CN109148073B - Coil assembly, plasma generating device and plasma equipment - Google Patents
Coil assembly, plasma generating device and plasma equipment Download PDFInfo
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- CN109148073B CN109148073B CN201710457176.3A CN201710457176A CN109148073B CN 109148073 B CN109148073 B CN 109148073B CN 201710457176 A CN201710457176 A CN 201710457176A CN 109148073 B CN109148073 B CN 109148073B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
- H01F2005/027—Coils wound on non-magnetic supports, e.g. formers wound on formers for receiving several coils with perpendicular winding axes, e.g. for antennae or inductive power transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
- H01F2038/146—Inductive couplings in combination with capacitive coupling
Abstract
The invention provides a coil assembly, wherein the coil assembly comprises a plurality of groups of induction coils, the input ends of the induction coils are electrically connected, and the output ends of the induction coils are uniformly distributed along the circumferential direction of the coil assembly. The invention also provides a plasma generating device and a plasma device. The induction coil can form uniform plasma in the process cavity, and the inductive coupling plasma generating device is small in capacitive coupling and convenient to accurately adjust.
Description
Technical Field
The present invention relates to the field of semiconductor processing equipment, and in particular, to a coil assembly, a plasma generating device including the coil assembly, and plasma equipment including the plasma generating device.
Background
In recent years, with the development of the semiconductor industry, plasma processing techniques have been widely used not only in the semiconductor field but also in the fields of optics, micro-electro-mechanical systems, biological detection, and the like.
Plasma equipment for performing plasma processing techniques includes plasma generating devices and process chambers, while common plasma generating devices include capacitively coupled plasma generating devices, inductively coupled plasma generating devices, and microwave plasma generating devices.
The inductively coupled plasma generator has the advantages of adjustable plasma density and energy, low cost and the like, and is widely applied to the dry etching process.
With the continuous development of the process, the requirement for the distribution uniformity of the plasma on the surface of the wafer to be etched is higher and higher. In order to adapt to different processes, the inductively coupled plasma generating device needs to be adjusted. The adjustment accuracy is affected due to the capacitive coupling between the coils of the inductively coupled plasma generating device.
Therefore, how to further improve the density uniformity of the plasma generated by the inductively coupled plasma generator and improve the adjustment accuracy of the inductively coupled plasma generator is an urgent technical problem to be solved in the art.
Disclosure of Invention
An object of the present invention is to provide a coil assembly, a plasma generating device including the coil assembly, and a plasma apparatus including the plasma generating device. The induction coil is capable of solving at least one of the above technical problems.
In order to achieve the above object, according to one aspect of the present invention, there is provided a coil assembly, which is characterized in that the coil assembly includes a plurality of sets of induction coils, input ends of the plurality of sets of induction coils are electrically connected, and output ends of the plurality of sets of induction coils are uniformly distributed along a circumferential direction of the coil assembly.
Preferably, the coil assembly comprises three sets of induction coils; alternatively, the coil assembly comprises four sets of induction coils.
Preferably, the length of each set of the induction coils satisfies the following formula:
0.01λ≤L≤0.2λ，
wherein, L is the length of each group of induction coils;
λ is the wavelength of the electromagnetic wave output by the radio frequency power supply used to power the coil assembly.
Preferably, the distance between the input end and the output end of each group of the induction coils except the group of the induction coils located at the innermost part of the coil assembly is between 10mm and 25 mm.
Preferably, the difference between the lengths of any two sets of induction coils is no more than 10% of the length of any one set of induction coils.
Preferably, the difference between the length of the induction coil of the innermost group of the coil assembly and the length of the induction coil of any other group is not more than 10% of the length of the induction coil of any group.
Preferably, the group of induction coils located at the innermost part of the coil assembly comprises a first coil and a second coil, the first coil is located at the inner ring of the second coil, the first coil and the second coil are connected in series, the input end of the group of induction coils located at the innermost part of the coil assembly is arranged on the first coil, and the output end of the group of induction coils located at the innermost part of the coil assembly is arranged on the second coil.
Preferably, each set of induction coils has a length of between 230mm and 480 mm.
Preferably, the distance between both ends of the first coil is between 10mm and 25mm, and the distance between both ends of the second coil is between 10mm and 25 mm.
As a second aspect of the present invention, a plasma generating apparatus is provided, where the plasma generating apparatus includes a radio frequency source, a matcher and a coil assembly, which are connected in sequence, where the coil assembly is the coil assembly provided in the present invention, and an output end of the matcher is electrically connected to input ends of each set of coils in the coil assembly.
