CN109087880B - Spin-drying device and spin-drying method - Google Patents
Spin-drying device and spin-drying method Download PDFInfo
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- CN109087880B CN109087880B CN201811074802.1A CN201811074802A CN109087880B CN 109087880 B CN109087880 B CN 109087880B CN 201811074802 A CN201811074802 A CN 201811074802A CN 109087880 B CN109087880 B CN 109087880B
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Abstract
The invention relates to the technical field of microelectronic manufacturing, and aims to provide a spin-drying device and a spin-drying method. The spin-drying device comprises a machine body, a rotating mechanism and a blowing mechanism. During the use, rotation mechanism drives the silicon chip that the card was established in the mounting groove and rotates between first preset position and second preset position, and rotation amplitude is little, can effectively avoid the silicon chip at the rotation in-process, because the relative roll takes place for silicon chip and mounting groove, causes the silicon chip to collapse the limit and appear dark line even, the problem of piece, is provided with simultaneously just to the main gas mouth of blowing of first open-ended, blows in dry gas in to the mounting groove, through purging and the mode that combines together that spin-dries, help improving work efficiency.
Description
Technical Field
The invention relates to the technical field of microelectronic manufacturing, in particular to a spin-drying device and a spin-drying method.
Background
In the production process of the semiconductor silicon wafer, the silicon wafer spin-drying step is a transition link in the production process and runs through the whole production flow. The silicon wafer with the film of 60 microns to 170 microns is dried by a common drying machine, the silicon wafer and the wafer basket are relatively rolled to crack and bite the wafer basket, so that the local edge of the silicon wafer is unevenly stressed, the edge is bounced, and the silicon wafer is seriously vibrated to generate dark grains. The main reason is that the silicon wafer is too thin or the radian is too large.
Disclosure of Invention
The invention aims to provide a spin-drying device to solve the problem that a thin silicon wafer is easily damaged when being dried by the spin-drying device in the prior art.
The invention also aims to provide a spin-drying method which is realized based on the spin-drying device.
The embodiment of the invention is realized by the following steps:
a spin-drying device is used for spin-drying silicon wafers and comprises a machine body; a swing mechanism rotatably connected with the body; the rotating mechanism is provided with a plurality of mounting grooves, the mounting grooves are used for being clamped with the silicon wafer, and the rotating mechanism is used for driving the silicon wafer to rotate between a first preset position and a second preset position in a reciprocating mode; the blowing mechanism is provided with a main blowing port for blowing dry gas into the clamping groove; the main air blowing port is fixedly arranged on the machine body and is always positioned between a first preset position and a second preset position; the mounting groove is provided with a first opening for the silicon wafer to enter and exit the mounting groove, and the main air blowing opening is arranged right opposite to the first opening.
In one embodiment of the invention:
the blowing mechanism also comprises a first auxiliary blowing port and a second auxiliary blowing port which are used for blowing dry gas into the mounting groove, and the first auxiliary blowing port and the second auxiliary blowing port are fixedly arranged on the machine body; the first auxiliary air blowing port, the second auxiliary air blowing port and the main air blowing port are arranged around the rotation axis of the silicon wafer.
In one embodiment of the invention:
the included angle between the first auxiliary air blowing port and the main air blowing port is 90-95 degrees;
the included angle between the second auxiliary air blowing port and the main air blowing port is 90-95 degrees.
In one embodiment of the invention:
the drying gas is nitrogen, and the temperature of the nitrogen is 60-70 ℃.
In one embodiment of the invention:
the included angle between the first preset position and the second preset position is 30-40 degrees.
In one embodiment of the invention:
the spin-drying device also comprises a first spoiler and a second spoiler which are fixedly connected with the rotating device, and the distance between the first spoiler and the second spoiler is gradually increased along the direction from the main air blowing opening to the silicon wafer;
when the silicon wafer rotates to a third preset position, the main air blowing opening is positioned on one side of the first spoiler, which is far away from the second spoiler, and the first spoiler is used for guiding dry air; when the silicon wafer rotates to a fourth preset position, the main air blowing opening is positioned on one side, away from the first spoiler, of the second spoiler, and the second spoiler is used for guiding dry air; the third preset position and the fourth preset position are located between the first preset position and the second preset position.
