CN108949089A - A kind of preparation method of the polyurethane adhesive of PTC function - Google Patents
A kind of preparation method of the polyurethane adhesive of PTC function Download PDFInfo
- Publication number
- CN108949089A CN108949089A CN201810722277.3A CN201810722277A CN108949089A CN 108949089 A CN108949089 A CN 108949089A CN 201810722277 A CN201810722277 A CN 201810722277A CN 108949089 A CN108949089 A CN 108949089A
- Authority
- CN
- China
- Prior art keywords
- parts
- coupling agent
- polyurethane adhesive
- preparation
- ptc function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Abstract
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of preparation method of the polyurethane adhesive of PTC function.The polyurethane adhesive of the PTC function of preparation is used for the bonding of patch electronics element in the circuit board, it is bonded at the input and/or output end of electronic component and plays the role of conducting, when electric current is excessive or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.Compared to traditional PPTC route protection element, wiring board area can be effectively saved, reduces manufacturing cost, promotes device circuit reliability.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of system of the polyurethane adhesive of PTC function
Preparation Method.
Background technique
Polymer matrix PTC composite material is usually to add conductive filler thereto using polymer as matrix and be made.With electricity
The conducing composite material of resistance positive temperature coefficient can maintain extremely low resistance value at a normal temperature, and have and react temperature change
Sharp characteristic, i.e., when generation overcurrent is rapidly heated in circuit, resistance can increase to a high value moment, make at circuit
In off state, it is used for resettable fuse, to achieve the purpose that protect circuit element.Commercialized PPTC element is being applied to
Electronic circuit usually can more or less tie up the space on wiring board when protecting, it is contemplated that PPTC device is all to connect in circuit
It plays a protective role, using the medium of PTC current-limiting protection function as the cohesive body of connection and component pin and wiring board, Ke Yiyou
The saving wiring board area of effect reduces manufacturing cost, promotes device circuit reliability.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of preparations of the polyurethane adhesive of PTC function
Method, which comprises the steps of:
(1) will conductive agent, coupling agent be added dihydroxy polypropylene oxide ether in, be dispersed with stirring uniformly, be added castor oil and
Toluene di-isocyanate(TDI), pre-polymerization 2.5-3 hours at 60-90 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 70-85
℃;
(3) step (1) and the component of (2) are mixed, degassing, solidification bonding.
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
80-130 parts of conductive agent
3-8 parts of coupling agent
40-50 parts of castor oil
50-65 parts of toluene di-isocyanate(TDI) TDI
To 70-90 parts of two o-chloraniline methane
90-110 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
The conductive agent includes one of silver powder or silver-plated copper powder, and grain diameter is between 0.05 micron to 5 microns, grain
Diameter draw ratio is less than 50.
The coupling agent is monoalkoxy type titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating type titanium
One of acid esters coupling agent, corrdination type titanate coupling agent, quaternary titanate coupling agent or combinations thereof.
The solidification is bonded as at room temperature 15-30 minutes at 2.5-3 hours or 80 DEG C.
The polyurethane adhesive of the PTC function of preparation is used for the bonding of patch electronics element in the circuit board, in electronics member
The input and/or output end of part is bonded and plays the role of conducting, and when electric current is excessive or element over-temperature, resistance sharply increases reality
Existing circuit turns off, and can be self-healing conducting after troubleshooting.Compared to traditional PPTC route protection element, can effectively save
Wiring board area reduces manufacturing cost, promotes device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) silver powder, monoalkoxy pyrophosphoric acid ester type coupling agent are added in dihydroxy polypropylene oxide ether, are dispersed with stirring
It is even, castor oil and toluene di-isocyanate(TDI) are added, pre-polymerization 3 hours at 60 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 70 DEG C;
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
130 parts of silver powder
8 parts of coupling agent of monoalkoxy pyrophosphoric acid ester type
40 parts of castor oil
65 parts of TDI
To 70 parts of two o-chloraniline methane
110 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
(3) step (1) and the component of (2) mixing, degassing, solidification in 2.5 hours bonds at room temperature, tensile strength:
68MPa;Conductivity: 46Scm-1;PTC intensity: 3.9.
Embodiment 2:
(1) silver powder, chelating titanate coupling agent are added in dihydroxy polypropylene oxide ether, are dispersed with stirring uniformly, add
Enter castor oil and toluene di-isocyanate(TDI), pre-polymerization 2.5 hours at 90 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 80 DEG C;
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
100 parts of silver powder
3 parts of chelating titanate coupling agent
50 parts of castor oil
65 parts of TDI
To 70 parts of two o-chloraniline methane
90 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
(3) step (1) and the component of (2) are mixed, degassing, solidification in 15 minutes bonds at 80 DEG C, tensile strength: 71MPa;
Conductivity: 43Scm-1;PTC intensity: 2.8.
Embodiment 3:
(1) silver-plated copper powder, corrdination type titanate coupling agent are added in dihydroxy polypropylene oxide ether, are dispersed with stirring
It is even, castor oil and toluene di-isocyanate(TDI) are added, pre-polymerization 3 hours at 60 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 70 DEG C;
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
80 parts of silver-plated copper powder
3 parts of corrdination type titanate coupling agent
40 parts of castor oil
50 parts of TDI
To 90 parts of two o-chloraniline methane
100 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
(3) step (1) and the component of (2) are mixed, degassing, solidification in 3 hours bonds at room temperature, tensile strength: 55MPa;
Conductivity: 40Scm-1;PTC intensity: 3.1.
