CN109215512B - Manufacturing equipment, ejector pin and positioning method - Google Patents
Manufacturing equipment, ejector pin and positioning method Download PDFInfo
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- CN109215512B CN109215512B CN201811297161.6A CN201811297161A CN109215512B CN 109215512 B CN109215512 B CN 109215512B CN 201811297161 A CN201811297161 A CN 201811297161A CN 109215512 B CN109215512 B CN 109215512B
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Abstract
The invention relates to manufacturing equipment, a thimble and a positioning method. The positioning method is used for positioning the substrate, and comprises the following steps: placing the substrate in the movement space of the thimble; driving the thimble to move towards the direction close to and parallel to the substrate, so that a gap exists between the thimble and the substrate; driving the thimble to descend from a first height position to a second height position along a direction vertical to the substrate so as to enable the distance between the thimble and the upper part to be larger than or equal to a preset distance; and driving the thimble to clamp the substrate. The ejector pin adopts the positioning method to position the substrate, and before the ejector pin clamps the substrate, the ejector pin is required to be lowered from a first height position to a second height position along the direction vertical to the substrate, so that the ejector pin is lowered to a non-interference position, the interference between the ejector pin and an upper part component can be avoided, and the problems of the interference between the ejector pin and the upper part component and the low positioning precision of the traditional substrate positioning method are solved.
Description
Technical Field
The invention relates to the technical field of manufacturing of flat panel display devices, in particular to manufacturing equipment, a thimble and a positioning method.
Background
In the manufacturing industry of flat panel display devices, such as the production, inspection and repair of flat panel display devices, a substrate needs to be positioned inside a manufacturing apparatus. The conventional method of positioning a substrate is to horizontally clamp the substrate with an array of tips. If the upper part of the bedplate of the manufacturing equipment is close to the bedplate, the ejector pins on the bedplate cannot be too high, otherwise the ejector pins interfere with the upper part of the bedplate; certainly, the thimble cannot be too low, otherwise the substrate is easy to slide to the upper part of the thimble, so that the positioning precision of the substrate is low, and even the thimble and the upper part are mutually scratched. The traditional positioning method of the substrate has the problems of interference between the thimble and the upper part and lower positioning precision; in addition, the conventional platen requires an additional vacuum suction design to reliably position the substrate on the platen, resulting in a problem of high cost of the manufacturing apparatus.
Disclosure of Invention
Accordingly, it is necessary to provide a manufacturing apparatus, an ejector pin, and a positioning method, which are directed to the problems of interference between the ejector pin and the upper member and low positioning accuracy in the conventional substrate positioning method and the problems of high cost in the manufacturing apparatus.
A positioning method for positioning a substrate, the positioning method comprising:
placing the substrate in the movement space of the thimble;
driving the ejector pins to move towards the direction close to and parallel to the substrate, so that a gap exists between the ejector pins and the substrate;
driving the ejector pin to descend from a first height position to a second height position along a direction perpendicular to the substrate, so that the distance between the ejector pin and the upper part is larger than or equal to a preset distance; and
and driving the thimble to clamp the substrate.
In one embodiment, after the step of driving the thimble to clamp the substrate, the positioning method further includes the steps of:
moving the upper part out of the movement space of the thimble; after the substrate is processed, the upper part is moved out of the movement space of the thimble, so that the problem of interference between the thimble and the upper part is further avoided.
In one embodiment, after the step of moving the upper member out of the movement space of the thimble, the positioning method further comprises the steps of:
and driving the thimble to move towards the direction far away from and parallel to the substrate so as to take out the subsequent substrate.
In one embodiment, after the step of driving the thimble to move in the direction away from the substrate, the positioning method further includes the steps of:
and taking away the substrate.
In one embodiment, after the step of removing the substrate, the positioning method further comprises the steps of:
driving the ejector pins to ascend from the second height position to the first height position along the direction vertical to the substrate, so that the ejector pins ascend to the initial position to prepare for positioning the next substrate; since the upper part is moved to the outside of the movement space of the thimble, the thimble is prevented from touching the upper part in the process of rising from the second height position to the first height position, so that the upper part and the thimble are always kept at a proper distance, and the problem of interference between the thimble and the upper part is better avoided.
In one embodiment, the step of removing the substrate includes:
and taking away the substrate through a feeding and discharging mechanical arm.
A thimble positions the substrate by adopting the positioning method of any one of the embodiments.
