CN109214262B - Detection device - Google Patents

Detection device Download PDF

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Publication number
CN109214262B
CN109214262B CN201810696924.8A CN201810696924A CN109214262B CN 109214262 B CN109214262 B CN 109214262B CN 201810696924 A CN201810696924 A CN 201810696924A CN 109214262 B CN109214262 B CN 109214262B
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Prior art keywords
light
light guide
sensing
reflective
guide element
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CN109214262A (en
Inventor
林伯骏
巫仁杰
黄承钧
游国良
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Gingy Technology Inc
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Gingy Technology Inc
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention provides a detection device for sensing biopolymer. The detection device comprises a sensing element, a light-transmitting element and a surface plasma resonance layer. The light-transmitting element is configured on the sensing element. The surface plasma resonance layer is arranged on the light-transmitting element and used for receiving the biopolymer. The light-transmitting element is arranged between the surface plasma resonance layer and the sensing element.

Description

Detection device
Technical Field
The present invention relates to a detection device, and more particularly, to a detection device for sensing biopolymer.
Background
For example, in the prior art, a fingerprint pattern is formed by pressing ink on a biometric feature (e.g., a finger) and transferring the pressed fingerprint pattern to a paper, and then the printed fingerprint pattern is optically scanned and input into a computer for filing or comparison. The above-mentioned identification has the disadvantage of being unable to be processed immediately, and also unable to meet the demand for instant identification in the present society. Therefore, electronic biometric devices are becoming one of the mainstream of the current technology. However, in general, a biometric recognition apparatus has only a biometric recognition function. Therefore, how to add other functions of the biometric device to improve the added value of the biometric device is also one of the current development directions.
Disclosure of Invention
The invention provides a detection device capable of sensing biopolymer.
The detection device of an embodiment of the invention includes a light guide element, a first reflection element, a sensing element, a light emitting element and a surface plasmon resonance layer. The light guide element includes a top surface and a bottom surface opposite the top surface. The first reflecting element is arranged on the bottom surface of the light guide element. The sensing element is arranged beside the bottom surface of the light guide element. The light emitting element is used for emitting a light beam, wherein the light beam is reflected by the first reflecting element and transmitted to the sensing element. The surface plasma resonance layer is arranged on the light guide element and is used for receiving the biopolymer. The light guide element is located between the surface plasmon resonance layer and the sensing element.
Based on the above, the detection device of an embodiment of the invention has the functions of both biological feature recognition and sensing of biological high polymer, and has high added value.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 2 is a schematic diagram of a part of a detection apparatus according to an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a detecting device according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 5 is a schematic view of a part of a detection apparatus according to an embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 8 is a schematic diagram of a part of a detection apparatus according to an embodiment of the invention.
Fig. 9 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 10 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 11 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 12 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 13 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 14 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 15 is a schematic top view of the detection device of fig. 14.
Fig. 16 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 17 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 18 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 19 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 20 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 21 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention.
Fig. 22 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 23 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
FIG. 24 is a cross-sectional view of a detecting device according to an embodiment of the present invention.
Fig. 25 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 26 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
FIG. 27 is a partially enlarged view of a plurality of antireflective microstructures of FIG. 26 in region II.
Fig. 28 is a partial bottom view of a light guide element according to an embodiment of the invention.
Fig. 29 is a partial bottom view of a light guide element according to an embodiment of the invention.
Fig. 30 is a partial cross-sectional view of a light guide element according to an embodiment of the invention.
Fig. 31 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 32 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 33 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
FIG. 34 is a cross-sectional view of a detecting device according to an embodiment of the present invention.
Fig. 35 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
Fig. 36 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention.
FIG. 37 is a cross-sectional view of an embodiment of a detecting device according to an embodiment of the present invention.
Fig. 38 to 42 are schematic cross-sectional views of other embodiments of the detecting device of the embodiment of fig. 1.
FIG. 43 is a cross-sectional view of an embodiment of a detecting device according to an embodiment of the present invention.
FIG. 44 is a cross-sectional view of another embodiment of a detecting device according to an embodiment of the present invention.
FIG. 45 is a cross-sectional view of an embodiment of a detecting device according to the present invention.
FIG. 46 is a cross-sectional view of another embodiment of a detecting device according to an embodiment of the present invention.
Fig. 47A to 47B are schematic top and cross-sectional views of a detection device according to an embodiment of the invention.
Fig. 48A to 48B are schematic top and cross-sectional views of a detection device according to an embodiment of the invention.
FIG. 49 is a cross-sectional view of a detecting device according to an embodiment of the present invention.
FIG. 50 is a cross-sectional view of a detecting device according to an embodiment of the present invention.
FIG. 51A is a schematic cross-sectional view of a trench of a detection apparatus according to an embodiment of the present invention.
FIG. 51B is a schematic cross-sectional view of a trench of a detection apparatus according to an embodiment of the present invention.
Fig. 51C to 51D are schematic cross-sectional views of another two kinds of trenches of a detecting device according to an embodiment of the invention.
Fig. 52 shows the relationship of various reflection angles θ of the sensing light beam L reflected by the surface plasmon resonance layer SPR and the reflectance thereof.
Description of reference numerals:
c1, C2, C3: a recessed portion;
D. k: a distance;
d1, D2, D3: direction;
e1, E2: a light-emitting part;
α、θ、θ1、θ2、θi: an angle;
l, L', L1, B, BB: a light beam;
II: an area;
f1: an object;
S120T, S140T, S1421S, S1441S, S1441C, S1444S, S131, S133A, S133B, S170T, S210T, 160a, 160B, 160C, 212, 214, 215a, 215aA, 215aB, 215aC, 216B, 218A, 218C, 222, P1, 146, 148: kneading;
SPR: a surface plasmon resonance layer;
p, P1-P5: spacing;
t1, T2: thickness;
H. H1-H5: thickness;
1: an environmental medium;
14: a substrate;
20: a shade;
40: a wall structure;
70: a light-transmitting base;
80: a biopolymer;
200. 200-200Y, 200-1-200-20: a detection device;
230: a light emitting element;
240: a sensing element;
260. 260B: a reflective element;
260D, 270: a reflective element;
270B, 270D: a reflective element;
280. 293: a reflective element;
210: a light guide element;
201. 202, 250, G1: optical cement;
210-1: a thick portion;
210-2: a thin portion;
213: an inner wall;
215. 215A, 215B, 215C, 215D: a trench;
219: a side wall;
240 a: a light receiving face;
262. 272: a reflection section;
266. 276, MS: a microstructure;
291. 291a, 291b, 291C, 291D, 296: a light absorbing element;
292: a light absorbing layer;
300: an anti-reflection microstructure;
300C: a vertex;
300R: a ridge line;
301: a light receiving area;
302: a backlight area;
303: an optical microstructure.
Detailed Description
The foregoing and other technical and scientific aspects, features and utilities of the present invention will be apparent from the following detailed description of various embodiments, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: "upper", "lower", "front", "rear", "left", "right", etc., are simply directions with reference to the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. Also, in any of the following embodiments, the same or similar elements will be given the same or similar reference numerals.
Fig. 1 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Fig. 2 is a schematic diagram of a part of a detection apparatus according to an embodiment of the invention. Referring to fig. 1 and 2, the detecting device 200 is located in the environmental medium 1. In the present embodiment, the ambient medium 1 is, for example, air. The invention is not limited thereto and in other embodiments the detection apparatus 200 may be located in other kinds of environmental media. The detection device 200 is used to acquire an image of an object. Under normal circumstances, the organism is a biological feature, such as: fingerprint, but the present invention is not limited thereto.
The detection apparatus 200 comprises a light guiding element 210. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light emitting surface 218. The light-emitting surface 218 is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light emitting surface 218. In particular, the light incident surface 216 is inclined with respect to the top surface 212, and the light incident surface 216 and the top surface 212 form an acute angle α.
In the present embodiment, the light guide element 210 further has an inner wall 213. The light-emitting surface 218 is closer to the light-transmitting element 220 than the bottom surface 214. The inner wall 213 is connected between the bottom surface 214 and the light emitting surface 218. The inner wall 213 and the light-emitting surface 218 form a recess 210 a. In other words, the light guide element 210 includes a thick portion 210-1 having the bottom surface 214 and a thin portion 210-2 having the light emitting surface 218. In the embodiment, the light emitting surface 218 and the bottom surface 214 may be selectively parallel to the top surface 212, but the invention is not limited thereto, and in other embodiments, the light emitting surface 218 may be inclined with respect to the top surface 212, which will be exemplified in the following paragraphs with reference to other drawings.
The detection device 200 includes a light transmissive element 220. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. In the present embodiment, the light-transmitting element 220 can be fixed on the top surface 212 of the light-guiding element 210 through an optical adhesive (not shown). The material of the light guide element 210 and/or the material of the light transmissive element 220 may be selected from glass, polymethyl methacrylate (PMMA), Polycarbonate (PC), or other suitable light transmissive materials. In the embodiment, the light guide element 210, the optical adhesive and the light transmission element 220 may have the same or similar refractive indexes, but the invention is not limited thereto.
The detection device 200 includes a light emitting element 230. The light emitting element 230 is disposed beside the light incident surface 216 and emits a light beam L. In the present embodiment, the light incident surface 216 of the light guide element 210 has a recess 216 a. The light emitting element 230 is disposed in the recess 216 a. The detection apparatus 200 further comprises an optical glue 250. The optical adhesive 250 fills the recess 216a to cover the light emitting element 230 and connect the light emitting element 230 and the light guide element 210. In the embodiment, the optical adhesive 250 may have the same or similar refractive index as the light guide element 210 to reduce the loss of the light beam L before entering the light guide element 210, but the invention is not limited thereto. In the present embodiment, the light beam L is, for example, invisible light. Therefore, when the electronic product equipped with the detection device 200 acquires the image of the object, the light beam L does not affect the appearance of the electronic product. However, the invention is not limited thereto, and in other embodiments, the light beam L may also be visible light or a combination of visible light and invisible light. In the embodiment, the light emitting element 230 may be a light emitting diode, but the invention is not limited thereto, and in other embodiments, the light emitting element 230 may also be other suitable types of light emitting elements.
The detection apparatus 200 includes a sensing element 240. The sensing element 240 is disposed on the light emitting surface 218 of the light guiding element 210. The light receiving surface 240a of the sensing element 240 faces the light emitting surface 218 of the light guiding element 210. In the present embodiment, the sensing element 240 is supported by the light emitting surface 218 of the light guiding element 210, and the light receiving surface 240a of the sensing element 240 may be substantially parallel to the light emitting surface 218 of the light guiding element 210. The sensing element 240 is, for example, a Charge Coupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS), but the invention is not limited thereto, and in other embodiments, the sensing element 240 may also be other suitable types of image sensors.
Referring to fig. 1 and fig. 2, the light beam L passes through the light incident surface 216 and then is transmitted to the light transmissive element 220, and at least a portion of the light beam L is totally reflected at an interface 222 between the light transmissive element 220 and the environmental medium 1. When an object (e.g., a fingerprint protrusion) touches the interface 222, the total reflection of the light beam L is destroyed on the interface 222 corresponding to the fingerprint protrusion, so that the sensing device 240 obtains a dark fringe corresponding to the fingerprint protrusion; while the convex portion of the fingerprint touches the interface 222, the concave portion of the fingerprint does not touch the interface 222, and the total reflection of the light beam L is not destroyed on the other interface 222 corresponding to the concave portion of the fingerprint, so that the sensing device 240 obtains the bright pattern corresponding to the concave portion of the fingerprint; thus, the sensing device 240 can obtain an image of an object (e.g., a fingerprint image) with alternating bright and dark colors.
It should be noted that, through the inclined light incident surface 216 (i.e. the design of the acute angle α), the light beam L emitted from the light emitting device 230 can be totally reflected within the short distance k at the interface 222 between the light transmitting device 220 and the ambient medium 1. Therefore, the size of the detecting device 200 can be reduced, which is beneficial to being installed in various electronic products. In the present embodiment, the size of the acute angle α can be designed appropriately, so as to further increase the proportion of the total reflection of the light beam L at the interface 222 on the premise of reducing the size of the detection apparatus 200. For example, in the present embodiment, the acute angle α may satisfy the following formula (1):
Figure BDA0001713629250000051
wherein theta isiIs the angle at which the light beam L enters the light guide element 210 from the light incident surface 216, n1Is the refractive index of the surrounding medium 1, and n2Is the refractive index of the light guiding element 210. If the direction from the normal of the light incident surface 216 (e.g., in fig. 2, there is no broken line parallel to the light beam L) to the light beam L is clockwise, θiIs negative. If the direction from the normal of the light incident surface 216 (e.g., in fig. 2, there is no broken line parallel to the light beam L) to the light beam L is counterclockwise, θiPositive values. When the angle α satisfies the above formula (1), the ratio of total reflection of the light beam L at the interface 222 is increased, which is helpful to improve the image capturing quality of the detection apparatus 200.
Referring to fig. 1, in the present embodiment, the detecting device 200 may further include a second reflecting element 270 and a first reflecting element 260. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210 and between the light transmissive element 220 and the light guide element 120. The first reflective element 260 is disposed on the bottom surface 214 of the light guide element 210. The light beam L passes through the light incident surface 216 and is then reflected by the second reflective element 270 and the first reflective element 260 to expand the light beam L. The expanded light beam L is transmitted to the light-transmitting element 220 and is totally reflected at an interface 222 between the light-transmitting element 220 and the environmental medium 1. The sensing element 240 is disposed closer to the light-transmitting element 220 than the first reflecting element 260 (e.g., at the recess 210 a).
It is noted that, by the beam expansion effect of the second reflective element 270 and the first reflective element 260 and the adjustment of the position of the sensing element 240 (for example, by making the light receiving surface 240a of the sensing element 240 close to the light transmissive element 220, or by making the light receiving surface 240a of the sensing element 240 inclined with respect to the top surface 212), the sensing element 240 can acquire a complete image of the object (for example, a fingerprint image) using the light receiving surface 240a with a small area. In other words, the area of the sensing element 240 can be reduced, and the size of the detecting device 200 including the sensing element 240 can be further reduced. However, the invention is not limited thereto, and in other implementations, the detecting device may not include the second reflecting element 270 and the first reflecting element 260, which will be exemplified in the following paragraphs with reference to other figures.
