CN109192697A - 一种柔性薄膜绷紧固定装置 - Google Patents

一种柔性薄膜绷紧固定装置 Download PDF

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CN109192697A
CN109192697A CN201810995428.2A CN201810995428A CN109192697A CN 109192697 A CN109192697 A CN 109192697A CN 201810995428 A CN201810995428 A CN 201810995428A CN 109192697 A CN109192697 A CN 109192697A
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高国涵
范斌
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Institute of Optics and Electronics of CAS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

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Abstract

本发明提供了一种柔性薄膜绷紧固定装置,包括固定工作台、压膜板、上压力板、下压力板、升降台、顶螺座、下螺座、三套旋轮、直线轴承组、立柱组、顶杆组、底台、支座、顶板,还包括薄膜主框架、压膜环、光栅位移计、压力传感器组。其中固定工作台承载自由薄膜,转动顶螺座上的上旋轮驱动压膜板将薄膜边缘进行圆对称夹持在固定工作台上,转动下螺座上的下旋轮驱动升降台使预置其上的薄膜主框架上升将薄膜顶起绷紧,转动顶螺座上的中旋轮驱动下压力板使预置其下的压膜环下降与薄膜框架配合将薄膜锁死,光栅位移计检测升降台位移,压力传感器组监测薄膜应力。本发明的装置适用于将柔性薄膜均匀绷紧,以及通过薄膜主框架和压膜环将柔性薄膜固定。

Description

一种柔性薄膜绷紧固定装置
技术领域
本发明属于柔性衬底微细加工领域,具体涉及一种柔性薄膜绷紧固定装置。
背景技术
在半导体微细加工领域,衬底普遍采用平面的刚性衬底,如硅和玻璃。光刻工艺中的涂胶、曝光等工艺和设备均对衬底的平面度有较高要求,然而柔性薄膜衬底由于硬度较低、面形随机,无法与这些工艺和设备兼容,限制了微细加工工艺与设备在柔性薄膜衬底上的使用。
发明内容
为了实现在柔性薄膜衬底上实现微细加工,与现有微细加工工艺及设备兼容,本发明提供一种柔性薄膜绷紧固定装置。
本发明解决其技术问题所采取的技术方案是:
本发明的柔性薄膜绷紧固定装置,所述的装置包括顶板、上旋轮、压力传感器组、中旋轮、下压力板、压膜板、薄膜主框架、立柱组、光栅位移计、底台、支座、顶螺座、上旋轮卡环、上压力板、顶杆组、直线轴承组、压膜环、固定工作台、升降台、下旋轮、下螺座;其连接关系是,所述的底台、立柱组和顶板连接组合为静定框架,并与支座连接使固定工作台处于方便操作的高度;下螺座与底台连接,顶螺座与顶板连接,上旋轮、中旋轮与顶螺座螺纹连接,下旋轮与下螺座螺纹连接;上压力板中心通过上旋轮卡环与上旋轮相连,上压力板边缘通过直线轴承组与立柱组相连,顶杆组的顶端有压力传感器组并与上压力板连接,顶杆组底端和压膜板相连;下压力板中心与中旋轮连接,下压力板边缘通过直线轴承组与立柱组相连,压膜环通过螺丝悬于下压力板底面;固定工作台中心镂空,边缘与立柱连接,升降台与下旋轮连接,光栅位移计与升降台相连监测其位移,薄膜主框架置于升降台上表面。
其中,所述的上旋轮、上压力板、中旋轮、下压力板、压膜环、下旋轮、升降台和薄膜主框架为同轴心设置。
本发明的原理:本装置所述的固定工作台承载自由薄膜,转动顶螺座上的上旋轮驱动压膜板将薄膜边缘进行圆对称夹持在固定工作台上,转动下螺座上的下旋轮驱动升降台使预置其上的薄膜主框架上升将薄膜顶起绷紧,转动顶螺座上的中旋轮驱动下压力板使预置其下的压膜环下降与薄膜框架配合将薄膜锁死,通过光栅位移计测量升降台位移控制薄膜预紧力,通过压力传感器组监测压膜板与固定工作台间正压力控制薄膜最大静摩擦力。本发明的装置适用于将柔性薄膜均匀绷紧,以及通过薄膜主框架和压膜环将柔性薄膜固定。
本发明与现有技术相比的优点在于:
(1)本发明克服了现有手工绷膜容易产生褶皱、预紧力不均匀的缺点,通过压膜板圆对称地将薄膜外围锁定,再利用薄膜主框架上升对薄膜施加圆对称的辐射状预紧力,有效改善了预紧力的各向均匀性。
(2)本发明克服了现有将薄膜用胶黏剂粘在平板上难以剥离的缺点,通过将薄膜均匀的各向张紧并固定,有效地保证了薄膜的表面面形以满足加工的要求,并且在加工后可以恢复薄膜的自由状态。
附图说明
图1为本发明的柔性薄膜绷紧固定装置的主视图。
图2为采用该装置前后薄膜应力均匀性分布示意图,其中,图2(a)为采用装置前,图2(b)为采用装置后。
图中,1为顶板,2为上旋轮,3为压力传感器组,4为中旋轮,5为下压力板,6为压膜板,7为薄膜主框架,8为立柱组,9为光栅位移计,10为底台,11为支座,12为顶螺座,13为上旋轮卡环,14为上压力板,15为顶杆组,16为直线轴承组,17为压膜环,18为固定工作台,19为升降台,20为下旋轮,21为下螺座。
具体实施方式
下面结合附图和具体实施例对本发明作具体描述
实施例1
本发明的柔性薄膜绷紧固定装置,包括顶板1,上旋轮2,压力传感器组3,中旋轮4,下压力板5,压膜板6,薄膜主框架7,立柱组8,光栅位移计9,底台10,支座11,顶螺座12,上旋轮卡环13,上压力板14,顶杆组15,直线轴承组16,压膜环17,固定工作台18,升降台19,下旋轮20,下螺座21。其中:
顶板1——固定6个立柱的上端;
上旋轮2——安装在顶螺座12上,手扳以驱动上压力板14上下移动,通过顶杆组15和压膜板6对膜片的外围施压;
压力传感器组3——对压膜盘6的正压力进行控制;
中旋轮4——驱动下压板5上下移动施以压膜环工作;
下压力板5——安装有压膜环的卡具,实施压膜的安装到位;
压膜板6——对平整的薄膜在安装前的周边镇压,接触薄膜部分具有弹性的材料;
薄膜主框架7——承载薄膜;
立柱组8——由光轴组成,设两侧各三只,整套装置设置六根;
光栅位移计9——量程0-100mm,分辨率0.1μm,精度0.3μm;
底台10——固定六个立柱,并和顶板组合为静定框架;
支座11——设计高度适合操作方便;
顶螺座12——固定在顶板下作为上压力板14和下压力板5的上下移动支承;
上旋轮卡环13——用于连接上压力板14,保证其上下位移;
上压力板14——驱动顶杆组15和压膜盘上下移动;
顶杆组15——初定六根,均安装有压力传感器,连接压膜盘6,由下压板5的直线轴承导向上下移动;
直线轴承组16——每个滑动位置均设置1-2付,保证上下压力板的平行位移;
压膜环17——箍紧薄膜;
固定工作台18——支承并固接立柱,保证升降台的无间隙上下移动;
升降台19——定位安装薄膜主框架,上行时使薄膜在周边压紧条件下预绷紧,绷紧程度视升降台上升高度,升降台位移由光栅位移计控制;
下旋轮20——驱动升降台上下位移;
下螺座21——支承升降台19的位移;
本发明的工作流程如下:
首先把薄膜在固定工作台18上铺平,周边由压膜板6圆对称压紧后,中间升降台19向上托起薄膜主框架7使薄膜辐射状向周边绷紧,这样可保证薄膜周边受到的张力一致,然后降下压膜环17,把薄膜逐步箍压在薄膜主框架7上。随着压入深度的变化,为防止薄膜受力太大,适当调节压膜板6的压力直至全部松开,以完成绷装薄膜。
通过应力双折射仪对薄膜的应力分布进行检测,可以证明该装置能明显改善薄膜的应力均匀性,对比效果如图2所示,图2采用该装置前后薄膜应力均匀性分布,其中,图2(a)为采用装置前,图2(b)为采用装置后。

