CN109186792B - Method for manufacturing preset lead wire type film sensor - Google Patents
Method for manufacturing preset lead wire type film sensor Download PDFInfo
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- CN109186792B CN109186792B CN201810937954.3A CN201810937954A CN109186792B CN 109186792 B CN109186792 B CN 109186792B CN 201810937954 A CN201810937954 A CN 201810937954A CN 109186792 B CN109186792 B CN 109186792B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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Abstract
The invention relates to a method for manufacturing a preset lead wire type film sensor, which comprises the following steps: manufacturing a preset lead substrate: manufacturing a substrate mould according to the shape requirement of the sensor, wherein the substrate material part in the substrate mould is empty, and the lead wire part is solid; then obtaining a substrate based on the substrate mold; adding the lead into the substrate, and combining the lead and the substrate together in a curing mode to complete lead presetting; and processing the substrate to form the sensor substrate. When the substrate is molded, the mounting position of the lead is directly reserved to preset the lead, so that the processing and positioning problems of the reworked lead after the sensor is molded are solved.
Description
Technical Field
The invention relates to the technical field of thin film sensors, in particular to a manufacturing method of a preset lead type thin film sensor.
Background
When the hypersonic aircraft flies in the atmosphere, particularly when the hypersonic aircraft flies in the atmosphere, a large amount of heat energy is generated due to shock wave compression and viscous friction, and the surface temperature of the hypersonic aircraft is increased sharply. The high temperature problem caused by aircraft reentry is generally accompanied by complex high temperature physical phenomena, and the thermal environment of the aircraft is difficult to directly predict by the existing experience and theory, so the thermal environment of the aircraft is usually researched by relying on a ground wind tunnel test. In the heat-proof design of the hypersonic aircraft, the safety of the aircraft and pilots is ensured mainly by depending on the measured value of the heat flow of the wind tunnel.
With the development of the propulsion integrated hypersonic aircraft, in order to meet the requirements of reducing resistance, ensuring the performance of an air inlet and the like, the front edge of a fuselage, the lip of the air inlet, a partition plate, a control rudder and other components generally adopt a sharp wing front edge with smaller curvature radius. According to the general rule of pneumatic heating, for the thermal environment of a hypersonic aircraft, the smaller curvature radius of the windward front edge of the part corresponds to the higher pneumatic heating amount. The research of the super-combustion engine technology and the integration technology of the engine and the aircraft lead the static temperature of airflow in a combustion chamber of the aircraft to reach more than 1800 ℃, and the heat flow on the surface of a model and in the combustion chamber can reach 5MW/m2In the above, in the flow field with such high temperature, the heat conduction and radiation will cause the temperature on the surface and inside of the aircraft to rise suddenly, and even may cause fatal damage to the aircraft. Therefore, in a ground simulation experiment of a hypersonic aircraft model, measurement of the surface transient heat flow rate is an important work, plays a vital role in optimizing design of the aircraft, and has a great influence on cooling and combustion efficiency of an engine. The surface of the aircraft and the heat flow inside the combustion chamber are reduced, and the difficulty of the heat-proof design of the aircraft can be reduced.
From the above, the measurement of the heat flow on the surface of the aircraft model is one of the important items of the aerodynamic experiment research, and has high application value in the aspects of aircraft layout research, structural and component optimization, flow control, CFD (computational fluid dynamics) verification and confirmation, and the like.
The measurement of the heat flow on the surface of an aircraft is divided into non-contact measurement and contact measurement: the measurement by infrared and phosphorescence heat map is non-contact measurement. The heat flow change rule of the whole aircraft model surface can be directly obtained by measuring the heat flow through the infrared and phosphorescence heat maps, but the shorter test time has extremely high requirements on the measurement method because the pulse wind tunnel test time represented by the shock wind tunnel is millisecond. The infrared heat measurement is limited by the difficulty in purchasing a high-frequency thermal infrared imager with both resolution and sampling frequency meeting the requirements, and is not developed in a shock tunnel. While the phosphorescence heat map has realized qualitative measurement of heat flow, the technology development is limited, and quantitative measurement cannot be realized, so that the current measurement of the heat flow on the surface of the aircraft mainly depends on contact measurement. The contact measurement is generally carried out on the basis of a thin-film heat flow sensor and a coaxial thermocouple, wherein the coaxial thermocouple has lower sensitivity and is suitable for position measurement with larger heat flow value; the thin film heat flow sensor comprises a thin film resistance heat flow sensor and a thin film thermocouple heat flow sensor, which are both referred to as thin film sensors in common use.
