CN105542692B - A kind of manufacturing method of paper-based copper-coated board copper foil glue - Google Patents

A kind of manufacturing method of paper-based copper-coated board copper foil glue Download PDF

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CN105542692B
CN105542692B CN201510951816.7A CN201510951816A CN105542692B CN 105542692 B CN105542692 B CN 105542692B CN 201510951816 A CN201510951816 A CN 201510951816A CN 105542692 B CN105542692 B CN 105542692B
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parts
copper foil
paper
added
copper
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CN105542692A (en
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傅智雄
余青川
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SINOINFO ECOMMERCE Inc
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SINOINFO ECOMMERCE Inc
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Priority to CN201810650356.8A priority Critical patent/CN109082252B/en
Priority to CN201510951816.7A priority patent/CN105542692B/en
Priority to CN201810649919.1A priority patent/CN108977144B/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/12—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention discloses a kind of manufacturing method of paper-based copper-coated board copper foil glue, and steps are as follows：Step 1: the synthesis of modified ba phenolic resin：1）In 2,350 2450 parts of phenol, 3,000 3200 parts of formaldehyde and 120 140 parts of melamine resin are added in reaction kettle, 25 28 parts of barium hydroxide is added in the case of stirring, carries out temperature reaction later；2）After reaction, decompression dehydration is vacuumized, 380 2300 parts of solvent is added after the completion, is stirred later and cooling, deposit is for use；Step 2: by obtained 240 260 parts of modification ba phenolic resin and 150 160 parts of polyvinyl butyral, 18 22 parts of base epoxy resin mixed dissolution in 1,090 1310 parts of organic solvent, you can copper foil glue of the present invention is made.Copper foil glue obtained significantly improves the peel strength of copper-clad plate and the uniformity of peel strength, in the production of slim copper foil paper-based copper-coated board, achieving preferable economic benefit.

