CN109128580A - A kind of unleaded vacuum seal solder and preparation method thereof - Google Patents
A kind of unleaded vacuum seal solder and preparation method thereof Download PDFInfo
- Publication number
- CN109128580A CN109128580A CN201811184336.2A CN201811184336A CN109128580A CN 109128580 A CN109128580 A CN 109128580A CN 201811184336 A CN201811184336 A CN 201811184336A CN 109128580 A CN109128580 A CN 109128580A
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- CN
- China
- Prior art keywords
- parts
- solder
- unleaded
- oxide
- vacuum seal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Catalysts (AREA)
Abstract
The present invention discloses a kind of unleaded vacuum seal solder, including following component: 60~80 parts of bismuth oxide；6~16 parts of boron oxide；Silica 1~2 part；4~5 parts of aluminium oxide；Each component is in parts by weight.Solder, production and the use for having prevented lead or lead oxides in are made using completely new formula in the present invention, and in each component, bismuth oxide is not soluble in water and alkali, odorlessness are stable in the air, silica, not soluble in water, insoluble in acid, aluminium oxide is not soluble in water and non-polar organic solvent, with strong adsorption capacity and catalytic activity, materials environmental protection, it is ensured that the production and use of solder will not generate toxicity, meet the environmental requirement of vacuum cup sealing-in.
Description
Technical field
The present invention relates to a kind of solder, specifically a kind of solder for vacuum seal.
Background technique
Solder is the general name for dosing the metal alloy compositions in weld seam, overlay cladding and brazed seam.Including welding wire
(welding wire), welding rod (welding rod), solder (brazing and soldering alloy) etc..Melting welding weldering
The fusion temperature of material is usually less than the solidus of base material, chemical component, mechanical and thermal characteristics all with base material relatively,
Such as various welding rods, flux-cored wire.Weld strength is often not less than base material itself；And the fusion temperature of solder has to be lower than base material
Solidus, chemical component are often mutually gone farther out with base material, and brazed seam is very thin, precision size, but Joint intensity majority is not as good as base material sheet
Body, corrosion stability are also poor.For solder when in use such as arc welding, temperature is often more than that base material and solder itself are many, no soft or hard point；
And the hard solder in solder, the soldering joint strength such as copper zinc material (ormolu), silver solder (yellow gold) are larger, it is main to use
In the higher metal component of bonding strength requirement, and to be welded into strength of joint smaller for soft solder such as scolding tin (alloy based on tin-lead),
It is mainly used for connecting the small connector of inexcessive desired strength, such as electronic instrument and meter, the connector of household electrical appliances electronic circuit.
There are many models for solder, can be divided into hard solder and slicken solder according to fusing point difference；It can be divided according to constituent difference
For tin-lead solder, silver solder, spelter solder etc..In Vacuum Package field, currently used solder is to be mostly with lead base glass
Main material.Lead contamination can be generated in production and use process by solder made of main material of lead base glass, and is welded
Material can impact product quality itself, and there are potential risks, keep the whole lead content of final products higher.
Summary of the invention
Goal of the invention: present invention aims in view of the deficiencies of the prior art, provide what a kind of suitable vacuum seal used
Lead-free solder, while meeting vacuum cup to unleaded requirement；
Another object of the present invention is to provide the preparation methods of the lead-free solder.
Technical solution: unleaded vacuum seal solder of the present invention includes following component:
60~80 parts of bismuth oxide；
6~16 parts of boron oxide；
Silica 1~2 part；
4~5 parts of aluminium oxide；
Each component is in parts by weight.
Further preferably technical solution is the present invention, and the unleaded vacuum seal solder includes following component:
70 parts of bismuth oxide；
10 parts of boron oxide；
2 parts of silica；
4 parts of aluminium oxide；
Each component is in parts by weight.
Preferably, the bismuth oxide is α type bismuth oxide powder.
Preferably, the aluminium oxide is γ type aluminium oxide.
The preparation method of unleaded vacuum seal solder of the present invention, includes the following steps:
(1) each component material ratio by weight is prepared, is put into batch mixer and carries out mixing, after 15~25 minutes take out to
With；
(2) mixing completed will be mixed to be put into crucible, under the conditions of 950~1150 DEG C, mixing is melted 20~25 points
Clock；
(3) melt is poured out out of crucible, and rolls into sheet, and according to sealing-in needs, sheet solder is broken into suitable shape.
Preferably, mixing is melted using platinum crucible in step (2).
The utility model has the advantages that solder is made using completely new formula in (1) present invention, lead or lead oxygen are produced and prevented in
The use of compound, and in each component, bismuth oxide is not soluble in water and alkali, and odorlessness is stable in the air, silica, no
It is dissolved in water, insoluble in acid, aluminium oxide is not soluble in water and non-polar organic solvent, has strong adsorption capacity and catalytic activity, materials ring
It protects, it is ensured that the production and use of solder will not generate toxicity, meet the environmental requirement of vacuum cup sealing-in；
(2) fusing point of bismuth oxide is 825 DEG C in the present invention, and boron oxide can be used as with the oxide complete miscibility of bismuth
The fluxing agent of solder, silica is as flux, and aluminium oxide has strong adsorption capacity and catalytic activity, as adsorbent and catalysis
Agent can make solder meet the requirement of sealing-in at a lower temperature, and sealing-in surface is smooth, and firmness is reliable.
Specific embodiment
Technical solution of the present invention is described in detail below, but protection scope of the present invention is not limited to the implementation
Example.
Embodiment 1: a kind of unleaded vacuum seal solder, including following component:
60 parts of α type bismuth oxide；
6 parts of boron oxide；
Silica 1 part；
4 parts of γ type aluminium oxide；
Each component is in parts by weight.
