CN201994151U - Surface mounting type high polymer PTC (positive temperature coefficient) element - Google Patents
Surface mounting type high polymer PTC (positive temperature coefficient) element Download PDFInfo
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- CN201994151U CN201994151U CN2011200227464U CN201120022746U CN201994151U CN 201994151 U CN201994151 U CN 201994151U CN 2011200227464 U CN2011200227464 U CN 2011200227464U CN 201120022746 U CN201120022746 U CN 201120022746U CN 201994151 U CN201994151 U CN 201994151U
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Abstract
The utility model discloses a surface mounting type high polymer PTC (positive temperature coefficient) element, which comprises a PTC chip, an upper polar plate, an upper cover plate, a lower polar plate, a lower cover plate, a left pad and a right pad. A notch is arranged at each of the left end and the right end of the PTC chip, the upper polar plate is attached to the upper surface of the PTC chip, a notch is arranged at the left end of the upper polar plate, the upper cover plate is attached to the upper surface of the upper polar plate, a left insulating boss extending downwardly from the left end of the upper cover plate is embedded into the notches at the left ends of the PTC chip and the upper polar plate, the lower polar plate is attached to the lower surface of the PTC chip, a notch is arranged at the right end of the lower polar plate, the lower cover plate is attached to the lower surface of the lower polar plate, a right insulating boss extending upwardly from the right end of the lower cover plate is embedded into the notches at the right ends of the PTC chip and the lower polar plate, the left pad and the right pad are attached to the left end and the right end of the surface of at least one cover plate, a left end is arranged on the inner wall of a left through hole, and the left pad is communicated with the lower polar plate through the left end, a right end is arranged on the inner wall of a right through hole, and the right pad is communicated with the upper polar plate through the right end. The surface mounting type high polymer PTC element is simple in structure and convenient in manufacture, and electric arc resistance is improved greatly.
Description
Technical field
The utility model relates to a kind of electronic devices and components that are used for over-current protection, is specifically related to a kind of surface labeling type polymer PTC element.
Background technology
Functional high molecule material is the focus of present material science research, and the high molecular composite conductive material with ptc characteristics is outstanding person wherein, and academia's industrial circle being is all is being researched and developed it enthusiastically so far.So-called high molecular PTC composite conducting material has the high molecular composite conductive material of PTC (positive temperature coefficient " positive temperature coefficient ") resistance characteristic exactly.That is to say that in certain temperature range, the resistivity of this electric conducting material self can increase with the rising of temperature.This excess-current excess-temperature protection element is composited by macromolecular material filled conductive particle.Described macromolecular material comprises thermosetting polymer and thermoplastic polymer, and thermoplastic polymer comprises polyethylene, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, Kynoar, polytrifluorochloroethylene etc.; Thermosetting polymer mainly contains epoxy resin.Conducting particles comprises carbon black, metal dust and conductivity ceramics powder, and the surface is coated with graphite, carbon black, ceramic fine bead, the glass microballoon of metal.Metal dust commonly used comprises silver powder, copper powder, aluminium powder, nickel powder, stainless steel powder.
Utilize the high molecular PTC composite conducting material to make the macromolecule excess-current excess-temperature protection element, can be used as the excess-current excess-temperature protective device of circuit.It is connected in the circuit and uses, and lower by the electric current of macromolecule excess-current excess-temperature protection element during the circuit operate as normal, its temperature is lower, presents low resistance state, can not influence the circuit operate as normal.And when the big electric current that causes by fault when this macromolecule excess-current excess-temperature protection element, its temperature can raise suddenly, causes that himself resistance value becomes greatly suddenly, so just makes circuit present approximate off state, thereby plays the protective circuit effect.After fault was got rid of, the temperature of macromolecule excess-current excess-temperature protection element descended, and its resistance value can return to the low resistance state again.Therefore, this is a kind of fuse that can recover automatically in fact, has been widely applied in the fields such as computer, communication equipment, automotive electronics, family expenses and Industry Control electric equipment.