It is to be noted that the detection apparatus 200 of the present embodiment further includes a Surface Plasmon Resonance (Surface Plasmon Resonance) layer SPR. The surface plasmon resonance layer SPR is disposed on the surface 222 of the light transmitting element 220. The light transmitting element 220 is disposed between the surface plasmon resonance layer SPR and the sensing element 240. In the embodiment, the material of the surface plasmon resonance layer SPR includes metal, and the thickness of the surface plasmon resonance layer SPR is about 50 nanometers (nm), for example, but the invention is not limited thereto.
The surface plasmon resonance layer SPR is used to receive biopolymer (Biopolymers)80, such as: sweat, blood, urine, bacteria, viruses, etc., but the present invention is not limited thereto. The at least one light emitting element 230 is configured to emit a sensing light beam L toward the surface plasmon resonance layer SPR. The sensing light beam L reflected by the surface plasmon resonance layer SPR has various reflection angles θ; when the biopolymer 80 is formed on the surface plasmon resonance layer SPR, the reflectivity of the portion of the sensing light beam L having a specific angle (i.e., resonance angle) among the various reflection angles θ is abruptly decreased; the sensing element 240 receives the sensing light beams L having various reflection angles θ reflected by the surface plasmon resonance layer SPR; analyzing the light distribution of the sensing light beam L received by the sensing element 240 can deduce what the specific angle (i.e. the resonance angle) is. By the specific angle, it is possible to identify whether the biopolymer 80 disposed on the surface plasmon resonance layer SPR is a specific biopolymer 80. This will be exemplified below with reference to fig. 52.
Fig. 52 shows the relationship of various reflection angles θ of the sensing light beam L reflected by the surface plasmon resonance layer SPR and the reflectance thereof. Referring to fig. 1 and 52, for example, when the first biopolymer 80 is formed on the surface plasmon resonance layer SPR, the reflectivity of the sensing light beam L with various reflection angles θ reflected by the surface plasmon resonance layer SPR decreases suddenly at a specific angle θ 1, and the analysis of the sensing light beam L with various reflection angles θ reflected by the surface plasmon resonance layer SPR and received by the sensing element 240 can deduce the specific angle θ 1, so that the biopolymer 80 disposed on the surface plasmon resonance layer SPR can be identified as the first biopolymer 80 by the specific angle θ 1; when the second biopolymer 80 is formed on the surface plasmon resonance layer SPR, the reflectance of the sensing light beam L with various reflection angles θ 2 reflected by the surface plasmon resonance layer SPR decreases suddenly at a specific angle θ 2, and the analysis of the sensing light beam L with various reflection angles θ reflected by the surface plasmon resonance layer SPR and received by the sensing element 240 can deduce the specific angle θ 2, and the biopolymer 80 disposed on the surface plasmon resonance layer SPR can be identified as the second biopolymer 80 by the specific angle θ 2; when the third biopolymer 80 is formed on the surface plasmon resonance layer SPR, the reflectance of the sensing light beam L with various reflection angles θ 3 reflected by the surface plasmon resonance layer SPR decreases suddenly at a specific angle θ 3, and the analysis of the sensing light beam L with various reflection angles θ reflected by the surface plasmon resonance layer SPR and received by the sensing element 240 can deduce the specific angle θ 3, and the biopolymer 80 disposed on the surface plasmon resonance layer SPR can be identified as the third biopolymer 80 by the specific angle θ 3
Fig. 3 is a schematic cross-sectional view of a detecting device according to another embodiment of the invention. Referring to fig. 3, the detecting device 200A is similar to the detecting device 200 described above, and therefore the same or corresponding elements are denoted by the same or corresponding reference numerals. The difference between the detection device 200A and the detection device 200 is that the light-emitting surface 218A of the detection device 200A is different from the light-emitting surface 218 of the detection device 200. The following mainly describes the differences, and please refer to the above description for the same or corresponding points.
Referring to fig. 3, the detecting device 200A includes a light guide element 210, a light transmissive element 220, a light emitting element 230, and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light emitting surface 218A. The light-emitting surface 218A is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light emitting surface 218A. The light incident surface 216 and the top surface 212 form an acute angle α. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light emitting element 230 is disposed beside the light incident surface 216 and emits a light beam L. The light beam L passes through the light incident surface 216, then passes through the light transmissive element 220, and is totally reflected by an interface 222 between the light transmissive element 220 and the ambient medium 1. The sensing element 240 is disposed on the light emitting surface 218A of the light guiding element 210.
Unlike the detection device 200, the light-emitting surface 218A of the detection device 200A is inclined with respect to the top surface 212 and the bottom surface 214, and the distance k between the top surface 212 and the light-emitting surface 218A decreases with distance from the light-emitting element 230. The sensing element 240 is supported on the light emitting surface 218A, and the light receiving surface 240a of the sensing element 240 may be substantially parallel to the light emitting surface 218A of the light guiding element 210. The light receiving surface 240a of the sensing element 240 is also inclined with respect to the top surface 212 and the bottom surface 214. In addition to the above-mentioned advantages and effects of the detection apparatus 200, the detection apparatus 200A utilizes the inclined sensing element 240, so that the detection apparatus 200A can reduce the probability of stray light entering the sensing element 240, thereby improving the quality of the obtained object image, for example: the contrast of the object image can be improved.
Fig. 4 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Fig. 5 is a schematic view of a part of a detection apparatus according to an embodiment of the invention. Referring to fig. 4 and 5, the detecting device 200B is similar to the detecting device 200A, and therefore the same or corresponding elements are denoted by the same or corresponding reference numerals. The difference between the detection apparatus 200B and the detection apparatus 200A is that the light emitting element 230B is disposed outside the light guide element 210 and in the environmental medium 1. The following mainly describes the differences, and please refer to the above description for the same or corresponding points.
Referring to fig. 4 and 5, the detecting device 200B includes a light guide element 210, a light transmitting element 220, a light emitting element 230B and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216B connected between the top surface 212 and the bottom surface 214, and a light emitting surface 218A. The light-emitting surface 218A is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216B and the light emitting surface 218A. The light incident surface 216B and the top surface 212 form an acute angle α. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light emitting element 230B is disposed beside the light incident surface 216 and emits a light beam L. The light beam L passes through the light incident surface 216B, then passes through the light transmissive element 220, and is totally reflected by an interface 222 between the light transmissive element 220 and the ambient medium 1. The sensing element 240 is disposed on the light emitting surface 218A of the light guiding element 210.
Unlike the detection device 200A, the light incident surface 216B of the detection device 200B may not have the recess 216a, and the light emitting element 230B is disposed outside the light guide element 210 and in the ambient medium 1. In other words, the light beam L emitted by the light emitting element 230B passes through the light incident surface 216B and enters the light guiding element 210 after being transmitted for a certain distance in the environment medium 1. Due to the change of the transmission path of the light beam L, the optimum range of the acute angle α of the detection device 200B is also different from the optimum range of the acute angle α of the detection device 200A. In detail, in the detecting device 200B, the acute angle α may satisfy the following formula (2):
Figure BDA0001713629250000071
wherein theta isiIs the incident angle of the light beam L incident on the incident surface 216B, n1Is the refractive index of the surrounding medium 1, and n2Is the refractive index of the light guiding element 210. If the direction from the normal of the light incident surface 216B (e.g., the dashed line in FIG. 5) to the light beam L is clockwise, θiIs negative. If the direction from the normal line (e.g., the dotted line in fig. 5) of the light incident surface 216B to the light beam L is counterclockwise, θiPositive values. The detecting device 200B has similar functions and advantages as the detecting device 200A, and thus, will not be repeated.
Fig. 6 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Referring to fig. 6, the detecting device 200C is similar to the detecting device 200A, and therefore the same or corresponding elements are denoted by the same or corresponding reference numerals. The difference between the detecting device 200C and the detecting device 200A is that the detecting device 200C may not include the second reflective element 270 and the first reflective element 260, and the light guiding element 210 of the detecting device 200C may not have the inner wall 213. The following mainly describes the differences, and please refer to the above description for the same or corresponding points.
Referring to fig. 6, the detecting device 200C includes a light guide element 210, a light transmissive element 220, a light emitting element 230 and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light emitting surface 218C. The light-emitting surface 218C is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light emitting surface 218C. The light emitting surface 218C is inclined with respect to the top surface 212, and the distance k between the top surface 212 and the light emitting surface 218C decreases with distance from the light emitting element 230. The light incident surface 216 and the top surface 212 form an acute angle α. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light emitting element 230 is disposed beside the light incident surface 216 and emits a light beam L. The light beam L passes through the light incident surface 216, then passes through the light transmissive element 220, and is totally reflected by an interface 222 between the light transmissive element 220 and the ambient medium 1. The sensing element 240 is disposed on the light emitting surface 218C of the light guiding element 210. The sensing element 240 rests on the light emitting surface 218C, and the light receiving surface 240a of the sensing element 240 is parallel to the light emitting surface 218C of the light guiding element 210. In other words, the light receiving surface 240a of the sensing element 240 is also inclined.
Unlike the detection device 200A, the light guide element 210 of the detection device 200C may not have the inner wall 213, and the light emitting surface 218C of the light guide element 210 may be directly connected to the bottom surface 214. In addition, the detecting device 200C may not include the second reflective element 270 and the first reflective element 260, and the light beam L may directly transmit to the light transmissive element 220 after passing through the light exit surface 116, and be totally reflected at the interface 222 between the light transmissive element 220 and the environmental medium 1. In other words, the size of the detecting device 200C can be reduced by using the first reflection (i.e. the total reflection of the light beam L on the interface 222) and the tilted sensing element 240, without providing the second reflection element 270 and the first reflection element 260.
Fig. 7 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Fig. 8 is a schematic diagram of a part of a detection apparatus according to an embodiment of the invention. Referring to fig. 7 and 8, the detecting device 200D is similar to the detecting device 200 described above, and therefore the same or corresponding elements are denoted by the same or corresponding reference numerals. The difference between the detection apparatus 200D and the detection apparatus 200 is that the light incident surface 216 of the detection apparatus 200D can be disposed at the bottom of the light guide element 210. The following mainly describes the differences, and please refer to the above description for the same or corresponding points.
Referring to fig. 7 and 8, the detecting device 200D includes a light guide element 210, a light transmissive element 220, a light emitting element 230, a sensing element 240, a second reflective element 270, and a first reflective element 260. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light emitting surface 218. The light-emitting surface 218 is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light emitting surface 218. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light emitting device 230 is used for emitting a light beam L. The sensing element 240 is disposed on the light emitting surface 218 of the light guiding element 210. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210 and located between the light transmissive element 220 and the light guide element 210. The first reflective element 260 is disposed on the bottom surface 214 of the light guide element 210. The light beam L passes through the light incident surface 216 and is reflected by the second reflective element 270 and the first reflective element 260. The light beam L is reflected by the second reflecting element 270 and the first reflecting element 260, and then is totally reflected by the interface 222 between the light transmitting element 220 and the ambient medium 1.
Unlike the detection device 200A, the light incident surface 216 of the detection device 200D may be disposed at the bottom of the light guide element 210. In other words, a portion of the light incident surface 216 may be substantially coplanar with the bottom surface 214, but the invention is not limited thereto. In the present embodiment, θiIs the angle at which the light beam L enters the light guide element 210 from the light incident surface 216, and θiSatisfies the following formula (3):
Figure BDA0001713629250000091
wherein n is1Is the refractive index of the surrounding medium 1, and n2Is the refractive index of the light guiding element 210. If from the normal to the light-incident surface 216 (e.g.: dotted line in fig. 8) to the direction of the light beam L is clockwise, θiIs negative. If the direction from the normal of the light incident surface 216 (e.g., the dashed line in fig. 8) to the light beam L is counterclockwise, θiPositive values. The detecting device 200D has similar functions and advantages as the detecting device 200, and thus, will not be repeated.
Fig. 9 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Referring to fig. 9, the detecting device 200E includes a light guide element 210. The light guide element 210 has a top surface 212 and a bottom surface 214 opposite to each other. Light guide element 210 also has a sidewall 219 connected between top surface 212 and bottom surface 214. In this embodiment, the sidewalls 219 may not be sloped with respect to the top surface 212. In other words, the sidewalls 219 may be substantially perpendicular to the top surface 212. The invention is not limited in this regard and in other embodiments, the sidewalls 219 can be sloped relative to the top surface 212. In the present embodiment, the refractive index of the light guide element 210 may be greater than or equal to 1.4 and less than or equal to 1.6. The light guide element 210 is made of glass, for example. However, the invention is not limited thereto, and in other embodiments, the material of the light guide element 210 may also be other suitable materials, such as: polymethyl methacrylate (PMMA), Polycarbonate (PC), or other suitable light-transmissive material.
The detection device 200E includes a light transmissive element 220. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light transmissive element 220 has a surface 222 facing away from the light guiding element 210. In the present embodiment, if the detecting device 200E is used to acquire a fingerprint and/or a vein of a finger, the surface 222 of the light-transmitting element 220 can be pressed by the finger.
The detection device 200E includes a first optical glue 201. The first optical adhesive 201 is disposed between the light-transmitting element 220 and the top surface 212 of the light-guiding element 210. The light-transmitting element 220 is connected to the top surface 212 of the light-guiding element 210 by the first optical glue 201. In this embodiment, the first optical glue 201 may have a refractive index that is the same as or similar to the light guide element 210 and/or the light transmissive element 220, so as to reduce the loss of the light beam L at the interface between the first optical glue 201 and the light guide element 210 and/or the interface between the first optical glue 201 and the light transmissive element 220. In other words, the refractive index of the first optical adhesive 201 may also be greater than or equal to 1.4 and less than or equal to 1.6, but the invention is not limited thereto.
The detection device 200E includes a sensing element 240. The sensing element 240 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the light transmissive element 220 and the sensing element 240. The sensing element 240 has a light receiving surface 240a facing the light guiding element 210.
