CN109076710A - 具有嵌入式多层电子器件的多层结构 - Google Patents

具有嵌入式多层电子器件的多层结构 Download PDF

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Publication number
CN109076710A
CN109076710A CN201780023589.9A CN201780023589A CN109076710A CN 109076710 A CN109076710 A CN 109076710A CN 201780023589 A CN201780023589 A CN 201780023589A CN 109076710 A CN109076710 A CN 109076710A
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China
Prior art keywords
substrate film
substrate
film
component
electric characteristic
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CN201780023589.9A
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CN109076710B (zh
Inventor
亚尔莫·萨斯基
亚尔科·托威宁
帕斯·拉帕娜
米科·海基宁
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Tactotek Oy
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Tactotek Oy
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Abstract

一种用于电子装置的集成多层组件(100、200、300)，包括第一衬底膜(106)，其配置成在其至少第一侧上容纳电气特征，所述第一衬底膜具有第一侧和基本上相对的第二侧，第二衬底膜(202)，其配置成在其至少第一侧上容纳电气特征，所述第二衬底膜具有第一侧和基本上相对的第二侧，第一和第二衬底膜的第一侧被配置为彼此面对，第一衬底膜的第一侧上的至少一个电气特征(214B)，第二衬底膜的第一侧上的至少一个其他电气特征(214A)，以及第一和第二衬底膜之间的模制塑料层(204)，至少部分地嵌入它们的第一侧上的电气特征。提出了一种相关的制造方法。

Description

具有嵌入式多层电子器件的多层结构
发明领域
通常，本发明涉及多层结构，该多层结构关联于电子器件，相关装置和有关制造方法。特别地，然而不排他地，本发明涉及在多层堆叠中提供功能元件诸如电子器件。
背景技术
通常，在例如电子器件和电子产品，诸如各种电子装置的背景中，存在有各种不同的堆叠组件和结构。
在常见结构中堆叠元件背后的动机可以与有关的使用背景一样多样化。当所得到的优化解决方案最终显示多层性质时，寻求仅仅例如在制造工艺或物流方面的部件的有效集成或相对经常的尺寸节省、重量节省、成本节省、可用性益处。而相关的使用情境可以涉及产品包装或食品盒、装置外壳的视觉设计、可穿戴电子器件、个人电子装置、显示器、检测器或传感器、车辆内饰、天线、标签、车辆并且尤其是车用电子器件等。
电子器件，诸如电子部件、IC(集成电路)和导体，通常可以通过许多种不同的技术设置到衬底元件上。例如，现成电子器件，诸如各种表面安装装置(SMD)，可以安装在衬底表面上，其最终构建多层结构的内部或外部界面层。另外，属于术语“印刷电子器件(printedelectronics)”的技术来实际上将电子器件直接和附加地生产到相关衬底。在该背景中，术语“印刷”是指能够通过基本上增材印刷工艺从印刷品生产电子器件/电气元件的各种印刷技术，包括但不限于丝网印刷、柔版印刷(苯胺印刷)和喷墨印刷。所使用的衬底可以是柔性的并且是有机的印刷材料，然而，其并非总是如此。
衬底，诸如塑料衬底膜，可以进行加工，例如，(热)成型或模制。实际上，使用例如注塑模制，塑料层可以设置在膜上，然后可能嵌入多个元件，诸如电子部件，其存在于膜上。塑料层可具有不同的机械、光学、电学、电气等性质。所获得的多层或堆叠结构可以被配置用于各种目的，其取决于所包括的特征，诸如电子器件，以及预期的使用方案和有关的使用环境。例如，它可以包括一个或多个连接特征，诸如锚爪型突起，用于与主体元件的兼容凹槽耦接，或反之亦然。
然而，由于电子器件可能不总是相关产品中最高优先级或最重要的关键或唯一特征，并且它们实际上可能仅被视为补充，任选特征，提供所需电气效应的特征的实现和设计应认真执行。所得产品和制造阶段的通常增加的总体复杂性以及重量和尺寸要求、提高的功耗、额外的设计考虑、新的工艺步骤都是众多缺点的实例，这些缺点容易变得实体化，作为在目标解决方案中采用各种电子特征的副作用。
