CN109207926B - Enhanced aluminum-plated film and production process thereof - Google Patents
Enhanced aluminum-plated film and production process thereof Download PDFInfo
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- CN109207926B CN109207926B CN201811357123.5A CN201811357123A CN109207926B CN 109207926 B CN109207926 B CN 109207926B CN 201811357123 A CN201811357123 A CN 201811357123A CN 109207926 B CN109207926 B CN 109207926B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
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Abstract
The invention relates to an enhanced aluminizer and a production process thereof. The enhanced aluminum-plated film comprises a base film, wherein an enhanced bonding reaction layer formed by aluminum oxide and an aluminum-plated layer formed by metal aluminum are sequentially evaporated on the base film, the thickness of the base film is 11-13 micrometers, the thickness of the enhanced bonding reaction layer is 2-4 nanometers, and the thickness of the aluminum-plated layer is 29-31 nanometers. In the invention, a high adhesion layer, namely a bonding enhancement reaction layer, for connecting the aluminum plating layer and the base film is formed between the aluminum plating layer and the base film during vapor deposition. The enhanced bonding reaction layer has the functions of obviously improving the adhesion of the aluminum coating and increasing the barrier property. After the packaging structure is compounded with other materials, the aluminum coating is firm and does not fall off, so that the peeling strength between the packaging structure and other materials is improved, the packaging structure is not easy to delaminate, and the stability of the packaging structure is ensured.
Description
Technical Field
The invention belongs to the field of film materials, and particularly relates to an enhanced aluminum-plated film and a production process thereof.
Background
The packaging market is demanding more and more on materials, especially on barrier films. The barrier film is generally vacuum coated, and other barrier films comprise a PVDC coating film and a multi-layer co-extrusion film, but the PVDC coating film generates dioxin after being burnt to damage the environment, and the multi-layer co-extrusion film is high in price. The main disadvantages and shortcomings of the conventional vacuum coating are as follows:
1. the aluminum plating layer has low fastness and small peeling strength after being compounded with other materials (including dry compounding, extrusion compounding and solvent-free compounding). The transfer and falling of the aluminum plating layer are caused by insufficient fastness of the aluminum plating layer, and two composite base materials are layered when the aluminum plating layer is serious, so that serious hidden quality troubles are brought to the packaging material.
2. The barrier property is poor, the moisture permeability and the oxygen permeability data can not meet the requirements of packaging products, and meanwhile, in order to pursue the barrier property, the thickness of the aluminum plating layer is increased, and the influence on the fastness of the aluminum plating layer is larger.
3. The surface treatment value is seriously declined, and the composite peeling strength does not reach the standard or even delaminates due to insufficient surface tension along with the prolonging of the storage time.
Disclosure of Invention
In order to solve the technical problem, the invention provides an enhanced aluminum-plated film and a production process thereof.
In order to realize the purpose of the invention, the invention adopts the following technical scheme:
an enhanced aluminum-plated film comprises a base film, wherein an enhanced bonding reaction layer formed by aluminum oxide and an aluminum-plated layer formed by metal aluminum are sequentially evaporated on the base film, the thickness of the base film is 11-13 micrometers, the thickness of the enhanced bonding reaction layer is 2-4 nanometers, and the thickness of the aluminum-plated layer is 29-31 nanometers.
The preferred scheme is as follows: the thickness of the basal membrane is 12 micrometers, the thickness of the enhanced bonding reaction layer is 3 nanometers, and the thickness of the aluminum-plated layer is 30 nanometers.
Further scheme: the base film is any one of a PET film, a BOPP film, a CPP film and a PE film.
The production process of the enhanced aluminizer comprises the following steps:
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by using a radio frequency plasma system, wherein the power of the radio frequency plasma system is 2-20kW, the magnetic field intensity is 20-80 gauss, and the frequency is 50-120 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1400-1600 ℃, then sending the aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9 percent into the upper part of the evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen input is 0.5-51/min, and the evaporation rate of aluminum is 3-10 g/min; the power of the microwave plasma system is 1.5-5kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
and 3, cooling and rolling.
