CN109206912A - 一种绝缘导热硅脂组合物 - Google Patents
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Abstract
本发明公开了一种绝缘导热硅脂组合物。其主要组成为硅油、偶联剂以及导热填料。该绝缘导热硅脂设计为偶联剂与包覆于导热填料的表面,增强导热填料与硅油间的兼容性,降低界面热阻;导热粉体进行粒径级配优化,形成导热链。本发明的产品具有热导率高、流动好的特点,且较高温度下的可靠性高。
Description
技术领域
本发明涉及一种绝缘导热硅脂组合物。
背景技术
随着微电子技术的功耗和功率密度不断增加,散热已成为电子元器件及电路板技术进步的关键。研究表明,单个电子元件的工作温度升高2℃,可靠性降低10%。由此开发出诸多散热技术及材料,其中导热界面材料因为能有效降低热源和散热材料之间的界面热阻而得到广泛应用。导热硅脂,又称散热膏,是一种膏状的导热界面材料,能有效降低界面热阻,及时排除电子设备使用过程中产生的大量热量,在电子产品的小型化、密集化、可靠性等方面具有重要作用。根据使用工况,硅脂又分为导电导热型和绝缘导热型,本发明涉及一种绝缘导热硅脂组合物。
与其他专利相比,本专利通过优化填料粒度级配、选择适合的偶联剂种类及用量,可实现90vol%以上的填充量;通过调整填料组分或填料量可实现导热系数的连续变化。
发明内容
本发明的目的在于提供一种绝缘导热硅脂组合物,其组成为:硅油5~20wt%、偶联剂0.5~1%、余量为导热填料;其中偶联剂包覆在导热填料的表面,再与硅油混合;其中所述的导热填料为4级配料,可以保证实现较高的填充率以及较低的黏度。上述硅油是指二甲基硅油、羟基硅油、乙烯基硅油、含氢硅油中的一种或两种以上混合物;上述偶联剂为KH550、KH570、KH590、钛酸酯、硬脂酸中的一种;上述导热填料可以是指氧化铝、氧化硅、氧化锌、氧化铍等金属氧化物陶瓷粉体、也可以是氮化硅、氮化铝、氮化硼等氮化物陶瓷粉体或碳化硅、金刚石中的一种或多种。上述导热填料采用4级配料,15.1~50μm、5.1~15μm、1.1~5μm、<1μm,其中15.1~50μm、5.1~15μm、1.1~5μm符合“两头大、中间小”的原则,且<1μm的体积占比不高于2%。该绝缘导热硅胶的制备方法为,将偶联剂与级配好的导热粉体进行充分混合,实现偶联剂在导热填料表面的包覆;二是处理后的导热粉体与硅油的充分混合。混合的实现方式可以为搅拌、球磨、研磨等。
下面结合实施例,说明本发明的具体内容:
实施例1:将平均粒径为20μm、10μm、3μm及0.7μm的氮化铝粉体,按体积比40:20:38:2的比例在行星球磨机中进行湿法混料,介质为无水乙醇,然后加入总料量(无水乙醇不计入)1wt%的硬脂酸,直至完成偶联剂对导热填料的包覆。将处理后的导热填料烘干,并按导热填料与二甲基硅油及其他添加剂在三辊混料机中混合均匀,其中导热填料占总料量的95vol%。经过以上步骤,即获得了导热系数达4.7W/(m·K)的绝缘导热硅胶。
实施例2:将平均粒径为25μm的氮化硼粉体、平均粒径为12μm的氧化铝粉体、平均粒径为3μm的氧化锌粉体及平均粒径为0.3μm的金刚石粉体,按体积比50:20:29:1的比例在行星球磨机中进行湿法混料,介质为无水乙醇,然后加入总料量(无水乙醇不计入)0.7wt%的KH570,直至完成偶联剂对导热填料的包覆。将处理后的导热填料烘干,并按导热填料与二甲基硅油及其他添加剂在三辊混料机中混合均匀,其中导热填料占总料量的80vol%。经过以上步骤,即获得了导热系数达3.2W/(m·K)的绝缘导热硅胶。
实施例3:将平均粒径为15μm的氮化铝粉体、平均粒径为8μm的氧化铝粉体、平均粒径为3μm的氧化锌粉体及平均粒径为0.5μm的氮化硅粉体,按体积比45:25:29:1的比例在行星球磨机中进行湿法混料,介质为无水乙醇,然后加入总料量(无水乙醇不计入)1wt%的KH550,直至完成偶联剂对导热填料的包覆。将处理后的导热填料烘干,并按导热填料与二甲基硅油及其他添加剂在三辊混料机中混合均匀,其中导热填料占总料量的85vol%。经过以上步骤,即获得了导热系数达4.2W/(m·K)的绝缘导热硅胶。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (6)
1.一种绝缘导热硅脂组合物,其组成为:硅油5~20wt%、偶联剂0.5~1%、余量为导热填料;其中偶联剂包覆在导热填料的表面,再与硅油混合;其中所述的导热填料为4级配料,可以保证实现较高的填充率以及较低的黏度。
2.根据权利要求1所述的一种绝缘导热硅脂组合物,其特征在于所述硅油是指二甲基硅油、羟基硅油、乙烯基硅油、含氢硅油中的一种或两种以上混合物;所述偶联剂为KH550、KH570、KH590、钛酸酯、硬脂酸中的一种;所述导热填料是指金属氧化物陶瓷粉体、氮化物陶瓷粉体、碳化硅、金刚石中的一种或多种。
3.根据权利要求2所述的一种绝缘导热硅脂组合物,其特征在于金属氧化物陶瓷粉体包括氧化铝、氧化硅、氧化锌、氧化铍,氮化物陶瓷粉体包括氮化硅、氮化铝、氮化硼等。