The macromolecule excess-current excess-temperature protection element is widely used in the overcurrent protection field, but the surface mountization of electronic devices and components is present development trends, and this also has higher requirement to the encapsulation technology of macromolecule excess-current excess-temperature protection element.The present surface labeling type polymer PTC element that generally uses, owing to adopt directly etched figure on the metal foil electrode of PTC chip surface, and on the PTC chip, drill through hole plating copper and form the termination electrode, if the metal forming etching is incomplete like this, remaining metal existence causes element to occur arc burning easily when energising, causes accident potential.
Chinese invention patent application 200710041075.4 also discloses another surface mounted over-current over-temperature protection element and manufacture method thereof.
The utility model content
The technical problems to be solved in the utility model provides a kind of surface attaching type PTC element that can eliminate arc burning hidden danger, overcomes the above-mentioned defective that prior art exists.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: a kind of surface labeling type polymer PTC element comprises with the lower part: PTC chip, two ends, the left and right sides respectively are provided with a breach; Top crown is made by electric conducting material, is fitted in the upper surface of PTC chip, and the left end of top crown is provided with the breach that a breach with PTC chip left end aligns; Upper cover plate is made by insulating material, be fitted in described top crown above, from the left end of upper cover plate extend a left side insulation boss downwards and embed described PTC chip and top crown left end breach; Bottom crown is made by electric conducting material, is fitted in the lower surface of PTC chip, and the right-hand member of bottom crown is provided with the breach that a breach with PTC chip right-hand member aligns; Lower cover is made by insulating material, be fitted in described bottom crown below, from the right-hand member of lower cover extend upward a right insulation boss and embed described PTC chip and bottom crown right-hand member breach; Left and right pad is fitted in the left and right two ends of at least one lid surface, is separated by the soldering-resistance layer insulation between the left and right pad, and described lid surface is the upper surface of upper cover plate and the lower surface of lower cover; Left side through hole runs through described left pad, upper cover plate, a left side insulation boss, bottom crown and lower cover, and the inwall of left through hole is provided with the left end head, and the left end head is with described left pad and bottom crown conducting; Right through hole runs through described backhand welding dish, upper cover plate, top crown, right insulation boss and lower cover, and the inwall of right through hole is provided with the right-hand member head, and the right-hand member head is with described backhand welding dish and top crown conducting.
Preferably, described left and right pad respectively has two, is respectively upper left pad and the upper right pad that is fitted in the upper cover plate upper surface, the lower-left pad that is fitted in the lower cover lower surface and bottom right pad.
Preferably, the breach on described PTC chip, top crown and the bottom crown is semicircle or half elliptic.
Preferably, described left through hole, right through hole are semicircle or half elliptic through hole.
Preferably, described left end head, right-hand member head are made of the coat of metal.
Preferably, described left and right pad is made of metal level.
Further, described metal level is that internal layer is that copper layer, skin are nickel dams; Or internal layer is that copper layer, skin are the tin layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the gold layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the tin layers.
Preferably, described upper cover plate and lower cover adopt the compound resin sheet to make.
Preferably, described soldering-resistance layer is selected from a kind of in epoxy resin, polyamide or the polyester.
Compared with prior art, the utlity model has significant beneficial effect, need not the upper and lower pole plate of PTC chip both sides is carried out etching, structure is simpler, manufacturing is more convenient, after left and right termination being passed upper and lower cover plate, embed in the insulation boss of PTC chip barbed portion, directly do not contact the PTC chip, anti-electric arc ability improves greatly.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION figure of a kind of embodiment of the utility model surface labeling type polymer PTC element.
Fig. 2 is a kind of three-dimensional outline drawing of utility model surface labeling type polymer PTC element.
Fig. 3 is that the manufacture method of the utility model PTC element is at completing steps 6) after the multilayer composite board front schematic view.