The detection device 200E includes a second optical glue 202. The second optical adhesive 202 is disposed between the bottom surface 214 of the light guide element 210 and the sensing element 240. The sensing element 240 is connected to the bottom surface 214 of the light guide element 210 by the second optical glue 202. In the present embodiment, the second optical glue 202 may have the same or similar refractive index as the light guide element 210, so as to reduce the loss of the light beam L at the interface between the second optical glue 202 and the light guide element 210. In other words, the refractive index of the second optical adhesive 202 may also be greater than or equal to 1.4 and less than or equal to 1.6, but the invention is not limited thereto.
The material of the light guide element 210 is different from the material of the first optical adhesive 201 and the second optical adhesive 202. In other words, the light guide element 210 with lower material cost can be inserted between the light transmissive element 220 and the sensing element 240, so as to reduce the amount of optical glue filled between the light transmissive element 220 and the sensing element 240. Since the amount of the first optical adhesive 201 and the second optical adhesive 202, which are high in material cost, is small, the manufacturing cost of the detection device 200E is low.
The detection device 200E includes a light emitting element 230. The light emitting device 230 is used for emitting a light beam L. The light beam L passes through the light guide element 210, then passes through the light transmissive element 220, and is totally reflected at an interface (i.e., the surface 222) between the light transmissive element 220 and the environmental medium 1. When an object (e.g., a fingerprint protrusion) touches the surface 222, the total reflection of the light beam L is destroyed on the surface 222 corresponding to the fingerprint protrusion, so that the sensing device 240 obtains a dark stripe corresponding to the fingerprint protrusion; while the convex portion of the fingerprint touches a portion of the surface 222, the concave portion of the fingerprint does not touch the surface 222, and the total reflection of the light beam L on the other portion of the surface 222 corresponding to the concave portion of the fingerprint is not destroyed, so that the sensing device 240 obtains the bright pattern corresponding to the concave portion of the fingerprint; thus, the sensing device 240 can obtain an image of an object (e.g., a fingerprint image) with alternating bright and dark colors. In the present embodiment, the light beam L is, for example, visible light. However, the invention is not limited thereto, and in other embodiments, the light beam L may be non-visible light or a combination of non-visible light and visible light. The light emitting element 230 is, for example, a light emitting diode, but is not limited thereto, and in other embodiments, the light emitting element 230 may be another suitable type of light emitting element.
In this embodiment, the detecting device 200E may further include a second reflecting element 270 and a first reflecting element 260. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210. The second reflective element 270 is located between the light transmissive element 220 and the light guide element 210. The first reflective element 260 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the second reflective element 270 and the first reflective element 260. The light beam L is reflected by the second reflective element 270 and the first reflective element 260 and then transmitted to the light transmissive element 220, and is totally reflected at an interface (i.e., the surface 222) between the light transmissive element 220 and the environmental medium 1. For example, in the embodiment, the second reflective element 270 and the first reflective element 260 may be reflective sheets or reflective layers formed by coating, which is not limited in the invention.
In the embodiment, the light beam L may be transmitted to the top surface 212 of the light guide element 210 before being transmitted to the second reflective element 270 and the first reflective element 260, and the light beam L may be sequentially reflected by the second reflective element 270 and the first reflective element 260 to be transmitted to the light transmissive element 220. However, the invention is not limited thereto, and in other embodiments, the light beam L may also pass along other paths. In addition, in the embodiment, the second reflective element 270 and the first reflective element 260 may be staggered and partially overlapped. However, the present invention is not limited thereto, and in other embodiments, the second reflective element 270 and the first reflective element 260 may be completely staggered without overlapping, or disposed in other suitable relative positions, which will be described below with reference to fig. 10 and 11.
Fig. 10 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The detection device 200F of fig. 10 is similar to the detection device 200E of fig. 9, and therefore like or corresponding elements are denoted by like or corresponding reference numerals. Unlike the detecting device 200E, in the embodiment of fig. 10, the light beam L may be transmitted to the bottom surface 214 of the light guide element 210 before being transmitted to the second reflecting element 270 and the first reflecting element 260, and the light beam L may be sequentially reflected by the first reflecting element 260 and the second reflecting element 270 to be transmitted to the light transmission element 220. For example, in the embodiment, the second reflective element 270 and the first reflective element 260 may be reflective sheets or reflective layers formed by coating, which is not limited in the invention. In addition, in other embodiments, the reflective function of the first reflective element 260 can be replaced by the interface reflection between the second optical glue 202 and the external air layer, wherein the refractive index of the second optical glue 202 is different from the refractive index of the external air layer.
Fig. 11 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The detection device 200G of fig. 11 is similar to the detection device 200F of fig. 10, and therefore like or corresponding elements are denoted by like or corresponding reference numerals. Unlike the detecting device 200F, in the embodiment of fig. 11, the second reflective element 270B and the first reflective element 260B do not partially overlap. In particular, the second reflective element 270B may be located within the area of the first reflective element 260B. In other words, the perpendicular projection of the second reflective element 270B on the bottom surface 214 may be located entirely within the perpendicular projection of the first reflective element 260B on the bottom surface 214. The light beam L may be sequentially reflected by the front end of the first reflective element 260B, the second reflective element 270B and the rear end of the first reflective element 260B to be transmitted to the light transmissive element 220.
Fig. 12 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The detection device 200H of fig. 12 is similar to the detection device 200F of fig. 10, and therefore like or corresponding elements are denoted by like or corresponding reference numerals. Unlike the detection device 200F, the detection device 200H of fig. 12 further includes a third reflective element 280. The third reflective element 280 is disposed on the bottom surface 214 of the light guide element 210. The light beam L is sequentially reflected by the first reflective element 260, the second reflective element 270 and the third reflective element 280 to be transmitted to the light transmissive element 220. The first reflective element 260 is separable from the third reflective element 280. The first reflective element 260 partially overlaps the second reflective element 270. In detail, the first reflective element 260 overlaps with the front end of the second reflective element 270 and does not overlap with the rear end of the second reflective element 270. The third reflective element 280 partially overlaps the second reflective element 270. In detail, the third reflective element 280 overlaps with the rear end of the second reflective element 270 and does not overlap with the front end of the second reflective element 270. In addition, the first reflective element 260, the third reflective element 280 or the sensing element 240 illustrated in fig. 12 need not be disposed in the second optical glue 202. In other embodiments, the first reflective element 260, the third reflective element 280 or the sensing element 240 may be disposed on the bottom surface 214 of the light guide element 210; in other words, the first reflective element 260, the third reflective element 280 or the sensing element 240 may be disposed on the other side of the second optical glue 202.
It should be noted that, in any of the embodiments shown in fig. 9 to 12, the light guide element 210 has a sidewall 219 connected to the top surface 212 and the bottom surface 214, and a light absorption layer (not shown) may be disposed on the sidewall 219.
Fig. 13 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The detection apparatus 200I of fig. 13 is similar to the detection apparatus 200E of fig. 9, and therefore identical or corresponding elements are denoted by identical or corresponding reference numerals. Unlike the inspection device 200E, in the embodiment of FIG. 13, at least one of the second reflective element 270D and the first reflective element 260D has one or more optical microstructures 276, 266. For example, the second reflective element 270D and the first reflective element 260D may optionally both have one or more optical microstructures 276 and 266, and in an example of the present embodiment, if a plurality of optical microstructures 276 and 266 are disposed on the second reflective element 270D and the first reflective element 260D in a continuous or spaced manner. In general, the optical microstructures referred to in this specification may be disposed on any reflective element in whole or in part, and the optical microstructures are not limited to be disposed continuously or at intervals. The light beam L can be reflected by the one or more optical microstructures 276 of the second reflective element 270D and/or the one or more optical microstructures 266 of the first reflective element 260D for transmission through the optically transmissive element 220. In this embodiment, the optical microstructure 276 can be disposed globally (or locally) on the second reflective element 270D and the optical microstructure 266 can be disposed globally (or locally) on the first reflective element 260D. Further, the optical microstructures 276 and/or the first reflective element 260D are configured to: the image capture area is increased, and the light beam L transmitted to the sensing element 240 is more uniform, which is beneficial to the imaging effect.
Fig. 14 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Fig. 15 is a schematic top view of the detection device of fig. 14. The detection apparatus 200J of fig. 14 and 15 is similar to the detection apparatus 200E of fig. 9, and therefore the same or corresponding elements are denoted by the same or corresponding reference numerals. Unlike detection device 200E, detection device 200E also includes a light absorbing layer 292. The light absorbing layer 292 can absorb light. In other words, the light absorbing layer 292 may be a light shielding layer that is opaque and non-reflective. The light absorbing layer 292 covers the sidewalls 219 of the light guide element 210. The light absorption layer 292 can absorb the stray light beam L incident on the sidewall 219, thereby improving the image capturing quality of the inspection apparatus 200J. In this embodiment, the light absorbing layer 292 can be an ink layer or an adhesive. However, the invention is not limited thereto, and in other embodiments, the light absorbing layer 292 may be other suitable light absorbing materials.
Fig. 16 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. Fig. 17 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. Fig. 18 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Fig. 19 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The detecting devices 200K, 200L, 200M, 200N of fig. 16, 17, 18, and 19 are similar to the detecting devices 200F, 200G, 200H, 200I of fig. 10, 11, 12, and 13, respectively, and the same or corresponding elements are denoted by the same or corresponding reference numerals. The main differences between the detecting devices 200K, 200L, 200M, 200N and the detecting devices 200F, 200G, 200H, 200I are: the detection devices 200K, 200L, 200M, and 200N have more light-absorbing layers 292 covering the sidewalls 219 than the detection devices 200F, 200G, 200H, and 200I, respectively.
Fig. 20 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The detection device 200O of FIG. 20 is similar to the detection device 200E of FIG. 9, and like or corresponding elements are designated by like or corresponding reference numerals. The main differences between the detection apparatus 200O and the detection apparatus 200E are: detection device 200O has more light absorbing layer 292 than detection device 200. The light absorbing layer 292 covers at least the sidewalls 219 of the light guiding element 210. In the embodiment of fig. 20, the light absorbing layer 292 may also selectively cover the sidewalls of the first optical paste 201 and/or the sidewalls of the second optical paste 202, but the invention is not limited thereto.
Fig. 21 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. Referring to fig. 21, the detecting device 200P includes a light guide element 210. The light guide element 210 has a top surface 212 and a bottom surface 214 opposite to each other. The detection device 200P includes a light transmissive element 220. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210. The light transmissive element 220 has a surface 222 facing away from the light guiding element 210.
The detecting device 200P includes a second reflective element 270 and a first reflective element 260. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210. The second reflective element 270 is located between the light transmissive element 220 and the light guide element 210. The first reflective element 260 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the second reflective element 270 and the first reflective element 260. In the embodiment, the first reflective element 260 may be located within an area of the second reflective element 270, but the invention is not limited thereto. The detecting device 200P includes a light emitting element 230. The light emitting device 230 is used for emitting a light beam L. The light beam L is reflected by the second reflective element 270 and the first reflective element 260 and then transmitted to the light transmissive element 220, and is totally reflected at an interface (i.e., the surface 222) between the light transmissive element 220 and the environmental medium 1. The detection device 200P includes a sensing element 240. The sensing element 240 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the light transmissive element 220 and the sensing element 240. The sensing element 240 has a light receiving surface 240a facing the light guiding element 210.
It is noted that the detecting device 200P includes a first light absorbing element 291. The first light absorbing element 291 is disposed on the bottom surface 214 of the light guide element 210. The first light absorbing element 291 can absorb the stray light beam L transmitted to the bottom surface 214, thereby improving the image capturing quality of the detecting apparatus 200P. In this embodiment, the first light absorbing element 291 may be disposed beside the first reflective element 260 without overlapping the first reflective element 260. More specifically, the detecting device 200P further includes a third reflective element 280. The third reflective element 280 is disposed on the bottom surface 214 of the light guide element 210. The first light absorbing element 291 may be located between the first reflective element 260 and the third reflective element 280. The light beam L is reflected by the second reflective element 270, the first reflective element 260 and the third reflective element 280 and then transmitted to the light-transmitting element 220.
Fig. 22 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The detection device 200Q of fig. 22 is similar to the detection device 200P of fig. 21, and therefore identical or corresponding elements are denoted by identical or corresponding reference numerals. The main differences between the detection apparatus 200Q and the detection apparatus 200P are: the detecting device 200Q further includes a fourth reflecting element 293. The fourth reflective element 293 is disposed on the top surface 212 of the light guide element 210 and separated from the second reflective element 270. The light beam L is reflected by the second reflective element 270, the first reflective element 260, the third reflective element 280 and the fourth reflective element 293 and then transmitted to the light transmissive element 220. In the present embodiment, the light beam L can be sequentially reflected by the second reflective element 270, the first reflective element 260, the fourth reflective element 293 and the third reflective element 280 to be transmitted to the light transmissive element 220.
Fig. 23 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The detection device 200R of fig. 23 is similar to the detection device 200P of fig. 21, and therefore identical or corresponding elements are denoted by identical or corresponding reference numerals. The main differences between the detection apparatus 200R and the detection apparatus 200P are: the detection apparatus 200R further includes a second light absorbing element 296. The second light absorbing element 296 is disposed on the top surface 212 of the light guiding element 210. The second light absorbing element 296 can absorb the stray light beam L transmitted to the top surface 212, thereby improving the image capturing quality of the detecting device 200B. In this embodiment, the second light absorbing element 296 is selectively disposed on the second reflecting element 270 and between the second reflecting element 270 and the bottom surface 214 of the light guiding element 210. The first light absorbing element 291 and the second light absorbing element 296 can be staggered without overlapping in a direction d perpendicular to the surface 222.
FIG. 24 is a cross-sectional view of a detecting device according to an embodiment of the present invention. The detection device 200S of fig. 24 is similar to the detection device 200P of fig. 21, and therefore like or corresponding elements are denoted by like or corresponding reference numerals. The main differences between the detection apparatus 200S and the detection apparatus 200P are: the first light absorbing element 291C of the detecting device 200P is disposed on the first reflecting element 260 and located between the top surface 212 of the light guiding element 210 and the first reflecting element 260.