The preparation method of the unleaded vacuum seal solder, includes the following steps:
(1) each component material ratio by weight is prepared, is put into batch mixer and carries out mixing, taken out after 15 minutes stand-by；
(2) mixing completed will be mixed to be put into platinum crucible, under the conditions of 950 DEG C, mixing is melted 20 minutes；
(3) melt is poured out out of crucible, and rolls into sheet, and according to sealing-in needs, sheet solder is broken into suitable shape.
Embodiment 2: a kind of unleaded vacuum seal solder, including following component:
80 parts of α type bismuth oxide；
16 parts of boron oxide；
2 parts of silica；
5 parts of γ type aluminium oxide；
Each component is in parts by weight.
The preparation method of the unleaded vacuum seal solder, includes the following steps:
(1) each component material ratio by weight is prepared, is put into batch mixer and carries out mixing, taken out after 25 minutes stand-by；
(2) mixing completed will be mixed to be put into platinum crucible, under the conditions of 1150 DEG C, mixing is melted 25 minutes；
(3) melt is poured out out of crucible, and rolls into sheet, and according to sealing-in needs, sheet solder is broken into suitable shape.
Embodiment 3: a kind of unleaded vacuum seal solder, including following component:
70 parts of α type bismuth oxide；
10 parts of boron oxide；
2 parts of silica；
4 parts of γ type aluminium oxide；
Each component is in parts by weight.
The preparation method of the unleaded vacuum seal solder, includes the following steps:
(1) each component material ratio by weight is prepared, is put into batch mixer and carries out mixing, taken out after twenty minutes stand-by；
(2) mixing completed will be mixed to be put into platinum crucible, at 1100 DEG C, mixing is melted 25 minutes；
(3) melt is poured out out of crucible, and rolls into sheet, and according to sealing-in needs, sheet solder is broken into suitable shape.
The experimental data comparison such as table 1 of 3 groups of comparative examples made from Examples 1 to 3 and lead base glass:
Solder made from each embodiment after tested, sealing-in when lead-free solder can reach 505 degree of ordinary solder at 610 degree or so
Effect.
As described above, must not be explained although the present invention has been indicated and described referring to specific preferred embodiment
For the limitation to invention itself.It without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
Various changes can be made in the form and details for it.
Claims (6)
1. a kind of unleaded vacuum seal solder, which is characterized in that including following component:
60~80 parts of bismuth oxide；
6~16 parts of boron oxide；
Silica 1~2 part；
4~5 parts of aluminium oxide；
Each component is in parts by weight.
2. unleaded vacuum seal solder according to claim 1, which is characterized in that including following component:
70 parts of bismuth oxide；
10 parts of boron oxide；
2 parts of silica；
4 parts of aluminium oxide；
Each component is in parts by weight.
3. unleaded vacuum seal solder according to claim 1, which is characterized in that the bismuth oxide is three oxygen of α type
Change two bismuth meals end.
4. unleaded vacuum seal solder according to claim 1, which is characterized in that the aluminium oxide is γ type aluminium oxide.
5. the preparation method of unleaded vacuum seal solder described in a kind of Claims 1 to 4 any one, which is characterized in that including
Following steps:
(1) each component material ratio by weight is prepared, is put into batch mixer and carries out mixing, taken out after 15~25 minutes stand-by；
(2) mixing completed will be mixed to be put into crucible, under the conditions of 950~1150 DEG C, mixing is melted 20~25 minutes；
(3) melt is poured out out of crucible, and rolls into sheet, and according to sealing-in needs, sheet solder is broken into suitable shape.
6. preparation method according to claim 5, which is characterized in that melt mixing using platinum crucible in step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184336.2A CN109128580A (en) | 2018-10-11 | 2018-10-11 | A kind of unleaded vacuum seal solder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184336.2A CN109128580A (en) | 2018-10-11 | 2018-10-11 | A kind of unleaded vacuum seal solder and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109128580A true CN109128580A (en) | 2019-01-04 |
Family
ID=64811111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811184336.2A Withdrawn CN109128580A (en) | 2018-10-11 | 2018-10-11 | A kind of unleaded vacuum seal solder and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN109128580A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112170997A (en) * | 2020-09-25 | 2021-01-05 | 西华大学 | Glass brazing filler metal for brazing MCT microwave dielectric ceramic and metal and brazing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4310357A (en) * | 1980-05-14 | 1982-01-12 | Nippon Electric Glass Company, Limited | Low temperature sealing glass |
| CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
| CN101526645A (en) * | 2009-03-31 | 2009-09-09 | 武汉华工正源光子技术有限公司 | Process technology for fixing coupled fiber by using low temperature glass solders |
| CN105502926A (en) * | 2015-12-11 | 2016-04-20 | 贵州佰博新材料科技有限公司 | Semiconductor surface passivation lead-free glass powder and preparing method thereof |
-
2018
- 2018-10-11 CN CN201811184336.2A patent/CN109128580A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4310357A (en) * | 1980-05-14 | 1982-01-12 | Nippon Electric Glass Company, Limited | Low temperature sealing glass |
| CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
| CN101526645A (en) * | 2009-03-31 | 2009-09-09 | 武汉华工正源光子技术有限公司 | Process technology for fixing coupled fiber by using low temperature glass solders |
| CN105502926A (en) * | 2015-12-11 | 2016-04-20 | 贵州佰博新材料科技有限公司 | Semiconductor surface passivation lead-free glass powder and preparing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112170997A (en) * | 2020-09-25 | 2021-01-05 | 西华大学 | Glass brazing filler metal for brazing MCT microwave dielectric ceramic and metal and brazing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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Application publication date: 20190104 |