CN109215512A - Manufacturing equipment, thimble and localization method - Google Patents
Manufacturing equipment, thimble and localization method Download PDFInfo
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- CN109215512A CN109215512A CN201811297161.6A CN201811297161A CN109215512A CN 109215512 A CN109215512 A CN 109215512A CN 201811297161 A CN201811297161 A CN 201811297161A CN 109215512 A CN109215512 A CN 109215512A
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- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
The present invention relates to a kind of manufacturing equipment, thimble and localization methods.For above-mentioned localization method for positioning to substrate, localization method includes: that substrate is placed in the space of thimble；It drives thimble to move towards the direction near and parallel to substrate, makes between thimble and substrate that there are gaps；Driving thimble drops to the second height and position from the first height and position along the direction perpendicular to substrate, so that the distance between thimble and upper member are greater than or equal to pre-determined distance；And driving thimble clamps substrate.Above-mentioned thimble positions substrate using above-mentioned localization method, edge is needed to drop to the second height and position from the first height and position perpendicular to the orientation substrate before thimble clamping substrate, thimble is set to drop to non-interfering position, it can avoid thimble and upper member is interfered, solve the problems, such as that the localization method of traditional substrate is interfered there are thimble and upper member and positioning accuracy is lower.
Description
Technical field
The present invention relates to the technical fields of manufacture flat-panel display device, more particularly to a kind of manufacturing equipment, thimble and determine
Position method.
Background technique
The manufacturing of flat-panel display device need to be in manufacturing equipment such as the production, detection and reparation of flat-panel display device
Inside substrate is positioned.The localization method of traditional substrate is to carry out horizontal-clamping to substrate using permutation thimble.Such as
The upper member destage plate of the platen of fruit manufacturing equipment is close, then the thimble on platen cannot be excessively high, otherwise thimble and platen
Upper member interferes；Certainly, thimble can not be too low, and the top for otherwise causing substrate to be easy to slide into thimble leads to substrate
Positioning accuracy is lower or even thimble is mutually abraded with upper member.There are thimbles and top portion for the localization method of traditional substrate
Part interference and the lower problem of positioning accuracy；In addition, traditional platen need to increase the design for inhaling vacuum, substrate is reliably fixed
On platen, the problem of leading to the higher cost of manufacturing equipment.
Summary of the invention
Based on this, it is necessary to interfere for the localization method of traditional substrate there are thimble and upper member and positioning accuracy
Lower problem, and manufacturing equipment has higher cost provides a kind of manufacturing equipment, thimble and localization method.
A kind of localization method, for positioning to substrate, the localization method includes:
The substrate is placed in the space of thimble；
Drive the thimble to move towards the direction near and parallel to the substrate, make the thimble and the substrate it
Between there are gaps；
The thimble is driven to drop to the second height and position from the first height and position along the direction perpendicular to the substrate, with
The distance between the thimble and upper member is set to be greater than or equal to pre-determined distance；And
The thimble is driven to clamp the substrate.
In one of the embodiments, after the step of driving the thimble to clamp the substrate, the localization method
It further comprises the steps of:
The upper member is moved to outside the space of the thimble；After to substrate completion of processing, by top
The problem of component is moved to outside the space of thimble, further avoids thimble and upper member interference.
In one of the embodiments, the step being moved to the upper member outside the space of the thimble it
Afterwards, the localization method further comprises the steps of:
It drives the thimble to be directed away from and is parallel to the direction movement of the substrate, so as to the taking-up of subsequent substrate.
The thimble is being driven to be directed away from the step of the direction of the substrate moves it in one of the embodiments,
Afterwards, the localization method further comprises the steps of:
Take the substrate away.
In one of the embodiments, after the step of taking the substrate away, the localization method is further comprised the steps of:
The thimble is driven along the direction perpendicular to the substrate to rise to described first from second height and position high
Position is spent, thimble is made to rise to initial position, preparation positions next substrate；Due to before this by upper member
It is moved to except the space of thimble, avoids during thimble rises to the first height and position from the second height and position and touch
It touches to upper member, so that upper member and thimble be made to remain suitable distance, preferably avoids thimble and upper member
The problem of interference.
The step of taking the substrate away in one of the embodiments, specifically:
The substrate is taken away by loading and unloading manipulator.
A kind of thimble positions the substrate using localization method described in any of the above-described embodiment.
