CN109214262A - Detection device - Google Patents

Detection device Download PDF

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Publication number
CN109214262A
CN109214262A CN201810696924.8A CN201810696924A CN109214262A CN 109214262 A CN109214262 A CN 109214262A CN 201810696924 A CN201810696924 A CN 201810696924A CN 109214262 A CN109214262 A CN 109214262A
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CN
China
Prior art keywords
light
detection device
guide device
reflecting element
sensing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810696924.8A
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Chinese (zh)
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CN109214262B (en
Inventor
林伯骏
巫仁杰
黄承钧
游国良
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Gingy Technology Inc
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Gingy Technology Inc
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Priority claimed from US16/008,037 external-priority patent/US10460188B2/en
Application filed by Gingy Technology Inc filed Critical Gingy Technology Inc
Publication of CN109214262A publication Critical patent/CN109214262A/en
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Publication of CN109214262B publication Critical patent/CN109214262B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The invention provides a detection device for sensing biopolymer. The detection device comprises a sensing element, a light-transmitting element and a surface plasma resonance layer. The light-transmitting element is configured on the sensing element. The surface plasma resonance layer is arranged on the light-transmitting element and used for receiving the biopolymer. The light-transmitting element is arranged between the surface plasma resonance layer and the sensing element.

Description

Detection device
Technical field
The present invention relates to a kind of detection device more particularly to a kind of detection devices to sense biopolymer.
Background technique
Previous identity recognizing technology is, for example, using will be transferred to paper after biological characteristic (such as: finger) pressing ink Upper formation fingerprint graph then recycles optical scanner input computer to file or compare.Above-mentioned identification has can not Immediately the shortcomings that processing, the demand in society now for instant authentication can not also be met.Therefore, the biology of electronic type is special Sign identification device becomes one of the mainstream of current development in science and technology.It is however generally that biometric devices only have life The function of object feature identification.Therefore, how to increase other functions of biometric devices, to promote living things feature recognition dress The surcharge set is also one of the direction developed at present.
Summary of the invention
The present invention provides a kind of detection device, can sense biopolymer.
The detection device of one embodiment of the invention include light-guide device, the first reflecting element, sensing element, light-emitting component with And surface plasmon resonance layer.Light-guide device includes top surface and the bottom surface relative to top surface.First reflecting element is set to On the bottom surface of light-guide device.Sensing element is configured at by the bottom surface of light-guide device.Light-emitting component is to issue light beam, wherein light beam It is reflected by the first reflecting element and is transferred to sensing element.Surface plasmon resonance layer is set on light-guide device, and to Receive biopolymer.Light-guide device is between surface plasmon resonance layer and sensing element.
Based on above-mentioned, the detection device of one embodiment of the invention has both living things feature recognition and senses the function of biopolymer Can, surcharge is high.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make Carefully it is described as follows.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Fig. 2 is the schematic diagram of the part of the detection device of one embodiment of the invention.
Fig. 3 is the diagrammatic cross-section of the detection device of another embodiment of the present invention.
Fig. 4 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Fig. 5 is the schematic diagram of the part of the detection device of one embodiment of the invention.
Fig. 6 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Fig. 7 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Fig. 8 is the schematic diagram of the part of the detection device of one embodiment of the invention.
Fig. 9 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 10 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 11 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 12 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 13 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 14 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 15 is the upper schematic diagram of the detection device of Figure 14.
Figure 16 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 17 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 18 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 19 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 20 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 21 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 22 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 23 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 24 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 25 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 26 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Partial enlargement diagram of multiple anti-reflection micro-structures in region II that Figure 27 is Figure 26.
Figure 28 is the local bottom view of the light-guide device of one embodiment of the invention.
Figure 29 is the local bottom view of the light-guide device of one embodiment of the invention.
Figure 30 is the partial cutaway schematic of the light-guide device of one embodiment of the invention.
Figure 31 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 32 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 33 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 34 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 35 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 36 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 37 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.
Figure 38 to Figure 42 is the diagrammatic cross-section of other kind of state sample implementation of the detection device of the embodiment of Fig. 1 respectively.
Figure 43 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.
Figure 44 is the diagrammatic cross-section of another state sample implementation of the detection device of one embodiment of the invention.
Figure 45 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.
Figure 46 is the diagrammatic cross-section of another state sample implementation of the detection device of one embodiment of the invention.
Figure 47 A to Figure 47 B is respectively the upper view and diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 48 A to Figure 48 B is respectively the upper view and diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 49 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 50 is the diagrammatic cross-section of the detection device of one embodiment of the invention.
Figure 51 A is another diagrammatic cross-section of the groove of the detection device of one embodiment of the invention.
Figure 51 B is another diagrammatic cross-section of the groove of the detection device of one embodiment of the invention.
Figure 51 C to Figure 51 D is respectively two kinds of diagrammatic cross-sections again of the groove of the detection device of the embodiment of the present invention.
Figure 52 is shown by the various angle of reflection θ and its reflectivity of the surface plasmon resonance layer SPR sensing light beam L reflected Relationship.
Description of symbols:
C1, C2, C3: recessed portion;
D, k: distance;
D1, D2, D3: direction;
E1, E2: light out part;
α、θ、θ1、θ2、θi: angle;
L, L ', L1, B, BB: light beam;
II: region;
F1: object;
S120T、S140T、S1421S、S1441S、S1441C、S1444S、S131、S133A、S133B、S170T、S210T、 160a、160b、160c、212、214、215a、215aA、215aB、215aC、216、216B、218、218A、218C、222、P1、 146,148: face;
SPR: surface plasmon resonance layer;
P, P1~P5: spacing;
T1, T2: thickness;
H, H1~H5: thickness;
1: surrounding medium;
14: substrate;
20: shade;
40: wall body structure;
70: light transmission pedestal;
80: biopolymer;
200,200~200Y, 200-1~200-20: detection device;
230: light-emitting component;
240: sensing element;
260,260B: reflecting element;
260D, 270: reflecting element;
270B, 270D: reflecting element;
280,293: reflecting element;
210: light-guide device;
201,202,250, G1: optical cement;
210-1: thick portion;
210-2: thin portion;
213: inner wall;
215,215A, 215B, 215C, 215D: groove;
219: side wall;
240a: light receiving surface;
262,272: reflecting part;
266,276, MS: micro-structure;
291,291a, 291b, 291c, 291C, 291D, 296: extinction element;
292: light absorbing layer;
300: anti-reflection micro-structure;
300C: vertex;
300R: crest line;
301: sensitive area;
302: backlight area;
303: optical microstructures.
Specific embodiment
For the present invention aforementioned and other technology contents, feature and effect refer to each implementation of attached drawing in following cooperation In the detailed description of example, can clearly it present.The direction term being previously mentioned in following embodiment, such as: "upper", "lower", "front", "rear", "left", "right" etc. are only the directions with reference to attached drawings.Therefore, the direction term used be for illustrating, and It is not intended to limit the invention.Also, in following any embodiment, the same or similar element will use the same or similar Label.
Fig. 1 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Fig. 2 is that the detection of one embodiment of the invention fills The schematic diagram for the part set.Fig. 1 and Fig. 2 is please referred to, detection device 200 is located in surrounding medium 1.In the present embodiment, environment Medium 1 is, for example, air.However, the present invention is not limited thereto, in other embodiments, detection device 200 may also be located at other types Surrounding medium in.Image of the detection device 200 to obtain object.Under normal circumstances, the object is biological characteristic, example Such as: fingerprint, but invention is not limited thereto.
Detection device 200 includes light-guide device 210.Light-guide device 210 has top surface 212, relative to the bottom surface of top surface 212 214, the incidence surface 216 and light-emitting surface 218 being connected between top surface 212 and bottom surface 214.Light-emitting surface 218 is relative to top surface 212.Bottom surface 214 is connected between incidence surface 216 and light-emitting surface 218.In particular, incidence surface 216 is tilted relative to top surface 212, And incidence surface 216 and top surface 212 accompany sharp angle α.
In the present embodiment, light-guide device 210 has more inner wall 213.Light-emitting surface 218 is compared with bottom surface 214 close to translucent element 220.Inner wall 213 is connected between bottom surface 214 and light-emitting surface 218.Inner wall 213 and light-emitting surface 218 form recess 210a.Change speech It, light-guide device 210 includes the thick portion 210-1 with the bottom surface 214 and thin portion 210-2 with light-emitting surface 218.In this implementation In example, light-emitting surface 218 and bottom surface 214 are optionally parallel to top surface 212, but invention is not limited thereto, in other implementations In example, light-emitting surface 218 can also be tilted relative to top surface 212, and other accompanying drawings will be cooperated to illustrate in subsequent paragraph below.
Detection device 200 includes translucent element 220.Translucent element 220 is configured on the top surface 212 of light-guide device 210.? In the present embodiment, translucent element 220 can pass through optical cement (not shown) and be fixed on the top surface 212 of light-guide device 210.Guide-lighting member The material of part 210 and/or the material of translucent element 220 can be selected from glass, polymethyl methacrylate (PMMA, Polymethylmethacrylate), polycarbonate (PC, Polycarbonate) or other light-transmitting materials appropriate.In this reality It applies in example, light-guide device 210, the optical cement and translucent element 220 can have same or similar refractive index, but the present invention is not As limit.
Detection device 200 includes light-emitting component 230.Light-emitting component 230 is configured at 216 side of incidence surface and to issue light beam L.In the present embodiment, the incidence surface 216 of light-guide device 210 has recess 216a.Light-emitting component 230 is configured at recess 216a In.Detection device 200 further includes optical cement 250.The filling recess 216a of optical cement 250, to coat light-emitting component 230 and connect hair Optical element 230 and light-guide device 210.In the present embodiment, optical cement 250 can have same or similar with light-guide device 210 Refractive index, to reduce the loss before light beam L enters light-guide device 210, but invention is not limited thereto.In the present embodiment, light Beam L is, for example, non-visible light.Whereby, for the electronic product equipped with detection device 200 when obtaining the image of object, light beam L will not Influence the appearance of electronic product.However, the invention is not limited thereto, in other embodiments, light beam L can also be visible light or visible The combination of light and black light.In the present embodiment, light-emitting component 230 can be light emitting diode, however, the present invention is not limited thereto, In other embodiments, light-emitting component 230 can also be the light-emitting component of other appropriate types.
Detection device 200 includes sensing element 240.Sensing element 240 is configured on the light-emitting surface 218 of light-guide device 210. Light-emitting surface 218 of the light receiving surface 240a of sensing element 240 towards light-guide device 210.In the present embodiment, sensing element 240 The light-emitting surface 218 of light-guide device 210 is born against, and the light receiving surface 240a of sensing element 240 can be with the light out of light-guide device 210 Face 218 is substantial parallel.Sensing element 240 for example, charge coupled cell (Charge Coupled Device, CCD) or mutual Benefit formula metal oxide semiconductor device (Complementary Metal-Oxide Semiconductor, CMOS), but this hair Bright without being limited thereto, in other embodiments, sensing element 240 can also be the imaging sensor of other appropriate types.
Fig. 1 and Fig. 2 is please referred to, light beam L is transmitted after passing through incidence surface 216 to translucent element 220, at least part of light beam L It can be totally reflected in translucent element 220 and the interface 222 of surrounding medium 1.When object (such as: fingerprint protrusion) touching is had a common boundary When face 222, on the part interface 222 of corresponding fingerprint protrusion, the total reflection of light beam L can be destroyed, and then make sensing element 240 obtain the dark line of corresponding fingerprint protrusion;While part interface 222 is touched in fingerprint protrusion, fingerprint recess portion will not touch friendship Interface 222, on another part interface 222 of corresponding fingerprint recess portion, the total reflection of light beam L will not be destroyed, and then make to feel Survey the bright rays that element 240 obtains corresponding fingerprint recess portion;Whereby, sensing element 240 can obtain the subject image (example between bright dark phase Such as: fingerprint image).
It is worth noting that, through inclined incidence surface 216 (i.e. the design of sharp angle α), the light beam of the sending of light-emitting component 230 L can be totally reflected in short distance k in translucent element 220 and the interface 222 of surrounding medium 1.Whereby, detection device 200 Size can reduce, in favor of being mounted in various electronic product.In the present embodiment, it can be suitably designed the size of sharp angle α, Under the premise of reducing 200 size of detection device, further to improve the ratio that light beam L is totally reflected in interface 222. For example, in the present embodiment, sharp angle α can meet following formula (1):
Wherein θiThe angle of light-guide device 210, n are injected from incidence surface 216 for light beam L1For the refractive index of surrounding medium 1, and n2For the refractive index of light-guide device 210.If by incidence surface 216 normal (such as: in Fig. 2, the not no void parallel with light beam L Line) to the direction of light beam L be then θ clockwiseiFor negative value.If by incidence surface 216 normal (such as: in Fig. 2, do not have The dotted line parallel with light beam L) to the direction of light beam L be counterclockwise then θiFor positive value.When angle α meets above formula (1), light beam L It is improved in the ratio that interface 222 is totally reflected, and helps to be promoted the capture quality of detection device 200.
Fig. 1 is please referred to, in the present embodiment, detection device 200 can further comprise the second reflecting element 270 and first Reflecting element 260.Second reflecting element 270 is configured at the top surface 212 of light-guide device 210 and is located at translucent element 220 and leaded light Between element 120.First reflecting element 260 is configured at the bottom surface 214 of light-guide device 210.Light beam L pass through incidence surface 216 after according to Sequence is reflected by the second reflecting element 270 and the first reflecting element 260, with expanded light beam L.The light beam L being extended is transmitted to light transmission member It part 220 and is totally reflected in translucent element 220 and the interface 222 of surrounding medium 1.Sensing element 240 is set to compared with first Reflecting element 260 at translucent element 220 (such as: recess 210a at).
Being worth noting is, through the second reflecting element 270 and the first reflecting element 260 expand effect and adjustment senses Element 240 position (such as: enable the light receiving surface 240a of sensing element 240 close to translucent element 220, or enable sensing element 240 Light receiving surface 240a tilted relative to top surface 212), sensing element 240 can the small light receiving surface 240a of usable floor area obtained Whole subject image (such as: fingerprint image).In other words, the area of sensing element 240 can reduce, and including sensing element 240 The size of detection device 200 also can further reduce.However, the invention is not limited thereto, and in other implementations, detection device It may not include the second reflecting element 270 and the first reflecting element 260, other attached drawings will be cooperated to illustrate in subsequent paragraph below It is bright.
