CN108893088A - A kind of PTC function SPUR adhesive - Google Patents
A kind of PTC function SPUR adhesive Download PDFInfo
- Publication number
- CN108893088A CN108893088A CN201810610703.4A CN201810610703A CN108893088A CN 108893088 A CN108893088 A CN 108893088A CN 201810610703 A CN201810610703 A CN 201810610703A CN 108893088 A CN108893088 A CN 108893088A
- Authority
- CN
- China
- Prior art keywords
- ptc function
- parts
- tin
- spur
- spur adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Abstract
The present invention is a kind of PTC function SPUR adhesive; two kinds of molding bonded modes can be solidified using photocuring and wet gas environments according to application demand; for the end I/O of flexible electronic component and the bonding of circuit board line; and play the role of conducting; when electric current is excessive or element over-temperature; resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting, can play overcurrent and overheat protector function in circuit.
Description
Technical field
The invention belongs to electronic materials and adhesive area, are related to a kind of PTC function SPUR adhesive.
Background technique
Polymer matrix PTC composite material is usually to add conductive filler thereto using polymer as matrix and be made.With electricity
The conducing composite material of resistance positive temperature coefficient can maintain extremely low resistance value at a normal temperature, and have and react temperature change
Sharp characteristic, i.e., when generation overcurrent is rapidly heated in circuit, resistance can increase to a high value moment, make at circuit
In off state, it is used for resettable fuse, to achieve the purpose that protect circuit element.Commercialized PPTC element is being applied to
Electronic circuit usually can more or less tie up the space on wiring board when protecting, it is contemplated that PPTC device is all to connect in circuit
It plays a protective role, using the medium of PTC current-limiting protection function as the cohesive body of connection and component pin and wiring board, Ke Yiyou
The saving wiring board area of effect reduces manufacturing cost, promotes device circuit reliability.For the installation requirements and system of different elements
At feature, the curing mode of binder is needed to have certain versatility.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of PTC function SPUR adhesive, feature exists
In each weight ratio of constituents is：
100 parts of silane end capped polyurethane prepolymer
5~10 parts of methyl-silicone oil
700~900 parts of conductive agent
1~5 part of dibutoxy diacyloxysilanes
1~5 part of photoinitiator
0.5~1 part of organotin
Each component is sequentially placed into stirred tank under dried over anhydrous environment when preparation to be uniformly mixed, is protected from light under dry environment and protects
It deposits, under light illumination or is added vapor equal curable binder when use.
The conductive agent is one of silver powder or silver-plated copper powder, and grain diameter is between 0.05 micron to 5 microns, partial size
Draw ratio is less than 50.
The photoinitiator includes one of benzoin ethyl ether, diazonium salt, alkyl sulfosalt.
The organotin includes one of stannous methide, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
Input and/or output end of the PTC function SPUR adhesive for electronic component is bonded and plays the role of conducting, works as electricity
When flowing through big or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.
SPUR adhesive of the present invention can solidify two kinds of molding bonded sides using photocuring and wet gas environments according to application demand
Formula can play overcurrent and overheat protector function for the end I/O of flexible electronic component and the bonding of circuit board line in circuit
Energy.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1：
By 100 parts of silane end capped polyurethane prepolymers, 5 parts of methyl-silicone oils, 900 parts of silver powder, 4 part two under dried over anhydrous environment
Butoxy diacyloxysilanes, 1 part of benzoin ethyl ether, 1 part of stannous methide are sequentially placed into stirred tank and are uniformly mixed, obtain SPUR
Adhesive is protected from light under dry environment and saves.
Solidify bonding, tensile strength when use under room temperature UV illumination：49MPa；Conductivity：51Scm-1；PTC intensity：3.0.
Embodiment 2：
By 100 parts of silane end capped polyurethane prepolymers, 6 parts of methyl-silicone oils, 700 parts of silver-plated copper powders, 1 under dried over anhydrous environment
Part dibutoxy diacyloxysilanes, 5 parts of diazonium salts, 0.5 part of dioctyl tin are sequentially placed into stirred tank and are uniformly mixed, obtain
SPUR adhesive is protected from light under dry environment and saves.
Solidify bonding, tensile strength when use under room temperature UV illumination：55MPa；Conductivity：40Scm-1；PTC intensity：3.3.
Embodiment 3：
By 100 parts of silane end capped polyurethane prepolymers, 8 parts of methyl-silicone oils, 700 silver-plated copper powders, 3 parts under dried over anhydrous environment
Dibutoxy diacyloxysilanes, 3 parts of alkyl sulfosalts, 1 part of tributyl tin are sequentially placed into stirred tank and are uniformly mixed, obtain
SPUR adhesive is protected from light under dry environment and saves.
Solidify bonding, tensile strength when use under 90% humidity environment：50MPa；Conductivity：43Scm-1；PTC intensity：
3.1。
Embodiment 4：
By 100 parts of silane end capped polyurethane prepolymers, 10 parts of methyl-silicone oils, 800 parts of silver powder, 5 parts under dried over anhydrous environment
Dibutoxy diacyloxysilanes, 1~5 part of benzoin ethyl ether, 1 part of tin dilaurate tin diethyl are sequentially placed into stirred tank mixing
Uniformly, SPUR adhesive is obtained, is protected from light under dry environment and saves.
