CN109087880A - A kind of spin-drying device and drying method - Google Patents
A kind of spin-drying device and drying method Download PDFInfo
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- CN109087880A CN109087880A CN201811074802.1A CN201811074802A CN109087880A CN 109087880 A CN109087880 A CN 109087880A CN 201811074802 A CN201811074802 A CN 201811074802A CN 109087880 A CN109087880 A CN 109087880A
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- silicon wafer
- inflatable mouth
- spin
- predeterminated position
- drying device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Abstract
The present invention relates to microelectronic manufacturing technology fields, it is desirable to provide a kind of spin-drying device and drying method.Spin-drying device of the invention includes fuselage, swing mechanism and blower mechanism.When use, swing mechanism drives the silicon wafer being fastened in mounting groove to rotate between the first predeterminated position and the second predeterminated position, rotation amplitude is small, silicon wafer can effectively be avoided during rotation, since relative rolling occurs for silicon wafer and mounting groove, silicon wafer chipping be caused the problem of dark line, fragment even occur, it is provided with the main inflatable mouth of the opening of face first simultaneously, it is blown into dry gas into mounting groove, in such a way that purging plus drying combine, helps to improve working efficiency.
Description
Technical field
The present invention relates to microelectronic manufacturing technology fields, in particular to a kind of spin-drying device and drying method.
Background technique
In semi-conductor silicon chip production process, silicon wafer drying work step is excessive link in production process, through entire
Production procedure among.Silicon wafer and piece basket can occur using the drying of common dryer for 60 microns to 170 micro belt film silicon wafers
Between relative rolling crack between the teeth and sting piece basket, cause silicon wafer local edge unbalance stress to occur spring side, it is serious to generate vibration and occur
Dark line.The main reason is that silicon wafer is too thin or radian is excessive causes.
Summary of the invention
The purpose of the present invention includes providing a kind of spin-drying device, is got rid of with improving spin-drying device in the prior art to thin silicon wafer
The problem of be easy to causeing silicon wafer to damage when dry.
The purpose of the present invention further includes providing a kind of drying method, is realized based on above-mentioned spin-drying device.
The embodiment of the present invention is achieved in that
A kind of spin-drying device, for drying silicon wafer comprising fuselage；The swing mechanism being rotatably coupled with fuselage；It returns
Multiple mounting grooves are provided on rotation mechanism, mounting groove is used to be clamped with silicon wafer, and swing mechanism is for driving silicon wafer default first
Reciprocating rotation between position and the second predeterminated position；And blower mechanism, blower mechanism have dry for being blown into clamping groove
The main inflatable mouth of pathogenic dryness body；Main inflatable mouth is fixed on fuselage, and is always positioned at the first predeterminated position and the second default position
Between setting；Wherein, mounting groove has for the first opening for silicon wafer disengaging mounting groove, and the main opening of inflatable mouth face first is set
It sets.
In one embodiment of the invention:
Above-mentioned inflatable body further includes the first auxiliary inflatable mouth for being blown into from dry gas to mounting groove and second auxiliary
Inflatable mouth is helped, the first auxiliary inflatable mouth and the second auxiliary inflatable mouth are fixed on fuselage；It is first auxiliary inflatable mouth, second auxiliary
Inflatable mouth and main inflatable mouth is helped to be arranged around the pivot center of silicon wafer.
In one embodiment of the invention:
Angle between above-mentioned first auxiliary inflatable mouth and main inflatable mouth is 90 ° -95 °；
Angle between second auxiliary inflatable mouth and main inflatable mouth is 90 ° -95 °.
In one embodiment of the invention:
Above-mentioned dry gas is nitrogen, and the temperature of nitrogen is 60 DEG C -70 DEG C.
In one embodiment of the invention:
Angle between above-mentioned first predeterminated position and the second predeterminated position is 30 ° -40 °.