鉴于上述情况，在许多现实制造方案中，在衬底膜上装配所有所需的电子或通常电气特征已经变得非常有挑战性，如果有可能的话，这是由于可用于在其上安装或产生特征的有限表面面积，以及例如必要的物理分离，一些元件应该在任何情况下必须以最佳或甚至适当的方式发挥作用衬底。此外，在一些应用中，在彼此相邻或处于一定距离的公共衬底上放置若干特征，这在任何情况下都是次优的，因为特征的所得到的相当有限的空间分离降低了所实现的功能(例如其可以是传感功能)的可实现的空间分辨率。
发明内容
本发明的目的是至少减轻设置有嵌入式电气特征(诸如电子特征)的各种装置或其他主体元件的情况下与现有解决方案相关的一个或多个上述缺点。
该目的利用根据本发明的多层组件和有关制造方法的实施方式实现。
根据本发明的一实施方式，一种用于电子装置的集成多层组件包括：
优选柔性的(可弯曲的，弹性的)第一衬底膜，被配置为在其至少第一侧上容纳电气特征，诸如传导迹线(导电线路)和电子部件，例如SMD(表面安装装置)，所述第一衬底膜具有第一侧和基本上相对的第二侧，
优选柔性的第二衬底膜，被配置为在其至少第一侧上容纳电气特征，诸如传导迹线和电子部件，所述第二衬底膜具有第一侧和基本上相对的第二侧，第一和第二衬底膜的第一侧被配置为彼此面对，
在第一衬底膜的第一侧上的至少一个电气特征，
在第二衬底膜的第一侧上的至少一个其他电气特征，和
在第一和第二衬底膜之间的模制塑料层，并且至少部分地嵌入其第一侧上的电气特征。
膜可以与模制层相邻并且接触。优选地，在膜之间已经模制该层，使得膜和该层附接在一起并且构建堆叠的多层组件。
在一种实施方式中，在任一或两个衬底膜上的至少一个上述电气特征包括或限定用于传感的电极。例如，一个或多个电极可以用作电容的手势和/或触摸传感布置的一部分。因此，至少两个堆叠的并且任选地重叠的(在组件的厚度方向上)电极，优选在每个膜上的至少一个，可以构成电极结构的至少一部分，用于检测例如在多层组件上或更通常在多层组件附近的触摸或3d手势的目的。
在一种实施方式中，无论是补充的还是替代的，任一或两个衬底膜被成型(例如热成型)为所需的3d形状。成型可在将至少一些电气特征(诸如电子部件)定位在膜上之后，任选地发生。最初，在成形之前，膜可以是平面的，并且至少一些特征可以定位在其上的选定位置。优选地，选择位置使得随后的成型不会直接对其施加过大的应力，以避免已经定位的特征或它们的相互连接(诸如衬底上的迹线)的破坏。
在一些实施方式中，任一或两个膜上的特征可包括光源或光检测器。例如，许多LED可以定位在(一个或多个)膜上。替代地或额外地，光检测器，诸如光电二极管或光电晶体管或光伏装置可以包括在(一个或多个)膜上或通常在组件内。
考虑到预定频率或频带，任选可见光，塑料层可以包含光学上至少半透明的，任选透明的材料。该层可以构建用于透射光的光导层，例如，从嵌入式光源到环境或从环境或嵌入式光源到嵌入式检测器。
在一些实施方式中，组件还可在任一或两个膜的(一个或多个)第二表面上包含至少一个附加层，诸如保护性的、美学和/或连接层。
考虑到预定频率或频带，第一衬底膜可以是光学上基本上不透明、半透明或透明的。膜可以显示一种选定颜色或多种选定颜色。由嵌入式或外部光源发射的频率(并且可能由任选的光检测器捕获)可以由衬底膜吸收、反射或透射。类似的考虑适用于第二衬底膜。
然而，任一或两个衬底膜可以在其第二侧上设置有功能特征，诸如电气或特别是电子特征。
在一些实施方式中，任一或两个衬底膜可以包括图形，诸如符号、图案、文本、图片等。这可以使用IML/IMD(模内标签，模内装饰)技术提供。
(一个或多个)附加层可以直接生产或层压到衬底膜和其之间的模制塑料层的聚集体上。层压可以包含施加热量、压力和/或粘合剂。
根据另一实施方式，构建用于电子装置的集成多层组件的方法包括：
获得优选柔性的第一衬底膜，被配置为在其至少第一侧上容纳电气特征，诸如传导迹线和电子部件，例如SMD(表面安装装置)，所述第一衬底膜具有第一侧和基本上相对的第二侧，
获得优选柔性的第二衬底膜，被配置为在其至少第一侧上容纳电气特征，诸如传导迹线和电子部件，所述第二衬底膜具有第一侧和基本上相对的第二侧，
在第一衬底膜的第一侧上设置至少一个电气特征，
在第二衬底膜的第一侧上设置至少一个其他电气特征，
将第一和第二衬底膜布置在模具中，优选地每个半模具有一个膜，使得其第一侧被配置成以基本上隔开的关系彼此面对，并且
在第一和第二衬底膜之间模制塑料层，并且至少部分地嵌入其第一侧上的电气特征。
模制方法优选为注塑模制。已经设置有其他特征诸如电子器件的衬底膜可以用作插入件。
如技术人员所理解的，本文提出的关于组件的实施方式的不同考虑可以作必要的修正而灵活地应用于本方法的实施方式，并且反之亦然。
取决于实施方式，本发明的实用性源于许多个问题。
所获得的多层结构通常可以保持相对轻和紧凑，例如薄，而它保持坚固并且保护嵌入的功能特征和显示例如在尺寸、形状、颜色和/或图形图案方面的所需的外观。