As a third aspect of the present invention, a plasma apparatus is provided, where the plasma apparatus includes a plasma generating device and a process chamber, a dielectric window is disposed on the process chamber, and the plasma generating device is disposed outside the process chamber, where the plasma generating device is the plasma generating device provided in the present invention, and the coil assembly is disposed above the dielectric window.
Preferably, the plasma equipment further comprises a coil adjusting device, and the coil adjusting device is used for adjusting the distance between each group of induction coils on the coil assembly and the dielectric window.
In the coil assembly provided by the invention, because the output ends of the two adjacent groups of induction coils are in different positions, the phase difference between the output currents of the two adjacent groups of induction coils is not equal to 180 degrees, so that after the coil assembly is electrified, the capacitive coupling between the two adjacent groups of induction coils can avoid the highest point, thereby improving the adjusting capability of the coil assembly on the dissociation degree of gas molecules, improving the accuracy of the graph obtained by a dry etching process and reducing the process cost.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of one embodiment of a plasma generating device provided by the present invention;
FIG. 2 is a schematic view of another embodiment of a plasma generating device provided by the present invention;
fig. 3 is a schematic structural diagram of a plasma apparatus provided by the present invention.
Description of the reference numerals
101: the radio frequency power supply 201: matching device
300: the coil assembly 311: first coil
321: second coil
301. 302, 303, 304: induction coil
400: the process chamber 401: dielectric window
402: chamber wall 403: substrate table
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As an aspect of the present invention, there is provided a coil assembly, as shown in fig. 1 and 2, the coil assembly 300 includes a plurality of sets of induction coils, input ends of the plurality of sets of induction coils are electrically connected, and output ends of the plurality of sets of induction coils are uniformly distributed along a circumferential direction of the coil assembly 300.
As shown in fig. 1 and 2, the coil assembly 300 is used in combination with the rf power source 101 and the matching unit 201 in the plasma generating apparatus. Specifically, the input end of each set of induction coils in the coil assembly 300 is electrically connected to the output end of the matcher 200, and the output end of each coil assembly 300 is electrically connected to a reference voltage terminal (e.g., a ground terminal) located at a different position.
As described above, since the input ends of the respective sets of induction coils are electrically connected and the output ends are positioned differently in the coil assembly 300, there is a phase difference between the phases of the currents of the respective sets of induction coils. That is, the phase difference between the output current phases of any two adjacent sets of induction coils is not 180 °. Therefore, after the coil assembly is powered on, the capacitive coupling between two adjacent groups of induction coils can avoid the capacitive coupling enhancement effect caused by the reverse offset of the current acting at the phase of 180 degrees, so that the adjustment capability of the coil assembly 300 on the dissociation degree of gas molecules can be improved, the accuracy degree of the graph obtained by the dry etching process can be improved, and the process cost can be reduced.
In addition to low capacitive coupling, the coil assembly provided by the present invention is capable of forming a plasma having a uniform density distribution in a process chamber used in conjunction with a plasma generating device including the coil assembly. Specifically, the output end of the matcher 201 is electrically connected to the input end of each induction coil in the coil assembly 300, and the output end of each induction coil in the coil assembly 300 is grounded at different positions, so that a structure in which a plurality of groups of induction lines are connected in parallel with each other is formed, and therefore, the coil assembly includes only one common input end (i.e., a common input end formed after the input ends of different induction lines are electrically connected) and one common output end (i.e., a ground end). Because the output ends of the induction coils are uniformly distributed in the range of 360 degrees, the phase difference between the outputs of the induction coils is uniform, and therefore, the plasma with uniform density can be formed in the process chamber.
In addition, the inductance of the coil assembly is reduced by connecting the multiple groups of induction coils in parallel, the current value of the coil assembly is further improved, and the power coupling efficiency of the coil assembly is improved.
In the present invention, there is no particular limitation on the number of sets of induction coils in the coil assembly 300. The number of sets of induction coils in coil assembly 300 may be determined based on the power density required in the dry etching process. Specifically, the greater the power density, the greater the number of sets of induction coils. In the embodiment of the inductively coupled plasma generating apparatus provided by the present invention shown in fig. 1, the coil assembly 300 includes four sets of induction coils, namely, an induction coil 301, an induction coil 302, an induction coil 303 and an induction coil 304 from inside to outside.
The angle between the line connecting the output end of the induction coil 301 and the center of the coil assembly and the line connecting the output end of the induction coil 302 and the center of the coil assembly is 90 °. When a current is supplied to the coil assembly 300 through the rf source 101 and the matching unit 201, a phase difference between a phase direction of an output current of the induction coil 301 and a phase of an output current of the induction coil 302 is 90 °.
