CN109161372A - A kind of encapsulated epoxy resin of thin film capacitor - Google Patents
A kind of encapsulated epoxy resin of thin film capacitor Download PDFInfo
- Publication number
- CN109161372A CN109161372A CN201810896446.5A CN201810896446A CN109161372A CN 109161372 A CN109161372 A CN 109161372A CN 201810896446 A CN201810896446 A CN 201810896446A CN 109161372 A CN109161372 A CN 109161372A
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- CN
- China
- Prior art keywords
- parts
- epoxy resin
- low speed
- thin film
- added
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
The invention discloses a kind of encapsulated epoxy resins of thin film capacitor, it is characterised in that including following parts by weight of component: 35-40 parts of epoxy resin, 3-4 parts of glass fibre, 1-2 parts of reactive diluent, melting silicon powder 50-55 parts, aluminium hydroxide 3-4,2-3 parts of white carbon black, 2-3 parts of curing agent, 0.01-0.02 parts of dimethyl benzylamine, 5-6 parts of high-performance filler, 0.3-0.5 parts of aluminium hydroxide.The present invention is not easy to crack, and long product lifecycle improves product quality.
Description
Technical field
The present invention relates to thin film capacitor technical field more particularly to a kind of encapsulated epoxy resins of thin film capacitor.
Background technique
Thin film capacitor is to work as electrode with metal foil, itself and poly- ethyl ester, polypropylene, polystyrene or polycarbonate etc. are moulded
Expect film, after the overlapping of both ends, is wound into the capacitor of cylindric construction, end encapsulated epoxy resin carries out close after shaping
Envelope.
Mode of the epoxy resin embedding adhesive by craft or mechanization, is poured into device, after by room temperature or
Heating cure makes its molding, reaches Waterproof, moistureproof and dustproof, and extraneous cooling thermal impact and oscillation are resisted in insulation secrecy and raising
The purpose of power.Therefore, epoxy resin embedding adhesive need to realize excellent electrical property, and good mechanical properties, heat-resisting good, hydroscopicity and heat are swollen
The features such as swollen coefficient is small also needs to meet the requirement such as fire-retardant, thermally conductive, damp resistance thermal and weatherability sometimes.
Existing capacitor encapsulated epoxy resin is easy season cracking in use, influences capacitor and uses the longevity
Life.
Summary of the invention
Present invention aim to address above-mentioned deficiencies, provide a kind of encapsulated epoxy resin of thin film capacitor.
The encapsulated epoxy resin of a kind of thin film capacitor provided by the invention, it is characterised in that including following parts by weight group
Point: 35-40 parts of epoxy resin, 3-4 parts of glass fibre, 1-2 parts of reactive diluent, melting silicon powder 50-55 parts, aluminium hydroxide 3-
4, white carbon black 2-3 parts, 2-3 parts of curing agent, 0.01-0.02 parts of dimethyl benzylamine, 5-6 parts of high-performance filler, aluminium hydroxide 0.3-
0.5 part.
The glass fibre is the broken felt of 3-5mm long.
A kind of preparation method of the encapsulated epoxy resin of thin film capacitor, comprising the following steps: the first step, by ring
Oxygen resin, glass fibre are added blender and carry out after stirring at low speed 2 minutes, by reactive diluent, melting silicon powder, hydroxide
Aluminium, white carbon black, which are added in blender, to be stirred at low speed 5 minutes, is formed epoxy resin mixed liquor after the completion of stirring and is contained storage；The
Dimethyl benzylamine, high-performance filler, aluminium hydroxide are added in another blender after stirring at low speed 2 minutes two steps, by curing agent
It is added in blender and stir at low speed 3 minutes, form curing agent mixed liquor after the completion of stirring and contain storage；Third step, by shape
At epoxy resin mixed liquor be added in another blender, the curing agent mixed liquor of formation is then slowly added into asphalt mixtures modified by epoxy resin
In rouge mixed liquor, it is stirred in addition；It is mixed to use and stir at low speed.
Described stirs at low speed to use revolving speed to be stirred for 50 revs/min of speed.Thin-film electro provided by the invention
The encapsulated epoxy resin of container has following the utility model has the advantages that product ageing-resistant performance is good, and intensity and plasticity are good, and product is not easy to crack；
By first pre- stirring in preparation method, curing agent is slowly added into epoxy resin by when mixing, and resin can be prevented rapidly solid
Change, leads to product quality problem.
A kind of encapsulated epoxy resin of thin film capacitor provided by the invention, not easy to crack, long product lifecycle improve
Product quality.
Specific embodiment
Below by embodiment to further instruction of the present invention, the embodiment of the present invention is with technical solution of the present invention
Premised under implemented, the detailed implementation method and specific operation process are given, but protection scope of the present invention is unlimited
In following embodiments:
Embodiment 1:
A kind of encapsulated epoxy resin of thin film capacitor, including following parts by weight of component: 35 parts of epoxy resin, 3 parts of glass fibre,
1 part of reactive diluent, melting 50 parts of silicon powder, aluminium hydroxide 3,2 parts of white carbon black, 2 parts of curing agent, 0.01 part of dimethyl benzylamine,
5 parts of high-performance filler, 0.3 part of aluminium hydroxide；The glass fibre is the broken felt of 3-5mm long.