In one embodiment, the thimble comprises a thimble body and a stop part extending towards the clamping direction of the thimble body, the thimble body is used for clamping the substrate, and the stop part is used for limiting the substrate; when the thimble body is clamped on the substrate, the substrate may be deformed and arched upwards, and the substrate is easy to slip off from the thimble body.
In one embodiment, the stop portion has a wedge-shaped cross section; when the substrate arches upwards and is to slide away from the thimble body, the substrate slides back to the clamping position of the thimble body from the inclined surface of the stop part again, so that the stop part has better limiting effect on the substrate.
A manufacturing apparatus comprising the thimble according to any of the above embodiments.
The positioning method comprises the steps that firstly, the substrate is placed in the movement space of the ejector pins, so that the ejector pins on the bedplate can clamp the substrate, and the substrate is prevented from being placed at the tops of the ejector pins and cannot be clamped by the ejector pins; then driving the thimble to move towards the direction close to and parallel to the substrate, wherein a gap exists between the thimble and the substrate; then driving the thimble to descend from a first height position to a second height position along a direction vertical to the substrate so as to enable the distance between the thimble and the upper part to be larger than or equal to a preset distance, namely, the thimble descends to a non-interference position so as to prevent the thimble from mechanically interfering with the upper part; finally, driving the thimble to clamp the substrate to position the substrate on the bedplate; the thimble adopts the positioning method to position the substrate, the thimble is required to be lowered from a first height position to a second height position along the direction vertical to the substrate before clamping the substrate, so that the thimble is lowered to a non-interference position, the interference between the thimble and the upper part can be avoided, that is, compared with the traditional positioning method which only can drive the thimble to move towards and parallel to the substrate clamping direction, besides the thimble moves towards and parallel to the substrate clamping direction, i.e. in addition to moving towards a direction close to and parallel to the substrate, can be lowered from a first height position to a second height position in a direction perpendicular to the substrate, the thimble moves up and down relative to the upper part component without considering whether the thimble is too high or too low, so that the problems of interference between the thimble and the upper part component and low positioning precision in the traditional positioning method of the substrate are solved; the manufacturing equipment comprises the ejector pin, the substrate can be reliably positioned without adding a vacuum suction design, and the cost of the manufacturing equipment is greatly reduced.
Drawings
FIG. 1 is a flow chart of a positioning method according to an embodiment;
FIG. 2 is a schematic diagram illustrating a positional relationship between a substrate and a thimble in step S101 of the flowchart of the positioning method shown in FIG. 1;
FIG. 3 is a schematic diagram illustrating a positional relationship between the substrate and the thimble in step S105 of the flowchart of the positioning method shown in FIG. 1;
FIG. 4 is a schematic diagram illustrating a positional relationship between the substrate and the thimble in step S107 of the flowchart of the positioning method shown in FIG. 1;
FIG. 5 is a schematic diagram illustrating a positional relationship between the substrate and the thimble in step S109 of the flowchart of the positioning method shown in FIG. 1;
fig. 6 is a flowchart of a positioning method according to another embodiment.
Detailed Description
To facilitate an understanding of the present invention, the manufacturing apparatus, thimble, and method of positioning will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the manufacturing apparatus, ejector pin and positioning method are shown in the drawings. However, the manufacturing apparatus, ejector pins, and positioning methods may be implemented in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the substance of the manufacturing equipment, ejector pins, and positioning methods.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the manufacturing apparatus, thimble, and positioning method is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, a positioning method is used for positioning a substrate, and the positioning method includes: placing the substrate in the movement space of the thimble; driving the ejector pins to move towards the direction close to and parallel to the substrate, so that a gap exists between the ejector pins and the substrate; driving the ejector pin to descend from a first height position to a second height position along a direction perpendicular to the substrate, so that the distance between the ejector pin and the upper part is larger than or equal to a preset distance; and driving the thimble to clamp the substrate.
As shown in fig. 1 and fig. 2, a positioning method according to an embodiment is used for positioning a substrate 10. In one embodiment, the positioning method comprises part or all of the following steps:
s101, the substrate 10 is placed in the movement space of the ejector pins 20, so that the ejector pins on the bedplate can clamp the substrate, and the situation that the substrate cannot be clamped by the ejector pins because the substrate is placed on the tops of the ejector pins is avoided. In this embodiment, the number of the ejector pins is plural, the ejector pins are all disposed on the platen, the substrate is located at a common action region of the ejector pins, and the substrate is located in a motion space of each ejector pin. In one embodiment, the plurality of ejector pins are distributed in a rectangular array, and the whole row of ejector pins acts on the substrate, so that the plurality of ejector pins reliably act on the substrate. In one embodiment, the substrate 10 is placed between the pins 20.