In one embodiment of the invention:
the included angle between the third preset position and the fourth preset position is 10-20 degrees.
In one embodiment of the invention:
the spin-drying device also comprises a silicon wafer basket for containing silicon wafers, and the mounting groove is arranged in the silicon wafer basket; the slewing mechanism is provided with an accommodating cavity for accommodating a silicon wafer basket, and the silicon wafer basket is detachably connected with the slewing mechanism.
In one embodiment of the invention:
the slewing mechanism further comprises a positioning mechanism arranged in the accommodating cavity, and the positioning mechanism is detachably connected with the silicon wafer basket and used for positioning the silicon wafer basket.
A spin-drying method is realized based on any one of the spin-drying devices, and comprises the following steps:
loading a plurality of silicon chips into a plurality of mounting grooves; the slewing mechanism drives the silicon wafer to rotate back and forth between a first preset position and a second preset position; the main air blowing port blows dry air into the accommodating cavity; and after the silicon wafer meets the process requirements, stopping working of the slewing mechanism and the main air blowing port.
The embodiment of the invention has the beneficial effects that:
the spin-drying device provided by the embodiment of the invention is used for spin-drying silicon wafers and comprises a machine body, a rotating mechanism and a blowing mechanism. The rotating mechanism is rotatably connected with the machine body and is used for driving the silicon wafer to rotate back and forth between a first preset position and a second preset position. The rotary mechanism is provided with a plurality of mounting grooves, and a silicon wafer can be clamped in each mounting groove. The mounting groove is provided with a first opening for the silicon wafer to enter and exit, and a main air blowing opening of the air blowing mechanism is arranged right opposite to the first opening and is always positioned between a first preset position and a second preset position. During the use, rotation mechanism drives the silicon chip that the card was established in the mounting groove and rotates between first preset position and second preset position, and rotation amplitude is little, can effectively avoid the silicon chip at the rotation in-process, because the relative roll takes place for silicon chip and mounting groove, causes the silicon chip to collapse the limit and appear dark line even, the problem of piece, is provided with simultaneously just to the main gas mouth of blowing of first open-ended, blows in dry gas in to the mounting groove, through purging and the mode that combines together that spin-dries, help improving work efficiency. And because a plurality of mounting grooves are arranged in the swing mechanism, a plurality of silicon wafers can be simultaneously dried, and the working efficiency is further improved.
The spin-drying method provided by the embodiment of the invention is realized based on the spin-drying device, so that the spin-drying method has the advantages of high working efficiency and capability of avoiding edge breakage and dark-line fragments of the silicon wafer in the spin-drying process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of an overall structure of a spin-drying device provided in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of a revolving rack in the spin drying device provided in embodiment 1 of the present invention;
FIG. 3 is a schematic structural view of a silicon wafer basket in the spin-drying apparatus provided in embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a silicon wafer in a spin-drying device provided in embodiment 1 of the present invention when the silicon wafer is located at a first preset position;
fig. 5 is a schematic structural diagram of a spin-drying device provided in embodiment 1 of the present invention, in which a silicon wafer is located at a second preset position.
Icon: 010-a spin-drying device; 100-a fuselage; 110-body; 111-a working chamber; 210-a main blowing port; 220-a first auxiliary air blowing port; 230-a second auxiliary air blowing port; 300-a turret; 310-a first rotating plate; 320-a second rotating plate; 321-a second opening; 330-a positioning mechanism; 331-a first positioning member; 332-a second positioning element; 333-a third positioning element; 341-first spoiler; 342-a second spoiler; 400-silicon wafer basket; 410-a first opening; 420-mounting grooves; 430-a vent; 500-silicon wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the terms "first", "second", and the like are used for distinguishing the description, and are not to be construed as indicating or implying relative importance.
