JP6508732B2 - リードフレームストリップへのｌｅｄダイのボンディング - Google Patents

リードフレームストリップへのｌｅｄダイのボンディング Download PDF

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JP6508732B2
JP6508732B2 JP2016522909A JP2016522909A JP6508732B2 JP 6508732 B2 JP6508732 B2 JP 6508732B2 JP 2016522909 A JP2016522909 A JP 2016522909A JP 2016522909 A JP2016522909 A JP 2016522909A JP 6508732 B2 JP6508732 B2 JP 6508732B2
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Prior art keywords
strip
led dies
led
light emitting
emitting structure
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Japanese (ja)
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JP2016523456A5 (https=
JP2016523456A (ja
Inventor
クァン リー，ツェ
クァン リー，ツェ
スコット マーティン，ポール
スコット マーティン，ポール
ヨハネス クラウス，アルプレヒト
ヨハネス クラウス，アルプレヒト
カン，チュンヘン
リン パン，ホイ
リン パン，ホイ
イン，ロン
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ルミレッズ ホールディング ベーフェー
ルミレッズ ホールディング ベーフェー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/922—Parallel electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/942—Serial electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2016522909A 2013-06-28 2014-06-18 リードフレームストリップへのｌｅｄダイのボンディング Active JP6508732B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNPCT/CN2013/000784 2013-06-28
CNPCT/CN2013/000784 2013-06-28
PCT/IB2014/062347 WO2014207620A1 (en) 2013-06-28 2014-06-18 Bonding led die to lead frame strips

Publications (3)

Publication Number Publication Date
JP2016523456A JP2016523456A (ja) 2016-08-08
JP2016523456A5 JP2016523456A5 (https=) 2017-07-27
JP6508732B2 true JP6508732B2 (ja) 2019-05-08

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JP2016522909A Active JP6508732B2 (ja) 2013-06-28 2014-06-18 リードフレームストリップへのｌｅｄダイのボンディング

Country Status (6)

Country Link
US (2) US9530949B2 (https=)
EP (1) EP3014657B1 (https=)
JP (1) JP6508732B2 (https=)
KR (1) KR102168935B1 (https=)
CN (2) CN105493281B (https=)
WO (1) WO2014207620A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105493281B (zh) * 2013-06-28 2018-09-18 皇家飞利浦有限公司 将led裸片与引线框架带的接合
CN108884984B (zh) * 2016-03-15 2021-04-16 昕诺飞控股有限公司 细长引线框架和制造细长引线框架的方法
JP6360514B2 (ja) * 2016-03-31 2018-07-18 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 Ｌｅｄ基板及びそれを有する光照射装置
EP3555520B1 (en) 2016-12-13 2023-04-12 Lumileds LLC Arrangement of leds on a leadframe
KR102450579B1 (ko) * 2017-06-05 2022-10-07 삼성전자주식회사 Led램프
DE102017127721A1 (de) * 2017-11-23 2019-05-23 Osram Opto Semiconductors Gmbh Led-filament mit konversionsschicht
WO2019226788A1 (en) 2018-05-24 2019-11-28 Lumiode, Inc. Led display structures and fabrication of same
DE102018211723A1 (de) * 2018-07-13 2020-01-16 Osram Gmbh Led-anordnung und beleuchtungsvorrichtung
WO2020131894A1 (en) 2018-12-21 2020-06-25 Lumiode, Inc. Addressing for emissive displays

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DE3835942A1 (de) * 1988-10-21 1990-04-26 Telefunken Electronic Gmbh Flaechenhafter strahler
DE10025563B4 (de) 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
DE102004001312B4 (de) * 2003-07-25 2010-09-30 Seoul Semiconductor Co., Ltd. Chip-Leuchtdiode und Verfahren zu ihrer Herstellung
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
WO2007097483A1 (en) * 2006-02-24 2007-08-30 Seoul Semiconductor Co., Ltd. Light emitting diode package
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8581393B2 (en) 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
JPWO2008078791A1 (ja) * 2006-12-27 2010-04-30 昭和電工株式会社 発光装置の製造方法
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
JP2009199977A (ja) * 2008-02-25 2009-09-03 Panasonic Corp 照明装置
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
TWI401788B (zh) 2008-12-24 2013-07-11 財團法人工業技術研究院 發光二極體照明模組與封裝方法
JP2011023295A (ja) * 2009-07-17 2011-02-03 Rohm Co Ltd Ｌｅｄ照明装置および画像表示装置
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CN105493281B (zh) * 2013-06-28 2018-09-18 皇家飞利浦有限公司 将led裸片与引线框架带的接合

Also Published As

Publication number Publication date
WO2014207620A1 (en) 2014-12-31
KR20160027064A (ko) 2016-03-09
US9905544B2 (en) 2018-02-27
CN105493281A (zh) 2016-04-13
EP3014657B1 (en) 2018-04-25
KR102168935B1 (ko) 2020-10-23
EP3014657A1 (en) 2016-05-04
JP2016523456A (ja) 2016-08-08
CN109237319B (zh) 2020-10-27
US20170092628A1 (en) 2017-03-30
US20160329473A1 (en) 2016-11-10
CN109237319A (zh) 2019-01-18
US9530949B2 (en) 2016-12-27
CN105493281B (zh) 2018-09-18

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