CN109186792A - A kind of production method of preset lead type thin film sensor - Google Patents
A kind of production method of preset lead type thin film sensor Download PDFInfo
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- CN109186792A CN109186792A CN201810937954.3A CN201810937954A CN109186792A CN 109186792 A CN109186792 A CN 109186792A CN 201810937954 A CN201810937954 A CN 201810937954A CN 109186792 A CN109186792 A CN 109186792A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
Abstract
The present invention relates to a kind of production methods of preset lead type thin film sensor, comprising: makes preset wire substrate: making substrate die according to the shape need of sensor, keeps substrate material part in substrate die empty, lead portion is real；It is then based on substrate die and obtains substrate；Lead is added in substrate, and is combined together by curing mode, it is preset to complete lead；Processing is carried out to substrate again and forms sensor substrate.For the present invention when substrate forms, the installation site for directly reserving lead carrys out preset lead, reprocesses the processing and positioning problem that lead can face after solving sensor molding.
Description
Technical field
The present invention relates to film sensor technologies field more particularly to a kind of production sides of preset lead type thin film sensor
Method.
Background technique
Hypersonic aircraft flies in an atmosphere, when especially reentering, since shock wave compression and viscous friction generate greatly
Calorimetric energy will lead to the surge of aircraft surface temperature.High temperature problem caused by aircraft reenters generally all can be along with complexity
High-temperature physics phenomenon, existing experience and theory are difficult to directly predict aircraft thermal environment, so usually to try by ground wind-tunnel
It tests and the thermal environment of aircraft is studied.And in the anti-thermal design of hypersonic aircraft, rely primarily on wind-tunnel hot-fluid
The safety of measured value guarantee aircraft and pilot.
With the development of propelling integrated hypersonic aircraft, reduces resistance in order to meet, guarantees inlet characteristic etc.
The requirement of aspect, the components such as fuselage leading edge, inlet lip, partition and control flaps are generally used the lesser tapered wing of radius of curvature
Leading edge.According to the universal law of Aerodynamic Heating, for hypersonic aircraft thermal environment, leading edge radius of curvature is smaller windward for component
Then corresponding higher Aerodynamic Heating amount.The integrated technique of the research of super burn engine technology and engine and aircraft, leads
Cause aircraft burning indoor air flow static temperature up to 1800 DEG C or more, and model surface and the indoor hot-fluid that burns may be up to 5MW/
m2More than, in the flow field of such high temperature, the effects of heat transfer and heat radiation, can make aircraft surface and internal temperature rapid
It so increases, in some instances it may even be possible to fatal damage can be generated to aircraft.Therefore, real in the ground simulation of hypersonic vehicle
In testing, surface transient rate of heat flow measurement is an important job, is had for the optimization design of aircraft vital
Effect, the influence of cooling and efficiency of combustion for engine are also very big.Reduce surface and the combustion chamber heat of aircraft
Stream, can reduce the difficulty of its anti-thermal design.
In summary it is found that dummy vehicle surface heat flow measurement be aerodynamics experimental study big event it
One, to the side such as aircraft layout research, structure and component optimization, flowing control, CFD (computational fluid dynamics) verifying confirmation
Face application value all with higher.
Non-cpntact measurement and contact measurement are divided into the measurement of aircraft surface hot-fluid: using the side such as infrared and phosphorescence thermal map
Method measurement belongs to non-cpntact measurement.Infrared and phosphorescence thermal map measurement hot-fluid can directly obtain the heat on entire dummy vehicle surface
Rheology law, but due to being the impulse wind tunnel test period that represents as Millisecond using shock tunnel, shorter test period pair
Measurement method requires high.Wherein infrared detecting heat is high by being difficult to buy the satisfactory frequency of resolution ratio and sample frequency
The limitation of thermal infrared imager, does not grow up also in shock tunnel.Though phosphorescence thermal map has realized the observational measurement to hot-fluid,
It is limited to technology development, can't realizes quantitative measurement, therefore, the measurement of aircraft surface hot-fluid mainly be also relied on connect at present
Touching measurement.Contact measurement is generally basede on film heat flux sensor and coaxial thermocouple carries out, the wherein sensitivity of coaxial thermocouple
It is lower, it is suitable for the biggish position measurement of heat flow value；Film heat flux sensor includes film resistor heat flow transducer and thin film thermoelectric
Even heat flow transducer is general in use, being referred to as thin film sensor.