Example 1
Fig. 1 is a schematic view of an overall structure of the spin drying device 010 provided in this embodiment. Referring to fig. 1, the present embodiment provides a spin-drying device 010 for spin-drying a silicon wafer 500, which includes a main body 100, a swing mechanism, and a blowing mechanism. The swing mechanism is rotatably connected to the body 100 for driving the silicon wafer 500 to rotate back and forth between a first preset position a1 and a second preset position a 2. The rotating mechanism is provided with a plurality of mounting grooves 420, and a silicon wafer 500 can be clamped in each mounting groove 420. The mounting groove 420 is provided with a first opening 410 for the silicon wafer 500 to enter and exit, and the main blowing port 210 of the blowing mechanism is disposed opposite to the first opening 410 and is always located between a first preset position a1 and a second preset position a 2. During the use, the rotation mechanism drives the silicon wafer 500 clamped in the mounting groove 420 to rotate between the first preset position a1 and the second preset position a2, the rotation amplitude is small, the problem that the edge of the silicon wafer 500 is broken or even dark stripes and fragments occur due to the fact that the silicon wafer 500 and the mounting groove 420 roll relatively in the rotation process can be effectively avoided, meanwhile, the main air blowing port 210 right facing the first opening 410 is arranged, dry air is blown into the mounting groove 420, and the work efficiency is improved by a combined mode of purging and spin-drying.
The spin-drying device 010 provided in this embodiment is further described as follows:
in the present embodiment, the body 100 includes a body 110 and a cover (not shown), and a working chamber 111 for accommodating the swing mechanism is disposed in the body 110. The working chamber 111 is a substantially cylindrical cavity, with the axis of the working chamber 111 disposed horizontally. The cover is rotatably coupled to the body 110 for closing or opening the working chamber 111.
Fig. 2 is a schematic structural view of a revolving rack 300 in the spin drying device 010 provided in this embodiment. Referring to fig. 2, in the present embodiment, the revolving mechanism includes a driving mechanism (not shown) and a revolving frame 300, and the revolving frame 300 is disposed in the working chamber 111 and can rotate around the axis of the working chamber 111. The driving mechanism is in transmission connection with the revolving frame 300, and the revolving frame 300 can rotate in a reciprocating manner within a preset angle range under the driving of the driving mechanism, so that the silicon wafer 500 arranged on the revolving frame 300 is driven to rotate. The preset angle is an included angle between the first preset position a1 and the second preset position a 2. Further, the included angle between the first preset position a1 and the second preset position a2 is 30 ° to 40 °, and in the present embodiment, the included angle between the first preset position a1 and the second preset position a2 is 40 °.
Specifically, in the present embodiment, the turret 300 includes a first turret plate 310 and a second turret plate 320 disposed in opposing spaced relation. The first rotating plate 310 is in transmission connection with a driving mechanism and is driven by the driving mechanism to rotate in a reciprocating mode, the second rotating plate 320 is fixedly connected to the first rotating plate 310 through a connecting piece, and a containing cavity for containing the silicon wafer 500 is formed between the first rotating plate 310 and the second rotating plate 320.
Fig. 3 is a schematic structural view of a silicon wafer basket 400 in the spin drying device 010 according to this embodiment. Referring to fig. 2 and 3, in the present embodiment, the second rotating plate 320 is provided with a second opening 321 for communicating the outside with the accommodating cavity, and the silicon wafer basket 400 is detachably disposed in the accommodating cavity through the second opening 321. A plurality of mounting grooves 420 are formed in the silicon wafer basket 400, each mounting groove 420 can be clamped with a silicon wafer 500, a first opening 410 is formed in the upper end of the silicon wafer basket 400, and when the silicon wafer basket is used, the silicon wafers 500 can be loaded into the mounting grooves 420 through the first openings 410 or taken out of the mounting grooves 420.
