CN201222387Y - High molecule PTC chip and surface paste-loading type overcurrent over-temperature protection element - Google Patents
High molecule PTC chip and surface paste-loading type overcurrent over-temperature protection element Download PDFInfo
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- CN201222387Y CN201222387Y CNU2008201504763U CN200820150476U CN201222387Y CN 201222387 Y CN201222387 Y CN 201222387Y CN U2008201504763 U CNU2008201504763 U CN U2008201504763U CN 200820150476 U CN200820150476 U CN 200820150476U CN 201222387 Y CN201222387 Y CN 201222387Y
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- metal foil
- electrode sheet
- foil electrode
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Abstract
The utility model discloses a polymer PTC chip and a surface-mounted polymer PTC over-current excess-temperature protective element made by the PTC chip, wherein the polymer PTC chip comprises a polymer PTC material layer, a casing body and metal foil electrode slices which are respectively attached on the upper surface and the lower surface of the polymer PTC chip, wherein the casing body is a frame-shaped structure, whose center is provided with a through hole, the upper and the lower metal foil electrode slices are respectively adhered on the upper surface and the lower surface of the casing body, and the polymer PTC material layer is closed in a cavity between the metal foil electrode slices and the through hole of the casing body. Compared with the prior art, the utility model is characterized in that polymer PTC materials are coated in the casing body through a simple structure, which do not directly contact with air, and greatly improve the weatherability.
Description
Technical field
The utility model relates to a kind of electronic devices and components that are used for the excess-current excess-temperature protection, the surface labeling type polymer PTC overflow over-temperature protection element that is specifically related to a kind of high polymer PTC chip and utilizes this high polymer PTC chip to make.
Background technology
Functional high molecule material is the focus of present material science research, and the high molecular composite conductive material with ptc characteristics is outstanding person wherein, and academia's industrial circle being is all is being researched and developed it enthusiastically so far.So-called high molecular PTC composite conducting material has the high molecular composite conductive material of PTC (positive temperature coefficient " positive temperature coefficient ") resistance characteristic exactly.That is to say that in certain temperature range, the resistivity of this electric conducting material self can increase with the rising of temperature.This excess-current excess-temperature protection element is composited by macromolecular material filled conductive particle.Described macromolecular material comprises thermosetting polymer and thermoplastic polymer, and thermoplastic polymer comprises polyethylene, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, Kynoar, polytrifluorochloroethylene etc.; Thermosetting polymer mainly contains epoxy resin.Conducting particles comprises carbon black and metal dust, and the surface is coated with graphite, carbon black, ceramic fine bead, the glass microballoon of metal.Metal dust commonly used comprises silver powder, copper powder, aluminium powder, nickel powder, stainless steel powder.
Utilize the high molecular PTC composite conducting material to make the macromolecule excess-current excess-temperature protection element, can be used as the excess-current excess-temperature protective device of circuit.It is connected in the circuit and uses, and lower by the electric current of macromolecule excess-current excess-temperature protection element during the circuit operate as normal, its temperature is lower, presents low resistance state, can not influence the circuit operate as normal.And when the big electric current that causes by fault when this macromolecule excess-current excess-temperature protection element, its temperature can raise suddenly, causes that himself resistance value becomes greatly suddenly, so just makes circuit present approximate off state, thereby plays the protective circuit effect.After fault was got rid of, the temperature of macromolecule excess-current excess-temperature protection element descended, and its resistance value can return to the low resistance state again.Therefore, this is a kind of fuse that can recover automatically in fact, has been widely applied in the fields such as computer, communication equipment, automotive electronics, family expenses and Industry Control electric equipment.
The macromolecule excess-current excess-temperature protection element is widely used in the overcurrent protection field, and the miniaturization of electronic devices and components is present development trends, and this also has higher requirement to the encapsulation technology of macromolecule excess-current excess-temperature protection element.Because the side of excess-current excess-temperature protection element especially for the excess-current excess-temperature protection element that contains metallic stuffing, often is directly exposed in the air, is subjected to intrusion such as oxygen and steam in the external environment easily, causes element weather resistance variation.
The utility model content
First technical problem to be solved in the utility model provides high polymer PTC chip simple in structure, that weather resistance is good, make high molecular PTC composite conducting material wherein to isolate fully with air, improve weather resistance, overcome the above-mentioned defective that prior art exists.