The signal extraction of the film sensor depends on a lead wire, and the quality, the packaging and the installation of the sensor are directly influenced by the lead wire manufacturing process.
The existing method for manufacturing the thin film sensor lead is to coat silver paste or platinum liquid and the like on two ends of a sensor sensitive element or to adopt vacuum coating. The silver paste or platinum liquid painting method is that suspension liquid containing silver or platinum and other particles is painted directly on two ends of a sensitive element of a film sensor and a sensor substrate, and then the wire is formed through baking and curing. The tracing method is simple, can be used for tracing by using high-grade fine painting brushes, writing brushes, drawing duckbill pens, needles and the like, has good lead performance, can be implemented on sensor substrates in any shapes, has low manufacturing cost, and is a commonly used method at present. However, the connecting lead formed by painting at the two ends of the sensitive element of the sensor has a thickness higher than that of the sensitive element, so that a fine step of the thicknesses of the sensitive element and the lead is formed, and the existence of the step affects the local flow field of the aircraft, which can cause the increase of the error of heat flow measurement; in addition, because the lead is manufactured on the outer surface of the sensor substrate, insulation operation is needed when the lead is installed on the surface of an aircraft model, otherwise, the lead and the aircraft model are short-circuited to cause sensor failure, and the installation difficulty of the sensor is increased and the installation efficiency of the sensor is reduced due to the arrangement of the insulating layer. In addition, the insulating layer can cause the heating temperature of the sensor to increase, and when the temperature of the sensor exceeds the rising temperature of the sensitive element, transverse heat transfer can be formed on the sensor, and further measurement errors are caused. The vacuum coating is to coat metal films on the surface of the sensor and the substrate under the vacuum condition, for example, materials with good conductivity such as platinum, silver, copper, aluminum and the like are adopted, a lead is formed by direct mask coating, a lead is formed by laser direct etching or a lead is formed by a semiconductor photoetching method. The vacuum coating includes evaporation coating and sputtering coating, wherein the adhesion of the film deposited on the substrate by vacuum evaporation is poor, and the film is easily washed away by starting shock waves and high-speed airflow during experiments, so the sputtering coating method is generally adopted. The sputtering coating method is to utilize high energy particles (mostly positive ions accelerated by an electric field) to impact the surface of a solid, and after momentum and energy exchange is carried out between the high energy particles and atoms/molecules on the surface of the solid, the atoms/molecules splashed from the surface of the solid are deposited on the surface of a substrate or a workpiece to form a film. Common sputter coating methods include cathode sputtering, magnetron sputtering, ion sputtering, and the like.
When the thin film sensor lead is manufactured by adopting the manufacturing method of the mask, the mask can be formed by processing metal materials such as stainless steel, red copper and the like. A mask is placed on a substrate of the sensor, and then thin film particles are deposited on the substrate through the slits of the mask to form leads, the shape of which is determined by the shape of the slits of the mask. Since the lead wires are required to be manufactured on the end face and the whole body of the sensor, and the thin film sensor is generally small in size and complex in shape, the processing and positioning of the mask are difficult, so that the method is only suitable for manufacturing the lead wires of the thin film sensor with a simple shape.
The laser direct etching method is that after the sensor is coated, the useless film is directly removed by laser, and the residual film becomes a lead. This method is expensive and requires an expensive laser direct etcher.
The semiconductor photoetching method is to utilize the semiconductor and circuit making process, to utilize the basic principle of photography, to adopt photosensitive resist, exposure machine, mask and other material and tools, to utilize the change of photosensitive resist before and after exposure, and to adopt chemical change and corrosion method to realize the control of the shape and size of the sensor film. The method is actually one of wet etching technologies, is equivalent to manufacturing a mask pattern by adopting a photosensitive resist, and can enable the mask to be tightly attached to the surface of the sensor, thereby ensuring the uniformity of a metal film during sputtering. However, the wet etching process is complicated, and often requires the use of a plurality of chemical reagents, especially aqua regia is generally used when a platinum film is etched, which is highly dangerous.
