CN109075051A - Substrate board treatment and substrate processing method using same - Google Patents

Substrate board treatment and substrate processing method using same Download PDF

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Publication number
CN109075051A
CN109075051A CN201780023526.3A CN201780023526A CN109075051A CN 109075051 A CN109075051 A CN 109075051A CN 201780023526 A CN201780023526 A CN 201780023526A CN 109075051 A CN109075051 A CN 109075051A
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China
Prior art keywords
substrate
components
nozzle
board treatment
target area
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Granted
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CN201780023526.3A
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CN109075051B (en
Inventor
石井弘晃
武明励
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides substrate board treatment and substrate processing method using same, it is intended that the processing width of the peripheral part of substrate is not only made to attenuate, but also improves the uniformity of processing width.In order to reach the purpose, substrate board treatment of the invention includes holding member, is arranged to from below remain substrate approximate horizontal, and substrate can be made to pivot about with defined rotary shaft；Rotating mechanism can be such that holding member pivots about with rotary shaft；Other components, the end face with the substrate for being held in holding member is at spaced intervals along the radial arrangement of substrate in the outside of substrate；And nozzle, treatment fluid is sprayed from the top for spraying target area in a manner of it can fall in the ejection target area for the upper surface that at least part is included in other components.Interval setting between other components and the end face of substrate are as follows: the treatment fluid for falling in ejection target area flows through the upper surface of other components and is discharged from the inner end of the rotation shaft side of the upper surface, and the upper surface peripheral part of substrate is fallen in from top.