It is worth noting that, the detection device 200 of the present embodiment further includes surface plasma body resonant vibration (Surface Plasmon Resonance) layer SPR.Surface plasmon resonance layer SPR is set on the surface 222 of translucent element 220.Thoroughly Optical element 220 is configured between surface plasmon resonance layer SPR and sensing element 240.In the present embodiment, surface plasma The material of resonance body layer SPR is for example including metal, the thickness of surface plasmon resonance layer SPR for example, about 50 nanometers (nm), but Invention is not limited thereto.
Surface plasmon resonance layer SPR receiving biopolymer (Biopolymers) 80, such as: sweat, blood Liquid, urine, bacterium, virus etc., but invention is not limited thereto.An at least light-emitting component 230 is to total to surface plasma The layer SPR that shake issues sensing light beam L.The sensing light beam L reflected by surface plasmon resonance layer SPR has various angle of reflection θ;It is raw When object high polymer 80 is formed on surface plasmon resonance layer SPR, there is special angle (i.e. resonance angle) in various angle of reflection θ The reflectivity of section senses light beam L can rapid drawdown;Sensing element 240 receives the tool reflected by surface plasmon resonance layer SPR There is the sensing light beam L of various angle of reflection θ;The light distribution for the sensing light beam L that analysis sensing element 240 receives can deduce described Why is special angle (i.e. resonance angle).By the special angle, it just can recognize that and be set to surface plasmon resonance layer SPR On biopolymer 80 whether be a kind of specific biopolymer 80.Cooperation Figure 52 is illustrated below.
Figure 52 is shown by the various angle of reflection θ and its reflectivity of the surface plasmon resonance layer SPR sensing light beam L reflected Relationship.Fig. 1 and Figure 52 is please referred to, for example, the first biopolymer 80 is formed in surface plasmon resonance layer SPR When upper, the sensing light beam L with various angle of reflection θ reflected by surface plasmon resonance layer SPR is in the anti-of special angle θ 1 Penetrate rate can rapid drawdown, analysis sensing element 240 institute it is received by surface plasmon resonance layer SPR reflect with various angles of reflection Why the sensing light beam L of θ can deduce special angle θ 1, by special angle θ 1, just can identify and be set to surface plasma Biopolymer 80 on resonant layer SPR is the first biopolymer 80;Second of biopolymer 80 is formed in surface etc. When on gas ions resonant layer SPR, the sensing light beam L with various angle of reflection θ 2 that is reflected by surface plasmon resonance layer SPR In the reflectivity meeting rapid drawdown of special angle θ 2,240 institute of analysis sensing element is received to be reflected by surface plasmon resonance layer SPR The sensing light beam L with various angle of reflection θ why can deduce special angle θ 2, by special angle θ 2, just can identify and set The biopolymer 80 being placed on surface plasmon resonance layer SPR is second of biopolymer 80;The third biology is high poly- When object 80 is formed on surface plasmon resonance layer SPR, there are various reflections by what surface plasmon resonance layer SPR reflected For the sensing light beam L of angle θ 3 in the reflectivity meeting rapid drawdown of special angle θ 3,240 institute of analysis sensing element is received by surface plasma Why the sensing light beam L with various angle of reflection θ of resonance body layer SPR reflection can deduce special angle θ 3, pass through specific angle θ 3 is spent, just can identify that the biopolymer 80 being set on surface plasmon resonance layer SPR is the third biopolymer 80
Fig. 3 is the diagrammatic cross-section of the detection device of another embodiment of the present invention.Referring to figure 3., detection device 200A with Detection device 200 above-mentioned is similar therefore identical or corresponding element, is indicated with identical or corresponding label.Detection dress It sets 200A and the difference of detection device 200 is, the light-emitting surface 218A of detection device 200A and the light-emitting surface of detection device 200 218 is different.Mainly illustrate this difference below, the two is identical or corresponding section is referring again to preceding description.
Referring to figure 3., detection device 200A includes light-guide device 210, translucent element 220, light-emitting component 230 and sensing Element 240.Light-guide device 210 have top surface 212, relative to top surface 212 bottom surface 214, be connected to top surface 212 and bottom surface 214 Between incidence surface 216 and light-emitting surface 218A.Light-emitting surface 218A is relative to top surface 212.Bottom surface 214 is connected to incidence surface 216 Between light-emitting surface 218A.Incidence surface 216 and top surface 212 accompany sharp angle α.Translucent element 220 is configured at the top of light-guide device 210 On face 212.Light-emitting component 230 is configured at 216 side of incidence surface and to issue light beam L.Light beam L is after incidence surface 216 to saturating Optical element 220 transmits, and is totally reflected in the interface 222 of translucent element 220 and surrounding medium 1.Sensing element 240, which is configured at, leads On the light-emitting surface 218A of optical element 210.
Unlike detection device 200, the light-emitting surface 218A of detection device 200A is relative to top surface 212 and bottom surface 214 inclinations, and top surface 212 and light-emitting surface 218A distance k is with separate light-emitting component 230 and decrescence.Sensing element 240 is born against In on light-emitting surface 218A, and the light receiving surface 240a of sensing element 240 can be substantially flat with the light-emitting surface 218A of light-guide device 210 Row.The light receiving surface 240a of sensing element 240 is tilted also relative to top surface 212 and bottom surface 214.Detection device 200A is in addition to having Outside the efficacy and advantages of above-mentioned detection device 200, using inclined sensing element 240, detection device 200A can reduce stray light Into the probability of sensing element 240, and then the subject image quality obtained is improved, such as: the comparison of subject image can be improved.
Fig. 4 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Fig. 5 is that the detection of one embodiment of the invention fills The schematic diagram for the part set.Referring to figure 4. and Fig. 5, detection device 200B is similar with detection device 200A, therefore identical or opposite The element answered is indicated with identical or corresponding label.Detection device 200B and the difference of detection device 200A are that shine member Part 230B is arranged in outside light-guide device 210 and is located in surrounding medium 1.Mainly illustrate this difference below, the two is identical or phase Corresponding position is referring again to preceding description.
Referring to figure 4. and Fig. 5, detection device 200B include light-guide device 210, translucent element 220, light-emitting component 230B with And sensing element 240.Light-guide device 210 have top surface 212, relative to top surface 212 bottom surface 214, be connected to top surface 212 and bottom Incidence surface 216B and light-emitting surface 218A between face 214.Light-emitting surface 218A is relative to top surface 212.Bottom surface 214 is connected into light Between face 216B and light-emitting surface 218A.Incidence surface 216B and top surface 212 accompany sharp angle α.Translucent element 220 is configured at light-guide device On 210 top surface 212.Light-emitting component 230B is configured at 216 side of incidence surface and to issue light beam L.Light beam L passes through incidence surface It transmits after 216B to translucent element 220, and is totally reflected in the interface 222 of translucent element 220 and surrounding medium 1.Sensing element 240 are configured on the light-emitting surface 218A of light-guide device 210.
Unlike detection device 200A, the incidence surface 216B of detection device 200B can not have recess 216a, shine Element 230B is arranged in outside light-guide device 210 and is located in surrounding medium 1.In other words, the light beam L that light-emitting component 230B is issued It needs just pass through incidence surface 216B after first transmitting a distance in surrounding medium 1 and enter in light-guide device 210.Due to above-mentioned The change of the transmission path of light beam L, the optimum range of the sharp angle α of detection device 200B also can be with the sharp angle αs of detection device 200A Optimum range it is different.In detail, in detection device 200B, sharp angle α can meet following formula (2):
Wherein θiThe incident angle of incidence surface 216B, n are incident to for light beam L1For the refractive index of surrounding medium 1, and n2To lead The refractive index of optical element 210.If by incidence surface 216B normal (such as: the dotted line in Fig. 5) to the direction of light beam L be clockwise Direction, then θiFor negative value.If by incidence surface 216B normal (such as: the dotted line in Fig. 5) to the direction of light beam L be side counterclockwise To then θiFor positive value.Detection device 200B have the advantages that effect similar with detection device 200A and, just no longer repeated in this.
Fig. 6 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Fig. 6 is please referred to, detection device 200C is with before The detection device 200A stated is similar therefore identical or corresponding element, is indicated with identical or corresponding label.Detection device The difference of 200C and detection device 200A are that detection device 200C may not include the second reflecting element 270 and the first reflector Part 260, and the light-guide device 210 of detection device 200C can not have inner wall 213.Mainly illustrate this difference below, the two it is identical or Corresponding section is referring again to preceding description.
Fig. 6 is please referred to, detection device 200C includes light-guide device 210, translucent element 220, light-emitting component 230 and sensing Element 240.Light-guide device 210 have top surface 212, relative to top surface 212 bottom surface 214, be connected to top surface 212 and bottom surface 214 Between incidence surface 216 and light-emitting surface 218C.Light-emitting surface 218C is relative to top surface 212.Bottom surface 214 is connected to incidence surface 216 Between light-emitting surface 218C.Light-emitting surface 218C relative to top surface 212 tilt, and top surface 212 and light-emitting surface 218C distance k with Decrescence far from light-emitting component 230.Incidence surface 216 and top surface 212 accompany sharp angle α.Translucent element 220 is configured at light-guide device On 210 top surface 212.Light-emitting component 230 is configured at 216 side of incidence surface and to issue light beam L.Light beam L passes through incidence surface 216 Backward translucent element 220 transmits, and is totally reflected in the interface 222 of translucent element 220 and surrounding medium 1.Sensing element 240 is matched It is placed on the light-emitting surface 218C of light-guide device 210.Sensing element 240 is born against on light-emitting surface 218C, and the light of sensing element 240 Receiving plane 240a is parallel with the light-emitting surface 218C of light-guide device 210.In other words, the light receiving surface 240a of sensing element 240 is also It is inclined.
Unlike detection device 200A, the light-guide device 210 of detection device 200C can not have inner wall 213, and guide-lighting The light-emitting surface 218C of element 210 can directly be connect with bottom surface 214.In addition, detection device 200C may not include the second reflecting element 270 and first reflecting element 260, light beam L can directly be transmitted to translucent element 220 after passing through light-emitting surface 116, and in translucent element 220 are totally reflected with the interface 222 of surrounding medium 1.In other words, using primary event, (i.e. light beam L is complete on interface 222 Reflection) and inclined sensing element 240, the size of detection device 200C can also be reduced, and it is not necessarily intended to the second reflection of setting Element 270 and the first reflecting element 260.
Fig. 7 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Fig. 8 is that the detection of one embodiment of the invention fills The schematic diagram for the part set.Fig. 7 and Fig. 8 is please referred to, detection device 200D and detection device 200 above-mentioned are similar therefore identical Or corresponding element, it is indicated with identical or corresponding label.Detection device 200D and the difference of detection device 200 is, The incidence surface 216 of detection device 200D may be provided at the bottom of light-guide device 210.Mainly illustrate that this difference, the two are identical below Or corresponding section is referring again to preceding description.
Fig. 7 and Fig. 8 is please referred to, detection device 200D includes light-guide device 210, translucent element 220, light-emitting component 230, sense Survey element 240, the second reflecting element 270 and the first reflecting element 260.Light-guide device 210 has top surface 212, relative to top The bottom surface 214 in face 212, the incidence surface 216 being connected between top surface 212 and bottom surface 214 and light-emitting surface 218.218 phase of light-emitting surface For top surface 212.Bottom surface 214 is connected between incidence surface 216 and light-emitting surface 218.Translucent element 220 is configured at light-guide device On 210 top surface 212.Light-emitting component 230 is to issue light beam L.Sensing element 240 is configured at the light-emitting surface of light-guide device 210 On 218.Second reflecting element 270 is configured at the top surface 212 of light-guide device 210, and is located at translucent element 220 and light-guide device Between 210.First reflecting element 260 is configured at the bottom surface 214 of light-guide device 210.Light beam L is after incidence surface 216 by second Reflecting element 270 and the first reflecting element 260 reflect.Light beam L is reflected by the second reflecting element 270 and the first reflecting element 260 It is totally reflected afterwards in the interface 222 of translucent element 220 and surrounding medium 1.
Unlike detection device 200A, the incidence surface 216 of detection device 200D may be provided at the bottom of light-guide device 210 Portion.In other words, the incidence surface 216 of part can substantially can be coplanar with bottom surface 214, but invention is not limited thereto.In this reality It applies in example, θiThe angle of light-guide device 210, and θ are injected from incidence surface 216 for light beam LiMeet following formula (3):
Wherein n1For the refractive index of surrounding medium 1, and n2For the refractive index of light-guide device 210.If by the method for incidence surface 216 Line (such as: the dotted line in Fig. 8) to the direction of light beam L be then θ clockwiseiFor negative value.If by the normal of incidence surface 216 (such as: the dotted line in Fig. 8) to the direction of light beam L be counterclockwise then θiFor positive value.Detection device 200D has and detection Device 200 similar effect and advantage, are just no longer repeated in this.
Fig. 9 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Fig. 9 is please referred to, detection device 200E includes Light-guide device 210.Light-guide device 210 has opposite top surface 212 and bottom surface 214.Light-guide device 210, which also has, is connected to top surface Side wall 219 between 212 and bottom surface 214.In the present embodiment, side wall 219 can not be tilted relative to top surface 212.In other words, side Wall 219 generally can be vertical with top surface 212.However, the present invention is not limited thereto, in other embodiments, side wall 219 can also be relative to Top surface 212 tilts.In the present embodiment, the refractive index of light-guide device 210 can be greater than or equal to 1.4 and be less than or equal to 1.6.It leads The material of optical element 210 is, for example, glass.However, the present invention is not limited thereto, in other embodiments, the material of light-guide device 210 It can be other suitable materials, such as: polymethyl methacrylate (PMMA, Polymethylmethacrylate), polycarbonate (PC, Polycarbonate) or other light-transmitting materials appropriate.
Detection device 200E includes translucent element 220.Translucent element 220 is configured on the top surface 212 of light-guide device 210. Translucent element 220 has backwards to the surface 222 of light-guide device 210.In the present embodiment, if detection device 200E refers to obtain The vein of line and/or finger, then the surface 222 of translucent element 220 is for finger pressing.
Detection device 200E includes the first optical cement 201.First optical cement 201 is configured at translucent element 220 and leaded light member Between the top surface 212 of part 210.Translucent element 220 is connect using the first optical cement 201 with the top surface 212 of light-guide device 210.? In the present embodiment, the first optical cement 201 can have the refraction same or similar with light-guide device 210 and/or translucent element 220 Rate, to reduce light beam L in the first optical cement 201 and the boundary of light-guide device 210 and/or the first optical cement 201 and translucent element Loss on 220 boundary.In other words, the refractive index of the first optical cement 201 is also greater than or equal to 1.4 and is less than or equal to 1.6, but invention is not limited thereto.
