CN109082252B - Copper foil adhesive for high-peel-strength paper-based copper-clad plate - Google Patents
Copper foil adhesive for high-peel-strength paper-based copper-clad plate Download PDFInfo
- Publication number
- CN109082252B CN109082252B CN201810650356.8A CN201810650356A CN109082252B CN 109082252 B CN109082252 B CN 109082252B CN 201810650356 A CN201810650356 A CN 201810650356A CN 109082252 B CN109082252 B CN 109082252B
- Authority
- CN
- China
- Prior art keywords
- parts
- copper foil
- foil adhesive
- copper
- peel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/12—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a copper foil adhesive for a high-peel-strength paper-based copper-clad plate, which comprises the following steps: step one, synthesis of modified barium phenolic resin: 1) adding 2350 plus 2450 parts of phenol, 3000 plus 3200 parts of formaldehyde and 120 plus 140 parts of melamine formaldehyde resin into a reaction kettle, adding 25-28 parts of barium hydroxide under the condition of stirring, and then carrying out heating reaction; 2) after the reaction is finished, vacuumizing, decompressing and dehydrating, adding 380-2300 parts of solvent, stirring, cooling and storing for later use; step two, mixing and dissolving the prepared 240-260 parts of modified barium phenolic resin, 150-160 parts of polyvinyl butyral and 18-22 parts of basic epoxy resin in 1090-1310 parts of organic solvent to obtain the copper foil adhesive. The prepared copper foil adhesive obviously improves the peeling strength and the uniformity of the peeling strength of the copper clad laminate, and obtains better economic benefit when being used for producing the thin copper foil paper-based copper clad laminate.
Description
The subject of the present application is "one" to application No. 201510951816.7, application No. 2015.12.17
A manufacturing method of copper foil adhesive for a paper-based copper-clad plate is provided.
Technical Field
The invention relates to the field of manufacturing of paper-based copper-clad plates, in particular to a copper foil adhesive for a high-peel-strength paper-based copper-clad plate.
Background
A layer of copper foil adhesive is coated on a roughened copper foil used for manufacturing the paper-based copper-clad plate before the copper foil is subjected to hot-pressing lamination with a prepreg so as to meet the requirements of dip-soldering resistance and peeling strength of a copper-clad plate product. The adhesive can also prevent the paper fiber from being exposed in the environment after copper foil is etched during the circuit board manufacturing process, so that the water absorption rate is increased, the insulation resistance is reduced, and the circuit board is caused to lose efficacy. Therefore, the formula of the copper foil adhesive and the manufacturing process thereof are important components of the production technology of the paper-based copper-clad plate. Copper foil for copper clad laminate production is developing towards thinning, the thickness of the copper foil for the traditional paper-based copper clad laminate is mainly 35um, and the copper foil with the thickness of 18um is dominant at present. In recent years, the use ratio of copper foils with the thickness of 15um and 13um in the paper-based copper-clad plate is increased year by year. Along with the reduction of the thickness of the copper foil, the thickness of the roughened layer of the bonding surface is also reduced, the peeling strength of the product is influenced, the phenomenon of copper sheet falling off is easy to occur in the assembling process of an electronic product, the product is scrapped, and the economic loss is serious. How to improve the peeling strength of the thin copper foil or the ultra-thin copper foil paper-based copper-clad plate and improve the reliability of electronic products is a problem concerned by paper-based copper-clad plate manufacturers.
Disclosure of Invention
The invention aims to provide the copper foil adhesive for the high-peel-strength paper-based copper-clad plate, which obviously improves the peel strength and peel strength uniformity of the copper-clad plate, and obtains better economic benefit when being used for producing the thin copper foil paper-based copper-clad plate.