Fig. 25 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The sensing device 200T of fig. 25 is similar to the sensing device 200Q of fig. 22, and therefore like or corresponding elements are designated by like or corresponding reference numerals. The main differences between the detection apparatus 200T and the detection apparatus 200Q are: the detecting device 200T does not include the third reflective element 280 of the detecting device 200Q, the first reflective element 260D of the detecting device 200T extends from at least right under the gap g between the second reflective element 270 and the fourth reflective element 293 to right under the end of the fourth reflective element 293, and the first light absorbing element 291D may be disposed on the first reflective element 260D and between the bottom surface 214 of the light guiding element 210 and the first reflective element 260D.
It should be noted that, in another variation of the embodiment shown in fig. 21 to fig. 25, the light guide element 210 has a top surface 212 and a bottom surface opposite to each other and a sidewall 219 connected to the top surface 214 and the bottom surface 214; the side walls 219 may also be covered with a light absorbing layer 294. In addition, the light guide element 210 of any embodiment may be a light-transmitting plate or an optical glue filled in the space occupied by the light guide element 210 (a multi-layer light guide medium may also be used as shown in fig. 9), and the invention is not limited thereto.
Referring to fig. 1, 3, 4, 6, 7, 9, 10, 11, 12, 13, 14, 16, 17, 18, 19, 20, 21, 22, 23, 24 and 25, the detection devices 200, 200A to 200T each include a Surface Plasmon Resonance (SPR) layer.
Referring to fig. 26 and 27, fig. 26 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. FIG. 27 is a partially enlarged view of a plurality of antireflective microstructures of FIG. 26 in region II. One embodiment of the present invention provides a detection apparatus 200U. The detection device 200U is located in an ambient medium for use. In one embodiment, the aforementioned environment medium is, for example, air, water or other kinds of environment media. The detection device U may be used to acquire images of the object F1 for identification. The object F1 is, for example, a finger, a palm, a wrist or an eyeball of a user, and the image acquired by the detection apparatus 200U is, for example, a fingerprint, a palm print, a vein, a pupil or an iris, but the invention is not limited thereto.
As shown in fig. 26, the detecting device 200U of one embodiment of the present invention includes a substrate 14, a light emitting element 230, a light guiding element 210, a light transmitting element 220 and a sensing element 240. The light guide element 210 is used to transmit light beams therein. The light guide element 210 of the present embodiment has a top surface 212 and a bottom surface 214 opposite to the top surface 212, and the light guide element 210 further has a light incident portion E1 and a light emergent portion E2 located on the bottom surface 214. The light beam L enters the light guide element 210 through the light incident portion E1, is transmitted in the light guide element 210, is totally reflected at least once to form a signal light beam L', and then exits the light guide element 210 through the light exiting portion E2 of the light guide element 210. In this embodiment, a plurality of anti-reflection microstructures 300 are disposed on the light exit portion E2 of the light guide element 210.
It should be noted that, when the signal light beam L 'enters the environment medium (e.g., air or air bubbles) from the light guide element 210, the signal light beam L' originally emitted from the light emitting portion E2 is totally reflected again to avoid the angle of the light beam projected to the light emitting portion E2 being greater than the critical angle of total reflection of the light guide element 210. Therefore, in the present embodiment, the light exit portion E2 has a plurality of anti-reflection microstructures 300 to destroy the total reflection of the signal light beam L'.
Specifically, each antireflection microstructure 300 has a light receiving region 301 and a back light region 302. In the present embodiment, the light receiving area 301 makes the incident angle of the signal beam L 'smaller than the critical angle of total reflection of the light guiding element 210, and the backlight area 302 makes the incident angle of the signal beam L' larger than the critical angle of total reflection. In one embodiment, the backlight area 302 is substantially parallel to the main traveling direction of the signal light beam L ', so that the signal light beam L' is less likely to be projected on the backlight area 302. On the other hand, the light receiving area 301 is substantially perpendicular to the main traveling direction of the light beam, and the area of the light receiving area 301 is larger than that of the backlight area 302, so that most of the signal light beam L 'is projected onto the light receiving area 301, and the signal light beam L' projected onto the light receiving area 301 is less prone to be totally reflected.
It should be noted that although a small portion of the stray light may be projected to the backlight area 302, the stray light projected to the backlight area 302 is totally reflected, and will not be emitted from the light-emitting portion E2 to interfere with the signal of the sensing element 240 to cause ghost image, as shown in fig. 26 to 27. In addition, after the signal light beam L' passes through the light receiving area 301, a portion of the light beam is refracted into another light beam with a larger angle when passing through the back light area 302 after passing through the light receiving surface 240a of the sensing element 240, and the light beam is totally reflected on the surface 222 of the light transmitting element 220, so that the angle of the totally reflected light beam is larger than that of the original path, and the light beam travels far away from the original path, and thus the light beam does not enter the light receiving surface 240a of the sensing element 240 again, thereby avoiding the phenomenon of signal ghost.
Referring to fig. 27, in the present embodiment, a plurality of anti-reflection microstructures 300 are connected to each other, and each anti-reflection microstructure 300 may have a mountain shape, a wave shape, or a sawtooth shape in cross section. In the embodiment of FIG. 27, each antireflective microstructure 300 has a saw-tooth cross-sectional shape. In addition, both the light receiving area 301 and the backlight area 302 of the present embodiment are inclined planes.
Please refer to fig. 27 and fig. 28. Fig. 28 is a partial bottom view of a light guide element according to an embodiment of the invention. Further, in the present embodiment, each of the anti-reflection microstructures 300 is an asymmetric pillar, and the asymmetric pillars extend along the first direction D1 and are arranged side by side along the second direction D2.
Each asymmetric convex column has a ridge line 300R, which is the boundary line between the light receiving area 301 and the backlight area 302. In the present embodiment, a perpendicular reference plane R1 passing through the ridge line 300R is defined. As shown in fig. 27, the vertical reference plane R1 is parallel to the third direction D3, that is, parallel to the thickness direction of the light guide element 210. The light receiving area 301 and the backlight area 302 are respectively located on two opposite sides of the vertical reference plane R1, the light receiving area 301 forms a first angle θ 1 with the vertical reference plane R1, and the backlight area 302 forms a second angle θ 2 with the vertical reference plane R1. In the embodiment, the first included angle θ 1 is greater than the second included angle θ 2 to ensure that most of the light beams can be projected onto the light receiving area 301 and are not totally reflected any more. In addition, in this embodiment, for two adjacent anti-reflection microstructures 300, the edge of light receiving area 301 of one anti-reflection microstructure 300 may coincide with the edge of backlight area 302 of the other anti-reflection microstructure 300. That is, a connecting region for connecting two anti-reflection microstructures 300 is not formed between two adjacent anti-reflection microstructures 300, so as to further reduce the probability of total reflection of the light beam. In other embodiments, however, a connecting region may be provided between every two adjacent anti-reflective microstructures 300, so long as the angle of inclination of the connecting region with respect to the vertical reference plane R1 prevents the light beam from being totally reflected or does not affect the travel path of the light beam.
In addition, the appearance of the anti-reflection microstructure 300 according to the embodiment of the invention is not limited to the asymmetric convex pillar, and the light receiving area 301 and the back light area 302 may also be curved surfaces, wherein the curved surfaces include concave surfaces or convex surfaces, for example. Referring to fig. 29, fig. 29 is a partial bottom view of a light guide element according to an embodiment of the invention. In this embodiment, a plurality of anti-reflection microstructures 300 are arranged in an array, and each anti-reflection microstructure 300 is an eccentric microlens. As shown in fig. 29, the cross-sectional shape of the bottom of each of antireflection microstructures 300 is circular, however, when viewed from the bottom, the vertex 300C of each of antireflection microstructures 300 is offset from the center of the cross-sectional shape (circular) of the bottom. That is, the top 300C of antireflective microstructure 300 is not aligned with the center of the cross-sectional shape (circle) of the bottom. In this embodiment, the edges of each antireflective microstructure 300 and the edges of another antireflective microstructure 300 are joined.
In addition, in the present embodiment, the vertices 300C of all the anti-reflection microstructures 300 in the same row arranged along the first direction D1 are defined to form a connecting line P2, and the connecting line P2 can divide the surface region of each anti-reflection microstructure 300 into a light receiving region 301 and a backlight region 302. Specifically, the light receiving area 301 is a surface area located in the right half of the line P2, and the backlight area 302 is a surface area located in the left half of the line P2. As can also be seen in fig. 29, the area of the light receiving area 301 may be larger than the area of the backlight area 302.
Referring to fig. 30, fig. 30 is a partial cross-sectional view of a light guide element according to an embodiment of the invention. Specifically, fig. 30 may be a schematic cross-sectional view of a plurality of anti-reflection microstructures 300 in fig. 29 in a second direction D2. In this embodiment, the cross-sectional shape of anti-reflection microstructure 300 is substantially wave-shaped or mountain-shaped, that is, both light receiving area 301 and backlight area 102 are curved.
In addition, a first angle θ 1 is formed between a tangent plane passing through any one point of the light receiving area 301 and the vertical reference plane R1 passing through the vertex 300C, and a second angle is formed between a tangent plane passing through any one point of the back light area 302 and the vertical reference plane R1 passing through the vertex 300C, and the first angle may be greater than the second angle. Accordingly, when the light beam is projected to the light receiving area 301, it can be ensured that the incident angle of the light beam is smaller than the critical angle of total reflection of the light guiding element 210, so as to avoid the light beam from being totally reflected.
In other embodiments, antireflective microstructure 300 may also be an eccentric cone of another type, such as an eccentric polygonal cone, i.e., the bottom of antireflective microstructure 300 may have a triangular, quadrangular or other polygonal cross-sectional shape. Embodiments of the present invention do not limit the shape of the antireflection microstructure 300 as long as the ratio of the light beam to be totally reflected (or the ratio of the light beam to penetrate through the light exit portion E2) can be reduced.
Please refer to fig. 26 again. The detecting device 200U of the present embodiment further includes a light-transmitting element 220. The light transmissive element 220 is disposed on the top surface 212 of the light guide element 210 and has a surface 222 in contact with the ambient medium and facing away from the light guide element 210. If the detecting device 200 is applied to an optical fingerprint recognition system for capturing a fingerprint and/or vein image, the surface 222 of the transparent element 220 can be touched or pressed by a finger for detection and recognition.
The detecting device 200U further includes a substrate 14 located at the second side of the light guiding element 210, a light emitting element 230 and a sensing element 240, wherein the light emitting element 230 and the sensing element 240 are both disposed on the substrate 14. The substrate 14 may be a wiring board that already has pre-configured wiring. In addition, the material of the substrate 14 is a light absorbing material.
The sensing element 240 is disposed on the substrate 14 corresponding to the plurality of anti-reflection microstructures 300 of the light guide element 210, and is used for acquiring an image of the object F1. In other words, the light guide element 210 is located between the sensing element 240 and the light transmissive element 220.
The sensing element 240 has a light receiving surface 240a to receive the light beam L emitted from the light emitting portion E2 of the light guiding element 210. In other words, after passing through the plurality of anti-reflection microstructures 300, the light beam is projected to the light receiving surface 240a of the sensing element 240.
The light emitting element 230 is disposed on the substrate 14 adjacent to the light incident portion E1 of the light guiding element 210, and is used for generating the light beam L transmitted in the light guiding element 210. In the present embodiment, the light emitting element 230 is disposed outside the light guiding element 210, and the light beam L generated by the light emitting element 230 is projected to the light incident portion E1 of the light guiding element 210.
Further, the bottom surface 214 of the light guide element 210 of the embodiment of the invention further has a first recess C1 for accommodating the light emitting element 230 and a second recess C2 for accommodating the sensing element 240. The light incident portion E1 of the light guide element 210 is located in the first recess C1, and the light emergent portion E2 of the light guide element 210 is located in the second recess C2.
As shown in fig. 26, when the light emitting element, the light guiding element 210 and the sensing element 240 are all disposed on the substrate 14, the light emitting element 230 can be received and clamped in the first recess C1, and the sensing element 240 can be received and clamped in the second recess C2. In addition, in the present embodiment, a plurality of anti-reflection microstructures 300 are located at the bottom of second recess C2. In this way, the overall size of the detection apparatus 200 can be reduced. However, in other embodiments, the first recess C1 and the second recess C2 may be omitted. In another embodiment, the light emitting element 230 may be embedded in the light guiding element 210. Specifically, the light emitting element 230 may be embedded in the light guide element 210 by fixing the light emitting element 230 on the substrate 14, and then forming the light guide element 210 through steps of glue filling, curing, and the like. At this time, the light beam L generated by the light emitting element 230 is directly transmitted in the light guiding element 210 without passing through other media. In addition, the light emitting elements 230 of the embodiment of the invention are all disposed on the bottom surface 214 of the light guide element 210, but in other embodiments, the light emitting elements 230 may also be disposed on the top surface 212 of the light guide element 210.
In addition, the detecting device 200U of the embodiment of the present invention further includes a second reflecting element 270 and a first reflecting element 260. The second reflective element 270 and the first reflective element 260 are disposed on the top surface 212 and the bottom surface 214 of the light guide element 210, respectively. Specifically, the second reflective element 270 is located between the light transmissive element 220 and the light guide element 210, and the first reflective element 260 is located between the substrate 14 and the light guide element 210. In an embodiment, the second reflective element 270 and the first reflective element 260 may be a reflective sheet or a reflective film layer formed on the surface of the light guide element 210, but the invention is not limited thereto. In addition, in the present embodiment, the second reflective element 270 and the first reflective element 260 may be disposed in a staggered manner, and at least partially overlap in the thickness direction of the light guide element 210, so as to guide the light beam L to the light transmissive element 220. In other embodiments, the second reflective element 270 and the first reflective element 260 may be completely staggered without overlapping. Therefore, the present invention does not limit the relative position between the second reflective element 270 and the first reflective element 260 or the form of reflecting the light beam L as long as the light beam L can be guided to the light transmissive element 220.
For example, in other embodiments, the traveling direction of the light beam L may be designed so that the light beam L generates total reflection between the light guide element 210 and the environment medium. In this case, the first reflecting element 260 may be omitted. In general, after the light beam L generated by the light emitting element 230 enters the light guiding element 210 through the light incident portion E1, the light beam L is reflected by the second reflecting element 270 and the first reflecting element 260, and then is transmitted to the light transmitting element 220 in the light guiding element 210, and is totally reflected at the interface between the light transmitting element 220 and the environment medium, that is, the surface 222 of the light transmitting element 220.
