CN108463094B - A kind of flat-plate minitype loop circuit heat pipe that compensated chamber is set - Google Patents

A kind of flat-plate minitype loop circuit heat pipe that compensated chamber is set Download PDF

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Publication number
CN108463094B
CN108463094B CN201810172282.1A CN201810172282A CN108463094B CN 108463094 B CN108463094 B CN 108463094B CN 201810172282 A CN201810172282 A CN 201810172282A CN 108463094 B CN108463094 B CN 108463094B
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loop circuit
heat pipe
mainboard
porous media
thin slice
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CN108463094A (en
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郭春生
年显勃
曲芳仪
陈子昂
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Shandong University
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Shandong University
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a kind of flat-plate minitype loop circuit heat pipes, including mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, the mainboard includes vaporization chamber, condensation chamber, jet chimney and fluid pipeline are connected between vaporization chamber and condensation chamber, it is characterized in that, the compensating liquid room is connected to vaporization chamber and fluid pipeline joint the system also includes compensating liquid room.Effect that there are mainly two types of for fluid present invention compensated chamber: 1. by the aperture of compensating liquid room, exhaust and the big crucial step of fluid injection two is may be implemented in we.2. the working solution for being stored in compensating liquid room can effectively be fed evaporates rapidly working solution because of overheat in capillary wick, preventing liquid to be evaporated two completely causes capillary wick failure that whole device is made to paralyse.

Description

A kind of flat-plate minitype loop circuit heat pipe that compensated chamber is set
Technical field
The invention belongs to field of heat exchangers more particularly to flat-plate minitype loop circuit heat pipe systems.
Background technique
With the rapid development of microelectronics and information technology, the Highgrade integration and miniaturization of device and circuit become important Development trend, but integrated level improve brought by chip unit area calorific intensity it is soaring and temperature raising will seriously threaten dress Set the reliability with equipment.Existing research discovery microelectronic chip has the characteristics that surface heat is unevenly distributed, certain parts Heat flow rate per unit area even up to 1000w/cm2 at hot spot, is considered as the key reason for causing chip failure or even damage. For this purpose, exploitation, which cool down directly to chip and improves the micro cooler of its whole uniform temperature, has become the research of thermal control in recent years pass The hot spot of note.
Miniature loop circuit heat pipe is exactly a kind of important micro cooler developed in recent years in order to adapt to this needs.Make For gas-liquid two-phase phase-change heat-exchange device, micro heat pipe has compact structure and can carry out larger heat in lesser temperature gradient The characteristics of amount transmission.
The minitype flat plate hot pipe of currently available technology, jet chimney and condenser pipe are not separated by, and are disposed entirely within together, A part point plays the role of jet chimney i.e. in heat exchange pipeline, and a part plays condenser pipe, and jet chimney and Condenser pipe is not distinguished completely, and heat exchange is had between jet chimney and condenser pipe, affects jet chimney and condenser pipe Operation.So that the heat diffusion of jet chimney to fluid pipeline, makes the liquid evaporation in fluid pipeline form bubble, to hinder The smooth operation entirely recycled, so that can not achieve liquid phase separates this initial principle.
Summary of the invention
The present invention is intended to provide a kind of efficient and small structure flat-plate minitype loop circuit heat pipe system, is improved to minicore The heat-sinking capability of piece.
To achieve the goals above, technical scheme is as follows: a kind of flat-plate minitype loop circuit heat pipe, including mainboard And upper cover plate, the upper cover plate are packaged together with mainboard, the mainboard includes vaporization chamber, condensation chamber, vaporization chamber and condensation chamber Between connect jet chimney and fluid pipeline, the system also includes compensating liquid room, the compensating liquid room and vaporization chamber and The connection of fluid pipeline joint.
A kind of flat-plate minitype loop circuit heat pipe, including mainboard and upper cover plate, the upper cover plate are packaged together with mainboard, institute Stating mainboard includes vaporization chamber, condensation chamber, and jet chimney and fluid pipeline, the jet chimney are connected between vaporization chamber and condensation chamber It is separated between fluid pipeline by heat-insulated through-hole.
