JP2013103433A - Laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate capable of obtaining favorable processibility and voltage resistance of a prepreg-cured resin layer, and further capable of preventing warping of the laminate.SOLUTION: The laminate comprises a metal layer and a resin layer laminated on the surface of the metal layer. The resin layer is formed by using a prepreg 1 in which a thermosetting composition 2 is impregnated into a substrate 10. The substrate 10 which is not a woven cloth has a plurality of the first resin threads 11 extending to a first direction, and a plurality of the second rein threads 12 extending to a second direction crossing the first direction. The first and second threads 11 and 12 are laminated and are integrated at an intersecting point. The first and second resin threads 11 and 12 each comprise polyolefin resin.

Description

  The present invention relates to a prepreg in which a thermosetting composition is impregnated in a substrate. The present invention also relates to a laminate using the prepreg.

  Conventionally, various thermosetting compositions have been used to obtain electronic parts such as printed wiring boards. For example, in a printed wiring board, a thermosetting composition containing a thermosetting compound and a curing agent in order to form an insulating layer for insulating between layers or to form an insulating layer located in a surface layer portion. Is used. Moreover, this thermosetting composition is impregnated in a base material and may be used as a prepreg.

  Patent Document 1 below discloses a prepreg in which a glass fiber substrate is impregnated with a thermosetting resin composition. In this prepreg, inorganic fine particles having an average particle diameter of 500 nm or less are attached to the surface of the glass fiber of the glass fiber substrate. Examples of the glass fiber substrate include glass woven fabric and glass nonwoven fabric.

JP 2011-177892 A

  In the prepreg using the conventional glass fiber base material as described in Patent Document 1, there is a problem that the workability of the cured product after the prepreg is cured is deteriorated.

  An object of the present invention is to provide a prepreg capable of satisfactorily achieving both workability and voltage resistance after curing. A limited object of the present invention is to provide a prepreg with good handling properties in an uncured state.

  Another object of the present invention is to provide a laminate capable of improving the workability and voltage resistance of the resin layer after curing the prepreg and further suppressing the warpage of the laminate. is there. A limited object of the present invention is to provide a laminate in which a prepreg having good handling properties in an uncured state is used.

  According to a wide aspect of the present invention, there is provided a prepreg in which a thermosetting composition is impregnated in a base material, the thermosetting composition containing a thermosetting compound, and the base material is a woven fabric. A plurality of first resin yarns extending in a first direction and a plurality of second resin yarns extending in a second direction intersecting the first direction. And the first resin yarn and the second resin yarn are laminated, and the first resin yarn and the second resin yarn are integrated at an intersection, and the first resin yarn is integrated There is provided a prepreg in which the material of the resin yarn and the second resin yarn is a polyolefin resin.

  Moreover, according to the wide situation of this invention, the laminated board using the prepreg mentioned above is provided.

  That is, according to a wide aspect of the present invention, a metal layer and a resin layer laminated on the surface of the metal layer are provided, and the thermosetting composition is impregnated in the substrate. It is formed using a prepreg, the thermosetting composition contains a thermosetting compound, the base material is a base material that is not a woven fabric, and the base material has a plurality of extending in the first direction. A first resin yarn and a plurality of second resin yarns extending in a second direction intersecting the first direction, wherein the first resin yarn and the second resin yarn are laminated; The first resin yarn and the second resin yarn are integrated at an intersection, and the material of the first resin yarn and the second resin yarn is a polyolefin resin, respectively. A laminate is provided.

  In this specification, both the invention related to the prepreg described above and the invention related to the laminated board described above are disclosed.

  It is preferable that the first resin yarn and the second resin yarn are heat-sealed at the intersection.

  The thermosetting composition preferably contains an inorganic filler. The new Mohs hardness of the inorganic filler is preferably 9 or less. The inorganic filler preferably has a thermal conductivity of 10 W / m · K or more. The average particle size of the inorganic filler is preferably 0.1 μm or more and 100 μm or less.

  The average opening diameter of the substrate is preferably 3 mm or more and 10 mm or less. The maximum thickness of the substrate is preferably 30 μm or more and 100 μm or less.

  The thermosetting composition preferably contains a coupling agent or a surfactant. The thermosetting compound preferably includes a thermosetting compound having a cyclic ether group.

  The prepreg according to the present invention is a prepreg in which a thermosetting composition is impregnated in a base material, the thermosetting composition contains a thermosetting compound, and the base material is not a woven fabric. A plurality of first resin yarns extending in a first direction and a plurality of second resin yarns extending in a second direction intersecting the first direction, The first resin yarn and the second resin yarn are laminated, and the first resin yarn and the second resin yarn are integrated at an intersection, and the first resin yarn and the second resin yarn are integrated. Since the material of the second resin yarn is a polyolefin resin, the workability and voltage resistance of the cured product after curing can be improved.

  A laminate according to the present invention includes a metal layer and a resin layer laminated on the surface of the metal layer, and the resin layer is a prepreg in which a thermosetting composition is impregnated in a base material. The thermosetting composition includes a thermosetting compound, the base material is a base material that is not a woven fabric, and the base material extends in a first direction. A resin yarn and a plurality of second resin yarns extending in a second direction intersecting the first direction, the first resin yarn and the second resin yarn being laminated, Since the first resin yarn and the second resin yarn are integrated at the intersection, and the material of the first resin yarn and the second resin yarn is polyolefin resin, respectively, the prepreg is cured. The workability and voltage resistance of the resin layer after being made can be improved. Furthermore, the curvature of a laminated board can be suppressed.

FIG. 1 is a partially cutaway perspective view for explaining a prepreg according to an embodiment of the present invention. FIG. 2 is a plan view for explaining a substrate used in the prepreg according to the embodiment of the present invention. FIG. 3 is a plan view for explaining a modification of the base material used for the prepreg. FIG. 4 is a cross-sectional view schematically showing a laminate using a prepreg according to an embodiment of the present invention.

  Hereinafter, the present invention will be described in detail.

  The prepreg according to the present invention is a prepreg in which a base material is impregnated with a thermosetting composition. The said thermosetting composition contains a thermosetting compound (A). The base material is a base material that is not a woven fabric. The base material includes a plurality of first resin yarns extending in a first direction and a plurality of second resin yarns extending in a second direction intersecting the first direction. The first resin thread and the second resin thread are laminated. The first resin yarn and the second resin yarn are integrated at an intersection. The material of the first resin yarn and the second resin yarn is a polyolefin resin, respectively.

