CN109135641A - A kind of preparation method of ESD function epoxy glue - Google Patents
A kind of preparation method of ESD function epoxy glue Download PDFInfo
- Publication number
- CN109135641A CN109135641A CN201810755231.1A CN201810755231A CN109135641A CN 109135641 A CN109135641 A CN 109135641A CN 201810755231 A CN201810755231 A CN 201810755231A CN 109135641 A CN109135641 A CN 109135641A
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- CN
- China
- Prior art keywords
- epoxy glue
- parts
- electronic component
- esd function
- esd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention proposes a kind of preparation method of ESD function epoxy glue, includes the following steps: that (1) graphene, zinc oxide, coupling agent are added in epoxide diluent, is dispersed with stirring and uniformly obtains colloidal sol；(2) colloidal sol is added in bisphenol A type epoxy resin, phenolic resin and antimony oxide is added, is uniformly mixing to obtain ESD function adhesive；Insulation bonding of the ESD function epoxy glue for electronic component in the circuit board; it is contacted with the input and output pin of electronic component; it is in parallel with electronic component internal circuit on circuit; ESD function epoxy glue is in high resistant state of insulation; when electronic component overvoltage condition; the conducting of ESD function epoxy glue seepage flow, protects electronic component.Present invention process is simple, low in cost, can effectively save wiring board area, reduces manufacturing cost and process cycle, can promote device circuit reliability.
Description
Technical field
The invention belongs to electronic materials and adhesive area, are related to a kind of preparation method of ESD function epoxy glue.
Background technique
Varistor (MOV), Transient Suppression Diode (TVS) and macromolecule ESD protective element (PESD) are all tradition
The electronic circuit protection scheme of anti-over-voltage electrostatic.As electronic circuitry design integration degree is higher and higher, develop two-sided, multilayer
The buried capacitor of wiring board and functionalization buries baffle-wall, can greatly promote the feasibility of miniaturized design.Jie of ESD defencive function
Matter insulate convered structure in the circuit board as electronic component, can effectively save wiring board area, reduces manufacturing cost, can mention
Rise device circuit reliability.
Summary of the invention
The present invention proposes a kind of preparation method of ESD function epoxy glue, which comprises the steps of:
(1) graphene, zinc oxide, coupling agent are added in epoxide diluent, are dispersed with stirring and uniformly obtain colloidal sol；
(2) colloidal sol is added in bisphenol A type epoxy resin, phenolic resin and antimony oxide is added, is uniformly mixing to obtain
ESD function adhesive；
Each component volume ratio are as follows:
100 parts of bisphenol A type epoxy resin
25-50 parts of epoxide diluent
2-5 parts of coupling agent
40-60 parts of zinc oxide
5-10 parts of graphene
40-45 parts of phenolic resin
6-12 parts of antimony oxide
The volume calculation of each component are as follows: volume=weighing/theoretical density.
The graphene is the preparation of industrial machinery stripping method, and carbon content is greater than 96%, 0.5-5 microns of plane partial size, is less than
10 layers of graphene sheet layer accounts for 80% of gross mass or more.
The Zinc oxide particles partial size is between 0.01 micron to 1 micron.
The epoxide diluent includes ethylene glycol diglycidylether, alkylidene glycidol ether, the shrink of polypropylene glycol two
One of glycerin ether.
The coupling agent is monoalkoxy type titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating type titanium
One of acid esters coupling agent, corrdination type titanate coupling agent, quaternary titanate coupling agent or combinations thereof.
Insulation bonding of the ESD function epoxy glue for electronic component in the circuit board, the input and output with electronic component are drawn
Foot has a contact, in parallel with electronic component internal circuit on circuit, and ESD function epoxy glue is in high resistant state of insulation, when electronics member
When part overvoltage condition, electronic component is protected in the conducting of ESD function epoxy glue seepage flow.
Present invention process is simple, low in cost, can effectively save wiring board area, reduces manufacturing cost and technique week
Phase can promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) 25 parts of ethylene glycol two are added in 5 parts of graphenes, 40 parts of zinc oxide, 2 parts of monoalkoxy type titanate coupling agents to contract
In water glycerin ether, it is dispersed with stirring and uniformly obtains colloidal sol；
(2) colloidal sol is added in 100 parts of bisphenol A type epoxy resins, 40 parts of phenolic resin and 12 parts of antimony oxides is added,
Be uniformly mixing to obtain ESD function adhesive, adhesive tensile strength: 45Mpa, ESD performance reach IEC6100-4-2.