Description

A kind of manufacturing method of paper-based copper-coated board copper foil glue
Technical field
The present invention relates to paper-based copper-coated board manufacturing field, in particular to a kind of manufacturers of paper-based copper-coated board copper foil glue Method.
Background technology
Paper-based copper-coated board manufacture roughening copper foil used, with one layer of copper foil glue must be first applied before prepreg hot pressing cladding Glutinous agent, to meet the resistance to dip solderability requirement with peel strength of copper-clad plate product.Adhesive can also avoid making wiring board simultaneously When copper foil is etched after paper fiber it is exposed in the environment, increase water absorption rate, reduce insulation resistance, cause circuit board to fail.Therefore, Copper foil gluing agent prescription and its manufacturing process are the important components of paper-based copper-coated board production technology.Copper-clad plate production copper foil Develop to slimming direction, traditional paper-based copper-coated board copper foil is based on 35um thickness, and 18um thickness copper foil has accounted for master at present Lead status.15um, 13um thickness copper foil increase year by year in the use ratio of paper-based copper-coated board in recent years.With subtracting for copper thickness Few, the roughening layer thickness of adhesive surface is also being reduced, and the peel strength of product is affected, and in electronic product assembling process, is held Copper sheet obscission easily occurs, causes product rejection, economic loss serious.How to improve thin copper foil or extra thin copper foil paper substrate covers copper The peel strength of plate improves the reliability of electronic product, is paper-based copper-coated board production firm concern.
Invention content
The purpose of the present invention is to provide a kind of paper-based copper-coated board manufacturing method of copper foil glue, copper foil glue obtained is apparent The peel strength of copper-clad plate and the uniformity of peel strength are improved, in the production of slim copper foil paper-based copper-coated board, achieving Preferable economic benefit.
In order to achieve the above objectives, solution of the invention is：
A kind of paper-based copper-coated board manufacturing method of copper foil glue, its step are as follows：
Step 1: the synthesis of modified ba phenolic resin
1) in 2350-2450 parts of phenol of addition, 3000-3200 parts of formaldehyde and 120-140 parts of trimerization in reaction kettle Cyanamide formaldehyde resin is added 25-28 parts of barium hydroxide, carries out temperature reaction later in the case of stirring；
2) decompression dehydration after reaction, is vacuumized, 380-2300 parts of solvent is added after the completion, stirring later is simultaneously cold But, deposit is for use；
Step 2: by the modification ba phenolic resin of obtained 240-260 parts and 150-160 parts of polyvinyl alcohol contracting fourth Aldehyde, 18-22 parts of base epoxy resin mixed dissolution in 1090-1310 parts of organic solvent, you can copper foil of the present invention is made Glue；
Described part is parts by weight.
The 1 of the step 1) in carry out temperature reaction, from beginning to warm to 80 DEG C, the time is 15 ± 5 minutes；Work as temperature Nature heating, calculating reacting time when being warming up to 90 DEG C are carried out when rising to 80 DEG C, the reaction time is 60 minutes, keeps temperature 100 ℃。
The 2 of the step 1) in, reaction terminates decompression dehydration immediately, and vacuum degree reaches 0.03Mpa in 5 minutes, final true Reciprocal of duty cycle is 0.08-0.09 (5-10 points) Mpa；The big heating of steam when temperature is down to 70 DEG C, vapour pressure are less than 0.5Mpa；Dehydration temperaturre When ging up to 75 DEG C, gel time is surveyed in sampling, is reached 90-110 seconds (160 DEG C), and stopping vacuumizes and is added 380-2300 parts Solvent.
The 2 of the step 1) in, solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol.
In the step 2, first 1090-1310 parts of organic solvent is added in dissolving tank, is added in the case of stirring 150-160 parts of polyvinyl butyral, stirring and dissolving is until being completely dissolved；240-260 parts of modification barium is added later Phenolic resin and 18-22 parts of base epoxy resin continue stirring and dissolving, obtain copper foil glue of the present invention.
In the step 2, organic solvent is 1000-1200 parts of methanol and 90-110 parts of acetone.
After adopting the above scheme, a kind of manufacturing method of paper-based copper-coated board copper foil glue of the present invention, has synthesized a kind of trimerization Cyanamide formaldehyde resin is modified ba phenolic resin, and modified ba phenolic resin and polyvinyl butyral, base epoxy resin are existed Copper foil glue is made in mixed dissolution in organic solvent, can significantly improve the peel strength of copper-clad plate and the uniformity of peel strength.
By the cyanurotriamide modified ba phenolic resin obtained by preparation method of the present invention, due to introducing stable heterocycle The crosslink density of structure and resin improves, and the heat resistance of resin is remarkably improved, as the heat decomposition temperature of phenolic resin is 380 DEG C, be 438 DEG C after cyanurotriamide modified.In electronic product assembling process, it is not easy to which appearance layering, blistering, copper foil fall off The defects of.In addition, cyanurotriamide modified ba phenolic resin, system polar groups increase, due to metal or metal oxide Surface is all high energy surface, and highly polar adhesive is easy spreading wetting to copper foil surface, improves adhesion strength, improves copper foil Peel strength, and improve the uniformity of peel strength.In being produced for slim copper foil paper-based copper-coated board, preferable economy is achieved Benefit.
Specific implementation mode