在其两者上设置两个衬底膜和特别是电气特征，诸如迹线、电极、电子部件和/或通常的元件，在安装空间或可用表面面积和整体空间可配置性方面产生显着的益处。例如，由例如传导性印刷材料构建成的一个或多个电极垫或电极区域可以以空间上所需的样式(例如，在组件的厚度方向上，即在行进通过组件的层的方向上至少部分地重叠)设置到两个膜，其使能够以协作的组合进行在组件上的用户输入或通常的手势(例如3d手势)的准确的电容的传感。可以检测触摸和非接触手势两者。或者，用于检测例如触摸的一个或多个电极或通常的传感元件可以设置在正面的(当使用时)衬底膜上，仅用以便于解决方案的触摸检测，其中远离组件表面上的触摸位置的背面膜仅设置有传感元件。
所使用的热塑性模制材料可以针对各种目的优化，包括固定电子器件，考虑了模制工艺。然而，可以将模制材料任选地与其他所使用的材料一起配置成保护嵌入式特征(诸如电子器件)免受例如环境条件，诸如潮湿、热量、寒冷、污垢、震动等。
在光学应用的情况下，嵌入式光电子器件诸如光源或检测器与模制光导材料之间的光耦合可以是强的，具有低损耗并且没有实质上的伪像。相关的制造工艺的相对简单性产生益处，该益处自身参考例如相关的相当可容忍的装置和材料成本、空间、加工时间、物流和存储要求。
然而，组件可以显示选定的外观或例如通过以下配置对观察者(诸如操作者)的触觉感觉：表面图形、嵌入的图形(例如可以通过窗口仍然可见)、具有不同表面轮廓的表面材料、通常的形状等。
嵌入的特征可以通过印刷而安装或直接生产在衬底膜上。优选的印刷技术是增材制造(印刷电子器件技术)并且包括例如丝网印刷、柔版印刷和喷墨。
表述“多个(a number of)”在本文中可以指从一(1)开始的任何正整数。
表述“许多个(a plurality of)”可以分别指从二(2)开始的任何正整数。
序数，诸如“第一”和“第二”在本文中用于将一个元素与其他元素区分开，而不是特别地对它们排出优先级或排序，如果没有另外明确说明。
除非另外明确指出，否则术语“膜(film)”和“箔(foil)”在本文中通常可互换使用。
在所附的从属权利要求中公开了本发明的不同实施方式。
附图的简要说明
接下来将参考所附附图更详细地描述本发明，在附图中：
图1示出了根据本发明的多层组件的一种实施方式。
图2是根据本发明的多层结构的实施方式的截面侧视图。
图3概念性地示出了用于获取本发明的多层组件和该组件的相关元件的制造工艺的一种实施方式。
图4是公开根据本发明的方法的实施方式的流程图。
具体实施方式
在各种实施方式中，任一或两个衬底膜可包含至少一个窗口，该至少一个窗口由相关材料层中的开口，诸如通孔、片状物(襟片，折片)或切口限定。
(一个或多个)窗口可任选地包含不同于膜的材料的填充材料。考虑到所选择的，例如，可见的，(一种或多种)波长，任选玻璃或塑料，诸如上釉，该材料任选地在光学上是半透明或透明的。例如，它可以限定光学功能元件，诸如透镜、棱镜或其他折射元件和/或衍射元件。
(一个或多个)窗口可显示所需的指示和/或装饰形状，诸如数字、符号、图形图案和/或图片、文本的至少部分形状。然而，当可适用时，窗口材料可以具有选定的颜色。
在各种实施方式中，模制层的材料可以构建窗口填充物的至少一部分。该材料可以限定例如来自波导层的突起，其容纳在由衬底膜和任选可能的另外的相邻层限定的窗口中。在一些实施方式中，模制材料还可以构建组件的外部(顶部)表面的至少一部分。
在各种实施方式中，除在其任一或两侧上的模制材料和衬底膜之外，组件可以包含另外的膜或通常的层。
例如，覆盖层(罩层)可以由任一衬底膜上的至少一个覆盖元件(罩元件)，诸如膜或板或沉积涂层来提供。覆盖层还可以任选地包含窗口，该窗口用于启动例如由组件的嵌入式光源发射的光通过环境或外部光以进入组件，例如其是在模制材料内的。窗口可以是对齐的并且至少部分地与下面的衬底部层的窗口重叠。它可以具有相同或不同尺寸。
覆盖的(一种或多种)材料可包括例如塑料、玻璃、皮革、织物、有机的或通常的纤维材料。在一些实施方式中，考虑到例如，由组件的内部光源和/或外部光源发射的波长，材料可以是基本上半透明或透明的。在一些其他实施方式中，它可以是基本上不透明的。覆盖(罩)可以具有例如橡胶或橡胶的表面。表面材料和拓扑结构(表面形式)可以被优化以提供所需的感觉和/或美学性能，除了或代替例如绝缘(例如湿和/或热)或阻尼性能。覆盖层可以是柔性的、弹性的或硬性/刚性的。
覆盖层可以保护组件和/或便于其附接到主体装置，例如，如果组件没有经由任一衬底膜来固定到主体。覆盖层，或在一些方案中，直接地(一个或多个)衬底膜可以因此包含附接特征，诸如粘合材料和/或(一个或多个)机械固定结构，例如，为了该目的，以凸台/底座、夹子、挂钩、凹槽等的形式。
因此，取决于所使用的层材料，它们的厚度，和例如，嵌入式元件，整个组件通常可以是柔性的或刚性/硬性的。
