CN109099737A - A kind of temperature-uniforming plate - Google Patents
A kind of temperature-uniforming plate Download PDFInfo
- Publication number
- CN109099737A CN109099737A CN201811130193.7A CN201811130193A CN109099737A CN 109099737 A CN109099737 A CN 109099737A CN 201811130193 A CN201811130193 A CN 201811130193A CN 109099737 A CN109099737 A CN 109099737A
- Authority
- CN
- China
- Prior art keywords
- channel
- passage
- temperature
- uniforming plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of temperature-uniforming plates, belong to cooling field, including substrate, and the channel circulated for refrigerant is equipped in substrate, and the side of substrate is equipped with several radiating fins；The channel include first passage, second channel and several be used to be connected to the communicating passage of first passage and second channel.Compared with prior art, the present invention provides a kind of temperature-uniforming plate, multiple communicating passages are equipped between first passage and second channel, improve mobility of the refrigerant in channel, and multiple radiating grooves are set in communicating passage, increasing heat radiation area improves radiating efficiency, samming can be carried out to hot spot in time, and be radiated by radiating fin.
Description
Technical field
The present invention relates to cooling field, especially a kind of temperature-uniforming plate.
Background technique
Traditional temperature-uniforming plate mainly has following two categories: 1) being laid with heat pipe inside aluminium sheet, by the thermal diffusion of heat pipe, reduce heat
Point temperature；2) directly it is used as temperature-uniforming plate with flat-plate heat pipe (also known as vapor chamber, VC).The heat pipe used in these two types of temperature-uniforming plates and
VC, generally using copper as shell, water has metal powder sintered or silk screen capillary structure as working medium, inside.However this two
Class temperature-uniforming plate is all limited to the heat transfer distance of heat pipe and VC generally no more than 200mm, causes the size of this kind of temperature-uniforming plate big
It is small to be limited by.In addition liquid fluidity is poor in existing temperature-uniforming plate, and heat dissipation area is small, therefore cannot radiate in time.
Summary of the invention
In view of the above-mentioned problems, liquid fluidity is strong the present invention provides a kind of temperature-uniforming plate, increasing heat radiation area is improved and is dissipated
The thermal efficiency can radiate in time.
The technical solution adopted by the present invention are as follows:
A kind of temperature-uniforming plate, including substrate, substrate is interior to be equipped with the channel circulated for refrigerant, and the side of substrate is equipped with several heat dissipations
Fin；The channel include first passage, second channel and several be used to be connected to being connected to for first passage and second channel
Channel.
Preferably, the inner wall of the communicating passage is equipped with several radiating grooves.
Preferably, the first passage and second channel keeping parallelism, communicating passage are arranged in parallel in first passage and the
Between two channels.
Preferably, the both ends of the first passage and the second channel all keep closing.
Preferably, the substrate is made of aluminium.
Compared with prior art, the beneficial effects of the present invention are: the present invention provides a kind of temperature-uniforming plate, in first passage and
It is equipped with multiple communicating passages between second channel, improves mobility of the refrigerant in channel, is arranged in communicating passage multiple
Radiating groove, increasing heat radiation area improve radiating efficiency, can carry out samming to hot spot in time, and radiate by radiating fin.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of temperature-uniforming plate provided by the invention；
Fig. 2 is a kind of cross-sectional view A-A of temperature-uniforming plate provided by the invention；
Fig. 3 is a kind of cross-sectional view B-B of temperature-uniforming plate provided by the invention.
Specific embodiment
Preferred embodiment provided by the invention is illustrated with reference to the accompanying drawings.
Fig. 1 to Fig. 3 is a kind of preferred embodiment of temperature-uniforming plate provided by the invention.As shown in Figure 1 to Figure 3, the samming
Plate includes substrate 10, and the channel 20 circulated for refrigerant is equipped in substrate 10, and the side of substrate 10 is equipped with several radiating fins
30；The channel 20 include first passage 21, second channel 22 and several for being connected to first passage 21 and second channel
22 communicating passage 23 improves refrigerant by being equipped with multiple communicating passages 23 between first passage 21 and second channel 22
Mobility in channel improves radiating efficiency, can carry out samming to hot spot in time, and radiate by radiating fin 30.
The inner wall of the communicating passage 23 is equipped with several radiating grooves 231, and increasing heat radiation area improves radiating efficiency,
It can radiate in time.
First passage 21 and 22 keeping parallelism of second channel, communicating passage 23 are arranged in parallel in as a preferred method,
Between first passage 21 and second channel 22；The both ends of the first passage 21 and the second channel 22 all keep closing.