Preferably, the heat-insulated through-hole is the channel slot being arranged on mainboard.
Preferably, the channel slot runs through entire mainboard in a thickness direction.
Preferably, channel slot corresponding with mainboard upper channel slot is arranged on the upper cover plate.
Preferably, heat-insulating material is set in heat-insulated through-hole,
Preferably, porous media thin slice is arranged in the vaporization chamber, thin slice is installed to Micro-ring using interference fit At the vaporization chamber of road heat pipe mainboard, thin slice upper surface is no more than mainboard upper surface.
Preferably, porous media thin slice nickel powder is base, it is sintered to be formed by punching press.
Preferably, the size of Ni-based porous media capillary wick is length 5.15mm, width 3.8mm, with a thickness of 150 μ M, the length is along the direction perpendicular to jet chimney and fluid pipeline.
Preferably, cavity is arranged on upper cover plate, the position opposite with porous media thin slice, the sky is arranged in the cavity Chamber is connected to jet chimney.
Preferably, the vaporization chamber is located at the side of the jet chimney of heat-insulated through-hole.
Preferably, the porosity of the porous media thin slice is K, porous media with a thickness of H1, the cavity With a thickness of H2, then meet following condition: H2=a*Ln (K*H1)-b, wherein 200 < a < 210,760 <b < 770；
140μm<H2<240μm；80μm<K*H1<130μm.
Preferably, 60% < K < 80%, 100 μm < H1 < 200 μm.
Preferably, H1=c*H2,0.7 < c < 0.8.
Preferably, further including compensating liquid room, the compensating liquid room is connected to vaporization chamber and fluid pipeline joint.
Compared with prior art, the present invention has the advantage that:
1) effect that there are mainly two types of for fluid present invention compensated chamber: 1. by the aperture of compensating liquid room, we can be real It is now vented and the big crucial step of fluid injection two.2. the working solution for being stored in compensating liquid room can effectively feed in capillary wick because It overheats and evaporates working solution rapidly, preventing liquid to be evaporated two completely causes capillary wick failure that whole device is made to paralyse.
2) by setting heat insulation path, gas-liquid is separated into transmission, the heat transfer phenomenon avoided in vapour-liquid flow process occurs, To influence the transmission of gas and liquid, flow resistance is reduced, avoids the obstruction in channel, increases hot-fluid transmission range.
3) by the way that cavity is arranged on upper cover plate, the steam evaporated convenient for working solution heat in capillary wick porous media is quick It overflows, avoids steam from being trapped at capillary wick, to block entire porous media structure, capillary wick is caused to be evaporated, make entire micro- Type ring road hot-pipe system paralyses.The quick discharge of steam can accelerate the circulation inside whole device simultaneously, improve heat transfer Radiating efficiency.
4) loop heat pipe structure is minimized, microchip surface can be directly attached to, heat is directly taken away, radiated It is high-efficient.
5) capillary wick uses Ni-based porous media structure, is capable of providing biggish capillary force, is able to maintain that whole device Fast turn-around, and a large amount of heat is taken away using the latent heat of working solution.
6) present invention obtains an optimal plate miniature loop circuit heat pipe optimum results, and lead to by test of many times Overtesting is verified, to demonstrate the accuracy of result.
Detailed description of the invention
Fig. 1 is the schematic diagram of the plate miniature loop circuit heat pipe mainboard of the present invention；
Fig. 2 is the plate miniature loop circuit heat pipe cover plate schematic diagram of the present invention；
Fig. 3 is the plate miniature loop circuit heat pipe vaporization chamber Section A-A schematic diagram of the present invention；
Fig. 4 is the plate miniature loop heat pipe air liquid pipe road C-C schematic cross-section of the present invention；
Fig. 5 is the plate miniature loop circuit heat pipe section B-B schematic diagram of the present invention；
Fig. 6 is the plate miniature loop circuit heat pipe porous media capillary wick schematic diagram of the present invention；
Fig. 7 is the plate miniature loop circuit heat pipe schematic three dimensional views of the present invention.