In order to achieve the above purpose, the solution of the invention is:
a copper foil adhesive for a high-peel-strength paper-based copper-clad plate is prepared by the following steps:
step one, synthesis of modified barium phenolic resin
1) Adding 2350 plus 2450 parts of phenol, 3000 plus 3200 parts of formaldehyde and 120 plus 140 parts of melamine formaldehyde resin into a reaction kettle, adding 25-28 parts of barium hydroxide under the condition of stirring, and then carrying out heating reaction;
2) after the reaction is finished, immediately vacuumizing and dehydrating under reduced pressure, wherein the vacuum degree reaches 0.03Mpa within 5 minutes, and the final vacuum degree is 0.08-0.09(5-10 minutes) Mpa; when the temperature is reduced to 70 ℃, the steam is heated greatly, and the steam pressure is less than 0.5 Mpa; when the dehydration temperature rises to 75 ℃, sampling and measuring the gelling time, reaching 90-110 seconds (160 ℃), stopping vacuumizing and adding 2300 parts of solvent; then stirring and cooling, and storing for later use;
step two, mixing and dissolving the prepared 260 parts of 240-poly-vinyl butyral and 18-22 parts of basic epoxy resin in 150-poly-vinyl butyral and 1310 parts of organic solvent to obtain the copper foil adhesive;
the parts are all parts by weight.
In the step 2), the solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol; in the second step, the organic solvent is 1000-1200 parts of methanol and 90-110 parts of acetone.
In the second step, firstly 1090-1310 parts of organic solvent is added into a dissolving tank, and under the condition of stirring, 150-160 parts of polyvinyl butyral is added, and the mixture is stirred and dissolved until the organic solvent is completely dissolved; and then adding 240-260 parts of modified barium phenolic resin and 18-22 parts of basic epoxy resin, and continuously stirring and dissolving to obtain the copper foil adhesive.
The copper foil adhesive is prepared from the following raw materials in parts by weight: 1200kg of methanol 1000-; the modified barium phenolic resin comprises the following synthetic materials in parts by weight: 2350-2450kg of phenol, 3000-3200kg of formaldehyde, 120-140kg of melamine-formaldehyde resin, 25-28kg of barium hydroxide, 380 kg of ethyl acetate and 1900kg of methanol.
The copper foil adhesive is prepared from the following raw materials in parts by weight: 1150kg of methanol, 100kg of acetone, 150kg of polyvinyl butyral, 250kg of modified barium phenolic resin and 20kg of basic epoxy resin; the modified barium phenolic resin comprises the following synthetic materials in parts by weight: 2400kg of phenol, 3150kg of formaldehyde, 120kg of melamine formaldehyde resin, 27kg of barium hydroxide, 396kg of ethyl acetate and 1800kg of methanol.
After the scheme is adopted, in the manufacturing process of the copper foil adhesive for the high-peel-strength paper-based copper-clad plate, the melamine formaldehyde resin modified barium phenolic resin is synthesized, and the modified barium phenolic resin, the polyvinyl butyral and the basic epoxy resin are mixed and dissolved in the organic solvent to prepare the copper foil adhesive, so that the peel strength and the uniformity of the peel strength of the copper-clad plate can be obviously improved.
The melamine modified barium phenolic resin prepared by the preparation method of the invention can obviously improve the heat resistance of the resin due to the introduction of a stable heterocyclic structure and the improvement of the crosslinking density of the resin, for example, the thermal decomposition temperature of the common phenolic resin is 380 ℃, and the melamine modified barium phenolic resin is 438 ℃. In the process of assembling electronic products, the defects of layering, bubbling, copper foil falling off and the like are not easy to occur. In addition, the polar groups in the system of the melamine modified barium phenolic resin are increased, and because the surfaces of metal or metal oxide are high-energy surfaces, the adhesive with strong polarity is easy to spread and wet on the surface of the copper foil, so that the bonding strength is improved, the peeling strength of the copper foil is improved, and the uniformity of the peeling strength is improved. The method is used for producing the thin copper foil paper-based copper-clad plate, and obtains better economic benefit.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments.