In one embodiment of the invention:
Above-mentioned spin-drying device further includes the first spoiler and the second spoiler being fixedly connected on slewing equipment, along from master
To the direction of silicon wafer, the distance between the first spoiler and the second spoiler are gradually increased inflatable mouth；
When silicon wafer turns to third predeterminated position, main inflatable mouth is located at one of the first spoiler far from the second spoiler
Side, the first spoiler are used to be oriented to for dry gas；When silicon wafer turns to four predeterminated positions, main inflatable mouth is located at second and disturbs
Side of the flowing plate far from the first spoiler, the second spoiler are used to be oriented to for dry gas；Third predeterminated position and the 4th is preset
Position is between the first predeterminated position and the second predeterminated position.
In one embodiment of the invention:
Angle between above-mentioned third predeterminated position and the 4th predeterminated position is 10 ° -20 °.
In one embodiment of the invention:
Above-mentioned spin-drying device further includes the silicon wafer basket for accommodating silicon wafer, and mounting groove is arranged in silicon wafer basket；Swing mechanism
Has the accommodating chamber for accommodating silicon wafer basket, silicon wafer basket and swing mechanism are detachably connected.
In one embodiment of the invention:
Above-mentioned swing mechanism further includes the positioning mechanism being arranged in accommodating chamber, and positioning mechanism removably connects with silicon wafer basket
It connects, for being positioned to silicon wafer basket.
A kind of drying method, based on any one of the above spin-drying device realize, the drying method the following steps are included:
Multiple silicon wafers are fitted into multiple mounting grooves；Swing mechanism drives silicon wafer in the first predeterminated position and the second default position
Reciprocating rotation between setting；Main inflatable mouth is blown into dry gas into accommodating chamber；After silicon wafer meets technique requirement, swing mechanism and master
Inflatable mouth stops working.
The beneficial effect of the embodiment of the present invention includes:
The spin-drying device that the embodiment of the present invention provides, for drying silicon wafer comprising fuselage, swing mechanism and hair dryer
Structure.Swing mechanism is rotatably coupled with fuselage, for driving silicon wafer past between the first predeterminated position and the second predeterminated position
Multiple rotation.It is provided with multiple mounting grooves on swing mechanism, can block in each mounting groove and set a silicon wafer.Mounting groove has for silicon
First opening of piece disengaging, the main inflatable mouth face first of blower mechanism are open setting, and be always positioned at the first predeterminated position and
Between second predeterminated position.In use, swing mechanism drives the silicon wafer being fastened in mounting groove in the first predeterminated position and second
It is rotated between predeterminated position, rotation amplitude is small, silicon wafer can be effectively avoided during rotation, since silicon wafer and mounting groove occur
Relative rolling causes silicon wafer chipping even the problem of dark line, fragment occur, while being provided with the main air blowing of the opening of face first
Mouthful, it is blown into dry gas into mounting groove, in such a way that purging plus drying combine, helps to improve working efficiency.And
Due to being provided with multiple mounting grooves in swing mechanism, spin-drying operation can be carried out simultaneously to multiple silicon wafers, further improve work
Make efficiency.
The drying method that the embodiment of the present invention provides is realized based on above-mentioned spin-drying device, therefore also has work effect
Rate is high, can be avoided the beneficial effect that chipping and dark line fragment occurs during drying in silicon wafer.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the overall structure diagram for the spin-drying device that the embodiment of the present invention 1 provides；
The structural schematic diagram of reversing frame in the spin-drying device that Fig. 2 provides for the embodiment of the present invention 1；
The structural schematic diagram of silicon wafer basket in the spin-drying device that Fig. 3 provides for the embodiment of the present invention 1；
Fig. 4 is structural schematic diagram when silicon wafer is located at the first predeterminated position in the spin-drying device that provides of the embodiment of the present invention 1；
Fig. 5 is structural schematic diagram when silicon wafer is located at the second predeterminated position in the spin-drying device that provides of the embodiment of the present invention 1.
Icon: 010- spin-drying device；100- fuselage；110- body；111- working chamber；The main inflatable mouth of 210-；220- first
Assist inflatable mouth；230- second assists inflatable mouth；300- reversing frame；The first finger plate of 310-；The second finger plate of 320-；321-
Two openings；330- positioning mechanism；The first locating piece of 331-；The second locating piece of 332-；333- third locating piece；The first flow-disturbing of 341-
Plate；The second spoiler of 342-；400- silicon wafer basket；410- first is open；420- mounting groove；430- venthole；500- silicon wafer.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the embodiment of the present invention, it should be noted that term " first ", " second " etc. are only used for distinguishing and retouch
It states, is not understood to indicate or imply relative importance.
Embodiment 1
Fig. 1 is the overall structure diagram of spin-drying device 010 provided in this embodiment.Fig. 1 is please referred to, the present embodiment provides
A kind of spin-drying device 010, for drying silicon wafer 500 comprising fuselage 100, swing mechanism and blower mechanism.Swing mechanism with
Fuselage 100 is rotatably coupled, for driving the reciprocating rotary between the first predeterminated position a1 and the second predeterminated position a2 of silicon wafer 500
It is dynamic.It is provided with multiple mounting grooves 420 on swing mechanism, can block in each mounting groove 420 and set a silicon wafer 500.Mounting groove 420
Have the first opening 410 passed in and out for silicon wafer 500,210 face first of main inflatable mouth opening, 410 setting of blower mechanism, and begins
Final position is between the first predeterminated position a1 and the second predeterminated position a2.In use, swing mechanism drive is fastened in mounting groove 420
Silicon wafer 500 rotated between the first predeterminated position a1 and the second predeterminated position a2, rotation amplitude is small, can effectively avoid silicon wafer
500 during rotation, since relative rolling occurs for silicon wafer 500 and mounting groove 420, causes 500 chipping of silicon wafer even to occur dark
The problem of line, fragment, while it being provided with the main inflatable mouth 210 of the opening of face first 410, dry gas is blown into mounting groove 420
Body helps to improve working efficiency in such a way that purging plus drying combine.
Spin-drying device 010 provided in this embodiment is further described below:
In the present embodiment, fuselage 100 includes body 110 and cover (not shown go out), is provided in body 110 for holding
Receive the working chamber 111 of swing mechanism.The substantially cylindrical cavity of working chamber 111, the axis horizontal setting of working chamber 111.Cover
It is rotatably coupled with body 110, for making working chamber 111 be in closing or open state.
Fig. 2 is the structural schematic diagram of reversing frame 300 in spin-drying device 010 provided in this embodiment.Referring to figure 2., at this
In embodiment, swing mechanism includes driving mechanism (not shown go out) and reversing frame 300, and the setting of reversing frame 300 is in working chamber 111
In, and can be rotated by axis of the axis of working chamber 111.Driving mechanism and reversing frame 300 are sequentially connected, and reversing frame 300 is driving
Under the drive of motivation structure can within the scope of predetermined angle reciprocating rotation, to drive the silicon wafer 500 that is arranged on reversing frame 300
Rotation.Angle of the predetermined angle between the first predeterminated position a1 and the second predeterminated position a2.Further, the first predeterminated position
Angle between a1 and the second predeterminated position a2 is 30 ° -40 °, in the present embodiment, the first predeterminated position a1 and the second default position
Setting the angle between a2 is 40 °.
Specifically, in the present embodiment, reversing frame 300 includes the first finger plate 310 that relative spacing is arranged and second time
Rotating plate 320.First finger plate 310 is sequentially connected with driving mechanism, the reciprocating rotation under the drive of driving mechanism, the second finger plate
320 are fixedly connected on the first finger plate 310 by connector, are formed and are used between the first finger plate 310 and the second finger plate 320
In the accommodating chamber for accommodating silicon wafer 500.
Fig. 3 is the structural schematic diagram of silicon wafer basket 400 in spin-drying device 010 provided in this embodiment.Incorporated by reference to referring to Fig. 2 and
Fig. 3 offers the second opening 321 for being connected in the external world with accommodating chamber, silicon wafer basket in the present embodiment on the second finger plate 320
400 by the second opening 321 removably in accommodating chamber.Multiple mounting grooves 420, each installation are provided in silicon wafer basket 400
Slot 420, which can block, sets a silicon wafer 500, and the upper end of silicon wafer basket 400 offers the first opening 410, in use, 500 energy of silicon wafer
It is enough packed into mounting groove 420 by the first opening 410, or is taken out out of mounting groove 420.