The lead formed by vacuum coating has small thickness and the advantage of overcoming the influence of transverse heat transfer caused by a painting method. But also has the defects of complex manufacturing process and high cost. The method is only suitable for manufacturing the lead on a simple shape sensor such as a plane substrate.
Therefore, in view of the above disadvantages, it is desirable to provide a new lead manufacturing method to simplify the manufacturing process of the sensor, reduce the manufacturing cost, and ensure the overall quality of the sensor.
Disclosure of Invention
The invention aims to solve the technical problems of difficult positioning, high manufacturing cost and no universality of the existing thin film sensor lead manufacturing method, and provides a manufacturing method of a preset lead type thin film sensor.
In order to solve the above technical problem, the present invention provides a method for manufacturing a lead-in-place type thin film sensor, comprising:
A. manufacturing a preset lead substrate: manufacturing a substrate mould according to the shape requirement of the sensor, wherein the substrate material part in the substrate mould is empty, and the lead wire part is solid; then obtaining a substrate based on the substrate mold; adding the lead into the substrate, and combining the lead and the substrate together in a curing mode to complete lead presetting; and processing the substrate to form the sensor substrate. The invention directly presets the lead in the substrate, and realizes simple manufacture of the lead of the film sensor.
In the method for manufacturing a pre-wired thin film sensor according to the present invention, the method further includes:
b1, manufacturing a mask according to the preset design of the sensitive element, and forming a thin film sensitive element on the sensor substrate to obtain the thin film resistance heat flow sensor.
In the method for manufacturing the pre-wired thin film sensor according to the present invention, the lead material used in step B1 includes platinum, palladium, gold, silver or copper.
The manufacturing method of the preset lead wire type film sensor further comprises the following technical scheme that the method is parallel to the B1:
and B2, presetting the thermocouple wire in the sensor substrate, and coating the film on the surface of the sensor substrate by adopting a direct-current magnetic control coating machine to form a thermocouple junction so as to obtain the thin-film thermocouple heat flow sensor.
In the manufacturing method of the pre-wired thin film sensor according to the present invention, the specific method for obtaining the thin film thermocouple heat flow sensor is as follows:
installing a film-coated target, and selecting a target material;
processing a mounting seat, fixing a sensor substrate on the mounting seat, and placing the mounting seat on a sample table in a vacuum chamber of a direct-current magnetic control coating machine;
starting a vacuum pump, and vacuumizing the vacuum chamber to 1-5 multiplied by 10 at an initial pumping speed of 10-9000 liters/second-4Pa; then, opening the pressure reducing plate, reducing the pumping speed to 50-30% of the initial pumping speed, and continuously filling argon to reach 1-8 multiplied by 10-1Pa；
Rotating the sample stage or target at a speed of 5-20 circles/minute; enabling a direct-current magnetron coating machine to stably sputter the sensor substrate, coating the sensor substrate surface, and forming a thermocouple node;
then closing the direct current magnetic control film plating machine, stopping filling argon, continuously vacuumizing the vacuum chamber at 50-30% of the initial vacuumizing speed for 10-60 minutes;
taking out the sensor substrate, heating and baking for a preset time period, and naturally cooling to obtain a thin film thermocouple heat flow sensor; preferably, when the platinum film is plated on the surface of the sensor substrate, the heating and baking temperature is 600 ℃;
wherein the predetermined time period is determined according to the target material to be coated.
In the method for manufacturing the pre-wired thin film sensor according to the present invention, the lead material used in step B2 is the same as the thermocouple material.
In the method for manufacturing a pre-wired thin film sensor according to the present invention, the sensor substrate in step a is further subjected to a cleaning step, the cleaning step includes:
the sensor substrate is cleaned by sequentially adopting gasoline, washing powder, primary pure water, dilute sulfuric acid, secondary pure water, alcohol, ultrasonic waves and plasma.
In the manufacturing method of the preset lead wire type film sensor, the dilute sulfuric acid needs to be heated to 80-120 ℃, and the cleaning time is 30-60 minutes.