The angle between the line connecting the output of the induction coil 302 and the center of the coil assembly and the line connecting the output of the induction coil 303 and the center of the coil assembly is 90 °. When a current is supplied to the coil assembly 300 through the rf source 101 and the matching unit 201, a phase difference between a phase direction of an output current of the induction coil 302 and a phase of an output current of the induction coil 303 is 90 °.
The angle between the line connecting the output end of the induction coil 303 and the center of the coil assembly and the line connecting the output end of the induction coil 304 and the center of the coil assembly is 90 °. When a current is supplied to the coil assembly 300 through the rf source 101 and the matching unit 201, the phase difference between the phase direction of the output current of the induction coil 303 and the phase of the output current of the induction coil 304 is 90 °.
In fig. 2, another embodiment of the inductively coupled plasma generating apparatus provided by the present invention is shown, and as shown in the figure, the coil assembly 300 includes three sets of induction coils, namely an induction coil 301, an induction coil 302 and an induction coil 303 from inside to outside. The output ends of two adjacent groups of induction lines are separated by 120 degrees.
An angle between a connecting line of the output end of the induction coil 301 and the center of the coil assembly and a connecting line of the output end of the induction coil 302 and the center of the coil assembly is 120 °. When a current is supplied to the coil assembly 300 through the rf source 101 and the matching unit 201, a phase difference between a phase direction of an output current of the induction coil 301 and a phase of an output current of the induction coil 302 is 120 °.
The angle between the line connecting the output of the induction coil 302 and the center of the coil assembly and the line connecting the output of the induction coil 303 and the center of the coil assembly is 120 °. When a current is supplied to the coil assembly 300 through the rf source 101 and the matching unit 201, a phase difference between a phase direction of an output current of the induction coil 302 and a phase of an output current of the induction coil 303 is 120 °.
The number of sets of induction coils can be determined by one skilled in the art based on the power density required for the plasma processing process.
In the present invention, the length of each set of induction coils in the coil assembly 300 is not particularly specified. Preferably, the length of each set of the induction coils satisfies the following formula (1):
0.01λ≤L≤0.2λ (1)
wherein, L is the length of each group of induction coils;
λ is the wavelength of the electromagnetic wave output by the radio frequency power supply used to power the coil assembly.
When the length of each set of induction coils satisfies the above formula (1), standing wave effect can be avoided, so that the plasma generated by the coil assembly can be more uniform.
In the present invention, the wavelength λ of the electromagnetic wave output by the radio frequency source can be calculated according to the formula (2):
λ＝c/f (2)
where c is the transmission speed of electromagnetic waves, usually light beams, and f is the frequency of the radio frequency power source.
For example, for a radio frequency power supply with a frequency of 13.56MHz, the length of each set of induction coils may be between 230mm and 480 mm.
In order to substantially equalize the inductance values between the induction coils, it is preferred that the difference between the lengths of any set of the strip induction coils should not exceed 10% of the length of any set of the induction coils.
As will be readily understood by those skilled in the art, the smaller the radius closer to the inner induction coil, the larger the radius closer to the outer induction coil. Therefore, in order to better avoid the standing wave effect, it is preferable that the difference between the length of the induction coil of the group located at the innermost portion of the coil block and the length of any other induction coil of the group is not more than 10% of the length of any induction coil of the group.
In order to ensure that the difference between the length of the innermost induction coil group of the coil assembly and the length of any other induction coil group should not exceed 10% of the length of any induction coil group, it is preferable that the innermost induction coil group of the coil assembly comprises a first coil and a second coil, the first coil is located at the inner ring of the second coil, the first coil and the second coil are connected in series, the input end of the innermost induction coil group of the coil assembly is disposed on the first coil, and the output end of the innermost induction coil group of the coil assembly is disposed on the second coil.
Specifically, one end of the first coil is formed as an input end of the induction coil located at the innermost portion of the coil block, the other end of the first coil is electrically connected to one end of the second coil, and the other end of the second coil is formed as an output end of the induction coil located at the innermost portion of the coil block.
In the embodiment shown in fig. 1 and 2, the set of induction coils 301 located innermost in the coil assembly comprises a first coil 311 and a second coil 321. As described above, the first coil 311 and the second coil 321 are connected in series.
As described above, in the present invention, the frequency of the rf power source may be 13.56MHz, and the length of each induction line may be 230mm to 480mm as calculated by equation (1).