Detection device 200E includes sensing element 240.Sensing element 240 is configured on the bottom surface 214 of light-guide device 210. Light-guide device 210 is between translucent element 220 and sensing element 240.Sensing element 240 has towards light-guide device 210 Light receiving surface 240a.
Detection device 200E includes the second optical cement 202.Second optical cement 202 is configured at the bottom surface 214 of light-guide device 210 Between sensing element 240.Sensing element 240 is connect using the second optical cement 202 with the bottom surface 214 of light-guide device 210.At this In embodiment, the second optical cement 202 can have the refractive index same or similar with light-guide device 210, to reduce light beam L second Loss on the boundary of optical cement 202 and light-guide device 210.In other words, the refractive index of the second optical cement 202 is also greater than or waits In 1.4 and being less than or equal to 1.6, but invention is not limited thereto.
The material of light-guide device 210 is different from the material of the first optical cement 201 and the second optical cement 202.In other words, saturating It can be inserted into the lower light-guide device 210 of material cost between optical element 220 and sensing element 240, be filled in light transmission member to reduce The dosage of optical cement between part 220 and sensing element 240.Due to material cost high the first optical cement 201 and the second optics The usage amount of glue 202 is few, therefore the manufacturing cost of detection device 200E is low.
Detection device 200E includes light-emitting component 230.Light-emitting component 230 is to issue light beam L.Light beam L passes through guide-lighting member It transmits after part 210 to translucent element 220, and is totally reflected in the interface (i.e. surface 222) of translucent element 220 and surrounding medium 1. When object (such as: fingerprint protrusion) touching surface 222, on the portion 222 of corresponding fingerprint protrusion, light beam L's is all-trans Penetrating can be destroyed, and then sensing element 240 is made to obtain the dark line for corresponding to fingerprint protrusion;Touch portion 222 in fingerprint protrusion Meanwhile fingerprint recess portion will not touch surface 222, and on another portion 222 of corresponding fingerprint recess portion, the total reflection of light beam L It will not be destroyed, and then sensing element 240 is made to obtain the bright rays for corresponding to fingerprint recess portion;Whereby, sensing element 240 can obtain bright dark Alternate subject image (such as: fingerprint image).In the present embodiment, light beam L is, for example, visible light.However, the present invention is unlimited In this, in other embodiments, light beam L can also be the combination of non-visible light or non-visible light and visible light.Light-emitting component 230 For example light emitting diode, but this is without being limited thereto, and in other embodiments, light-emitting component 230 can also be the hair of other appropriate types Optical element.
In the present embodiment, detection device 200E can further comprise the second reflecting element 270 and the first reflecting element 260.Second reflecting element 270 is configured on the top surface 212 of light-guide device 210.Second reflecting element 270 is located at translucent element Between 220 and light-guide device 210.First reflecting element 260 is configured on the bottom surface 214 of light-guide device 210.Light-guide device 210 Between the second reflecting element 270 and the first reflecting element 260.Light beam L is by the second reflecting element 270 and the first reflecting element It transmits after 260 reflections to translucent element 220, and occurs in the interface (i.e. surface 222) of translucent element 220 and surrounding medium 1 Total reflection.For example, in the present embodiment, the second reflecting element 270 and the first reflecting element 260 can be reflector plate or It is formed by reflecting layer with coating method, the present invention is without restriction.
In the present embodiment, light beam L can guide before being not delivered to the second reflecting element 270 and the first reflecting element 260 The top surface 212 of optical element 210 is transmitted, and light beam L can sequentially be reflected by the second reflecting element 270 and the first reflecting element 260, with It is transmitted to translucent element 220.However, the invention is not limited thereto, in other embodiments, light beam L can also be transmitted along other paths. In addition, in the present embodiment, the second reflecting element 270 can be staggered with the first reflecting element 260 and part is Chong Die.However, book Invent it is without being limited thereto, in other embodiments, the second reflecting element 270 and the first reflecting element 260 can also be staggered completely without It overlaps, or is configured with other relative positions appropriate, cooperate Figure 10 and Figure 11 to illustrate below.
Figure 10 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200F's and Fig. 9 of Figure 10 Detection device 200E is similar, therefore identical or corresponding element is indicated with identical or corresponding label.With detection device Unlike 200E, in the embodiment in figure 10, light beam L is being not delivered to the second reflecting element 270 and the first reflecting element 260 It can be transmitted before to the bottom surface of light-guide device 210 214, and light beam L can be sequentially by the first reflecting element 260 and the second reflecting element 270 reflections, to be transmitted to translucent element 220.For example, in the present embodiment, the second reflecting element 270 and the first reflector Part 260 can be reflector plate or be formed by reflecting layer with coating method, and the present invention is without restriction.In addition, in other implementations In example, the reflection function of the first reflecting element 260 can also be reflected with the interface between the second optical cement 202 and the air layer of outside Replace, wherein the refractive index of the second optical cement 202 is different from the external refractive index of air layer.
Figure 11 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200G's and Figure 10 of Figure 11 Detection device 200F is similar, therefore identical or corresponding element is indicated with identical or corresponding label.With detection device Unlike 200F, in the embodiment in figure 11, the second reflecting element 270B is not that part is Chong Die with the first reflecting element 260B. In detail, the second reflecting element 270B can be within the area of the first reflecting element 260B.In other words, the second reflecting element 270B the upright projection on bottom surface 214 can be entirely located at upright projection of the first reflecting element 260B on bottom surface 214 with It is interior.Light beam L can be sequentially by after the front end of the first reflecting element 260B, the second reflecting element 270B and the first reflecting element 260B End reflection, to be transmitted to translucent element 220.
Figure 12 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200H's and Figure 10 of Figure 12 Detection device 200F is similar, therefore identical or corresponding element is indicated with identical or corresponding label.With detection device Unlike 200F, the detection device 200H of Figure 12 further includes third reflecting element 280.Third reflecting element 280, which is configured at, leads On the bottom surface 214 of optical element 210.Light beam L is sequentially by the first reflecting element 260, the second reflecting element 270 and third reflecting element 280 reflections, to be transmitted to translucent element 220.First reflecting element 260 and third reflecting element 280 are separable.First reflector Part 260 and the second reflecting element 270 are partly be overlapped.In detail, the front end of the first reflecting element 260 and the second reflecting element 270 Overlapping is without Chong Die with the rear end of the second reflecting element 270.Third reflecting element 280 and the second reflecting element 270 are partly be overlapped. In detail, the front end without with the second reflecting element 270 Chong Die with the rear end of the second reflecting element 270 of third reflecting element 280 Overlapping.In addition, the first reflecting element 260, the either sensing element 240 of third reflecting element 280 that Figure 12 is drawn are not necessarily non- It must be configured in the second optical cement 202.In other embodiments, the first reflecting element 260, third reflecting element 280 be either Sensing element 240 is also possible on the bottom surface 214 configured in light-guide device 210;In other words, the first reflecting element 260, third are anti- It penetrates the either sensing element 240 of element 280 and is also possible to the other side configured in the second optical cement 202.
It must be illustrated, in Fig. 9 into any embodiment illustrated in fig. 12, light-guide device 210, which has, to be connected to The side wall 219 of top surface 212 and bottom surface 214, and light absorbing layer (not shown go out) can be provided on the side wall 219.
Figure 13 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200I's and Fig. 9 of Figure 13 Detection device 200E is similar, therefore identical or corresponding element is indicated with identical or corresponding label.With detection device Unlike 200E, in the embodiment of figure 13, at least one of the second reflecting element 270D and the first reflecting element 260D have There are one or more optical microstructures 276,266.For example, the second reflecting element 270D and the first reflecting element 260D are optional All have one or more optical microstructures 276,266 to selecting property, in an example of the present embodiment, if with multiple optical microstructures 276,266, when the second reflecting element 270D, the first reflecting element can be set in such a way that continuous or interval configures On 260D.In sum, the so-called optical microstructures of this specification can be comprehensive or be partly arranged at any reflecting element On, in addition, also not limited to optical microstructures is that continuous configuration mode is either spaced configuration.Light beam L can be by the second reflection One or more optical microstructures of one or more optical microstructures 276 of element 270D and/or the first reflecting element 260D 266 reflections, with the transmitting of translucent element 220.In the present embodiment, optical microstructures 276 can comprehensive (or part) be arranged in On second reflecting element 270D reflecting element, optical microstructures 266 can comprehensive (or part) be arranged in the first reflecting element On 260D reflecting element.In addition, the effect of configuration optical microstructures 276 and/or the first reflecting element 260D are: increasing capture face It accumulates and keeps the light beam L for being transmitted to sensing element 240 more uniform, be conducive to imaging effect.
Figure 14 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Figure 15 is the upper view of the detection device of Figure 14 Schematic diagram.The detection device 200E of the detection device 200J and Fig. 9 of Figure 14 and Figure 15 is similar therefore identical or corresponding element It is indicated with identical or corresponding label.Unlike detection device 200E, detection device 200E further includes light absorbing layer 292.Light absorbing layer 292 can absorb light.In other words, light absorbing layer 292 can be opaque and non-reflective light shield layer.Light absorption Layer 292 covers the side wall 219 of light-guide device 210.Light absorbing layer 292 can absorb the spuious light beam L for being incident to side wall 219, in turn Promote the capture quality of detection device 200J.In the present embodiment, light absorbing layer 292 for ink layer or can paste part.But this hair Bright without being limited thereto, in other embodiments, light absorbing layer 292 can also be other appropriate light absorbents.
Figure 16 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Figure 17 is the detection of one embodiment of the invention The diagrammatic cross-section of device.Figure 18 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Figure 19 is that the present invention one is real Apply the diagrammatic cross-section of the detection device of example.Detection device 200K, 200L, 200M, 200N of Figure 16, Figure 17, Figure 18 and Figure 19 Similar with detection device 200F, 200G, 200H, 200I of Figure 10, Figure 11, Figure 12 and Figure 13 respectively, this is identical or corresponding Element is indicated with identical or corresponding label.Detection device 200K, 200L, 200M, 200N and detection device 200F, 200G, The main difference of 200H, 200I are: detection device 200K, 200L, 200M, 200N respectively compared with detection device 200F, 200G, The more light absorbing layers 292 of covering side wall 219 of 200H, 200I.
Figure 20 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200O's and Fig. 9 of Figure 20 Detection device 200E is similar, this identical or corresponding element is indicated with identical or corresponding label.Detection device 200O with The main difference of detection device 200E is: detection device 200O is compared with the light absorbing layer 292 of detection device more than 200.Light absorbing layer 292 at least cover the side wall 219 of light-guide device 210.In the embodiment of figure 20, light absorbing layer 292 also optionally covers The side wall of the side wall of first optical cement 201 and/or the second optical cement 202, but invention is not limited thereto.
Figure 21 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Referring to figure 2. 1, detection device 200P packet Include light-guide device 210.Light-guide device 210 has opposite top surface 212 and bottom surface 214.Detection device 200P includes translucent element 220.Translucent element 220 is configured on the top surface 212 of light-guide device 210.Translucent element 220 has backwards to light-guide device 210 Surface 222.
Detection device 200P includes the second reflecting element 270 and the first reflecting element 260.The configuration of second reflecting element 270 In the top surface of light-guide device 210 212.Second reflecting element 270 is between translucent element 220 and light-guide device 210.First is anti- Penetrate the bottom surface 214 that element 260 is configured at light-guide device 210.Light-guide device 210 is located at the second reflecting element 270 and the first reflection Between element 260.In the present embodiment, the first reflecting element 260 can be located within the area of the second reflecting element 270, but this Invention is not limited.Detection device 200P includes light-emitting component 230.Light-emitting component 230 is to issue light beam L.Light beam L is by It transmits after two reflecting elements 270 and the reflection of the first reflecting element 260 to translucent element 220, and is situated between in translucent element 220 and environment The interface (i.e. surface 222) of matter 1 is totally reflected.Detection device 200P includes sensing element 240.Sensing element 240 configures In on the bottom surface of light-guide device 210 214.Light-guide device 210 is between translucent element 220 and sensing element 240.Sensing element 240 have the light receiving surface 240a towards light-guide device 210.
It is worth noting that, detection device 200P includes the first extinction element 291.First extinction element 291, which is configured at, leads On the bottom surface 214 of optical element 210.First extinction element 291 can absorb the spuious light beam L transmitted to bottom surface 214, and then promotes inspection Survey the capture quality of device 200P.In the present embodiment, the first extinction element 291 be configured in the side of the first reflecting element 260 and It is not Chong Die with the first reflecting element 260.Furthermore, detection device 200P further includes third reflecting element 280.Third is anti- Element 280 is penetrated to be configured on the bottom surface 214 of light-guide device 210.First extinction element 291 can be located at the first reflecting element 260 with Between third reflecting element 280.Light beam L is anti-by the second reflecting element 270, the first reflecting element 260 and third reflecting element 280 It is transmitted after penetrating to translucent element 220.
Figure 22 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200Q's and Figure 21 of Figure 22 Detection device 200P is similar, therefore identical or corresponding element is indicated with identical or corresponding label.Detection device 200Q Be with the main difference of detection device 200P: detection device 200Q further includes the 4th reflecting element 293.4th reflecting element 293 are configured on the top surface 212 of light-guide device 210 and separate with the second reflecting element 270.Light beam L is by the second reflecting element 270, it is transmitted after the first reflecting element 260, third reflecting element 280 and the reflection of the 4th reflecting element 293 to translucent element 220. In the present embodiment, light beam L can be sequentially by the second reflecting element 270, the first reflecting element 260, the 4th reflecting element 293 and Three reflecting elements 280 are reflected and are transmitted to translucent element 220.
Figure 23 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200R's and Figure 21 of Figure 23 Detection device 200P is similar, therefore identical or corresponding element is indicated with identical or corresponding label.Detection device 200R Be with the main difference of detection device 200P: detection device 200R further includes the second extinction element 296.Second extinction element 296 are configured on the top surface 212 of light-guide device 210.Second extinction element 296 can absorb the spuious light beam transmitted to top surface 212 L, and then promote the capture quality of detection device 200B.In the present embodiment, the second extinction element 296 is optionally configured at On second reflecting element 270 and between the second reflecting element 270 and the bottom surface 214 of light-guide device 210.First extinction element 291 can be staggered with the second extinction element 296, and not be overlapped on the direction d perpendicular to surface 222.