Further, the connection between the first rotating plate 310 and the second rotating plate 320 is a positioning mechanism 330. The positioning mechanism 330 includes a first positioning member 331 and a second positioning member 332. The first positioning members 331 are substantially L-shaped, two first positioning members 331 are spaced apart from each other in the left-right direction of the dehydrating device 010, and the upper end of the silicon wafer basket 400 is engaged between the two first positioning members 331. The second positioning members 332 are substantially L-shaped, the two second positioning members 332 are spaced apart from each other in the left-right direction of the spin-drying device 010, and the lower end of the silicon wafer basket 400 is engaged between the two second positioning members 332. Both ends of the two first positioning members 331 and the two second positioning members 332 are fixedly connected to the first rotating plate 310 and the second rotating plate 320, respectively, thereby forming the rotating frame 300.
Further, the positioning mechanism 330 further includes a third positioning member 333, and two ends of the third positioning member 333 are fixedly connected to the first rotating plate 310 and the second rotating plate 320, respectively. The two third positioning members 333 are oppositely spaced in the left-right direction of the spin-drying device 010, and the middle portion of the silicon wafer basket 400 is clamped between the two third positioning members 333. Through the combined action of the two first positioning parts 331, the two second positioning parts 332 and the two third positioning parts 333, the silicon wafer basket 400 is stably positioned, and in the rotating process of the revolving frame 300, the silicon wafer basket 400 can also stably rotate along with the revolving frame 300, so that the silicon wafer 500 is prevented from being damaged due to vibration caused by relative rotation of the silicon wafer basket 400 and the revolving frame 300.
In the present embodiment, the blowing mechanism includes a heating assembly (not shown), a main blowing port 210, and a blowing assembly (not shown). After the heating unit heats the dry gas, the dry gas is blown into the mounting groove 420 from the main blowing port 210 by the blowing unit. The main blowing openings 210 are fixedly arranged on the inner wall of the working cavity 111 along the axis of the working cavity 111 at intervals and are arranged right above the first opening 410. When the drying device is used, heated drying gas is blown to the silicon wafer 500 from top to bottom through the main gas blowing openings 210, so that the drying process of the silicon wafer 500 is accelerated. Specifically, the heating assembly comprises a dry-fire heating rod. Further, the drying gas is nitrogen, the temperature of the heated nitrogen is 60 ℃ to 70 ℃, and in the embodiment, the temperature of the nitrogen is 65 ℃.
Further, the spinning device 010 further includes a first spoiler 341 and a second spoiler 342 fixedly coupled to the second rotating plate 320. The first spoiler 341 and the second spoiler 342 are each substantially circular arc-shaped, and a distance between the first spoiler 341 and the second spoiler 342 gradually increases in a direction from the main air blowing port 210 to the silicon wafer 500. When the turret 300 is at the initial position a0 (shown in fig. 1), the first and second spoilers 341 and 342 are respectively located at both sides of the main blowing port 210; when the revolving frame 300 rotates to a third preset position, the first spoiler 341 rotates from the left side of the main air blowing port 210 to the right side of the main air blowing port 210, hot nitrogen blown from the main air blowing port 210 is blown onto the first spoiler 341, and the groove on the left side of the silicon wafer basket 400 is purged by the hot nitrogen through the guiding action of the first spoiler 341; when the revolving frame 300 rotates to the fourth preset position, the second spoiler 342 rotates from the right side of the main blowing port 210 to the left side of the main blowing port 210, hot nitrogen blown from the main blowing port 210 blows onto the second spoiler 342, and the hot nitrogen purges the right groove of the silicon wafer basket 400 through the guiding action of the second spoiler 342. The dead angle of purging is prevented, and the improvement of the working efficiency is facilitated. Further, the curvature of the first and second spoilers 341 and 342 is 40 °. Furthermore, the included angle between the third preset position and the initial position a0 is 5-10 degrees, the included angle between the fourth preset position and the initial position a0 is 5-10 degrees, namely, the included angle between the third preset position and the fourth preset position is 10-20 degrees. In the present embodiment, the angle between the preset position and the initial position a0 is 10 °, and the angle between the fourth preset position and the initial position a0 is 10 °.
Further, the blowing mechanism further comprises a first auxiliary blowing port 220 and a second auxiliary blowing port 230, the first auxiliary blowing port 220 and the second auxiliary blowing port 230 are both fixedly arranged on the inner wall of the working chamber 111, and part of nitrogen heated by the heating assembly is blown to the silicon wafer basket 400 from the first auxiliary blowing port 220 and the second auxiliary blowing port 230 under the action of the blowing assembly. The silicon wafer basket 400 has a plurality of vent holes 430 formed in the sidewall thereof, and hot nitrogen gas blown from the first and second auxiliary blowing ports 220 and 230 is introduced into the mounting groove 420 through the vent holes 430. The first auxiliary air blowing openings 220 are arranged at intervals along the axis of the working cavity 111, and the second auxiliary air blowing openings 230 are arranged at intervals along the axis of the working cavity 111. The first auxiliary outlet 220, the second auxiliary outlet 230 and the main outlet 210 are arranged at intervals around the axis of the working chamber 111.
Further, in order to prevent mutual interference of hot nitrogen blown out from adjacent air blowing ports, the first auxiliary air blowing port 220 is arranged on the left side of the main air blowing port 210, and an included angle between the first auxiliary air blowing port 220 and the main air blowing port 210 is 90-95 degrees; the second auxiliary blowing port 230 is arranged at the right side of the main blowing port 210, and the included angle between the second auxiliary blowing port 230 and the main blowing port 210 is 90-95 degrees.
In this embodiment, the spin-drying device 010 further includes a control device and a start button. The control device is electrically connected with the starting button, the swing mechanism and the blowing mechanism. When the air blowing device is used, the rotating mechanism and the air blowing mechanism are driven to work by pressing the starting button. The machine body 100 is further provided with a door interlock, and when the machine cover is in an open state, the start button cannot drive the spin-drying device 010 to operate under the control of the door interlock. Further, the spin-drying device 010 further includes a stop button electrically connected to the control mechanism, when the stop button is pressed, the spin-drying device 010 stops operating, and the swing mechanism stops operating after rotating to the initial position a0 under the control of the control mechanism.
When the spin-drying device 010 provided by the embodiment of the invention is used, the cover is opened, the silicon wafer basket 400 containing the silicon wafers 500 is placed in the cover, the start button is pressed, the spin-drying device 010 starts to work, and the silicon wafers 500 are at the initial position a 0. When the silicon wafer blowing device works, the main air blowing opening 210, the first auxiliary air blowing opening 220 and the second auxiliary air blowing opening 230 simultaneously blow hot nitrogen to the silicon wafer basket 400 to blow the silicon wafer 500, and at the moment, the hot nitrogen blown by the main air blowing opening 210 is directly blown to the silicon wafer 500 from between the first spoiler 341 and the second spoiler 342; when the silicon wafer 500 is driven by the rotation mechanism to rotate to the third preset position to the right, the first spoiler 341 rotates from the left side of the main air blowing port 210 to the right side of the main air blowing port 210, hot nitrogen blown from the main air blowing port 210 is blown onto the first spoiler 341, the groove on the left side of the silicon wafer basket 400 is purged by the hot nitrogen through the guiding action of the first spoiler 341, the silicon wafer 500 continues to rotate to the right under the drive of the rotation mechanism, and the rotation mechanism drives the silicon wafer 500 to rotate to the left until the silicon wafer rotates to the first preset position a1 (shown in fig. 4); when the silicon wafer 500 is driven by the rotation mechanism to rotate to the fourth preset position to the left, the second spoiler 342 rotates from the right side of the main air blowing port 210 to the left side of the main air blowing port 210, hot nitrogen blown from the main air blowing port 210 blows onto the second spoiler 342, through the guiding effect of the second spoiler 342, the hot nitrogen purges the right groove of the silicon wafer basket 400, the silicon wafer 500 continues to rotate to the left under the driving of the rotation mechanism until the silicon wafer 500 rotates to the second preset position a2 (as shown in fig. 5), and the rotation mechanism drives the silicon wafer 500 to rotate to the right. And performing reciprocating rotation work until the silicon wafer 500 is dried, and after the process requirements are met, driving the silicon wafer 500 to rotate to the initial position a0 by the rotating mechanism and then stopping rotating, stopping hot nitrogen purging by the main air blowing port 210, the first auxiliary air blowing port 220 and the second auxiliary air blowing port 230, and stopping the drying device 010.
The drying device 010 provided by the embodiment can rapidly dry the whole basket of silicon wafers 500 under the combined purging action of the main air blowing port 210, the first auxiliary air blowing port 220 and the second auxiliary air blowing port 230 and the drying action of the rotating mechanism, and the silicon wafers 500 are not easily damaged in the drying process due to the small rotating angle of the silicon wafers 500, so that the fragment rate is effectively reduced, and even 6-inch silicon wafers 500 with the thickness of 60-175 micrometers can be dried in the whole basket. Meanwhile, the first spoiler 341 and the second spoiler 342 are arranged to guide hot nitrogen blown out from the main air blowing port 210, so that dead corners of grooves in the silicon wafer basket 400 are purged, and the purging efficiency of the silicon wafer 500 is further improved. The drying device 010 provided by the embodiment is simple in structure and low in cost.
Example 2
The embodiment provides a spin-drying method which is realized based on the spin-drying device. The method will be described below by taking the spin-drying apparatus described in example 1 as an example. The method comprises the following steps:
SO 1: and loading a plurality of silicon chips into the mounting grooves.
After a plurality of silicon chips are arranged in the mounting groove in the silicon chip basket through the first opening, the mounting groove is arranged in the accommodating cavity through the second opening, the positioning is realized through the positioning mechanism arranged in the accommodating cavity, and the silicon chips are positioned at the initial position at the moment.
SO 2: the slewing mechanism drives the silicon wafer to rotate back and forth between a first preset position and a second preset position.
The silicon wafer is driven by the swing mechanism to rotate from the initial position to the left and right, when the silicon wafer rotates to the first preset position to the right, the swing mechanism drives the silicon wafer to rotate to the left, and when the silicon wafer rotates to the second preset position, the swing mechanism drives the silicon wafer to rotate to the right.
SO 3: and blowing dry gas into the mounting groove through the main blowing port.
And in the process that the silicon wafer rotates between the first preset position and the second preset position in a reciprocating mode, the blowing mechanism blows hot nitrogen to the silicon wafer through the main blowing port, the first auxiliary blowing port and the second auxiliary blowing port. The silicon wafer is quickly dried by combining hot nitrogen purging and drying.
SO 4: and after the silicon wafer meets the process requirements, stopping working of the slewing mechanism and the main air blowing port.
And after the silicon wafer is dried to meet the process requirements, stopping the work of the blowing mechanism, and stopping the work after the slewing mechanism drives the silicon wafer to rotate to the initial position.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a device spin-dries for spin-dry silicon chip, its characterized in that includes:
a body;
a swing mechanism rotatably connected with the body; the silicon wafer reciprocating rotation device comprises a rotary mechanism, a plurality of mounting grooves and a plurality of clamping grooves, wherein the rotary mechanism is provided with a plurality of mounting grooves which are used for being clamped with a silicon wafer and is used for driving the silicon wafer to rotate between a first preset position and a second preset position in a reciprocating mode; and
the air blowing mechanism is provided with a main air blowing port for blowing dry air into the mounting groove; the main air blowing port is fixedly arranged on the machine body and is always positioned between the first preset position and the second preset position;
the mounting groove is provided with a first opening for the silicon wafer to enter and exit the mounting groove, and the main air blowing port is arranged opposite to the first opening; the included angle between the first preset position and the second preset position is 30-40 degrees.
2. The spin-drying apparatus of claim 1, wherein:
the blowing mechanism also comprises a first auxiliary blowing port and a second auxiliary blowing port which are used for blowing the drying gas into the mounting groove, and the first auxiliary blowing port and the second auxiliary blowing port are fixedly arranged on the machine body; the first auxiliary air blowing port, the second auxiliary air blowing port and the main air blowing port are arranged around the rotation axis of the silicon wafer.
3. The spin-drying apparatus of claim 2, wherein:
the included angle between the first auxiliary air blowing port and the main air blowing port is 90-95 degrees;
the included angle between the second auxiliary air blowing port and the main air blowing port is 90-95 degrees.
4. A spin-drying apparatus according to any one of claims 1 to 3, wherein:
the drying gas is nitrogen, and the temperature of the nitrogen is 60-70 ℃.
5. The spin-drying apparatus of claim 1, wherein:
the spin-drying device further comprises a first spoiler and a second spoiler which are fixedly connected to the swing mechanism, and the distance between the first spoiler and the second spoiler is gradually increased along the direction from the main air blowing opening to the silicon wafer;
when the silicon wafer rotates to a third preset position, the main air blowing opening is positioned on one side of the first spoiler far away from the second spoiler, and the first spoiler is used for guiding the dry air; when the silicon wafer rotates to a fourth preset position, the main air blowing opening is located on one side, away from the first spoiler, of the second spoiler, and the second spoiler is used for guiding the dry air; the third preset position and the fourth preset position are located between the first preset position and the second preset position.
6. The spin-drying apparatus of claim 5, wherein:
the included angle between the third preset position and the fourth preset position is 10-20 degrees.
7. The spin-drying apparatus of claim 1, wherein:
the spin-drying device also comprises a silicon wafer basket for containing the silicon wafers, and the mounting groove is arranged in the silicon wafer basket; the slewing mechanism is provided with an accommodating cavity for accommodating the silicon wafer basket, and the silicon wafer basket is detachably connected with the slewing mechanism.
8. The spin-drying apparatus of claim 7, wherein:
the slewing mechanism further comprises a positioning mechanism arranged in the containing cavity, and the positioning mechanism is detachably connected with the silicon wafer basket and used for positioning the silicon wafer basket.
9. A spin-drying method implemented on the basis of the spin-drying apparatus of any one of claims 1 to 8, comprising:
loading a plurality of silicon chips into the mounting grooves;
the slewing mechanism drives the silicon wafer to rotate back and forth between a first preset position and a second preset position;
the main air blowing port blows dry air into the mounting groove;
and after the silicon wafer meets the process requirements, stopping working of the slewing mechanism and the main air blowing port.
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| CN201811074802.1A CN109087880B (en) | 2018-09-14 | 2018-09-14 | Spin-drying device and spin-drying method |
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| CN201811074802.1A CN109087880B (en) | 2018-09-14 | 2018-09-14 | Spin-drying device and spin-drying method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60233825A (en) * | 1984-05-07 | 1985-11-20 | Hitachi Ltd | Treatment device |
| US6067727A (en) * | 1996-11-07 | 2000-05-30 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for drying substrates |
| CN200946965Y (en) * | 2006-06-28 | 2007-09-12 | 常州市科沛达超声工程设备有限公司 | Silicon wafer drying machine |
| CN202549809U (en) * | 2012-03-31 | 2012-11-21 | 江苏聚能硅业有限公司 | Nitrogen dryer |
| CN203218236U (en) * | 2012-12-28 | 2013-09-25 | 禾邑实业股份有限公司 | Fixture structure of rotary drying machine |
| CN108389814A (en) * | 2018-03-02 | 2018-08-10 | 爱佩克斯（北京）科技有限公司 | A kind of jig of the spinner with guide bracket |
-
2018
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60233825A (en) * | 1984-05-07 | 1985-11-20 | Hitachi Ltd | Treatment device |
| US6067727A (en) * | 1996-11-07 | 2000-05-30 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for drying substrates |
| CN200946965Y (en) * | 2006-06-28 | 2007-09-12 | 常州市科沛达超声工程设备有限公司 | Silicon wafer drying machine |
| CN202549809U (en) * | 2012-03-31 | 2012-11-21 | 江苏聚能硅业有限公司 | Nitrogen dryer |
| CN203218236U (en) * | 2012-12-28 | 2013-09-25 | 禾邑实业股份有限公司 | Fixture structure of rotary drying machine |
| CN108389814A (en) * | 2018-03-02 | 2018-08-10 | 爱佩克斯（北京）科技有限公司 | A kind of jig of the spinner with guide bracket |
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