  By adopting the above-described configuration in the prepreg according to the present invention, the workability and voltage resistance of the cured product (resin layer) after curing the prepreg can be improved. In addition, the fact that the material of the first resin yarn and the second resin yarn is a polyolefin resin greatly contributes to improvement of workability and voltage resistance of the cured product. Furthermore, by adopting the above configuration in the prepreg according to the present invention, the handling property of the prepreg is improved. Furthermore, when a laminated board is produced using the prepreg according to the present invention, warpage of the laminated board can be suppressed, and dimensional stability can be improved.

  The laminated board which concerns on this invention is equipped with a metal layer and the resin layer laminated | stacked on the surface of this metal layer. The resin layer is formed by curing a prepreg impregnated with a thermosetting composition in a substrate. The said thermosetting composition contains a thermosetting compound (A). The base material is a base material that is not a woven fabric. The base material includes a plurality of first resin yarns extending in a first direction and a plurality of second resin yarns extending in a second direction intersecting the first direction. The first resin thread and the second resin thread are laminated. The first resin yarn and the second resin yarn are integrated at an intersection. The material of the first resin yarn and the second resin yarn is a polyolefin resin, respectively.

  By adopting the above configuration in the laminated board according to the present invention, the workability and voltage resistance of the resin layer after curing the prepreg can be improved, and the warpage of the laminated board can be further suppressed. Furthermore, the dimensional stability of the laminate can be improved. In addition, the fact that the material of the first resin yarn and the second resin yarn is a polyolefin resin greatly contributes to the improvement of the workability and voltage resistance of the resin layer. Furthermore, by adopting the above-described configuration in the laminated board according to the present invention, the handling property of the prepreg is improved, and the laminated board can be easily and uniformly produced.

  The thermosetting composition impregnated in the base material contains a thermosetting compound (A). The thermosetting composition impregnated in the substrate preferably contains a thermosetting compound (A) and a curing agent (B). However, when the thermosetting compound (A) is thermosetting polyimide or the like, the curing agent (B) is not necessarily used. The whole thermosetting composition may be the thermosetting compound (A). Hereinafter, first, details of each component used in the thermosetting composition in the present invention will be described.

(Thermosetting compound (A))
The thermosetting compound (A) is cured by the action of the curing agent (B). The thermosetting compound (A) is not particularly limited. As for a thermosetting compound (A), only 1 type may be used and 2 or more types may be used together.

  The thermosetting compound (A) is preferably a thermosetting compound (A1) having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The thermosetting compound (A1) having a cyclic ether group is preferably a thermosetting compound having an epoxy group or an oxetanyl group.

  The thermosetting compound (A1) may contain an epoxy compound (A1a) having an epoxy group, or may contain an oxetane compound (A1b) having an oxetanyl group.

  From the viewpoint of further improving the heat resistance and voltage resistance of the cured product, the thermosetting compound (A) preferably has an aromatic skeleton.

  Specific examples of the epoxy compound (A1a) having an epoxy group include an epoxy monomer having a bisphenol skeleton, an epoxy monomer having a dicyclopentadiene skeleton, an epoxy monomer having a naphthalene skeleton, an epoxy monomer having an adamantane skeleton, and an epoxy having a fluorene skeleton. Examples of the monomer include an epoxy monomer having a biphenyl skeleton, an epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton, an epoxy monomer having a xanthene skeleton, an epoxy monomer having an anthracene skeleton, and an epoxy monomer having a pyrene skeleton. These hydrogenated products or modified products may be used. As for an epoxy compound (A1a), only 1 type may be used and 2 or more types may be used together.

  Examples of the epoxy monomer having a bisphenol skeleton include an epoxy monomer having a bisphenol A type, bisphenol F type, or bisphenol S type bisphenol skeleton.

  Examples of the epoxy monomer having a dicyclopentadiene skeleton include dicyclopentadiene dioxide and a phenol novolac epoxy monomer having a dicyclopentadiene skeleton.

  Examples of the epoxy monomer having a naphthalene skeleton include 1-glycidylnaphthalene, 2-glycidylnaphthalene, 1,2-diglycidylnaphthalene, 1,5-diglycidylnaphthalene, 1,6-diglycidylnaphthalene, 1,7-diglycidyl. Naphthalene, 2,7-diglycidylnaphthalene, triglycidylnaphthalene, 1,2,5,6-tetraglycidylnaphthalene and the like can be mentioned.

  Examples of the epoxy monomer having an adamantane skeleton include 1,3-bis (4-glycidyloxyphenyl) adamantane and 2,2-bis (4-glycidyloxyphenyl) adamantane.

  Examples of the epoxy monomer having a fluorene skeleton include 9,9-bis (4-glycidyloxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, and 9,9-bis (4- Glycidyloxy-3-chlorophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-bromophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-fluorophenyl) fluorene, 9,9-bis (4-Glycidyloxy-3-methoxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dichlorophenyl) Fluorene and 9,9-bis (4-glycidyloxy-3,5-dibromophenyl) Fluorene, and the like.

  Examples of the epoxy monomer having a biphenyl skeleton include 4,4'-diglycidylbiphenyl and 4,4'-diglycidyl-3,3 ', 5,5'-tetramethylbiphenyl.

  Examples of the epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton include 1,1′-bi (2,7-glycidyloxynaphthyl) methane, 1,8′-bi (2,7-glycidyloxynaphthyl) methane, 1,1′-bi (3,7-glycidyloxynaphthyl) methane, 1,8′-bi (3,7-glycidyloxynaphthyl) methane, 1,1′-bi (3,5-glycidyloxynaphthyl) methane 1,8'-bi (3,5-glycidyloxynaphthyl) methane, 1,2'-bi (2,7-glycidyloxynaphthyl) methane, 1,2'-bi (3,7-glycidyloxynaphthyl) Examples include methane and 1,2′-bi (3,5-glycidyloxynaphthyl) methane.

  Examples of the epoxy monomer having a xanthene skeleton include 1,3,4,5,6,8-hexamethyl-2,7-bis-oxiranylmethoxy-9-phenyl-9H-xanthene.