Claims (2)

1.一种柔性薄膜绷紧固定装置,其特征在于:所述的装置包括顶板(1)、上旋轮(2)、压力传感器组(3)、中旋轮(4)、下压力板(5)、压膜板(6)、薄膜主框架(7)、立柱组(8)、光栅位移计(9)、底台(10)、支座(11)、顶螺座(12)、上旋轮卡环(13)、上压力板(14)、顶杆组(15)、直线轴承组(16)、压膜环(17)、固定工作台(18)、升降台(19)、下旋轮(20)、下螺座(21);其连接关系是,所述的底台(10)、立柱组(8)和顶板(1)连接组合为静定框架,并与支座(11)连接使固定工作台(18)处于方便操作的高度;下螺座(21)与底台(10)连接,顶螺座(12)与顶板(1)连接,上旋轮(2)、中旋轮(4)与顶螺座(12)螺纹连接,下旋轮(20)与下螺座(21)螺纹连接;上压力板(14)中心通过上旋轮卡环(13)与上旋轮(2)相连,上压力板(14)边缘通过直线轴承组(16)与立柱组(8)相连,顶杆组(15)的顶端有压力传感器组(3)并与上压力板(14)连接,顶杆组(15)底端和压膜板(6)相连;下压力板(5)中心与中旋轮(4)连接,下压力板(5)边缘通过直线轴承组(16)与立柱组(8)相连,压膜环(17)通过螺丝悬于下压力板(5)底面;固定工作台(18)中心镂空,边缘与立柱组(8)连接,升降台(19)与下旋轮(20)连接,光栅位移计(9)与升降台(19)相连监测其位移,薄膜主框架(7)置于升降台(19)上表面。
2.据权利要求1所述的柔性薄膜绷紧固定装置,其特征在于:所述的上旋轮(2)、上压力板(14)、中旋轮(4)、下压力板(5)、压膜环(17)、下旋轮(20)、升降台(19)和薄膜主框架(7)为同轴心设置。
CN201810995428.2A 2018-08-29 2018-08-29 一种柔性薄膜绷紧固定装置 Pending CN109192697A (zh)

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CN110531588A (zh) * 2019-07-15 2019-12-03 电子科技大学 一种用于薄膜盘面绷紧的机构
CN110531588B (zh) * 2019-07-15 2020-12-04 电子科技大学 一种用于薄膜盘面绷紧的机构
CN111620296A (zh) * 2020-05-19 2020-09-04 中国科学院光电技术研究所 一种柔性薄膜附加均匀径向预紧力的高平面度固定方法

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