Embodiment
As shown in Figure 1 and Figure 2, the utility model surface labeling type polymer PTC element comprises PTC chip 6, and the two ends, the left and right sides of PTC chip 6 respectively are provided with a breach 61,62.The top crown of being made by electric conducting material 5 is fitted in the upper surface of PTC chip 6, and the left end of top crown 5 is provided with the breach 51 that a breach 61 with PTC chip left end aligns; The upper cover plate of making by insulating material 4 be fitted in top crown 5 above, from the left end of upper cover plate 4 extend a left side insulation boss 41 downwards and embed above-mentioned PTC chip 6 and top crown 5 left ends breach 61,51; The bottom crown of being made by electric conducting material 7 is fitted in the lower surface of PTC chip 6, and the right-hand member of bottom crown 7 is provided with the breach 71 that a breach 62 with PTC chip right-hand member aligns; The lower cover of making by insulating material 8 be fitted in bottom crown 7 below, from the right-hand member of lower cover 8 extend upward a right insulation boss 81 and embed described PTC chip 6 and bottom crown 7 right-hand members breach 62,71.Breach 61,62,51,71 on above-mentioned PTC chip 6, top crown 5 and the bottom crown 7 can be different shapes such as square, circle, but is preferably semicircle or half elliptic.
Upper left pad 2 and upper right pad 3 are fitted in the left and right two ends of upper cover plate 4 upper surfaces, are separated by soldering-resistance layer 1 insulation between upper left pad 2 and the upper right pad 3; Lower-left pad 11 and bottom right pad 9 are fitted in the left and right two ends of lower cover 8 lower surfaces, are separated by soldering-resistance layer 10 insulation between lower-left pad 11 and the bottom right pad 9.Left and right pad 2,3,9,11 is made of metal level, and preferably, metal level is that internal layer is that copper layer, skin are nickel dams; Or internal layer is that copper layer, skin are the tin layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the gold layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the tin layers.Soldering-resistance layer 1,10 can be selected from a kind of in epoxy resin, polyamide or the polyester.
Be respectively equipped with left through hole 14 and right through hole 15 at the left and right two ends of PTC element, left side through hole 14 runs through described left pad 2,11, upper cover plate 4, a left side insulation boss 41, bottom crown 7 and lower cover 8, the inwall of left side through hole 14 is provided with left end head 13, and left end head 13 is with left pad 2,11 and bottom crown 7 conductings; Right through hole 15 runs through described backhand welding dish 3,9, upper cover plate 4, top crown 5, right insulation boss 81 and lower cover 8, and the inwall of right through hole 15 is provided with right-hand member head 12, and right-hand member head 12 is with backhand welding dish 3,9 and top crown 5 conductings.Preferably, left end head 13, right-hand member head 12 are made of the coat of metal.The shape of a left side through hole 14, right through hole 15 can be different shapes such as square, circle, but is preferably semicircle or half elliptic.
Need to prove that left and right pad respectively has two among the above embodiment, be respectively upper left pad 2 and the upper right pad 3 that is fitted in upper cover plate 4 upper surfaces, the lower-left pad 11 that is fitted in lower cover 8 lower surfaces and bottom right pad 9.Because upper left pad 2 is connected with top crown 5, bottom crown 7 conductions respectively with upper right pad 3, lower-left pad 11 also is connected with top crown 5, bottom crown 7 conductions respectively with bottom right pad 9, therefore, no matter with the upper surface of PTC element or lower surface is as mounting the surface, the two poles of the earth of PTC element can both be connected in the circuit effectively.But the utility model also can have only a pair of left and right pad, such as having only top a pair of pad 2,3 or have only following a pair of pad 9,11,, also the two poles of the earth of PTC element can be connected in the circuit effectively for mounting the surface with surface with pad.
Upper cover plate 4 and lower cover 8 can adopt the compound resin sheet to make.The compound resin sheet is made of macromolecule resin and packing material, also can not have packing material.Macromolecule resin can be selected from: phenolic resins, epoxy resin, polyimide resin, polyflon, bismaleimide-triazine resin, thermosetting polyphenylene ether resin or mylar etc.; Packing material can be paper, glass fabric or aramid fiber non woven fabric etc.; The compound resin sheet can be one deck, also can be the multi-layer sheet that is made of above-mentioned several different materials.