When an object F1 (e.g., a finger) touches the surface 222 of the transparent element 220, the finger ridge touches the surface 222, and a portion of the light beam L cannot be totally reflected, so that the sensing element 240 obtains a dark fringe corresponding to the finger ridge. On the other hand, the concave pattern of the finger does not contact the surface 222 of the light-transmitting element 220, and the other part of the light beam L can still be totally reflected to form the signal light beam L'. The signal light beam L' is projected toward the light exit portion E2 of the light guide element 210, and is projected toward the light receiving surface 240a of the sensing element 240 through the plurality of anti-reflection microstructures 300 of the light guide element 210. Subsequently, the signal light beam L' received by the sensing element 240 is processed by an image processing element, so as to obtain a fingerprint image of the object F1.
That is to say, in the embodiment of the invention, by disposing the anti-reflection microstructure 300 on the light exit portion E2 of the light guide element 210, the signal light beam L' can be prevented from being totally reflected again before entering the sensing element 240, so as to reduce the image recognition degree of the detection apparatus 200.
Referring to fig. 31, fig. 31 is a cross-sectional view of a detecting device according to an embodiment of the invention. The same or corresponding elements of the detecting device 200V of fig. 31 and the detecting device 200U of fig. 26 have the same reference numerals, and the description of the same parts is omitted. In the embodiment of fig. 31, the detecting device 200V further includes a third reflecting element 280 located on the bottom surface 214 of the light guiding element 210. That is, the first reflective element 260 and the third reflective element 280 are located on the same surface of the light guide element 210, but are spaced apart from each other. In the present embodiment, the light beam L is reflected by the second reflective element 270, the first reflective element 260 and the third reflective element 280 to be transmitted in the light guide element 210 and projected to the light transmissive element 220.
In the present embodiment, the second reflective element 270 completely overlaps the first reflective element 260 in the thickness direction of the light guide element 210, and the second reflective element 270 and the third reflective element 280 only partially overlap in the thickness direction of the light guide element 210. In addition, the detecting device 200V of the present embodiment further includes a light absorbing element 291 disposed between the first reflecting element 260 and the third reflecting element 280. In the present embodiment, the light absorbing element 291 and the second reflecting element 270 overlap in the thickness direction of the light guiding element 210. Further, the perpendicular projection of the second reflective element 270 may at least partially overlap the light absorbing element 291. The light absorbing element 291 may be a shielding layer opaque and non-reflective to the light beam L, such as an ink layer or an adhesive layer, or a shielding sheet, but the foregoing examples are not intended to limit the scope of the present invention.
In other embodiments, other light absorbing elements (not shown) may be disposed in other regions of the light guiding element 210, that is, regions where the second reflecting element 270, the first reflecting element 260, and the third reflecting element 280 are not disposed. For example, the detecting device 200V may further include a plurality of light absorbing elements (not shown) disposed on two opposite side walls of the light guiding element 210, wherein the side walls are connected to the surface between the top surface 212 and the bottom surface 214 of the light guiding element 210.
The light absorbing element 291 can absorb and reduce stray light that does not follow the predetermined light path, thereby preventing the sensing element 240 from receiving stray light other than the signal light beam L'. In addition, the light absorbing element 291 can increase the image capturing area, and the signal beam L' transmitted to the sensing element 240 is more uniform, which is beneficial to improving the imaging quality.
Referring to fig. 32, fig. 32 is a schematic cross-sectional view of a detection device according to an embodiment of the invention. The same or corresponding elements of the detecting device 200W of fig. 32 and the detecting device 200V of fig. 31 have the same reference numerals, and the description of the same parts is omitted. In the embodiment of fig. 32, the detection device 200W further comprises a fourth reflective element 290 located on the top surface 212 of the light guide element 210. That is, the second reflecting element 270 and the fourth reflecting element 290 are located on the same surface of the light guiding element 210, but are spaced apart from each other. In the present embodiment, the light beam L is sequentially reflected by the second reflective element 270, the first reflective element 260, the fourth reflective element 290 and the third reflective element 280, so as to be transmitted in the light guide element 210 and projected to the light transmissive element 220.
In the present embodiment, the second reflective element 270 at least partially overlaps the first reflective element 260 in the thickness direction of the light guide element 10, and the fourth reflective element 290 and the third reflective element 280 also partially overlap in the thickness direction of the light guide element 210. However, the second reflecting element 270 and the third reflecting element 280 do not overlap at all in the thickness direction of the light guiding element 210.
In addition, the detecting device 200W of the present embodiment further includes another light absorbing element 291b disposed between the second reflecting element 270 and the third reflecting element 280, in addition to the light absorbing element 291a disposed between the first reflecting element 260 and the third reflecting element 280. In this embodiment, the two light absorbing elements 291a, 291b and the second reflecting element 270 at least partially overlap in the thickness direction of the light guiding element 210. Similar to the embodiment of fig. 31, the two light absorbing elements 291a, 291b can absorb and reduce stray light that does not follow the predetermined light path, thereby preventing the sensing element 240 from receiving stray light other than the signal light beam L'. In addition, the light absorbing element 291 can increase the image capturing area, and the signal beam L' transmitted to the sensing element 240 is more uniform, which is beneficial to improving the imaging quality.
In addition, in the present embodiment, the detection apparatus 200W further includes a light shield 20 disposed in the first recess C1. The light shielding member 20 is located between the light emitting device 230 and the sensing device 240 to prevent the light beam L from directly projecting to the sensing device 240. On the other hand, the light shielding object 20 can limit the divergence angle of the light beam L generated by the light emitting device 230, so as to more precisely control the light beam L to enter the light guiding device 210 at a predetermined incident angle. Thus, the optical path of the light beam L can be further precisely controlled, and most of the light beam L can be ensured to be projected toward the object F1, thereby improving the imaging quality of the sensing element 240.
Referring to fig. 33, fig. 33 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The same or corresponding elements of the detecting device 200X of fig. 33 and the detecting device 200V of fig. 31 have the same reference numerals, and the description of the same parts is omitted.
In the embodiment of fig. 33, the light guide element 210 includes a plurality of optical microstructures 303 disposed between the first reflective element 260 and the third reflective element 280. In the present embodiment, the distribution range of the plurality of optical microstructures 303 and the second reflective element 270 at least partially overlap in the thickness direction of the light guide element 210. Further, the vertical projection of the second reflective element 270 may at least partially overlap the distribution range of the plurality of optical microstructures 303.
The shape of each optical microstructure 303 may be the same as that of antireflective microstructure 300 described above. For example, the cross-sectional shape of the optical microstructure 303 may be a sawtooth shape, a wave shape or a mountain shape, but the invention is not limited thereto.
The plurality of optical microstructures 303 may cause a portion of the light beam reflected by the second reflecting element 270 to pass through the plurality of optical microstructures 303 and project from the light guide element 210. Further, the stray light L1 not traveling according to the predetermined path may be projected out of the light guiding element 210 through the optical microstructure 303 and absorbed by the substrate 14, so as to prevent the sensing element 240 from receiving the stray light L1 besides the signal light beam L'. In addition, the configuration of the optical microstructure 303 can increase the image capture area, and make the signal beam L' transmitted to the sensing element 240 more uniform, which is beneficial to improving the imaging quality.
In addition, similar to the embodiment of fig. 32, in the embodiment of fig. 33, the detecting device 200X further includes a light shielding member 20 disposed in the first recess C1 to prevent the light beam L from directly projecting to the sensing element 240, and to limit the divergence angle of the light beam L generated by the light emitting element 230, so as to more precisely control the light beam L to enter the light guiding element 210 at a predetermined incident angle.
Referring to fig. 34, fig. 34 is a schematic cross-sectional view of a detection device according to an embodiment of the invention. The same or corresponding elements of the detecting device 200Y of fig. 34 and the detecting device 200W of fig. 32 have the same or similar reference numerals, and the description of the same parts is omitted.
In the embodiment of fig. 34, the detecting device 200Y includes a light absorbing element 291c disposed between the second reflecting element 270 and the fourth reflecting element 290, and the light guiding element 210 includes a plurality of optical microstructures 303 disposed between the first reflecting element 260 and the third reflecting element 280.
In the present embodiment, the distribution range of the plurality of optical microstructures 303 and the second reflective element 270 and the fourth reflective element 290 do not overlap with each other in the thickness direction of the light guide element 210. In addition, the light absorbing element 291c and the first reflective element 260 are at least partially overlapped in the thickness direction of the light guide element 210, but the light absorbing element 291c and the third reflective element 280 are not overlapped at all in the thickness direction of the light guide element 210.
The light absorbing element 291c and the optical microstructure 303 of the present embodiment can make the stray light L1 that does not travel according to the predetermined path exit from the light guiding element 210 and be absorbed by the substrate 14, or be directly absorbed by the light absorbing element 291c, so as to prevent the sensing element 240 from receiving the stray light other than the signal light beam L'. In addition, the configuration of the light absorbing element 291c and the optical microstructure 303 can increase the image capturing area, and make the signal light beam L' transmitted to the sensing element 240 more uniform, which is beneficial to improving the imaging quality.
Referring to fig. 35, fig. 35 is a schematic cross-sectional view of a detection apparatus according to an embodiment of the invention. The same or corresponding elements of the detecting device 200Z of fig. 35 and the detecting device 200U of fig. 26 have the same or similar reference numerals, and the description of the same parts is omitted. In the present embodiment, the detection device 200Z omits the light transmissive member 220 as shown in fig. 26. Accordingly, the light beam L generated by the light emitting element 230 enters the light guiding element 210 through the light incident portion E1, and then is transmitted in the light guiding element 210 by the reflection of the second reflecting element 270 and the reflection of the first reflecting element 260, and total reflection is generated at the interface between the light guiding element 210 and the environment medium, that is, the surface of the top surface 212 of the light guiding element 210.
That is, the surface of the top surface 212 of the light guide element 210 may be a contact surface that is contacted by the object F1. When an object F1 (e.g., a finger) contacts the light guide element 210 from the top surface 212 of the light guide element 210, the finger ridge will prevent a portion of the light beam L from being totally reflected, so that the sensing element 240 obtains a dark fringe corresponding to the finger ridge. On the other hand, the concave pattern of the finger does not contact the surface of the top surface 212 of the light guide element 210, and the other part of the light beam L can still be totally reflected to form the signal light beam L'. The signal light beam L' is projected toward the light exit portion E2 of the light guide element 210, and is projected toward the light receiving surface 240a of the sensing element 240 through the plurality of anti-reflection microstructures 300 of the light guide element 210. Then, the signal light beam L' received by the sensing element 240 is subjected to image processing by the image processing element, so that a fingerprint image of the object F1 can be obtained and the identity of the object F1 can be identified according to the fingerprint image.
Fig. 36 is a schematic cross-sectional view of a detecting device according to an embodiment of the invention. The same or corresponding elements of the detecting device 200Z of FIG. 35 of the detecting device 200-1 of the present embodiment have the same or similar reference numerals, and the description of the same parts is omitted.
In the present embodiment, the bottom surface 214 of the light guide element 210 does not have the first recess C1 and the second recess C2. That is, the surface of light guide element 210 on bottom surface 214 is planar, but a plurality of anti-reflection microstructures 300 are still disposed at light exit portion E2 on bottom surface 214.
In addition, the detection device 200-1 of the present embodiment further includes an optical adhesive G1. The optical adhesive G1 is connected between the light guide element 210 and the substrate 14, so that the light guide element 210 is fixed on the substrate 14, and the light emitting element 230 and the sensing element 240 are embedded in the optical adhesive G1. In addition, the refractive index of the optical adhesive G1 is substantially the same as that of the light guide element 210, and may be greater than or equal to 1.4 and less than or equal to 1.6, for example. Therefore, when the light beam L enters the optical cement G1 from the light guide element 210 or enters the light guide element 210 from the optical cement G1, the light beam L travels according to a predetermined optical path without being refracted. It should be noted that the optical adhesive G1 does not fill the gap defined between the sensing element 240 and the light-emitting portion E2 (the plurality of anti-reflection microstructures 300). Therefore, the plurality of anti-reflection microstructures 300 disposed in the light-emitting portion E2 can greatly reduce the probability that the signal light beam L' is totally reflected again in the light-emitting portion E2, thereby improving the imaging quality of the sensor 240.
In addition, in the embodiment, the light guide element 210 is located on the top surface (surface 222) of the light guide element 210 and has another concave portion C3, and the position of the concave portion C3 corresponds to the position of the second reflective element 270, so as to reduce a part of the thickness of the light guide element 210, which is beneficial to providing a thinner detection device for different products.
The detection devices 200U to 200Y and 201-1 each include a Surface Plasmon Resonance (Surface Plasmon Resonance) layer SPR. The function of the surface plasmon resonance layer SPR of the detection apparatuses 200U to 200Y and 200-1 is the same as that of the surface plasmon resonance layer SPR of the detection apparatus 200, and thus, the description thereof will not be repeated.
FIG. 37 is a cross-sectional view of an embodiment of a detecting device according to an embodiment of the present invention. Referring to fig. 37, the detecting device 200-2 is adapted to obtain the biological characteristics of the user O. In this embodiment, the user O is a finger, for example, and the biometric feature is a fingerprint or a vein, but not limited thereto. For example, in another embodiment, the user O may also be a palm and the biometric characteristic may be a palm print.
The detecting device 200-2 includes a substrate 14, a light emitting device 230, a sensing device 240, a light shield 20, a first reflective device 260, a light guide device 210, and a second reflective device 270.
The substrate 14 serves as a carrier for the above-mentioned components, and the substrate 14 may have a circuit. For example, the substrate 14 may be a Printed Circuit Board (PCB), a Flexible Printed Circuit Board (FPCB), a glass carrier with a Circuit, or a ceramic substrate with a Circuit, but not limited thereto.
The light emitting device 230 is disposed on the substrate 14, and the light emitting device 230 is electrically connected to the circuit on the substrate 14. For example, the detecting device 200 may further include a connection line CL1, and the light emitting element 230 is electrically connected to the circuit on the substrate 14 through the connection line CL1, but not limited thereto. The light emitting element 230 is adapted to provide a light beam B that illuminates the user O.
The sensing element 240 is disposed on the substrate 14 and beside the light emitting element 230. In addition, the sensing element 240 is electrically connected to the circuit on the substrate 14. For example, the detecting device 200 may further include a connection line CL2, and the sensing element 240 is electrically connected to the circuit on the substrate 14 through the connection line CL2, but not limited thereto. The sensing element 240 is adapted to receive the portion of the light beam B reflected by the user O (e.g., the light beam BB).
The light shield 20 is disposed on the substrate 14 and located between the light emitting device 230 and the sensing device 240. The light shield 20 is adapted to shield a large-angle light beam (e.g., the light beam BL) emitted by the light emitting device 230 to avoid interference caused by the large-angle light beam directly irradiating the sensing device 240. For example, the light shielding member 20 can be made of a light absorbing material, or can be formed by forming a light absorbing layer on a light transmissive block. In addition, the height of the light shield 20 may be greater than or equal to the height of the light emitting element 230 and less than the height of the light guiding element 210. That is, the top surface S140T of the light shield 20 may be higher than the top surface S120T of the light emitting element 230 or flush with the top surface S120T of the light emitting element 230. In addition, the top surface S140T of the light shield 20 is lower than the top surface 212 of the light guide element 210 to allow part of the light beam (e.g., light beam B) emitted by the light emitting element 230 to pass through. In any feasible example of the present application, the light guide element 210 may be formed by baking after filling a light-transmissive glue material.
The first reflective element 260 is disposed on the substrate 14 and between the light shield 20 and the sensing element 240. The first reflective element 260 is adapted to reflect the light beam B transmitted toward the substrate 14 such that the light beam B is transmitted away from the substrate 14. For example, the first reflective element 260 can be a reflective sheet or a reflective layer formed on the substrate 14 by at least one of plating, printing, etching, adhering, and coating.
The light guide element 210 is disposed on the substrate 14 and covers the light emitting element 230, the sensing element 240, the light shield 20 and the first reflective element 260. The light guide element 210 may be formed by curing a transparent adhesive through a heating process or an illumination process. The light-transmissive colloid may be epoxy, silica gel, optical glue, resin (resin) or other suitable light-transmissive material.
The second reflective element 270 is disposed above the light shield 20 and between the light emitting element 230 and the sensing element 240. Specifically, the second reflecting element 270 is at least located on a transmission path of the light beam B from the light emitting element 230 and not shielded by the light shield 20, so as to reflect the light beam B transmitted toward the top surface 212 of the light guiding element 210, so that the light beam B is transmitted toward the first reflecting element 260. The second reflective element 270 may be a reflective sheet or a reflective layer formed on the light guide element 210 by at least one of plating, printing, etching, adhering, and coating. It should be noted that, in other derivative embodiments of fig. 37, 38, 41 and 42, the second reflective element 270 may be omitted and disposed above the light guide element 210, as shown in fig. 43 and 45.
In the present embodiment, the second reflective element 270 is disposed on the top surface 212 of the light guide element 210, but not limited thereto. The second reflective element 270 may extend from above the light shield 20 to above the first reflective element 260, and the second reflective element 270 exposes the sensing element 240. The first reflective element 260 may partially overlap with the second reflective element 270, but is not limited thereto. In another embodiment, the first reflective element 260 and the second reflective element 270 may also be completely overlapping or not overlapping at all. In addition, the first and second reflective elements 260 and 270 may have the same or different reflectivities.
Since the first reflective element 260 and the second reflective element 270 help the light beam B to be reflected in the light guide element 210 for multiple times, the light beam B transmitted in the detection device 200-2 can be more uniform, so that the user O can receive light uniformly, which is helpful for the sensing element 240 to obtain a complete biometric image. Therefore, the detecting device 200-2 has good image quality.
In this embodiment, the user O directly presses on the top surface 212 of the light guide element 210 to perform biometric identification. In one embodiment, the detection device 200-2 may further comprise a protective cover (not shown) or a protective film (not shown). The protective cover or film is disposed on the light guide element 210 and the second reflective element 270, and the user O presses the protective cover or film on the surface away from the second reflective element 270 for biometric identification. The protective cover or film may protect the underlying light guide element 210 and the second reflective element 270 (e.g., from scratching).
Fig. 38 to 42 are schematic cross-sectional views of other implementation aspects of the detecting device of the embodiment of fig. 1, wherein the same elements are denoted by the same reference numerals, and therefore, the description thereof is omitted.
Referring to FIG. 38, the main differences between the detecting device 200-3 and the detecting device 200-2 of FIG. 37 are as follows. In the detecting apparatus 200-3, the plurality of microstructures MS may be formed on a surface of at least one of the substrate 14, the second reflecting element 270, the light guiding element 210, and the first reflecting element 260 to increase a reflection amount of the light beam B and make the light beam B more uniform. Fig. 38 schematically illustrates that a plurality of microstructures MS are formed on the surface of the first reflective element 260 away from the substrate 14, but not limited thereto. In another embodiment, the plurality of microstructures MS may be formed on the substrate 14 in a region other than the region where the above-mentioned elements are disposed. The plurality of microstructures MS can be formed on the top surface 212 of the light guide element 210, and the second reflective element 270 is disposed on at least a portion of the plurality of microstructures MS. The plurality of microstructures MS may be formed on a surface of the second reflective element 270 facing the substrate 14 or a surface away from the substrate 14.
It should be noted that the plurality of microstructures MS may be disposed entirely or partially on the element, and the plurality of microstructures MS may be disposed on the element in a continuous or spaced manner. In addition, in any possible embodiment of the present invention, the plurality of microstructures MS may also be disposed on the first reflecting element 260 or the second reflecting element 270 in a partially attached manner. For example, the plurality of microstructures MS and the first reflective element 260 (or the second reflective element 270) can be attached through an annular adhesive layer (not shown), wherein the annular adhesive layer is located between a portion of the plurality of microstructures MS and a portion of the first reflective element 260 (or the second reflective element 270), and no adhesive layer is disposed between another portion of the plurality of microstructures MS and another portion of the first reflective element 260 (or the second reflective element 270), so that the plurality of microstructures MS, the annular adhesive layer, and the first reflective element 260 (or the second reflective element 270) enclose an air gap layer (not shown).
Under the architecture of fig. 38, the detection apparatus 200-3 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. For the related description, refer to the related paragraphs, which are not repeated here.
Referring to FIG. 39, the main differences between the detecting device 200-4 and the detecting device 200-2 of FIG. 37 are as follows. In the detecting device 200-4, the first reflective element 260 includes a plurality of reflective portions 262 arranged at intervals, and the second reflective element 270 includes a plurality of reflective portions 272 arranged at intervals. Specifically, each of the first reflective element 260 and the second reflective element 270 may be composed of more than one reflective portion (e.g., a reflective sheet or a reflective layer). When the reflecting member is composed of a plurality of reflecting portions, the reflecting portions may be arranged at intervals. The interval arrangement may include the case of an equal interval arrangement and an unequal interval arrangement (scattered distribution). In another embodiment, only one of the first reflective element 260 and the second reflective element 270 includes a plurality of reflective portions arranged at intervals.
Under the architecture of fig. 39, the detection apparatus 200-4 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260 (the reflective portion 262), the light guide element 210, and the second reflective element 270 (the reflective portion 272). For the related description, refer to the related paragraphs, which are not repeated here.
Referring to FIG. 40, the main differences between the detecting device 200-5 and the detecting device 200-2 of FIG. 37 are as follows. In the detection apparatus 200-5, the detection apparatus 200-5 further includes a spatial filter element 30 disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. The spatial filter element 30 is adapted to collimate the light beam delivered to the sensing element 240. In another embodiment, the spatial filter element 30 may be replaced by a grating. In addition, the spatial filter element 30 and the grating can be fixed on the sensing element 240 through an adhesive layer (not shown) or a fixing mechanism (not shown). Alternatively, the spatial filter element 30 may be replaced with an array of optical fibers as described in applicant's earlier application U.S. patent application No. 15/151,471 or chinese patent application No. 201810194406.6.
Under the architecture of fig. 40, the detection apparatus 200-5 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270. In addition, at least one of the first and second reflective elements 260 and 270 may include a plurality of reflective portions arranged at intervals (see fig. 39). For the related description, refer to the related paragraphs, which are not repeated here.
Referring to FIG. 41, the main differences between the detecting device 200-6 and the detecting device 200-2 of FIG. 37 are as follows. In the inspection apparatus 200-6, the inspection apparatus 200-6 further includes a wall structure 40. The wall structure 40 is disposed on the substrate 14, wherein the wall structure 40 and the substrate 14 form an accommodating space AS for accommodating the light emitting device 230, the sensing device 240, the light shield 20 and the first reflective device 260. In one embodiment, the wall structure 40 and the substrate 14 may be integrally formed. For example, the wall structure 40 and the substrate 14 may be formed by a base material removing groove, wherein the space occupied by the groove before removal is the accommodating space AS. In another embodiment, the wall structure 40 may be fixed on the substrate 14 through a machine component or an adhesive layer (not shown), and the wall structure 40 and the substrate 14 may have the same or different materials. In addition, the wall structure 40 may also be coated with a light absorbing material, as mentioned in the above embodiments.
Under the architecture of fig. 41, the detection apparatus 200-6 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270. In addition, at least one of the first and second reflective elements 260 and 270 may include a plurality of reflective portions arranged at intervals (see fig. 39). Furthermore, the detection device 200-6 may further include a spatial filter element 30 (see fig. 40), a grating or an optical fiber array (described in the applicant's prior U.S. patent application No. 15/151,471) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. For the related description, refer to the related paragraphs, which are not repeated here.
Referring to FIG. 42, the main differences between the detecting device 200-7 and the detecting device 200-6 of FIG. 41 are as follows. In the detection apparatus 200-7, the detection apparatus 200-7 further includes a light-transmissive cover TC. The transparent cover TC is disposed on the light guide element 210 and covers the light emitting element 230, the sensing element 240, the light shielding 20, the first reflective element 260, the connection line CL1, the connection line CL2, and the wall structure 40. The second reflective element 270 is disposed on the transparent cover TC.
The light-transmitting cover body TC is provided with a glue filling hole TC1 and a vacuum-pumping hole TC 2. The filling hole TC1 is suitable for filling the light-transmitting colloid forming the light guide element 210, and the vacuuming hole TC2 is suitable for being connected with a vacuuming device to draw out the gas in the accommodating space AS when the light-transmitting colloid is filled.
In the present embodiment, the transparent cover TC further covers the sidewall S112S of the wall structure 40, and the glue filling hole TC1 and the vacuuming hole TC2 are respectively formed in a portion of the transparent cover TC covering the sidewall S112S of the wall structure 40. The wall structure 40 includes a first through-hole TCH1 and a second through-hole TCH 2. The first through hole TCH1 and the second through hole TCH2 are respectively formed in the wall structure 40 at two opposite sides of the substrate 14, wherein the first through hole TCH1 is connected to the glue filling hole TC1, and the second through hole TCH2 is connected to the vacuuming hole TC 2. However, the invention is not limited thereto. The glue filling hole TC1 and the vacuuming hole TC2 may be formed on the portion of the transparent cover TC on the substrate 14, so that the wall structure 40 may not form the first through hole TCH1 and the second through hole TCH 2.
Under the configuration of fig. 42, the detection apparatus 200-7 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light-transmissive cover TC and the second reflective element 270. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270. In addition, at least one of the first and second reflective elements 260 and 270 may include a plurality of reflective portions arranged at intervals (see fig. 39). Furthermore, the detection apparatus 200-7 may further include a spatial filter element 30 (see fig. 40), a grating or an optical fiber array (described in the applicant's prior application U.S. patent application No. 15/151,471 or chinese patent application No. 201810194406.6) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. For the related description, refer to the related paragraphs, which are not repeated here.
FIG. 43 is a cross-sectional view of an embodiment of a detecting device according to an embodiment of the present invention. Referring to FIG. 43, the detecting device 200-8 is similar to the detecting device 200-2 of FIG. 37, wherein the same elements are denoted by the same reference numerals and will not be repeated below. The main differences between the detection device 200-8 and the detection device 200-2 of FIG. 37 are as follows. In the detecting unit 200-8, the detecting unit 200-8 further includes a light-transmitting base 70. The light-transmitting base 70 is disposed on the substrate 14 and covers the light shield 20.
In the present embodiment, the light-transmitting base 70 is a light-transmitting housing covering the light-shielding object 20, and the light-transmitting housing and the substrate 14 form a closed space CS for accommodating the light-shielding object 20. The shade 20 may not fill the enclosed space CS, that is, there may be a gap between the shade 20 and the light transmissive housing. The gap may be filled with an adhesive material for fixing the shade 20 and the transparent housing, but not limited thereto. In another embodiment, the light-transmitting base 70 may be a light-transmitting layer formed on the side wall surface and the top surface of the light shield 20 by at least one of electroplating, printing, etching, adhering and coating, and the light-transmitting layer may be made of more than one layer of light-transmitting material.
In the present embodiment, the light-transmitting base 70 does not cover the first reflective element 260, that is, the light-transmitting base 70 does not overlap with the first reflective element 260, but is not limited thereto. In another embodiment, the light transmissive base 70 may cover a portion of the first reflective element 260 adjacent to the light transmissive base 70 such that the light transmissive base 70 partially overlaps the first reflective element 260.
The second reflective element 270 is disposed on the top surface S210T of the light transmissive base 70, wherein the top surface S170T of the second reflective element 270 may be flush with the top surface 212 of the light guiding element 210. That is, the top surface S170T of the second reflective element 270 and the top surface 212 of the light guide element 210 have the same height, but not limited thereto. In another embodiment, the top surface S170T of the second reflective element 270 may be lower than the top surface 212 of the light guide element 210, and the light guide element 210 may further cover the second reflective element 270 and the light transmissive base 70 under the second reflective element 270.
Under the architecture of fig. 43, the detection apparatus 200-8 may further include a protective cover plate (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270. In addition, at least one of the first and second reflective elements 260 and 270 may include a plurality of reflective portions arranged at intervals (see fig. 39). Furthermore, the detection device 200-8 may further include a spatial filter element 30 (see fig. 40), a grating or an optical fiber array (described in the applicant's prior U.S. patent application No. 15/151,471) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. Still further, the inspection device 200-8 may further include a wall structure 40 (see FIG. 41). For the related description, refer to the related paragraphs, which are not repeated here.
FIG. 44 is a cross-sectional view of another embodiment of a detecting device according to an embodiment of the present invention. Referring to FIG. 44, the detecting device 200-9 is similar to the detecting device 200-8 of FIG. 43, wherein the same elements are denoted by the same reference numerals and will not be repeated below. The main differences between the detection device 200-9 and the detection device 200-8 of FIG. 43 are as follows. In the detecting device 200-9, the detecting device 200-9 further includes a wall structure 40 and a light-transmissive cover TC. The wall structure 40 and the transparent cover TC are described with reference to the foregoing related paragraphs, which are not repeated herein.
Under the structure of fig. 44, the light-transmitting cover TC can protect the light-guiding element 210 and the second reflective element 270 located below, so that a protective cover or a protective film is not required to be additionally disposed. In addition, a plurality of microstructures MS (see fig. 38) may be formed on a surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270. In addition, at least one of the first and second reflective elements 260 and 270 may include a plurality of reflective portions arranged at intervals (see fig. 39). Furthermore, the detection device 200-9 may further include a spatial filter element 30 (see fig. 40), a grating or an optical fiber array (described in the applicant's prior U.S. patent application No. 15/151,471) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. For the related description, refer to the related paragraphs, which are not repeated here.
FIG. 45 is a cross-sectional view of an embodiment of a detecting device according to the present invention. Referring to FIG. 45, the detecting device 200-10 is similar to the detecting device 200-2 of FIG. 37, wherein the same elements are denoted by the same reference numerals and will not be repeated below. The main differences between the detection apparatus 200-10 and the detection apparatus 200-2 of FIG. 37 are as follows. In the detecting device 200-10, the second reflecting element 270 of fig. 7 is not disposed. In this configuration, a portion of the light beam B transmitted to the top surface 212 of the light guide element 210 is transmitted to the first reflective element 260 by internal reflection. Specifically, when the thickness T160 of the light guide element 210 falls within the range of 0.3mm to 1.8mm, the portion of the light beam B transmitted to the top surface 212 of the light guide element 210 and having an angle not greater than 45 degrees (referring to the angle between the light beam B and the top surface 212) can be transmitted to the sensing element 240 through multiple reflections between the top surface 212 and the second reflection element 270, and the rest of the light beam transmitted to the top surface 212 of the light guide element 210 and having an angle greater than 45 degrees (referring to the angle between the light beam B and the top surface 212) exits the light guide element 210 through refraction.
FIG. 46 is a cross-sectional view of another embodiment of a detecting device according to an embodiment of the present invention. Referring to FIG. 46, the detecting device 200-11 is similar to the detecting device 200-10 of FIG. 45, wherein the same elements are denoted by the same reference numerals and will not be repeated below. The main differences between the detection device 200-11 and the detection device 200-10 of FIG. 45 are as follows. In the detection apparatus 200-11, the detection apparatus 200-11 further includes a light-transmissive cover TC. The light-transmissive cover TC is adapted to protect the components located thereunder. In addition, the transparent cover TC allows the light beam to pass through, so that the light beam from the light emitting device can pass through the light guiding device 210 and the transparent cover TC in sequence and be transmitted to the object to be measured contacting the transparent cover TC, and the light beam reflected by the object to be measured can pass through the transparent cover TC and the light guiding device 210 in sequence and be transmitted to the sensing device 240. For example, the transparent cover TC is a glass cover, but not limited thereto. Under the structure that the transparent cover TC is disposed on the light guide element 210 and covers the light emitting element 230, the sensing element 240, the light shielding 20, the first reflective element 260 and the connection lines CL1, CL2, the total thickness TT of the light guide element 210 and the transparent cover TC falls within the range of 0.3mm to 1.8mm, so as to facilitate the formation of internal reflection, so that at least a part of the light beam from the light emitting element 230 can be transmitted to the object to be measured contacting the transparent cover TC and then transmitted to the sensing element 240.
Under the structures of fig. 45 and 46, a plurality of microstructures MS (see fig. 38) can be formed on a surface of at least one of the substrate 14, the first reflective element 260, and the light guide element 210. In addition, the first reflective element 260 may include a plurality of reflective portions arranged at intervals (see fig. 39). In addition, at least one of the detecting devices 200-10 and 200-11 may further include a spatial filter element 30 (see fig. 40) disposed on the sensing element 240 and located between the light guiding element 210 and the sensing element 240, a grating or a plurality of fiber arrays each inclined at different angles, or a collimating element, etc. (or described in the applicant's previously filed U.S. patent application No. 15/151,471 or 15/989,123). Furthermore, at least one of the detecting devices 200-10 and 200-11 may further include a wall structure 40 disposed on the substrate 14 (see FIG. 41). For the related description, refer to the related paragraphs, which are not repeated here.
In addition, the detection devices 200-2 to 200-11 each include a Surface Plasmon Resonance (SPR) layer. The function of the surface plasmon resonance layer SPR of the detection apparatuses 200-2 to 200-11 is the same as that of the surface plasmon resonance layer SPR of the detection apparatus 200, and thus, the description thereof will not be repeated.
FIGS. 47A-47B are schematic top and cross-sectional views, respectively, of a detection device according to an embodiment of the present invention, wherein FIG. 47A is a schematic cross-sectional view taken along the line A-A' of FIG. 47B, and FIG. 47B omits the surface plasmon resonance layer SPR of FIG. 47A. Referring to fig. 47A to 47B, the detecting device 200-12 is adapted to obtain the biological characteristics of the object 10. In the present embodiment, the object 10 is, for example, a finger, and the biometric feature is, for example, a fingerprint or a vein, but not limited thereto. For example, in another embodiment, the object 10 may be a palm, and the biometric characteristic may be a palm print.
The detecting device 200-12 includes a substrate 14, a plurality of light emitting elements 230, a sensing element 240, and a light guiding element 210.
To increase the usability of the package structure of the detection device 200-12, a metal ring MR may be disposed in the substrate 14. The metal ring MR is located between the upper surface and the lower surface of the substrate 14 and surrounds the sensing region of the sensing element 240. Therefore, when the object 10 is pressed on the light guide element 210, the device can start to operate by means of induction electrification, and the packaging structure of the detection device 200-12 can enter a temporary stop state when not in use, so as to achieve the effects of energy conservation and power conservation.
The light emitting elements 230 are disposed on the substrate 14 and electrically connected to the substrate 14. Each light emitting element 230 has a light emitting surface 230 a. The light emitting surface 230a of each light emitting element 230 emits a light beam L toward the object 10.
The sensing device 240 is disposed on the substrate 14 and electrically connected to the substrate 14. In addition, the sensing element 240 is located beside the light emitting elements 230 for receiving the portion of the light beam L reflected by the object 10 to be tested (i.e. the reflected light beam L' with the fingerprint pattern information).
In one embodiment, the sensing device 240 may have a pulse width modulation circuit integrated therein. The pulse width modulation circuit controls the light emitting time of the light emitting device 230 and the image capturing time of the sensing device 240, so that the light emitting time of the light emitting device 230 and the image capturing time of the sensing device 240 are synchronized, and an accurate control effect can be achieved, but not limited thereto.
The light guide element 210 is disposed on the substrate 14 and covers the sensing element 240 and the plurality of light emitting elements 230. The light guide element 210 is formed by curing a transparent adhesive such as silicon gel, resin, optical adhesive, Epoxy resin (Epoxy) through a heating process or a light irradiation process. Therefore, the light guide element 210 can not only prevent the electrostatic damage to protect the sensing element 240 and the light emitting elements 230 covered therein, but also allow the light beams L emitted by the light emitting elements 230 and the light beams L' reflected by the object 10 to be tested to penetrate therethrough.
The light guide element 210 has at least one groove 215 on a side thereof opposite to the sensing element 240, and the at least one groove 215 is located between the sensing element 240 and the plurality of light emitting elements 230. In the present embodiment, the light emitting elements 230 are located on two opposite sides of the sensing element 240, and the light guiding element 210 includes two grooves 215, but not limited thereto.
In the present embodiment, the depth Y3 of the groove 215 is smaller than the thickness H4 of the light guide element 210, i.e., it conforms to H3 < H4. That is, the groove 215 does not penetrate the light guide element 210, thereby facilitating fabrication.
In the present embodiment, each groove 215 is an elongated V-shaped groove, and each groove 215 has two inclined surfaces 215 a. The complementary angle θ between the inclined surface 215a of the two inclined surfaces 215a of the groove 215, which is closer to the corresponding light emitting elements 230, and the angle between the light guiding element 210 and the surface of the sensing element 240 (e.g., the touch surface of the object 10) can be adjusted to achieve a desired light utilization rate. For example, the complementary angle θ falls within a range of 30 degrees to 45 degrees, and the depth Y3 of the at least one trench 215 is determined according to the magnitude of the complementary angle θ. In other embodiments, the cross-sectional shape of each groove 215 may be an inverted trapezoid, an inverted semicircle, or other shapes. The semi-circle broadly refers to a non-complete circle and is not limited to one half of a circle.
The V-shaped groove helps to change the path of the light beam L. Specifically, when the light beam L emitted by the light emitting element 230 is transmitted to the inclined surface 215a of the groove 215 close to the light emitting element 230, the light beam L enters the groove 215 (i.e., exits the light guide element 210) through the inclined surface 215a close to the light emitting element 230. The partial light beam entering the groove 215 can enter the light guide element 210 through the inclined surface 215a of the groove 215 close to the sensing element 240. Changing the path of the light beam L by the V-shaped groove helps to prevent the light beam L emitted by the light emitting device 230 from directly irradiating the sensing device 240, thereby reducing the optical interference of the sensing device 240 and improving the recognition capability of the detection apparatus 200-12.
In the present embodiment, the light transmission medium in the groove 215 is air, but not limited thereto. In another embodiment, the groove 215 may be filled with a light-transmitting material, wherein the refractive index of the light-transmitting material is greater than that of the light-guiding element 210, so as to preferably prevent the light beam L emitted by the light-emitting element 230 from directly irradiating the sensing element 240. The light-transmitting material is a light-transmitting material with a high refractive index, such as an optical adhesive that can be cured by light or heat, but not limited thereto.
In addition, the thickness H2 of the sensing element 240 can be made smaller than the thickness H1 of the light emitting element 230, that is, the light emitting surface 230a of the light emitting element 230 is higher than the light receiving surface 240a of the sensing element 240, so as to further reduce the light interference. The thickness H2 of the sensor 240 indicates the distance from the light-sensing surface 132 of the sensor 240 to the substrate 14, and the thickness H1 of the light-emitting element 230 indicates the distance from the light-emitting surface 230a of the light-emitting element 230 to the substrate 14.
The thickness H2 of the sensing element 240 may be smaller than the thickness H1 of the light emitting element 230 by changing the thickness of the elements (the sensing element 240 and the light emitting element 230) themselves. Alternatively, in the case where another film layer is disposed between each of the elements and the substrate 14, the thickness of the other film layer may be adjusted such that the thickness H2 of the sensing element 240 is smaller than the thickness H1 of the light emitting element 230. For example, the detection device 200-12 further includes a plurality of adhesive layers AD. The adhesive layers AD are respectively disposed between the light emitting devices 230 and the substrate 14 and between the sensing device 240 and the substrate 14. The adhesive layer AD is, for example, an adhesive glue or a double-sided tape. The sum of the thicknesses of the light emitting devices 230 and the adhesive layers AD thereunder is the thickness H1 of the light emitting devices 230, and the sum of the thicknesses of the sensing devices 240 and the adhesive layers AD thereunder is the thickness H2 of the sensing devices 240. The thickness H2 of the sensing element 240 can be made smaller than the thickness H1 of the light emitting element 230 by changing the thickness of the adhesive layer AD under each light emitting element 230 and the thickness of the adhesive layer AD under the sensing element 240. However, in another embodiment, the thickness H2 of the sensing element 240 may be equal to or greater than the thickness H1 of the light emitting element 230.
In the present embodiment, the detecting device 200-12 further comprises a plurality of connecting lines CL1 and CL 2. The connection lines CL1 and CL2 are respectively connected between the sensing element 240 and the substrate 14 and between the light emitting elements 230 and the substrate 14, so that the sensing element 240 and the light emitting elements 230 are respectively electrically connected to the substrate 14. The material of the plurality of connection lines CL1, CL2 is, for example, gold, copper, etc., but not limited thereto. In another embodiment, the sensing element 240 and the light emitting elements 230 can be connected to the circuit on the substrate 14 through solder balls, and the connection lines CL1 and CL2 can be omitted.
The manufacturing method of the detecting device 200-12 of the present embodiment may include the following steps, for example. First, the light emitting devices 230 and the sensing devices 240 are adhered to the substrate 14 by the adhesion layers AD, wherein the heights of the light emitting devices 230 and the sensing devices 240 can be further adjusted by polishing. Next, a plurality of connecting lines CL1 and CL2 are formed on the substrate 14 by using a wire bonding apparatus, wherein the connecting lines CL1 and CL2 connect the conductive pads of the light emitting devices 230 and the conductive pads of the substrate 14, and connect the conductive pads of the sensing device 240 and the conductive pads of the substrate 14, respectively. Next, a light-transmitting adhesive is formed on the substrate 14 by using a glue filling apparatus and covers the plurality of light-emitting elements 230, the sensing element 240, and the plurality of connection lines CL1, CL 2. Then, the transparent encapsulant is cured by a heating process (such as a baking process) or an irradiation process (such as an ultraviolet curing process). Finally, at least one groove 215 is formed on a side of the cured transparent glue opposite to the sensing element 240 by etching, laser engraving, or other existing patterning methods, so as to form the light guide element 210. In other embodiments, the light guide element 210 and the at least one groove 215 may be integrally formed by a mold, but the invention is not limited thereto. In an embodiment, a plurality of image capturing units (including the light emitting element 230, the sensing element 240 and the light guiding element 210) may be simultaneously manufactured on the substrate 14, and a plurality of detecting devices 200-12 are cut by a cutting process.
