CN108949095A - A kind of organic silicon high-temperature adhesive of PTC function - Google Patents
A kind of organic silicon high-temperature adhesive of PTC function Download PDFInfo
- Publication number
- CN108949095A CN108949095A CN201810611009.4A CN201810611009A CN108949095A CN 108949095 A CN108949095 A CN 108949095A CN 201810611009 A CN201810611009 A CN 201810611009A CN 108949095 A CN108949095 A CN 108949095A
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- CN
- China
- Prior art keywords
- parts
- organic silicon
- temperature adhesive
- ptc function
- silicon high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
Invention provides a kind of organic silicon high-temperature adhesive of PTC function, which is characterized in that each weight ratio of constituents are as follows: 100 parts of silicone resin, first and second 20-30 parts of base silicon rubber electrolytic silver powders, 700-900 parts, 10-15 parts of ethyl orthosilicate, 0.5-1 parts of n-butyl boronate, 1-2 parts of organotin；The organic silicon high-temperature adhesive of PTC function is used for the bonding of patch electronics element in the circuit board, solidify under 80-120 degrees celsius, it is bonded at the input and/or output end of electronic component and plays the role of conducting, when electric current is excessive or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of organic silicon high-temperature adhesive of PTC function.
Background technique
Polymer matrix PTC composite material is usually to add conductive filler thereto using polymer as matrix and be made.With electricity
The conducing composite material of resistance positive temperature coefficient can maintain extremely low resistance value at a normal temperature, and have and react temperature change
Sharp characteristic, i.e., when generation overcurrent is rapidly heated in circuit, resistance can increase to a high value moment, make at circuit
In off state, it is used for resettable fuse, to achieve the purpose that protect circuit element.Commercialized PPTC element is being applied to
Electronic circuit usually can more or less tie up the space on wiring board when protecting, it is contemplated that PPTC device is all to connect in circuit
It plays a protective role, using the medium of PTC current-limiting protection function as the cohesive body of connection and component pin and wiring board, Ke Yiyou
The saving wiring board area of effect reduces manufacturing cost, promotes device circuit reliability.
Organosilicon material has brilliant cold-and-heat resistent impact, anti-aging property, it is made to bonding in conjunction with conductive filler
Agent, applies to the bonding at the end discrete electronic component I/O on wiring board, and plays a protective role.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of organic silicon high-temperature adhesive of PTC function,
It is characterized in that, each weight ratio of constituents are as follows:
100 parts of silicone resin
First and second 20-30 parts of base silicon rubber
700-900 parts of electrolytic silver powder
10-15 parts of ethyl orthosilicate
0.5-1 parts of n-butyl boronate
1-2 parts of organotin
The organic silicon high-temperature adhesive of PTC function is used for the bonding of patch electronics element in the circuit board, and 80-120 is Celsius
Solidify under the conditions of degree, conducting is bonded and plays the role of at the input and/or output end of electronic component, when electric current is excessive or element
When overheat, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.
The silicone resin solid content 75-95%.
The electrolytic silver powder grain diameter is between 0.05 micron to 5 microns, and partial size draw ratio is less than 50.
The organotin includes one of stannous methide, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
The organic silicon high-temperature adhesive preparation method of PTC function is to pinch silicone resin, the first and second base silicon rubber, electrolytic silver powder
After being mediated uniformly in conjunction machine, other components are added, are uniformly mixed.
The present invention is using the organic silicon composite medium of conduction of PTC current-limiting protection function as connection and component pin and line
The cohesive body of road plate can effectively save wiring board area, reduce manufacturing cost, can promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
After 100 parts of silicone resin, 20 part of first and second base silicon rubber, 900 parts of electrolytic silver powders are mediated uniformly in kneader, it is added
10 parts of ethyl orthosilicates, 0.5 part of n-butyl boronate, 1 part of dioctyl tin, are uniformly mixed, and the organosilicon for obtaining PTC function is high
Warm adhesive solidifies bonding, tensile strength: 18MPa under 100 degrees celsius；Conductivity: 65Scm-1；PTC intensity: 3.1.
Embodiment 2:
After 100 parts of silicone resin, 30 part of first and second base silicon rubber, 700 parts of electrolytic silver powders are mediated uniformly in kneader, it is added
15 parts of ethyl orthosilicates, 0.5 part of n-butyl boronate, 1 part of tributyl tin, are uniformly mixed, and the organosilicon for obtaining PTC function is high
Warm adhesive solidifies bonding, tensile strength: 19MPa under 120 degrees celsius；Conductivity: 72Scm-1；PTC intensity: 3.0.