  Specific examples of the oxetane compound (A1b) having an oxetanyl group include, for example, 4,4′-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, 1,4-benzenedicarboxylate bis [(3- Ethyl-3-oxetanyl) methyl] ester, 1,4-bis [(3-ethyl-3-oxetanyl) methoxymethyl] benzene, and oxetane-modified phenol novolac. As for an oxetane compound (A1b), only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further improving the heat resistance of the cured product, the thermosetting compound (A) preferably has two or more cyclic ether groups.

  From the viewpoint of further improving the heat resistance of the cured product, the content of the thermosetting compound having two or more cyclic ether groups in the total 100% by weight of the thermosetting compound (A) is preferably 70%. % Or more, more preferably 80% by weight or more and 100% by weight or less. In the total 100% by weight of the thermosetting compound (A), the content of the thermosetting compound having two or more cyclic ether groups may be 10% by weight or more and 100% by weight or less. Moreover, the thermosetting compound which has 2 or more of cyclic ether groups may be sufficient as the whole thermosetting compound (A).

  The molecular weight of the thermosetting compound (A) is preferably less than 10,000. The molecular weight of the thermosetting compound (A) is preferably 200 or more, more preferably 1200 or less, still more preferably 600 or less, and particularly preferably 550 or less. When the molecular weight of the thermosetting compound (A) is at least the above lower limit, the volatility of the thermosetting compound (A) is reduced, and the prepreg is further handled. When the molecular weight of the thermosetting compound (A) is not more than the above upper limit, the adhesiveness of the cured product is further enhanced. Furthermore, the cured product is hard and hard to be brittle, and the adhesiveness of the cured product is further enhanced.

  In the present specification, the molecular weight in the thermosetting compound (A) means a molecular weight that can be calculated from the structural formula when it is not a polymer and when the structural formula can be specified. Means the weight average molecular weight.

  The content of the thermosetting compound (A) is preferably 20% by weight in a total of 100% by weight of all the resin components (hereinafter sometimes abbreviated as “all resin component X”) contained in the thermosetting composition. Above, more preferably 30% by weight or more, still more preferably 50% by weight or more, and preferably 90% by weight or less. When the content of the thermosetting compound (A) is not less than the above lower limit, the adhesiveness and heat resistance of the cured product are further increased. When the content of the thermosetting compound (A) is not more than the above upper limit, the coating property and impregnation property of the thermosetting composition are further enhanced. The total resin component X refers to the sum of the thermosetting compound (A), the curing agent (B), and other resin components added as necessary. The inorganic filler (C) is not included in all the resin components X.

(Curing agent (B))
The thermosetting composition preferably contains a curing agent (B). When the thermosetting compound (A) does not cure unless the curing agent (B) is present, the thermosetting composition preferably contains the curing agent (B). The curing agent (B) is not particularly limited as long as it can cure the thermosetting composition. As for a hardening | curing agent (B), only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further improving the heat resistance of the cured product, the curing agent (B) preferably has an aromatic skeleton or an alicyclic skeleton. The curing agent (B) preferably includes an amine curing agent (amine compound), an imidazole curing agent, a phenol curing agent (phenol compound) or an acid anhydride curing agent (acid anhydride), and includes an amine curing agent. More preferred. The acid anhydride curing agent includes an acid anhydride having an aromatic skeleton, a water additive of the acid anhydride or a modified product of the acid anhydride, or an acid anhydride having an alicyclic skeleton, It is preferable to include a water additive of an acid anhydride or a modified product of the acid anhydride.

  From the viewpoint of improving the dispersibility of the inorganic filler (C) and further enhancing the voltage resistance and thermal conductivity of the cured product, the curing agent (B) preferably contains a basic curing agent. Further, from the viewpoint of further improving the dispersibility of the inorganic filler (C) and further increasing the voltage resistance and thermal conductivity of the cured product, the curing agent (B) is an amine curing agent or an imidazole curing agent. More preferably, it includes an amine curing agent, and particularly preferably includes dicyandiamide. Moreover, it is also preferable that a hardening | curing agent (B) contains both a dicyandiamide and an imidazole hardening | curing agent. By using these preferable curing agents, the dispersibility of the inorganic filler (C) in the thermosetting composition is increased, and a cured product having an excellent balance of heat resistance, moisture resistance and electrical properties can be obtained. As a result, even if there is little content of an inorganic filler (C), thermal conductivity becomes quite high. In particular, when dicyandiamide is used, the adhesiveness between the cured product, the heat conductor, and the conductive layer is considerably increased.

  Examples of the amine curing agent include dicyandiamide, imidazole compound, hydrazide compound, diaminodiphenylmethane, and diaminodiphenylsulfone. From the viewpoint of further improving the adhesion between the cured product and the metal layer, the amine curing agent more preferably contains dicyandiamide or an imidazole compound. From the viewpoint of further improving the storage stability of the prepreg, the curing agent (B) preferably includes a curing agent having a melting point of 180 ° C. or higher, and includes an amine curing agent having a melting point of 180 ° C. or higher. More preferred.

  Examples of the imidazole curing agent include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl. 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2- Undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 '-Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole Can be mentioned.

  Examples of the phenol curing agent include phenol novolak, o-cresol novolak, p-cresol novolak, t-butylphenol novolak, dicyclopentadiene cresol, polyparavinylphenol, bisphenol A type novolak, xylylene modified novolak, decalin modified novolak, poly ( And di-o-hydroxyphenyl) methane, poly (di-m-hydroxyphenyl) methane, and poly (di-p-hydroxyphenyl) methane. From the viewpoint of further enhancing the flexibility of the cured product and the flame retardancy of the cured product, a phenol resin having a melamine skeleton, a phenol resin having a triazine skeleton, or a phenol resin having an allyl group is preferable.

  Commercially available products of the phenol curing agent include MEH-8005, MEH-8010, and MEH-8015 (all of which are manufactured by Meiwa Kasei Co., Ltd.), YLH903 (manufactured by Mitsubishi Chemical Corporation), LA-7052, LA-7054, and LA-7751. LA-1356 and LA-3018-50P (all of which are manufactured by DIC Corporation), PS6313 and PS6492 (all of which are manufactured by Gunei Chemical Co., Ltd.), and the like.