In one embodiment, the step of placing the substrate in the movement space of the thimble specifically includes: the substrate is arranged in the movement space of the thimble through the feeding and discharging mechanical arm. It can be understood that, in other embodiments, the substrate is not only limited to be placed in the movement space of the ejector pins by the feeding and discharging manipulator, but also can be placed in the movement space of the ejector pins by hands or other manners.
S103, driving the ejector pins to move towards the direction close to and parallel to the substrate, and enabling a gap to exist between the ejector pins and the substrate. In this embodiment, the ejector pins are driven to move towards the substrate along a direction parallel to the substrate, so that a gap is formed between the ejector pins and the substrate. In one embodiment, the gap is 1mm to 5 mm. In one embodiment, the gap is 3mm, so that the gap between the ejector pin and the substrate is small, and the substrate can be prevented from being abraded in the process of descending the subsequent ejector pin from the first height position to the second height position.
Referring to fig. 4, in step S105, the thimble is driven to descend from the first height position to the second height position along a direction perpendicular to the substrate, so that a distance between the thimble and the upper portion is greater than or equal to a preset distance, that is, the thimble descends to a non-interference position, so as to prevent the thimble from mechanically interfering with the upper portion, where a height corresponding to the first height position is greater than a height corresponding to the second height position. In one embodiment, the distance between the first height position and the second height position is 3mm to 10 mm. In one embodiment, the distance between the first height position and the second height position is 5mm, so that the upper part is positioned at a moderate distance from the thimble, and the problem of interference between the thimble and the upper part can be avoided. In this embodiment, the upper part is a deposition head for electroplating the substrate to achieve the processing of the substrate by the electroplating process.
Referring to fig. 5, S107, the ejector pins are driven to clamp the substrate, so that the substrate is positioned on the platen.
In one embodiment, the positioning method comprises a substrate feeding method and a substrate blanking method. Specifically, the substrate loading method comprises steps S101-S107. The blanking method of the substrate comprises the steps S109 to S113.
As shown in fig. 6, in one embodiment, after the step S107 of driving the thimble to clamp the substrate, the positioning method further includes the steps of:
and S109, moving the upper part out of the movement space of the thimble. After the substrate is processed, the upper part is moved out of the movement space of the thimble, so that the problem of interference between the thimble and the upper part is further avoided.
In one embodiment, before the step of moving the upper member out of the movement space of the ejector pins and after the step of driving the ejector pins to clamp the substrate, the positioning method further includes the steps of: the substrate is processed, and the ejector pins are clamped on the bedplate, so that the substrate is prevented from moving relative to the bedplate in the processing process, and the processing precision of the substrate is ensured. In one embodiment, the step of processing the substrate specifically includes: and repairing the substrate. In other embodiments, the step of processing the substrate specifically includes: and detecting the substrate.
In one embodiment, after the step S109 of moving the upper member out of the movement space of the thimble, the positioning method further includes the steps of:
and S111, driving the thimble to move towards the direction far away from and parallel to the substrate so as to take out the subsequent substrate.
It is understood that in other embodiments, step S111 may also precede step S109, as well as follow step S107. In this embodiment, the driving pin moves away from the substrate along a direction parallel to the substrate. Step S111 may be completed before step S109 and after step S107 when the ejector pin does not interfere with the upper member during movement in a direction away from and parallel to the substrate.
In one embodiment, after the step S111 of driving the thimble to move in the direction away from and parallel to the substrate, the positioning method further includes the steps of:
and S113, taking away the substrate.
In one embodiment, after the step S113 of removing the substrate, the positioning method further includes the steps of:
and S115, driving the ejector pins to ascend from the second height position to the first height position along the direction vertical to the substrate, so that the ejector pins ascend to the initial position and are ready for positioning the next substrate. Since the upper part is moved to the outside of the movement space of the thimble, the thimble is prevented from touching the upper part in the process of rising from the second height position to the first height position, so that the upper part and the thimble are always kept at a proper distance, and the problem of interference between the thimble and the upper part is better avoided.
In one embodiment, the step S113 of removing the substrate specifically includes:
and taking away the substrate through a feeding and discharging mechanical arm. It is understood that in other embodiments, the substrate may be removed by a human hand or other means, as well as by a loading and unloading robot.