The signal of thin film sensor, which is drawn, relies on lead, and the technique of lead production will directly affect quality, the envelope of sensor
Dress and installation.
Existing thin film sensor lead production method be sensor sensing element both ends retouch apply silver paste or platinum liquid etc., or
Using vacuum coating.Wherein retouch apply silver paste or platinum liquid method refer to the suspension liquid containing the particles such as silver or platinum is directly retouched be coated in it is thin
On film sensors sensing element both ends and sensor substrate, conducting wire is formed using baking-curing.It is fairly simple to retouch coating method, it can
To be carried out retouching painting with advanced fine paintbrush, writing brush, drawing ruling pen and needle etc., the lead performance that this mode makes is good, can be with
Implement in the sensor substrate of arbitrary shape, low manufacture cost, is currently used method.But in sensor sensing member
The connecting lead wire for applying and being formed is retouched at part both ends, and thickness is higher than sensing element, forms the Micro Step of sensing element and lead thicknesses, platform
The presence of rank influences the local flow field of aircraft, and the error that will lead to heat-flow measurement increases；Additionally, due to outside sensor substrate
Surface makes lead, needs to carry out insulation operation when being installed on dummy vehicle surface, and otherwise the two meeting short circuit causes sensor
Failure, and insulating layer is set and increases the installation difficulty of sensor and reduces sensor installation effectiveness.Also, insulating layer meeting again
It causes sensor heating temperature to increase, when the raising temperature for being more than sensing element, lateral heat transfer will be formed in sensor, into one
Step leads to measurement error.Vacuum coating is the metal-coated membrane on sensor surface and substrate under vacuum condition, such as using platinum,
The material that silver, copper, aluminium etc. conduct electricity very well forms lead, laser direct etching formation lead or half using direct exposure mask plated film
Conductor photolithography method forms lead.Vacuum coating includes evaporation coating and sputter coating, wherein being deposited by vacuum evaporation mode
Adhesive force on substrate is poor, and when experiment is easily activated shock wave and high-speed flow washes away, therefore general using sputtering
Coating method.Sputter coating method is to hit the surface of solids using high energy particle (majority is the cation by electric field acceleration), with solid
After the atom/molecule on surface carries out momentum, energy exchange, the atom/molecule sputtered from the surface of solids is made to deposit to substrate
Or workpiece surface, form film.Common sputter coating method includes cathodic sputtering, magnetron sputtering and ion sputtering etc..
When making thin film sensor lead using the production method of exposure mask, exposure mask can be using metals such as stainless steel and red coppers
Material is processed to be formed.Exposure mask is placed in the substrate of sensor, so that film particle is passed through the gap of exposure mask, is deposited on base
Lead is formed on bottom, the shape of lead is determined by the shape in exposure mask gap.Due to needing to draw in sensor end face and whole body production
Line, and thin film sensor stock size is small and complex-shaped, so the processing and positioning of exposure mask are relatively difficult, therefore this side
Method is only applicable to the lead production of the thin film sensor of simple shape.
Laser direct etching method is directly to be removed useless film with laser after to sensor plated film, remaining thin
Film becomes lead.This method cost is high, needs expensive laser direct etching machine.
Semiconductor photolithography method is the technique that semiconductor and circuit production is utilized, and using the basic principle of photograph, is used
The materials such as photoresists, exposure machine and exposure mask and tool, using the variation of photoresists exposure front and back, using chemical change and corrosion side
Method realizes the control to colorimetric sensor films shape and size.It is actually one kind of wet etching technique, is equivalent to using sense
Optical cement makes mask pattern, exposure mask can be made to be tightly attached to sensor surface, to guarantee the uniformity of the metallic film in sputtering.But
It is that wet-etching technology is cumbersome, when needing toward contact using a variety of chemical reagent, especially etching platinum film, generally uses chloroazotic acid,
Risk is strong.
The lead thicknesses that above-mentioned vacuum coating is formed are small, its advantage is that overcoming caused by retouching coating, laterally heat transfer influences.
But exist simultaneously complex manufacturing technology, defect at high cost.It is only suitable for drawing on the simple shape sensor such as planar substrate
Line production.
Therefore, against the above deficiency, it is desirable to provide a kind of new lead production method, to simplify the production work of sensor
Skill reduces cost of manufacture, and ensures the total quality of sensor.