  Examples of the acid anhydride having an aromatic skeleton, a water additive of the acid anhydride, or a modified product of the acid anhydride include, for example, a styrene / maleic anhydride copolymer, a benzophenone tetracarboxylic acid anhydride, and a pyromellitic acid anhydride. , Trimellitic anhydride, 4,4'-oxydiphthalic anhydride, phenylethynyl phthalic anhydride, glycerol bis (anhydrotrimellitate) monoacetate, ethylene glycol bis (anhydrotrimellitate), methyltetrahydroanhydride Examples include phthalic acid, methylhexahydrophthalic anhydride, and trialkyltetrahydrophthalic anhydride.

  Examples of commercially available acid anhydrides having an aromatic skeleton, water additives of the acid anhydrides, or modified products of the acid anhydrides include SMA Resin EF30, SMA Resin EF40, SMA Resin EF60, and SMA Resin EF80 (any of the above Also manufactured by Sartomer Japan), ODPA-M and PEPA (all manufactured by Manac), Ricacid MTA-10, Ricacid MTA-15, Ricacid TMTA, Ricacid TMEG-100, Ricacid TMEG-200, Ricacid TMEG-300, Ricacid TMEG-500, Ricacid TMEG-S, Ricacid TH, Ricacid HT-1A, Ricacid HH, Ricacid MH-700, Ricacid MT-500, Ricacid DSDA and Ricacid TDA-100 (all of which are manufactured by Shin Nippon Rika Co., Ltd.) PICLON B4400, EPICLON B650, and EPICLON B570 (all manufactured by both DIC Corporation).

  The acid anhydride having an alicyclic skeleton, a water additive of the acid anhydride, or a modified product of the acid anhydride is an acid anhydride having a polyalicyclic skeleton, a water additive of the acid anhydride, or the A modified product of an acid anhydride, or an acid anhydride having an alicyclic skeleton obtained by addition reaction of a terpene compound and maleic anhydride, a water additive of the acid anhydride, or a modified product of the acid anhydride It is preferable. By using these curing agents, the flexibility of the cured product and the moisture resistance and adhesion of the cured product are further increased.

  Examples of the acid anhydride having an alicyclic skeleton, a water addition of the acid anhydride, or a modified product of the acid anhydride include methyl nadic acid anhydride, acid anhydride having a dicyclopentadiene skeleton, and the acid anhydride And the like.

  Examples of commercially available acid anhydrides having the alicyclic skeleton, water additions of the acid anhydrides, or modified products of the acid anhydrides include Ricacid HNA and Ricacid HNA-100 (all of which are manufactured by Shin Nippon Rika Co., Ltd.) , And EpiCure YH306, EpiCure YH307, EpiCure YH308H, EpiCure YH309 (all of which are manufactured by Mitsubishi Chemical Corporation) and the like.

  The curing agent (B) is preferably methyl nadic acid anhydride or trialkyltetrahydrophthalic anhydride. Use of methyl nadic anhydride or trialkyltetrahydrophthalic anhydride increases the water resistance of the cured product.

  In a total of 100% by weight of the total resin component X, the content of the curing agent (B) is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. It is easy to fully harden a thermosetting composition as content of a hardening | curing agent (B) is more than the said minimum. When the content of the curing agent (B) is not more than the above upper limit, it is difficult to generate an excessive curing agent (B) that does not participate in curing. For this reason, the heat resistance and adhesiveness of hardened | cured material become still higher.

(Inorganic filler (C))
The thermosetting composition preferably contains an inorganic filler (C). The use of the inorganic filler (C) increases the thermal conductivity of the cured product. As a result, the heat dissipation of the cured product is increased. As for an inorganic filler (C), only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further increasing the thermal conductivity of the cured product, the thermal conductivity of the inorganic filler (C) is preferably 10 W / m · K or more, more preferably 15 W / m · K or more, and still more preferably 20 W / m ·. K or more. The upper limit of the thermal conductivity of the inorganic filler (C) is not particularly limited. Inorganic fillers having a thermal conductivity of about 300 W / m · K are widely known, and inorganic fillers having a thermal conductivity of about 200 W / m · K are easily available.

  The inorganic filler (C) is preferably at least one selected from the group consisting of alumina, synthetic magnesite, crystalline silica, boron nitride, aluminum nitride, silicon nitride, silicon carbide, zinc oxide and magnesium oxide, More preferably, it is at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon nitride, silicon carbide, zinc oxide and magnesium oxide. Use of these preferable inorganic fillers further increases the thermal conductivity of the cured product.

  The inorganic filler (C) is preferably at least one selected from the group consisting of spherical alumina, crushed alumina and spherical aluminum nitride, and more preferably spherical alumina or spherical aluminum nitride. Use of these preferable inorganic fillers further increases the thermal conductivity of the cured product.

  The new Mohs hardness of the inorganic filler (C) is preferably 12 or less, more preferably 9 or less. When the new Mohs hardness of the inorganic filler (C) is 9 or less, the workability of the cured product is further enhanced.

  From the viewpoint of further improving the workability of the cured product, the inorganic filler (C) is preferably at least one selected from the group consisting of synthetic magnesite, crystalline silica, zinc oxide, and magnesium oxide. The new Mohs hardness of these inorganic fillers is 9 or less.

  The inorganic filler (C) may contain a spherical filler (spherical filler), may contain a crushed filler (crushed filler), or may contain a plate-like filler (plate-like filler). Good. It is particularly preferable that the inorganic filler (C) includes a spherical filler. Since spherical fillers can be filled at high density, the use of spherical fillers further increases the thermal conductivity of the cured product.

  Examples of the crushed filler include crushed alumina. The crushing filler is obtained, for example, by crushing a lump-like inorganic substance using a uniaxial crusher, a biaxial crusher, a hammer crusher, a ball mill, or the like. By using the crushed filler, the filler in the cured product tends to be bridged or effectively brought into a close structure. Therefore, the thermal conductivity of the cured product is further increased. Moreover, generally the crushing filler is cheap compared with a normal filler. For this reason, the cost of a thermosetting composition becomes low by use of a crushing filler.

  The average particle diameter of the crushed filler is preferably 12 μm or less, more preferably 10 μm or less, and preferably 1 μm or more. When the average particle size of the crushed filler is not more than the above upper limit, the crushed filler can be dispersed with high density in the thermosetting composition, and the withstand voltage of the cured product is further enhanced. When the average particle diameter of the crushed filler is not less than the above lower limit, it becomes easy to fill the crushed filler with high density.