Appended drawing reference is as follows:
Appended drawing reference is as follows: 1 mainboard, 2 vaporization chambers, 3 compensating liquid rooms, 4 fluid injection exhaust holes, 5 heat-insulated through-holes, 6 liquid Pipeline, 7 jet chimneys, 8 condensation chambers, 9 upper cover plate shallow cavity positions, 10 upper cover plates, 11 sheet type porous media capillary wicks
Specific embodiment
Specific embodiments of the present invention will be described in detail with reference to the accompanying drawing.
A kind of flat-plate minitype loop circuit heat pipe, including mainboard 1 and upper cover plate 10, the upper cover plate 10 are encapsulated in mainboard 1 Together, the mainboard 1 includes vaporization chamber 2, condensation chamber 8, and jet chimney 7 and fluid pipeline are connected between vaporization chamber 2 and condensation chamber 8 6, it is separated between the jet chimney 7 and fluid pipeline 6 by heat-insulated through-hole 5.
Jet chimney 7 and fluid pipeline 6 are provided entirely on one piece of mainboard 1, so that structure by loop circuit heat pipe of the invention Miniaturization, can be directly attached to microchip surface, heat is directly taken away, and radiating efficiency is high, can be widely applied to electricity The heat dissipation of the micro-elements such as sub- chip.
Gas-liquid is separated transmission, heat effectively can be gathered in evaporator by the present invention by the way that heat-insulated through-hole 5 is arranged Place, radiates so that heat efficiently to be passed through to air-liquid pipeline and is transferred to condensation chamber.It avoids heat diffusion to fluid pipeline, makes Liquid evaporation in fluid pipeline forms bubble, so that the smooth operation entirely recycled is hindered, to can not achieve liquid phase point Open this initial principle.
Preferably, the heat-insulated through-hole 5 is the channel slot being arranged on mainboard 1.
Preferably, the channel slot runs through entire mainboard 1 in a thickness direction.I.e. as shown in Figure 4.By in mainboard Entire mainboard is penetrated through on thickness, can thoroughly to separate between jet chimney 7 and fluid pipeline 6, be further increased steam Heat-proof quality between pipeline 7 and fluid pipeline 6.
Preferably, channel slot corresponding with 1 upper channel slot of mainboard is arranged on the upper cover plate 10.
Preferably, heat-insulating material is arranged in heat-insulated through-hole 5, further hinder heat in jet chimney 7 and liquid line It is transmitted between road 6.
Preferably, the width of heat-insulated through-hole 5 is 0.5mm.
Preferably, the vaporization chamber 2 is located at the side of the jet chimney of heat-insulated through-hole 5.By so set, can protect It is directly entered jet chimney after demonstrate,proving the evaporation of steam, ensure that the conveying of gas, flow resistance is reduced, avoids the obstruction in channel, Increase hot-fluid transmission range.
Preferably, porous media thin slice 11 is arranged in the vaporization chamber 2, thin slice 11 is installed to by interference fit micro- At the vaporization chamber 2 of type loop circuit heat pipe mainboard 1.
Preferably, 11 thickness of thin slice is identical as 2 conduit thickness of mainboard vaporization chamber, 11 upper surface of porous media thin slice cannot More than 1 upper surface of mainboard.By making entire so set, avoid generating gap because upper cover plate and mainboard cannot combine closely Failure of apparatus.
The porous media thin slice 11 generates capillary force by porous media capillary wick.
Vaporization chamber 2 absorbs the heat of microchip, and heated porous medium capillary wick position evaporates surface working solution, steam The condensation chamber for entering miniature loop circuit heat pipe by jet chimney carries out heat release and liquefies to be working solution, in condensation chamber in condensation chamber Working solution after the completion of heat release passes through the evaporator progress heating evaporation that fluid pipeline is recycled into miniature loop circuit heat pipe again, thus Complete a circulation.Whole device provides a part of power by the capillary force that porous media structure capillary wick generates, and reaches circulation. Capillary wick be arranged in evaporator, evaporator not only connects with jet chimney but also connects with fluid pipeline, fluid pipeline, capillary wick with And compensating liquid room passes through a small chamber and is connected, and specifically sees Fig. 1.