The technical scheme of the utility model technical solution problem is as follows:
A kind of high polymer PTC chip, comprise high molecular PTC material layer, housing and paste metal foil electrode sheet respectively in the high polymer PTC chip upper and lower surface, described housing is a frame type structure, the center is provided with through hole, described metal foil electrode sheet up and down is sticking respectively to be posted on the upper surface and lower surface of housing, described high molecular PTC material layer is enclosed in the cavity between the through hole of metal foil electrode sheet and housing, and the shape of the shape of described polymer material layer and the through hole of housing adapts.
Compared with prior art, the utility model does not contact extraneous air by the high molecular PTC material is set directly in the housing, and weatherability improves greatly, has advantages such as simple in structure, good weatherability.
Described case material is an organic polymer composite, comprises macromolecule resin and packing material, also can include only macromolecule resin.Described macromolecule resin can be selected from: one or more mixtures in polyethylene, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, polypropylene, polybutene, Kynoar, polytrifluorochloroethylene, nylon, polyvinyl chloride, phenolic resins, epoxy resin, polyimide resin, polyflon, bismaleimide-triazine resin, thermosetting polyphenylene ether resin, the mylar; Packing material can be selected from: paper, glass fabric, aramid fiber non woven fabric, carbon black, magnesium hydroxide, aluminium hydroxide, kaolin, white carbon, calcium carbonate, one or more mixtures of titanium dioxide.
Described housing can use binding agent with being connected of metal foil electrode sheet, also can not use binding agent, directly hot melting cohesion.
Second technical problem that the utility model solves provides a kind of surface labeling type polymer PTC overflow over-temperature protection element that adopts above-mentioned high polymer PTC chip:
Described surface labeling type polymer PTC overflow over-temperature protection element comprises left pad, backhand welding dish, soldering-resistance layer and termination; It is characterized in that, also comprise aforesaid high polymer PTC chip, the described metal foil electrode sheet of going up is provided with etching bath, described etching bath will go up the metal foil electrode sheet be divided into separate about two cut sections, wherein right cut section all is enclosed in the upper surface of high molecular PTC material layer in the housing, and described etching bath is positioned on the upper surface of housing; Described left and right sides pad be fitted in respectively the metal foil electrode sheet about on the upper surface of two cut sections, about described soldering-resistance layer is connected between two pads and be covered in the top of etching bath; The two ends of described housing are provided with two terminations, and the left end head is electrically connected left pad with the left cut section of last metal foil electrode sheet, and the right-hand member head is electrically connected the backhand welding dish with the right cut section of last metal foil electrode sheet.
Compared with prior art, the utility model surface mounted over-current over-temperature protection element does not contact extraneous air by high polymer PTC chip is set directly in the housing, and weatherability improves greatly, has advantages such as simple in structure, good weatherability.
Preferably, left and right sides pad also is set, and on the metal foil electrode sheet etching bath is being set down at the lower surface of housing, the structure of bottom and superstructure reverse symmetry, thus make whole original paper not have directivity, the mounting of the element of being more convenient for.
Preferably, described housing is provided with two breach, and described termination is arranged in the breach, and described breach is arranged on the two ends, the left and right sides of housing, described breach is semicircle pass or half-oval pass, and described termination is to be connected up and down between two left pads and the metal level between two backhand welding dishes up and down.Described left and right sides pad is the layered metal structure, can for: internal layer is that copper layer, skin are nickel dams; Or internal layer is that copper layer, skin are the tin layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the gold layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the tin layers.Described termination is arranged on the housing side, and described termination is that metal level constitutes, and the structure of its metal level is identical with the metal-layer structure of left and right sides pad.
Preferably, can not be provided with two breach on the described housing, described termination is set directly on the housing side.
Description of drawings
Fig. 1 is the decomposition texture schematic diagram of the utility model macromolecule PCT chip.
Fig. 2 is the utility model surface labeling type polymer PTC overflow over-temperature protection element decomposition texture schematic diagram.
Fig. 3 is the outline drawing of embodiment among Fig. 2.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 shows an embodiment decomposition chart of the utility model high polymer PTC chip, described high polymer PTC chip comprises high molecular PTC material layer 2, housing 3 and pastes metal foil electrode sheet 1 and 1 ' in the high polymer PTC chip upper and lower surface respectively, described housing 3 is a frame type structure, the center is provided with through hole 4, described up and down metal foil electrode sheet 1 and 1 ' is sticking respectively to be posted on the upper surface and lower surface of housing 3, described high molecular PTC material layer 2 be enclosed in metal foil electrode sheet 1,1 ' and the through hole of housing 3 between cavity in.