  The aspect ratio of the crushing filler is not particularly limited. The aspect ratio of the crushed filler is preferably 1.5 or more, and preferably 20 or less. Fillers with an aspect ratio of less than 1.5 are relatively expensive and increase the cost of the prepreg. When the aspect ratio is 20 or less, filling of the crushed filler is easy.

  The aspect ratio of the crushed filler can be determined, for example, by measuring the crushed surface of the filler using a digital image analysis particle size distribution measuring apparatus (“FPA” manufactured by Nippon Luft).

  The average particle size of the inorganic filler (C) is preferably 0.1 μm or more, more preferably 0.2 μm or more, preferably 100 μm or less, more preferably 50 μm or less. When the average particle diameter is not less than the above lower limit, the inorganic filler (C) can be easily filled at a high density. When the average particle size is not more than the above upper limit, the withstand voltage of the cured product is further enhanced.

  The “average particle diameter” is an average particle diameter obtained from a volume average particle size distribution measurement result measured by a laser diffraction particle size distribution measuring apparatus.

  In 100% by volume of the thermosetting composition, the content of the inorganic filler (C) is preferably 20% by volume or more, more preferably 40% by volume or more, preferably 95% by volume or less, more preferably 90% by volume or less. is there. When the content of the inorganic filler (C) is not less than the above lower limit and not more than the above upper limit, the cured state of the cured product becomes good and the thermal conductivity becomes considerably high.

(Coupling agent)
The thermosetting composition preferably contains a coupling agent. By using the coupling agent, the withstand voltage of the cured product is further improved. As for the said coupling agent, only 1 type may be used and 2 or more types may be used together.

  Examples of the coupling agent include silane coupling agents, titanate coupling agents, zirconate coupling agents, and aluminate coupling agents.

  In the total 100% by weight of the total resin component X, the content of the coupling agent is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 20% by weight or less, more preferably 10% by weight or less. When the content of the coupling agent is not less than the above lower limit and not more than the above upper limit, the heat resistance and voltage resistance of the cured product are further improved. The resin component X includes the coupling agent.

(Surfactant)
The thermosetting composition preferably contains a surfactant. By using the surfactant, the withstand voltage of the cured product is further improved. As for the said surfactant, only 1 type may be used and 2 or more types may be used together. Moreover, in order to further improve the voltage resistance and heat resistance of the cured product, the thermosetting composition preferably contains the coupling agent or a surfactant.

  As the surfactant, polyester carboxylic acid, polyether carboxylic acid, polyacrylic carboxylic acid, aliphatic carboxylic acid, polysiloxane carboxylic acid, polyester phosphoric acid, polyether phosphoric acid, polyacrylic Nonionic surfactants having phosphoric acid, aliphatic phosphoric acid, polysiloxane phosphoric acid, polyester phenol, polyether phenol, polyacrylic phenol, aliphatic phenol, polysiloxane phenol, orioxyalkylene skeleton , Anionic surfactants and cationic surfactants.

  In the total 100% by weight of the total resin component X, the content of the surfactant is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 20% by weight or less, more preferably 10% by weight or less. When the content of the surfactant is not less than the above lower limit and not more than the above upper limit, the heat resistance and voltage resistance of the cured product are further improved. The resin component X contains the surfactant.

(Other ingredients)
The thermosetting composition may contain a polymer having a weight average molecular weight of 10,000 or more. As for this polymer, only 1 type may be used and 2 or more types may be used together.

  As the polymer, a curable resin such as a thermoplastic resin and a thermosetting resin can be used. The polymer is preferably a curable resin.

  The thermoplastic resin and thermosetting resin are not particularly limited. The thermoplastic resin is not particularly limited, and examples thereof include styrene resin, phenoxy resin, phthalate resin, thermoplastic urethane resin, polyamide resin, thermoplastic polyimide resin, ketone resin, and norbornene resin. The thermosetting resin is not particularly limited, and examples thereof include amino resins, phenol resins, thermosetting urethane resins, epoxy resins, thermosetting polyimide resins, and amino alkyd resins. Examples of the amino resin include urea resin and melamine resin.

  From the viewpoint of suppressing the oxidative degradation of the cured product, further improving the heat cycle resistance and heat resistance of the cured product, and further reducing the water absorption rate of the cured product, the polymer is a styrene resin, phenoxy resin or epoxy resin. It is preferable that it is a phenoxy resin or an epoxy resin, more preferably a phenoxy resin. In particular, use of a phenoxy resin or an epoxy resin further increases the heat resistance of the cured product. Moreover, use of a phenoxy resin further lowers the elastic modulus of the cured product and further improves the cold-heat cycle characteristics of the cured product. The polymer may not have a cyclic ether group such as an epoxy group.

  As the styrene resin, specifically, a homopolymer of a styrene monomer, a copolymer of a styrene monomer and an acrylic monomer, or the like can be used. Among these, a styrene polymer having a styrene-glycidyl methacrylate structure is preferable.

  Examples of the styrene monomer include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, p-ethylstyrene, and pn-. Butyl styrene, p-tert-butyl styrene, pn-hexyl styrene, pn-octyl styrene, pn-nonyl styrene, pn-decyl styrene, pn-dodecyl styrene, 2,4-dimethyl Examples include styrene and 3,4-dichlorostyrene.

  Specifically, the phenoxy resin is, for example, a resin obtained by reacting an epihalohydrin with a divalent phenol compound, or a resin obtained by reacting a divalent epoxy compound with a divalent phenol compound.

  The phenoxy resin comprises a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol A / F mixed skeleton, a naphthalene skeleton, a fluorene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantane skeleton, and a dicyclopentadiene skeleton. It is preferred to have at least one skeleton selected from the group. Among these, the phenoxy resin preferably has at least one skeleton selected from the group consisting of a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol A / F mixed skeleton, a naphthalene skeleton, a fluorene skeleton, and a biphenyl skeleton. Preferably, it has at least one skeleton of a fluorene skeleton and a biphenyl skeleton. Use of the phenoxy resin having these preferable skeletons further increases the heat resistance of the cured product.