In one embodiment, the thimble comprises a thimble body and a stop portion extending towards the clamping direction from the thimble body. The step S107 of driving the thimble to clamp the substrate specifically includes: the ejector pin body is driven to clamp the substrate, and the stop part limits the substrate. When the thimble body is clamped on the substrate, the substrate may be deformed and arched upwards, and the substrate is easy to slip off from the thimble body.
The invention also provides a thimble. The ejector pin positions the substrate by adopting the positioning method of any one of the embodiments.
In one embodiment, the thimble comprises a thimble body and a stop portion extending towards the clamping direction from the thimble body. The thimble body is used for clamping the substrate, and the stop part is used for limiting the substrate. When the thimble body is clamped on the substrate, the substrate may be deformed and arched upwards, and the substrate is easy to slip off from the thimble body.
In one embodiment, the stop portion extends from one end of the thimble body towards the clamping direction, so that the length of the thimble body for clamping the substrate is longer, the size of the thimble is convenient to be shortest, and the problem of interference between the thimble and the upper part is better avoided.
In one embodiment, the stop portion is integrally formed with the thimble body, so that the thimble is more compact in structure and lower in manufacturing cost. It is understood that, in other embodiments, the stop portion and the thimble body may be formed integrally, and the stop portion and the thimble body may be formed separately and connected together by welding or gluing.
In one embodiment, the stop portion has a wedge-shaped cross-section. When the substrate arches upwards and is to slide away from the thimble body, the substrate slides back to the clamping position of the thimble body from the inclined surface of the stop part again, so that the stop part has better limiting effect on the substrate.
In one embodiment, the cross section of the stopping part is triangular or trapezoidal, so that the stopping part can better limit the substrate.
In one embodiment, the thimble body has a circular cross-section such that the thimble body is in point contact with the substrate. Furthermore, the thimble body is of a cylindrical structure, so that the thimble body is simple in structure and easy to manufacture. In order to reduce the clamping force of the thimble body abutting against the substrate and avoid the problem of pits in the process of clamping and positioning the substrate by the thimble, furthermore, the side wall of the thimble body is provided with an abutting surface which is used for abutting against the substrate, so that the position of the thimble body abutting against the substrate is of a surface structure, the acting force between the thimble body and the substrate is reduced, the clamping force of the thimble body clamping against the substrate per unit area is smaller, the local stress on the substrate is avoided being larger, and the problem of pits in the process of clamping and positioning the substrate by the thimble is solved. Furthermore, the abutting surface is arranged at a position, close to the stop part, on the ejector pin body, so that the substrate is always limited on the abutting surface, and thus, the substrate and the ejector pin body are always clamped in a surface contact mode, and the reliability of clamping the substrate by the ejector pin body is improved.
The invention further provides manufacturing equipment comprising the thimble in any one of the embodiments.
In one embodiment, the manufacturing apparatus further comprises a platen. The ejector pins are arranged on the bedplate, the substrate is located at the common action area of the ejector pins, and the substrate is located in the motion space of each ejector pin. In one embodiment, the plurality of ejector pins are distributed in a rectangular array, and the whole row of ejector pins acts on the substrate, so that the plurality of ejector pins reliably act on the substrate.
In one embodiment, a manufacturing apparatus includes a base, a first lifting mechanism, a second lifting mechanism, a thimble, a drive mechanism, and an upper member. First elevating system and second elevating system all locate on the base. The bedplate is connected with the power output end of the first lifting mechanism, so that the first lifting mechanism drives the bedplate to move up and down relative to the base. The thimble is connected on the platen in a sliding manner. The driving mechanism is arranged on the bedplate, and a power output end of the driving mechanism is connected with the ejector pins, so that the driving mechanism drives the ejector pins to slide relative to the bedplate, and the ejector pins push the substrate to a preset position. The upper part is positioned above the bedplate and is connected with the power output end of the second lifting mechanism. The second lifting mechanism drives the upper part to move up and down relative to the bedplate, so that the upper part is close to or away from the bedplate, the upper part can process the substrate on the bedplate, and the upper part is away from the bedplate after the substrate is processed, and the problem of interference between the upper part and the bedplate is avoided.
It will be appreciated that in other embodiments, the second lift mechanism may be omitted, the upper member being disposed directly on the base, and the first lift mechanism driving the platen relative to the upper member to move the platen away from or towards the upper member. Further, the movement direction of the bedplate and the movement direction of the upper part are parallel to each other, so that the distance of relative movement between the bedplate and the upper part can be conveniently adjusted.