Through the above manufacturing method, the detecting device 200-12 of the present embodiment can be manufactured as a full-flat fingerprint identification device, thereby increasing the compatibility of assembly with other devices. In addition, the detecting device 200-12 of the present embodiment can be mass-produced by the manufacturing method of film-pressing and glue-injecting, thereby reducing the production cost. In addition, since the groove 215 of the light guide element 210 can reduce the light interference, the light shielding element can be omitted, thereby simplifying the manufacturing process, reducing the required elements for the manufacturing process, and contributing to reducing the module area.
FIGS. 48A to 48B are schematic top and cross-sectional views, respectively, of a detection apparatus according to an embodiment of the present invention, in which FIG. 48A is a schematic cross-sectional view taken along the line A-A' of FIG. 48B, and FIG. 48B omits the surface plasmon resonance layer SPR of FIG. 48A. Referring to FIG. 48A and FIG. 48B, the detecting device 200-13 is similar to the detecting device 200-12 of FIG. 47A. The main differences between the two are as follows. The inspection unit 200-13 further includes at least one wall structure 40. The at least one wall structure 40 surrounds the sensing element 240 and the plurality of light emitting elements 230, wherein the material of the at least one wall structure 40 may be the same as or different from the material of the substrate 14, but the invention is not limited thereto.
In the manufacturing process, the wall structure 40 may be formed after the sensing element 240 and the plurality of light emitting elements 230 are disposed and before the light guiding element 210. Alternatively, the substrate 14 may be first formed into a groove shape, and the protruding portion of the edge of the groove may be used as the wall structure 40. In other words, at least the wall structure 40 and the substrate 14 may be integrally formed. The arrangement of at least the wall structure 40 can reduce the problem that the connecting lines CL1 and CL2 are broken or the sensing element 240 is displaced and fails due to increased glue filling pressure when the transparent glue is filled, thereby facilitating the improvement of the yield of the detection device 200-13. At the same time, provides the detection device 200-13 with better structural strength. In one embodiment, the wall structure 40 may be removed by a cutting process after the light guide element 210 is formed, so that the detecting device 200-12 shown in fig. 47A may also be formed.
FIG. 49 is a cross-sectional view of a detecting device according to an embodiment of the present invention. Referring to FIG. 49, the detecting device 200-15 is similar to the detecting device 200-12 of FIG. 47A. The main differences between the two are as follows. The detection device 200-15 further comprises a light-transmissive cover TC. The light-transmitting cover TC is disposed on the light guide element 210 and covers the at least one groove 215, wherein the light-transmitting medium in the at least one groove 215 includes air. The transparent cover TC is made of glass or transparent plastic. In one embodiment, the light-transmissive cover TC can be attached to the light guide element 210 through an adhesive layer (not shown). The adhesive layer can be an adhesive glue or a double-sided adhesive tape. Therefore, the moisture blocking capability and the protection of the internal components of the detecting devices 200-15 (e.g., the light guide element 210 is prevented from being scratched) can be further enhanced. In another embodiment, the transparent cover TC can be fixed on the light guide element 210 by a fixing mechanism, so that the adhesive layer can be omitted.
Under the architecture of FIG. 49, the detection apparatus 200-15B may also further include the wall structure 40 of FIG. 48A. For the related description, refer to the related paragraphs, which are not repeated here.
FIG. 50 is a cross-sectional view of a detecting device according to an embodiment of the present invention. Referring to FIG. 50, the detecting device 200-16 is similar to the detecting device 200-12 of FIG. 47A. The main differences between the two are as follows. The detection apparatus 200-16 further comprises a spatial filter element 30. The spatial filter element 30 is disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240 for collimating the light beam transmitted to the sensing element 240. The spatial filter element 30 may be, for example, a pinhole collimator (pinhole collimator) or a fiber collimator (fiber collimator). In this way, the light intensity of the light beam reflected by the object to be detected by the sensing element 240 can be increased, thereby increasing the recognition rate of the detection devices 200-16.
Under the configuration of fig. 50, the detecting device 200-16 may further include the wall structure 40 of fig. 48A or the transparent cover TC of fig. 49. For the related description, refer to the related paragraphs, which are not repeated here.
FIG. 51A is a schematic cross-sectional view of a trench of a detection apparatus according to an embodiment of the present invention. Referring to FIG. 51A, the detecting device 200-17 is similar to the detecting device 200-12 of FIG. 47A. The main differences between the two are as follows. In the inspection devices 200 to 17D, the angles of the two top corners of the groove 215A are different. For example, a complementary angle of an angle between the inclined plane 215aA of the light emitting element 230 and the light guide element 210, which is closer to the corresponding one of the two inclined planes 215aA, relative to the surface of the sensing element 240 is 66.8 degrees, a complementary angle of an angle between the inclined plane 215aA of the light guide element 210 and the surface of the sensing element 240, which is closer to the corresponding one of the two inclined planes 215aA, is 32.5 degrees, and a bottom angle of the groove 215A is 90 degrees. In other embodiments, the angles of the two top corners of the groove 215A may be reversed or changed according to design requirements, but not limited thereto. In addition, the depth Y3A of the groove 215A is determined according to the above angle. In the embodiment, the depth Y3A of the groove 215A is greater than the distance H5 from the light-emitting surface of each light-emitting element 230 to the surface of the light-guiding element 210 relative to the sensing element 240, but not limited thereto.
In the present embodiment, the groove 215A is filled with a light transmissive material F2, and the refractive index of the light transmissive material F2 is greater than the refractive index of the light guiding element 210. Therefore, when the light beam L emitted by the light emitting element 230 passes through the groove 215A, a portion of the light beam L is totally reflected by the inclined surface 215aA of the adjacent light emitting element 230, and a portion of the light beam L passes through the inclined surface 215aA of the adjacent light emitting element 230 and passes in a direction away from the sensing element 240. Therefore, the light beam L emitted by the light emitting device 230 can be prevented from directly irradiating the sensing device 240, and the light interference can be reduced.
FIG. 51B is a schematic cross-sectional view of a trench of a detection apparatus according to an embodiment of the present invention. Referring to FIG. 51B, the detecting device 200-18 is similar to the detecting device 200-12 of FIG. 47A. The main differences between the two are as follows. In the detecting devices 200-18, the groove 215B is a U-shaped groove. Specifically, the trench 215B has two side surfaces 146 and a bottom surface 148 that are opposite and parallel to each other. Depending on the manufacturing method, the bottom surface 148 may be a flat surface, an inclined surface, or a curved surface.
In addition to the U-shaped groove being able to change the path of the light beam by refraction, the light beam transmitted to the side surface 146 adjacent to the side surface 146 of the light emitting element 230 can be totally internally reflected so that the light beam is transmitted away from the sensing element 240. In the embodiment, the depth Y3B of the groove 215B is greater than the distance H5 from the light emitting surface of each light emitting element 230 to the surface of the light guiding element 210 opposite to the sensing element 240, so that most of the light beams transmitted to the side surface 146 of the groove 215B adjacent to the light emitting element 230 are transmitted at the side surface 146 by total internal reflection toward the direction away from the sensing element 240.
In a preferred embodiment, the width D2 of the groove 215B (e.g., the width D2 of the bottom surface 148), the distance D1 from one of the light emitting devices 230 corresponding to the groove 215B, and the distance D3 from the sensing device 240 to the groove 215B are all one third of the distance D from one of the light emitting devices 230 corresponding to the groove 215B to the sensing device 240, but the invention is not limited thereto.
In the present embodiment, the groove 215B is filled with a light transmissive material F2. The refractive index of the light transmissive material F2 is less than the refractive index of the light guiding element 210 to create total internal reflection. However, in other embodiments, the light transmissive material F2 may be omitted.
Fig. 51C to 51D are schematic cross-sectional views of another two kinds of trenches of a detecting device according to an embodiment of the invention. Referring to FIG. 51C and FIG. 51D, the detecting devices 200-19 and 200-20 are similar to the detecting device 200-12 shown in FIG. 47A and FIG. 47B. The main differences between the two are as follows. In the detecting devices 200-19, 200-20, the grooves 215C, 215D are inverted trapezoidal grooves. Specifically, the groove 215C (or the groove 215D) has two inclined surfaces 215aB (or two inclined surfaces 215aC) and a bottom surface 148. In the present embodiment, the inverted trapezoid-shaped grooves of the detecting devices 200-19 and 200-20 are inverted isosceles trapezoids, but not limited thereto.
In addition to changing the traveling path of the light beam by refraction, the light beam transmitted to the inclined plane 215aB (or the inclined plane 215aC) can be totally internally reflected by the inclined plane 215aB (or the inclined plane 215aC) adjacent to the light emitting element 230, so that the light beam does not directly reach the sensing surface of the sensing element 240. In the detecting devices 200-19, 200-20, the depths Y3C, H3D of the grooves 215C, 215D are smaller than the distance H5 from the light-emitting surface of each light-emitting element 230 to the surface of the light-guiding element 210 opposite to the sensing element 240, so that most of the light beams transmitted to the bottom surfaces 148 of the grooves 215C, 215D are turned by total internal reflection at the bottom surfaces 148, and thus do not directly reach the sensing surface of the sensing element 240 (as shown in fig. 51A).
In the present embodiment, the grooves 215C and 215D are filled with a light transmissive material F3, wherein the refractive index of the light transmissive material F3 is smaller than that of the light guiding element 210, so as to generate total internal reflection.
In addition, the detection devices 200-12 to 200-20 each include a Surface Plasmon Resonance (SPR) layer. The function of the surface plasmon resonance layer SPR of the detection apparatuses 200-2 to 200-11 is the same as that of the surface plasmon resonance layer SPR of the detection apparatus 200, and thus, the description thereof will not be repeated.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims (13)

1. A detection device, comprising:
a light guide element comprising:
a top surface; and
a bottom surface opposite the top surface;
a first reflective element disposed on the bottom surface of the light guide element;
a sensing element disposed beside the bottom surface of the light guide element;
a light emitting element for emitting a light beam, wherein the light beam is reflected by the first reflecting element and transmitted to the sensing element; and
a surface plasmon resonance layer disposed on the light guide element and configured to receive a biopolymer, wherein the light guide element is located between the surface plasmon resonance layer and the sensing element;
the bottom surface of the light guide element is provided with a light outlet part, the light outlet part is provided with a plurality of anti-reflection microstructures, the light beam at least forms a signal light beam projected to the anti-reflection microstructures through at least one total reflection in the light guide element, the signal light beam penetrates through the anti-reflection microstructures to be projected to the sensing element, the light guide element is provided with a total reflection critical angle, each anti-reflection microstructure comprises a light receiving area and a backlight area, the incident angle of the signal light beam is smaller than the total reflection critical angle, the incident angle of the signal light beam is larger than the total reflection critical angle, and the area of the light receiving area is larger than the area of the backlight area.
2. The detection device of claim 1, wherein the light guide element further comprises:
and the light incident surface is connected between the top surface and the bottom surface, and an acute angle alpha is formed between the light incident surface and the top surface.
3. The sensing device of claim 2, wherein the sensing device is located in an ambient medium and the acute angle α satisfies the following equation (1):
Figure FDA0003301176000000011
wherein theta isiFor the light beam to come fromAngle of the light surface entering the light-guiding element, n1Is the refractive index of the surrounding medium, and n2Is the refractive index of the light guiding element.
4. The sensing device of claim 2, wherein the sensing device is located in an ambient medium and the acute angle α satisfies the following equation (2):
Figure FDA0003301176000000012
wherein theta isiIs the incident angle of the light beam incident on the light incident surface, n1Is the refractive index of the surrounding medium, and n2Is the refractive index of the light guiding element.
5. The detection device of claim 1, further comprising:
and a second reflecting element disposed on the bottom surface of the light guide element, wherein the light beam is reflected by the first reflecting element and the second reflecting element and transmitted to the sensing element.
6. The detection device of claim 1, further comprising:
the light-transmitting element is configured on the top surface of the light-guiding element;
a first optical adhesive disposed between the light transmitting element and the top surface of the light guiding element, the light transmitting element being connected to the top surface of the light guiding element by the first optical adhesive; and
and a second optical cement disposed between the bottom surface of the light guide element and the sensing element, wherein the sensing element is connected to the bottom surface of the light guide element by the second optical cement, and the material of the light guide element is different from the material of the first optical cement and/or the second optical cement.
7. The detection device of claim 6, wherein the light guide element is glass.
8. The detecting device according to claim 1, wherein each of the anti-reflection microstructures is an asymmetric convex pillar, the asymmetric convex pillar has a ridge line, a first included angle is formed between the light receiving area and a vertical reference surface passing through the ridge line, a second included angle is formed between the backlight area and the vertical reference surface, and the first included angle is larger than the second included angle.
9. The detecting device according to claim 1, wherein the plurality of anti-reflection microstructures are arranged in an array, each of the anti-reflection microstructures is an eccentric microlens, the eccentric microlens has a vertex, a first included angle is formed between a tangent plane passing through any point of the light receiving area and a vertical reference plane passing through the vertex, a second included angle is formed between a tangent plane passing through any point of the back light area and the vertical reference plane, and the first included angle is larger than the second included angle.
10. The detection device of claim 1, further comprising:
a substrate, the first reflective element being disposed between the substrate and the light guide element; and
a light shield disposed on the substrate and between the light emitting device and the sensing device, wherein the first reflective device is disposed between the light shield and the sensing device, and the light guide device covers the sensing device, the light emitting device, the light shield, and the first reflective device.
11. The detecting device according to claim 1, wherein a plurality of microstructures are formed on a surface of at least one of the first reflecting element and the light guiding element.
12. The detecting device according to claim 1, wherein the first reflecting element includes a plurality of reflecting portions arranged at intervals.
13. The detection device of claim 1, further comprising:
a substrate, wherein the light guide element, the first reflective element, the sensing element and the light emitting element are disposed on the substrate;
a plurality of connecting wires respectively connected between the substrate and the sensing element and between the substrate and the light emitting element; and
and the wall structure is configured on the substrate, wherein the wall structure and the substrate form an accommodating space for accommodating the light-emitting element, the sensing element and the first reflecting element.
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