  The epoxy resin is an epoxy resin other than the phenoxy resin. Examples of the epoxy resins include styrene skeleton-containing epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, biphenol type epoxy resins, naphthalene type epoxy resins, and fluorene type epoxy resins. , Phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, anthracene type epoxy resin, epoxy resin having adamantane skeleton, epoxy resin having tricyclodecane skeleton, and epoxy resin having triazine nucleus in skeleton Etc.

  The thermosetting composition may contain rubber particles. Use of the rubber particles increases the stress relaxation property and flexibility of the cured product.

  The thermosetting composition may contain a dispersant. Use of the dispersant further increases the thermal conductivity and voltage resistance of the cured product.

  The dispersant preferably has a functional group containing a hydrogen atom having hydrogen bonding properties. When the dispersant has a functional group containing a hydrogen atom having hydrogen bonding properties, the thermal conductivity and voltage resistance of the cured product are further enhanced. Examples of the functional group containing a hydrogen atom having hydrogen bonding include a carboxyl group (pKa = 4), a phosphoric acid group (pKa = 7), a phenol group (pKa = 10), and the like.

  The pKa of the functional group containing a hydrogen atom having hydrogen bonding property is preferably 2 or more, more preferably 3 or more, preferably 10 or less, more preferably 9 or less. When the pKa of the functional group is not less than the lower limit, the acidity of the dispersant does not become too high. Therefore, the storage stability of the thermosetting composition and prepreg is further enhanced. When the pKa of the functional group is not more than the above upper limit, the function as the dispersant is sufficiently achieved, and the thermal conductivity and voltage resistance of the cured product are further enhanced.

  Furthermore, the thermosetting composition contains an antioxidant, an ion scavenger, a tackifier, a plasticizer, a thixotropic agent, a flame retardant, a photosensitizer, a colorant, and the like as necessary. May be.

(Base material)
In FIG. 2, an example of the base material used for the prepreg which concerns on one Embodiment of this invention is shown with a top view.

  The base material 10 includes a plurality of first resin threads 11 extending in a first direction and a plurality of second resin threads 12 extending in a second direction that intersects the first direction. The first resin thread 11 and the second resin thread 12 are laminated. The substrate 10 is not a woven fabric. In the base material 10, the first resin yarn 11 and the second resin yarn 12 are not knitted. The base material 10 is a net-like body.

  The plurality of first resin threads 11 are arranged in parallel in the first direction at a predetermined interval. The plurality of second resin threads 12 are arranged in parallel in the second direction at a predetermined interval. A second resin thread 12 is laminated on the first resin thread 11. In addition, the first resin thread 11 may be laminated on the second resin thread 12, and the second resin thread 12 is further formed on the first resin thread 11 on the second resin thread 12. It may be laminated. Therefore, the first resin thread 11 and the second resin thread 12 may be laminated in a plurality of layers.

The first direction in which the first resin thread 11 extends and the second direction in which the second resin thread 12 extends are orthogonal to each other. The angle formed by the first direction and the second direction is 90 degrees. The angle formed by the first direction in which the first resin yarn extends and the second direction in which the second resin yarn extends is not particularly limited. Like the base material 50 shown in FIG. 3, the first direction in which the first resin yarn 51 extends and the second direction in which the second resin yarn 52 extends are not orthogonal to each other, but both are oblique directions. You may cross.
The angle formed between the first direction in which the first resin yarn extends and the second direction in which the second resin yarn extends is preferably 30 degrees or more, more preferably 60, so that the opening area becomes appropriately large. More than 90 degrees and less than 90 degrees.

  Each of the first resin yarn 11 and the second resin yarn 12 is preferably a flat yarn.

  The material of the first resin thread 11 and the second resin thread 12 is a polyolefin resin. Examples of the polyolefin resin include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ethylene-α olefin copolymer, propylene-α olefin copolymer, and ethylene-ethyl acrylate copolymer. , Ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, and polypropylene. As for the said polyolefin resin, only 1 type may be used and 2 or more types may be used together.

  The first resin thread 11 and the second resin thread 12 are integrated at the intersection. The first resin thread 11 and the second resin thread 12 may be bonded by an adhesive at the intersection, and the first resin thread 11 and the second resin thread 12 are thermally fused at the intersection. Also good. At the time of molding the first resin yarn 11 and the second resin yarn 12, the first resin yarn 11 and the second resin yarn 12 are laminated before the resin constituting them is solidified, at the intersection. You may solidify so that it may integrate. From the viewpoint of further improving the heat resistance of the cured product, it is preferable that the first resin yarn 11 and the second resin yarn 12 are heat-sealed at the intersection.

  The average value of the opening diameters of the substrate 10 is preferably 100 μm or more, more preferably 1 mm or more, still more preferably 3 mm or more, preferably 10 mm or less. When the opening diameter of the substrate 10 is not less than the above lower limit and not more than the above upper limit, the handling property of the prepreg in an uncured state is further improved. Furthermore, when a thermosetting composition contains an inorganic filler (C), an inorganic filler (C) can be filled in the opening part of the base material 10, and the heat conductivity of hardened | cured material becomes still higher.

  From the viewpoint of dispersing the inorganic filler (C) well in the base material 10, further enhancing the voltage resistance of the cured product and further suppressing the warpage, and further suppressing the warpage of the laminate. It is preferable that the average particle diameter of the filler (C) is 0.1 μm or more and 100 μm or less, and the average value of the opening diameter of the substrate 10 is 3 mm or more and 10 mm or less.

  From the viewpoint of dispersing the inorganic filler (C) well in the base material 10, further enhancing the voltage resistance of the cured product and further suppressing the warpage, and further suppressing the warpage of the laminate. The average particle diameter of the filler (C) is preferably 1/5 or less, more preferably 1/10 or less, of the average value of the opening diameter of the substrate 10.

  The said opening diameter means the maximum length of the opening in one opening part. The average value of the opening diameter is a value obtained by averaging the values of the maximum lengths of the openings in the plurality of openings.

  The maximum thickness of the substrate is preferably 10 μm or more, more preferably 30 μm or more, still more preferably 50 μm or more, preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. When the maximum thickness of the substrate is equal to or more than the lower limit, a prepreg suitable for an electronic component such as a laminate can be obtained.

(Other details of prepreg)
FIG. 1 is a partially cutaway perspective view schematically showing an example of a prepreg according to an embodiment of the present invention.