The thimble includes extending on thimble ontology and the thimble ontology towards clamping direction in one of the embodiments,
Stop portion, the thimble ontology is for clamping the substrate, and the stop portion is for limiting the substrate；Work as thimble
When ontology is held on substrate, there may be the situation for deforming and arching upward upwards, substrate is easy to slip from thimble ontology substrate,
Since thimble further includes the stop portion extended on thimble ontology towards clamping direction, stop portion has position-limiting action to substrate, avoids
The problem of substrate is slipped from thimble ontology, makes thimble relatively reliable be held on substrate.
The wedge-shaped in cross-section shape in the stop portion in one of the embodiments,；It is intended to slip away top when substrate arches upward upwards
When needle ontology, substrate slides back to the holding position of thimble ontology again from the inclined-plane in stop portion, has stop portion to substrate more preferable
Ground position-limiting action.
A kind of manufacturing equipment, including thimble described in any of the above-described embodiment.
Substrate, is placed in the space of thimble by above-mentioned localization method first, and the thimble on platen is enable to clamp
To substrate, avoids the top that substrate is placed in thimble and cannot be clamped by thimble；Then driving thimble is near and parallel to base
The direction of plate moves, and there are gaps between thimble and substrate；Then driving thimble is along the direction perpendicular to the substrate from first
Height and position drops to the second height and position so that the distance between the thimble and upper member be greater than or equal to it is default away from
From, i.e., thimble drops to non-interfering position, in case mechanical interference occurs for the thimble and upper member；Finally driving thimble clamping
Substrate is positioned at substrate on platen；Above-mentioned thimble positions substrate using above-mentioned localization method, and thimble clamps base
It needs to drop to the second height and position from the first height and position along the direction perpendicular to the substrate before plate, drops to thimble non-
Interference position can avoid thimble and upper member and interfere, that is to say, that relative to it is traditional can only drive thimble towards and it is flat
The localization method that move in substrate clamping direction of row, above-mentioned thimble is in addition to direction and is parallel to substrate clamping direction and moves it
Outside, i.e., in addition to towards near and parallel to the substrate direction movement other than, moreover it is possible to along perpendicular to the substrate direction from
First height and position drops to the second height and position, i.e., thimble is relative to upper member elevating movement, without whether considering thimble
Too high or too low, the localization method for solving traditional substrate, which is interfered there are thimble with upper member, and positioning accuracy is lower asks
Topic；Above-mentioned manufacturing equipment includes above-mentioned thimble, is not required to increase and inhales vacuum design and can carry out reliable location to substrate, significantly
Reduce the cost of manufacturing equipment.
Detailed description of the invention
Fig. 1 is the flow chart of the localization method of an embodiment；
Fig. 2 is the positional diagram of substrate and thimble in the step S101 of the flow chart of localization method shown in Fig. 1；
Fig. 3 is the positional diagram of substrate and thimble in the step S105 of the flow chart of localization method shown in Fig. 1；
Fig. 4 is the positional diagram of substrate and thimble in the step S107 of the flow chart of localization method shown in Fig. 1；
Fig. 5 is the positional diagram of substrate and thimble in the step S109 of the flow chart of localization method shown in Fig. 1；
Fig. 6 is the flow chart of the localization method of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, manufacturing equipment, thimble and localization method are carried out more below with reference to relevant drawings
Comprehensive description.The preferred embodiment of manufacturing equipment, thimble and localization method is given in attached drawing.But manufacturing equipment, thimble
And localization method can be realized using many different forms, however it is not limited to embodiment described herein.On the contrary, providing
The purpose of these embodiments is to keep the disclosure to manufacturing equipment, thimble and localization method more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Herein in the used in the description of manufacturing equipment, thimble and localization method
Term, which is only for the purpose of describing specific embodiments, is not intended to limit the present invention.Term as used herein " and/
Or " it include any and all combinations of one or more related listed items.
One embodiment is, for positioning to substrate, the localization method includes: by the substrate for a kind of localization method
It is placed in the space of thimble；It drives the thimble to move towards the direction near and parallel to the substrate, makes the top
There are gaps between needle and the substrate；The thimble is driven to decline along the direction perpendicular to the substrate from the first height and position
To the second height and position, so that the distance between the thimble and upper member are greater than or equal to pre-determined distance；And driving institute
It states thimble and clamps the substrate.