The invention has the beneficial effects that:
(1) in the invention, a high adhesion layer, namely a bonding enhancement reaction layer, for connecting the aluminum plating layer and the base film is formed between the aluminum plating layer and the base film during vapor deposition. The enhanced bonding reaction layer has the functions of obviously improving the adhesion of the aluminum coating and increasing the barrier property. After the packaging structure is compounded with other materials, the aluminum coating is firm and does not fall off, so that the peeling strength between the packaging structure and other materials is improved, the packaging structure is not easy to delaminate, and the stability of the packaging structure is ensured.
(2) The plasma treatment principle of the invention is that argon is adopted to start a radio frequency plasma treatment system, electrons and photons bombard the surface of a base film to cause the coupling of the surface of the base film, so as to improve the adhesive force and the enhancement of the adhesive force of the surface of the base film, the formation of a barrier layer and the improvement of heat resistance. In addition, the surface of the material is removed to absorb gas, so that better permeability is achieved.
And introducing process gas oxygen in the ionization oxidation deposition process, and regulating the flow of the oxygen through a flow regulator according to different running speeds so as to meet the requirement of sufficient oxidation. Ionization process gas O of microwave plasma system2And aluminum atoms, forming aluminum ions and oxygen ions, enabling the oxygen ions and the aluminum ions to fully react, and enabling the aluminum vapor to be combined with the high-activity oxygen ions to form a bonding-enhanced reaction layer. The aluminum vapor is then directly bonded to the enhanced bonding reaction layer to form an aluminum plating layer.
Drawings
FIG. 1 is a schematic view of an enhanced aluminum-plated film structure.
FIG. 2 is a schematic diagram illustrating the evaporation principle of an enhanced aluminizer.
FIG. 3 is a block diagram of the production process of the present invention.
FIG. 4 is a bar graph comparing the adhesion of the aluminized layer between the enhanced aluminized film and the conventional aluminized film.
FIGS. 5 and 6 are schematic diagrams showing the surface tension values of the aluminized layers of the enhanced aluminized film and the ordinary aluminized film changing with time.
The designations in the drawings have the following meanings:
1-a base film; 2-enhanced binding reaction layer; 3-plating an aluminum layer.
Detailed Description
The technical scheme of the invention is more specifically explained by combining the following embodiments:
the production process of the enhanced aluminizer of the invention is as follows:
example 1
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by using a radio frequency plasma system, wherein the power of the radio frequency plasma system is 15kW, the magnetic field intensity is 50 gauss, and the frequency is 80 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1500 ℃, then conveying an aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9% above an evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen input is 25/min, and the evaporation rate of the aluminum is 5 g/min; the power of the microwave plasma system is 3kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
the invention feeds the aluminum wire by the direct current stepping motor, and the voltage of the aluminum wire stepping motor is adjusted according to the different running speeds to meet the requirement of evaporation. The multi-component boron nitride resistance evaporator is used for melting and evaporating the aluminum wire, and the stable and continuous evaporation of the aluminum wire is achieved by adjusting the voltage of the evaporation boat according to the difference of the operation speed.
And (3) detecting the deposition amount of aluminum: through the on-line measuring system, can monitor the coating by vaporization process at any time, in case the coating by vaporization appears the unstable condition, the system can give the signal feedback to control system, and the system can adjust automatically. In addition, the system also has a manual control mode, and in the mode, an operator can observe the evaporation condition through the display screen and manually adjust the problems which possibly occur.
And 3, cooling and rolling. The thickness of the enhanced bonding reaction layer in the obtained enhanced aluminum plating film is 3 nanometers, and the thickness of the aluminum plating layer is 30 nanometers.