Summary of the invention
The technical problem to be solved in the present invention is that tired for positioning existing for existing thin film sensor lead production method
Difficulty, cost is high, and does not have the defect of versatility, provides a kind of production method of preset lead type thin film sensor.
In order to solve the above-mentioned technical problems, the present invention provides a kind of production method of preset lead type thin film sensor,
Include:
A, it makes preset wire substrate: substrate die being made according to the shape need of sensor, makes substrate in substrate die
Material part is sky, and lead portion is real；It is then based on substrate die and obtains substrate；Lead is added in substrate, and by solid
Change mode is combined together, and it is preset to complete lead；Processing is carried out to substrate again and forms sensor substrate.The present invention is directly by lead
It is preset in substrate, realizes the simple production of thin film sensor lead.
In the production method of preset lead type thin film sensor according to the present invention, further includes:
B1, the pre-designed production exposure mask according to sensing element form film sensing element in sensor substrate, obtain thin
Film resistance heat flow transducer.
In the production method of preset lead type thin film sensor according to the present invention, drawn based on what step B1 was used
Wire material includes platinum, palladium, gold, silver or copper.
In the production method of preset lead type thin film sensor according to the present invention, further include with the B1 phase simultaneously
The technical solution of column:
B2, thermocouple wire is preset in sensor substrate, is plated using direct magnetic control coating machine in sensor substrate surface
Film forms thermocouple junction, obtains film thermocouple heat flow transducer.
In the production method of preset lead type thin film sensor according to the present invention, the acquisition film thermocouple
Heat flow transducer method particularly includes:
The target of plated film is installed, and selects target；
Mounting base is processed, sensor substrate is fixed in mounting base, then mounting base is placed in direct magnetic control coating machine
On the indoor sample stage of vacuum；
Start vacuum pump, 1~5 × 10 will be evacuated down in the vacuum chamber with 10-9000 liter/second initial pumping speed-4Pa；
It is then turned on pressure reductor, pumping speed is reduced to the 50%~30% of initial pumping speed, is persistently filled with argon gas and reaches 1~8 × 10-1Pa；
Make sample stage or target with the rotation of 5~20 circles/minute speed；And make direct magnetic control coating machine to sensor substrate into
Row stablizes sputtering, to sensor substrate surface plated film, forms thermocouple junction；
It is then shut off direct magnetic control coating machine and stops applying argon gas, continue with 50%~30% pair of vacuum chamber of initial pumping speed
It vacuumizes, continues 10~60 minutes；
Sensor substrate is taken out, after predetermined hold-time section is toasted in heating, makes its natural cooling, obtains film thermocouple heat
Flow sensor；Preferably, when plating platinum film to sensor substrate surface, the temperature for heating baking is 600 DEG C；
Wherein the predetermined amount of time is determined according to the target of plated film.
In the production method of preset lead type thin film sensor according to the present invention, drawn based on what step B2 was used
Wire material is identical as galvanic couple material.
In the production method of preset lead type thin film sensor according to the present invention, sensing described in step A
The step of device substrate will also be through over cleaning, the cleaning include:
Successively use gasoline, washing powder, a pure water, dilute sulfuric acid, two times pure water, alcohol, ultrasonic wave and plasma cleaning
Sensor substrate.
In the production method of preset lead type thin film sensor according to the present invention, the dilute sulfuric acid needs are added
For heat to 80~120 DEG C, scavenging period is 30~60 minutes.
In the production method of preset lead type thin film sensor according to the present invention, the target material includes
Platinum, palladium, gold, nickel, copper or thermocouple material.
The production method for implementing preset lead type thin film sensor of the invention, has the advantages that for existing
The problem of the preset difficulty of thin film sensor lead in technology, the present invention directly reserve the installation position of lead when substrate forms
It sets and carrys out preset lead, reprocess the processing and positioning problem that lead can face after solving sensor molding.Compared to conventional thin
The lead manufacture craft of film sensors, present invention reduces manufacture difficulties and cost, and have versatility.It is passed due to can be realized
The consistency of sensor production, can produce the sensor substrate with preset lead in enormous quantities, and due to realize lead with
The integration production of substrate, after sensor sensing element or thermocouple break, can be processed using substrate again, be obtained
Sensor improves the reuse rate of substrate, and further reduces the production cost.
