CN106634811A - Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board) - Google Patents
Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board) Download PDFInfo
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- CN106634811A CN106634811A CN201611205058.5A CN201611205058A CN106634811A CN 106634811 A CN106634811 A CN 106634811A CN 201611205058 A CN201611205058 A CN 201611205058A CN 106634811 A CN106634811 A CN 106634811A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention discloses an organosilicon electronic pouring sealant good in impact resistance and used for a PCB (printed circuit board). The organosilicon electronic pouring sealant is prepared by vinyl-terminated silicone oil-1, vinyl-terminated silicone oil-2, 12% platinum catalyst, acetenyl cyclohexanol, vinyl silicone resin, 1-allyloxy radicals-2,3-epoxy propane, 1,3,5,7-tetramethyl cyclotetrasiloxane, a silane coupling agent A171, an appropriate amount of hydrogen-containing silicone oil, alkali magnesium sulfate whiskers, (Heptadecafluoro-1,1,2,2-tetradecyl)trimethoxysilane, sodium dodecyl sulfate, ammonium persulfate, maleic anhydride, fluorine silicone resin emulsion, methyl ethyl ketone peroxide, an appropriate amount of deionized water and an appropriate amount of ethanol. The prepared organosilicon electronic pouring sealant is excellent in comprehensive performance, fast in curing, good in adhesion, high in flowability, simple in preparation process, low in production cost, wide in application range and worthy of popularization.
Description
Technical field
The present invention relates to printed-circuit board encapsulating glue technical field, more particularly to the PCB circuits that a kind of shock resistance is good
Plate organic silicon electronic potting adhesive.
Background technology
With the fast development of electronic science and technology, electronic component, device, instrument and instrument are obtained in the electronics industry
It is widely applied.Because the working environment of many electronic equipments is complicated and changeable, even exceedingly odious natural bar can be run into sometimes
Part, is to protect electronic component and integrated circuit not to be affected by working environment, improves the electric property and stability of electronic device, is tasted
Tasting needs to carry out embedding protection to electronic equipment.Embedding is one of important procedure of electronic components, and it is by Embedding Material
It is filled in the space of electronic device with the method such as mechanical or manual, machine-shaping under certain condition makes device inside
The operating procedure that electronic component and circuit are environmentally isolated with.At present, electronic component and integrated circuit forward direction high-performance, densification,
High accuracy and powerful direction are fast-developing, and this necessarily causes the caloric value of electronic device to greatly improve.Meanwhile, electronics device
The miniaturization of part again strongly reduces its heat-dissipating space, and heat dissipation channel is more crowded, causes heat to gather in a large number, if heat is not
Can timely and effectively conduct, it will the operating temperature for making circuit rises rapidly, cause electronic device fail probability into
Increase again, have a strong impact on the stability and reliability of electronic device, or even the service life that electronic equipment can be shortened.Therefore, use
Not only there is good electrical insulation capability also to have the higher capacity of heat transmission in the Embedding Material of electronic device, in order to avoid height
Cause Embedding Material to catch fire under the working condition such as voltage and electric discharge, also require that Embedding Material has good fire resistance, additionally,
In order to prevent moisture and harmful gass from causing the pollution and corrosion of circuit board, Embedding Material sea by the gap between electronic device
English has good adhesive property.Organosilicon material has excellent electrical insulation capability, especially additional organosilicon casting glue
The consumption of catalyst is less during solidification, and no coupling product is produced, and the dimensional stability of solidfied material is high, and linear shrinkage is low, and chemistry is steady
It is qualitative good, thus development prospect is extensively, but to there is low thermal conductivity, anti-flammability and adhesive property poor for common organic silicon potting adhesive
The shortcomings of, have a strong impact on range of application, although embedding can be improved by a large amount of addition heat fillings, fire retardant and bonding agent
The performance of glue, but the mechanical property of casting glue, processing characteristics can be had adverse effect on, so the Halogen resistance of research autohension
Combustion heat conduction additional organosilicon casting glue has important theory significance and application prospect.