The invention relates to a copper foil adhesive for a high-peel-strength paper-based copper-clad plate, which comprises the following steps:
step one, synthesis of modified barium phenolic resin
1) Adding 2350 plus 2450 parts of phenol, 3000 plus 3200 parts of formaldehyde and 120 plus 140 parts of melamine formaldehyde resin into a reaction kettle, adding 25-28 parts of barium hydroxide under the condition of stirring, and then carrying out heating reaction;
adding the phenol, the formaldehyde and the melamine formaldehyde resin into a reaction kettle in sequence, stirring, adding barium hydroxide under the condition of stirring, stirring for 3-5 minutes, and starting heating reaction;
the temperature rise reaction is carried out, wherein the specific operation example is that the temperature is raised to 80 ℃ from the beginning for 15 +/-5 minutes; when the temperature rises to 80 ℃, the air valve is closed to naturally raise the temperature, the reaction time is calculated when the temperature rises to 90 ℃, the reaction time is 60 minutes, and the temperature is kept at 100 ℃.
2) After the reaction is finished, vacuumizing, decompressing and dehydrating, adding 380-2300 parts of solvent, stirring, cooling and storing for later use; a preferred example of the solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol.
After the reaction is finished, immediately decompressing and dehydrating, wherein the specific operation embodiment is that the vacuum degree reaches 0.03Mpa within 5 minutes, and the final vacuum degree is 0.08-0.09(5-10 min) Mpa; when the temperature is reduced to 70 ℃, the steam is started to be heated greatly, and the steam pressure is less than 0.5 Mpa; when the dehydration temperature rises to 75 ℃, sampling and measuring the gelling time, reaching 90-110 seconds (160 ℃), stopping vacuumizing and adding 2300 parts of solvent; and adding the solvent, stirring, cooling to 40 ℃, and stopping stirring for storage.
The synthetic materials and the proportion of the modified barium phenolic resin are shown in the following table.
Serial number | Name of raw material | Specification of | Batch (kg) |
1 | Phenol and its preparation | Industrial first grade | 2350-2450 |
2 | Formaldehyde (I) | 37% | 3000-3200 |
3 | Melamine formaldehyde resin | 45% | 120-140 |
4 | Barium hydroxide | C.P | 25-28 |
5 | Acetic acid ethyl ester | Qualified | 380-400 |
6 | Methanol | Qualified | 1700-1900 |
Specific examples of the synthetic materials and the compounding ratio of the modified barium phenolic resin are shown in the following table.
The quality indexes of the synthesized modified barium phenolic resin are shown in the following table.
Detecting items | Detection conditions | Detection standard |
Appearance of the product | At room temperature | Brownish red transparent liquid |
Gel time | 160±2℃ | 60-80 seconds |
Solids content | 140℃1H | 52-56% |
Step two, mixing and dissolving the prepared 240-260 parts of modified barium phenolic resin, 150-160 parts of polyvinyl butyral and 18-22 parts of basic epoxy resin in 1090-1310 parts of organic solvent to obtain the copper foil adhesive. The preferred examples of the organic solvent are 1000-1200 parts of methanol and 90-110 parts of acetone.
The dissolving operation step is preferably carried out by firstly adding 1090-1310 parts of organic solvent into a dissolving tank (sequentially adding methanol and acetone), adding 150-160 parts of polyvinyl butyral under stirring, and stirring for dissolving till complete dissolving, wherein the stirring and dissolving time is preferably not less than 8 hours; and then adding 240-260 parts of modified barium phenolic resin and 18-22 parts of basic epoxy resin, continuously stirring and dissolving (dissolving for 1 hour), then discharging the glue solution, sampling and testing, and obtaining and using the copper foil glue according with the standard.
The parts are all parts by weight.
The raw materials and the proportion of the copper foil adhesive are shown in the following table.
Serial number | Name of raw material | Specification of | Batch (kg) |
1 | Methanol | Qualified | 1000-1200 |
2 | Acetone (II) | Qualified | 90-110 |
3 | Polyvinyl butyral | Qualified | 150-160 |
4 | Modified barium phenolic resin | 50% | 240-260 |
5 | Basic epoxy resin | Qualified | 18-22 |
Specific examples are given in the following table for raw materials and proportions for copper foil adhesive formulation.
The quality indexes of the synthesized copper foil adhesive are shown in the following table.