As shown in Figures 1 and 2, the localization method of an embodiment is for positioning substrate 10.An implementation wherein
Some or all of in example, the localization method includes the following steps:
The substrate 10 is placed in the space of thimble 20, the thimble on platen is enable to be clamped to substrate by S101,
The situation that avoids the top that substrate is placed in thimble and cannot be clamped by thimble.In the present embodiment, the number of thimble is multiple,
Multiple thimbles are set on platen, and substrate is located at the collective effect region of multiple thimbles, and substrate is located at the fortune of each thimble
In dynamic space.Multiple thimble rectangular array distributions in one of the embodiments, and permutation thimble acts on substrate,
Act on multiple thimbles reliably on substrate.One embodiment is that substrate 10 is placed between thimble 20.
The step substrate being placed in one of the embodiments, in the space of thimble specifically: by upper
Substrate is placed in the space of thimble by blanking mechanical hand.It is appreciated that in other embodiments, not only limit passes through loading and unloading
Substrate is placed in the space of thimble by manipulator, and substrate can also be placed in the movement of thimble by manpower or other modes
In space.
S103 drives the thimble to move towards the direction near and parallel to the substrate, make the thimble with it is described
There are gaps between substrate.In the present embodiment, drive thimble along the direction for being parallel to substrate, towards substrate motion, so that
There is gap between thimble and substrate.Gap is 1mm~5mm in one of the embodiments,.In one of the embodiments,
Gap is 3mm, keeps the gap between thimble and substrate smaller, and can be avoided subsequent thimble and drop to from the first height and position
Substrate is caused to wear during two height and positions.
Referring also to Fig. 4, S105 drive the thimble to decline along the direction perpendicular to the substrate from the first height and position
To the second height and position, so that the distance between the thimble and upper member are greater than or equal to pre-determined distance, i.e. thimble declines
Extremely non-interfering position, in case mechanical interference occurs for the thimble and upper member, wherein the corresponding height of the first height and position is big
In the corresponding height of the second height and position.First height and position and second height position in one of the embodiments,
It the distance between sets as 3mm~10mm.First height and position and second height and position in one of the embodiments,
The distance between be 5mm, be located at upper member more moderate at a distance from thimble, while can be dry to avoid thimble and upper member
The problem of relating to.In the present embodiment, upper member is deposition head, for substrate to be electroplated, carries out electricity to substrate to realize
The processing of depositing process.
Referring also to Fig. 5, S107 drive the thimble to clamp the substrate, are positioned at substrate on platen.
The localization method includes the charging method of substrate and the baiting method of substrate in one of the embodiments,.Specifically
Ground, the charging method of substrate include step S101~S107.And the baiting method of substrate includes step S109~S113.
As shown in fig. 6, in one of the embodiments, drive the thimble clamp the substrate step S107 it
Afterwards, the localization method further comprises the steps of:
The upper member is moved to outside the space of the thimble by S109.It, will after to substrate completion of processing
The problem of upper member is moved to outside the space of thimble, further avoids thimble and upper member interference.
In one of the embodiments, the step being moved to the upper member outside the space of the thimble it
Before, and after the step of driving the thimble to clamp the substrate, localization method, which further comprises the steps of:, adds substrate
Work avoids substrate from moving in process relative to platen since substrate clamping is in the thimble on platen, it is ensured that substrate adds
Work precision.The step of substrate is processed in one of the embodiments, specifically: substrate is repaired.In other realities
The step of applying in example, substrate processed specifically: substrate is detected.
In one of the embodiments, in the step being moved to the upper member outside the space of the thimble
After S109, the localization method is further comprised the steps of:
S111 drives the thimble to be directed away from and is parallel to the direction movement of the substrate, so as to taking for subsequent substrate
Out.
It is appreciated that in other embodiments, step S111 can also before step S109, and step S107 it
Afterwards.In the present embodiment, driving thimble is along being parallel to the direction of substrate far from substrate motion.When thimble is directed away from and is parallel to
When will not interfere with upper member in the direction moving process of substrate, step S111 can be before step S109, and in step
It is completed after S107.
The direction movement of the substrate is directed away from and is parallel in one of the embodiments, in the driving thimble
After step S111, the localization method is further comprised the steps of:
S113 takes the substrate away.
In one of the embodiments, after taking the step S113 of the substrate away, the localization method further includes step
It is rapid:
S115 drives the thimble to rise to described the from second height and position along the direction perpendicular to the substrate
One height and position, makes thimble rise to initial position, and preparation positions next substrate.Due to before this by top
Component is moved to except the space of thimble, avoids the process that thimble rises to the first height and position from the second height and position
Middle touching preferably avoids thimble and top so that upper member and thimble be made to remain suitable distance to upper member
The problem of component interference.