In the method for manufacturing the pre-wired thin film sensor according to the present invention, the target material includes platinum, palladium, gold, nickel, copper, or a thermocouple material.
The manufacturing method of the preset lead wire type film sensor has the following beneficial effects: aiming at the problem of difficulty in presetting the lead of the film sensor in the prior art, the invention directly reserves the installation position of the lead to preset the lead when the substrate is formed, thereby solving the processing and positioning problems of the reworked lead after the sensor is formed. Compared with the lead manufacturing process of the traditional film sensor, the manufacturing method of the thin film sensor reduces the manufacturing difficulty and cost and has universality. The sensor substrate with the preset lead can be produced in large scale due to the consistency of the sensor manufacturing, and the integrated manufacturing of the lead and the substrate is realized, so that the substrate can be reused for processing after a sensor sensitive element or a thermocouple is damaged to obtain the sensor, the reuse rate of the substrate is improved, and the manufacturing cost is further reduced.
Drawings
Fig. 1 is an exemplary flowchart of a method for manufacturing a pre-wired thin film sensor according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, the present invention provides a method for manufacturing a pre-wired thin film sensor, including:
A. manufacturing a preset lead substrate: in step 100, a substrate mold is manufactured according to the shape requirement of the sensor, so that a substrate material part in the substrate mold is empty, and a lead part is solid; then a substrate is obtained based on the substrate mold in step 110; in step 120, adding the lead into the substrate, and combining the lead and the substrate together in a curing mode to complete lead presetting; in step 130, the substrate is further processed to form a sensor substrate.
The invention integrates the lead manufacture which is difficult to process at present into the substrate forming process, changes the lead presetting process and simplifies the lead presetting process. After obtaining the sensor substrate on which the lead lines are preset, the method of obtaining the sensor based on further processing of the sensor substrate may be the same as or similar to that in the prior art.
The substrate mould can be made of high-hardness materials, such as SKH3, 5CrMnMo and other materials; the substrate mold is made to be opposite to the convex-concave of the sensor according to the pre-designed shape of the sensor. And adding a sensor substrate material such as ceramic powder into the substrate mold, compacting the sensor substrate material, preliminarily curing the sensor substrate material, and taking out the sensor substrate material to obtain the substrate. The lead and the substrate can be solidified and combined by adopting a high-temperature sintering mode.
As an example, after obtaining the sensor substrate, a mask may be fabricated according to the preset design of the sensing element, and a thin film sensing element may be formed on the sensor substrate to obtain the thin film resistance thermal flow sensor.
For the thin film resistance heat flow sensor, the lead wire can be made of a metal wire with good electrical conductivity, such as platinum, palladium, gold, silver or copper.
As an example, there is also a parallel scheme, that is, after obtaining the sensor substrate, the thermocouple wire may be preset in the sensor substrate, and a direct current magnetic control coating machine is used to coat the sensor substrate surface to form a thermocouple junction, so as to obtain the thin film thermocouple heat flow sensor.
The following description will be made in detail by taking an example of obtaining a film thermocouple heat flow sensor by coating with a direct current magnetic control coating machine, and other coating modes by using vacuum coating machines such as a radio frequency magnetic control coating machine, an ion coating machine and the like are executed according to the operation rules of the machines:
as an example, the specific method for obtaining the thin film thermocouple heat flow sensor may be:
installing a film-coated target, and selecting a target material; the material of the target material is selected according to the measurement requirement, and a metal material with good heat conductivity, such as platinum, palladium, gold, nickel or copper, can be selected; alternatively, the target material may be selected to be the same as the thermocouple material.
Processing a mounting seat, wherein after the mounting seat is processed, the cleaned and dried sensor substrate can be fixed on the mounting seat, then the mounting seat is placed on a sample table in a vacuum chamber of a direct-current magnetic control coating machine, and the vacuum chamber is closed;
starting a vacuum pump, and vacuumizing the vacuum chamber to 1-5 multiplied by 10 at an initial pumping speed of 10-9000 liters/second-4Pa; then opening a pressure reducing plate for auxiliary pressure reduction, reducing the pumping speed to 50% -30% of the initial pumping speed, and continuously filling argon to reach 1-8 multiplied by 10-1Pa; the initial pumping speed can be selected within the range of dozens to thousands of liters per second according to actual use requirements; the initial pumping speed is related to the actual pumping speed of the coating machine. In practical use, as long as the air leakage rate of the film coating machine is within the performance range of the film coating machine, the film coating machine is pumped to a predetermined vacuum degree within a predetermined time, such as 30 minutes, for example, 1-5 multiplied by 10-4Pa, and the speed of vacuumizing does not influence the film coating.
