CN109117708A - 指纹辨识装置以及使用其的移动装置 - Google Patents
指纹辨识装置以及使用其的移动装置 Download PDFInfo
- Publication number
- CN109117708A CN109117708A CN201810649335.4A CN201810649335A CN109117708A CN 109117708 A CN109117708 A CN 109117708A CN 201810649335 A CN201810649335 A CN 201810649335A CN 109117708 A CN109117708 A CN 109117708A
- Authority
- CN
- China
- Prior art keywords
- specific wavelength
- integrated circuit
- emitting diode
- image sensing
- sensing integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000005022 packaging material Substances 0.000 claims abstract 9
- 238000004806 packaging method and process Methods 0.000 claims abstract 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims 4
- 239000000463 material Substances 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 10
- 239000002362 mulch Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
- G06F1/1671—Special purpose buttons or auxiliary keyboards, e.g. retractable mini keypads, keypads or buttons that remain accessible at closed laptop
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762523482P | 2017-06-22 | 2017-06-22 | |
US62/523,482 | 2017-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109117708A true CN109117708A (zh) | 2019-01-01 |
Family
ID=64693307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810649335.4A Pending CN109117708A (zh) | 2017-06-22 | 2018-06-22 | 指纹辨识装置以及使用其的移动装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20180373916A1 (zh) |
CN (1) | CN109117708A (zh) |
TW (1) | TW201909035A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109902626B (zh) * | 2019-02-27 | 2024-01-05 | 维沃移动通信有限公司 | 终端设备 |
TWI710942B (zh) * | 2019-09-16 | 2020-11-21 | 宏碁股份有限公司 | 指紋辨識裝置及其驅動方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102317889A (zh) * | 2009-01-15 | 2012-01-11 | 夏普株式会社 | 光定位装置以及搭载有该装置的电子设备 |
CN103187507A (zh) * | 2011-12-30 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN103810483A (zh) * | 2012-11-02 | 2014-05-21 | 金佶科技股份有限公司 | 指纹取像系统 |
CN104425679A (zh) * | 2013-09-04 | 2015-03-18 | 展晶科技(深圳)有限公司 | 发光二极管 |
TW201626516A (zh) * | 2015-01-06 | 2016-07-16 | 曦威科技股份有限公司 | 指紋辨識封裝結構與指紋辨識封裝方法 |
CN106127102A (zh) * | 2015-05-04 | 2016-11-16 | 曦威科技股份有限公司 | 指纹检测装置、使用其的移动装置以及其制造方法 |
CN106650561A (zh) * | 2015-10-30 | 2017-05-10 | 培新科技股份有限公司 | 指纹影像撷取装置及其指纹影像撷取模块 |
-
2018
- 2018-06-13 TW TW107120309A patent/TW201909035A/zh unknown
- 2018-06-21 US US16/014,530 patent/US20180373916A1/en not_active Abandoned
- 2018-06-22 CN CN201810649335.4A patent/CN109117708A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102317889A (zh) * | 2009-01-15 | 2012-01-11 | 夏普株式会社 | 光定位装置以及搭载有该装置的电子设备 |
CN103187507A (zh) * | 2011-12-30 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN103810483A (zh) * | 2012-11-02 | 2014-05-21 | 金佶科技股份有限公司 | 指纹取像系统 |
CN104425679A (zh) * | 2013-09-04 | 2015-03-18 | 展晶科技(深圳)有限公司 | 发光二极管 |
TW201626516A (zh) * | 2015-01-06 | 2016-07-16 | 曦威科技股份有限公司 | 指紋辨識封裝結構與指紋辨識封裝方法 |
CN106127102A (zh) * | 2015-05-04 | 2016-11-16 | 曦威科技股份有限公司 | 指纹检测装置、使用其的移动装置以及其制造方法 |
CN106650561A (zh) * | 2015-10-30 | 2017-05-10 | 培新科技股份有限公司 | 指纹影像撷取装置及其指纹影像撷取模块 |
Also Published As
Publication number | Publication date |
---|---|
TW201909035A (zh) | 2019-03-01 |
US20180373916A1 (en) | 2018-12-27 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191127 Address after: Ruizhida Corporate Service Center, Room 23, 1st floor, Eden Square, Eden Island, Maai Island, Seychelles Applicant after: Seychelles Merchant Water Wood Technology Co.,Ltd. Address before: Hsinchu County, Taiwan, China Applicant before: EOSMEM Corp. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200804 Address after: 2nd floor, building 1, 1998 Licheng middle Avenue, Longqiao street, Putian City, Fujian Province Applicant after: Putian Jiemu Technology Co.,Ltd. Address before: Ruizhida corporate service center, room 23, 1 / F, Eden Plaza, seychellmae Applicant before: Seychelles Merchant Water Wood Technology Co.,Ltd. |
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CB02 | Change of applicant information |
Address after: 351100 705-706, building a, Jiulong community, No. 999, lihuadong Avenue, Xialin street, Chengxiang District, Putian City, Fujian Province Applicant after: Fujian Jiemu Technology Co.,Ltd. Address before: 351100 floor 2, building 1, No. 1998, lichengzhong Avenue, Longqiao street, Putian City, Fujian Province Applicant before: Putian Jiemu Technology Co.,Ltd. |
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CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20231102 Address after: Room 308 and Room 309, No. 268 Xiangke Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201210 Applicant after: Shanghai Jieming Technology Co.,Ltd. Address before: 351100 705-706, building a, Jiulong community, No. 999, lihuadong Avenue, Xialin street, Chengxiang District, Putian City, Fujian Province Applicant before: Fujian Jiemu Technology Co.,Ltd. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20241113 Address after: No. 942, Tonglong 2nd Road, Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen City, Fujian Province 361115, China 423-49 Applicant after: Xingchen Technology Co.,Ltd. Country or region after: China Address before: Room 308 and Room 309, No. 268 Xiangke Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201210 Applicant before: Shanghai Jieming Technology Co.,Ltd. Country or region before: China |
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TA01 | Transfer of patent application right |