Connecting pipe between fluid pipeline 6 and vaporization chamber 2, as shown in Figure 1, the pipeline also has capillary force, by steam Liquid in pipeline road 7 is drawn onto vaporization chamber 2.Rely on the capillary force of porous media thin slice capillary wick by liquid in vaporization chamber 2 Liquid is drawn onto the different location of vaporization chamber 2 along porous media sheet length direction (i.e. the up and down direction of Fig. 1), then again into Enter jet chimney 7, to form a circulation.
It finds under study for action, along the up and down direction of vaporization chamber 2, the fluid distrbution in jet chimney is uneven, wherein under Part cloth fluid is more, and top is distributed less fluid, therefore causes Local Heat Transfer uneven, while causing different location jet chimney 7 Fluid distrbution unevenly and temperature distribution is non-uniform, to cause local temperature excessively high or too low, be easy to cause heat pipe Damage.For above-mentioned situation, the present invention is improved, and reaches even fluid distribution, uniformity of temperature profile.
Along the direction (i.e. the lower part of Fig. 1 to top) of porous media capillary wick capillary force, different location it is described porous The capillary force of medium capillary wick gradually increases.It is gradually increased by the capillary force along lower part to top, capillary wick, so that top Quickly liquid can be sucted, increase the quantity of the fluid on top, to enter the steam pipe on top after the evaporation of top Road 7, thus reach even fluid distribution, the purpose of uniformity of temperature profile.It is found through experiments that, above-mentioned setting achieves very well Technical effect.
Further preferably, the width gradually increased along the direction of porous media capillary wick capillary force, the capillary force of capillary wick It spends increasing.It is found through experiments that, above-mentioned setting can preferably reach the mesh of even fluid distribution, uniformity of temperature profile 's.
Preferably, porous media capillary wick can be divided into muti-piece along up and down direction, every piece of capillary force is different, In along porous media capillary wick capillary force direction (i.e. the lower part of Fig. 1 to top), the capillary force of different masses gradually increases.Into One step is preferred, and the amplitude of the capillary force enhancing of different masses is increasing.
But if the capillary force of top capillary wick is excessive, and it is too small to will cause lower flow flow, to cause new Unevenly, thus the present invention obtain through a large number of experiments optimal capillary wick capillary force relationship.
Preferably, the length (i.e. Fig. 1 up and down direction) of porous media thin slice 11 is LAlways, most upper in porous media thin slice 11 The capillary force of side is FOn, then the capillary force distribution of porous media thin slice 11 is as follows: F=FOn*(L/LAlways)a, wherein a is coefficient, 1.24<a<1.33.L is 11 the lowermost distance of positional distance porous media thin slice in porous media thin slice 11.
Above-mentioned relationship is obtained by a large amount of numerical simulation and its experiment, is tested through a large number of experiments Card.Capillary force distribution is carried out by above-mentioned relationship, fluid distrbution is enabled to reach most uniformly.
Preferably, 1.27 < a < 1.29.
Preferably, with L/LAlwaysIncrease, a is gradually increased.
Preferably, porous media thin slice 11 is sintered to be formed by punching press using nickel powder as base.
Preferably, the size of Ni-based porous media thin slice 11 is length 5.15mm, width 3.8mm, with a thickness of 150 μ M, the length is along the direction perpendicular to jet chimney 7 and fluid pipeline.
Preferably, cavity 9 is arranged on upper cover plate 10, the opposite position of porous media thin slice 11 is arranged in the cavity 9, The cavity 10 is connected to jet chimney 7.
The purpose for manufacturing this cavity is that the steam evaporated convenient for working solution heat in capillary wick porous media quickly overflows, and is kept away Non-evaporating vapour is trapped at capillary wick, to block entire porous media structure, capillary wick is caused to be evaporated, and makes entire miniature loop heat Guard system paralyses.The quick discharge of steam can accelerate the circulation inside whole device simultaneously, improve heat transfer radiating efficiency.
Preferably, capillary wick is not connected to directly with jet chimney, connected between capillary wick and jet chimney by cavity 9 It is logical.Mainly have following reason: working solution can generally be walked to enter in upper cover plate shallow cavity upwards by thermal evaporation, steam in capillary wick, It is entered back into jet chimney by shallow cavity, the resistance that this mode steam receives is smaller, is conducive to improve efficiency.It is directly connected to not The efficiency of whole device can be improved, and the flowing of capillary wick internal liquid can be interfered.