The following is explained: the vacuum pump of the direct current magnetron coating machine is divided into a pre-pump and a secondary pump, wherein the pre-pump is a mechanical pump, and the secondary pump is a molecular pump or a diffusion pump. The sequence of vacuumizing the vacuum chamber is that the pre-pump is used for vacuumizing firstly, and then the vacuum is converted into the secondary pump for vacuumizing, and at the moment, the pre-pump pumps the gas exhausted by the secondary pump. The initial pumping rate referred to in this disclosure is the pumping rate of the secondary pump. For the inconsistent performance of the molecular pumps of different film plating machine configurations, the adaptive initial pumping speed needs to be selected. Theoretically, the higher the vacuum degree in the vacuum chamber is, the better the vacuum degree is, and the higher the vacuum degree is, the higher the cleanliness in the vacuum chamber is, which is beneficial to improving the coating quality. The actual predetermined vacuum level is determined by the performance of the coater. As the thermocouple junction is manufactured in the method, the thermocouple junction mainly has the functions of heat conduction and electric conduction, and the integral sensor is not greatly influenced by a few impurities, so that the high vacuum degree is not required.
After the pressure reducing plate is opened, the pumping speed is reduced because the argon as the coating gas needs to be filled, and the gas pressure balance in the vacuum chamber needs to be kept, so that the flow rate of the pumped vacuum air flow is reduced, and the using amount of the argon can be reduced. Argon gas reaches 1 to 8 multiplied by 10-1At Pa, ionization is easily achieved. The lower the argon concentration, the higher the required coating voltage.
Rotating the sample stage or target at a speed of 5-20 circles/minute; starting a direct current power supply to supply power to a direct current magnetic control coating machine, regulating the voltage to enable the direct current magnetic control coating machine to stably sputter a sensor substrate, coating the sensor substrate surface to form a thermocouple node; the coating time of the stable sputtering can be determined according to the thickness of the film and the heights of the substrate and the target, and can be generally selected to be 1-5 minutes. The sample stage or the target is rotated at a constant speed so as to uniformly coat the film on the surface of the sensor substrate. The rotating speed is related to the coating time, and the shorter the coating time is, the higher the rotating speed needs to be set.
Then closing the direct current magnetic control film plating machine, stopping filling argon, continuously vacuumizing the vacuum chamber at 50-30% of the initial vacuumizing speed for 10-60 minutes; and after the direct-current magnetic control coating machine is closed, vacuumizing the vacuum chamber continuously for 10-60 minutes because the sensor substrate is heated during coating, and after the coating is finished, the temperature can be continuously maintained at the heating temperature, so that the continuous vacuumizing is favorable for cooling, and the film and the sensor substrate can be better combined. Meanwhile, after the coating is finished, film particles still exist in the vacuum chamber, the vacuum pumping is continued, the concentration of the film particles is reduced, and the harm to operators can be reduced.
Taking out the sensor substrate, placing the sensor substrate in an oven, heating and baking the sensor substrate for a preset time period, and naturally cooling the sensor substrate to obtain a thin-film thermocouple heat flow sensor; preferably, when the platinum film is plated on the surface of the sensor substrate, the heating and baking temperature is 600 ℃; after the sensor substrate is coated with a film, the film is baked to reduce the thermal stress in the film and improve the binding force of particles in the film and the binding force with the substrate. The baking temperature is determined according to the temperature resistance of the coating material and the substrate material, and within the baking temperature, the coating material cannot volatilize and the substrate material cannot soften.
Wherein the predetermined time period is determined according to the target material to be coated.
And naturally cooling the oven and then taking out the oven to finish the whole process of manufacturing the film thermocouple heat flow sensor.