The evaporated film is subjected to radio frequency plasma treatment and thermal evaporation, so that the temperature is high, and the film needs to be cooled in time. The invention uses the inner cooling drum (the temperature can reach-15 ℃) to rapidly cool the film, thereby ensuring that the film is not overheated. The finished product after evaporation is rolled in a reel shape so as to be convenient for subsequent procedures such as rewinding and slitting.
Example 2
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by utilizing a radio frequency plasma system, wherein the power of the radio frequency plasma system is 2kW, the magnetic field intensity is 20 gauss, and the frequency is 50 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1400 ℃, then conveying an aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9% above an evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen introduction amount is 0.5/min, and the evaporation rate of aluminum is 3 g/min; the power of the microwave plasma system is 1.5kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
and 3, cooling and rolling. The thickness of the enhanced bonding reaction layer in the obtained enhanced aluminum plating film is 3 nanometers, and the thickness of the aluminum plating layer is 30 nanometers.
Example 3
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by using a radio frequency plasma system, wherein the radio frequency plasma system has the power of 20kW, the magnetic field intensity of 80 gauss and the frequency of 120 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1600 ℃, then conveying an aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9% above an evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen input is 51/min, and the evaporation rate of the aluminum is 10 g/min; the power of the microwave plasma system is 5kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
and 3, cooling and rolling. The thickness of the enhanced bonding reaction layer in the obtained enhanced aluminum plating film is 3 nanometers, and the thickness of the aluminum plating layer is 30 nanometers.
Example 4
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by using a radio frequency plasma system, wherein the radio frequency plasma system has the power of 16kW, the magnetic field intensity of 40 gauss and the frequency of 90 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1500 ℃, then conveying an aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9% above an evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen input is 40/min, and the evaporation rate of the aluminum is 8 g/min; the power of the microwave plasma system is 4kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
and 3, cooling and rolling. The thickness of the enhanced bonding reaction layer in the obtained enhanced aluminum plating film is 3 nanometers, and the thickness of the aluminum plating layer is 30 nanometers.
The properties of the reinforced aluminized film produced by the invention are described as follows:
1. adhesion of aluminized layer
The fastness, i.e. adhesion, of the aluminum plating layer in the enhanced aluminum plating film of the invention and the common aluminum plating film is compared under various base film materials (including a PET film, a BOPP film, a CPP film, and a PE film) as shown in FIG. 4, and as can be seen from FIG. 4: the adhesive force of the aluminized layer in the enhanced aluminized film is totally superior to that of the aluminized layer in the common aluminized film. The invention can achieve higher adhesive force with the solvent-free composite effect of other BOPP, PET, NY, PE and CPP films.
2. Composite strength
As shown in table 1 below: the strength of the enhanced aluminizer and the common aluminizer of the invention after being compounded with various materials is compared:
TABLE 1
| Composite material | Common aluminizer (base film PET film) | The invention relates to an enhanced aluminizer (the basal membrane is a PET film) |
| PET | 1.0N-1.5N/15mm | 2.5N-3.5N/15mm |
| BOPP | 0.5N-1.0N/15mm | 1.5N-2.5N/15mm |
| Al | 2.0N-3.0N/15mm | 5.0N-6.0N/15mm |
From the above table, it can be seen that: the strength of the enhanced aluminizer compounded with various materials is obviously improved.
3. Surface treatment value
As shown in fig. 5: the surface treatment values of the enhanced aluminizer and the common aluminizer change with time by taking the CPP film as a base film.
As shown in fig. 6: the surface treatment values of the enhanced aluminized film and the common aluminized film change with time by taking the BOPP film as a base film.
As can be seen from fig. 5 and 6: the surface treatment value of the aluminum plating layer of the enhanced aluminum plating film is higher than that of the common aluminum plating film, and the surface treatment value of the aluminum plating layer of the common aluminum plating film is seriously declined. That is, it is shown that: the peel strength of the invention can be effectively improved after the invention is compounded with other materials, thereby avoiding the layering phenomenon of the packaging film.