By experiment and numerical analysis discovery, cavity is compared with vaporization chamber, cannot be excessive, excessive to lead to a large amount of steam meeting It accumulating in cavity, condensation chamber can not be transmitted in time and exchanged heat, same cavity is compared with vaporization chamber, cannot be too small, it is too small Steam is also resulted in be trapped at capillary wick, to block entire porous media structure, therefore by a large amount of numerical analysis and It is largely tested, and the optimum size relationship for coming cavity 10 and vaporization chamber is summed up.
Preferably, the porosity of the porous media thin slice 11 be K, porous media thin slice 11 with a thickness of H1, institute The depth for stating cavity 10 is H2, then meets following condition: H2=a*Ln (K*H1)-b, wherein 200 < a < 210,760 <b < 770；
140μm<H2<240μm；80μm<K*H1<130μm.
Preferably, 60% < K < 80%, 100 μm < H1 < 200 μm.
Preferably, H1=c*H2,0.7 < c < 0.8.
Preferably, the loop circuit heat pipe further includes compensating liquid room 3, the compensating liquid room 3 and vaporization chamber 2 and liquid The connection of 6 joint of pipeline.Effect that there are mainly two types of for compensating liquid room: 1. by the aperture of compensating liquid room, we can be real It is now vented and the big crucial step of fluid injection two.2. the working solution for being stored in compensating liquid room can effectively feed in capillary wick because It overheats and evaporates working solution rapidly, preventing liquid to be evaporated two completely causes capillary wick failure that whole device is made to paralyse.
Size as the Ni-based porous media capillary wick of sheet type preferably as shown in Figure 5 is length 5.15mm, and width is 3.8mm, with a thickness of 150 μm.Capillary force is larger when wherein Ni-based porosity of porous medium is 60%~80%, device running efficiency It is higher.
Preferably, 7 width of jet chimney is 400-500 μm, as preferably 450 μm, preferably there are 10.It is preferred that Jet chimney 7 from each other between be divided into 200 μm, length 43mm, depth is 150 μm.By processing rectangular channel on mainboard Road, and upper cover plate is engaged to form pipeline with mainboard.
Preferably, 7 width of jet chimney is 2-5 times, preferably 3 times of fluid pipeline width.By increasing steam pipe The quantity in road is more, it is therefore intended that the pressure drop for reducing steam increases the transmission range of steam, improves the operational efficiency of device.
Preferably, 6 width of fluid pipeline is 150 μm, length 43mm, depth is 150 μm, designs four liquid altogether Pipeline is divided into 75 μm between intermediate.
By fluid pipeline design it is such it is narrow be because are as follows: 1. slypes can provide very big capillary force, by liquid from cold Evaporation ends are sucked back in solidifying room, become the auxiliary power of whole device, and guiding role is generated to the flowing of liquid.2. narrow is logical Road can bear bigger pressure.
Preferably, it is 8.9mm, the shallow cavity that depth is 150 μm that the size of condensation chamber 8, which is length and width,.The mesh so selected It is increasing heat radiation area, improves radiating efficiency.Many kinds also can be set in the condensation chamber type of cooling, such as air-cooled or water is arranged Cool equipment, we realize the cooling of condensation chamber used here as electronic semi-conductor's cooling element.
For flat-plate minitype loop circuit heat pipe, guarantees that vaporization chamber porous media capillary wick is not evaporated, do not generated Vapor lock, fluid pipeline by bubble obstruction be the key that maintain whole device trouble-free operation.It is understood that containing in air There are many non-condensable gas, and when working solution evaporates in flat-plate minitype loop circuit heat pipe, non-condensable gas can produce in conjunction with steam Raw a large amount of bubble, and then block duct and the block liquid pipeline of porous media capillary wick, so that whole device starting is not Or device is paralysed after starting.So the non-condensable gas of discharge whole device is the premise of whole device operation.