Take the step S113 of the substrate away in one of the embodiments, specifically:
The substrate is taken away by loading and unloading manipulator.It is appreciated that in other embodiments, being not limited only to by upper and lower
Material manipulator takes substrate away, can also take substrate away by manpower or other modes.
The thimble includes extending on thimble ontology and the thimble ontology towards clamping direction in one of the embodiments,
Stop portion.The thimble is driven to clamp the step S107 of the substrate specifically: the thimble ontology is driven to clamp the base
Plate, and the stop portion limits the substrate.When thimble ontology is held on substrate, substrate there may be deformation and
The situation to arch upward upwards, substrate are easy to slip from thimble ontology, since thimble further includes prolonging on thimble ontology towards clamping direction
The stop portion stretched, stop portion to substrate have position-limiting action, avoid the problem of substrate is slipped from thimble ontology, make thimble compared with
Reliably it is held on substrate.
The present invention also provides a kind of thimbles.Thimble using localization method described in any of the above-described embodiment to the substrate into
Row positioning.
The thimble includes extending on thimble ontology and the thimble ontology towards clamping direction in one of the embodiments,
Stop portion.The thimble ontology is for clamping the substrate, and the stop portion is for limiting the substrate.Work as thimble
When ontology is held on substrate, there may be the situation for deforming and arching upward upwards, substrate is easy to slip from thimble ontology substrate,
Since thimble further includes the stop portion extended on thimble ontology towards clamping direction, stop portion has position-limiting action to substrate, avoids
The problem of substrate is slipped from thimble ontology, makes thimble relatively reliable be held on substrate.
The stop portion that stop portion is extended by one end of thimble ontology towards clamping direction in one of the embodiments, makes to push up
The length that needle ontology clamps substrate is longer, most short convenient for accomplishing the size of thimble, preferably avoids thimble and upper member dry
The problem of relating to.
Stop portion and this body by integral forming of thimble in one of the embodiments, make the more compact structure of thimble and manufacture
Cost is relatively low.It is appreciated that in other embodiments, stop portion can also be not limited only to be integrally formed with thimble ontology, stop
Portion and thimble ontology each self-forming and can also be connected together by welding or be glued.
The wedge-shaped in cross-section shape in the stop portion in one of the embodiments,.It is intended to slip away top when substrate arches upward upwards
When needle ontology, substrate slides back to the holding position of thimble ontology again from the inclined-plane in stop portion, has stop portion to substrate more preferable
Ground position-limiting action.
The cross section triangular shape or trapezoidal shape in the stop portion in one of the embodiments, enables stop portion more
Substrate is limited well.
The cross section of thimble ontology is circle in one of the embodiments, makes thimble ontology and substrate point contact.Into one
Step ground, thimble ontology are cylindrical-shaped structure, manufacture the structure of thimble ontology more simply and readily.In order to reduce thimble ontology with
The clamping force that substrate supports avoids the problem that pit occur during substrate clamps positioning by thimble, further, thimble sheet
The side wall of body is equipped with bearing surface, and bearing surface is for being held in substrate, and face is tied at the position for abutting thimble ontology with substrate
Structure reduces the active force between thimble ontology and substrate, the clamping force for the unit area for being clamped in thimble ontology on substrate
It is smaller, it avoids on substrate that stress suffered by part is larger, solves during substrate clamps positioning by thimble and pit occur
The problem of.Further, bearing surface is opened in the position in neighbouring stop portion on thimble ontology, and substrate is made to be limited in bearing surface always
On, it is clamped in this way, substrate passes through face contact form with thimble ontology always, improves the reliable of thimble ontology clamping substrate
Property.
The present invention also provides a kind of manufacturing equipments including thimble described in any of the above-described embodiment.
Manufacturing equipment further includes platen in one of the embodiments,.The number of thimble be it is multiple, multiple thimbles are set to
On platen, substrate is located at the collective effect region of multiple thimbles, and substrate is located in the space of each thimble.Wherein
In one embodiment, multiple thimble rectangular array distributions, and permutation thimble acts on substrate, makes multiple thimbles reliably
It acts on substrate.