Embodiment 2:
(1) 50 parts of alkylidenes are added in 10 parts of graphenes, 60 parts of zinc oxide, 5 parts of monoalkoxy pyrophosphoric acid ester type coupling agents
In glycidol ether, it is dispersed with stirring and uniformly obtains colloidal sol；
(2) colloidal sol is added in 100 parts of bisphenol A type epoxy resins, 45 parts of phenolic resin and 6 parts of antimony oxides is added,
Be uniformly mixing to obtain ESD function adhesive, adhesive tensile strength: 42Mpa, ESD performance reach IEC6100-4-2.
Embodiment 3:
(1) 8 parts of graphenes, 50 parts of zinc oxide, 3 parts of corrdination type titanate coupling agents are added 30 parts of polypropylene glycols two and shunk
In glycerin ether, it is dispersed with stirring and uniformly obtains colloidal sol；
(2) colloidal sol is added in 100 parts of bisphenol A type epoxy resins, 40 parts of phenolic resin and 10 parts of antimony oxides is added,
Be uniformly mixing to obtain ESD function adhesive, adhesive tensile strength: 39Mpa, ESD performance reach IEC6100-4-2.
Embodiment 4:
(1) 50 parts of ethylene glycol two are added in 6 parts of graphenes, 45 parts of zinc oxide, 2 parts of quaternary titanate coupling agents to shrink
In glycerin ether, it is dispersed with stirring and uniformly obtains colloidal sol；
(2) colloidal sol is added in 100 parts of bisphenol A type epoxy resins, 40 parts of phenolic resin and 8 parts of antimony oxides is added,
Be uniformly mixing to obtain ESD function adhesive, adhesive tensile strength: 46Mpa, ESD performance reach IEC6100-4-2.
Claims (6)
1. a kind of preparation method of ESD function epoxy glue, which comprises the steps of:
(1) graphene, zinc oxide, coupling agent are added in epoxide diluent, are dispersed with stirring and uniformly obtain colloidal sol；
(2) colloidal sol is added in bisphenol A type epoxy resin, phenolic resin and antimony oxide is added, is uniformly mixing to obtain ESD function
It can adhesive；
Each component volume ratio are as follows:
100 parts of bisphenol A type epoxy resin
25-50 parts of epoxide diluent
2-5 parts of coupling agent
40-60 parts of zinc oxide
5-10 parts of graphene
40-45 parts of phenolic resin
6-12 parts of antimony oxide
The volume calculation of each component are as follows: volume=weighing/theoretical density.
2. a kind of preparation method of ESD function epoxy glue according to claim 1, which is characterized in that the graphene is work
The preparation of industry mechanical stripping method, carbon content are greater than 96%, and 0.5-5 microns of plane partial size, the graphene sheet layer less than 10 layers accounts for total matter
80% or more of amount.
3. a kind of preparation method of ESD function epoxy glue according to claim 1, which is characterized in that the Zinc oxide particles
Partial size is between 0.01 micron to 1 micron.
4. a kind of preparation method of ESD function epoxy glue according to claim 1, which is characterized in that the epoxide diluent
Including one of ethylene glycol diglycidylether, alkylidene glycidol ether, polypropylene glycol diglycidyl ether.
5. a kind of preparation method of ESD function epoxy glue according to claim 1, which is characterized in that the coupling agent is single
Alcoxyl fundamental mode titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating titanate coupling agent, corrdination type titanate esters
One of coupling agent, quaternary titanate coupling agent or combinations thereof.
6. a kind of ESD prepared by a kind of preparation method of ESD function epoxy glue as claimed in any one of claims 1 to 5, wherein
Function epoxy glue is contacted for the insulation bonding of electronic component in the circuit board with the input and output pin of electronic component,
In parallel with electronic component internal circuit on circuit, ESD function epoxy glue is in high resistant state of insulation, when electronic component overvoltage condition
When, electronic component is protected in the conducting of ESD function epoxy glue seepage flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755231.1A CN109135641A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation method of ESD function epoxy glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755231.1A CN109135641A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation method of ESD function epoxy glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109135641A true CN109135641A (en) | 2019-01-04 |
Family
ID=64799959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810755231.1A Withdrawn CN109135641A (en) | 2018-07-05 | 2018-07-05 | A kind of preparation method of ESD function epoxy glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109135641A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
-
2018
- 2018-07-05 CN CN201810755231.1A patent/CN109135641A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190104 |