In order to make the process of the movement of the bedplate relative to the base more stable, the bedplate is further connected to the base in a sliding mode, the first lifting mechanism drives the bedplate to slide relative to the base, and therefore the first lifting mechanism drives the bedplate to move up and down relative to the base more stably. In this embodiment, the base is provided with a sliding groove, and the platen portion is located in the sliding groove and slides relative to the base, so that the platen is slidably connected to the base. In other embodiments, the sliding connection between the base and the platen may also be achieved by a fit between rail slides.
Furthermore, the manufacturing equipment also comprises a guide rod, and the guide rod is arranged on the base. The bedplate is provided with a slide hole, and the guide rod penetrates through the slide hole and is connected with the bedplate in a sliding manner, so that the guide effect is achieved, and the bedplate can slide more stably relative to the base.
In order to enable accurate sliding between the bedplate and the base, the manufacturing equipment further comprises a first sensor, a second sensor and a controller, wherein the first sensor and the second sensor are arranged on the base. The first sensor is arranged on the base and corresponds to the first height position of the thimble, and the second sensor is arranged on the base and corresponds to the second height position of the thimble. The first inductor and the second inductor are used for inducing the thimble. The controller is arranged on the base and is in communication connection with the first inductor, the second inductor and the first lifting mechanism respectively. When the ejector pin slides to a first height position relative to the base along with the bedplate, the first sensor sends out a sensing signal, and the controller controls the first lifting mechanism to stop acting according to the sensing signal of the first sensor, so that the bedplate stops at the current position on the base. Similarly, when the thimble slides to a second height position relative to the base along with the bedplate, the second sensor sends out a sensing signal, and the controller controls the first lifting mechanism to stop according to the sensing signal of the second sensor so as to stop the bedplate at the current position on the base. In this way, the first lifting mechanism drives the bedplate to accurately slide relative to the base.
In one embodiment, the first lifting structure comprises a first motor, a first lead screw and a first nut. The first motor is arranged on the base. One end of the first screw rod is connected with the power output end of the first motor, and the other end of the first screw rod is rotatably connected with the base. The first nut is sleeved on the first screw rod and is in threaded connection with the first screw rod. The first nut is also connected with the bedplate. The first motor drives the first screw rod to rotate relative to the base, and the first screw rod drives the first nut to move relative to the base, so that the first nut drives the bedplate to slide relative to the base.
Further, the manufacturing equipment also comprises a feeding and discharging mechanical arm. The feeding and discharging mechanical arm is arranged on the base. The loading and unloading mechanical arm is used for placing the substrate in the ejector pin movement space on the bedplate before the substrate is processed and taking the substrate out after the substrate is processed. Further, the feeding and discharging mechanical arm and the driving mechanism are in communication connection with the controller. When the ejector pin is located at the first height position, the controller controls the feeding and discharging mechanical arm to place the substrate in the movement space of the ejector pin. When the ejector pin is located at the second height position and the driving mechanism drives the ejector pin to loosen the substrate, the controller controls the feeding and discharging mechanical arm to take out the substrate on the bedplate. The manufacturing equipment realizes automatic feeding and discharging of the substrate.
In one embodiment, the driving mechanism comprises a cylinder and a connecting rod, the cylinder is arranged on the bedplate, and the power output end of the cylinder is connected with the connecting rod. The connecting rod is further connected with the ejector pins, so that the power output ends of the air cylinders are connected with the ejector pins through the connecting rod, and the air cylinders drive the ejector pins to move relative to the bedplate. In other embodiments, the driving mechanism is not limited to a pneumatic driving mode, and can also be a motor screw driving mode.
In one embodiment, the second lifting structure comprises a second motor, a second lead screw and a second nut. The second motor is arranged on the base. One end of the second screw rod is connected with the power output end of the second motor, and the other end of the second screw rod is rotatably connected with the base. The second nut is sleeved on the second screw rod and is in threaded connection with the second screw rod. The second nut is also connected to the upper member. The second motor drives the second screw rod to rotate relative to the base, and the second screw rod drives the second nut to move relative to the base, so that the second nut drives the upper part to slide relative to the base.