Fig. 2, Fig. 3 show an example structure schematic diagram of the surface labeling type polymer PTC overflow over-temperature protection element that adopts the utility model high polymer PTC chip, described surface labeling type polymer PTC overflow over-temperature protection element comprises left pad 7 and 7 ', backhand welding dish 8 and 8 ', soldering-resistance layer 6 and 6 ', termination 10 and high polymer PTC chip; Described high polymer PTC chip comprises high molecular PTC material layer 2, glass reinforced epoxy housing 3 and paste metal foil electrode sheet 1 and 1 ' respectively in the high polymer PTC chip upper and lower surface, described housing 3 is a frame type structure, the center is provided with through hole 4, described metal foil electrode sheet 1 up and down and 1 ' is the upper surface and the lower surface of covering shell 3 respectively, described high molecular PTC material layer 2 is arranged on metal foil electrode sheet 1,1 ' and the through hole of housing 3 between cavity in, the shape of the shape of described polymer material layer and the through hole of housing adapts, the described metal foil electrode sheet 1 of going up is provided with etching bath 5, described etching bath 5 will go up metal foil electrode sheet 1 be divided into separate about two cut sections, wherein right cut section is enclosed in the upper surface of high molecular PTC material layer 2 in the housing 3, and described etching bath 5 is positioned on housing 3 upper surfaces; Described left and right sides pad 7 and 8 be fitted in respectively metal foil electrode sheet 1 about on the upper surface of two cut sections, about described soldering-resistance layer 6 is connected between two pads and be covered in the top of etching bath 5; Described metal foil electrode sheet 1 ' down is provided with etching bath 5 ', described etching bath 5 ' will descend metal foil electrode sheet 1 ' be divided into separate about two cut sections, wherein left cut section is enclosed in the lower surface of high molecular PTC material layer 2 in the housing, and described etching bath 5 ' is positioned on housing 3 lower surfaces; Described left and right sides pad 7 ' and 8 ' be fitted in down respectively metal foil electrode sheet 1 ' about on the lower surface of two cut sections, about described soldering-resistance layer 6 ' is connected between two pads and be covered in the below of etching bath 5 '; The two ends of described housing 3 are provided with two terminations 10, and the left end head is electrically connected left pad 7 with the left cut section of last metal foil electrode sheet 1, and the right-hand member head is electrically connected backhand welding dish 8 with the right cut section of last metal foil electrode sheet 1.Like this, this excess-current excess-temperature protection element no matter be to mount or mount with two following pads with two top pads, can both guarantee that the two poles of the earth of PTC chip are connected in the circuit in use.
The two ends, the left and right sides of housing respectively are provided with a breach 9, breach 9 is semicircle pass or half-oval pass, described termination 10 is arranged in the breach 9, the left end head is electrically connected upper left pad 7, lower-left pad 7 ' with the left cut section of last metal foil electrode sheet 1, the left cut section of following metal foil electrode sheet 1 ', the right-hand member head is electrically connected upper right pad 8, bottom right pad 8 ' with the right cut section of last metal foil electrode sheet 1, the right cut section of following metal foil electrode sheet 1 '.
Claims (7)
1. high polymer PTC chip, comprise high molecular PTC material layer (2), housing (3) and paste metal foil electrode sheet (1 respectively in the high polymer PTC chip upper and lower surface, 1 ') it is characterized in that, described housing (3) is a frame type structure, the center is provided with through hole (4), described metal foil electrode sheet (1 up and down, 1 ') sticking respectively being posted on the upper surface and lower surface of housing (3), described high molecular PTC material layer (2) is enclosed in metal foil electrode sheet (1,1 ') and in the cavity between the through hole of housing (3), the shape of the through hole (4) of the shape of described polymer material layer (2) and housing adapts.
2. surface labeling type polymer PTC overflow over-temperature protection element comprises left pad (7), backhand welding dish (8), soldering-resistance layer (6) and termination (10); It is characterized in that, also comprise high polymer PTC chip as claimed in claim 1, the described metal foil electrode sheet (1) of going up is provided with etching bath (5), described etching bath (5) will go up metal foil electrode sheet (1) be divided into separate about two cut sections, wherein right cut section all is enclosed in high molecular PTC material layer (2) upper surface in the housing, and described etching bath (5) is positioned on housing (3) upper surface; Described left and right sides pad (7,8) be fitted in respectively metal foil electrode sheet (1) about on the upper surface of two cut sections, about described soldering-resistance layer (6) is connected between two pads and be covered in the top of etching bath (5); The two ends of described housing (3) are provided with two terminations (10), and the left end head is electrically connected the left cut section of left pad (7) with last metal foil electrode sheet (1), and the right-hand member head is electrically connected the right cut section of backhand welding dish (8) with last metal foil electrode sheet (1).