A kind of preparation method of the encapsulated epoxy resin of the thin film capacitor, comprising the following steps:
The first step carries out 3 parts of 35 parts of epoxy resin, glass fibre addition blenders after stirring at low speed 2 minutes, and activity is diluted
1 part of agent, 50 parts of silicon powder of melting, aluminium hydroxide 3,2 parts of white carbon black be added in blender and stir at low speed 5 minutes, stirring is completed
Epoxy resin mixed liquor is formed afterwards contains storage；
Low speed in another blender is added in 0.01 part of dimethyl benzylamine, 5 parts of high-performance filler, 0.3 part of aluminium hydroxide by second step
After stirring 2 minutes, will stir at low speed 3 minutes in 2 parts of addition blenders of curing agent, forms curing agent mixing after the completion of stirring
Liquid contains storage；
The epoxy resin mixed liquor of formation is added in another blender by third step, then by the curing agent mixed liquor of formation
It is slowly added into epoxy resin mixed liquor, is stirred in addition；It is mixed to use and stir at low speed；The low speed stirs
It mixes to use revolving speed to be stirred for 50 revs/min of speed.
Embodiment 2:
A kind of encapsulated epoxy resin of thin film capacitor, including following parts by weight of component: 40 parts of epoxy resin, 4 parts of glass fibre,
2 parts of reactive diluent, melting 55 parts of silicon powder, aluminium hydroxide 4,3 parts of white carbon black, 3 parts of curing agent, 0.02 part of dimethyl benzylamine,
6 parts of high-performance filler, 0.5 part of aluminium hydroxide；The glass fibre is the broken felt of 3-5mm long.
A kind of preparation method of the encapsulated epoxy resin of the thin film capacitor, comprising the following steps:
Epoxy resin, glass fibre are added blender and carried out after stirring at low speed 2 minutes by the first step, by reactive diluent, melting
Silicon powder, aluminium hydroxide, white carbon black, which are added in blender, to be stirred at low speed 5 minutes, and epoxy resin mixing is formed after the completion of stirring
Liquid contains storage；
Dimethyl benzylamine, high-performance filler, aluminium hydroxide are added in another blender after stirring at low speed 2 minutes second step, will
Curing agent is added in blender and stir at low speed 3 minutes, forms curing agent mixed liquor after the completion of stirring and contains storage；
The epoxy resin mixed liquor of formation is added in another blender by third step, then by the curing agent mixed liquor of formation
It is slowly added into epoxy resin mixed liquor, is stirred in addition；It is mixed to use and stir at low speed.
Claims (4)
1. a kind of encapsulated epoxy resin of thin film capacitor, it is characterised in that including following parts by weight of component: epoxy resin 35-40
Part, silicon powder 50-55 parts of melting, aluminium hydroxide 3-4,2-3 parts of white carbon black, is consolidated 3-4 parts of glass fibre, 1-2 parts of reactive diluent
2-3 parts of agent, 0.01-0.02 parts of dimethyl benzylamine, 5-6 parts of high-performance filler, 0.3-0.5 parts of aluminium hydroxide.
2. a kind of encapsulated epoxy resin of thin film capacitor as described in claim 1, it is characterised in that: the glass fibre is
The broken felt of 3-5mm long.
3. a kind of preparation method of the encapsulated epoxy resin of thin film capacitor as described in claim 1, it is characterised in that including
Following steps: epoxy resin, glass fibre are added blender and carried out after stirring at low speed 2 minutes by the first step, and activity is diluted
Agent, melting silicon powder, aluminium hydroxide, white carbon black are added in blender and stir at low speed 5 minutes, and asphalt mixtures modified by epoxy resin is formed after the completion of stirring
Rouge mixed liquor contains storage；Low speed in another blender is added in dimethyl benzylamine, high-performance filler, aluminium hydroxide by second step
After stirring 2 minutes, curing agent is added in blender and stir at low speed 3 minutes, forms curing agent mixed liquor after the completion of stirring
Contain storage；The epoxy resin mixed liquor of formation is added in another blender by third step, then mixes the curing agent of formation
It closes liquid to be slowly added into epoxy resin mixed liquor, be stirred in addition；It is mixed to use and stir at low speed.
4. a kind of preparation method of the encapsulated epoxy resin of thin film capacitor as claimed in claim 3, it is characterised in that: described
Stir at low speed to use revolving speed to be stirred for 50 revs/min of speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810896446.5A CN109161372A (en) | 2018-08-08 | 2018-08-08 | A kind of encapsulated epoxy resin of thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810896446.5A CN109161372A (en) | 2018-08-08 | 2018-08-08 | A kind of encapsulated epoxy resin of thin film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109161372A true CN109161372A (en) | 2019-01-08 |
Family
ID=64895061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810896446.5A Pending CN109161372A (en) | 2018-08-08 | 2018-08-08 | A kind of encapsulated epoxy resin of thin film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109161372A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116606619A (en) * | 2023-07-17 | 2023-08-18 | 山东凯恩新材料科技有限公司 | Preparation method of single-component epoxy resin adhesive electronic pouring sealant |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144002A (en) * | 2007-09-29 | 2008-03-19 | 常州市科文传感器材料有限公司 | Temperature sensor imbedding material |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN108251033A (en) * | 2017-12-29 | 2018-07-06 | 广州聚合新材料科技股份有限公司 | A kind of automobile thin film capacitor embedding special epoxy resin glue and preparation method thereof |
-
2018
- 2018-08-08 CN CN201810896446.5A patent/CN109161372A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144002A (en) * | 2007-09-29 | 2008-03-19 | 常州市科文传感器材料有限公司 | Temperature sensor imbedding material |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN108251033A (en) * | 2017-12-29 | 2018-07-06 | 广州聚合新材料科技股份有限公司 | A kind of automobile thin film capacitor embedding special epoxy resin glue and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116606619A (en) * | 2023-07-17 | 2023-08-18 | 山东凯恩新材料科技有限公司 | Preparation method of single-component epoxy resin adhesive electronic pouring sealant |
| CN116606619B (en) * | 2023-07-17 | 2023-09-26 | 山东凯恩新材料科技有限公司 | Preparation method of single-component epoxy resin adhesive electronic pouring sealant |
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Application publication date: 20190108 |