The positioning method comprises the steps that firstly, the substrate is placed in the movement space of the ejector pins, so that the ejector pins on the bedplate can clamp the substrate, and the substrate is prevented from being placed at the tops of the ejector pins and cannot be clamped by the ejector pins; then driving the thimble to move towards the direction close to and parallel to the substrate, wherein a gap exists between the thimble and the substrate; then driving the thimble to descend from a first height position to a second height position along a direction vertical to the substrate so as to enable the distance between the thimble and the upper part to be larger than or equal to a preset distance, namely, the thimble descends to a non-interference position so as to prevent the thimble from mechanically interfering with the upper part; finally, driving the thimble to clamp the substrate to position the substrate on the bedplate; the thimble adopts the positioning method to position the substrate, the thimble is required to be lowered from a first height position to a second height position along the direction vertical to the substrate before clamping the substrate, so that the thimble is lowered to a non-interference position, the interference between the thimble and the upper part can be avoided, that is, compared with the traditional positioning method which only can drive the thimble to move towards and parallel to the substrate clamping direction, besides the thimble moves towards and parallel to the substrate clamping direction, i.e. in addition to moving towards a direction close to and parallel to the substrate, can be lowered from a first height position to a second height position in a direction perpendicular to the substrate, the thimble moves up and down relative to the upper part component without considering whether the thimble is too high or too low, so that the problems of interference between the thimble and the upper part component and low positioning precision in the traditional positioning method of the substrate are solved; the manufacturing equipment comprises the ejector pin, the substrate can be reliably positioned without adding a vacuum suction design, and the cost of the manufacturing equipment is greatly reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A positioning method for positioning a substrate, the positioning method comprising:
placing the substrate in the movement space of the thimble;
driving the ejector pins to move towards the direction close to and parallel to the substrate, so that a gap exists between the ejector pins and the substrate;
driving the ejector pin to descend from a first height position to a second height position along a direction perpendicular to the substrate, so that the distance between the ejector pin and the upper part is larger than or equal to a preset distance; and
driving the thimble to clamp the substrate; the ejector pins are distributed in a rectangular array, and the whole row of ejector pins acts on the substrate, so that the ejector pins reliably act on the substrate.
2. The positioning method according to claim 1, wherein after the step of driving the ejector pins to clamp the substrate, the positioning method further comprises the steps of:
and moving the upper part out of the movement space of the thimble.
3. The positioning method according to claim 2, characterized in that after the step of moving said upper member outside the range of action of said thimble, said positioning method further comprises the steps of:
and driving the thimble to move towards the direction far away from and parallel to the substrate.
4. The positioning method according to claim 3, wherein after the step of driving the ejector pin to move in a direction away from the substrate, the positioning method further comprises the steps of:
and taking away the substrate.
5. The method of claim 4, wherein after the step of removing the substrate, the method further comprises the steps of:
and driving the thimble to ascend from the second height position to the first height position along the direction vertical to the substrate.
6. The positioning method according to claim 5, wherein the step of removing the substrate comprises:
and taking away the substrate through a feeding and discharging mechanical arm.
7. A thimble, characterized in that the substrate is positioned by the positioning method according to any one of claims 1 to 6.
8. The thimble according to claim 7, wherein the thimble comprises a thimble body and a stop portion extending towards a clamping direction of the thimble body, the thimble body is configured to clamp the substrate, and the stop portion is configured to limit the substrate.
9. The ejector pin according to claim 8, wherein the cross section of the stopper portion is wedge-shaped.
10. A manufacturing apparatus, comprising the thimble according to any one of claims 7 to 9; the manufacturing equipment also comprises a bedplate, wherein the number of the thimbles is multiple, the thimbles are all arranged on the bedplate, the substrate is positioned at the coaction area of the thimbles, the substrate is positioned in the motion space of each thimble, the thimbles are distributed in a rectangular array, and the whole row of thimbles act on the substrate so that the thimbles act on the substrate reliably; the manufacturing equipment also comprises a base, a first lifting mechanism, a second lifting mechanism, a driving mechanism and an upper part, wherein the first lifting mechanism and the second lifting mechanism are arranged on the base, the bedplate is connected with the power output end of the first lifting mechanism so that the first lifting mechanism drives the bedplate to move up and down relative to the base, the thimble is connected on the bedplate in a sliding way, the driving mechanism is arranged on the bedplate, and the power output end of the driving mechanism is connected with the thimble, so that the driving mechanism drives the thimble to slide relative to the bedplate, therefore, the ejector pins push the substrate to a preset position, the upper part is positioned above the bedplate and connected with a power output end of a second lifting mechanism, the second lifting mechanism drives the upper part to move up and down relative to the bedplate, so that the upper part is close to or away from the bedplate, and the movement direction of the bedplate is parallel to that of the upper part, thereby being convenient for adjusting the distance of relative movement between the bedplate and the upper part.
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| CN109215512B true CN109215512B (en) | 2021-02-26 |
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