在各种实施方式中，衬底膜可包含塑料、金属、玻璃、皮革、织物、有机的和/或纤维材料(例如纸或卡板)。优选地，衬底膜是电绝缘(介电)材料，或至少包含电绝缘(介电)材料。衬底膜可以相互具有与所使用的材料相似或不同的配置，例如它们的光学透明度、柔韧性，主体特征，诸如电子器件、层厚度和/或形状。
考虑到所选择的(一种或多种)波长，衬底膜可以是光学上不透明、半透明或透明的。由组件的外部或内部光源发射的并且随后入射在衬底上的光能够至少部分地被任一或两个衬底膜吸收或穿透(透射)，这取决于其布置和元件的所使用的材料，相应的折射率和通常的配置，例如几何结构和表面拓扑结构。然而，衬底膜可以至少局部反射并且包含反射(表面)材料，例如，以涂层或更彻底的形式。
在各种实施方式中，考虑到所选择的(一种或多种)波长，例如可见光，模制塑料层可以是光学上基本上不透明、半透明或透明的。在一些实施方式中，模制层可以配置为用作光导。它可以传输由组件的内部光源发射的光，任选地设置在(一个或多个)衬底膜上并且至少部分地嵌入模制材料中，和/或外部光。
在各种实施方式中，优选通过热成型，诸如压力成型，真空成型或液压成型，将衬底形成为所需的基本上三维(非平面)，例如，弯曲的、有角的或起伏的形状，相对于其自身厚度，这是在设置例如其上的模制层之前或之时。在成型之前，可在衬底上设置电气特征，诸如以印刷电子器件和/或安装部件形式的电子器件。所得到的3d形状可比初始膜厚几倍。附加地或替代地，可以在成型之后将这些特征设置到衬底。
多层组件通常可以是基本上平面的或平的。因此，组件的宽度和长度的数量级可以不同于高度(层堆叠的方向)，即“厚度”，其可以小得多。例如，厚度可以仅为几毫米或更小，而宽度和长度可以是若干厘米或更多，甚至大得多，这取决于实施方式。厚度可以是恒定的，或者其可以改变，考虑例如在一些实施方式中，组件的形状可通常符合的盘的通常的形状。
在一些实施方式中，代替光源或除了光源之外，许多光接收器或检测器，诸如光电二极管、光电晶体管，其他合适的光电元件，或者例如光伏元件(例如太阳能电池)被设置在(一个或多个)衬底膜上。可以将它们至少部分地通过模制而嵌入在已构建的塑料层的内部。这些元件被配置成捕获或通常传感那些通过(一个或多个)衬底或者例如上述(一个或多个)窗口接收的和/或由内部光源发射的并且在塑料光导层内传播的光。例如，可以利用传感数据来调整光源。
在各种实施方式中，包括在组件中的电气特征，如设置在衬底膜上和/或在其(一个或多个)其他层或(一个或多个)元件上，通常可包括选自由以下组成的组中的至少一种元件：传导迹线、印刷传导迹线、接触垫、部件、集成电路(芯片)、处理单元、存储器、通信单元、收发器、发射器、接收器、信号处理器、微控制器、电池、光发射装置、光传感装置、光电二极管、连接器、电气连接器、光学连接器、二极管、OLED(有机LED)、印刷电子部件、传感器、力传感器、天线、加速度计、陀螺仪、电容式开关或传感器、电极、传感器电极、印刷电极、印刷传感器电极和光伏电池。这些特征可以借助于印刷电子器件技术(例如丝网印刷或喷墨，或其他增材制造方法)印刷和/或安装。这些特征可以至少部分地嵌入，例如，在模制的光导层中或在不同的层之间。例如，一些特征诸如连接器(可以布置成向组件提供电力)可以至少部分地暴露于组件的环境。
如在上文中所暗指的，(一个或多个)覆盖层、(一个或多个)相关的可能的窗口填充材料、衬底膜、模制层和/或组件的其他元件可以设置有视觉上可区分的、装饰性的/美学的和/或信息性的特征，诸如其上或其中的颜色和/或图形图案。特征可以嵌入在其外部表面下方的组件中和/或设置在其外部表面上。因此，IML(模内标签)/IMD(模内装饰)技术适用于制造这些特征。
在各种实施方式中，所使用的模具可以结合在模制塑料层中构建其相应镜像特征的表面形状。形状/特征可以包括例如突起、光栅、凸台、凸台底座、凹槽、凹部、脊、孔或切口。
参考所附附图，图1在100处示出了根据本发明的多层组件的一种实施方式，特别是其外部。
所描绘的仅示例性的组件100通常具有稍微平的或平面的盘形状，具有低侧壁，如果有的话。组件100的外部表面至少部分地由其上的任选(一个或多个)覆盖层108或衬底膜106限定。任选地，基本上透明的或至少半透明的，在该示例中圆形的窗口116A可以没有材料或者包含圆形的基本上平面的透明或半透明材料的板，例如塑料或玻璃。
本领域技术人员理解的事实是，可以基于光学、维度(尺寸)和美学目的在具体情况下确定最佳形状。
在其他可行的实施方式中，组件100和相关元件可以具有更多的三维形状，因此也具有相当大的厚度或“高度”。
所示组件100围绕其厚度/高度轴线具有强(圆形的)对称性，但是在一些其他实施方式中，其部件中的至少一个或多个或组件具有不同的对称性或基本上完全不对称(非对称的)。
图2经由截面侧视图示出了根据本发明的多层组件的实施方式200。因此，该主要概念上的表示可以覆盖例如图1的实施方式和各种其他实施方式。考虑到图1，例如可以沿着线A-A截取视图。图3在300处说明了本质上相同或类似的实施方式，特别是从制造工艺和层状构造的角度来看。在图3中，所示的层厚度仅是示例性的，但也可以反映相对厚度方面的现实方案。例如，任一或两个衬底106、202可以具有膜类型(具有例如约0.1毫米的厚度)，而例如模制层204可以基本上更厚，例如，一或几毫米或更多。
衬底106、202设置有元件，诸如电气传导迹线(导体)210，电极214A、214B，电子部件212、214，诸如光源214，光接收器/传感器，集成电路等，如上文中所述，至少在其第一侧上(图中的顶部/上表面)。另外，这种元件314A可以设置在其两侧/表面上和/或嵌入其中，任选地至少部分地在优选热塑性材料的层204的模制之后。
除了结构上经由模制层204之外，衬底106、202还可以在功能上，例如在电学上，连接在一起以实现例如在它们之间的信号传输和/或当前设置。
衬底106、202之间的连接230可以通过使用传导元件诸如金属脚线(销)、柔性电路等实现。在一些实施方式中，也可以应用无线连接(例如，射频或光学)。
可以构建(有线)连接230，在模制之后，或在使用例如可适用的模具特征之前，以在模制期间保护连接元件。替代地或额外地，例如，在模制期间，可以通过适当的模具特征诸如柱，为连接元件构建引入件，防止材料204流到由其占据的空间。
作为另一种替代或补充选择，衬底106、202可以是，例如在边缘处电气连接在一起，任选地经由电气布线、柔性电路或其他导体，其可以使能够省略例如之后从所构建的多层堆叠的更中心区域移除用于连接的模制材料204，或者布置特定模具特征，诸如柱，用于产生必要的引入件。
作为另一选择，可以机械加工模制材料204，诸如钻孔或其他加工，以在其中布置引入件，用于连接以及(一种或多种)相关的传导元件。
对任一衬底106、202的电源供应和/或通信连接，考虑到外部电子器件或者例如主体装置电子器件，通常可以以类似的方式布置，例如，经由在边缘处设置的侧接触部。
在一些应用中，代替模制该层204，另外可以参考例如现成的元件来提供，该现成的元件优选包含必要的表面形式诸如凹槽，用于接收和容纳从衬底204的第一上表面突出的电子器件212、214的至少一部分。
衬底106可以层压到模制层204的顶部或在模制层的顶部上产生。衬底106可以包含至少一个窗口116，或者在一些实施方式中，如上文中所讨论的许多个窗口，用于使例如由光源214发射的光透射通过朝向环境和/或与环境的其他类型的相互作用，任选地用于传感目的。在一些其他实施方式中，衬底202可以附加地或替代地包含至少一个这样的窗口(出于清楚的原因未在图中明确表示)。
窗口116、层204和光源214(和/或其他相关元件，诸如光检测器/传感器)可以依据例如相互位置、材料、尺寸和形状来配置，使得源214发射的光，该光在层204内传播并且入射在(一个或多个)窗口116上，穿过窗口116，这至少考虑所选择的入射角。
然而，该配置可以任选地使得光源和/或其他内部元件诸如附加的电子器件，基本上完全或至少在相对于参考物(诸如组件的表面法线(即窗口填充/掩蔽层106或可能的顶层108的表面法线，或者在没有窗口填充材料的情况下甚至是层204的表面法线))的选定检查角度内保持对观察者隐藏。相关临界角度的大小可以是例如，约10、15、20、30、40、45、50、60或更多度。在一些其他实施方式中，相对于其并且可能围绕其限定上述观察角度的参考物可以与上述表面法线不同，并且因此可以是例如与其成一定角度(诸如45度角)的线。
至少一个覆盖/顶部层108可以任选地设置并且布置有窗口116C，该窗口可以相对于衬底106的窗口对齐，使得光从整个组件，不仅仅是模制层204和衬底106，射出到所需的程度。例如，窗口116、116C可以沿组件的厚度/高度方向大体上叠加。
在与模制层204相对的一侧上，任选地在衬底202下方设置至少一个底部层218。底部层218可具有美学功能(通过例如图形、表面形式、颜色等提供)、触觉功能(例如通过表面形式、材料选择)、保护功能(材料性质、厚度、柔韧性/刚度、硬度、绝缘性质等)、连接/固定功能(例如，粘性的、粘附性的、机械上的，诸如突起、凹槽、挂钩、维可牢尼龙搭扣(velcro))，传导功能(电气传导材料、迹线、引线/导线或其他导体)和/或其他功能。
在一些实施方式中，省略(一个或多个)底部层218，并且组件200经由衬底202附接到主体装置或其他主体元件218。作为另一替代，组件200可以是独立元件或装置类型的，或者经由其他表面(例如，经由(一个或多个)侧壁/边缘或顶部表面)附接到主体或其他元件。
在一些实施方式中，组件200形成主体装置/元件的壳体或覆盖的至少一部分。例如，组件可以相应地成形为显示通常凸状的、中空的接受器和/或容器形状。
组件200可以被配置成以便实现内部反射，优选地，在用作光导的模制层204内光的基于完全的内部反射的传播。通过使用合适的材料可以增强光的反射型的传播而不是不希望的吸收/耗散。层204可具有例如比相邻衬底106、202，底部层/主体元件表面/保护层218和/或相关反射物更高的折射率。然而，光导层204相对于光源214(诸如顶部或侧面发射LED)的位置和几何结构，可以配置成使得光通常以大于相关临界角度的角度到达材料界面，从而确保内部反射，如本领域技术人员所理解的。