4.根据权利要求1所述的一种绝缘导热硅脂组合物,其特征在于所述的导热填料4级配料,为15.1~50μm、5.1~15μm、1.1~5μm、<1μm,其中15.1~50μm、5.1~15μm、1.1~5μm符合“两头大、中间小”的原则,且<1μm的体积占比不高于2%。
5.根据权利要求1所述的一种绝缘导热硅脂组合物,其特征在于其制备主要包括两个步骤:一是将级配好的导热粉体与偶联剂充分混合,实现偶联剂在导热填料表面的包覆;二是处理后的导热粉体与硅油的充分混合。
6.按照权利要求1所述的导热硅脂组合物,其特征在于所述的导热硅脂组合物还含有稳定剂、阻燃剂、着色剂或触变剂。
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110003659A (zh) * | 2019-04-26 | 2019-07-12 | 四川无限电科技有限公司 | 一种导热硅脂 |
CN110157388A (zh) * | 2019-05-31 | 2019-08-23 | 昆山兆科电子材料有限公司 | 一种高导热膏及其制备方法 |
CN111471306A (zh) * | 2020-05-29 | 2020-07-31 | 深圳市立凡硅胶制品有限公司 | 一种用于热界面填缝的导热硅胶泥 |
CN111534358A (zh) * | 2020-05-09 | 2020-08-14 | 中山市特好德润滑科技有限公司 | 一种导热润滑脂及其制备方法和应用 |
CN111849169A (zh) * | 2020-07-14 | 2020-10-30 | 广东乐普泰新材料科技有限公司 | 一种导热硅脂及其制备方法 |
CN112266618A (zh) * | 2020-10-13 | 2021-01-26 | 无锡吉仓纳米材料科技有限公司 | 一种复合导热网络的智能导热硅凝胶及其制备方法 |
CN114350027A (zh) * | 2021-12-21 | 2022-04-15 | 浙江新安化工集团股份有限公司 | 一种具有高补强及导热双功能的粉体及制备方法 |
CN115058232A (zh) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | 一种低成本导热膏的制备方法 |
CN115216153A (zh) * | 2022-08-29 | 2022-10-21 | 北京中石伟业科技股份有限公司 | 一种高性能导热硅脂及其制备方法和应用 |
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2017
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110003659A (zh) * | 2019-04-26 | 2019-07-12 | 四川无限电科技有限公司 | 一种导热硅脂 |
CN110157388A (zh) * | 2019-05-31 | 2019-08-23 | 昆山兆科电子材料有限公司 | 一种高导热膏及其制备方法 |
CN111534358A (zh) * | 2020-05-09 | 2020-08-14 | 中山市特好德润滑科技有限公司 | 一种导热润滑脂及其制备方法和应用 |
CN111534358B (zh) * | 2020-05-09 | 2022-03-29 | 中山市特好德润滑科技有限公司 | 一种导热润滑脂及其制备方法和应用 |
CN111471306A (zh) * | 2020-05-29 | 2020-07-31 | 深圳市立凡硅胶制品有限公司 | 一种用于热界面填缝的导热硅胶泥 |
CN111849169A (zh) * | 2020-07-14 | 2020-10-30 | 广东乐普泰新材料科技有限公司 | 一种导热硅脂及其制备方法 |
CN112266618A (zh) * | 2020-10-13 | 2021-01-26 | 无锡吉仓纳米材料科技有限公司 | 一种复合导热网络的智能导热硅凝胶及其制备方法 |
CN114350027A (zh) * | 2021-12-21 | 2022-04-15 | 浙江新安化工集团股份有限公司 | 一种具有高补强及导热双功能的粉体及制备方法 |
CN115058232A (zh) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | 一种低成本导热膏的制备方法 |
CN115216153A (zh) * | 2022-08-29 | 2022-10-21 | 北京中石伟业科技股份有限公司 | 一种高性能导热硅脂及其制备方法和应用 |
CN115216153B (zh) * | 2022-08-29 | 2023-10-17 | 北京中石伟业科技股份有限公司 | 一种高性能导热硅脂及其制备方法和应用 |
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