As an example, for a thin film thermocouple heat flow sensor, the lead material may be the same as the thermocouple material, such as a wire with a good electrical conductivity.
In the invention, after the solidification of the lead and the substrate is successfully completed, the substrate needs to be further processed to meet the surface parameter requirement of the sensor, for example, the substrate can be sequentially ground and polished.
The polished sensor substrate needs to be further cleaned and put into use. As an example, the sensor substrate described in step a is further subjected to a step of cleaning, the cleaning including:
the sensor substrate is cleaned by sequentially adopting gasoline, washing powder, primary pure water, dilute sulfuric acid, secondary pure water, alcohol, ultrasonic waves and plasma. Wherein the first pure water and the second pure water represent two processes of cleaning with pure water, and the pure water can be replaced by more than two times of distilled water.
For example, the concentration of the dilute sulfuric acid for cleaning can be 10-30%, and before the dilute sulfuric acid is used, the dilute sulfuric acid needs to be heated to 80-120 ℃ for 30-60 minutes.
The ultrasonic cleaning time is long, and generally more than one day is needed.
After the sensor substrate is cleaned, the sensor substrate can be dried by heating equipment such as a hair dryer and then placed in a drying bottle or a tank for storage for use.
The thin film resistance heat flow sensor or the thin film thermocouple heat flow sensor manufactured by the method can repolish and clean the sensing surface of the sensor after the sensing element or the thermocouple node is damaged, and the sensing element or the thermocouple node is formed by coating a film, so that the thin film sensor is manufactured for many times, the reuse rate of the preset lead substrate is improved, and the manufacturing cost of the sensor is reduced.
The lead is preset in the sensor substrate, so that the problem of insulation is not considered when the lead is installed on an aircraft model, and the installation difficulty is reduced.
In conclusion, the film sensor manufactured by the method can be used for measuring the surface heat flow of wind tunnel aircraft models such as a shock tunnel of high supersonic speed ground simulation equipment. The lead is directly preset in the sensor substrate, and then the film is coated on the surface of the sensor substrate to form a thermocouple junction or a film sensitive element is formed by adopting a mask, so that the simple manufacture of the lead of the film sensor is realized. The shape and the size of a sensitive element of the film sensor can be conveniently designed, the accurate positioning is carried out, the dense arrangement and the accurate manufacture of measuring points of the sensor are realized, and the defects of difficult positioning and poor repeatability of the dense manufacture of the traditional sensor are overcome. Therefore, the manufacturing precision and efficiency of the film sensor are improved, and the method is suitable for manufacturing the film sensor with any shape.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. A method for manufacturing a lead-in-place type thin film sensor is characterized by comprising the following steps:
A. manufacturing a preset lead substrate: manufacturing a substrate mould according to the shape requirement of the sensor, wherein the substrate material part in the substrate mould is empty, and the lead wire part is solid; then obtaining a substrate based on the substrate mold; adding the lead into the substrate, and combining the lead and the substrate together in a curing mode to complete lead presetting; then processing the substrate to form a sensor substrate;
b2, presetting the thermocouple wire in the sensor substrate, and coating the film on the surface of the sensor substrate by adopting a direct-current magnetic control coating machine to form a thermocouple node to obtain a thin-film thermocouple heat flow sensor;
the specific method for obtaining the film thermocouple heat flow sensor comprises the following steps:
installing a film-coated target, and selecting a target material;
processing a mounting seat, fixing a sensor substrate on the mounting seat, and placing the mounting seat on a sample table in a vacuum chamber of a direct-current magnetic control coating machine;
starting a vacuum pump, and vacuumizing the vacuum chamber to 1-5 multiplied by 10 at an initial pumping speed of 10-9000 liters/second-4Pa; then, opening the pressure reducing plate, reducing the pumping speed to 50-30% of the initial pumping speed, and continuously filling argon to reach 1-8 multiplied by 10-1Pa；
Rotating the sample stage or target at a speed of 5-20 circles/minute; enabling a direct-current magnetron coating machine to stably sputter the sensor substrate, coating the sensor substrate surface, and forming a thermocouple node;
then closing the direct current magnetic control film plating machine, stopping filling argon, continuously vacuumizing the vacuum chamber at 50-30% of the initial vacuumizing speed for 10-60 minutes;
taking out the sensor substrate, heating and baking for a preset time period, and naturally cooling to obtain a thin film thermocouple heat flow sensor; wherein, when the platinum film is plated on the surface of the sensor substrate, the heating and baking temperature is 600 ℃;
wherein the predetermined time period is determined according to the target material to be coated.