Serial number | Name of item | Standard of merit |
1 | Appearance of the product | Yellow or brown transparent liquid |
2 | Solids content (150 ℃,1 hour) | 17-20% |
The copper foil adhesive prepared by the invention has the following application examples: coating the prepared copper foil adhesive on a roughened copper foil with the thickness of 15um or 12um, drying at 140-16 ℃ to remove the solvent, controlling the solubility of acetone to be 20-30%, and controlling the adhesive coating amount to be 14-16 g per square meter to prepare the adhesive coated copper foil. Laminating 1 glued copper foil and 8 paper-based prepregs at a density of 100Kg/cm2And hot pressing at 160 ℃ for 100 minutes to obtain the copper clad laminate with the thickness of 1.6 mm. The dip-soldering resistance (260 ℃) of the plate is more than 15 seconds, the peel strength is 1.2-1.4N/mm, and other performances meet the technical index requirements of CPFCP-04 in GB 4723-92 standard.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made within the scope of the claims of the present invention should fall within the scope of the claims of the present invention.
Claims (5)
1. The copper foil adhesive for the high-peel-strength paper-based copper-clad plate is characterized by comprising the following manufacturing steps:
step one, synthesis of modified barium phenolic resin
1) Adding 2350 plus 2450 parts of phenol, 3000 plus 3200 parts of formaldehyde and 120 plus 140 parts of melamine formaldehyde resin into a reaction kettle, adding 25-28 parts of barium hydroxide under the condition of stirring, and then carrying out heating reaction;
2) after the reaction is finished, immediately vacuumizing and decompressing for dehydration, wherein the vacuum degree reaches 0.03Mpa within 5 minutes, and finally reaches 0.08-0.09Mpa within 5-10 minutes; when the temperature is reduced to 70 ℃, the steam is heated greatly, and the steam pressure is less than 0.5 Mpa; when the dehydration temperature rises to 75 ℃, sampling and measuring the gelling time at 160 ℃ for 90-110 seconds, stopping vacuumizing and adding 2300 parts of 380-plus solvent; then stirring and cooling, and storing for later use;
step two, mixing and dissolving the prepared modified barium phenolic resin of 260 parts of 240-160 parts of polyvinyl butyral and the basic epoxy resin of 18-22 parts in organic solvent of 1310 parts of 1090-one to prepare the copper foil adhesive;
the parts are all parts by weight.
2. The copper foil adhesive for the high-peel-strength paper-based copper-clad plate as claimed in claim 1, wherein in the step one 2), the solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol; in the second step, the organic solvent is 1000-1200 parts of methanol and 90-110 parts of acetone.
3. The copper foil adhesive for the high-peel-strength paper-based copper-clad plate as claimed in claim 1, wherein in the second step, 1090-1310 parts of organic solvent is added into a dissolving tank, 150-160 parts of polyvinyl butyral is added under stirring, and the stirring and the dissolving are carried out until the copper foil adhesive is completely dissolved; and then adding 240-260 parts of modified barium phenolic resin and 18-22 parts of basic epoxy resin, and continuously stirring and dissolving to obtain the copper foil adhesive.
4. The copper foil adhesive for the high-peel-strength paper-based copper-clad plate, as claimed in claim 2, is prepared from the following raw materials in parts by weight: 1200kg of methanol 1000-; the modified barium phenolic resin comprises the following synthetic materials in parts by weight: 2350-2450kg of phenol, 3000-3200kg of formaldehyde, 120-140kg of melamine-formaldehyde resin, 25-28kg of barium hydroxide, 380 kg of ethyl acetate and 1900kg of methanol.