In the present invention, since each set of induction coils is provided with an input end and an output end, each set of induction coils is not closed, but an opening is formed between the input end and the output end. Preferably, the distance between the input end and the output end of each set of the induction coils, except the induction coil located at the innermost portion of the coil assembly, is between 10mm and 25 mm. The advantage of setting the distance between the input and output of each set of induction coils in the above range is two: 1. the risk of arc discharge fire caused by too close distance between the input end and the output end can be avoided; 2. the influence of an excessively large distance between the input and output ends on the uniformity of the electromagnetic field at the opening formed between the input and output ends can be minimized.
Further preferably, the distance between both ends of the first coil is between 10mm and 25mm, and the distance between both ends of the second coil is between 10mm and 25 mm.
As a second aspect of the present invention, there is provided a plasma generating apparatus, as shown in fig. 1 and 2, comprising a radio frequency source 101, a matcher 201, and a coil assembly 300, which are connected in sequence, wherein the coil assembly is the above-mentioned coil assembly provided by the present invention.
As shown in fig. 1 and fig. 2, an output terminal of the rf power supply 201 is electrically connected to an input terminal of the matcher 201, and an output terminal of the matcher 201 is electrically connected to input terminals of each set of induction coils in the coil assembly 300.
As described above, since the output ends of any two adjacent induction lines are located at different positions, the phase difference between the two adjacent induction lines is not equal to 180 °, and thus it can be known that, after the coil assembly is powered on, the capacitive coupling between two adjacent induction coils can enhance the capacitive coupling effect by avoiding the current acting at 180 ° phase from being cancelled out in the opposite direction, so that the adjusting capability of the coil assembly 300 on the dissociation degree of gas molecules can be improved, the accuracy of the pattern obtained by the dry etching process can be improved, and the process cost can be reduced.
As a third aspect of the present invention, there is provided a plasma apparatus, as shown in fig. 3, comprising a plasma generating device and a process chamber 400. A dielectric window 401 is disposed on the process chamber 400, and the plasma generating device is disposed outside the process chamber 400, wherein the plasma generating device is the above-mentioned inductively coupled generating device provided by the present invention, and the coil assembly 300 is disposed above the dielectric window 401.
It should be noted that "above" is described herein with reference to the orientation in fig. 3.
As described above, a more uniform density plasma may be generated within the process chamber 400 using the plasma generating apparatus.
In order to further increase the density of the plasma in the process chamber 400, it is preferable that the plasma apparatus further comprises a coil adjusting device for adjusting the distance between each set of induction coils on the coil assembly and the dielectric window 401.
As shown in fig. 3, the plasma distribution in the process chamber 400 can be changed by adjusting the distance between the innermost induction coil and the dielectric window 401.
When the distance G = G1 between the innermost induction coil and the dielectric window 401, the density distribution of the plasma in the process chamber 400 is as shown by a curve G1, i.e., the middle density is low and the two sides are high; when the distance G = G2 between the innermost induction coil and the dielectric window 401, the density distribution of the plasma in the process chamber 400 is as shown by the curve G2, i.e., the density is substantially uniform throughout; when the distance G = G3 between the innermost induction coil and the dielectric window 401, the density distribution of the plasma in the process chamber 400 is as shown by the curve G3, i.e., high density in the middle and high density on both sides. Wherein g1 > g2 > g3.
In the present invention, the specific structure of the coil adjusting means is not particularly limited. For example, the coil adjusting means may comprise a stepper motor, by which the distance between each induction line and the dielectric window 401 is adjusted.
Of course, the present invention is not limited thereto. As another embodiment, the coil adjusting means may include a plurality of adjusting bars having different lengths, the adjusting bars being supported between the respective induction lines of the coil assembly 300 and the dielectric window 400. The adjusting rods with different lengths can be replaced according to the density of the plasma in the process chamber until the density of the plasma in the process chamber is uniform.
In the present invention, there is no particular limitation on the specific structure of the process chamber. As shown in fig. 3, the process chamber 400 includes a dielectric window 401, chamber walls 402, and a substrate table 403 disposed inside the process chamber. During dry etching, process gas is introduced into the process chamber 400, a radio frequency source is used for outputting current to the coil assembly 300, and each group of induction coils of the coil assembly 300 form a magnetic field, so that the process gas in the process chamber 400 can be ionized to form plasma, and a substrate arranged on the substrate table 403 can be dry etched.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (12)
1. A coil assembly is characterized by comprising a plurality of groups of induction coils from inside to outside, wherein the input ends of the induction coils are electrically connected, and the output ends of the induction coils are uniformly distributed along the circumferential direction of the coil assembly; the phase difference between the output currents of any two adjacent groups of induction coils is not equal to 180 degrees, so that the capacitive coupling enhancement effect between the two adjacent groups of induction coils is avoided;
the coil assembly comprises a coil assembly and a plurality of induction coils, wherein the coil assembly comprises a first coil and a second coil, the first coil is positioned in an inner ring of the second coil, the first coil is connected with the second coil in series, the current flowing direction of the first coil is the same as that of the second coil, and the current flowing direction of the induction coils of the coil assembly except the innermost induction coil is the same as that of the first coil and that of the second coil.