Huang Zhibin exists《The preparation and performance study of heat conductive transparent organic silicon potting adhesive》In one text, by vinyl silicone oil
Studied with architectural characteristic and reinforced filling Miscibility, the species of viscosifier of containing hydrogen silicone oil etc., be prepared for possessing good
The organic silicon potting adhesive of good mechanical property, optical property and adhesive property, have studied VMQ silicones, nano silicon, thickening
The impact to casting glue performance such as agent, on this basis, adds heat filling nano aluminium oxide and nano zine oxide, is prepared for tool
The organic silicon potting adhesive of standby high intensity, high heat conductance and high transmission rate, and nanoparticle, coupling agent modified etc. are have studied to filling
The impact of sealing performance.As a result show the vinyl-terminated silicone fluid of viscosity 19mPa S and 3000mPa S with mass ratio 8:100 compoundings
Based on polymer, add reactive hydrogen mass fraction be 0.8% containing hydrogen silicone oil, make mol ratio n（Si-H）：n（Si-Vi）For
The consumption of 1.2, VMQ silicones prepares the LED casting glues of optimal synthesis performance when being 30phr, synthesized not using additive reaction
Congener viscosifier DA, DAVE and DAVM, the wherein casting glue of DAVM possess optimal adhesive property and optical property, to leading
Hot filler carries out surface silanization process, and the thermal conductivity and refractive index of casting glue are gradually increasing, light transmittance, thermal coefficient of expansion and body
Product resistivity is gradually lowered, and thermostability is significantly improved.But the casting glue synthesized in article is not met by PCB circuits on market
Use requirement of the plate to casting glue, and various aspects of performance is not high, it is necessary to and further improving could expand use range.
The content of the invention
The object of the invention is exactly to make up the defect of prior art, there is provided a kind of good PCB of shock resistance
Use organic silicon electronic potting adhesive.
The present invention is achieved by the following technical solutions：
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, is made up of the raw material of following weight portion：
The 40-50 of vinyl-terminated silicone fluid -1, the 50-60 of vinyl-terminated silicone fluid -2,12% platinum catalyst 0.38-0.5, ethynylcyclohexanol
0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,7- tetramethyl-rings
Tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, alkali magnesium sulfate crystal whisker 5.8-7, the 17 fluorine last of the ten Heavenly stems
Ethyl triethoxy silicane alkane 0.2-0.3, sodium lauryl sulphate 0.1-0.2, Ammonium persulfate. 0.01-0.02, maleic anhydride 3.5-5,
Fluorine silicon resin emulsion 8-10, methyl ethyl ketone peroxide 0.02-0.03, appropriate deionized water, appropriate amount of ethanol.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, is prepared by following concrete steps
Make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, under agitation 12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（2）Alkali magnesium sulfate crystal whisker is added in the 11-14 times of deionized water measured, is heated while stirring until temperature is 65-85
DEG C when add 17 fluorine decyl triethoxysilanes, continue stir 10-20min, wherein stir speed (S.S.) control in 600-800r/
Min, filtered while hot, solid is added to ultrasonic disperse in the 5-7 times of deionized water measured and obtains dispersion liquid after dry, pulverize, then to it
Middle addition sodium lauryl sulphate, Ammonium persulfate. and maleic anhydride, in the case where temperature is for 65-75 DEG C 3-4h is reacted；
（3）By step（2）It is added in fluorine silicon resin emulsion, when being warmed up to 45-55 DEG C after product filtration, washing, the drying of preparation
Methyl ethyl ketone peroxide, constant temperature stirring reaction 1-1.5h is added to filter, solid washing with alcohol is dried afterwards for several times；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing in power mixer is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, in being placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, in pouring mould into
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, the vinyl-terminated silicone fluid -1
Viscosity be 300mPa s, contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s, vinyl
Content is 0.8mol%.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, it is living in described containing hydrogen silicone oil
Property hydrogen content be 0.50Wt%, and the addition of containing hydrogen silicone oil be n (Si-H)：n（Si-Vi）For 1.2-1.4.