5. The copper foil adhesive for the high-peel-strength paper-based copper-clad plate, as claimed in claim 2, is prepared from the following raw materials in parts by weight: 1150kg of methanol, 100kg of acetone, 150kg of polyvinyl butyral, 250kg of modified barium phenolic resin and 20kg of basic epoxy resin; the modified barium phenolic resin comprises the following synthetic materials in parts by weight: 2400kg of phenol, 3150kg of formaldehyde, 120kg of melamine formaldehyde resin, 27kg of barium hydroxide, 396kg of ethyl acetate and 1800kg of methanol.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810650356.8A CN109082252B (en) | 2015-12-17 | 2015-12-17 | Copper foil adhesive for high-peel-strength paper-based copper-clad plate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810650356.8A CN109082252B (en) | 2015-12-17 | 2015-12-17 | Copper foil adhesive for high-peel-strength paper-based copper-clad plate |
CN201510951816.7A CN105542692B (en) | 2015-12-17 | 2015-12-17 | A kind of manufacturing method of paper-based copper-coated board copper foil glue |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510951816.7A Division CN105542692B (en) | 2015-12-17 | 2015-12-17 | A kind of manufacturing method of paper-based copper-coated board copper foil glue |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109082252A CN109082252A (en) | 2018-12-25 |
CN109082252B true CN109082252B (en) | 2021-01-08 |
Family
ID=55822265
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510951816.7A Active CN105542692B (en) | 2015-12-17 | 2015-12-17 | A kind of manufacturing method of paper-based copper-coated board copper foil glue |
CN201810650356.8A Active CN109082252B (en) | 2015-12-17 | 2015-12-17 | Copper foil adhesive for high-peel-strength paper-based copper-clad plate |
CN201810649919.1A Active CN108977144B (en) | 2015-12-17 | 2015-12-17 | Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510951816.7A Active CN105542692B (en) | 2015-12-17 | 2015-12-17 | A kind of manufacturing method of paper-based copper-coated board copper foil glue |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810649919.1A Active CN108977144B (en) | 2015-12-17 | 2015-12-17 | Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate |
Country Status (1)
Country | Link |
---|---|
CN (3) | CN105542692B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113388349B (en) * | 2021-05-13 | 2023-03-31 | 福建利豪电子科技股份有限公司 | Preparation process of copper foil adhesive special for high CTI (comparative tracking index) and application of copper foil adhesive to paper-based copper-clad plate |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3378630A (en) * | 1964-01-27 | 1968-04-16 | Westinghouse Electric Corp | Pressure sensitive thermosetting resinous adhesives and tapes |
US3450595A (en) * | 1964-09-08 | 1969-06-17 | Formica Int | Metal-clad laminates |
CN86100670B (en) * | 1986-01-21 | 1988-07-27 | 湖州绝缘材料厂 | Copper foil adhesion agent for copper-foil-covering laminated paper plate |
CN1876745A (en) * | 2005-06-09 | 2006-12-13 | 张瑞敬 | Modifier, additive for three aldehydes resin glue |
CN1865380A (en) * | 2006-06-19 | 2006-11-22 | 浙江林学院 | Energy-saving type modified alkyd resin glue and its production method |
CN101353405B (en) * | 2008-08-12 | 2011-06-29 | 中国西电集团公司 | Method for modifying tung oil modified phenolic resin with melamine |
CN102064273A (en) * | 2010-10-21 | 2011-05-18 | 电子科技大学 | Light-emitting diode (LED) and preparation method thereof |
CN102122695A (en) * | 2010-10-21 | 2011-07-13 | 电子科技大学 | Light-emitting diode and preparation method thereof |
CN102199264A (en) * | 2011-03-18 | 2011-09-28 | 江阴市明康绝缘玻纤有限公司 | Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive |
CN102153970A (en) * | 2011-03-18 | 2011-08-17 | 江阴市明康绝缘玻纤有限公司 | Adhesive applied to preparing copper clad laminate copper foils and substrates |
CN102732197A (en) * | 2011-04-12 | 2012-10-17 | 佛冈建滔实业有限公司 | Preparation process of adhesive suitable for adhesive coated copper foil |
CN103865477B (en) * | 2012-12-17 | 2017-04-05 | 西南林业大学 | A kind of cross-linking modified soybean albumen adhesive |