Figure 24 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200S's and Figure 21 of Figure 24 Detection device 200P is similar, therefore identical or corresponding element is indicated with identical or corresponding label.Detection device 200S Be with the main difference of detection device 200P: the first extinction element 291C of detection device 200P is configured at the first reflecting element On 260 and it is located between the top surface 212 and the first reflecting element 260 of light-guide device 210.
Figure 25 is the diagrammatic cross-section of the detection device of one embodiment of the invention.The detection device 200T's and Figure 22 of Figure 25 Detection device 200Q is similar, therefore identical or corresponding element is indicated with identical or corresponding label.Detection device 200T Be with the main difference of detection device 200Q: detection device 200T does not include the third reflecting element 280 of detection device 200Q, The first reflecting element 260D of detection device 200T is at least by the sky between the second reflecting element 270 and the 4th reflecting element 293 The underface of the end of the 4th reflecting element 293 is extended to immediately below gap g, and the first extinction element 291D is configured in first On reflecting element 260D and it is located between the bottom surface 214 and the first reflecting element 260D of light-guide device 210.
It must be illustrated, in another alternate embodiment from Figure 21 to Figure 25, light-guide device 210 has opposite one Top surface 212 and bottom surface and the one side wall 219 for being connected to top surface Yu bottom surface 214;Above-mentioned side wall 219 can also be covered with light absorption Layer 294.In addition, the light-guide device 210 of any embodiment can be a light transmission plate or filling light-guide device 210 is taken up space In optical cement (can also as Fig. 9 use multilayer light-conductive media), the present invention is not limited thereto.
Please refer to Fig. 1, Fig. 3, Fig. 4, Fig. 6, Fig. 7, Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 16, Figure 17, figure 18, Figure 19, Figure 20, Figure 21, Figure 22, Figure 23, Figure 24 and Figure 25, detection device 200,200A~200T include respective surface Plasma resonance (Surface Plasmon Resonance) layer SPR.
Figure 26 and Figure 27 is please referred to, Figure 26 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Figure 27 is Partial enlargement diagram of the multiple anti-reflection micro-structures of Figure 26 in region II.Wherein an embodiment provides a kind of detection dress to the present invention Set 200U.Detection device 200U is to be located in surrounding medium to use.In one embodiment, surrounding medium above-mentioned is, for example, sky Gas and water either other kinds of surrounding medium.Detection device U can be used to obtain the image of object F1, to be identified.It is aforementioned Object F1 be, for example, user finger, palm, wrist either eyeball, and image acquired in detection device 200U is for example It is the images such as fingerprint, palmmprint, vein, pupil either iris, but invention is not limited thereto.
As shown in figure 26, the detection device 200U of a present invention wherein embodiment includes substrate 14, light-emitting component 230, leads Optical element 210, translucent element 220 and sensing element 240.Light-guide device 210 is transmit light beam wherein.The present embodiment Light-guide device 210 have top surface 212 and the bottom surface 214 opposite with top surface 212, and light-guide device 210 and have be located at bottom surface 214 light in part E1 and light out part E2.Light beam L enters light-guide device 210 by light in part E1, and in light-guide device 210 Transmitting, forms signal beams L ' and being totally reflected at least once later, then leave leaded light by the light out part E2 of light-guide device 210 Element 210.In the present embodiment, multiple anti-reflection micro-structures 300 are equipped in the light out part E2 of light-guide device 210.
Need to first it illustrate, when signal beams L ' is entered in surrounding medium (such as: air or bubble) by light-guide device 210 When, in order to avoid the angle that light beam projects light out part E2 is greater than the cirtical angle of total reflection of light-guide device 210, and cause to answer originally The signal beams L ' being emitted by light out part E2 is totally reflected once again again.Therefore, in the present embodiment, by having light out part E2 Multiple anti-reflection micro-structures 300, to destroy the total reflection of signal beams L '.
Specifically, each anti-reflection micro-structure 300 has sensitive area 301 and backlight area 302.In the present embodiment, Sensitive area 301 makes the incidence angle of signal beams L ' less than the cirtical angle of total reflection of light-guide device 210, and backlight area 302 can make letter The incidence angle of number light beam L ' is greater than the cirtical angle of total reflection.In one embodiment, backlight area 302 can be roughly parallel to signal beams L ' Main direction of travel, so that signal beams L ' be made less easily to be incident upon backlight area 302.On the other hand, sensitive area 301 is substantially Perpendicular to the main direction of travel of light beam, and the area of sensitive area 301 can be greater than the area in backlight area 302, to make major part Signal beams L ' all project sensitive area 301, and the signal beams L ' for projecting sensitive area 301 is also less easily all-trans It penetrates.
Here, please continue to refer to Figure 26 to Figure 27, it should be noted that, although least a portion of stray light may project back Light area 302, but the stray light for projecting backlight area 302 can be totally reflected, and interfere sensing without being emitted from light out part E2 The signal of element 240 causes ghost image.In addition, signal beams L ' is by the way that after sensitive area 301, segment beam can be in sensing element 240 Light receiving surface 240a after pass through backlight area 302 when be refracted as the biggish light beam of another angle, this light beam can be in translucent element 220 Surface 222 be totally reflected, therefore be totally reflected beam angle compared with original route come it is big, cause this light beam travelling route that can be distal to Original route, therefore it will not be re-introduced into the light receiving surface 240a of sensing element 240, so that signal be avoided to cause showing for ghost image As.
Referring to figure 2. 7, in the present embodiment, multiple anti-reflection micro-structures 300 are connected with each other, and each anti-reflection micro-structure 300 section shape can be in chevron, waveform or zigzag.In the embodiment of Figure 27, micro-structure 300 that each is anti-reflection Section shape is zigzag.In addition, the sensitive area 301 of the present embodiment and backlight area 302 are all clinoplains.
It please cooperate referring to Figure 27 and Figure 28.Figure 28 is that the partial bottom of the light-guide device of one embodiment of the invention regards signal Figure.Furthermore, in the present embodiment, each anti-reflection micro-structure 300 is asymmetric pillar, and asymmetric pillar is along the One direction D1 extends, and side by side along second direction D2.
Each asymmetric pillar has a crest line 300R, that is, the boundary line of sensitive area 301 and backlight area 302.? In the present embodiment, the vertical reference surface R1 by crest line 300R is defined.As shown in figure 27, vertical reference surface R1 is parallel to third Direction D3, that is, it is parallel to the thickness direction of light-guide device 210.Sensitive area 301 is to be located at vertical ginseng with backlight area 302 Examine two opposite sides of face R1, sensitive area 301 and vertical reference surface R1 form the first angle theta 1, and backlight area 302 and vertical reference Face R1 forms the second angle theta 2.In the present embodiment, the first angle theta 1 can be greater than the second angle theta 2, to ensure most light beam Sensitive area 301 can be projected, and will not be totally reflected again.In addition, in the present embodiment, the anti-reflection micro-structure adjacent for two For 300, the edge of the sensitive area 301 for micro-structure 300 that one of them is anti-reflection can be with the backlight area of another anti-reflection micro-structure 300 302 coincident.That is, between two adjacent anti-reflection micro-structures 300 and not formed to connect two anti-reflection micro- knots The bonding pad of structure 300, to be further reduced the probability that light beam is totally reflected.But in other embodiments, as long as bonding pad phase The tilt angle of vertical reference surface R1 can be totally reflected to avoid light beam, or do not influence the travel path of light beam, Bonding pad can be set between every two adjacent anti-reflection micro-structures 300.
In addition, the appearance of the anti-reflection micro-structure 300 of the embodiment of the present invention is not restricted to asymmetric pillar, and sensitive area 301 and backlight area 302 be also possible to curved surface, mean camber be, for example, include concave surface or convex surface.9, Figure 29 is this referring to figure 2. Invent the local bottom view of the light-guide device of an embodiment.In the present embodiment, multiple anti-reflection micro-structures 300 are to be arranged in Array, and each anti-reflection micro-structure 300 is eccentric lenticule.As shown in figure 29, the bottom section of each anti-reflection micro-structure 300 Shape is circle, however, the vertex 300C of anti-reflection micro-structure 300 is relative to bottom section shape (circle) in terms of the apparent direction of bottom The center of circle offset.That is, the vertex 300C of anti-reflection micro-structure 300 is not in alignment with the circle of bottom section shape (circle) The heart.In the present embodiment, the edge of each anti-reflection micro-structure 300 can connect each other with the edge of another anti-reflection micro-structure 300 It connects.
In addition, in the present embodiment, all anti-reflection micro-structures 300 of definition same a line that D1 is arranged along a first direction Vertex 300C formed line P2, and line P2 the surface region of each anti-reflection micro-structure 300 can be divided into sensitive area 301 with And backlight area 302.Specifically, sensitive area 301 is the surface region positioned at line P2 right half part, and backlight area 302 is then Positioned at the surface region of line P2 left-half.By in Figure 29 it can also be seen that the area of sensitive area 301 can be greater than backlight area 302 area.
0, Figure 30 is the partial cutaway schematic of the light-guide device of one embodiment of the invention referring to figure 3..Specifically, figure 30 can be the diagrammatic cross-section of multiple anti-reflection micro-structures 300 in a second direction d 2 in Figure 29.In the present embodiment, anti-reflection The section shape of micro-structure 300 is substantially wavy or chevron, that is to say, that sensitive area 301 and backlight area 102 are all bent Face.
In addition, by being formed between the section at 301 any point of sensitive area and the vertical reference surface R1 for passing through vertex 300C First angle theta 1, and by being formed between the section at 302 any point of backlight area and the vertical reference surface R1 for passing through vertex 300C Second angle, and the first angle can be greater than the second angle.Accordingly, when light beam projects sensitive area 301, it can be ensured that light beam Incidence angle is less than the cirtical angle of total reflection of light-guide device 210, is totally reflected to avoid light beam.
In other embodiments, anti-reflection micro-structure 300 is also possible to other kinds of eccentric cone, e.g. eccentric polygonal Shape cone, that is, the bottom section shape of anti-reflection micro-structure 300 is triangle, quadrangle or other polygons.As long as can It reduces ratio (or increasing the ratio that light beam penetrates light out part E2) embodiment of the present invention that light beam is totally reflected and is not intended to limit increasing The shape of saturating micro-structure 300.
Referring again to Figure 26.The detection device 200U of the present embodiment further includes translucent element 220.Translucent element 220 is arranged In the top surface of light-guide device 210 212, and have with surrounding medium contact and backwards to the surface 222 of light-guide device 210.If Detection device 200 is applied in optical fingerprint identifying system, to obtain fingerprint and/or vein image, translucent element 220 Surface 222 contacts or presses for finger, to be detected and be identified.
Detection device 200U further includes substrate 14, light-emitting component 230 and the sensing positioned at 210 second side of light-guide device Part 240, wherein light-emitting component 230 and sensing element 240 are all disposed on substrate 14.Substrate 14 can be wiring board, wiring board There is preconfigured route.In addition, the material of substrate 14 is light absorbent.
Sensing element 240 corresponds to multiple anti-reflection micro-structures 300 of light-guide device 210 and is configured on substrate 14, to Obtain the image of object F1.In other words, light-guide device 210 is between sensing element 240 and translucent element 220.
Sensing element 240 has light receiving surface 240a, to receive the light beam being emitted by the light out part E2 of light-guide device 210 L.In other words, after light beam passes through multiple anti-reflection micro-structures 300, the light receiving surface 240a of sensing element 240 can be projected.
Light-emitting component 230 is arranged on the substrate 14 adjacent to the light in part E1 of light-guide device 210, for generating in guide-lighting member The light beam L transmitted in part 210.In the present embodiment, light-emitting component 230 is to be set to except light-guide device 210, and it is first to shine Light beam L caused by part 230 can be projected to the light in part E1 of light-guide device 210.
Furthermore, the bottom surface 214 of the light-guide device 210 of the embodiment of the present invention also has to accommodate light-emitting component 230 the first recessed portion C1 and the second recessed portion C2 to accommodate sensing element 240.The light in part E1 of light-guide device 210 Positioned at the first recessed portion C1, and the light out part E2 of light-guide device 210 is to be located at the second recessed portion C2.
As shown in figure 26, when light-emitting component, light-guide device 210 and sensing element 240 are all disposed on substrate 14, hair Optical element 230 can just be accommodated and is fastened in the first recessed portion C1, and sensing element 240 can just accommodate and by card It is fixed in the second recessed portion C2.In addition, in the present embodiment, multiple anti-reflection micro-structures 300 are positioned at the bottom of the second recessed portion C2 Portion.In this way, the overall volume of detection device 200 can be reduced.However, in other embodiments, the first recessed portion C1 and second Recessed portion C2 also can be omitted.In another embodiment, light-emitting component 230, which can be, is embedded in light-guide device 210.Specifically For, can first by light-emitting component 230 it is fixed on the substrate 14 and then by encapsulating and solidification and etc. form leaded light Element 210, so that light-emitting component 230 be made to be embedded in light-guide device 210.At this point, light beam L caused by light-emitting component 230 It is not required to directly be passed in light-guide device 210 by other media.In addition to this, the light-emitting component of the embodiment of the present invention 230 be all to be set to the bottom surface 214 of light-guide device 210, but in other embodiments, light-emitting component 230, which also can be set, is leading The top surface 212 of optical element 210.
In addition, the detection device 200U of the embodiment of the present invention still further comprises the second reflecting element 270 and first anti- Penetrate element 260.Second reflecting element 270 and the first reflecting element 260 are arranged respectively at the top surface 212 and bottom of light-guide device 210 Face 214.Specifically, the second reflecting element 270 is first reflecting element between translucent element 220 and light-guide device 210 260 be between substrate 14 and light-guide device 210.In one embodiment, the second reflecting element 270 and the first reflecting element 260 can be reflector plate or be formed at the reflective coating on 210 surface of light-guide device, and the present invention is not limiting as.In addition, at this In embodiment, the second reflecting element 270 and the first reflecting element 260 can be staggered mutually setting, and in light-guide device 210 It is least partially overlapped on thickness direction, light beam L is directed to translucent element 220.In other embodiments, the second reflecting element 270 can also be staggered completely without Chong Die with the first reflecting element 260.Therefore, as long as translucent element can be directed to light beam L 220, the present invention is not intended to limit the relative position of the second reflecting element 270 and the first reflecting element 260 or generates light beam L The form of reflection.
For example, in other embodiments, light beam L can also be made in guide-lighting member by the direction of travel of design light beam L Total reflection is generated between part 210 and surrounding medium.In that case, the first reflecting element 260 can be omitted.It is whole and It says, after light beam L caused by light-emitting component 230 is entered in light-guide device 210 by light in part E1, sequentially passes through the second reflector The reflection and the reflection of the first reflecting element 260 of part 270, and transmitted in light-guide device 210 to translucent element 220, and The interface of translucent element 220 and surrounding medium, that is, the surface 222 of translucent element 220 generate total reflection.
When the surface 222 of object F1 (such as: finger) contact translucent element 220, the burr of finger touches surface 222, It can make a part of light beam L that can not generate total reflection, so that sensing element 240 be made to obtain the dark line for corresponding to finger burr.Another party Face, the dimpled grain of finger do not touch the surface 222 of translucent element 220, and be totally reflected another part light beam L can still and shape At signal beams L '.The light out part E2 of signal beams L ' towards light-guide device 210 is projected, and passes through the multiple of light-guide device 210 Anti-reflection micro-structure 300 and the light receiving surface 240a for investing sensing element 240.It is subsequent to pass through image processing elements again, to sensing Signal beams L ' received by part 240 carries out image procossing, the fingerprint image of available object F1.
That is, in embodiments of the present invention, anti-reflection micro-structure is arranged by the light out part E2 in light-guide device 210 300, it can be totally reflected once again before entering sensing element 240 to avoid signal beams L ', to reduce detection device 200 Image recognition degree.
1, Figure 31 is the diagrammatic cross-section of the detection device of one embodiment of the invention referring to figure 3..The detection device of Figure 31 The detection device 200U of 200V and Figure 26 is identical or corresponding element label having the same, and identical part is no longer superfluous It states.In Figure 31 embodiment, detection device 200V further includes the third reflecting element 280 positioned at 210 bottom surface 214 of light-guide device. That is, the first reflecting element 260 is located at the same surface of light-guide device 210 with third reflecting element 280, but it is separated Setting.In the present embodiment, light beam L passes through the second reflecting element 270, the first reflecting element 260 and third reflecting element 280 Reflection, to be transmitted in light-guide device 210, and is projected to translucent element 220.
In the present embodiment, the thickness direction of the second reflecting element 270 and the first reflecting element 260 in light-guide device 210 On be it is completely overlapped, and the second reflecting element 270 and third reflecting element 280 on the thickness direction of light-guide device 210 only It partly overlaps.In addition, the detection device 200V of the present embodiment further includes being set to the first reflecting element 260 and third reflecting element Extinction element 291 between 280.In the present embodiment, extinction element 291 and the second reflecting element 270 are in light-guide device 210 Thickness direction overlapping.Furthermore, the upright projection of the second reflecting element 270 can be least partially overlapped with extinction element 291. Extinction element 291 can be shielding layer opaque to light beam L and non-reflective, e.g. ink layer or adhesion layer, or hide Piece is covered, but aforementioned illustration is not used to limit the scope of the present invention.
It in other embodiments, can also be in other regions of light-guide device 210, that is, not set second reflecting element 270, other extinction element (not shown) are arranged in the region of the first reflecting element 260 and third reflecting element 280.Citing and Speech, detection device 200V can further include the multiple extinctions member being arranged on two opposite side wall surfaces of light-guide device 210 Part (not shown), side wall surface above-mentioned refer to the surface being connected between the top surface 212 of light-guide device 210 and bottom surface 214.
Extinction element 291 can be absorbed and reduce the stray light for not following predetermined light paths to advance, to avoid sensing element 240 receive the stray light other than signal beams L '.In addition, configuration extinction element 291 can increase capture area, and make It is transmitted to the signal beams L ' of sensing element 240 more evenly, and is conducive to improve image quality.
It is the diagrammatic cross-section of the detection device of one embodiment of the invention please continue to refer to Figure 32, Figure 32.The detection of Figure 32 The detection device 200V of device 200W and Figure 31 is identical or corresponding element label having the same, and identical part is no longer It repeats.In the embodiment of Figure 32, detection device 200W further includes the 4th reflecting element positioned at 210 top surface 212 of light-guide device 290.That is, the second reflecting element 270 and the 4th reflecting element 290 are located at the same surface of light-guide device 210, but each other Separate setting.In the present embodiment, light beam L is sequentially to be reflected by the second reflecting element 270, the first reflecting element the 260, the 4th The reflection of element 290 and third reflecting element 280 to be transmitted in light-guide device 210, and is projected to translucent element 220.
In the present embodiment, the second reflecting element 270 and the first reflecting element 260 are on the thickness direction of light-guide device 10 It is least partially overlapped, and the 4th reflecting element 290 and third reflecting element 280 are also on the thickness direction of light-guide device 210 It partly overlaps.But the second reflecting element 270 and third reflecting element 280 on the thickness direction of light-guide device 210 completely not Overlapping.
In addition, the detection device 200W of the present embodiment is in addition to including being set to the first reflecting element 260 and third reflector Except extinction element 291a between part 280, setting is still further comprised in the second reflecting element 270 and third reflecting element Another extinction element 291b between 280.In the present embodiment, two extinction element 291a, 291b and the second reflecting element 270 It is least partially overlapped on the thickness direction of light-guide device 210.It is similar with the embodiment of Figure 31, two extinction element 291a, 291b can be absorbed and reduce the stray light for not following predetermined light paths to advance, so that it is next self-confident to avoid sensing element 240 from receiving Stray light other than number light beam L '.In addition, configuration extinction element 291 can increase capture area, and make to be transmitted to sensing element 240 signal beams L ' more evenly, and is conducive to improve image quality.
In addition, in the present embodiment, detection device 200W still further comprises the shading being arranged in the first recessed portion C1 Object 20.Shade 20 is directly projected to sensing element between light-emitting component 230 and sensing element 240, to avoid light beam L 240.On the other hand, shade 20 can limit to the dispersion angle of light beam L caused by light-emitting component 230, so as to more accurately Control light beam L is entered in light-guide device 210 with scheduled incident angle.In this way, the light of light beam L can be further precisely controlled Road, and ensure that most light beam L can be projected towards object F1, and improve the image quality of sensing element 240.
It is the diagrammatic cross-section of the detection device of one embodiment of the invention please continue to refer to Figure 33, Figure 33.The detection of Figure 33 The detection device 200V of device 200X and Figure 31 is identical or corresponding element label having the same, and identical part is no longer It repeats.
In the embodiment of Figure 33, light-guide device 210 includes being set to the first reflecting element 260 and third reflecting element Multiple optical microstructures 303 between 280.In the present embodiment, the range and the second reflection that multiple optical microstructures 303 are distributed Element 270 is least partially overlapped in the thickness direction of light-guide device 210.Furthermore, the vertical throwing of the second reflecting element 270 The range that shadow can be distributed with multiple optical microstructures 303 is least partially overlapped.
The shape of each optical microstructures 303 can be identical with anti-reflection micro-structure 300 above-mentioned.For example, optics is micro- The section shape of structure 303 is also possible to zigzag, waveform or chevron, but invention is not limited thereto.
It is more that multiple optical microstructures 303 can be such that a part of light beam after reflecting by the second reflecting element 270 passes through A optical microstructures 303 and from light-guide device 210 project and go out.Furthermore, the stray light that do not advance according to predefined paths L1 can be projected to except light-guide device 210 by optical microstructures 303, and be absorbed by substrate 14, to avoid sensing element 240 receive the stray light L1 other than signal beams L '.In addition, the configuration of optical microstructures 303 can increase capture face Product, and make to be transmitted to the signal beams L ' of sensing element 240 more evenly, and be conducive to improve image quality.
In addition, the embodiment with Figure 32 is similar, in the embodiment of Figure 33, detection device 200X still further comprises setting Shade 20 in the first recessed portion C1 is directly projected to sensing element 240 to avoid light beam L, and can limit to the member that shines The dispersion angle of light beam L caused by part 230 enters leaded light so as to be accurately controlled light beam L more with scheduled incident angle In element 210.
It is the diagrammatic cross-section of the detection device of one embodiment of the invention please continue to refer to Figure 34, Figure 34.The detection of Figure 34 The detection device 200W of device 200Y and Figure 32 is identical or corresponding element has the same or similar label, and identical portion Divide and repeats no more.
In the embodiment of Figure 34, detection device 200Y includes being set to the second reflecting element 270 and the 4th reflecting element 290 extinction element 291c, and light-guide device 210 includes being set between the first reflecting element 260 and third reflecting element 280 Multiple optical microstructures 303.
In the present embodiment, the range and the second reflecting element 270 and the 4th reflection that multiple optical microstructures 303 are distributed Element 290 is not overlapped completely in the thickness direction of light-guide device 210.In addition, extinction element 291c and the first reflecting element 260 exist The thickness direction of light-guide device 210 is least partially overlapped, but extinction element 291c and third reflecting element 280 are in light-guide device 210 thickness direction is not overlapped completely.
The extinction element 291c and optical microstructures 303 of the present embodiment can make the stray light that do not advance according to predefined paths L1 is emitted from light-guide device 210, and is absorbed by substrate 14, or directly absorbed by extinction element 291c, to avoid Sensing element 240 receives the stray light other than signal beams L '.In addition, extinction element 291c and optical microstructures 303 Configuration can increase capture area, and make to be transmitted to the signal beams L ' of sensing element 240 more evenly, and be conducive to improve at As quality.
5, Figure 35 is the diagrammatic cross-section of the detection device of one embodiment of the invention referring to figure 3..The detection device of Figure 35 The detection device 200U of 200Z and Figure 26 is identical or corresponding element has the same or similar label, and identical part is not It repeats again.In the present embodiment, detection device 200Z omits translucent element 220 as shown in figure 26.Accordingly, light-emitting component 230 After generated light beam L is entered in light-guide device 210 by light in part E1, sequentially by the reflection of the second reflecting element 270 with The reflection of first reflecting element 260, and transmitted in light-guide device 210, and in the boundary of light-guide device 210 and surrounding medium Face, that is, it is located at the surface of the top surface 212 of light-guide device 210, generate total reflection.
That is, the surface for being located at 210 top surface 212 of light-guide device can be used as the contact surface contacted by object F1.Work as object When body F1 (such as: finger) contacts light-guide device 210 by the top surface 212 of light-guide device 210, the burr of finger can make a part of light beam L can not generate total reflection, so that sensing element 240 be made to obtain the dark line for corresponding to finger burr.On the other hand, the dimpled grain of finger is simultaneously Not in contact with 212 surface of top surface for arriving light-guide device 210, and make another part light beam L that can still be totally reflected and form signal beams L'.The light out part E2 of signal beams L ' towards light-guide device 210 is projected, and passes through multiple anti-reflection micro-structures of light-guide device 210 300 and invest the light receiving surface 240a of sensing element 240.And then by image processing elements, sensing element 240 is connect The signal beams L ' received carries out image procossing, and the fingerprint image of available object F1 simultaneously carries out status knowledge according to fingerprint image Not.
Figure 36 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Detection device 200-1 Figure 35 of this example Detection device 200Z it is identical or corresponding element has the same or similar label, and identical part repeats no more.
In the present embodiment, the bottom surface 214 of light-guide device 210 does not have the first recessed portion C1 and the second recessed portion C2. That is, light-guide device 210 is plane on the surface of bottom surface 214, but multiple anti-reflection micro-structures 300 are still arranged in bottom surface 214 light out part E2.
In addition, the detection device 200-1 of the present embodiment further includes optical cement G1.Optical cement G1 is connected to light-guide device 210 Between substrate 14, so that light-guide device 210 is fixed on substrate 14, and light-emitting component 230 and sensing element 240 are embedment light It learns in glue G1.In addition, the refraction coefficient of optical cement G1 can be roughly the same with light-guide device 210, such as can be greater than or equal to 1.4, And it is less than or equal to 1.6.Therefore, light beam L is entered in optical cement G1 from light-guide device 210, or is entered by optical cement G1 When in light-guide device 210, it can be advanced according to scheduled optical path, without generating refraction.It should be noted that optical cement G1 is not filled out The gap defined between full sensing element 240 and light out part E2 (multiple anti-reflection micro-structures 300).Therefore, by going out Multiple anti-reflection micro-structures 300 of light portion E2 setting, can be greatly decreased the machine that signal beams L ' is totally reflected once again in light out part E2 Rate, to improve the image quality of sensing element 240.
In addition, in the present embodiment, light-guide device 210 is located at 210 top surface of light-guide device (surface 222) with another recess Portion C3, and the position of recessed portion C3 corresponds to the position of the second reflecting element 270, it is thick with the part for reducing light-guide device 210 Degree, and be conducive to provide relatively thin detection device for different product.
In addition, detection device 200U~200Y, 201-1 include respective surface plasma body resonant vibration (Surface Plasmon Resonance) layer SPR.The function of the surface plasmon resonance layer SPR of detection device 200U~200Y, 200-1 It is identical as the function of surface plasmon resonance layer SPR of aforementioned detection devices 200, it is just no longer repeated in this.
Figure 37 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.Referring to figure 3. 7, Detection device 200-2 is suitable for obtaining the biological characteristic of user O.In the present embodiment, user O is, for example, finger, and biology Feature is, for example, fingerprint or vein, and but not limited to this.For example, in another embodiment, user O can also be palm, And biological characteristic can be palmmprint.
Detection device 200-2 includes substrate 14, light-emitting component 230, sensing element 240, shade 20, the first reflecting element 260, light-guide device 210 and the second reflecting element 270.
Support plate of the substrate 14 as said elements, and substrate 14 can have route.For example, substrate 14 can be print Printed circuit board (Printed Circuit Board, PCB), flexible flexible printed wiring board (Flexible Printed Circuit Board, FPCB), the glass support plate with route or the ceramic substrate with route, but not limited to this.
Light-emitting component 230 configures on the substrate 14, and the route on light-emitting component 230 and substrate 14 is electrically connected.Citing For, detection device 200 can further comprise connecting line CL1, and light-emitting component 230 through connecting line CL1 and on substrate 14 Route be electrically connected, but not limited to this.Light-emitting component 230 is adapted to provide for illuminating the light beam B of user O.
The configuration of sensing element 240 is on the substrate 14 and by light-emitting component 230.In addition, sensing element 240 and substrate 14 On route be electrically connected.For example, detection device 200 can further comprise connecting line CL2, and sensing element 240 penetrates Connecting line CL2 and on substrate 14 route be electrically connected, but not limited to this.Sensing element 240 is suitable for receiving light beam B and is made The part (such as light beam BB) of user O reflection.
Shade 20 configures on the substrate 14 and between light-emitting component 230 and sensing element 240.Shade 20 is suitable for The wide-angle light beam (such as light beam BL) that masking light-emitting component 230 is issued, shines directly into sensing to avoid wide-angle light beam Interference caused by part 240.For example, shade 20 can be is made by light absorbent, or on light transmission bulk It forms light-absorption layer and is formed.In addition, the height of shade 20 can be greater than or equal to the height of light-emitting component 230 and be less than guide-lighting member The height of part 210.That is, the top surface S140T of shade 20 can be higher than light-emitting component 230 top surface S120T or with hair The top surface S120T of optical element 230 is flushed.In addition, the top surface S140T of shade 20 is lower than the top surface 212 of light-guide device 210, with The segment beam (such as light beam B) for allowing light-emitting component 230 to be issued passes through.It is described in any feasible example of the application Light-guide device 210 can be to dry after the glue material encapsulating of light transmission and formed.
First reflecting element 260 configures on the substrate 14 and between shade 20 and sensing element 240.First reflection Element 260 is suitable for reflecting the light beam B transmitted towards substrate 14, transmits light beam B towards the direction far from substrate 14.For example, First reflecting element 260 can be reflector plate or in a manner of plating, printing, etching, paste and be coated at least one of them Form reflecting layer on the substrate 14.
The configuration of light-guide device 210 is on the substrate 14 and covering luminous element 230, sensing element 240, shade 20 and the One reflecting element 260.Light-guide device 210 can be light transmission colloid and be solidified by heating processing procedure or irradiation processing procedure.It is described Optical cement body can be epoxy resin (epoxy), silica gel, optical cement, resin (resin) or other suitable translucent materials.
Top that second reflecting element 270 configured in shade 20 and be located at light-emitting component 230 and sensing element 240 it Between.Specifically, the second reflecting element 270 is located at least in the biography of light beam B carrying out self-emission device 230 and not covered by shade 20 It passs on path, the light beam B transmitted towards the top surface of light-guide device 210 212 is reflected, passes light beam B towards the first reflecting element 260 It passs.Second reflecting element 270 can be reflector plate or with plating, printing, etch, paste and be coated with the side of at least one of them Formula is formed in the reflecting layer on light-guide device 210.It need in addition be illustrated, but other derivatives in Figure 37,38,41,42 Embodiment in, also can be omitted the second reflecting element 270 configuration in the top of light-guide device 210, i.e., as shown in Figure 43, Figure 45 Out.
In the present embodiment, the second reflecting element 270 configuration on the top surface of light-guide device 210 212, but not as Limit.Second reflecting element 270 can extend from the top of shade 20 towards the top of the first reflecting element 260, and the second reflection Element 270 exposes sensing element 240.First reflecting element 260 can partly overlap with the second reflecting element 270, but not with this It is limited.In another embodiment, the first reflecting element 260 can also be completely overlapped or completely not be overlapped with the second reflecting element 270. In addition, the first reflecting element 260 and the second reflecting element 270 can have identical or different reflectivity.
Due to the first reflecting element 260 and the second reflecting element 270 help to allow light beam B in light-guide device 210 into Row multiple reflections, therefore the light beam B being transmitted in detection device 200-2 can be made more evenly, so allow user O can uniformly by Light, and help that sensing element 240 is allowed to get complete biometric image.Therefore detection device 200-2 can have well Capture quality.
In the present embodiment, user O is directly pressed on the top surface of light-guide device 210 212, to carry out biological characteristic knowledge Not.In one embodiment, detection device 200-2 can further comprise cover sheet (not shown) or protective film (not shown).It protects Protecting cover plate or protective film configuration are on light-guide device 210 and the second reflecting element 270, and user O pressing is in cover sheet Or on surface of the protective film far from the second reflecting element 270, to carry out living things feature recognition.Cover sheet or protective film can be protected Underlying light-guide device 210 and the second reflecting element 270 (such as scratch resistant).
Figure 38 to Figure 42 is the diagrammatic cross-section of other kind of state sample implementation of the detection device of the embodiment of Fig. 1 respectively, In identical element indicated with identical label, just no longer repeated under.
Referring to figure 3. 8, the main difference of the detection device 200-2 of detection device 200-3 and Figure 37 are as described below.It is examining It surveys in device 200-3, substrate 14, the second reflecting element 270, light-guide device 210 and the first reflecting element 260 are wherein at least It can be formed with the multiple micro-structure MS on the surface of one, to increase the volume reflection of light beam B, make light beam B more evenly.Figure 38 shows Meaning property, which is shown, is formed with multiple micro-structure MS on the first surface of the reflecting element 260 far from substrate 14, and but not limited to this.Another In one embodiment, substrate 14, which configures, can form the multiple micro-structure MS on the region other than said elements.Light-guide device 210 Can form the multiple micro-structure MS on top surface 212, and the configuration of the second reflecting element 270 the multiple micro-structure MS at least On part.The multiple micro- knot can be formed on surface of second reflecting element 270 towards substrate 14 or the surface far from substrate 14 Structure MS.
Supplementary explanation, the multiple micro-structure MS can be comprehensive or be partly arranged on said elements, and The multiple micro-structure MS can be configured on said elements in such a way that continuous or interval configures.In addition, in any of the invention In a possible embodiments, the mode that the multiple micro-structure MS can also take part to be bonded is configured in the first reflecting element 260 On either the second reflecting element 270.For example, the multiple micro-structure MS and the first reflecting element 260 (or the second reflecting element 270) the adhesion layer (not shown) fitting that can pass through annular between, wherein the adhesion layer of annular is located at the multiple micro-structure MS's Between a part and a part of the first reflecting element 260 (or second reflecting element 270), and the multiple micro-structure MS's is another Not set adhesion layer between a part and another part of the first reflecting element 260 (or second reflecting element 270), so that described Multiple micro-structure MS, the adhesion layer of annular and the first reflecting element 260 (or second reflecting element 270) enclose and set out the air gap Layer (not shown).
Under the framework of Figure 38, detection device 200-3 can further comprise that configuration is reflected in light-guide device 210 and second Cover sheet (not shown) or protective film (not shown) on element 270.Relevant description please refers to aforementioned relevant paragraph, in this Just it no longer repeats.
Referring to figure 3. 9, the main difference of the detection device 200-2 of detection device 200-4 and Figure 37 are as described below.It is examining It surveys in device 200-4, the first reflecting element 260 includes spaced multiple reflecting parts 262, and the second reflecting element 270 wraps Include spaced multiple reflecting parts 272.Specifically, the first reflecting element 260 and the second reflecting element 270 respectively can be by one A above reflecting part (such as reflector plate or reflecting layer) composition.When reflecting element is made of multiple reflecting parts, these reflecting parts It can be alternatively arranged.It is described to be alternatively arranged the case where may include equidistant arrangement and unequal spacing arrangement (distribution at random). In another embodiment, only one of them includes spaced multiple anti-for the first reflecting element 260 and the second reflecting element 270 Penetrate portion.
Under the framework of Figure 39, detection device 200-4 can further comprise that configuration is reflected in light-guide device 210 and second Cover sheet (not shown) or protective film (not shown) on element 270.In addition, substrate 14, the 260 (reflection of the first reflecting element Portion 262), can be formed on the surface of at least one of them of light-guide device 210 and the second reflecting element 270 (reflecting part 272) Multiple micro-structure MS (referring to Figure 38).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Referring to figure 4. 0, the main difference of the detection device 200-2 of detection device 200-5 and Figure 37 are as described below.It is examining It surveys in device 200-5, detection device 200-5 further comprises configuration on sensing element 240 and is located at light-guide device 210 and sense Survey the space filtering element 30 between element 240.Space filtering element 30 is suitable for the light that collimationization is transferred to sensing element 240 Beam.In another embodiment, space filtering element 30 is also alternatively at grating (grating).In addition, space filtering element 30 with Grating can pass through adhesion layer (not shown) or fixed mechanism (not shown) is fixed on sensing element 240.Alternatively, space filtering is first Part 30 is alternatively at the U.S. Patent Application No. 15/151,471 or Chinese Patent Application No. of applicant's earlier application 201810194406.6 described fiber array.
Under the framework of Figure 40, detection device 200-5 can further comprise that configuration is reflected in light-guide device 210 and second Cover sheet (not shown) or protective film (not shown) on element 270.In addition, substrate 14, the first reflecting element 260, leaded light Multiple micro-structure MS can be formed on the surface of at least one of them of element 210 and the second reflecting element 270 (referring to Figure 38). In addition, at least one of them of the first reflecting element 260 and the second reflecting element 270 may include spaced multiple reflecting parts (referring to Figure 39).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Referring to figure 4. 1, the main difference of the detection device 200-2 of detection device 200-6 and Figure 37 are as described below.It is examining It surveys in device 200-6, detection device 200-6 further comprises wall body structure 40.Wall body structure 40 configures on the substrate 14, wherein Wall body structure 40 and substrate 14, which are formed, accommodates light-emitting component 230, sensing element 240, shade 20 and the first reflecting element 260 Accommodating space AS.In one embodiment, wall body structure 40 and substrate 14 can be integrated molding.For example, wall body structure 40 can be with substrate 14 and remove groove by substrate material and be formed, further groove space, that is, accommodating space occupied before removing AS.In another embodiment, wall body structure 40 can be through mechanism member or adhesion layer (not shown) and fix on the substrate 14, And wall body structure 40 and substrate 14 can have identical or different material.In addition, wall body structure 40 can also be such as above-mentioned implementation Example is previously mentioned, and surface is coated with light absorbent.
Under the framework of Figure 41, detection device 200-6 can further comprise that configuration is reflected in light-guide device 210 and second Cover sheet (not shown) or protective film (not shown) on element 270.In addition, substrate 14, the first reflecting element 260, leaded light Multiple micro-structure MS can be formed on the surface of at least one of them of element 210 and the second reflecting element 270 (referring to Figure 38). In addition, at least one of them of the first reflecting element 260 and the second reflecting element 270 may include spaced multiple reflecting parts (referring to Figure 39).Furthermore detection device 200-6 can further comprise configuration on sensing element 240 and be located at light-guide device 210 Space filtering element 30 (referring to fig. 4 0), grating or fiber array between sensing element 240 (are described in the first Shen of applicant U.S. Patent Application No. 15/151,471 please).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Referring to figure 4. 2, the main difference of the detection device 200-6 of detection device 200-7 and Figure 41 are as described below.It is examining It surveys in device 200-7, detection device 200-7 further comprises light transmitting cover TC.Light transmitting cover TC is configured on light-guide device 210 And covering luminous element 230, sensing element 240, shade 20, the first reflecting element 260, connecting line CL1, connecting line CL2 with And wall body structure 40.In addition, the configuration of the second reflecting element 270 is on light transmitting cover TC.
Light transmitting cover TC has glue filling opening TC1 and vacuumizes hole TC2.Glue filling opening TC1 is suitable for filling and forms light-guide device 210 light transmission colloid, and vacuumize hole TC2 and be suitable for connecting with vacuum evacuation device, it is empty to extract accommodating out when filling light transmission colloid Between gas in AS.
In the present embodiment, light transmitting cover TC also coats the side wall surface S112S of wall body structure 40, and glue filling opening TC1 and In the part for vacuumizing the side wall surface S112S that hole TC2 is respectively formed at light transmitting cover TC cladding wall body structure 40.Wall body structure 40 Including first through hole TCH1 and the second through-hole TCH2.First through hole TCH1 and the second through-hole TCH2 are respectively formed at wall knot Structure 40 is located in the part of 14 liang of opposite sides of substrate, and wherein first through hole TCH1 is connect with glue filling opening TC1, and the second through-hole TCH2 with Vacuumize hole TC2 connection.However, invention is not limited thereto.It glue filling opening TC1 and vacuumizes hole TC2 and may be formed at euphotic cover Body TC is located at the part on substrate 14, in this way, wall body structure 40 can not have to form first through hole TCH1 and the second through-hole TCH2。
Under the framework of Figure 42, detection device 200-7 can further comprise that configuration is reflected in light transmitting cover TC and second Cover sheet (not shown) or protective film (not shown) on element 270.In addition, substrate 14, the first reflecting element 260, leaded light Multiple micro-structure MS can be formed on the surface of at least one of them of element 210 and the second reflecting element 270 (referring to Figure 38). In addition, at least one of them of the first reflecting element 260 and the second reflecting element 270 may include spaced multiple reflecting parts (referring to Figure 39).Furthermore detection device 200-7 can further comprise configuration on sensing element 240 and be located at light-guide device 210 Space filtering element 30 (referring to fig. 4 0), grating or fiber array between sensing element 240 (are described in the first Shen of applicant U.S. Patent Application No. 15/151,471 or Chinese Patent Application No. 201810194406.6 please).Relevant description please refers to Aforementioned relevant paragraph is just no longer repeated in this.
Figure 43 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.Referring to figure 4. 3, Detection device 200-8 is similar to the detection device 200-2 of Figure 37, wherein identical element is indicated with identical label, Yu Xiabian No longer repeat.The main difference of the detection device 200-2 of detection device 200-8 and Figure 37 are as described below.In detection device 200-8 In, detection device 200-8 further comprises light transmission pedestal 70.Light transmission pedestal 70 configures on the substrate 14 and covers shade 20.
In the present embodiment, light transmission pedestal 70 is the light-permeable shell for being provide with shade 20, and light-permeable shell and 14 shape of substrate At the enclosure space CS for accommodating shade 20.Shade 20 can not fill up enclosure space CS, that is to say, that shade 20 and thoroughly Gap may be present between bare hull body.The gap can fill the adhesion material to fixed shade 20 and light-permeable shell, but It is not limited.In another embodiment, light transmission pedestal 70 can be through plating, printing, etch, pastes and be coated with wherein The side wall surface and the photic zone on top surface that the mode of at least one is formed in shade 20, and the photic zone can by one layer with On translucent material be made.
In the present embodiment, light transmission pedestal 70 does not cover the first reflecting element 260, that is to say, that light transmission pedestal 70 not with The overlapping of first reflecting element 260, but not limited to this.In another embodiment, light transmission pedestal 70 can cover the first reflecting element The part of 260 neighbouring light transmission pedestal 70, so that light transmission pedestal 70 partly overlaps with the first reflecting element 260.
Second reflecting element 270 configures on the top surface S210T of light transmission pedestal 70, wherein the top of the second reflecting element 270 Face S170T can be flushed with the top surface 212 of light-guide device 210.That is, the top surface S170T of the second reflecting element 270 and leaded light The top surface 212 of element 210 has identical height, and but not limited to this.In another embodiment, the top of the second reflecting element 270 Face S170T can be lower than light-guide device 210 top surface 212, and light-guide device 210 can further cover the second reflecting element 270 and Light transmission pedestal 70 under the second reflecting element 270.