The present invention will be further described in detail with reference to the specific embodiments.
The present invention relates to a kind of paper-based copper-coated board manufacturing methods of copper foil glue, and its step are as follows：
Step 1: the synthesis of modified ba phenolic resin
1) in 2350-2450 parts of phenol of addition, 3000-3200 parts of formaldehyde and 120-140 parts of trimerization in reaction kettle Cyanamide formaldehyde resin is added 25-28 parts of barium hydroxide, carries out temperature reaction later in the case of stirring；
The phenol, formaldehyde and melamine resin are sequentially added into reaction kettle and stir, the case where stirring Lower addition barium hydroxide, stirring start to warm up reaction in 3-5 minutes；
The temperature reaction, concrete operations embodiment are that, from beginning to warm to 80 DEG C, the time is 15 ± 5 minutes；Work as temperature When rising to 80 DEG C, closing porthole makes it heat up naturally, calculating reacting time when being warming up to 90 DEG C, and the reaction time is 60 minutes, is protected Hold 100 DEG C of temperature.
2) decompression dehydration after reaction, is vacuumized, 380-2300 parts of solvent is added after the completion, stirring later is simultaneously cold But, deposit is for use；One preferred embodiment of the solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol.
It is to reach 0.03Mpa in vacuum degree in 5 minutes that the reaction, which terminates decompression dehydration, concrete operations embodiment immediately, Final vacuum degree is 0.08-0.09 (5-10 points) Mpa；The big heating of steam is opened when temperature is down to 70 DEG C, vapour pressure is less than 0.5Mpa； When dehydration temperaturre is gone up to 75 DEG C, gel time is surveyed in sampling, is reached 90-110 seconds (160 DEG C), and stopping vacuumizes and 380- is added 2300 parts of solvent；Solvent stirs after being added, and is cooled to 40 DEG C, and it is for use to stop stirring deposit.
Shown in the synthetic material and proportioning table specific as follows of the modified ba phenolic resin.
Serial number Raw material title Specification Inventory (kg)
1 Phenol Industrial level-one 2350-2450
2 Formaldehyde 37% 3000-3200
3 Melamine resin 45% 120-140
4 Barium hydroxide C.P 25-28
5 Ethyl acetate It is qualified 380-400
6 Methanol It is qualified 1700-1900
For the synthetic material and proportioning of modified ba phenolic resin, provide shown in the following table of a specific embodiment.
Serial number Raw material title Specification Inventory (kg)
1 Phenol Industrial level-one 2400
2 Formaldehyde 37% 3150
3 Melamine resin 45% 120
4 Barium hydroxide C.P 27
5 Ethyl acetate It is qualified 396
6 Methanol It is qualified 1800
Synthesized modified ba phenolic resin obtained, quality index is with reference to shown in lower table.
Detection project Testing conditions Examination criteria
Appearance Room temperature Brownish red transparency liquid
Gel time 160±2℃ 60-80 seconds
Solid content 140℃ 1H 52-56%
Step 2: by the modification ba phenolic resin of obtained 240-260 parts and 150-160 parts of polyvinyl alcohol contracting fourth Aldehyde, 18-22 parts of base epoxy resin mixed dissolution in 1090-1310 parts of organic solvent, you can copper foil of the present invention is made Glue.The organic solvent preferred embodiment is 1000-1200 parts of methanol and 90-110 parts of acetone.
Dissolving operating procedure preferred embodiment is that first 1090-1310 parts of organic solvent is added and (first is successively added in order Alcohol and acetone) in dissolving tank, 150-160 parts of polyvinyl butyral is added in the case of stirring, stirring and dissolving is until complete Until fully dissolved, the stirring and dissolving time is preferably no fewer than 8 hours；Later be added 240-260 part modification ba phenolic resin with 18-22 parts of base epoxy resin continues stirring and dissolving (dissolving 1 hour), later releases glue, sampling and testing, meet mark Standard obtains copper foil glue of the present invention and uses.
Above-described part is parts by weight.
Shown in the raw material and the following table of proportioning that the copper foil glue is prepared.
Serial number Raw material title Specification Inventory (kg)
1 Methanol It is qualified 1000-1200
2 Acetone It is qualified 90-110
3 Polyvinyl butyral It is qualified 150-160
4 Modified ba phenolic resin 50% 240-260
5 Base epoxy resin It is qualified 18-22
The raw material and proportioning prepared for copper foil glue, provide shown in the following table of a specific embodiment.
Serial number Raw material title Specification Inventory (kg)
1 Methanol It is qualified 1150
2 Acetone It is qualified 100
3 Polyvinyl butyral It is qualified 150
4 Modified ba phenolic resin 50% 250
5 Base epoxy resin It is qualified 20
Synthesized copper foil glue obtained, quality index is with reference to shown in lower table.
Serial number Project name Standard
1 Appearance Yellow or amber transparent liquid
2 Solid content (150 DEG C, 1 hour) 17-20%
Copper foil glue application example produced by the present invention is as follows：The above prepared copper foil glue is coated in 15um or 12um thickness On the roughening copper foil of degree, through drying and removing solvent at 140-16 DEG C, and acetone soluble 20-30% is controlled, glue-spread is often put down Square rice 14g-16g, is made adhesive coated foil.It is overlapped with 1 adhesive coated foil and 8 paper substrate prepregs, in 100Kg/cm2, 160 DEG C Under the conditions of hot pressing 100 minutes, that is, the copper-clad laminate that thickness is 1.6mm is made.Plank resistance to dip solderability (260 DEG C) 15 seconds with On, peel strength 1.2-1.4N/mm, other performances reach CPFCP-04 technical requirements in GB 4723-92 standards.
The foregoing is merely the preferred embodiment of the present invention, all equivalent changes done with scope of the invention as claimed and Modification, should all belong to the range of the claims in the present invention.