在一些实施方式中，例如任一或两个衬底106、202和模制层204可以具有基本相似的光学性质，例如在折射率方面。然后，元件之间的界面可以被认为是透明的或基本上不存在的，这是相对于例如在层204和衬底106、202的功能组合内的基于完全内部反射的传播以及入射光。
考虑到组件200的潜在照度和/或光传播特征，一个一般目的可以是经由窗口116向环境提供均匀照明或均匀“亮度”分布，而没有如前文所述的热点。光的方向性(例如它是准直的或漫射的)也可以在具体情况下确定。例如，漫射/准直透镜或其他特征可以通过适当成形的窗口填充物116、116C和/或组件的其他元件来实现。嵌入式反射/镜像特征，诸如板、膜或层表面，可用于类似目的。
除了由组件200投射/发射的光(由光源214产生)之外，表面的感知的照度均匀性还取决于反射的外部光的均匀性。
关于窗口116、116C相对于从组件200的环境到达那里的外部光的反射性质，相关的填充(或接收外部光的组件的其他元件，诸如层204，如果没有窗口填充，在例如通孔型窗口的情况下)可以结合面向环境的外部表面。该表面优选地是理想地或最大地漫射的，以在每个方向上均等地反射这种入射光。例如，这种漫射性质可以通过提高表面粗糙度来实现。
为了获得所需的照度特性，诸如均匀性，在一些实施方式中，组件200可以依据窗口116、116C的照度或者其他元件来配置，其限定外部表面的至少一部分，将内部透射的光外耦合到环境，并且可能地反射外部光。因此，来自下层204的窗口116、116C的恒定照度可以被认为是一个潜在的设计目的。
附加地或替代地，窗口116、116C或其他元件的亮度和/或发光强度可以被配置为至少足够(适当的充分性水平应由技术人员在具体实施方式下自然地确定)恒定。
通常，组件200和特别是例如其窗口116、116C的照度性质实际上可以通过所使用的元件相关材料、它们的相互定位以及尺寸和形状的组合确定。形状可以涵盖表面拓扑结构和整体几何结构两者。
图4包括公开根据本发明的方法的实施方式的流程图400。
在用于制造多层结构的方法的开始，可以执行启动阶段402。在启动402期间，可以进行必要的任务，诸如材料、部件和工具选择、采集、校准和其他配置活动。必须特别注意，各个元件和材料选择共同工作，并且免于选定的制造和安装工艺，其自然地优选地进行预先检查，基于制造工艺规范和部件数据表，或者例如通过调查和测试生产的原型。所使用的设备，诸如模制/IMD(模内装饰)、层压、粘合、热成型、切割、钻孔和/或印刷设备，其中，可以因此在此阶段上升到操作状态。可以制备具有必要表面形式等的(一种或多种)模具。
在404处，获得用于容纳电子器件的优选地柔性衬底膜和/或可能的其他优选地平面衬底元件。可以获取现成的衬底材料元件，例如，塑料膜的卷。在一些实施方式中，衬底膜本身可以首先通过模制、挤制或其他方法从所需的(一种或多种)源材料内部生产。任选地，加工衬底膜。例如，它可以被涂覆、切割和/或设置有如上文中所考虑的开口、凹口、凹槽、切口等。初始的和/或所得到的膜可以具有例如矩形、正方形或圆形形状。考虑到所选择的光的波长或通常的电磁辐射，诸如在其上提供的光源或检测器的工作波长，衬底可以是不透明的、半透明的或基本上透明的。
在406处，许多传导元件或迹线限定例如用于电耦合电子部件的所需电路图案或电路设计的导体线、电极、接触垫(或其他接触区域)等，这些传导元件或迹线设置在任一或两个衬底膜上，优选地通过一种或多种印刷电子器件的技术，参考相关的增材制造技术。例如，可以利用丝网、喷墨、柔版、凹版或胶版印刷。培养涉及例如印刷图形、视觉指示器等的(一个或多个)膜的其他行动也可以在此进行。
在408处，可以在任一或两个衬底膜和相关表面上设置多个电子元件或部件，诸如处理元件、通信元件、存储元件、传感元件和/或光源，诸如LED。在实践中，例如现成部件诸如各种SMD可以通过焊料和/或粘合剂附接到所选择的接触区域。替代地或额外地，印刷电子器件技术可以应用于直接在(一个或多个)膜上实际制造至少部分部件，诸如OLED。
在一些实施方式中，可以形成任一或两个衬底膜以显示所需的3d形状(基本上非平面的形状)，优选通过热成型418，诸如真空或压力成型。含有可热成型材料的衬底可以被成形以更好地适合主体装置或使用方案。附加地或替代地，甚至可以进行热成型，这在模制410之后，假如已经构建的多层堆叠被设计成免于这种加工。考虑到成型技术，例如可以应用压力成型以为衬底提供非常精确、清晰的细节。当衬底缺少(通)孔时，其可以实现不希望的流动并且经由它们致使压力下降，压力成型通常可以是优选的。
在一些实施方式中，电子器件/子衬底的多个子组件可以在409处如此设置到任一或两个衬底，并且例如通过粘合剂固定。
