CN105493281B - 将led裸片与引线框架带的接合 - Google Patents

将led裸片与引线框架带的接合 Download PDF

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Publication number
CN105493281B
CN105493281B CN201480047536.7A CN201480047536A CN105493281B CN 105493281 B CN105493281 B CN 105493281B CN 201480047536 A CN201480047536 A CN 201480047536A CN 105493281 B CN105493281 B CN 105493281B
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CN
China
Prior art keywords
led
led bare
band
light
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480047536.7A
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English (en)
Chinese (zh)
Other versions
CN105493281A (zh
Inventor
S.K.李
P.S.马丁
A.J.克劳斯
C.康
H.L.潘
L.殷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bright Sharp Holdings Ltd
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Priority to CN201480047536.7A priority Critical patent/CN105493281B/zh
Priority to CN201811011231.7A priority patent/CN109237319B/zh
Publication of CN105493281A publication Critical patent/CN105493281A/zh
Application granted granted Critical
Publication of CN105493281B publication Critical patent/CN105493281B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/922—Parallel electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/942—Serial electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201480047536.7A 2013-06-28 2014-06-18 将led裸片与引线框架带的接合 Active CN105493281B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480047536.7A CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合
CN201811011231.7A CN109237319B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CNPCT/CN2013/000784 2013-06-28
CNPCT/CN2013/000784 2013-06-28
CN201480047536.7A CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合
PCT/IB2014/062347 WO2014207620A1 (en) 2013-06-28 2014-06-18 Bonding led die to lead frame strips

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811011231.7A Division CN109237319B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Publications (2)

Publication Number Publication Date
CN105493281A CN105493281A (zh) 2016-04-13
CN105493281B true CN105493281B (zh) 2018-09-18

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480047536.7A Active CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合
CN201811011231.7A Active CN109237319B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

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Application Number Title Priority Date Filing Date
CN201811011231.7A Active CN109237319B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Country Status (6)

Country Link
US (2) US9530949B2 (https=)
EP (1) EP3014657B1 (https=)
JP (1) JP6508732B2 (https=)
KR (1) KR102168935B1 (https=)
CN (2) CN105493281B (https=)
WO (1) WO2014207620A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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CN105493281B (zh) * 2013-06-28 2018-09-18 皇家飞利浦有限公司 将led裸片与引线框架带的接合
CN108884984B (zh) * 2016-03-15 2021-04-16 昕诺飞控股有限公司 细长引线框架和制造细长引线框架的方法
JP6360514B2 (ja) * 2016-03-31 2018-07-18 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 Ｌｅｄ基板及びそれを有する光照射装置
EP3555520B1 (en) 2016-12-13 2023-04-12 Lumileds LLC Arrangement of leds on a leadframe
KR102450579B1 (ko) * 2017-06-05 2022-10-07 삼성전자주식회사 Led램프
DE102017127721A1 (de) * 2017-11-23 2019-05-23 Osram Opto Semiconductors Gmbh Led-filament mit konversionsschicht
WO2019226788A1 (en) 2018-05-24 2019-11-28 Lumiode, Inc. Led display structures and fabrication of same
DE102018211723A1 (de) * 2018-07-13 2020-01-16 Osram Gmbh Led-anordnung und beleuchtungsvorrichtung
WO2020131894A1 (en) 2018-12-21 2020-06-25 Lumiode, Inc. Addressing for emissive displays

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DE10025563B4 (de) 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
DE102004001312B4 (de) * 2003-07-25 2010-09-30 Seoul Semiconductor Co., Ltd. Chip-Leuchtdiode und Verfahren zu ihrer Herstellung
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
WO2007097483A1 (en) * 2006-02-24 2007-08-30 Seoul Semiconductor Co., Ltd. Light emitting diode package
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8581393B2 (en) 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
JPWO2008078791A1 (ja) * 2006-12-27 2010-04-30 昭和電工株式会社 発光装置の製造方法
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
JP2009199977A (ja) * 2008-02-25 2009-09-03 Panasonic Corp 照明装置
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TWI401788B (zh) 2008-12-24 2013-07-11 財團法人工業技術研究院 發光二極體照明模組與封裝方法
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Also Published As

Publication number Publication date
WO2014207620A1 (en) 2014-12-31
KR20160027064A (ko) 2016-03-09
US9905544B2 (en) 2018-02-27
CN105493281A (zh) 2016-04-13
EP3014657B1 (en) 2018-04-25
KR102168935B1 (ko) 2020-10-23
EP3014657A1 (en) 2016-05-04
JP2016523456A (ja) 2016-08-08
CN109237319B (zh) 2020-10-27
US20170092628A1 (en) 2017-03-30
US20160329473A1 (en) 2016-11-10
CN109237319A (zh) 2019-01-18
US9530949B2 (en) 2016-12-27
JP6508732B2 (ja) 2019-05-08

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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Effective date of registration: 20200708

Address after: Holland Schiphol

Patentee after: Bright Sharp Holdings Ltd.

Address before: Eindhoven, Netherlands

Patentee before: Royal Philips Co.,Ltd.

TR01 Transfer of patent right