Detailed description of the invention
Fig. 1 is a kind of the exemplary of the production method of preset lead type thin film sensor described in the specific embodiment of the invention
Flow chart.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As shown in connection with fig. 1, the present invention provides a kind of production methods of preset lead type thin film sensor, comprising:
A, it makes preset wire substrate: in step 100, substrate die being made according to the shape need of sensor, makes substrate
Substrate material part is sky in mold, and lead portion is real；Then substrate is obtained based on substrate die in step 110；Step
In 120, lead is added in substrate, and is combined together by curing mode, it is preset to complete lead；In step 130, then to lining
Bottom carries out processing and forms sensor substrate.
The present invention presently, there are the production of the lead of processing difficulties, will be fused to substrate it is molding during, change lead
Preset process, the process for keeping lead preset are simplified.After acquisition is prefixed the sensor substrate of lead, it is based on sensor
The method that substrate further processing obtains sensor can be and method same or like in the prior art.
The substrate die can be made of high hard material, such as the materials production such as selection SKH3,5CrMnMo；Substrate
Mold is fabricated to opposite with sensor convex-concave according to pre-designed sensor shape.Sensor substrate is added into substrate die
Material, such as ceramic powder, are compacted into, and take out after primary solidification, obtain substrate.High temperature can be used between lead and substrate
The mode of sintering carries out solidification combination.
As an example, can be served as a contrast according to the pre-designed production exposure mask of sensing element in sensor after obtaining sensor substrate
Film sensing element is formed on bottom, obtains film resistor heat flow transducer.
For film resistor heat flow transducer, lead can be used the wire to conduct electricity very well and be made, such as can be
Platinum, palladium, gold, silver or copper etc..
As an example, there is also a kind of schemes mutually arranged side by side, i.e., it, can be pre- by thermocouple wire after obtaining sensor substrate
It sets in sensor substrate, using direct magnetic control coating machine in sensor substrate surface plated film, forms thermocouple junction, obtain thin
Film hot thermocouple flow sensor.
It is carried out specifically for obtaining film thermocouple heat flow transducer using direct magnetic control coating machine plated film below
It is bright, it is other by the way of the vacuum coating equipments plated film such as radio frequency magnetron coating machine, ion plating equipment according to the operation of machine itself
Regulation implements:
As an example, the specific method for obtaining film thermocouple heat flow transducer can be with are as follows:
The target of plated film is installed, and selects target；Wherein the material of target is selected according to measurement, be can choose and is led
The metal material of good in thermal property, such as platinum, palladium, gold, nickel or copper；Or it is identical as thermocouple material that target, which also can choose,.
Mounting base is processed, the mounting base after processing is completed, the sensor substrate after having cleaned, having dried can be fixed on
In mounting base, then mounting base is placed on the sample stage in direct magnetic control vacuum chamber of film coating machine, and closes vacuum chamber；
Start vacuum pump, 1~5 × 10 will be evacuated down in the vacuum chamber with 10-9000 liter/second initial pumping speed-4Pa；
Be then turned on pressure reductor assisted decompression, reduce pumping speed to the 50%~30% of initial pumping speed, be persistently filled with argon gas reach 1~8 ×
10-1Pa；The initial pumping speed can be chosen in tens to several kilolitres range per second according to actual needs；Initial pumping speed with
The practical pumping speed of the coating machine used is related.In actual use, if the leak rate of coating machine the coating machine performance range
It is interior, scheduled vacuum degree, such as 1~5 × 10 such as are extracted into 30 minutes in the predetermined time-4Pa, the speed of vacuum pumping rate
Do not influence plated film.
Illustratively: the vacuum pump of direct magnetic control coating machine is divided into fore pump and two stage pump, and fore pump is mechanical pump, second level
Pump is molecular pump or diffusion pump.Sequence to vacuum chamber is first to be vacuumized with fore pump, is then converted into second level pumping
Vacuum, the gas of prime pumping two stage pump discharge at this time.The initial pumping speed involved in the disclosure is the pumping speed of two stage pump.It is right
It is inconsistent in the performance for the molecular pump that different coating machines configures, it needs to select adaptable initial pumping speed.In theory,
The higher the better for the indoor vacuum degree of vacuum, and vacuum degree more high vacuum Cleanliness is higher, is conducive to improve coating quality.But it is real
The predetermined vacuum level on border still will be determined according to the performance of coating machine.Due to be in the disclosure in order to make thermocouple junction,
Effect is mainly thermally conductive and conductive, little for sensor entire effect containing a little impurity, so not needing too high vacuum
Degree.