Solidify bonding, tensile strength when use under 80% humidity environment：44MPa；Conductivity：53Scm-1；PTC intensity：
3.3。
Claims (5)
1. a kind of PTC function SPUR adhesive, which is characterized in that each weight ratio of constituents is：
100 parts of silane end capped polyurethane prepolymer
5~10 parts of methyl-silicone oil
700~900 parts of conductive agent
1~5 part of dibutoxy diacyloxysilanes
1~5 part of photoinitiator
0.5~1 part of organotin
Each component is sequentially placed into stirred tank under dried over anhydrous environment when preparation to be uniformly mixed, is protected from light under dry environment and saves, make
Used time under light illumination or be added the equal curable binder of vapor.
2. a kind of PTC function SPUR adhesive according to claim 1, which is characterized in that the conductive agent is silver powder or plating
One of silver-bearing copper powder, grain diameter is between 0.05 micron to 5 microns, and partial size draw ratio is less than 50.
3. a kind of PTC function SPUR adhesive according to claim 1, which is characterized in that the photoinitiator includes resting in peace
One of fragrant ether, diazonium salt, alkyl sulfosalt.
4. a kind of PTC function SPUR adhesive according to claim 1, which is characterized in that the organotin includes dimethyl
One of tin, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
5. a kind of PTC function SPUR adhesive according to claim 1, which is characterized in that for electronic component input and/
Or output end is bonded and plays the role of conducting, when electric current is excessive or element over-temperature, resistance, which sharply increases, realizes circuit shutdown,
It can be self-healing conducting after troubleshooting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610703.4A CN108893088A (en) | 2018-06-07 | 2018-06-07 | A kind of PTC function SPUR adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610703.4A CN108893088A (en) | 2018-06-07 | 2018-06-07 | A kind of PTC function SPUR adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108893088A true CN108893088A (en) | 2018-11-27 |
Family
ID=64345144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810610703.4A Pending CN108893088A (en) | 2018-06-07 | 2018-06-07 | A kind of PTC function SPUR adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108893088A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109943252A (en) * | 2019-02-28 | 2019-06-28 | 苏州金枪新材料股份有限公司 | A kind of wicker copper conducting resinl and preparation method thereof |
| CN113366044A (en) * | 2018-12-26 | 2021-09-07 | 迈图高新材料公司 | Silicone-based curable composition and use thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103360940A (en) * | 2012-03-31 | 2013-10-23 | 江南大学 | Preparation method of ultraviolet light/humidity dual-cured high-weatherability organic silicon hybrid polyurethane resin |
| CN105294986A (en) * | 2015-10-29 | 2016-02-03 | 广州擎天材料科技有限公司 | Solid-state hypocrystalline unsaturated polyurethane prepolymer and preparation method thereof |
| CN105551698A (en) * | 2015-12-14 | 2016-05-04 | 天津凯华绝缘材料股份有限公司 | PPTC electrode paste and preparation method therefor |
-
2018
- 2018-06-07 CN CN201810610703.4A patent/CN108893088A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103360940A (en) * | 2012-03-31 | 2013-10-23 | 江南大学 | Preparation method of ultraviolet light/humidity dual-cured high-weatherability organic silicon hybrid polyurethane resin |
| CN105294986A (en) * | 2015-10-29 | 2016-02-03 | 广州擎天材料科技有限公司 | Solid-state hypocrystalline unsaturated polyurethane prepolymer and preparation method thereof |
| CN105551698A (en) * | 2015-12-14 | 2016-05-04 | 天津凯华绝缘材料股份有限公司 | PPTC electrode paste and preparation method therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113366044A (en) * | 2018-12-26 | 2021-09-07 | 迈图高新材料公司 | Silicone-based curable composition and use thereof |
| CN109943252A (en) * | 2019-02-28 | 2019-06-28 | 苏州金枪新材料股份有限公司 | A kind of wicker copper conducting resinl and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108893088A (en) | A kind of PTC function SPUR adhesive | |
| EP2660828A1 (en) | Apparatus comprising thermal fuse and resistor | |
| CN201036096Y (en) | Composite type positive temperature coefficient thermal resistance | |
| CN105551698A (en) | PPTC electrode paste and preparation method therefor | |
| CN105390219A (en) | Component with over-voltage over-current protective effect and manufacturing process of the same | |
| JP2000208302A (en) | Electric device containing positive temperature coefficient resistant composition and producing method therefor | |
| KR20170083630A (en) | Positive temperature coefficient composition | |
| CN105190790B (en) | rheostat with aging alarm | |
| CN101565592A (en) | Strippable welding protection adhesive | |
| CN202282601U (en) | Protection circuit combining high-polymer phenylthiocarbamide (PTC) thermistor and piezoresistor | |
| CN106928611A (en) | A kind of piezoresistor insulation cover of heatproof | |
| CN105706189B (en) | Electronic component and its manufacturing method | |
| CN203166496U (en) | Module type lightning surge protection device | |
| CN204834219U (en) | Thermistor with fuse | |
| CN107221914A (en) | Circuit overvoltage, overcurrent and superheat is protected | |
| JP2006286986A (en) | Electronic component and manufacturing method thereof | |
| CN108949089A (en) | A kind of preparation method of the polyurethane adhesive of PTC function | |
| CN202534449U (en) | Cement resistor with temperature fuse wire | |
| US6396383B1 (en) | Protective element | |
| CN211320041U (en) | Fuse based on intelligent PTC high polymer material | |
| CN203387159U (en) | Short circuit protection circuit of triode voltage stabilizing circuit | |
| CN109082257A (en) | A kind of wet dual-purpose solidification glue of PESD function light | |
| CN207587667U (en) | A kind of thermal overload release of breaker of plastic casing | |
| CN202534450U (en) | Cement resistor | |
| CN206236635U (en) | A kind of thick film silver-based ceramic melt part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181127 |
|
| WD01 | Invention patent application deemed withdrawn after publication |