Claims (3)
1. The production process of the enhanced aluminizer is characterized by comprising a base film, wherein an enhanced bonding reaction layer formed by alumina and an aluminized layer formed by metal aluminum are sequentially evaporated on the base film, the thickness of the base film is 11-13 micrometers, the thickness of the enhanced bonding reaction layer is 2-4 nanometers, and the thickness of the aluminized layer is 29-31 nanometers;
the production process comprises the following steps:
step 1, unwinding a base film;
and 2, carrying out evaporation treatment under a vacuum condition:
step 2-1, plasma treatment: carrying out plasma treatment on the surface of the base film by using a radio frequency plasma system, wherein the power of the radio frequency plasma system is 2-20kW, the magnetic field intensity is 20-80 gauss, and the frequency is 50-120 HZ; argon is used as plasma gas, and the introduction amount of the argon is 250 sccm;
step 2-2, ionization oxidation deposition: heating the evaporation boat to 1400-1600 ℃, then sending the aluminum wire to the surface of the evaporation boat, and introducing oxygen with the purity of more than 99.9 percent into the upper part of the evaporation area; a microwave plasma system for ionizing oxygen and aluminum vapor is arranged above the evaporation zone, so that aluminum oxide is deposited on the surface of the plastic film to form a bonding enhancement reaction layer; the oxygen input is 0.5-51/min, and the evaporation rate of aluminum is 3-10 g/min; the power of the microwave plasma system is 1.5-5kW, and the microwave working frequency is 2450 +/-50 MHz; then stopping introducing oxygen into the evaporation area, and depositing aluminum vapor on the surface of the enhanced bonding reaction layer to form an aluminum coating;
and 3, cooling and rolling.
2. The process for producing an enhanced aluminum plating film according to claim 1, wherein: the thickness of the basal membrane is 12 micrometers, the thickness of the enhanced bonding reaction layer is 3 nanometers, and the thickness of the aluminum-plated layer is 30 nanometers.
3. The process for producing an enhanced aluminum plating film according to claim 1, wherein: the base film is any one of a PET film, a BOPP film, a CPP film and a PE film.
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| CN110468375A (en) * | 2019-07-31 | 2019-11-19 | 张健 | A kind of flexibility barrier film and preparation method thereof |
| CN110605892A (en) * | 2019-09-27 | 2019-12-24 | 黄山永新股份有限公司 | Large-gram-weight liquid self-supporting bag packaging material and preparation method thereof |
| CN111041446A (en) * | 2019-12-31 | 2020-04-21 | 广东铭丰包装材料有限公司 | Air supply device of aluminizing machine |
| CN112831754A (en) * | 2020-12-31 | 2021-05-25 | 佛山市彩龙镀膜包装材料有限公司 | High-adhesion polyester aluminized film coating process |
| CN113912894B (en) * | 2021-09-16 | 2022-06-14 | 佛山市彩龙镀膜包装材料有限公司 | Transparent high-barrier polyester aluminum oxide-plated film and preparation method thereof |
| CN114044933B (en) * | 2021-11-25 | 2022-06-10 | 佛山市彩龙镀膜包装材料有限公司 | Sandwich-structure aluminum-plated film and preparation method thereof |
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| CN1995446A (en) * | 2006-12-13 | 2007-07-11 | 黄山永新股份有限公司 | Transparent obstructive alumina film production process |
| CN108337916A (en) * | 2015-06-16 | 2018-07-27 | 3M创新有限公司 | Obstruct membrane, evacuated insulation panel and the moisture barrier bag for using Obstruct membrane, evacuated insulation panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1995446A (en) * | 2006-12-13 | 2007-07-11 | 黄山永新股份有限公司 | Transparent obstructive alumina film production process |
| CN108337916A (en) * | 2015-06-16 | 2018-07-27 | 3M创新有限公司 | Obstruct membrane, evacuated insulation panel and the moisture barrier bag for using Obstruct membrane, evacuated insulation panel |
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