3. surface labeling type polymer PTC overflow over-temperature protection element according to claim 2, it is characterized in that, also comprise the left and right sides, bottom pad (7 ', 8 ') and soldering-resistance layer (6 '), described metal foil electrode sheet (1 ') down is provided with etching bath (5 '), described etching bath (5 ') will descend metal foil electrode sheet (1 ') be divided into separate about two cut sections, wherein left cut section all is enclosed in the lower surface of high molecular PTC material layer (2) in the housing, and described etching bath (5 ') is positioned on housing (3) lower surface; The left and right sides, described bottom pad (7 ', 8 ') be fitted in down respectively metal foil electrode sheet (1 ') about on the lower surface of two cut sections, about described soldering-resistance layer (6 ') is connected between two pads (7 ', 8 ') and be covered in the below of etching bath (5 '); Described left end head is electrically connected left pad (7 ', 7) with the left cut section of following metal foil electrode sheet (1 '), the right-hand member head is electrically connected backhand welding dish (8 ', 8) with the right cut section of following metal foil electrode sheet (1 ').
4. a kind of surface labeling type polymer PTC overflow over-temperature protection element according to claim 3 is characterized in that: described left and right sides pad (7,7 ', 8,8 ') is the layered metal structure, can for: internal layer is that copper layer, skin are nickel dams; Or internal layer is that copper layer, skin are the tin layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the gold layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the tin layers.
5. a kind of surface labeling type polymer PTC overflow over-temperature protection element according to claim 4 is characterized in that: described metal layer thickness is 0.002～0.20mm.
6. a kind of surface labeling type polymer PTC overflow over-temperature protection element according to claim 5; it is characterized in that: the two ends, the left and right sides of housing respectively are provided with a breach (9); breach (9) is semicircle pass or half-oval pass; described termination (10) is arranged in the breach (9); described termination (10) constitutes for metal level; the metal-layer structure of the structure of its metal level and left and right sides pad (7,8) is identical.
7. a kind of surface labeling type polymer PTC overflow over-temperature protection element according to claim 4; it is characterized in that: described termination (10) are arranged on the housing side; described termination (10) constitutes for metal level, and the metal-layer structure of the structure of its metal level and left and right sides pad (7,8) is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201504763U CN201222387Y (en) | 2008-07-02 | 2008-07-02 | High molecule PTC chip and surface paste-loading type overcurrent over-temperature protection element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201504763U CN201222387Y (en) | 2008-07-02 | 2008-07-02 | High molecule PTC chip and surface paste-loading type overcurrent over-temperature protection element |
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| Publication Number | Publication Date |
|---|---|
| CN201222387Y true CN201222387Y (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201504763U Expired - Lifetime CN201222387Y (en) | 2008-07-02 | 2008-07-02 | High molecule PTC chip and surface paste-loading type overcurrent over-temperature protection element |
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| Country | Link |
|---|---|
| CN (1) | CN201222387Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531402A (en) * | 2013-10-23 | 2014-01-22 | 上海长园维安电子线路保护有限公司 | Novel thin compressive overtemperature protection element structure |
| CN106876063A (en) * | 2017-04-14 | 2017-06-20 | 上海长园维安电子线路保护有限公司 | Over-current protecting element with protection shell |
-
2008
- 2008-07-02 CN CNU2008201504763U patent/CN201222387Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531402A (en) * | 2013-10-23 | 2014-01-22 | 上海长园维安电子线路保护有限公司 | Novel thin compressive overtemperature protection element structure |
| CN103531402B (en) * | 2013-10-23 | 2017-04-12 | 上海长园维安电子线路保护有限公司 | Thin compressive overtemperature protection element structure |
| CN106876063A (en) * | 2017-04-14 | 2017-06-20 | 上海长园维安电子线路保护有限公司 | Over-current protecting element with protection shell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Fu Jian Inventor after: Wang Jicai Inventor after: Feng Mingjun Inventor before: Wang Jicai Inventor before: Feng Mingjun |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG JICAI; FENG MINGJUN TO: FU JIAN; WANG JICAI; FENG MINGJUN |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090415 |