Embodiment 4:
(1) silver-plated copper powder, quaternary titanate coupling agent are added in dihydroxy polypropylene oxide ether, are dispersed with stirring
It is even, castor oil and toluene di-isocyanate(TDI) are added, pre-polymerization 3 hours at 80 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 85 DEG C;
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
0 part of silver-plated copper powder
6 parts of quaternary titanate coupling agent
45 parts of castor oil
60 parts of TDI
To 75 parts of two o-chloraniline methane
90 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
(3) step (1) and the component of (2) are mixed, degassing, solidification in 20 minutes bonds at 80 DEG C, tensile strength: 70MPa;
Conductivity: 48Scm-1;PTC intensity: 2.9.
Claims (5)
1. a kind of preparation method of the polyurethane adhesive of PTC function, which comprises the steps of:
(1) conductive agent, coupling agent are added in dihydroxy polypropylene oxide ether, are dispersed with stirring uniformly, castor oil and toluene is added
Diisocyanate, pre-polymerization 2.5-3 hours at 60-90 DEG C;
(2) two o-chloraniline methane will be added in dihydroxytetrahydrofandn propylene oxide copolyether, and will be heated to 70-85 DEG C;
(3) step (1) and the component of (2) are mixed, degassing, solidification bonding.
Each component volume ratio are as follows:
100 parts of dihydroxy polypropylene oxide ether
80-130 parts of conductive agent
3-8 parts of coupling agent
40-50 parts of castor oil
50-65 parts of toluene di-isocyanate(TDI) TDI
To 70-90 parts of two o-chloraniline methane
90-110 parts of dihydroxytetrahydrofandn propylene oxide copolyether
The volume calculation of each component are as follows: volume=weighing/theoretical density.
2. a kind of preparation method of the polyurethane adhesive of PTC function according to claim 1, which is characterized in that described to lead
Electric agent includes one of silver powder or silver-plated copper powder, and between 0.05 micron to 5 microns, partial size draw ratio is less than grain diameter
50。
3. a kind of preparation method of the polyurethane adhesive of PTC function according to claim 1, which is characterized in that the idol
Connection agent is monoalkoxy type titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating titanate coupling agent, coordination
One of type titanate coupling agent, quaternary titanate coupling agent or combinations thereof.
4. a kind of preparation method of the polyurethane adhesive of PTC function according to claim 1, which is characterized in that described solid
Change is bonded as at room temperature 15-30 minutes at 2.5-3 hours or 80 DEG C.
5. prepared by a kind of preparation method of the polyurethane adhesive of the PTC function as described in Claims 1 to 4 any one
The polyurethane adhesive of PTC function, for the bonding of patch electronics element in the circuit board, electronic component input and/or
Output end is bonded and plays the role of conducting, and when electric current is excessive or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, therefore
Barrier can be self-healing conducting after excluding.
Priority Applications (1)
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CN201810722277.3A CN108949089A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of the polyurethane adhesive of PTC function |
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CN201810722277.3A CN108949089A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of the polyurethane adhesive of PTC function |
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CN108949089A true CN108949089A (en) | 2018-12-07 |
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CN201810722277.3A Withdrawn CN108949089A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of the polyurethane adhesive of PTC function |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109943252A (en) * | 2019-02-28 | 2019-06-28 | 苏州金枪新材料股份有限公司 | A kind of wicker copper conducting resinl and preparation method thereof |
Citations (5)
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CN1629245A (en) * | 2004-10-29 | 2005-06-22 | 东华大学 | Boiling resistant polyurethane adhesive and method for preparing same |
CN1786096A (en) * | 2004-12-08 | 2006-06-14 | Lg电线株式会社 | Anisotropic conductive adhesive having PTC characteristics |
CN102102006A (en) * | 2010-12-20 | 2011-06-22 | 东莞市宏达聚氨酯有限公司 | Method for preparing bi-component polyurethane pouring sealant and product thereof |
CN103614108A (en) * | 2013-11-30 | 2014-03-05 | 江苏力合粘合剂有限公司 | Flexible packaging composite resin and preparation method thereof |
CN105551698A (en) * | 2015-12-14 | 2016-05-04 | 天津凯华绝缘材料股份有限公司 | PPTC electrode paste and preparation method therefor |
-
2018
- 2018-06-26 CN CN201810722277.3A patent/CN108949089A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1629245A (en) * | 2004-10-29 | 2005-06-22 | 东华大学 | Boiling resistant polyurethane adhesive and method for preparing same |
CN1786096A (en) * | 2004-12-08 | 2006-06-14 | Lg电线株式会社 | Anisotropic conductive adhesive having PTC characteristics |
CN102102006A (en) * | 2010-12-20 | 2011-06-22 | 东莞市宏达聚氨酯有限公司 | Method for preparing bi-component polyurethane pouring sealant and product thereof |
CN103614108A (en) * | 2013-11-30 | 2014-03-05 | 江苏力合粘合剂有限公司 | Flexible packaging composite resin and preparation method thereof |
CN105551698A (en) * | 2015-12-14 | 2016-05-04 | 天津凯华绝缘材料股份有限公司 | PPTC electrode paste and preparation method therefor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109943252A (en) * | 2019-02-28 | 2019-06-28 | 苏州金枪新材料股份有限公司 | A kind of wicker copper conducting resinl and preparation method thereof |
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Application publication date: 20181207 |