Preferably, fluid injection and gas vent 4 is arranged in compensating liquid room, it is respectively used to fluid injection and exhaust, fluid injection and exhaust Hole 4 can connect with extraneous fine copper pipe, and control valve is housed on copper pipe, control Liquid Flow to complete exhaust fluid injection.Fluid injection is complete At it is rear we aperture sealed, to form the flat-plate minitype loop circuit heat pipe system of a set of sealing.Internal system is followed in taking Ring.
Of course, it is possible to selection, in order to increase the accuracy of measurement temperature, temperature can be arranged in we at exhaust hole Air pressure monitoring device is spent, comes the temperature and operating condition of monitoring device, and in the air pressure and temperature calculating apparatus for passing through gas The volume of gas, and then the exhaust fluid injection of control device.
For plate miniature loop circuit heat pipe, heat is concentrated at vaporization chamber absorbing, passes through two phase transformations of working solution The latent heat for changing i.e. liquid takes away heat.So guaranteeing that heat concentration acts on the pass that evaporation ends are also device efficient operation Key.
Preferably, working solution we there are many selection, main working solution has following several: water, ammonia, acetone, methanol, Toluene, freon.Select which kind of working solution mainly related with required operating temperature, different liquids are in different operating temperatures The advantages of performance, is different, so selection working solution also needs to determine according to actual conditions.
Although the present invention has been disclosed in the preferred embodiments as above, present invention is not limited to this.Any art technology Personnel can make various changes or modifications, therefore protection scope of the present invention is answered without departing from the spirit and scope of the present invention When being defined by the scope defined by the claims..

Claims (5)

1. a kind of flat-plate minitype loop circuit heat pipe, including mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, described Mainboard includes vaporization chamber, condensation chamber, jet chimney and fluid pipeline is connected between vaporization chamber and condensation chamber, which is characterized in that institute Stating loop circuit heat pipe further includes compensating liquid room, and the compensating liquid room is connected to vaporization chamber and fluid pipeline joint；The steaming Indoor setting porous media thin slice is sent out, thin slice is installed at the vaporization chamber of miniature loop circuit heat pipe mainboard using interference fit, it is more Hole media sheet upper surface is no more than mainboard upper surface；
Cavity is set on upper cover plate, and the position opposite with porous media thin slice, the cavity and steam pipe is arranged in the cavity Road connection, the porosity of the porous media thin slice are K, porous media thin slice with a thickness of H1, the cavity with a thickness of H2 then meets following condition: H2=a*Ln (K*H1)-b, wherein 200 < a < 210,760 <b < 770；
140μm<H2<240μm；80μm<K*H1<130μm.
2. loop circuit heat pipe as described in claim 1, which is characterized in that porous media thin slice is arranged in the vaporization chamber.
3. loop circuit heat pipe as claimed in claim 2, which is characterized in that porous media thin slice is Ni-based porous media thin slice.
4. loop circuit heat pipe as described in claim 1, which is characterized in that H1=c*H2,0.7 < c < 0.8.
5. loop circuit heat pipe as claimed in claim 2, which is characterized in that cavity is arranged on upper cover plate, the cavity is arranged more The opposite position of hole media sheet, the cavity are connected to jet chimney.
CN201810172282.1A 2017-02-15 2017-02-15 A kind of flat-plate minitype loop circuit heat pipe that compensated chamber is set Active CN108463094B (en)

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CN110106943A (en) * 2019-05-13 2019-08-09 山东大学 A kind of air fresh water device for making and its loop circuit heat pipe
CN111189346B (en) * 2020-01-10 2021-06-08 中国矿业大学 Porous copper-wood fiber/polystyrene double-layer composite capillary core for loop heat pipe and preparation method thereof
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CN1318114C (en) * 2003-04-11 2007-05-30 中国科学院工程热物理研究所 Evaporator for separated heat tube
CN100437005C (en) * 2005-07-08 2008-11-26 富准精密工业(深圳)有限公司 Flat type heat-pipe
CN2829090Y (en) * 2005-07-30 2006-10-18 嘉善华昇电子热传科技有限公司 Slotted cylindrical heat pipe
TWI318679B (en) * 2007-05-16 2009-12-21 Ind Tech Res Inst Heat dissipation system with an plate evaporator
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