CN109211342A - 一种气流流量计、mems硅基温敏芯片及其制备方法 - Google Patents
一种气流流量计、mems硅基温敏芯片及其制备方法 Download PDFInfo
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- CN109211342A CN109211342A CN201811032191.4A CN201811032191A CN109211342A CN 109211342 A CN109211342 A CN 109211342A CN 201811032191 A CN201811032191 A CN 201811032191A CN 109211342 A CN109211342 A CN 109211342A
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- temperature
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 238000003466 welding Methods 0.000 claims abstract description 66
- 230000006698 induction Effects 0.000 claims abstract description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 56
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 43
- 229910052697 platinum Inorganic materials 0.000 claims description 27
- 239000000377 silicon dioxide Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- 235000012239 silicon dioxide Nutrition 0.000 claims description 15
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 8
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 206010022000 influenza Diseases 0.000 claims description 2
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- 238000010586 diagram Methods 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
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- 238000013461 design Methods 0.000 description 5
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 241000209094 Oryza Species 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
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- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Fluid Mechanics (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201811032191.4A CN109211342B (zh) | 2018-09-05 | 2018-09-05 | 一种气流流量计、mems硅基温敏芯片及其制备方法 |
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CN201811032191.4A CN109211342B (zh) | 2018-09-05 | 2018-09-05 | 一种气流流量计、mems硅基温敏芯片及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN109211342A true CN109211342A (zh) | 2019-01-15 |
CN109211342B CN109211342B (zh) | 2020-03-20 |
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CN201811032191.4A Active CN109211342B (zh) | 2018-09-05 | 2018-09-05 | 一种气流流量计、mems硅基温敏芯片及其制备方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110806432A (zh) * | 2019-11-19 | 2020-02-18 | 清华大学 | 微热板和微热板的制作方法 |
CN113295224A (zh) * | 2021-05-25 | 2021-08-24 | 中国科学院上海微系统与信息技术研究所 | 气液两用热式流量传感器及其制备方法 |
CN113804726A (zh) * | 2021-08-11 | 2021-12-17 | 北京航空航天大学 | 用于露点测量的振动-测温复合型谐振感湿芯片的制作方法 |
Citations (14)
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US4744246A (en) * | 1986-05-01 | 1988-05-17 | Busta Heinz H | Flow sensor on insulator |
JPH04230808A (ja) * | 1990-04-13 | 1992-08-19 | Yamatake Honeywell Co Ltd | ダイアフラムセンサ |
EP0629862A1 (de) * | 1993-06-18 | 1994-12-21 | Siemens Aktiengesellschaft | Vorrichtung zur Messung einer radialen Gas- oder Flüssigkeitsströmung mit einer Wheatstone-Brücke von vier temperaturempfindlichen Widerständen |
CN1174984A (zh) * | 1996-08-23 | 1998-03-04 | 李韫言 | 微细加工的热式流量传感器 |
CN1197200A (zh) * | 1997-01-16 | 1998-10-28 | 株式会社日立制作所 | 测量元件和使用该测量元件的空气质量流量计 |
CN1538934A (zh) * | 2001-07-31 | 2004-10-20 | ����Ĭ������˹�����ҿ�ѧ�о����� | 制造悬浮多孔硅微结构的方法及其在气体传感器中的应用 |