在410处，设置任选地为由光源和/或外部(例如周围环境)的光所发射的光所构建光导的至少一个热塑性层，优选通过模制，设置在衬底膜中的至少一个的第一侧和其上的电气特征的至少一部分上，诸如迹线和许多电子部件。优选地，光源和/或其他特征至少部分地嵌入模制材料内。在实践中，在注塑模制工艺中，一个或两个衬底膜可以用作插入件。在一些实施方式中，衬底元件的第一侧和相关表面可以留有一个或多个区域，诸如边界，没有模制塑料。在一些实施方式中，衬底膜的两侧可以设置有(一个或多个)模制层。所使用的热塑性材料可以是不透明的或至少是半透明的。它可以显示至少一种颜色。
在一些实施方式中，可以首先将两个衬底膜插入它们自己的半模具中，使得在实际模制期间将塑料层注入它们之间。优选地，膜位于(半)模具中，其具有基本上，如果不是完全地，关于彼此隔开，即具有它们之间的一些空间，该空间之后被注入的热塑性材料占据。
在一些实施方式中，基本上隔开的关系仍然可以涉及其中两个膜的局部区域(例如边缘区域)彼此接触的情况。例如，然后可以作为结果获得上述回顾的盘形状，其具有彼此连接或至少靠近的膜边缘，而膜的其余部分(例如中心部分)由被模制塑料分离而彼此远离。
塑料可以经由一个或多个位置注入，例如，从(一个或多个)膜的(一个或多个)侧面。因此例如，可以应用边缘注入和/或孔注入(通过(一个或多个)膜中的一个或多个孔在膜之间塑料注入)。或者，衬底膜之一可以通过合适的层压技术附接到模制塑料层和其他衬底膜的已形成的聚集体。
任一衬底膜可以设置有至少一个孔，用于上述讨论的(一个或多个)窗口。例如，孔可以由切割、钻孔、雕刻、冲压或蚀刻操作产生。在模制期间，热塑性模制材料然后可以从任一或两侧进入孔，任选地也行进至膜的另一侧，并且至少为相关的膜构建窗口填充物的至少一部分。
在一些实施方式中，在模制之前在衬底膜中没有准备通孔。该膜可以仍然任选地具有例如，在窗口的目标位置处减薄或以其他方式弱化(使用例如上述操作之一形成)的点，以在模制期间由于模制材料的压力而便于窗口形成。在一些实施方式中，与另一膜接触的模具表面可以具有表面特征，诸如在其上对应于膜中窗口的目标位置的凹槽、穿孔区域、片状物或小孔，其可以便于在模制期间成型和/或填充窗口。因此，膜中匹配并且面向窗口的所需区域的特征可以进一步使模制材料能够经由窗口流到膜的另一侧(即模具/外部侧)。
考虑到可适用材料选择的几个实例，衬底膜和/或可能的(一个或多个)另外的膜或材料层可基本上由以下组成为或包括选自由以下组成的组的至少一种材料：聚合物、热塑性材料、PMMA(聚甲基丙烯酸甲酯)、聚碳酸酯(PC)、聚酰亚胺、甲基丙烯酸甲酯和苯乙烯的共聚物(MS树脂)、玻璃、有机材料、纤维材料、聚对苯二甲酸乙二醇酯(PET)和金属。
可行的模制方法包括例如注塑模制。在几种塑料材料的情况下，它们可以使用双射或通常的多射模制方法模制。可以利用具有多个模制单元的模制机器。或者，多个机器或单个可重新配置的机器可以被用于顺序地提供若干材料。任选地，可以利用几种可适用于二次成型(双色模，包覆成形)的材料来构建一个或多个模制层，例如，衬底膜之间的相邻层。
考虑到选定的波长，该波长使例如由嵌入的光源和/或外部(例如周围环境)光(诸如可见光)发射的光能够以可忽略的损耗通过材料，用于构建(一个或多个)模制层的(热)塑性材料包括光学上基本上不透明、透明或半透明的材料。例如，取决于实施方式，在选定的波长下材料的足够的透光率可为约60％、70％、75％、85％、90％或95％或更高。
由例如上述模制程序或基于热量、压力和/或粘合剂的层压而设置到组件的(一个或多个)塑料层通常可以结合例如弹性树脂。更详细地，(一个或多个)层可包括一种或多种热塑性材料，其包括选自由以下组成的组中的至少一种材料：PC、PMMA、ABS(丙烯腈丁二烯苯乙烯)、PET、尼龙(PA，聚酰胺)、聚丙烯(PP)、聚苯乙烯(GPPS)和MS树脂。
在412处，可任选地将(一个或多个)其他层设置到组件。设置可包括通过例如模制、沉积/其他涂层方法直接制造和附接。通过钻孔、雕刻、锯切、蚀刻、切割(例如，使用激光或机械刀片)，或者使用如本领域技术人员所理解的任何其他可行的加工方法，可以任选地在掩蔽和可能的其他层中设置窗口限定的切口或孔。或者例如，可以通过模制生产具有现成窗口特征的(一个或多个)层。
关于获得的堆叠结构的所得到的总厚度，它在很大程度上取决于所使用的材料和相关的最小材料厚度，考虑到制造和随后的使用提供必要的强度。必须根据具体情况考虑这些方面。例如，结构的总厚度可以是约1mm，但是相当地更厚或更薄的实施方式也是可行的。
项目414是指可能的后加工任务以及附接到主体装置或元件。
在416处，方法执行终止。
本发明的范围由所附权利要求与其等同物一起确定。本领域技术人员将理解的事实是，所公开的实施方式仅出于说明性目的而构建，并且可以容易地准备应用许多上述原理的其他布置以最佳地适合每种可能的使用场景。

Claims (20)

1.一种用于电子装置的集成多层组件(100、200、300)，包括
第一衬底膜(106)，所述第一衬底膜配置成在其至少第一侧上容纳电气特征，所述第一衬底膜具有第一侧和基本上相对的第二侧，