The substrate 10 is made of aluminium, mitigates weight, while being conducive to heat transfer, the channel 20 in substrate 10 is making
There can be the opening for refrigerant to be perfused in the process, and after completing, by closure of openings, to prevent refrigerant leakage.In addition,
Refrigerant is generally made of R134A, ammonia and acetone etc..
Temperature-uniforming plate provided by the invention, which is suitable for first passage and second channel, has the use occasion of difference in height, is in position
The refrigerant suction heat vaporization in lower channel is set, passes through 23 in-position of communicating passage compared in high channel, the refrigeration of vaporization
Heat liquefaction is released in agent in flow process, then is relied in gravity reflux to the lower channel in position, liquid in channel entire in this way
Circuit relies on gravity back work；The entire effective working size of temperature-uniforming plate can achieve 1000mm, much larger than traditional temperature-uniforming plate
Size range.When in use, the thermal device of temperature-uniforming plate other side arrangement watt level unevenness, needs by temperature-uniforming plate that hot spot is equal
Temperature, then radiated by the radiating fin 30 of the other side.
In conclusion technical solution of the present invention can sufficiently effective realization foregoing invention purpose, and knot of the invention
Structure and the principle of work and power have all adequately been verified in embodiment, can reach expected effect and purpose, without departing substantially from this
Under the premise of the principle and essence of invention, various changes or modifications can be made to the embodiment of invention.Therefore, the present invention includes
All are previously mentioned all replacement contents in range in patent claim, any to be made in scope of the present invention patent
Equivalence changes, all category this case application the scope of the patents within.
Claims (5)
1. a kind of temperature-uniforming plate, which is characterized in that including substrate, the channel circulated for refrigerant, the side of substrate are equipped in substrate
Equipped with several wing plates that radiate；The channel include first passage, second channel and several for be connected to first passage and
The communicating passage of second channel.
2. temperature-uniforming plate according to claim 1, it is characterised in that: the inner wall of the communicating passage is equipped with several heat dissipations
Slot.
3. temperature-uniforming plate according to claim 1, it is characterised in that: the first passage and second channel keeping parallelism, even
Circulation passage is arranged in parallel between first passage and second channel.
4. temperature-uniforming plate according to claim 1, it is characterised in that: the both ends of the first passage and the second channel
All keep closing.
5. temperature-uniforming plate according to claim 1, it is characterised in that: the substrate is made of aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811130193.7A CN109099737A (en) | 2018-09-27 | 2018-09-27 | A kind of temperature-uniforming plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811130193.7A CN109099737A (en) | 2018-09-27 | 2018-09-27 | A kind of temperature-uniforming plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109099737A true CN109099737A (en) | 2018-12-28 |
Family
ID=64867179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811130193.7A Pending CN109099737A (en) | 2018-09-27 | 2018-09-27 | A kind of temperature-uniforming plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109099737A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050063159A1 (en) * | 2003-09-23 | 2005-03-24 | Richard Ma | Heat-dissipating fin module |
| CN105101751A (en) * | 2015-07-03 | 2015-11-25 | 浙江嘉熙光电设备制造有限公司 | Thermal superconductive gilled radiator and manufacturing method therefor |
| CN207151055U (en) * | 2017-08-02 | 2018-03-27 | 深圳市迈安热控科技有限公司 | Porous heat pipe and heat pipe for conductive heat dissipation device |
| CN107846813A (en) * | 2016-09-20 | 2018-03-27 | 宁波三星智能电气有限公司 | A kind of heat abstractor of charging pile |
| CN209043084U (en) * | 2018-09-27 | 2019-06-28 | 东莞市迈泰热传科技有限公司 | A kind of temperature-uniforming plate |
-
2018
- 2018-09-27 CN CN201811130193.7A patent/CN109099737A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050063159A1 (en) * | 2003-09-23 | 2005-03-24 | Richard Ma | Heat-dissipating fin module |
| CN105101751A (en) * | 2015-07-03 | 2015-11-25 | 浙江嘉熙光电设备制造有限公司 | Thermal superconductive gilled radiator and manufacturing method therefor |
| CN107846813A (en) * | 2016-09-20 | 2018-03-27 | 宁波三星智能电气有限公司 | A kind of heat abstractor of charging pile |
| CN207151055U (en) * | 2017-08-02 | 2018-03-27 | 深圳市迈安热控科技有限公司 | Porous heat pipe and heat pipe for conductive heat dissipation device |
| CN209043084U (en) * | 2018-09-27 | 2019-06-28 | 东莞市迈泰热传科技有限公司 | A kind of temperature-uniforming plate |
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