Under the framework of Figure 43, detection device 200-8 can further comprise that configuration is reflected in light-guide device 210 and second Cover sheet (not shown) or protective film (not shown) on element 270.In addition, substrate 14, the first reflecting element 260, leaded light Multiple micro-structure MS can be formed on the surface of at least one of them of element 210 and the second reflecting element 270 (referring to Figure 38). In addition, at least one of them of the first reflecting element 260 and the second reflecting element 270 may include spaced multiple reflecting parts (referring to Figure 39).Furthermore detection device 200-8 can further comprise configuration on sensing element 240 and be located at light-guide device 210 Space filtering element 30 (referring to fig. 4 0), grating or fiber array between sensing element 240 (are described in the first Shen of applicant U.S. Patent Application No. 15/151,471 please).Furthermore again, detection device 200-8 can further comprise wall body structure 40 (referring to Figure 41).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Figure 44 is the diagrammatic cross-section of another state sample implementation of the detection device of one embodiment of the invention.Please refer to figure 44, detection device 200-9 are similar to the detection device 200-8 of Figure 43, wherein identical element is indicated with identical label, under Just it no longer repeats.The main difference of the detection device 200-8 of detection device 200-9 and Figure 43 are as described below.In detection device In 200-9, detection device 200-9 further comprises wall body structure 40 and light transmitting cover TC.Wall body structure 40 and euphotic cover The relevant description of body TC please refers to aforementioned relevant paragraph, just no longer repeats in this.
Under the framework of Figure 44, light transmitting cover TC can protect underlying light-guide device 210 and the second reflector Part 270, therefore additional setting cover sheet or protective film can not had to.In addition, substrate 14, the first reflecting element 260, guide-lighting member Multiple micro-structure MS can be formed on the surface of at least one of them of part 210 and the second reflecting element 270 (referring to Figure 38).Separately Outside, at least one of them of the first reflecting element 260 and the second reflecting element 270 may include spaced multiple reflecting parts (referring to Figure 39).Furthermore detection device 200-9 can further comprise configuration on sensing element 240 and be located at light-guide device 210 Space filtering element 30 (referring to fig. 4 0), grating or fiber array between sensing element 240 (are described in the first Shen of applicant U.S. Patent Application No. 15/151,471 please).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Figure 45 is a kind of diagrammatic cross-section of state sample implementation of the detection device of one embodiment of the invention.Referring to figure 4. 5, Detection device 200-10 is similar to the detection device 200-2 of Figure 37, wherein identical element is indicated with identical label, Yu Xiabian No longer repeat.The main difference of the detection device 200-2 of detection device 200-10 and Figure 37 are as described below.In detection device 200- In 10, the second reflecting element 270 of Fig. 7 is not configured.Under this framework, it is transferred to the light beam B of the top surface 212 of light-guide device 210 Some the first reflecting element 260 is transferred to by internal reflection.Specifically, when the thickness T160 of light-guide device 210 is fallen When in the range of 0.3mm to 1.8mm, it is transferred to the top surface 212 of light-guide device 210 and there is the angle no more than 45 degree (to refer to Angle folded by light beam B and top surface 212) the part of light beam B can be by between top surface 212 and the second reflecting element 270 Multiple reflections and be transferred to sensing element 240, and be transferred to the top surface 212 of light-guide device 210 and have greater than 45 degree of angle Remaining of the light beam of (referring to angle folded by light beam B and top surface 212) is partly by projecting light-guide device 210.
Figure 46 is the diagrammatic cross-section of another state sample implementation of the detection device of one embodiment of the invention.Please refer to figure 46, detection device 200-11 are similar to the detection device 200-10 of Figure 45, wherein identical element is indicated with identical label, in Under just no longer repeat.The main difference of the detection device 200-10 of detection device 200-11 and Figure 45 are as described below.It is filled in detection It sets in 200-11, detection device 200-11 further comprises light transmitting cover TC.Light transmitting cover TC is suitable for protecting the member being located under it Part.In addition, light transmitting cover TC allows light beam to pass through, so that light-guide device 210 can sequentially be passed through by carrying out the light beam of self-emission device And light transmitting cover TC, and it is transferred to the determinand of contact light transmitting cover TC, and can sequentially be passed through by the light beam that determinand reflects Light transmitting cover TC and light-guide device 210 and be transferred to sensing element 240.For example, light transmitting cover TC is glass cover-plate, but It is not limited.It is configured on light-guide device 210 and covering luminous element 230, sensing element 240, shading in light transmitting cover TC Under the framework of object 20, the first reflecting element 260 and connecting line CL1, CL2, the total thickness of light-guide device 210 and light transmitting cover TC Degree TT is fallen in the range of 0.3mm to 1.8mm, with the formation of sharp internal reflection, so that carrying out the light beam of self-emission device 230 extremely The determinand that few some can be transferred to contact light transmitting cover TC is then secondly transferred to sensing element 240.
Under the framework of Figure 45 and Figure 46, substrate 14, the first reflecting element 260 and light-guide device 210 are wherein at least Multiple micro-structure MS can be formed on the surface of one (referring to Figure 38).In addition, the first reflecting element 260 may include spaced Multiple reflecting parts (referring to Figure 39).In addition, at least one of them of detection device 200-10 and detection device 200-11 can be into One step includes the space filtering element 30 configured on sensing element 240 and between light-guide device 210 and sensing element 240 (referring to fig. 4 0), grating or multiple fiber arrays either collimating element respectively lined up with different angle inclination etc. (or retouch It is set forth in the U.S. Patent Application No. 15/151,471 or 15/989,123 that applicant had previously applied).Furthermore detection device 200-10 And at least one of them of detection device 200-11 can further comprise the wall body structure 40 that is configured on substrate 14 (referring to figure 41).Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
In addition, detection device 200-2~200-11 includes respective surface plasma body resonant vibration (Surface Plasmon Resonance) layer SPR.The function of the surface plasmon resonance layer SPR of detection device 200-2~200-11 with The function of the surface plasmon resonance layer SPR of aforementioned detection devices 200 is identical, just no longer repeats in this.
Figure 47 A to Figure 47 B is respectively the upper view and diagrammatic cross-section of the detection device of one embodiment of the invention, wherein scheming 47A is the diagrammatic cross-section of the hatching line A-A ' along Figure 47 B, and Figure 47 B omits the surface plasmon resonance layer SPR of Figure 47 A.It please join It is suitable for obtaining the biological characteristic of determinand 10 according to Figure 47 A to Figure 47 B, detection device 200-12.In the present embodiment, determinand 10 For example, finger, and biological characteristic is, for example, fingerprint or vein, but not limited to this.For example, in another embodiment, to Surveying object 10 can also be palm, and biological characteristic can be palmmprint.
Detection device 200-12 includes substrate 14, a plurality of light-emitting elements 230, sensing element 240 and light-guide device 210.
For the usability of the encapsulating structure of increase detection device 200-12, becket MR can be set in substrate 14.Metal Ring MR is located at the sensing area between the upper surface and lower surface of substrate 14 and around sensing element 240.Whereby, when determinand 10 is pressed When being pressed on light-guide device 210, device can be made to start operation by way of electrification by induction, and the envelope of detection device 200-12 Assembling structure can enter temporarily stopped state when unused, the effect of to reach energy saving.
A plurality of light-emitting elements 230 are set on substrate 14 and are electrically connected with substrate 14.Each light-emitting component 230 has light Face 230a.The light-emitting surface 230a of each light-emitting component 230 issues light beam L towards determinand 10.
Sensing element 240 is set on substrate 14 and is electrically connected with substrate 14.In addition, sensing element 240 is positioned at multiple By light-emitting component 230, (the reflected beams of fingerprint pattern information are had to receive the part that light beam L is reflected by determinand 10 L’)。
In one embodiment, PWM circuit can be integrated in sensing element 240.It is controlled and is sent out by PWM circuit The fluorescent lifetime of optical element 230 and the capture time of sensing element 240, make the fluorescent lifetime and sensing element of light-emitting component 230 240 capture time synchronization, can reach the effect accurately controlled, but not limited to this.
Light-guide device 210 is set on substrate 14 and covers sensing element 240 and a plurality of light-emitting elements 230.Guide-lighting member Part 210 is, for example, that the light transmissions colloids such as silica gel, resin, optical cement, epoxy resin (Epoxy) are solid by heating processing procedure or irradiation processing procedure Change.Therefore light-guide device 210 protects the internal sensing element 240 covered and more in addition to that can prevent electrostatic breakdown A light-emitting component 230, the light beam L ' that the light beam L and determinand 10 that a plurality of light-emitting elements 230 can also be allowed to be issued are reflected It penetrates.
Light-guide device 210 has an at least groove 215 with respect to the side of sensing element 240, and at least a groove 215 is located at Between sensing element 240 and a plurality of light-emitting elements 230.In the present embodiment, a plurality of light-emitting elements 230 are located at sensing element 240 Two opposite sides, and light-guide device 210 include two grooves 215, but not limited to this.
In the present embodiment, the depth Y3 of groove 215 is less than the thickness H4 of light-guide device 210, implies that and meets H3 < H4.? That is groove 215 does not have to run through light-guide device 210, therefore convenient for production.
In the present embodiment, each groove 215 is the V-groove of strip, and there are two inclined-plane 215a for the tool of each groove 215. Can by adjusting in two inclined-plane 215a of groove 215 relatively adjacent to corresponding a plurality of light-emitting elements 230 inclined-plane 215a with lead The supplementary angle θ of angle folded by surface (such as the touch surface of determinand 10) of the optical element 210 relative to sensing element 240, to have Ideal light utilization efficiency.For example, supplementary angle θ is fallen in the range of 30 degree to 45 degree, and the depth Y3 system of an at least groove 215 It is determined according to the size of this supplementary angle θ.In other embodiments, the section shape of each groove 215 be also possible to stand upside down it is trapezoidal, fall Vertical semicircle or other shapes.The semicircle refers to incomplete circle, and is not limited to circular half.
V-groove helps to change the conduct path of light beam L.Specifically, the light beam L transmitting that light-emitting component 230 is issued When to groove 215 close to the inclined-plane 215a of light-emitting component 230, ditch can be entered by the inclined-plane 215a close to light-emitting component 230 Slot 215 (i.e. injection light-guide device 210).Segment beam into groove 215 can be again by groove 215 close to sensing element 240 Inclined-plane 215a enter light-guide device 210.Light-emitting component 230 is helped avoid by the conduct path that V-groove changes light beam L The light beam L direct irradiation issued reduces the light interference of sensing element 240, and promote detection device to sensing element 240 The recognition capability of 200-12.
In the present embodiment, the light transfer medium in groove 215 is air, and but not limited to this.In another embodiment, It can be filled with translucent material in groove 215, wherein the refractive index of translucent material is greater than the refractive index of light-guide device 210, with preferable The light beam L direct irradiation for avoiding light-emitting component 230 from being issued is to sensing element 240.The translucent material is the saturating of high refractive index Luminescent material, for example, can be by photocuring or the optical cement of heat cure, and but not limited to this.
In addition, the thickness H2 of sensing element 240 can also be made to be less than the thickness H1 of light-emitting component 230, that is, make the member that shines The light-emitting surface 230a of part 230 is higher than the light receiving surface 240a of sensing element 240, to further decrease light interference.Sensing element 240 Thickness H2 refer to the photosurface 132 of sensing element 240 to the distance of substrate 14, and the thickness H1 of light-emitting component 230 refers to the member that shines The light-emitting surface 230a of part 230 to substrate 14 distance.
The method for the thickness H1 for making the thickness H2 of sensing element 240 be less than light-emitting component 230, which can be, changes above-mentioned each member The thickness of part (sensing element 240 and light-emitting component 230) itself.Alternatively, being provided between above-mentioned each element and substrate 14 In the case where other film layers, the thickness of other film layers can adjust, so that the thickness H2 of sensing element 240 is less than light-emitting component 230 thickness H1.For example, detection device 200-12 further includes multiple adhesion layer AD.Adhesion layer AD is respectively set positioned at more Between a light-emitting component 230 and substrate 14 and between sensing element 240 and substrate 14.Adhesion layer AD be, for example, adhesion colloid or Double-sided adhesive etc..Each light-emitting component 230 and its under adhesion layer AD combined thickness, that is, light-emitting component 230 thickness H1, and sense Element 240 and its under adhesion layer AD combined thickness, that is, sensing element 240 thickness H2.It can be by changing each light-emitting component The thickness of adhesion layer AD under 230 and the thickness of the adhesion layer AD under sensing element 240, to make the thickness of sensing element 240 H2 is less than the thickness H1 of light-emitting component 230.However, in another embodiment, the thickness H2 of sensing element 240 also be can be equal to or greatly In the thickness H1 of light-emitting component 230.
In the present embodiment, detection device 200-12 further includes a plurality of connecting line CL1, CL2.Connecting line CL1, CL2 difference It is connected between sensing element 240 and substrate 14 and between a plurality of light-emitting elements 230 and substrate 14, so that sensing element 240 It is electrically connected respectively with substrate 14 with a plurality of light-emitting elements 230.Material of a plurality of connecting line CL1, CL2 e.g. gold, copper etc., but It is not limited.In another embodiment, sensing element 240 and a plurality of light-emitting elements 230 also can pass through on soldered ball and substrate 14 Circuit connection, and connecting line CL1, CL2 can be omitted.
The production method of the detection device 200-12 of the present embodiment for example may include following steps.Firstly, by multiple glutinous Layer AD a plurality of light-emitting elements 230 and sensing element 240 are sticked on substrate 14, plurality of light-emitting component 230 and sensing The height of element 240 can further be adjusted by way of grinding.Secondly, using routing device in forming a plurality of company on substrate 14 Wiring CL1, CL2, wherein a plurality of connecting line CL1, CL2 are separately connected the conductive pad of a plurality of light-emitting elements 230 and leading for substrate 14 The conductive pad of the conductive pad and substrate 14 of electrical pad and connection sensing element 240.Then, using adhesive injection device by light transmission colloid shape At on substrate 14 and covering a plurality of light-emitting elements 230, sensing element 240 and a plurality of connecting line CL1, CL2.Then, thoroughly Cross heating processing procedure (such as baking processing procedure) or irradiation processing procedure (such as ultraviolet light curing process) solidification light transmission colloid.Finally, by etching, Laser engraving or other existing patterning methods, light transmission gel phase after hardening form the side of sensing element 240 An at least groove 215, to form light-guide device 210.In other embodiments, light-guide device can also be made by mold 210 are integrally formed with an at least groove 215, but the present invention is not limited thereto.It in one embodiment, can on the substrate 14 simultaneously It manufactures multiple taking units (including light-emitting component 230, sensing element 240 and light-guide device 210), and passes through cutting processing procedure cutting Multiple detection device 200-12 out.