Open pressure reductor after, reduce pumping speed, be because while to be filled with plated film gases argon, due in vacuum chamber to be kept
Gas pressure balancing reduces the air-flow velocity vacuumized, can reduce the usage amount of argon gas.Argon gas is reaching 1~8 × 10-1When Pa,
Ionization easy to accomplish.Argon concentration is lower, and the plating membrane voltage needed is higher.
Make sample stage or target with the rotation of 5~20 circles/minute speed；DC power supply is opened as the confession of direct magnetic control coating machine
Electricity, pressure regulation make direct magnetic control coating machine carry out stablizing sputtering to sensor substrate, to sensor substrate surface plated film, form thermoelectricity
Even node；The plated film time of the stable sputtering can be determined according to the height of film thickness and substrate and target, generally
It can choose 1~5 minute.It rotates sample stage or target at the uniform velocity, is in order in sensor substrate surface uniform coated.Revolving speed
Size is related with plated film time, and plated film time is shorter, and the revolving speed for needing to set is higher.
It is then shut off direct magnetic control coating machine and stops applying argon gas, continue with 50%~30% pair of vacuum chamber of initial pumping speed
It vacuumizes, continues 10~60 minutes；Close direct magnetic control coating machine after, continue 10~60 minutes to vacuum chamber, be because
It is heated for sensor substrate in plated film, after plated film, temperature will continue to maintain temperature when heating, continue to have vacuumized
Conducive to cooling, film is enable preferably to be combined with sensor substrate.Meanwhile after plated film, there is also film grains in vacuum chamber
Son continues to vacuumize, and reduces film particle concentration, can be reduced the injury to operator.
Sensor substrate is taken out, is placed it in baking oven, after heating baking predetermined hold-time section, makes its natural cooling,
Obtain film thermocouple heat flow transducer；Preferably, when plating platinum film to sensor substrate surface, the temperature for heating baking is 600
℃；After sensor substrate plated film, baking film be in order to reduce the thermal stress in film, improve in film the binding force of particle and
With the bonding force of substrate.Baking temperature will be determined according to the heat resistance of Coating Materials and substrate material, in baking temperature,
Coating Materials cannot volatilize, and substrate material cannot soften.
Wherein the predetermined amount of time is determined according to the target of plated film.
It is taken out after baking oven natural cooling, i.e. the overall process of completion film thermocouple heat flow transducer production.
As an example, lead material can be identical as thermocouple material for film thermocouple heat flow transducer, such as
It is all the wire that certain conducts electricity very well with thermocouple.
In the present invention, after the solidification for successfully completing lead and substrate, needs that substrate is further processed, passed with meeting
Sensor surfaces parameter request, such as can successively polish substrate, re-polishing.
Sensor substrate after polishing and polishing also needs to come into operation again further across cleaning.As an example, step A
Described in sensor substrate will also be through over cleaning the step of, the cleaning includes:
Successively use gasoline, washing powder, a pure water, dilute sulfuric acid, two times pure water, alcohol, ultrasonic wave and plasma cleaning
Sensor substrate.Wherein a pure water and two times pure water indicate two processes using pure water cleaning, can also use it is secondary with
On distilled water replace pure water.
As an example, the dilute sulfuric acid concentration of cleaning can be 10%~30%, before use, the dilute sulfuric acid needs
80~120 DEG C are heated to, lasting scavenging period is 30~60 minutes.
The ultrasonic cleaning time is longer, generally requires one day or more.
After the completion of sensor substrate cleaning, can be dried using the heating equipments such as hair dryer, then be placed in drying bottle or
It is saved in tank, with to be used.
Film resistor heat flow transducer or film thermocouple heat flow transducer made by the above method, in sensing element
Or after thermocouple junction damage, it can polish again and form sensing element or thermocouple junction with cleaning sensor sensitive surface, plated film
Point is repeatedly fabricated to thin film sensor, improves the reuse rate of preset wire substrate in this way, reduce sensor production at
This.
Lead is preset in sensor substrate by the present invention, when installing on dummy vehicle without considering asking for insulation
Topic, reduces installation difficulty.