Claims (6)

1. a kind of paper-based copper-coated board manufacturing method of copper foil glue, which is characterized in that steps are as follows：
Step 1: the synthesis of modified ba phenolic resin
1) in 2350-2450 parts of phenol of addition, 3000-3200 parts of formaldehyde and 120-140 parts of melamine in reaction kettle Formaldehyde resin is added 25-28 parts of barium hydroxide, carries out temperature reaction later in the case of stirring；
2) decompression dehydration after reaction, is vacuumized, 380-2300 parts of solvent is added after the completion, is stirred later and cooling, storage It is standby for use；
Step 2: polyvinyl butyral, 18- by the modification ba phenolic resin of obtained 240-260 parts with 150-160 parts 22 parts of base epoxy resin mixed dissolution in 1090-1310 parts of organic solvent, you can the copper foil glue is made；
Described part is parts by weight.
2. a kind of manufacturing method of paper-based copper-coated board copper foil glue as described in claim 1, which is characterized in that the step 1 1) in carry out temperature reaction, from beginning to warm to 80 DEG C, the time is 15 ± 5 minutes；Nature is carried out when temperature rises to 80 DEG C Heating, calculating reacting time when being warming up to 90 DEG C, reaction time are 60 minutes, keep 100 DEG C of temperature.
3. a kind of manufacturing method of paper-based copper-coated board copper foil glue as described in claim 1, which is characterized in that the step 1 2) in, reaction terminates decompression dehydration immediately, and vacuum degree reaches 0.03Mpa in 5 minutes, finally the vacuum in 5-10 minutes Degree reaches 0.08-0.09Mpa；The big heating of steam when temperature is down to 70 DEG C, vapour pressure are less than 0.5Mpa；Dehydration temperaturre is gone up to 75 DEG C when, sample simultaneously survey gel time under the conditions of 160 degree, reach 90-110 seconds, stop vacuumize and be added 380-2300 parts Solvent.
4. a kind of manufacturing method of paper-based copper-coated board copper foil glue as described in claim 1 or 3, which is characterized in that the step The 2 of rapid one) in, solvent is 380-400 parts of ethyl acetate and 1700-1900 parts of methanol.
5. a kind of manufacturing method of paper-based copper-coated board copper foil glue as described in claim 1, which is characterized in that the step 2 In, first 1090-1310 parts of organic solvent is added in dissolving tank, 150-160 parts of polyethylene is added in the case of stirring Butyral, stirring and dissolving is until being completely dissolved；Later be added 240-260 parts modification ba phenolic resin and 18-22 parts Base epoxy resin, continue stirring and dissolving, obtain the copper foil glue.
6. a kind of manufacturing method of paper-based copper-coated board copper foil glue as described in claim 1 or 5, which is characterized in that the step In rapid two, organic solvent is 1000-1200 parts of methanol and 90-110 parts of acetone.
CN201510951816.7A 2015-12-17 2015-12-17 A kind of manufacturing method of paper-based copper-coated board copper foil glue Active CN105542692B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201810650356.8A CN109082252B (en) 2015-12-17 2015-12-17 Copper foil adhesive for high-peel-strength paper-based copper-clad plate
CN201510951816.7A CN105542692B (en) 2015-12-17 2015-12-17 A kind of manufacturing method of paper-based copper-coated board copper foil glue
CN201810649919.1A CN108977144B (en) 2015-12-17 2015-12-17 Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate

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CN201510951816.7A CN105542692B (en) 2015-12-17 2015-12-17 A kind of manufacturing method of paper-based copper-coated board copper foil glue