Further, the connector between the first finger plate 310 and the second finger plate 320 is positioning mechanism 330.Localization machine
Structure 330 includes the first locating piece 331 and the second locating piece 332.First locating piece 331 is substantially L-shaped, two the first locating pieces
331 along spin-drying device 010 left and right directions interval be arranged, the upper end of silicon wafer basket 400 be connected to two the first locating pieces 331 it
Between.Second locating piece 332 substantially l-shaped, two the second locating pieces 332 are arranged along the left and right directions interval of spin-drying device 010, silicon
The lower end of piece basket 400 is connected between two the second locating pieces 332.Two the first locating pieces 331 and two the second locating pieces
332 both ends are fixedly connected with the first finger plate 310 and the second finger plate 320 respectively, to form reversing frame 300.
Further, positioning mechanism 330 further includes third locating piece 333, and the both ends of third locating piece 333 are respectively with first
Finger plate 310 is fixedly connected with the second finger plate 320.Two third locating pieces 333 are opposite along the left and right directions of spin-drying device 010
Interval setting, the middle part of silicon wafer basket 400 is connected between two third locating pieces 333.By two the first locating pieces 331,
The collective effect of two second locating pieces 332 and two third locating pieces 333 is realized that the positioning of silicon wafer basket 400 is firm, and is being returned
In 300 rotation process of pivoted frame, silicon wafer basket 400 also can be rotated together steadily with reversing frame 300, avoid occurring due to silicon wafer basket
400 relatively rotate with reversing frame 300, cause vibration damage silicon wafer 500.
In the present embodiment, blower mechanism includes heating component (not shown go out), main inflatable mouth 210 and air blowing component (figure
It is not shown).After heating component heats dry gas, dry gas is under the action of air blowing component from main inflatable mouth 210
It is blown into mounting groove 420.Multiple main inflatable mouths 210 are fixed at 111 inner wall of working chamber along the axis interval of working chamber 111
On, and the surface of the first opening 410 is set.In use, the dry gas after heating is by main inflatable mouth 210, on to
Under blow to silicon wafer 500, accelerate the drying process of silicon wafer 500.Specifically, heating component includes dry combustion method type heating rod.Further,
Dry gas is nitrogen, and temperature of the nitrogen after heating is 60 DEG C -70 DEG C, and in the present embodiment, nitrogen temperature is 65 DEG C.
Further, spin-drying device 010 further includes 341 He of the first spoiler being fixedly connected on the second finger plate 320
Second spoiler 342.First spoiler 341 and the second spoiler 342 are substantially arc-shaped, along from main inflatable mouth 210 to silicon
The direction of piece 500, the distance between the first spoiler 341 and the second spoiler 342 are gradually increased.When reversing frame 300 is in just
When beginning position a0 (as shown in Figure 1), the first spoiler 341 and the second spoiler 342 are located at the two sides of main inflatable mouth 210；
When reversing frame 300 turns to third predeterminated position, the first spoiler 341 is from the left pivot movement of main inflatable mouth 210 to main air blowing
The right side of mouth 210, the hot nitrogen that main inflatable mouth 210 is blown out are blown on the first spoiler 341, pass through leading for the first spoiler 341
To effect, hot nitrogen purges 400 left channel of silicon wafer basket；When reversing frame 300 turns to four predeterminated positions, second
Spoiler 342 turns to the left side of main inflatable mouth 210, the hot nitrogen air-blowing that main inflatable mouth 210 is blown out from the right side of main inflatable mouth 210
Onto the second spoiler 342, by the guiding role of the second spoiler 342, hot nitrogen carries out the right groove of silicon wafer basket 400
Purging.Purging dead angle is prevented, working efficiency is helped to improve.Further, the first spoiler 341 and the second spoiler
342 crooked radian is 40 °.Further, the angle between third predeterminated position and initial position a0 is 5 ° -10 °, and the 4th is pre-
If the angle between position and initial position a0 is that the angle between 5 ° -10 °, i.e. third predeterminated position and the 4th predeterminated position is
10°-20°.In the present embodiment, the angle between predeterminated position and initial position a0 is 10 °, the 4th predeterminated position and initial bit
Setting the angle between a0 is 10 °.