2. The coil assembly of claim 1, wherein the coil assembly comprises three sets of induction coils; alternatively, the coil assembly comprises four sets of induction coils.
3. The coil assembly of claim 1, wherein the length of each set of the induction coils satisfies the following equation:
0.01λ≤L≤0.2λ，
wherein L is the length of each group of induction coils;
λ is the wavelength of the electromagnetic wave output by the radio frequency power supply used to power the coil assembly.
4. A coil assembly according to any one of claims 1 to 3, wherein the distance between the input and output ends of each set of induction coils, except the innermost set of induction coils located at the coil assembly, is between 10mm and 25 mm.
5. A coil assembly according to any one of claims 1 to 3, wherein the difference between the lengths of any two sets of induction coils is no more than 10% of the length of any one set of induction coils.
6. A coil assembly according to any one of claims 1 to 3, wherein the difference between the length of the innermost induction coil of the coil assembly and the length of any other induction coil of the group is no more than 10% of the length of any induction coil of the group.
7. A coil assembly according to any one of claims 1 to 3, wherein the input ends of the innermost set of induction coils of the coil assembly are provided on the first coil and the output ends of the innermost set of induction coils of the coil assembly are provided on the second coil.
8. A coil assembly according to any one of claims 1 to 3, wherein each set of induction coils has a length of between 230mm and 480 mm.
9. The coil assembly of claim 7, wherein the distance between the two ends of the first coil is between 10mm and 25mm, and the distance between the two ends of the second coil is between 10mm and 25 mm.
10. A plasma generating device, the plasma generating device includes a radio frequency source, a matcher and a coil assembly which are connected in sequence, characterized in that, the coil assembly is the coil assembly of any one of claims 1 to 9, and the output end of the matcher is electrically connected with the input end of each group of the coils in the coil assembly.
11. A plasma apparatus, comprising a plasma generating device and a process chamber, wherein a dielectric window is arranged on the process chamber, and the plasma generating device is arranged outside the process chamber, characterized in that the plasma generating device is the plasma generating device according to claim 10, and the coil assembly is arranged above the dielectric window.
12. The plasma apparatus of claim 11, further comprising a coil adjustment device for adjusting a distance between each set of induction coils on the coil assembly and the dielectric window.
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| CN1511335A (en) * | 2001-03-30 | 2004-07-07 | ��ķ�о�����˾ | Inductive plasma processor including current sensor for plasma excitation coil |
| CN1582485A (en) * | 2001-09-14 | 2005-02-16 | 拉姆研究有限公司 | Plasma processor coil |
| CN101465189A (en) * | 2007-12-17 | 2009-06-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Inductance coupling coil and plasma device |
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| KR100396214B1 (en) * | 2001-06-19 | 2003-09-02 | 주성엔지니어링(주) | Plasma processing apparatus having parallel resonance antenna for very high frequency |
| KR101069384B1 (en) * | 2008-11-14 | 2011-09-30 | 세메스 주식회사 | Inductively coupled plasma antenna and plasma process apparatus including the same |
| CN102548180A (en) * | 2010-12-27 | 2012-07-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Medium window, inductive coupling coil assembly, and plasma processing equipment |
| CN104862671B (en) * | 2014-02-24 | 2019-08-23 | 北京北方华创微电子装备有限公司 | A kind of reaction chamber and plasma processing device |
| CN107333378B (en) * | 2016-04-29 | 2019-05-03 | 中微半导体设备(上海)股份有限公司 | A kind of device for inductively coupled plasma processing and its control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1511335A (en) * | 2001-03-30 | 2004-07-07 | ��ķ�о�����˾ | Inductive plasma processor including current sensor for plasma excitation coil |
| CN1582485A (en) * | 2001-09-14 | 2005-02-16 | 拉姆研究有限公司 | Plasma processor coil |
| CN101465189A (en) * | 2007-12-17 | 2009-06-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Inductance coupling coil and plasma device |
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