Above-mentioned a kind of surface labeling type polymer PTC element can be made by the following method:
1) the high molecular PTC composite conducting material is pressed into thick 0.38mm, long 300mm, the sheet material of wide 200mm, utilize vulcanizing press respectively to paste the thickness 0.035mm Copper Foil that an one side roughened is crossed on the two sides then, the matsurface of Copper Foil is inside, and the high molecular PTC composite conducting material is clipped in the middle, hot forming, obtain the composite sheet of gross thickness 0.45mm, utilize electron accelerator or Co60 radioactive source crosslinking with radiation, these two Copper Foils will form the top crown and the bottom crown of PTC element.
2) get an above-mentioned composite sheet, beat blind hole according to certain arranging respectively at tow sides, the position of blind hole is corresponding with the gap position at PTC element two ends, blind hole diameter 2.0mm, hole depth 0.415mm.This blind hole depth just in time can make and positive bore saturating upper strata Copper Foil and high molecular PTC composite conducting material and do not bore lower floor's Copper Foil, and reverse side bores lower floor's Copper Foil and high molecular PTC composite conducting material and do not bore the upper strata Copper Foil.
3) the above-mentioned composite sheet upper and lower surface that has bored blind hole is respectively covered one or more epoxy glass cloth prepreg as upper cover plate and lower cover, again on upper cover plate and lower cover below respectively add the thickness 0.018mm Copper Foil crossed of one side roughened, the matsurface of Copper Foil is inside, utilize the hot pressing of vacuum hotpressing machine to be combined with each other, obtain multilayer composite board, in the pressing process, and the resin of partial melting is filled enter step 2) in the blind hole that produced.If have only single face that pad is arranged, can only add a Copper Foil in this step.
4) on the multilayer composite board that obtains with step 2) in the corresponding position of blind hole drill through the hole, through hole is coaxial with above-mentioned blind hole, through-hole diameter 0.6mm.
5) with the inner wall copper plating of all through holes, thickness of coating 0.025-0.05mm forms left and right termination.
6) utilize the method for chemical etching, laser cutting or machine cuts, the shape of on the Copper Foil of upper cover plate upper surface and lower cover lower surface, carving out corresponding left and right pad, as shown in Figure 3; Protect non-etching region with dry film before the etching, etching is intact to be retreated except that protective layer.
7) at printing of the non-pad position of upper cover plate upper surface and lower cover lower surface or spraying soldering-resistance layer, be heating and curing then, as required can be at soldering-resistance layer surface printing character.
8) the plating protective layer again at the left and right pad position of upper cover plate upper surface and lower cover lower surface forms pad; Can also in through hole, reach pad area and form coat of metal through spray tin or gold-plated processing.
9) multilayer composite board that step 8) is obtained is that the unit cuts by the PTC element, obtains independently final products.In cutting process, above-mentioned blind hole and through hole all are cut into two semicircle orifices, form the breach and the left and right through hole at PTC element two ends respectively.