In conclusion can be used for hypersonic ground-based simulation equipment shock wave using the thin film sensor that the method for the present invention makes
The measurement of the wind-tunnel dummy vehicle surface heat flow such as wind-tunnel.Lead is directly preset in sensor substrate by it, then in sensor
Substrate surface plated film forms thermocouple junction or forms film sensing element using exposure mask, realizes thin film sensor lead
Simple production.Design thin film sensor sensing element shape and size with can be convenient, are accurately positioned, and realize sensor
The intensive arrangement and accurate production of measuring point, overcome the shortcomings that traditional sensors intensively make location difficulty and poor repeatability.Cause
This improves the production precision and efficiency of thin film sensor, and the thin film sensor suitable for random appearance makes.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of production method of preset lead type thin film sensor, characterized by comprising:
A, it makes preset wire substrate: substrate die being made according to the shape need of sensor, makes substrate material in substrate die
Part is sky, and lead portion is real；It is then based on substrate die and obtains substrate；Lead is added in substrate, and passes through solidification side
Formula is combined together, and it is preset to complete lead；Processing is carried out to substrate again and forms sensor substrate.
2. the production method of preset lead type thin film sensor according to claim 1, it is characterised in that further include:
B1, the pre-designed production exposure mask according to sensing element form film sensing element in sensor substrate, obtain thin-film electro
Thermal resistance flow sensor.
3. the production method of preset lead type thin film sensor according to claim 1 or 2, it is characterised in that: described to draw
Wire material includes platinum, palladium, gold, silver or copper.
4. the production method of preset lead type thin film sensor according to claim 1, it is characterised in that further include:
B2, thermocouple wire is preset in sensor substrate, using direct magnetic control coating machine in sensor substrate surface plated film, shape
At thermocouple junction, film thermocouple heat flow transducer is obtained.
5. the production method of preset lead type thin film sensor according to claim 4, it is characterised in that:
The acquisition film thermocouple heat flow transducer method particularly includes:
The target of plated film is installed, and selects target；
Mounting base is processed, sensor substrate is fixed in mounting base, then mounting base is placed in direct magnetic control coating machine vacuum
On indoor sample stage；
Start vacuum pump, 1~5 × 10 will be evacuated down in the vacuum chamber with 10-9000 liter/second initial pumping speed-4Pa；Then
Pressure reductor is opened, pumping speed is reduced to the 50%~30% of initial pumping speed, is persistently filled with argon gas and reaches 1~8 × 10-1Pa；
Make sample stage or target with the rotation of 5~20 circles/minute speed；And it is steady to carry out direct magnetic control coating machine to sensor substrate
Fixed sputtering forms thermocouple junction to sensor substrate surface plated film；
It is then shut off direct magnetic control coating machine and stops applying argon gas, continue to take out with 50%~30% pair of vacuum chamber of initial pumping speed true
Sky continues 10~60 minutes；
Sensor substrate is taken out, after predetermined hold-time section is toasted in heating, makes its natural cooling, film thermocouple hot-fluid is obtained and passes
Sensor；Preferably, when plating platinum film to sensor substrate surface, the temperature for heating baking is 600 DEG C；
Wherein the predetermined amount of time is determined according to the target of plated film.
6. the production method of preset lead type thin film sensor according to claim 4 or 5, it is characterised in that:
The lead material is identical as thermocouple material.
7. the production method of preset lead type thin film sensor according to any one of claim 1 to 6, feature exist
In:
Carrying out processing to substrate described in step A includes that substrate is polished and polished.
8. the production method of preset lead type thin film sensor according to any one of claim 1 to 7, feature exist
In:
The step of sensor substrate described in step A will also be through over cleaning, the cleaning include:
Successively using gasoline, washing powder, a pure water, dilute sulfuric acid, two times pure water, alcohol, ultrasonic wave and plasma cleaning sensing
Device substrate.
9. the production method of preset lead type thin film sensor according to claim 8, it is characterised in that:
The dilute sulfuric acid needs to be heated to 80~120 DEG C, and scavenging period is 30~60 minutes.
10. the production method of preset lead type thin film sensor according to claim 5, it is characterised in that: the target
Material includes platinum, palladium, gold, nickel, copper or thermocouple material.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111156892A (en) * | 2019-12-23 | 2020-05-15 | 陕西电器研究所 | Preparation improvement method of ion beam sputtering coating blocking piece sensor |
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