Manufacturing equipment includes pedestal, the first elevating mechanism, the second elevating mechanism, thimble, drive in one of the embodiments,
Motivation structure and upper member.First elevating mechanism and the second elevating mechanism are set on pedestal.Platen and the first elevating mechanism
Power output end connection makes the first elevating mechanism driving platen relative to pedestal elevating movement.Thimble is slidably connected on platen.
Driving mechanism is set on platen, and the power output end of driving mechanism is connect with thimble, make driving mechanism drive thimble relative to
Platen sliding, to make thimble that substrate is pushed to pre-position.Upper member is located at the top of platen and goes up and down with second
The power output end of mechanism connects.Second elevating mechanism drives upper member to move relative to bedplate up-down, leans on upper member
Closely or platen is left, in this way, upper member can process the substrate on platen, and upper member is to substrate completion of processing
Platen is left later, avoids the problem that upper member and platen are interfered.
It is appreciated that in other embodiments, the second elevating mechanism can be omitted, and upper member is directly arranged at pedestal
On, the first elevating mechanism drives platen to move relative to upper member, keeps platen separate or close to upper member.Further,
The direction of motion of platen and the direction of motion of upper member are parallel to each other, convenient for adjusting relative motion between platen and upper member
Distance.
For make platen relative to base motion during it is more steady, further, platen is slidably connected on pedestal,
Slide the first elevating mechanism driving platen relative to pedestal, so that the first elevating mechanism driving platen be made to go up and down relative to pedestal
It moves more steady.In the present embodiment, sliding slot is offered on pedestal, platen part is located in sliding slot and sliding relative to pedestal
It is dynamic, it is slidably connected to platen on pedestal.In other embodiments, being slidably connected between pedestal and platen can also be by leading
Cooperation between rail sliding block is slided to realize.
Further, manufacturing equipment further includes guide rod, and guide rod is set on pedestal.Slide opening is offered on platen, guide rod is worn
It is slidably connected in slide opening and with platen, plays guiding role, keep platen more steady relative to the sliding of pedestal.
In order to make the accurate sliding between platen and pedestal, further, manufacturing equipment further includes the first inductor, second
Inductor and controller, the first inductor and the second inductor are set on pedestal.Wherein, the first inductor be set to pedestal on
At first height and position opposite position of thimble, the second inductor is set to corresponding with the second height and position of thimble on pedestal
At position.First inductor and the second inductor are used to induction thimble.Controller is set on pedestal, and controller is respectively with the
One inductor, the second inductor and the communication connection of the first elevating mechanism.When with platen to slide into first relative to pedestal high for thimble
When spending at position, the first inductor issues inductive signal, and controller is gone up and down according to the actuated signal control first of the first inductor
Mechanism stopping movement, makes platen stop at the current position on pedestal.Similarly, when thimble slides into platen relative to pedestal
When at the second height and position, the second inductor issues inductive signal, and controller is according to the actuated signal control of the second inductor the
One elevating mechanism stopping movement, makes platen stop at the current position on pedestal.In this way, realizing that the first elevating mechanism drives platform
Plate is accurately slided relative to pedestal.
The first lifting structure includes first motor, the first screw rod and the first nut in one of the embodiments,.First electricity
Machine is set on pedestal.One end of first screw rod and the power output end of first motor connect, and the other end and pedestal are rotatablely connected.The
One nut is sheathed on the first screw rod and is spirally connected with the first screw rod.First nut is also connect with platen.First motor driving first
Screw rod is rotated relative to pedestal, and the first screw rod drives the first nut mobile relative to pedestal, and the first nut is made to drive platen opposite
It is slided in pedestal.
Further, manufacturing equipment further includes loading and unloading manipulator.Loading and unloading manipulator is set on pedestal.Loading and unloading are mechanical
Hand is used to before substrate processing for substrate being placed in the thimble space on platen, and for substrate completion of processing it
Substrate is taken out afterwards.Further, loading and unloading manipulator and driving mechanism are communicated to connect with controller.When thimble is located at first
When height and position, substrate is placed in the space of thimble by controller control loading and unloading manipulator.When thimble is located at second
Height and position, and when driving mechanism driving thimble release substrate, controller controls the substrate on loading and unloading manipulator taking-up platen.
Above-mentioned manufacturing equipment realizes the automatic loading/unloading to substrate.
Driving mechanism includes cylinder and connecting rod in one of the embodiments, and cylinder is set on platen, and cylinder is dynamic
Power output end is connect with connecting rod.Connecting rod is also connect with thimble, connects the power output end of cylinder by connecting rod and thimble
It connects, in this way, cylinder drives thimble to move relative to platen.In other embodiments, driving mechanism is not limited only to pneumatic actuation side
Formula can also be motor lead screw driving method.