Claims (9)
1. a surface labeling type polymer PTC element is characterized in that, comprises with the lower part:
PTC chip (6), two ends, the left and right sides respectively are provided with a breach (61,62);
Top crown (5) is made by electric conducting material, is fitted in the upper surface of PTC chip (6), and the left end of top crown (5) is provided with the breach (51) that a breach (61) with PTC chip left end aligns;
Upper cover plate (4) is made by insulating material, be fitted in described top crown (5) above, from the left end of upper cover plate (4) extend a left side insulation boss (41) downwards and embed described PTC chip and top crown left end breach (61,51) in;
Bottom crown (7) is made by electric conducting material, is fitted in the lower surface of PTC chip (6), and the right-hand member of bottom crown (7) is provided with the breach (71) that a breach (62) with PTC chip right-hand member aligns;
Lower cover (8) is made by insulating material, be fitted in described bottom crown (7) below, from the right-hand member of lower cover (8) extend upward a right insulation boss (81) and embed described PTC chip and bottom crown right-hand member breach (62,71) in;
Left and right pad (2,3,11,9) is fitted in the left and right two ends of at least one lid surface, is separated by soldering-resistance layer (1,10) insulation between the left and right pad, and described lid surface is the upper surface of upper cover plate (4) and the lower surface of lower cover (8);
Left side through hole (14), run through described left pad (2,11), upper cover plate (4), a left side insulation boss (41), bottom crown (7) and lower cover (8), the inwall of left side through hole (14) is provided with left end head (13), and left end head (13) is with described left pad (2,11) and bottom crown (7) conducting;
Right through hole (15), run through described backhand welding dish (3,9), upper cover plate (4), top crown (5), right insulation boss (81) and lower cover (8), the inwall of right through hole (15) is provided with right-hand member head (12), and right-hand member head (12) is with described backhand welding dish (3,9) and top crown (5) conducting.
2. PTC element according to claim 1, it is characterized in that, described left and right pad respectively has two, is respectively upper left pad (2) and the upper right pad (3) that is fitted in upper cover plate (4) upper surface, the lower-left pad (11) that is fitted in lower cover (8) lower surface and bottom right pad (9).
3. PTC element according to claim 1 is characterized in that, the breach on described PTC chip, top crown and the bottom crown (61,62,51,71) is semicircle or half elliptic.
4. PTC element according to claim 1 is characterized in that, described left through hole (14), right through hole (15) are semicircle or half elliptic through hole.
5. PTC element according to claim 1 is characterized in that, described left end head (13), right-hand member head (12) are made of the coat of metal.
6. PTC element according to claim 1 is characterized in that, described left and right pad is made of metal level.
7. PTC element according to claim 6 is characterized in that, described metal level is that internal layer is that copper layer, skin are nickel dams; Or internal layer is that copper layer, skin are the tin layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the gold layers; Or internal layer is that copper layer, intermediate layer are that nickel dam, skin are the tin layers.
8. PTC element according to claim 1 is characterized in that, described upper cover plate (4) and lower cover (8) adopt the compound resin sheet to make.
9. PTC element according to claim 1 is characterized in that, described soldering-resistance layer (1,10) is selected from a kind of in epoxy resin, polyamide or the polyester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200227464U CN201994151U (en) | 2011-01-24 | 2011-01-24 | Surface mounting type high polymer PTC (positive temperature coefficient) element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200227464U CN201994151U (en) | 2011-01-24 | 2011-01-24 | Surface mounting type high polymer PTC (positive temperature coefficient) element |
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| Publication Number | Publication Date |
|---|---|
| CN201994151U true CN201994151U (en) | 2011-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011200227464U Expired - Lifetime CN201994151U (en) | 2011-01-24 | 2011-01-24 | Surface mounting type high polymer PTC (positive temperature coefficient) element |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610341A (en) * | 2011-01-24 | 2012-07-25 | 上海神沃电子有限公司 | Surface-mounted macromolecule PTC (positive temperature coefficient) element and manufacturing method thereof |
| US10096407B2 (en) | 2016-07-29 | 2018-10-09 | Polytronics Technology Corp. | Surface-mountable over-current protection device |
-
2011
- 2011-01-24 CN CN2011200227464U patent/CN201994151U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610341A (en) * | 2011-01-24 | 2012-07-25 | 上海神沃电子有限公司 | Surface-mounted macromolecule PTC (positive temperature coefficient) element and manufacturing method thereof |
| CN102610341B (en) * | 2011-01-24 | 2014-03-26 | 上海神沃电子有限公司 | Surface-mounted macromolecule PTC (positive temperature coefficient) element and manufacturing method thereof |
| US10096407B2 (en) | 2016-07-29 | 2018-10-09 | Polytronics Technology Corp. | Surface-mountable over-current protection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110928 Effective date of abandoning: 20140326 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20110928 Effective date of abandoning: 20140326 |