Further, blower mechanism further includes the first auxiliary inflatable mouth 220 and the second auxiliary inflatable mouth 230, the first auxiliary
Inflatable mouth 220 and the second auxiliary inflatable mouth 230 are fixed on 111 inner wall of working chamber, are partially heated component heating
Nitrogen blows to silicon wafer basket 400 from the first auxiliary inflatable mouth 220 and the second auxiliary inflatable mouth 230 under the action of air blowing component.Silicon
Multiple ventholes 430 are offered on the side wall of piece basket 400, are blown out from the first auxiliary inflatable mouth 220 and the second auxiliary inflatable mouth 230
Hot nitrogen from venthole 430 enter mounting groove 420 in.Multiple first auxiliary inflatable mouths 220 are along the axis interval of working chamber 111
Setting, multiple second auxiliary inflatable mouths 230 are arranged along the axis interval of working chamber 111.First auxiliary inflatable mouth 220, second is auxiliary
Inflatable mouth 230 and main inflatable mouth 210 is helped to be arranged around the axis interval of working chamber 111.
Further, the hot nitrogen of adjacent inflatable mouth blowout interferes in order to prevent, and the first auxiliary inflatable mouth 220 is arranged
In main 210 left side of inflatable mouth, and the angle between the first auxiliary inflatable mouth 220 and main inflatable mouth 210 is 90 ° -95 °；Second is auxiliary
Help the setting of inflatable mouth 230 on main 210 right side of inflatable mouth, and the angle between the second auxiliary inflatable mouth 230 and main inflatable mouth 210 is
90°-95°。
In the present embodiment, spin-drying device 010 further includes control device and start button.Control device and start button,
Swing mechanism and blower mechanism electrical connection.In use, driving swing mechanism and blower mechanism to work by pressing start button.Machine
It is also equipped with gate interlock on body 100, when cover is in the open state, under the control of gate interlock, start button can not be driven
Spin-drying device 010 is run.Further, spin-drying device 010 further includes the stop button being electrically connected with control mechanism, presses stopping
Button, spin-drying device 010 is out of service, and swing mechanism stops work after turning to initial position a0 under the control of control mechanism
Make.
The spin-drying device 010 provided in the embodiment of the present invention, in use, being put into apparatus lid opening equipped with silicon wafer 500
Silicon wafer basket 400 and after shutting cover, presses start button, spin-drying device 010 is started to work, and silicon wafer 500 is in initial at this time
Position a0.When work, main inflatable mouth 210, first assists inflatable mouth 220 and the second auxiliary inflatable mouth 230 simultaneously to silicon wafer basket 400
Hot nitrogen is blown, silicon wafer 500 is purged, the hot nitrogen that main inflatable mouth 210 is blown out at this time is disturbed from the first spoiler 341 and second
Silicon wafer 500 is directly blowed between flowing plate 342；When silicon wafer 500 is turned right under the drive of swing mechanism to third predeterminated position,
First spoiler 341 is from the left pivot movement of main inflatable mouth 210 to the right side of main inflatable mouth 210, the hot nitrogen of the main blowout of inflatable mouth 210
In air-blowing to the first spoiler 341, by the guiding role of the first spoiler 341, hot nitrogen to 400 left channel of silicon wafer basket into
Row purging, silicon wafer 500 continues to turn right under the drive of swing mechanism, until turning to the first predeterminated position a1 (such as Fig. 4 institute
Show) after, swing mechanism drives silicon wafer 500 to turn left；Silicon wafer 500 turns left default to the 4th under the drive of swing mechanism
When position, the second spoiler 342 turns to the left side of main inflatable mouth 210 from the right side of main inflatable mouth 210, and main inflatable mouth 210 is blown
Hot nitrogen out is blown on the second spoiler 342, and by the guiding role of the second spoiler 342, hot nitrogen is to silicon wafer basket 400
Right groove is purged, and silicon wafer 500 continues to turn left under the drive of swing mechanism, until turning to the second predeterminated position
After a2 (as shown in Figure 5), swing mechanism drives silicon wafer 500 to turn right.And so on rotation work, until silicon wafer 500 is got rid of
Dry, after meeting technique requirement, swing mechanism stops operating after driving silicon wafer 500 to turn to initial position a0, main inflatable mouth 210,
First auxiliary inflatable mouth 220 and the second auxiliary inflatable mouth 230 stop hot nitrogen purging, and spin-drying device 010 stops working.