The second lifting structure includes the second motor, the second screw rod and the second nut in one of the embodiments,.Second electricity
Machine is set on pedestal.One end of second screw rod is connect with the power output end of the second motor, and the other end and pedestal are rotatablely connected.The
Two nuts are sheathed on the second screw rod and are spirally connected with the second screw rod.Second nut is also connect with upper member.Second motor driven
Second screw rod is rotated relative to pedestal, and the second screw rod drives the second nut mobile relative to pedestal, and the second nut is made to drive top
Component is slided relative to pedestal.
Substrate, is placed in the space of thimble by above-mentioned localization method first, and the thimble on platen is enable to clamp
To substrate, avoids the top that substrate is placed in thimble and cannot be clamped by thimble；Then driving thimble is near and parallel to base
The direction of plate moves, and there are gaps between thimble and substrate；Then driving thimble is along the direction perpendicular to the substrate from first
Height and position drops to the second height and position so that the distance between the thimble and upper member be greater than or equal to it is default away from
From, i.e., thimble drops to non-interfering position, in case mechanical interference occurs for the thimble and upper member；Finally driving thimble clamping
Substrate is positioned at substrate on platen；Above-mentioned thimble positions substrate using above-mentioned localization method, and thimble clamps base
It needs to drop to the second height and position from the first height and position along the direction perpendicular to the substrate before plate, drops to thimble non-
Interference position can avoid thimble and upper member and interfere, that is to say, that relative to it is traditional can only drive thimble towards and it is flat
The localization method that move in substrate clamping direction of row, above-mentioned thimble is in addition to direction and is parallel to substrate clamping direction and moves it
Outside, i.e., in addition to towards near and parallel to the substrate direction movement other than, moreover it is possible to along perpendicular to the substrate direction from
First height and position drops to the second height and position, i.e., thimble is relative to upper member elevating movement, without whether considering thimble
Too high or too low, the localization method for solving traditional substrate, which is interfered there are thimble with upper member, and positioning accuracy is lower asks
Topic；Above-mentioned manufacturing equipment includes above-mentioned thimble, is not required to increase and inhales vacuum design and can carry out reliable location to substrate, significantly
Reduce the cost of manufacturing equipment.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of localization method, for being positioned to substrate, which is characterized in that the localization method includes:
The substrate is placed in the space of thimble；
It drives the thimble to move towards the direction near and parallel to the substrate, makes to deposit between the thimble and the substrate
In gap；
The thimble is driven to drop to the second height and position from the first height and position along the direction perpendicular to the substrate, so that institute
The distance between thimble and upper member are stated more than or equal to pre-determined distance；And
The thimble is driven to clamp the substrate.
2. localization method according to claim 1, which is characterized in that in the step of driving the thimble to clamp the substrate
Later, the localization method further comprises the steps of:
The upper member is moved to outside the space of the thimble.
3. localization method according to claim 2, which is characterized in that the upper member is being moved to the thimble
After step outside sphere of action, the localization method is further comprised the steps of:
It drives the thimble to be directed away from and is parallel to the direction movement of the substrate.
4. localization method according to claim 3, which is characterized in that the thimble is being driven to be directed away from the substrate
After the step of direction moves, the localization method is further comprised the steps of:
Take the substrate away.
5. localization method according to claim 4, which is characterized in that described fixed after the step of taking the substrate away
Position method further comprises the steps of:
The thimble is driven to rise to first height position from second height and position along the direction perpendicular to the substrate
It sets.
6. localization method according to claim 5, which is characterized in that the step of taking the substrate away specifically:
The substrate is taken away by loading and unloading manipulator.
7. a kind of thimble, which is characterized in that using localization method described in any one of claims 1 to 6 to the substrate into
Row positioning.
8. thimble according to claim 7, which is characterized in that the thimble includes on thimble ontology and the thimble ontology
The stop portion extended towards clamping direction, the thimble ontology are used for for clamping the substrate, the stop portion to the substrate
It is limited.
9. localization method according to claim 8, which is characterized in that the wedge-shaped in cross-section shape in the stop portion.
10. a kind of manufacturing equipment, which is characterized in that including thimble described in any one of claims 1 to 9.
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| CN109215512B (en) | 2021-02-26 |
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