第二衬底膜(202)，所述第二衬底膜配置成在其至少第一侧上容纳电气特征，所述第二衬底膜具有第一侧和基本上相对的第二侧，所述第一衬底膜的第一侧和第二衬底膜的第一侧被配置为彼此面对，
所述第一衬底膜的第一侧上的至少一个电气特征(214B)，
所述第二衬底膜的第一侧上的至少一个其他电气特征(214A)，以及
所述第一衬底膜和第二衬底膜之间的模制塑料层(204)，所述模制塑料层至少部分地嵌入所述第一衬底膜的第一侧和第二衬底膜第一侧上的电气特征。
2.根据任一前述权利要求所述的组件，其中，所述第一衬底膜上的所述至少一个电气特征包括第一传感元件(214B)，用于检测所述组件表面上的触摸。
3.根据权利要求2所述的组件，其中，所述第一传感元件包括第一电极，优选地是附加印刷材料。
4.根据权利要求2或3所述的组件，其中，所述第二衬底膜上的所述至少一个其他电气特征包括第二传感元件(214A)，所述第一传感元件和第二传感元件被共同配置为检测在所述组件表面上的触摸或手势，任选地，三维手势，包括跟踪物体相对于所述组件表面的非接触动作。
5.根据权利要求4所述的组件，其中，所述第二传感元件包括第二电极，优选地是附加印刷材料。
6.根据任一前述权利要求所述的组件，还包括在任一或两个所述第一衬底膜和第二衬底膜上的至少一个保护层(108、218)。
7.根据任一前述权利要求所述的组件，其中，所述第一衬底膜和第二衬底膜中的至少一个显示被形成为三维非平面的形状。
8.根据任一前述权利要求所述的组件，其中，所述第一衬底膜和第二衬底膜中的至少一个包括光学上不透明、半透明或基本上透明的材料的窗口(116)，考虑到预定频率或频带。
9.根据任一前述权利要求所述的组件，其中，所述第一衬底膜和第二衬底膜中的至少一个包括没有填充材料的通孔型的窗口。
10.根据任一前述权利要求所述的组件，其中，所述衬底膜包括选自由以下组成的组中的至少一种材料：聚合物、热塑性材料、PMMA(聚甲基丙烯酸甲酯)、聚碳酸酯(PC)、聚酰亚胺、甲基丙烯酸甲酯和苯乙烯的共聚物(MS树脂)、玻璃、有机材料、纤维材料、聚对苯二甲酸乙二醇酯(PET)和金属。
11.根据任一前述权利要求所述的组件，其中、所述模制塑料层包括选自由以下组成的组中的至少一种材料：PC、PMMA、ABS、PET、尼龙(PA，聚酰胺)、聚丙烯(PP)、聚苯乙烯(GPPS)、弹性树脂和MS树脂。
12.根据任一前述权利要求所述的组件，其中，位于所述第一衬底膜或第二衬底膜上的所述电气特征包括选自由以下组成的组中的至少一种元件：传导迹线、印刷传导迹线、接触垫、部件、集成电路(芯片)、处理单元、存储器、通信单元、收发器、发射器、接收器、信号处理器、微控制器、电池、光发射装置、光传感装置、光电二极管、连接器、电气连接器、光学连接器、二极管、OLED(有机LED)、印刷电子部件、传感器、力传感器、天线、加速度计、陀螺仪、电容式开关或传感器、电极、传感器电极、印刷传感器电极和光伏电池。
13.一种构建用于电子装置的集成多层组件的方法(400)，包括：
获得(404)第一衬底膜，所述第一衬底膜配置为在其至少第一侧上容纳电气特征，所述第一衬底膜具有第一侧和基本上相对的第二侧，
获得第二衬底膜，所述第二衬底膜配置为在其至少第一侧上容纳电气特征，所述第二衬底膜具有第一侧和基本上相对的第二侧，
在所述第一衬底膜的第一侧上设置(406、408)至少一个电气特征，
在所述第二衬底膜的第一侧上设置至少一个其他电气特征，
将所述第一衬底膜和第二衬底膜布置在模具中，优选地每个半模一个膜，使得第一衬底膜的第一侧和第二衬底膜的第一侧被配置成以基本上隔开的关系彼此面对，并且
在所述第一衬底膜和第二衬底膜之间模制(410)塑料层，并且至少部分地嵌入第一衬底膜的第一侧和第二衬底膜的第一侧上的电气特征。
14.根据权利要求13所述的方法，还包括成型(418)所述第一衬底和第二衬底中的至少一个为选定的基本上非平面的三维形状，在其上设置所述至少一个电气特征之后。
15.根据权利要求13-14中任一项所述的方法，其中，所述至少一个电气特征的所述设置包括安装或附加地印刷第一传感元件。
16.根据权利要求15所述的方法，其中，所述第一传感元件包括第一电极，用于传感在所述组件上的触摸或手势。
17.根据权利要求16所述的方法，其中，所述第一衬底膜被配置为正面的膜，在使用时面向环境和可能的物体，诸如手指或触笔，以在其中传感。
18.根据权利要求15-17中任一项所述的方法，其中，所述至少一个其他电气特征的所述设置包括安装或附加地印刷第二传感元件。
19.根据权利要求18所述的方法，其中，所述第二传感元件包括第二电极，与所述第一传感元件相结合地用于传感在所述组件上触摸或手势。
20.根据权利要求19所述的方法，其中，所述第一传感元件和第二传感元件在空间上配置成在所述组件的厚度方向上重叠。
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