Spin-drying device 010 provided in this embodiment assists inflatable mouth 220 and the second auxiliary to blow in main inflatable mouth 210, first
Under the effect of common purging and the drying of swing mechanism effect of port 230, rapidly whole basket silicon wafer 500 can be got rid of
It is dry, and since the rotational angle of silicon wafer 500 is smaller, silicon wafer 500 is not easily susceptible to damage during drying, effectively reduces broken
Piece rate, even 60 microns of 6 inch silicon wafers 500 to 175 micron thickness can whole basket drying.Simultaneously by setting first
Spoiler 341 and the second spoiler 342 are oriented to the hot nitrogen of main inflatable mouth 210 blowout, realize in silicon wafer basket 400
Groove dead angle is purged, and the purging efficiency of silicon wafer 500 is further improved.And spin-drying device 010 provided in this embodiment, knot
Structure is simple, at low cost.
Embodiment 2
A kind of drying method is present embodiments provided, is realized based on above-mentioned spin-drying device.Below with the record of embodiment 1
Spin-drying device for, this method is illustrated.Method includes the following steps:
SO1: multiple silicon wafers are fitted into multiple mounting grooves.
Multiple silicon wafers are open after the mounting groove being packed into silicon wafer basket by first, mounting groove is packed by the second opening
In accommodating chamber, and the positioning mechanism by being arranged in accommodating chamber realizes positioning, and silicon wafer is in initial position at this time.
SO2: swing mechanism drives silicon wafer reciprocating rotation between the first predeterminated position and the second predeterminated position.
Silicon wafer is rotated since initial position to the left and right under the drive of swing mechanism, when silicon wafer turns right to first in advance
If swing mechanism drives silicon wafer to turn left behind position, until after turning to the second predeterminated position, swing mechanism drive silicon wafer to
It turns right dynamic.
SO3: main inflatable mouth is blown into dry gas into the mounting groove.
Between the first predeterminated position and the second predeterminated position during reciprocating rotation, blower mechanism is blown silicon wafer by master
Port and first assists inflatable mouth, the second auxiliary inflatable mouth to blow hot nitrogen to silicon wafer.Two kinds are purged and dried by hot nitrogen
The combination of mode, quickly dries silicon wafer.
SO4: after silicon wafer meets technique requirement, swing mechanism and main inflatable mouth stop working.
After silicon wafer drying to after meeting technique requirement, inflatable body stops working, and swing mechanism drives silicon wafer to turn to just
It stops working behind beginning position.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of spin-drying device, for drying silicon wafer characterized by comprising
Fuselage；
The swing mechanism being rotatably coupled with the fuselage；Multiple mounting grooves, the installation are provided on the swing mechanism
Slot is used to be clamped with silicon wafer, and the swing mechanism is for driving the silicon wafer between the first predeterminated position and the second predeterminated position
Reciprocating rotation；And
Blower mechanism, the blower mechanism have the main inflatable mouth for being blown into dry gas into the clamping groove；The master
Inflatable mouth is fixed on the fuselage, and is always positioned between first predeterminated position and second predeterminated position；
Wherein, the mounting groove has the first opening for passing in and out the mounting groove for the silicon wafer, and the main inflatable mouth is just
To the first opening setting.
2. spin-drying device according to claim 1, it is characterised in that:
The inflatable body further includes the first auxiliary inflatable mouth and for being blown into the dry gas into the mounting groove
Two auxiliary inflatable mouths, the first auxiliary inflatable mouth and the second auxiliary inflatable mouth are fixed on the fuselage；It is described
First auxiliary inflatable mouth, the second auxiliary inflatable mouth and the main inflatable mouth are arranged around the pivot center of the silicon wafer.