Embodiment 3:
After 100 parts of silicone resin, 25 part of first and second base silicon rubber, 800 parts of electrolytic silver powders are mediated uniformly in kneader, it is added
15 parts of ethyl orthosilicates, 1 part of n-butyl boronate, 2 parts of tin dilaurate tin diethyls, are uniformly mixed, obtain having for PTC function
Machine silicon high temperature adhesive solidifies bonding, tensile strength: 16MPa under 120 degrees celsius；Conductivity: 73Scm-1；PTC intensity:
2.9。
Embodiment 4:
After 100 parts of silicone resin, 20 part of first and second base silicon rubber, 900 parts of electrolytic silver powders are mediated uniformly in kneader, it is added
15 parts of ethyl orthosilicates, 1 part of n-butyl boronate, 1 part of tin dilaurate tin diethyl, are uniformly mixed, obtain having for PTC function
Machine silicon high temperature adhesive solidifies bonding, tensile strength: 18MPa under 90 degrees celsius；Conductivity: 66Scm-1；PTC intensity:
3.2。
Claims (5)
1. a kind of organic silicon high-temperature adhesive of PTC function, which is characterized in that each weight ratio of constituents are as follows:
100 parts of silicone resin
First and second 20-30 parts of base silicon rubber
700-900 parts of electrolytic silver powder
10-15 parts of ethyl orthosilicate
0.5-1 parts of n-butyl boronate
1-2 parts of organotin
The organic silicon high-temperature adhesive of PTC function is used for the bonding of patch electronics element in the circuit board, 80-120 degrees Celsius of item
Solidify under part, conducting is bonded and plays the role of at the input and/or output end of electronic component, when electric current is excessive or element over-temperature
When, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.
2. a kind of organic silicon high-temperature adhesive of PTC function according to claim 1, which is characterized in that the silicone resin is solid
Content 75-95%.
3. a kind of organic silicon high-temperature adhesive of PTC function according to claim 1, which is characterized in that the electrolytic silver powder
Grain diameter is between 0.05 micron to 5 microns, and partial size draw ratio is less than 50.
4. a kind of organic silicon high-temperature adhesive of PTC function according to claim 1, which is characterized in that the organotin packet
Include one of stannous methide, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
5. a kind of organic silicon high-temperature adhesive of PTC function according to claim 1, which is characterized in that preparation method is
After silicone resin, the first and second base silicon rubber, electrolytic silver powder are mediated uniformly in kneader, other components are added, are uniformly mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611009.4A CN108949095A (en) | 2018-06-07 | 2018-06-07 | A kind of organic silicon high-temperature adhesive of PTC function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611009.4A CN108949095A (en) | 2018-06-07 | 2018-06-07 | A kind of organic silicon high-temperature adhesive of PTC function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108949095A true CN108949095A (en) | 2018-12-07 |
Family
ID=64488683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810611009.4A Withdrawn CN108949095A (en) | 2018-06-07 | 2018-06-07 | A kind of organic silicon high-temperature adhesive of PTC function |
Country Status (1)
| Country | Link |
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| CN (1) | CN108949095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112708391A (en) * | 2020-12-10 | 2021-04-27 | 晟大科技(南通)有限公司 | Special adhesive for Flexible Printed Circuit (FPC) and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181159A (en) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof |
| CN102516924A (en) * | 2011-12-07 | 2012-06-27 | 上海应用技术学院 | Conductive organosilicon pressure-sensitive adhesive emulsion and its preparation method |
-
2018
- 2018-06-07 CN CN201810611009.4A patent/CN108949095A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181159A (en) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof |
| CN102516924A (en) * | 2011-12-07 | 2012-06-27 | 上海应用技术学院 | Conductive organosilicon pressure-sensitive adhesive emulsion and its preparation method |
Non-Patent Citations (1)
| Title |
|---|
| 黄文润: "《液体硅橡胶》", 30 June 2009, 四川科学技术出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112708391A (en) * | 2020-12-10 | 2021-04-27 | 晟大科技(南通)有限公司 | Special adhesive for Flexible Printed Circuit (FPC) and preparation method thereof |
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Application publication date: 20181207 |