  A prepreg 1 shown in FIG. 1 has a base material 10 and a thermosetting composition 2 impregnated in the base material 10. The base material 10 is not exposed on the surface of the prepreg 1. The substrate 10 may be exposed on the surface of the prepreg 1.

  The thermal conductivity of the cured prepreg is preferably 0.7 W / m · K or more, more preferably 1.0 W / m · K or more, and still more preferably 1.5 W / m · K or more. The higher the thermal conductivity, the higher the heat dissipation of the cured product.

  The dielectric breakdown voltage of the cured prepreg is preferably 3 kV or more, more preferably 4 kV or more, still more preferably 5 kV or more, and particularly preferably 8 kV or more. The higher the breakdown voltage, the more sufficient insulation can be ensured when the prepreg is used for large current applications such as for power devices.

(Electronic parts)
The prepreg is preferably dispersed in order to obtain various electronic components such as a laminate and a laminate.

  FIG. 4 is a cross-sectional view showing an example of a laminated board using a prepreg according to an embodiment of the present invention.

  A laminated plate 21 shown in FIG. 4 includes a metal layer 22 and a resin layer 23 laminated on the surface of the metal layer 22. The resin layer 23 is formed using the prepreg 1 in which the thermosetting composition 2 is impregnated in the base material 10. The resin layer 23 may be the prepreg 1 itself, or may be a semi-cured product or a cured product in which the prepreg 1 is cured. The metal layer 22 is preferably a circuit. In FIG. 4, the resin layer 23 is schematically illustrated, and the base material 10 is not illustrated.

  Moreover, the said prepreg is used suitably in order to obtain a printed wiring board provided with a printed wiring board main body and the resin layer arrange | positioned on this printed wiring board main body. The resin layer is preferably formed by curing the prepreg 1 in which the thermosetting composition 2 is impregnated in the substrate 10.

  Hereinafter, the present invention will be clarified by giving specific examples and comparative examples of the present invention. The present invention is not limited to the following examples.

  The following materials were prepared.

(Thermosetting compound (A))
(1) Bisphenol A type liquid epoxy resin ("Epicoat 828US" manufactured by Mitsubishi Chemical Corporation, molecular weight 370)
(2) Pentafunctional acrylic resin (Sartomer “SR399E”, molecular weight 525)
(3) Thermosetting polyimide resin ("BANI-X" manufactured by Maruzen Petrochemical Co., Ltd., molecular weight 508)

(Thermoplastic compounds)
(1) Isobornyl methacrylate (Sartomer "SR423", molecular weight 222)

(Curing agent (B))
(1) Dicyandiamide (melting point 208 ° C)
(2) Isocyanur-modified solid dispersion type imidazole (“2MZA-PW” manufactured by Shikoku Kasei Co., Ltd., melting point 253 ° C.)
(3) AIBN (2,2′-azobisisobutyronitrile, melting point 170 ° C.)

(Inorganic filler (C))
(1) 5 μm crushed alumina (“LT300C” manufactured by Nippon Light Metal Co., Ltd., average particle diameter 5 μm, thermal conductivity 36 W / m · K, new Mohs hardness 12)
(2) 150 μm crushed alumina (“AC-12R” manufactured by Sumitomo Chemical Co., Ltd., average particle diameter 150 μm, thermal conductivity 36 W / m · K, new Mohs hardness 12)
(3) Crystalline silica (“Crystallite CMC-12” manufactured by Tatsumori Co., Ltd., average particle diameter 5 μm, thermal conductivity 10 W / m · K, new Mohs hardness 9)
(4) Boron nitride (“TPX25” manufactured by Momentive, average particle size 25 μm, thermal conductivity 60 W / m · K, new Mohs hardness 2)
(5) Aluminum hydroxide (“B-103” manufactured by Nippon Light Metal Co., Ltd., average particle size 8 μm, thermal conductivity 1.3 W / m · K, new Mohs hardness 3)

(Additive)
(1) Epoxysilane coupling agent (“KBE403” manufactured by Shin-Etsu Chemical Co., Ltd.)
(2) Surfactant (“D-90” manufactured by Kyoeisha Chemical Co., Ltd.)

(Polyolefin substrate)
(1) Hot melt type polyethylene fiber substrate (“NA-55” manufactured by Sekisui Film Co., Ltd., thickness 82 μm, average value of opening diameter 5 mm)
(2) Heat-sealable polyethylene fiber substrate 1 (“HN-33” manufactured by Sekisui Film Co., Ltd., thickness 60 μm, average value of opening diameter 7 mm)
(3) Heat-sealable polyethylene fiber substrate 2 (“HN-77” manufactured by Sekisui Film Co., Ltd., thickness 60 μm, average value of opening diameter 3 mm)

(Other base materials)
(1) Glass cloth ("E10T" manufactured by Unitika Ltd., thickness 90 μm, average value of opening diameter 0.2 mm)
(2) Aramid fiber sheet (“FF sheet AW25” manufactured by Maeda Kosen Co., Ltd., thickness 125 μm, average value of opening diameters is less than 1 mm)

(Examples 1-14 and Comparative Examples 1-5)
Using a homodisper type stirrer, each raw material was blended in the proportions shown in Tables 1 and 2 below (the blending unit is parts by weight) and kneaded to prepare an insulating material.

  In the case of using a fiber base material, the above-mentioned insulating material was impregnated into the types of base materials shown in Tables 1 and 2 below. Thereafter, the insulating material was scraped off with a blade so that the maximum thickness was 150 μm, and dried in an oven at 90 ° C. for 30 minutes to prepare a prepreg.

  When the fiber base material is not used, the insulating material is coated on a 50 μm-thick release PET (polyethylene terephthalate) sheet so that the thickness is 150 μm, and dried in an oven at 90 ° C. for 30 minutes. An insulating sheet was prepared on the PET sheet.

(Evaluation)
(1) Handling property The obtained prepreg or insulating sheet was cut into a size of 460 mm × 610 mm to obtain a test sample. For the insulating sheet formed on the PET sheet, the insulating sheet was peeled off from the PET sheet. Using the obtained test sample, the handling property at room temperature (23 ° C.) was evaluated according to the following criteria.

[Handling criteria]
◯: The prepreg or insulating sheet is not deformed and can be easily peeled. Δ: Although the prepreg or insulating sheet can be peeled, elongation or breakage occurs. ×: The prepreg or insulating sheet cannot be peeled.