2. The method of manufacturing a pre-leaded film sensor as set forth in claim 1, wherein:
the lead material is the same as the thermocouple material.
3. The method for manufacturing a pre-wired thin film sensor according to any one of claims 1 to 2, comprising:
and the step A, processing the substrate comprises grinding and polishing the substrate.
4. The method for manufacturing a pre-wired thin film sensor according to any one of claims 1 to 2, comprising:
the sensor substrate described in step a is further subjected to a step of cleaning, the cleaning including:
the sensor substrate is cleaned by sequentially adopting gasoline, washing powder, primary pure water, dilute sulfuric acid, secondary pure water, alcohol, ultrasonic waves and plasma.
5. The method of manufacturing a pre-leaded film sensor as set forth in claim 4, wherein:
the dilute sulfuric acid is required to be heated to 80-120 ℃, and the cleaning time is 30-60 minutes.
6. The method of manufacturing a pre-leaded film sensor as set forth in claim 1, wherein: the target material comprises platinum, palladium, gold, nickel, copper or thermocouple material.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432799A (en) * | 2002-01-17 | 2003-07-30 | 董述恂 | Film resistor temperature sensor and its making process |
| CN104119812A (en) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device |
| CN105300544A (en) * | 2015-11-12 | 2016-02-03 | 西安交通大学 | Oxide film thermocouple and preparation method thereof |
| CN106197718A (en) * | 2016-08-31 | 2016-12-07 | 北京埃德万斯离子束技术研究所股份有限公司 | A kind of film temperature sensor and preparation method |
| CN107032286A (en) * | 2016-01-29 | 2017-08-11 | 英飞凌科技股份有限公司 | Sensor device and its manufacture method |
| CN107101735A (en) * | 2017-06-13 | 2017-08-29 | 北京卫星环境工程研究所 | For the sheet film thermocouple temperature measurement system of measurement surface transient temperature and application |
| WO2018146787A1 (en) * | 2017-02-10 | 2018-08-16 | 株式会社岡崎製作所 | Resistance temperature sensor and method for fabricating same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101819074B (en) * | 2010-03-16 | 2012-07-04 | 中国飞机强度研究所 | Diaphragm type heat-flow density sensor and manufacturing method thereof |
-
2018
- 2018-08-17 CN CN201810937954.3A patent/CN109186792B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432799A (en) * | 2002-01-17 | 2003-07-30 | 董述恂 | Film resistor temperature sensor and its making process |
| CN104119812A (en) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device |
| CN105300544A (en) * | 2015-11-12 | 2016-02-03 | 西安交通大学 | Oxide film thermocouple and preparation method thereof |
| CN107032286A (en) * | 2016-01-29 | 2017-08-11 | 英飞凌科技股份有限公司 | Sensor device and its manufacture method |
| CN106197718A (en) * | 2016-08-31 | 2016-12-07 | 北京埃德万斯离子束技术研究所股份有限公司 | A kind of film temperature sensor and preparation method |
| WO2018146787A1 (en) * | 2017-02-10 | 2018-08-16 | 株式会社岡崎製作所 | Resistance temperature sensor and method for fabricating same |
| CN107101735A (en) * | 2017-06-13 | 2017-08-29 | 北京卫星环境工程研究所 | For the sheet film thermocouple temperature measurement system of measurement surface transient temperature and application |
Non-Patent Citations (3)
| Title |
|---|
| 刘济春等.预置引线薄膜电阻热流传感器的研制.《第十六届全国激波与激波管学术会议》.2017, * |
| 磁控溅射法制备NiCr/NiSi薄膜热电偶温度传感器;贾颖等;《仪表技术与传感器》;20060412(第2期);第1-3页 * |
| 预置引线薄膜电阻热流传感器的研制;刘济春等;《第十六届全国激波与激波管学术会议》;20170109;第433-438页 * |
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