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CN201810649919.1A Division CN108977144B (en) 2015-12-17 2015-12-17 Method for manufacturing copper foil adhesive for thin paper-based copper-clad plate

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CN201810650356.8A Active CN109082252B (en) 2015-12-17 2015-12-17 Copper foil adhesive for high-peel-strength paper-based copper-clad plate
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Publication number Priority date Publication date Assignee Title
CN113388349B (en) * 2021-05-13 2023-03-31 福建利豪电子科技股份有限公司 Preparation process of copper foil adhesive special for high CTI (comparative tracking index) and application of copper foil adhesive to paper-based copper-clad plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101353405A (en) * 2008-08-12 2009-01-28 西安电力机械制造公司 Method for modifying tung oil modified phenolic resin with melamine
CN103978768A (en) * 2014-04-07 2014-08-13 江阴市明康绝缘玻纤有限公司 Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378630A (en) * 1964-01-27 1968-04-16 Westinghouse Electric Corp Pressure sensitive thermosetting resinous adhesives and tapes
US3450595A (en) * 1964-09-08 1969-06-17 Formica Int Metal-clad laminates
CN86100670B (en) * 1986-01-21 1988-07-27 湖州绝缘材料厂 Copper foil adhesion agent for copper-foil-covering laminated paper plate
CN1876745A (en) * 2005-06-09 2006-12-13 张瑞敬 Modifier, additive for three aldehydes resin glue
CN1865380A (en) * 2006-06-19 2006-11-22 浙江林学院 Energy-saving type modified alkyd resin glue and its production method
CN102064273A (en) * 2010-10-21 2011-05-18 电子科技大学 Light-emitting diode (LED) and preparation method thereof
CN102122695A (en) * 2010-10-21 2011-07-13 电子科技大学 Light-emitting diode and preparation method thereof
CN102199264A (en) * 2011-03-18 2011-09-28 江阴市明康绝缘玻纤有限公司 Preparation method of water-soluble phenolic resin applied to preparation of copper-clad foil laminated board adhesive
CN102153970A (en) * 2011-03-18 2011-08-17 江阴市明康绝缘玻纤有限公司 Adhesive applied to preparing copper clad laminate copper foils and substrates
CN102732197A (en) * 2011-04-12 2012-10-17 佛冈建滔实业有限公司 Preparation process of adhesive suitable for adhesive coated copper foil
CN103865477B (en) * 2012-12-17 2017-04-05 西南林业大学 A kind of cross-linking modified soybean albumen adhesive
CN103059789A (en) * 2012-12-26 2013-04-24 佛冈建滔实业有限公司 Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering
CN103613906B (en) * 2013-11-22 2015-07-15 江苏星源航天材料股份有限公司 Flame-resistant melamine-paraformaldehyde modified tung oil resin for copper-clad plate
CN104087220B (en) * 2014-07-18 2016-01-20 福建隆达竹业有限公司 A kind of laminated adhesive and preparation method thereof
CN104231985A (en) * 2014-08-15 2014-12-24 太仓康盛化工有限公司 High-strength adhesive for bonding metal sheets and preparation method of high-strength adhesive
CN104449499A (en) * 2014-11-13 2015-03-25 山东永泰化工有限公司 Phenolic resin adhesive and preparation method thereof
CN110564346A (en) * 2019-09-20 2019-12-13 上海昶法新材料有限公司 Modified phenolic glue and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101353405A (en) * 2008-08-12 2009-01-28 西安电力机械制造公司 Method for modifying tung oil modified phenolic resin with melamine
CN103978768A (en) * 2014-04-07 2014-08-13 江阴市明康绝缘玻纤有限公司 Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"常温固化耐高温酚醛树脂胶粘剂的研制";庞金兴等;《武汉工业大学学报》;20000630;第22卷(第3期);第6-8页 *
"胶合板用快速固化酚醛树脂胶黏剂";王健等;《东北林业大学学报》;20101231;第38卷(第12期);第75-76页 *

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CN108977144B (en) 2021-01-08
CN108977144A (en) 2018-12-11
CN109082252A (en) 2018-12-25
CN105542692A (en) 2016-05-04
CN109082252B (en) 2021-01-08

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