3. spin-drying device according to claim 2, it is characterised in that:
Angle between the first auxiliary inflatable mouth and the main inflatable mouth is 90 ° -95 °；
Angle between the second auxiliary inflatable mouth and the main inflatable mouth is 90 ° -95 °.
4. spin-drying device according to claim 1-3, it is characterised in that:
The dry gas is nitrogen, and the temperature of the nitrogen is 60 DEG C -70 DEG C.
5. spin-drying device according to claim 1, it is characterised in that:
Angle between first predeterminated position and second predeterminated position is 30 ° -40 °.
6. spin-drying device according to claim 1, it is characterised in that:
The spin-drying device further includes the first spoiler and the second spoiler being fixedly connected on the slewing equipment, along from institute
Main inflatable mouth is stated to the direction of the silicon wafer, the distance between first spoiler and second spoiler are gradually increased；
When the silicon wafer turns to third predeterminated position, the main inflatable mouth is located at first spoiler far from described second
The side of spoiler, first spoiler are used to be oriented to for the dry gas；When the silicon wafer turns to the 4th default position
When setting, the main inflatable mouth is located at side of second spoiler far from first spoiler, and second spoiler is used
It is oriented in for the dry gas；The third predeterminated position and the 4th predeterminated position be located at first predeterminated position and
Between second predeterminated position.
7. spin-drying device according to claim 6, it is characterised in that:
Angle between the third predeterminated position and the 4th predeterminated position is 10 ° -20 °.
8. spin-drying device according to claim 1, it is characterised in that:
The spin-drying device further includes the silicon wafer basket for accommodating the silicon wafer, and the mounting groove is arranged in the silicon wafer basket；
The swing mechanism has the accommodating chamber for accommodating the silicon wafer basket, and the silicon wafer basket removably connects with the swing mechanism
It connects.
9. spin-drying device according to claim 8, it is characterised in that:
The swing mechanism further includes the positioning mechanism being arranged in the accommodating chamber, and the positioning mechanism and the silicon wafer basket can
It releasably connects, for being positioned to the silicon wafer basket.
10. a kind of drying method, this method is based on the described in any item spin-drying devices of claim 1-9 and realizes, which is characterized in that
Include:
Multiple silicon wafers are fitted into multiple mounting grooves；
The swing mechanism drives silicon wafer reciprocating rotation between the first predeterminated position and the second predeterminated position；
The main inflatable mouth is blown into dry gas into the mounting groove；
After the silicon wafer meets technique requirement, the swing mechanism and the main inflatable mouth stop working.
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| CN201811074802.1A CN109087880B (en) | 2018-09-14 | 2018-09-14 | Spin-drying device and spin-drying method |
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| CN201811074802.1A CN109087880B (en) | 2018-09-14 | 2018-09-14 | Spin-drying device and spin-drying method |
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| CN108389814A (en) * | 2018-03-02 | 2018-08-10 | 爱佩克斯（北京）科技有限公司 | A kind of jig of the spinner with guide bracket |
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2018
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| JPS60233825A (en) * | 1984-05-07 | 1985-11-20 | Hitachi Ltd | Treatment device |
| US6067727A (en) * | 1996-11-07 | 2000-05-30 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for drying substrates |
| CN200946965Y (en) * | 2006-06-28 | 2007-09-12 | 常州市科沛达超声工程设备有限公司 | Silicon wafer drying machine |
| CN202549809U (en) * | 2012-03-31 | 2012-11-21 | 江苏聚能硅业有限公司 | Nitrogen dryer |
| CN203218236U (en) * | 2012-12-28 | 2013-09-25 | 禾邑实业股份有限公司 | Fixture structure of rotary drying machine |
| CN108389814A (en) * | 2018-03-02 | 2018-08-10 | 爱佩克斯（北京）科技有限公司 | A kind of jig of the spinner with guide bracket |
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