By above-mentioned production method, the detection device 200-12 of the present embodiment can be made as the fingerprint recognition of whole plane Device, and then increase the compatibility with the assembling of other devices.In addition, passing through the production method of press mold injecting glue, the inspection of the present embodiment Surveying device 200-12 can be mass produced, and then reduce production cost.In addition, the groove 215 due to light-guide device 210 can be with Light interference is reduced, therefore can be omitted the setting of shading element, and then element needed for can simplify fabrication steps, reducing processing procedure is simultaneously Help to reduce module area.
Figure 48 A to Figure 48 B is respectively the upper view and diagrammatic cross-section of the detection device of one embodiment of the invention, wherein scheming 48A is the diagrammatic cross-section of the hatching line A-A ' along Figure 48 B, and Figure 48 B omits the surface plasmon resonance layer SPR of Figure 48 A.It please join It is similar according to the detection device 200-12 of Figure 48 A and Figure 48 B, detection device 200-13 and Figure 47 A.The following institute of the main difference of the two It states.Detection device 200-13 further includes an at least wall body structure 40.An at least wall body structure 40 is around sensing element 240 and more A light-emitting component 230, the wherein at least material of a wall body structure 40 can be selected and the identical or different material of substrate 14, the present invention It is not limited to this.
During production, wall body structure 40 may be formed at setting sensing element 240 and a plurality of light-emitting elements 230 it Afterwards and it is formed in front of light-guide device 210.Alternatively, groove-like first can also be fabricated to substrate 14, with the protrusion of recess edge It is allocated as wall body structure 40.In other words, at least wall body structure 40 can be integrally formed with substrate 14.At least wall body structure 40 Setting can be reduced when pouring into light transmission colloid causes connecting line CL1, CL2 to be thrust or sensing element because increasing encapsulating pressure 240 displacements and the problem of fail, and then help to be promoted the yield of detection device 200-13.Meanwhile providing detection device 200- 13 preferable structural strengths.In one embodiment, wall body structure can be removed by cutting processing procedure after forming light-guide device 210 40, it can also so form detection device 200-12 shown in Figure 47 A.
Figure 49 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Referring to figure 4. 9, detection device 200-15 It is similar with the detection device 200-12 of Figure 47 A.The main difference of the two is as described below.Detection device 200-15 further includes euphotic cover Body TC.Light transmitting cover TC is set on light-guide device 210 and covers an at least groove 215, the light in a wherein at least groove 215 Transfer medium includes air.The material of light transmitting cover TC is, for example, glass or perspex.In one embodiment, light transmitting cover TC can pass through adhesion layer (not shown) and be covered on light-guide device 210.Adhesion layer can be adhesion colloid or double-sided adhesive.Such one Come, can further enhance barrier aqueous vapor ability and protection detection device 200-15 internal element (such as prevents light-guide device 210 from scraping Wound).In another implementation, light transmitting cover TC can also be fixed on light-guide device 210 by fixed mechanism part, can so be saved Slightly adhesion layer.
Under the framework of Figure 49, detection device 200-15B can also further comprise the wall body structure 40 of Figure 48 A.It is relevant Description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Figure 50 is the diagrammatic cross-section of the detection device of one embodiment of the invention.Referring to figure 5. 0, detection device 200-16 It is similar with the detection device 200-12 of Figure 47 A.The main difference of the two is as described below.Detection device 200-16 further includes space filter Wave element 30.Space filtering element 30 is set on sensing element 240 and between light-guide device 210 and sensing element 240, The light beam of sensing element 240 is transferred to collimation.Pinhole collimator (pinhole for example can be selected in space filtering element 30 Collimator) either optical fiber collimator (fiber collimator).In this way, which the sensing of sensing element 240 can be increased The luminous intensity of the light beam reflected by determinand, and then promote the discrimination of detection device 200-16.
Under the framework of Figure 50, detection device 200-16 can also further comprise the wall body structure 40 or Figure 49 of Figure 48 A Light transmitting cover TC.Relevant description please refers to aforementioned relevant paragraph, just no longer repeats in this.
Figure 51 A is another diagrammatic cross-section of the groove of the detection device of one embodiment of the invention.1A referring to figure 5., Detection device 200-17 is similar with the detection device 200-12 of Figure 47 A.The main difference of the two is as described below.In detection device In 200-17D, the angle of two apex angles of groove 215A is different.For example, relatively adjacent to corresponding in two inclined-plane 215aA The supplementary angle of angle folded by the surface of the inclined-plane 215aA of light-emitting component 230 and light-guide device 210 relative to sensing element 240 is 66.8 degree, relatively adjacent to the inclined-plane 215aA of sensing element 240 and light-guide device 210 relative to sensing element in two inclined-plane 215aA The supplementary angle of angle folded by 240 surface is 32.5 degree, and the base angle of groove 215A is 90 degree.In other embodiments, groove The angle of two apex angles of 215A can also overturn, or change according to design requirement, and be not limited.In addition, groove 215A Depth Y3A system determines according to above-mentioned angle.In the present embodiment, the depth Y3A of groove 215A is greater than going out for each light-emitting component 230 Distance H5 of the smooth surface to light-guide device 210 relative to the surface of sensing element 240, but not limited to this.
In the present embodiment, translucent material F2 is filled in groove 215A, the refractive index of this translucent material F2 is greater than leaded light The refractive index of element 210.Therefore, when the light beam L that light-emitting component 230 is issued is transferred to groove 215A, the light beam L of part will It is totally reflected by the inclined-plane 215aA of neighbouring light-emitting component 230, and partial light beam L can pass through the inclined-plane of neighbouring light-emitting component 230 215aA and towards far from sensing element 240 direction transmit.In this way, can be to avoid the light beam L that light-emitting component 230 is issued Direct irradiation reduces light interference to sensing element 240.
Figure 51 B is another diagrammatic cross-section of the groove of the detection device of one embodiment of the invention.1B referring to figure 5., Detection device 200-18 is similar with the detection device 200-12 of Figure 47 A.The main difference of the two is as described below.In detection device In 200-18, groove 215B is U-shaped groove.Specifically, groove 215B has opposite and two sides 146 being parallel to each other and bottom Face 148.According to the difference of production method, bottom surface 148 may be plane, inclined surface or curved surface.
U-shaped groove is other than it can change the conduct path of light beam by reflecting, also using neighbouring light-emitting component 230 Side 146 will be transmitted to the light beam total internal reflection of side 146, transmit light beam towards the direction far from sensing element 240.At this In embodiment, the depth Y3B of groove 215B is greater than the light-emitting surface of each light-emitting component 230 to light-guide device 210 relative to sensing The distance H5 on the surface of part 240 exists so as to be transferred to most of light beam of the groove 215B adjacent to the side of light-emitting component 230 146 It is transmitted by total internal reflection towards the direction far from sensing element 240 side 146.
In a preferred embodiment, corresponding to the width D 2 (such as the width D 2 of bottom surface 148) of groove 215B, groove 215B One of light-emitting component 230 to groove 215B distance D1 and sensing element 240 to groove 215B distance D3 all For the one third of the distance D of one of corresponding light-emitting component 230 to sensing element 240, but the present invention is not with this It is limited.
In the present embodiment, translucent material F2 is filled in groove 215B.The refractive index of translucent material F2 is less than guide-lighting member The refractive index of part 210, to generate total internal reflection.However, in other embodiments, translucent material F2 can also be omitted.
Figure 51 C to Figure 51 D is respectively two kinds of diagrammatic cross-sections again of the groove of the detection device of the embodiment of the present invention.It please join According to Figure 51 C and Figure 51 D, detection device 200-19,200-20 are similar with Figure 47 A, the detection device 200-12 of Figure 47 B.The two Main difference is as described below.In detection device 200-19,200-20, groove 215C, 215D are inverted trapezoidal groove.Specifically, There are two inclined-plane 215aB (or two inclined-plane 215aC) and bottom surfaces 148 for groove 215C (or groove 215D) tool.In the present embodiment, The inverted trapezoidal groove of detection device 200-19,200-20 is all the isosceles trapezoid of handstand, and but not limited to this.
Inverted trapezoidal groove is other than it can change the conduct path of light beam by reflecting, also using neighbouring light-emitting component 230 inclined-plane 215aB (or inclined-plane 215aC) will be transmitted to the light beam total internal reflection of inclined-plane 215aB (or inclined-plane 215aC), make light Shu Buhui is directly mapped to the sensing face of sensing element 240.In detection device 200-19,200-20, the depth of groove 215C, 215D Spend the distance that Y3C, H3D are less than surface of the light-emitting surface of each light-emitting component 230 to light-guide device 210 relative to sensing element 240 H5, so that the most of light beam for being transferred to the bottom surface 148 of groove 215C, 215D is turned in bottom surface 148 by total internal reflection, from Sensing face without being directly mapped to sensing element 240 (as shown in Figure 51 A).
In the present embodiment, translucent material F3 is filled in groove 215C, 215D, wherein the refractive index of translucent material F3 is small In the refractive index of light-guide device 210, to generate total internal reflection.
In addition, detection device 200-12~200-20 includes respective surface plasma body resonant vibration (Surface Plasmon Resonance) layer SPR.The function of the surface plasmon resonance layer SPR of detection device 200-2~200-11 with The function of the surface plasmon resonance layer SPR of aforementioned detection devices 200 is identical, just no longer repeats in this.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field Technical staff, without departing from the spirit and scope of the present invention, when can make a little change and retouching, therefore protection model of the invention It encloses as defined by the appended claims.

Claims (15)

1. a kind of detection device characterized by comprising
Light-guide device, comprising:
Top surface;And
Bottom surface, relative to the top surface;
First reflecting element is set on the bottom surface of the light-guide device;
Sensing element is configured at by the bottom surface of the light-guide device;
Light-emitting component, to issue light beam, wherein the light beam is reflected by first reflecting element and is transferred to the sensing Element;And
Surface plasmon resonance layer is set on the light-guide device, and to receive biopolymer, wherein the leaded light Element is between the surface plasmon resonance layer and the sensing element.
2. detection device according to claim 1, which is characterized in that the light-guide device further include:
Incidence surface is connected between the top surface and the bottom surface, wherein the incidence surface and the top surface accompany sharp angle α.
3. detection device according to claim 2, which is characterized in that the detection device is located in surrounding medium, and institute It states sharp angle α and meets following formula (1):
Wherein θiThe angle of the light-guide device, n are injected from the incidence surface for the light beam1For the refraction of the surrounding medium Rate, and n2For the refractive index of the light-guide device.
4. detection device according to claim 2, which is characterized in that the detection device is located in surrounding medium, and institute It states sharp angle α and meets following formula (2):
Wherein θiThe incident angle of the incidence surface, n are incident to for the light beam1For the refractive index of the surrounding medium, and n2For The refractive index of the light-guide device.
5. detection device according to claim 1, which is characterized in that further include:
Second reflecting element is configured at the bottom surface of the light-guide device, wherein the light beam is by first reflecting element And the second reflecting element reflection, and it is transferred to the sensing element.
6. detection device according to claim 1, which is characterized in that further include:
Translucent element is configured on the top surface of the light-guide device;
First optical cement is configured between the translucent element and the top surface of the light-guide device, the translucent element benefit It is connect with first optical cement with the top surface of the light-guide device;And
Second optical cement is configured between the bottom surface of the light-guide device and the sensing element, the sensing element benefit Connect with second optical cement with the bottom surface of the light-guide device, wherein the material of the light-guide device be different from it is described The material of first optical cement and/or second optical cement.
7. detection device according to claim 6, which is characterized in that the light-guide device is glass.
8. detection device according to claim 1, which is characterized in that the bottom surface of the light-guide device has light Portion, and the light out part is equipped with multiple anti-reflection micro-structures, wherein the light beam passes through at least one at least in the light-guide device Secondary total reflection and form the signal beams for investing the multiple anti-reflection micro-structure, and the signal beams pass through it is the multiple anti-reflection Micro-structure is to invest the sensing element.
9. detection device according to claim 8, which is characterized in that the light-guide device has the cirtical angle of total reflection, often The one anti-reflection micro-structure includes that the incidence angle of the signal beams is made to be less than the sensitive area of the cirtical angle of total reflection and make The incidence angle of the signal beams is greater than the backlight area of the cirtical angle of total reflection, and the area of the sensitive area is greater than the back The area in light area.
10. detection device according to claim 9, which is characterized in that each anti-reflection micro-structure is asymmetric pillar, The asymmetric pillar forms the first angle between the vertical reference surface with crest line, the sensitive area and by the crest line, The backlight area and the vertical reference surface form the second angle, and first angle is greater than second angle.
11. detection device according to claim 9, which is characterized in that the multiple anti-reflection microstructured ar-rangement at array, and Each anti-reflection micro-structure is eccentric lenticule, and the bias lenticule has a vertex, passes through any of the sensitive area The first angle is formed between the section of any and vertical reference surface by the vertex, passes through any point in the backlight area Section and the vertical reference surface formed the second angle, and first angle be greater than second angle.
12. detection device according to claim 1, which is characterized in that further include:
Substrate, the first reflecting element configuration is between the substrate and the light-guide device;And
Shade configures on the substrate and between the light-emitting component and the sensing element, wherein described first Reflecting element is between the shade and the sensing element, and the light-guide device covers the sensing element, described Light-emitting component, the shade and first reflecting element.
13. detection device according to claim 1, which is characterized in that first reflecting element and the guide-lighting member Multiple micro-structures are formed on the surface of at least one of them of part.
14. detection device according to claim 1, which is characterized in that first reflecting element includes spaced Multiple reflecting parts.
15. detection device according to claim 1, which is characterized in that further include:
Substrate, wherein the light-guide device, first reflecting element, the sensing element and the light-emitting component are set to institute It states on substrate;
A plurality of connecting line, is connected between the substrate and the sensing element and the substrate and the light-emitting component Between;And
Wall body structure, configuration on the substrate, wherein the wall body structure and the substrate formed accommodate the light-emitting component, The accommodating space of the sensing element and first reflecting element.
CN201810696924.8A 2017-06-29 2018-06-29 Detection device Active CN109214262B (en)

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US62/574,222 2017-10-19
US16/008,037 2018-06-14
US16/008,037 US10460188B2 (en) 2014-08-26 2018-06-14 Bio-sensing apparatus

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