It is an advantage of the invention that：Vinyl silicone oil is one of most basic composition of additional organosilicon casting glue, the present invention
Tensile strength and hardness, elongation at break are obtained by selecting the vinyl silicone oil compounding of different viscosities coefficient and contents of ethylene
With all higher organic silicon potting adhesive of elasticity, containing hydrogen silicone oil as cross-linking agent, when its active hydrogen content is higher, with organosilicon embedding
The crosslink density of glue will be larger, and stress can be made to be dispersed on more strands, shows higher tensile strength, hardness
And elongation at break, but when active hydrogen content is too high, crosslinking rate is too fast, and strand has little time to form perfect cross-linked network
Network, and side reaction is also susceptible under the catalyst of Karst, make to form more bubble in organic silicon potting adhesive, cause to lack
Fall into, so it is that 0.5Wt% is more suitable that the present invention selects active hydrogen content, the present invention selects vinyl polysiloxane to fill out as reinforcement
Material, be because with contents of ethylene is more, outer layer by organic team knowledge, molecular weight is little the characteristics of, and and organic silicon potting adhesive
With good dispersion and the compatibility, preferable mobility and the transparency can be kept, and also can be occurred with containing hydrogen silicone oil
Hydrosilylation, it is possible to increase the mechanical property of casting glue, because the universal non-binding of organosilicon material, with base after solidification
There is space between material, the infiltration of long-time steam causes fault occur, and the present invention utilizes chemical reactive synthesis viscosifier, energy
Enough caking property, tensile shear strengths for effectively improving organic silicon potting adhesive, do not affect viscosity and mobility, the present invention also to utilize
Filler improves the heat conductivity and anti-flammability of casting glue, but filler has pole with matrix in terms of molecular structure and physical property
Big difference, and the dispersibility of system is poorer, and the thermal conductivity of casting glue is lifted and is more difficult to, and the surface modification of filler can promote filler
Dispersion in the base, reduces the interface resistance on direction of heat flow, so as to can effectively lift the performances such as the thermal conductivity of system, profit
With modifying agent to alkali magnesium sulfate crystal whisker modification so as to which surface is rich in functional group, is susceptible to be crosslinked, is polymerized, and again
Using maleic anhydride graft copolymerization, change its surface property, and be added in fluorine silicon resin emulsion and make its crosslinking copolymerization, improve
The dispersion compatibility in casting glue, improves thermostability, anti-flammability and the shock resistance of casting glue, filling prepared by the present invention
Sealing excellent combination property, curing rate is fast, and cementability is good, and mobility is high, preparation process is simple, low production cost, using model
Enclose wide, be worthy to be popularized.
Specific embodiment
The good PCB organic silicon electronic potting adhesive of a kind of shock resistance, by following weight portion（Kilogram）Original
Material preparation is made：Vinyl-terminated silicone fluid 40, vinyl-terminated silicone fluid 50,12% platinum catalyst 0.38, ethynylcyclohexanol 0.02,
Vinyl polysiloxane 25,1- allyloxy -2, the tetramethyl-ring tetrasiloxane 23 of 3- expoxy propane 14.8,1,3,5,7-, silane idol
Connection agent A171 2.7, appropriate containing hydrogen silicone oil, alkali magnesium sulfate crystal whisker 5.8,17 fluorine decyl triethoxysilanes 0.2, dodecane
Base sodium sulfate 0.1, Ammonium persulfate. 0.01, maleic anhydride 3.5, fluorine silicon resin emulsion 8, methyl ethyl ketone peroxide 0.02, deionized water
In right amount, appropriate amount of ethanol.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, is prepared by following concrete steps
Make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, under agitation 12% platinum catalyst of Deca 1/4, reacts 2h at 40 DEG C, then rises high-temperature to 68
DEG C reaction 2h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（2）Alkali magnesium sulfate crystal whisker is added in the deionized water of 11 times of amounts, is heated while stirring until temperature adds when being 65 DEG C
Enter 17 fluorine decyl triethoxysilanes, continue to stir 10min, wherein stir speed (S.S.) is controlled in 600r/min, filtered while hot, Gu
Body is added to ultrasonic disperse in the deionized water of 5 times of amounts and obtains dispersion liquid after dry, pulverize, then is added thereto to lauryl sulphate acid
Sodium, Ammonium persulfate. and maleic anhydride, in the case where temperature is for 65 DEG C 3h is reacted；
（3）By step（2）It is added in fluorine silicon resin emulsion after product filtration, washing, the drying of preparation, adds when being warmed up to 45 DEG C
Methyl ethyl ketone peroxide, constant temperature stirring reaction 1h is filtered, and solid washing with alcohol is dried afterwards for several times；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing in power mixer is sufficiently stirred for 35min and obtains B component, by component A and B component according to mass ratio 1；1 in high speed shear
Mixed in the presence of dispersion, in being placed in vacuum drying oven（Vacuum is MPa）Deaeration 10min, pour in mould 110 DEG C it is solid
Change 2h and obtain organic silicon potting adhesive.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, the vinyl-terminated silicone fluid -1
Viscosity be 300mPa s, contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s, vinyl
Content is 0.8mol%.