CN1650175A (zh) * | 2002-05-02 | 2005-08-03 | 株式会社山武 | 流速传感器 |
JP2011209035A (ja) * | 2010-03-29 | 2011-10-20 | Yamatake Corp | センサ |
CN102305650A (zh) * | 2010-04-19 | 2012-01-04 | 霍尼韦尔国际公司 | 具有顶帽的鲁棒传感器 |
CN204128607U (zh) * | 2014-10-31 | 2015-01-28 | 汪硕 | 一种热膜式流量传感芯片 |
CN105806430A (zh) * | 2016-04-08 | 2016-07-27 | 东南大学 | 一种基于mems工艺的二维薄膜气体流量传感器及其加工方法 |
CN106662477A (zh) * | 2014-08-22 | 2017-05-10 | 日立汽车系统株式会社 | 传感装置 |
CN108027267A (zh) * | 2015-09-30 | 2018-05-11 | 三美电机株式会社 | 流量传感器 |
CN108139254A (zh) * | 2015-08-03 | 2018-06-08 | 新纳公司 | Mems流量传感器 |
-
2018
- 2018-09-05 CN CN201811032191.4A patent/CN109211342B/zh active Active
Patent Citations (14)
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US4744246A (en) * | 1986-05-01 | 1988-05-17 | Busta Heinz H | Flow sensor on insulator |
JPH04230808A (ja) * | 1990-04-13 | 1992-08-19 | Yamatake Honeywell Co Ltd | ダイアフラムセンサ |
EP0629862A1 (de) * | 1993-06-18 | 1994-12-21 | Siemens Aktiengesellschaft | Vorrichtung zur Messung einer radialen Gas- oder Flüssigkeitsströmung mit einer Wheatstone-Brücke von vier temperaturempfindlichen Widerständen |
CN1174984A (zh) * | 1996-08-23 | 1998-03-04 | 李韫言 | 微细加工的热式流量传感器 |
CN1197200A (zh) * | 1997-01-16 | 1998-10-28 | 株式会社日立制作所 | 测量元件和使用该测量元件的空气质量流量计 |
CN1538934A (zh) * | 2001-07-31 | 2004-10-20 | ����Ĭ������˹�����ҿ�ѧ�о����� | 制造悬浮多孔硅微结构的方法及其在气体传感器中的应用 |
CN1650175A (zh) * | 2002-05-02 | 2005-08-03 | 株式会社山武 | 流速传感器 |
JP2011209035A (ja) * | 2010-03-29 | 2011-10-20 | Yamatake Corp | センサ |
CN102305650A (zh) * | 2010-04-19 | 2012-01-04 | 霍尼韦尔国际公司 | 具有顶帽的鲁棒传感器 |
CN106662477A (zh) * | 2014-08-22 | 2017-05-10 | 日立汽车系统株式会社 | 传感装置 |
CN204128607U (zh) * | 2014-10-31 | 2015-01-28 | 汪硕 | 一种热膜式流量传感芯片 |
CN108139254A (zh) * | 2015-08-03 | 2018-06-08 | 新纳公司 | Mems流量传感器 |
CN108027267A (zh) * | 2015-09-30 | 2018-05-11 | 三美电机株式会社 | 流量传感器 |
CN105806430A (zh) * | 2016-04-08 | 2016-07-27 | 东南大学 | 一种基于mems工艺的二维薄膜气体流量传感器及其加工方法 |
Non-Patent Citations (2)
Title |
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彭杰纲 等: "基于MEMS技术的微型流量传感器的研究进展", 《力学进展》 * |
郑志霞: "《硅微机械传感器》", 31 December 2012, 浙江大学出版社 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110806432A (zh) * | 2019-11-19 | 2020-02-18 | 清华大学 | 微热板和微热板的制作方法 |
CN113295224A (zh) * | 2021-05-25 | 2021-08-24 | 中国科学院上海微系统与信息技术研究所 | 气液两用热式流量传感器及其制备方法 |
CN113804726A (zh) * | 2021-08-11 | 2021-12-17 | 北京航空航天大学 | 用于露点测量的振动-测温复合型谐振感湿芯片的制作方法 |
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CN109211342B (zh) | 2020-03-20 |
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Address after: 430205, No. three, No. 3, Fenghuang garden, Phoenix Industrial Park, East Lake New Technology Development Zone, Hubei, Wuhan Applicant after: Sifang Optoelectronic Co.,Ltd. Applicant after: Institute of Microelectronics of the Chinese Academy of Sciences Address before: 430000, No. three, No. 3, Fenghuang garden, Phoenix Industrial Park, East Lake New Technology Development Zone, Hubei, Wuhan Applicant before: Wuhan Cubic Optoelectronics Co.,Ltd. Applicant before: Institute of Microelectronics of the Chinese Academy of Sciences |
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