(2) Heat resistance A prepreg or an insulating sheet is sandwiched between an aluminum plate having a thickness of 1.5 mm and an electrolytic copper foil having a thickness of 35 μm, and while maintaining a pressure of 4 MPa with a vacuum press machine, 120 ° C. for 1 hour, further 200 ° C. The prepreg or insulating sheet was press-cured for 1 hour to form a copper-clad laminate. This copper-clad laminate was cut into a size of 50 mm × 60 mm to obtain a test sample. The obtained test sample was floated in a solder bath at 288 ° C. with the copper foil side facing down, and the time until the copper foil swelled or peeled off was measured and judged according to the following criteria.

[Criteria for solder heat resistance test]
○: No swelling or peeling even after 3 minutes △: Swelling or peeling occurs after 1 minute and before 3 minutes ×: Swelling or peeling occurs after 1 minute

(3) Voltage resistance The obtained prepreg or insulating sheet was cut into a size of 100 mm × 100 mm to obtain a test sample. For the insulating sheet formed on the PET sheet, the insulating sheet was peeled off from the PET sheet. The obtained test sample was cured in an oven at 120 ° C. for 1 hour and further in an oven at 200 ° C. for 1 hour to obtain a cured product of a prepreg or a cured product of an insulating sheet. An AC voltage was applied using a withstand voltage tester (MODEL7473, manufactured by EXTECH Electronics) so that the voltage increased at a rate of 1 kV / sec between the cured prepregs or the cured cured sheet. The voltage at which the cured product of the prepreg or the cured product of the insulating sheet was destroyed was defined as a dielectric breakdown voltage.

(4) Warpage The obtained prepreg or insulating sheet was cut into a size of 50 mm x 500 mm to obtain a test sample. For the insulating sheet formed on the PET sheet, the insulating sheet was peeled off from the PET sheet. The obtained test sample was cured in an oven at 120 ° C. for 1 hour and further in an oven at 200 ° C. for 1 hour to obtain a cured product of a prepreg or a cured product of an insulating sheet. The difference between the maximum height and the minimum height of the cured product was measured on the obtained cured product on a horizontal table. The difference was regarded as the warpage of the cured product, and the warpage was determined according to the following criteria.

[Criteria for warping]
○: Warpage is less than 1 mm △: Warpage is 1 mm or more and less than 3 mm ×: Warpage is 3 mm or more

(5) Workability The obtained prepreg or insulating sheet was cut into a size of 50 mm x 500 mm to obtain a test sample. For the insulating sheet formed on the PET sheet, the insulating sheet was peeled off from the PET sheet. The obtained test sample was cured in an oven at 120 ° C. for 1 hour and further in an oven at 200 ° C. for 1 hour to obtain a cured product of a prepreg or a cured product of an insulating sheet. This cured product was subjected to router processing using a drill having a diameter of 2.0 mm (manufactured by Union Tool, RA series) under conditions of a rotational speed of 60000 and a table feed speed of 0.3 m / min. The processing distance until the flash was generated was measured, and the workability was evaluated according to the following criteria.

[Criteria for workability]
○: 50 m or more can be processed without burring △: 20 m or more and less than 50 m can be processed without burring ×: Burr is generated by processing less than 20 m

(6) Heat dissipation property A prepreg or an insulating sheet is sandwiched between an aluminum plate having a thickness of 1.5 mm and an electrolytic copper foil having a thickness of 35 μm. The prepreg or insulating sheet was press-cured for 1 hour to form a copper-clad laminate. This copper-clad laminate was cut into a size of 50 mm × 60 mm to obtain a test sample.

The test sample was pressed from the copper foil side with a pressure of 196 N / cm ² onto a heating element having a smooth surface controlled to 60 ° C. of the same size. The temperature of the surface of the aluminum plate was measured by a thermocouple. The heat dissipation was determined according to the following criteria.

[Criteria for heat dissipation]
○: Temperature difference between the surface of the heating element and the aluminum plate exceeds 3 ° C. and within 6 ° C. Δ: Temperature difference between the surface of the heating element and the aluminum plate exceeds 6 ° C. and within 10 ° C. ×: Surface temperature difference exceeds 10 ° C

  The results are shown in Tables 1 and 2 below. In Tables 1 and 2 below, “◯” is given to the type of base material used.

DESCRIPTION OF SYMBOLS 1 ... Prepreg 2 ... Thermosetting composition 10 ... Base material 11 ... 1st resin thread 12 ... 2nd resin thread 21 ... Laminate board 22 ... Metal layer 23 ... Resin layer 50 ... Base material 51 ... 1st resin Thread 52 ... Second resin thread

Claims (10)

A metal layer,
A resin layer laminated on the surface of the metal layer,
The resin layer is formed using a prepreg in which a thermosetting composition is impregnated in a base material,
The thermosetting composition comprises a thermosetting compound;
The base material is a base material that is not a woven fabric, and the base material includes a plurality of first resin yarns extending in a first direction and a plurality of base materials extending in a second direction intersecting the first direction. A second resin thread, the first resin thread and the second resin thread are laminated, and the first resin thread and the second resin thread are integrated at an intersection. And
A laminated board in which materials of the first resin yarn and the second resin yarn are polyolefin resins, respectively.   The laminate according to claim 1, wherein the first resin yarn and the second resin yarn are heat-sealed at an intersection.   The laminated board of Claim 1 or 2 in which the said thermosetting composition contains an inorganic filler.   The laminated board of Claim 3 whose new Mohs hardness of the said inorganic filler is 9 or less.   The laminated board of Claim 3 or 4 whose heat conductivity of the said inorganic filler is 10 W / m * K or more.   The laminated board of any one of Claims 3-5 whose average particle diameter of the said inorganic filler is 0.1 micrometer or more and 100 micrometers or less.   The laminated board of any one of Claims 1-6 whose average value of the opening diameter of the said base material is 3 mm or more and 10 mm or less.   The laminated board of any one of Claims 1-7 whose maximum thickness of the said base material is 30 micrometers or more and 100 micrometers or less.   The laminate according to any one of claims 1 to 8, wherein the thermosetting composition contains a coupling agent or a surfactant.   The laminated board of any one of Claims 1-9 in which the said thermosetting compound contains the thermosetting compound which has a cyclic ether group.

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