A kind of good PCB organic silicon electronic potting adhesive of shock resistance, it is living in described containing hydrogen silicone oil
Property hydrogen content be 0.50Wt%, and the addition of containing hydrogen silicone oil be n (SiH)：n（SiVi）For 1.2.
According to casting glue prepared by embodiment, performance test is carried out to it, it is as a result as follows：
Thermal conductivity（W/m•K）：0.65；Tensile strength（MPa）：3.4；Shear strength（MPa）：1.6；Specific insulation（Ω•cm）：
2.1×1015；Anti-flammability (UL94；V 0)：Pass through；Dielectric constant（50HZ）：3.4；Percentage elongation（%）：240.
Claims (4)
1. the good PCB organic silicon electronic potting adhesive of a kind of shock resistance, it is characterised in that by following weight portion
Raw material is made：The 40-50 of vinyl-terminated silicone fluid -1, the 50-60 of vinyl-terminated silicone fluid -2,12% platinum catalyst 0.38-0.5, second
Alkynyl Hexalin 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,
7- tetramethyl-ring tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, alkali magnesium sulfate crystal whisker 5.8-
7th, 17 fluorine decyl triethoxysilane 0.2-0.3, sodium lauryl sulphate 0.1-0.2, Ammonium persulfate. 0.01-0.02, Malaysia
Anhydride 3.5-5, fluorine silicon resin emulsion 8-10, methyl ethyl ketone peroxide 0.02-0.03, appropriate deionized water, appropriate amount of ethanol.
2. a kind of good PCB organic silicon electronic potting adhesive of shock resistance according to claim 1, its feature exists
In being made up of following concrete steps：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171, under agitation 12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, it is standby after natural cooling；
（2）Alkali magnesium sulfate crystal whisker is added in the 11-14 times of deionized water measured, is heated while stirring until temperature is 65-85
DEG C when add 17 fluorine decyl triethoxysilanes, continue stir 10-20min, wherein stir speed (S.S.) control in 600-800r/
Min, filtered while hot, solid is added to ultrasonic disperse in the 5-7 times of deionized water measured and obtains dispersion liquid after dry, pulverize, then to it
Middle addition sodium lauryl sulphate, Ammonium persulfate. and maleic anhydride, in the case where temperature is for 65-75 DEG C 3-4h is reacted；
（3）By step（2）It is added in fluorine silicon resin emulsion, when being warmed up to 45-55 DEG C after product filtration, washing, the drying of preparation
Methyl ethyl ketone peroxide, constant temperature stirring reaction 1-1.5h is added to filter, solid washing with alcohol is dried afterwards for several times；
（4）At room temperature by vinyl-terminated silicone fluid, containing hydrogen silicone oil, vinylite, the step of 3/4 mixing（3）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
Mixing in power mixer is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, in being placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, in pouring mould into
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
3. the good PCB organic silicon electronic potting adhesive of a kind of shock resistance according to claim 1-2, its feature
It is that the viscosity of the vinyl-terminated silicone fluid -1 is 300mPa s, and contents of ethylene is 1.92mol%, vinyl-terminated silicone fluid -2
Viscosity is 1000mPa s, and contents of ethylene is 0.8mol%.
4. the good PCB organic silicon electronic potting adhesive of a kind of shock resistance according to claim 1-2, its feature
It is that active hydrogen content is 0.50Wt% in described containing hydrogen silicone oil, and the addition of containing hydrogen silicone oil is n (Si-H)：n（Si-
Vi）For 1.2-1.4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611205058.5A CN106634811A (en) | 2016-12-23 | 2016-12-23 | Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611205058.5A CN106634811A (en) | 2016-12-23 | 2016-12-23 | Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board) |
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| CN106634811A true CN106634811A (en) | 2017-05-10 |
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| CN201611205058.5A Pending CN106634811A (en) | 2016-12-23 | 2016-12-23 | Organosilicon electronic pouring sealant good in impact resistance and used for PCB (printed circuit board) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116179150A (en) * | 2021-11-26 | 2023-05-30 | 中国工程物理研究院化工材料研究所 | Impact-resistant energy-absorbing organosilicon pouring sealant and preparation method thereof |
| CN114316896A (en) * | 2022-01-17 | 2022-04-12 | 江苏斯迪克新材料科技股份有限公司 | Silicon gel, preparation method and protective film applying silicon gel |
| CN114316896B (en) * | 2022-01-17 | 2023-08-25 | 江苏斯迪克新材料科技股份有限公司 | Silica gel, preparation method and protective film using silica gel |
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Application publication date: 20170510 |