CN103059789A (en) * | 2012-12-26 | 2013-04-24 | 佛冈建滔实业有限公司 | Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering |
CN103613906B (en) * | 2013-11-22 | 2015-07-15 | 江苏星源航天材料股份有限公司 | Flame-resistant melamine-paraformaldehyde modified tung oil resin for copper-clad plate |
CN103978768A (en) * | 2014-04-07 | 2014-08-13 | 江阴市明康绝缘玻纤有限公司 | Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate |
CN104087220B (en) * | 2014-07-18 | 2016-01-20 | 福建隆达竹业有限公司 | A kind of laminated adhesive and preparation method thereof |
CN104231985A (en) * | 2014-08-15 | 2014-12-24 | 太仓康盛化工有限公司 | High-strength adhesive for bonding metal sheets and preparation method of high-strength adhesive |
CN104449499A (en) * | 2014-11-13 | 2015-03-25 | 山东永泰化工有限公司 | Phenolic resin adhesive and preparation method thereof |
CN110564346A (en) * | 2019-09-20 | 2019-12-13 | 上海昶法新材料有限公司 | Modified phenolic glue and preparation method thereof |
-
2015
- 2015-12-17 CN CN201510951816.7A patent/CN105542692B/en active Active
- 2015-12-17 CN CN201810650356.8A patent/CN109082252B/en active Active
- 2015-12-17 CN CN201810649919.1A patent/CN108977144B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108977144B (en) | 2021-01-08 |
CN108977144A (en) | 2018-12-11 |
CN109082252A (en) | 2018-12-25 |
CN105542692A (en) | 2016-05-04 |
CN105542692B (en) | 2018-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101591418B (en) | Method for preparing modified phenolic resin | |
CN108297519B (en) | Manufacturing method of paper-based copper-clad plate | |
CN103213356B (en) | Preparation method of bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate | |
CN111284088B (en) | Preparation method of heat-resistant modified phenolic paper-based copper-clad laminate | |
CN106313203A (en) | Method for producing total-eucalyptus plywood by adopting moisture-proof composite urea resin | |
CN101864053B (en) | Modified phenolic resin for bamboo structure material and preparation method thereof | |
CN109082252B (en) | Copper foil adhesive for high-peel-strength paper-based copper-clad plate | |
CN110734735B (en) | High-branched polymer wood adhesive and preparation method and application thereof | |
CN113388349B (en) | Preparation process of copper foil adhesive special for high CTI (comparative tracking index) and application of copper foil adhesive to paper-based copper-clad plate | |
CN103396666A (en) | Thermosetting resin composition and prepreg and laminated sheet prepared with thermosetting resin composition | |
CN106433017B (en) | A kind of glue solution for copper-clad plate, composite base 22F copper-clad plate and preparation method thereof | |
CN112920744A (en) | Amino acid modified polyvinyl alcohol efficient composite adhesive and preparation method and application thereof | |
CN114506135B (en) | Low-dielectric and low-dielectric-loss copper-clad plate, preparation method thereof and prepreg for copper-clad plate | |
CN205800386U (en) | A kind of high stability paper-based copper-coated board | |
CN114347588A (en) | High-frequency high-speed flame-retardant copper-clad plate and forming process thereof | |
CN113185751A (en) | Halogen-free silicon flame-retardant vinyl resin, preparation method thereof and application thereof in copper-clad plate | |
CN106928478B (en) | Preparation method of benzoxazine resin laminated board | |
CN111284089A (en) | Preparation method of tung oil anhydride modified phenolic paper-based copper-clad laminate | |
CN116478649B (en) | Wood adhesive based on biomass hyperbranched polyol-biomass polyacid, and preparation method and application thereof | |
CN110358252B (en) | Glue solution for producing lead-free high-reliability FR-4 copper-clad plate | |
CN110643321B (en) | Electronic material glue solution and application thereof | |
CN117757417A (en) | Lactose-based hyperbranched boiling-resistant water-type adhesive and preparation method thereof | |
CN114248319A (en) | Preparation method of formaldehyde-free thick-core plywood | |
CN115386323A (en) | Preparation method and application of novel phenolic resin adhesive | |
CN114350307A (en) | Ethyl maltol-resistant solvent-free polyurethane adhesive and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |