CN109135629A - A kind of preparation method of printed wiring board PPTC adhesive - Google Patents
A kind of preparation method of printed wiring board PPTC adhesive Download PDFInfo
- Publication number
- CN109135629A CN109135629A CN201810721988.9A CN201810721988A CN109135629A CN 109135629 A CN109135629 A CN 109135629A CN 201810721988 A CN201810721988 A CN 201810721988A CN 109135629 A CN109135629 A CN 109135629A
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- China
- Prior art keywords
- parts
- adhesive
- pptc
- wiring board
- component
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to electronic materials and adhesive area, are related to a kind of preparation method of printed wiring board PPTC adhesive.Present invention process is simple, low in cost, and the PPTC adhesive curing time of preparation is short, for the conductive bond of the end electronic component I/O in the circuit board, and plays the role of excess-current excess-temperature protection.Wiring board area can be effectively saved, manufacturing cost and process cycle is reduced, device circuit reliability can be promoted.
Description
Technical field
The invention belongs to electronic materials and adhesive area, are related to a kind of preparation side of printed wiring board PPTC adhesive
Method.
Background technique
The resistivity of positive temperature coefficient (PTC) material increases with the raising of temperature, and macromolecule is blended with conductive filler can
Composite material (PPTC) obtained has lower room temperature resistivity, increases resistivity with temperature and increases and in some temperature spot electricity
Resistance sharply increases, and resistance, which sharply increases, under current state realizes circuit shutdown, and can voluntarily restore low after troubleshooting
Resistance state.In view of PPTC device is all to connect to play a protective role in circuit, using the medium of PTC current-limiting protection function as
The cohesive body of connection and component pin and wiring board can effectively save wiring board area, reduce manufacturing cost, promote device
Circuit reliability.
The adhesive solidification time often directly affects time and the reliability of SMT process flow, and the present invention develops one kind and is used for
Conductive connection can rapid curing PPTC adhesive with overcurrent protection.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of preparations of PPTC adhesive of printed wiring board
Method, which comprises the steps of:
(1) cupric salt being dissolved into deionized water, sequentially adds alkali and complexing agent, stirring dissolves it sufficiently,
Graphite oxide is added, is dispersed with stirring under ultrasonic environment, obtains uniform colloidal sol, be eventually adding reducing agent, stop after completely dissolution
Stirring；After room temperature~70 DEG C isothermal reaction 6~8 hours, after obtained precipitating is used deionized water, ethanol washing, it is distributed to
In butyl acrylate, powder and butyl acetate mass ratio 1: 2~1: 3；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
20-30 parts of ABS
3-8 parts of isopropyl benzene hydroperoxide
0.1-0.5 parts of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
10-15 parts of nitrile rubber
1-5 parts of thiocarbamide
0.1-0.5 parts of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding.
The cupric salt includes or mixtures thereof one of copper nitrate, copper acetate, cupric oxalate, cupric tartrate, concentration
For 0.01mol/L~0.06mol/L；The sulfydryl complexing agent includes one of thioacetic acid, mercaptopropionic acid or combinations thereof, is added
The mole for entering complexing agent is 1~3 times of copper atom mole in reaction system；The alkali concentration be 0.1mol/L~
0.5mol/L。
0.5~1.5g/L of the graphite oxide concentration, the reducing agent be one of potassium borohydride, sodium borohydride or its
Combination；The mole that reducing agent is added is 12~25 times of Cu atomic mol in reaction system.
The printed wiring board of preparation is bonded and is played for the input and/or output end of electronic component with PPTC adhesive and led
Logical effect, when electric current is excessive or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, can be self-healing after troubleshooting
Conducting.
Present invention process is simple, low in cost, and the PPTC adhesive curing time of preparation is short, is used for the end electronic component I/O
Conductive bond in the circuit board, and play the role of excess-current excess-temperature protection.Wiring board area can be effectively saved, system is reduced
This and process cycle are caused, device circuit reliability can be promoted.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) 0.01mol/L copper nitrate is dissolved into deionized water, sequentially add 0.1mol/L sodium hydroxide and
0.03mol/L thioacetic acid, stirring dissolve it sufficiently, and 1.5g/L graphite oxide is added, is dispersed with stirring, obtains under ultrasonic environment
To uniform colloidal sol, it is eventually adding 0.25mol/L sodium borohydride, stops stirring after completely dissolution；After room temperature isothermal reaction 8 hours,
After obtained precipitating is used deionized water, ethanol washing, it is distributed in butyl acrylate, powder and butyl acetate mass ratio 1:
2；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
20 parts of methacrylic acid
30 parts of ABS
8 parts of isopropyl benzene hydroperoxide
0.5 part of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
20 parts of methacrylic acid
15 parts of nitrile rubber
5 parts of thiocarbamide
0.5 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, tensile strength: 67MPa；Conductivity:
55Scm-1；PTC intensity: 3.1.
Embodiment 2:
(1) 0.06mol/L copper acetate is dissolved into deionized water, sequentially add 0.5mol/L potassium hydroxide and
0.06mol/L thioacetic acid, stirring dissolve it sufficiently, and 0.5g/L graphite oxide is added, is dispersed with stirring, obtains under ultrasonic environment
To uniform colloidal sol, it is eventually adding 0.72mol/L potassium borohydride, stops stirring after completely dissolution；70 DEG C after isothermal reaction 6 hours,
After obtained precipitating is used deionized water, ethanol washing, it is distributed in butyl acrylate, powder and butyl acetate mass ratio 1:
3；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
100 parts of methacrylic acid
20 parts of ABS
3 parts of isopropyl benzene hydroperoxide
0.1 part of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
10 parts of methacrylic acid
10 parts of nitrile rubber
1 part of thiocarbamide
0.1 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, tensile strength: 59MPa；Conductivity:
51Scm-1；PTC intensity: 3.9.
Embodiment 3:
(1) 0.05mol/L cupric oxalate is dissolved into deionized water, sequentially add 0.4mol/L sodium hydroxide and
0.1mol/L thioacetic acid, stirring dissolve it sufficiently, and 1g/L graphite oxide is added, is dispersed with stirring, obtains under ultrasonic environment
Uniform colloidal sol is eventually adding 0.8mol/L sodium borohydride, stops stirring after completely dissolution；50 DEG C after isothermal reaction 7 hours, will
After the precipitating arrived is using deionized water, ethanol washing, it is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 3；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
15 parts of methacrylic acid
20 parts of ABS
5 parts of isopropyl benzene hydroperoxide
0.5 part of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
15 parts of methacrylic acid
10 parts of nitrile rubber
3 parts of thiocarbamide
0.3 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, tensile strength: 51MPa；Conductivity:
62Scm-1；PTC intensity: 2.8.
Embodiment 4:
(1) 0.03mol/L cupric tartrate is dissolved into deionized water, sequentially add 0.3mol/L potassium hydroxide and
0.06mol/L thioacetic acid, stirring dissolve it sufficiently, and 1g/L graphite oxide is added, is dispersed with stirring, obtains under ultrasonic environment
Uniform colloidal sol is eventually adding 0.5mol/L potassium borohydride, stops stirring after completely dissolution；After room temperature reaction 7 hours, by what is obtained
After precipitating is using deionized water, ethanol washing, it is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 2；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
20 parts of methacrylic acid
30 parts of ABS
8 parts of isopropyl benzene hydroperoxide
0.5 part of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
15 parts of methacrylic acid
10 parts of nitrile rubber
5 parts of thiocarbamide
0.4 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, tensile strength: 42MPa；Conductivity:
66Scm-1；PTC intensity: 3.6.
Claims (4)
1. a kind of printed wiring board preparation method of PPTC adhesive, which comprises the steps of:
(1) cupric salt is dissolved into deionized water, sequentially adds alkali and complexing agent, stirring dissolves it sufficiently, is added
Graphite oxide is dispersed with stirring under ultrasonic environment, obtains uniform colloidal sol, be eventually adding reducing agent, stops stirring after completely dissolution；
After room temperature~70 DEG C isothermal reaction 6~8 hours, after obtained precipitating is used deionized water, ethanol washing, it is distributed to acrylic acid
In butyl ester, powder and butyl acetate mass ratio 1: 2~1: 3；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, be separately added into functional component for match preparing adhesive A
Component and B component,
Each weight ratio of constituents of component A are as follows:
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
20-30 parts of ABS
3-8 parts of isopropyl benzene hydroperoxide
0.1-0.5 parts of hydroquinone
Each weight ratio of constituents of B component are as follows:
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
10-15 parts of nitrile rubber
1-5 parts of thiocarbamide
0.1-0.5 parts of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding.
2. the preparation method of a kind of printed wiring board PPTC adhesive according to claim 1, which is characterized in that described two
Valence mantoquita includes or mixtures thereof one of copper nitrate, copper acetate, cupric oxalate, cupric tartrate, concentration be 0.01mol/L~
0.06mol/L；The sulfydryl complexing agent includes one of thioacetic acid, mercaptopropionic acid or combinations thereof, and rubbing for complexing agent is added
Your amount is 1~3 times of copper atom mole in reaction system；The alkali concentration is 0.1mol/L~0.5mol/L.
3. the preparation method of a kind of printed wiring board PPTC adhesive according to claim 1, which is characterized in that the oxygen
0.5~1.5g/L of graphite concentration, the reducing agent are one of potassium borohydride, sodium borohydride or combinations thereof；Reduction is added
The mole of agent is 12~25 times of Cu atomic mol in reaction system.
4. prepared by a kind of preparation method of printed wiring board as described in claims 1 to 3 any one with PPTC adhesive
Printed wiring board PPTC adhesive, the input and/or output end for electronic component is bonded and plays the role of conducting, works as electricity
When flowing through big or element over-temperature, resistance, which sharply increases, realizes circuit shutdown, can be self-healing conducting after troubleshooting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810721988.9A CN109135629A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of printed wiring board PPTC adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810721988.9A CN109135629A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of printed wiring board PPTC adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109135629A true CN109135629A (en) | 2019-01-04 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810721988.9A Withdrawn CN109135629A (en) | 2018-06-26 | 2018-06-26 | A kind of preparation method of printed wiring board PPTC adhesive |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN1786096A (en) * | 2004-12-08 | 2006-06-14 | Lg电线株式会社 | Anisotropic conductive adhesive having PTC characteristics |
| CN1925070A (en) * | 2006-09-19 | 2007-03-07 | 谭富彬 | Composition and preparation of aluminum conductive electric slurry for positive temperature coefficient heat-variable resistor |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
-
2018
- 2018-06-26 CN CN201810721988.9A patent/CN109135629A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN1786096A (en) * | 2004-12-08 | 2006-06-14 | Lg电线株式会社 | Anisotropic conductive adhesive having PTC characteristics |
| CN1925070A (en) * | 2006-09-19 | 2007-03-07 | 谭富彬 | Composition and preparation of aluminum conductive electric slurry for positive temperature coefficient heat-variable resistor |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 李宝库 等主编: "《胶粘剂应用技术》", 31 December 1989, 中国商业出版社 * |
| 田甜 等: "化学原位还原法制备石墨烯-铜纳米颗粒复合物", 《电子显微学报》 * |
| 钟力生 等编: "《工程电介质物理与介电现象》", 31 March 2013, 西安交通大学出版社 * |
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Application publication date: 20190104 |