Description

Substrate board treatment and substrate processing method using same
Technical field
The present invention relates to semiconductor wafer, liquid crystal display device glass substrate, plasma display glass substrate, Light base-board for plate, substrate for magnetic disc, optomagnetic base-board for plate, photomask glass substrate, substrate used for solar batteries etc. (hereinafter, Referred to as " substrate ") substrate board treatment that is handled.
Background technique
As such substrate board treatment, patent document 1, which discloses, a kind of to be made to remain substrate into horizontal holding structure Part and surrounded at spaced intervals along the peripheral part of substrate with the end face of substrate substrate complete cycle ring together with while rotate, to fall Mode in the upper face center portion of substrate sprays the device for the treatment of fluid.The ring surface has hydrophily.It is thin in substrate surface In the case where aqueous, when being not provided with the ring, it is supplied to the effect of the treatment fluid in centrifugal force in the upper face center portion of substrate It is unevenly spread when being spread from the central portion of substrate to peripheral part down with radial.Therefore, it is impossible to equably to substrate Upper surface entirety supplies treatment fluid.
Therefore, the device of patent document 1 is attempted by being made to reach peripheral part from the central portion of substrate using hydrophilic ring Treatment fluid near the peripheral part of substrate with membranaceous diffusion, thus equably by treatment fluid be supplied to upper surface entirety.
Patent document 2 discloses a kind of substrate board treatment, which, which includes, from below remains substrate Holding member that is horizontal and rotating substrate；Surround the complete cycle of substrate at spaced intervals along the peripheral part of substrate and the end face of substrate Ring；And the nozzle for the treatment of fluid is sprayed in a manner of the upper face center portion that can fall in the substrate rotated.The ring Waterproofness is higher than substrate, and keeps not rotating.It is on the surface of the substrate in hydrophobic situation, as described above, being supplied to The treatment fluid in face center portion is unevenly spread near the peripheral part of substrate with radial.However, in the dress of patent document 2 In setting, when treatment fluid is from the peripheral part of substrate to when the discharge of outside, the ring due to surrounding substrate hinders the flowing for the treatment of fluid, thus Hinder the discharge for the treatment of fluid.The device attempts by accumulating in a part of the treatment fluid of discharge on substrate as a result, and in base The liquid film for the treatment of fluid is formed on plate and reliably supplies treatment fluid to the surface area of entire substrate.
Sometimes, the device area of device pattern is used to form in the central portion setting of substrate, and except device area Peripheral part such as is etched at the processing.Patent document 3 discloses the substrate board treatment for carrying out the processing of peripheral part of this substrate. The device has top and the opposite cut-off component of substrate surface in substrate, and revolves substrate in generally horizontal plane While turning, treatment fluid is supplied from the nozzle for the peripheral part for being configured at cut-off component to the peripheral part of upper surface of base plate, is thus existed The etching process of peripheral part is carried out in upper surface of base plate.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2012-94836 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2010-157531 bulletin
Patent document 3: Japanese Unexamined Patent Publication 2008-47629 bulletin
Summary of the invention
Problems to be solved by the invention
In order to only be handled the narrow region of peripheral side in peripheral part in the process face of substrate, need only to substrate The narrow region of the peripheral side supplies treatment fluid in process face.However, since the substrate board treatment of patent document 1,2 is to substrate Entire upper surface supplies treatment fluid, therefore there are problems that can not only into the process face of substrate, the narrow region supplies treatment fluid.
In addition, in the device of patent document 3, since the flat in the peripheral part towards substrate sprays treatment fluid, To which treatment fluid is spread on the peripheral part of substrate, therefore the narrow region that existing can not only to the peripheral part in the process face of substrate The problem of being handled.If in order to handle the narrow region using the device of patent document 3 and by the ejection target area for the treatment of fluid Domain is set as close to the end face of substrate, then the flowing for the treatment of fluid falls in the flat part of substrate and the side of end because for the treatment of fluid Boundary part and become chaotic.That is, the treatment fluid for falling in substrate is spread to the central side of substrate sometimes, end surface side is flowed to sometimes.Cause This, by treatment fluid handle processing width can along substrate circumferential direction and uneven, the place that will be spread to the rotation center side of substrate The line that the top of reason liquid links is formed as waveform along the circumferential direction of substrate.Accordingly, there exist the processing width of the peripheral part of substrate Non-uniform problem.
The present invention proposes to solve the above-mentioned problems, it is intended that providing a kind of peripheral part in processing substrate In substrate-processing techniques, the processing width of the peripheral part of substrate can not only be made to narrow, but also can be improved processing width Uniformity.
The technical solution solved the problems, such as
In order to solve the above problems, according to the substrate board treatment of the first technical solution, comprising: holding member is set as Substrate is remained from below approximate horizontal, the substrate can be made to pivot about with defined rotary shaft；Whirler Structure can be such that the holding member pivots about with the rotary shaft；Other components, and are held in the holding member The substrate end face at spaced intervals along the radial arrangement of the substrate in the outside of the substrate；And nozzle, with energy The top ejection treatment fluid for spraying the mode of target area from the ejection target area is enough fallen in, the ejection target area At least part is contained in the upper surface of other components.It is described between other described components and the end face of the substrate Interval is arranged to: fall in the treatment fluid for spraying target area flow through the upper surface of other components and from this The inner end of the rotation shaft side on surface is discharged, and the upper surface peripheral part of the substrate is fallen in from top.
According to the substrate board treatment of the second technical solution, in the substrate board treatment of the first technical solution, the spray Target area is all contained in the upper surface of other components out.
According to the substrate board treatment of third technical solution, in the substrate board treatment of first or second technical solution, Also have and the nozzle and other described components are kept into the nozzle retaining feature being integrated.
According to the substrate board treatment of the 4th technical solution, in the substrate board treatment of first or second technical solution, Other described components are the cyclic annular structures along the periphery for circumferentially surrounding the substrate of the substrate centered on the rotary shaft Part, the substrate board treatment further include the rotating mechanism of the annular component, and the rotating mechanism of the annular component makes Other described components and the substrate are rotated with identical rotation speed.
According to the substrate board treatment of the 5th technical solution, in the substrate board treatment of the 4th technical solution, the ring Shape component has multiple arc-shaped components；The multiple arc-shaped component has circumferentially-adjacent two circular arc along the substrate Shape component；Described two respective one end in the circumferential direction of the substrate of arc-shaped component toward each other, described two circular arcs Shape component can be rotated in the horizontal plane centered on the respective other end；The substrate board treatment also has rotating machine Structure, the rotating mechanism can make described two arc-shaped components respectively with the respective other end rotation of described two arc-shaped components Turn center rotating, so that described two respective one end of arc-shaped component away from each other must be bigger than the diameter of the substrate.
According to the substrate board treatment of the 6th technical solution, any technical solution in the first to the 5th technical solution In substrate board treatment, radial drive portion is also included, other components moving radially along the substrate can be made；And Control unit, for controlling the radial drive portion and the nozzle；Utilizing the processing for falling in the ejection target area The upper surface of other excessively described components of liquid stream and be discharged from the inner end of the rotation shaft side of the upper surface and fallen in from top When processing position of the position of other components when the upper surface peripheral part of the substrate to define other components, institute Stating control unit is configured at the radial drive portion than the diameter for handling position and more leaning on the substrate other described components To outside outer fix during, so that the nozzle is sprayed the treatment fluid initially towards the ejection target area, and And make the radial drive portion other components by described in from the outside position while making the nozzle ejection treatment fluid It sets and is moved to the processing position.
According to the substrate board treatment of the 7th technical solution, any technical solution in the first to the 6th technical solution In substrate board treatment, the inner end of the rotation shaft side of the upper surface of other components is upper in the radial direction of the substrate The position of the rotation shaft side is more leaned in the periphery than the substrate.
According to the substrate board treatment of the 8th technical solution, any technical solution in the first to the 7th technical solution In substrate board treatment, other described components include the medial surface opposite with the end face of the substrate, the medial surface with It is tilted close to the mode of the rotary shaft relative to the rotary shaft with from lower end towards upper end.
According to the substrate board treatment of the 9th technical solution, any technical solution in the first to the 7th technical solution In substrate board treatment, other described components include the medial surface opposite with the end face of the substrate, the medial surface with From its lower end towards upper end and close to the rotary shaft, also, it is convexly curved relative to the axial rotary oblique upper.
According to the substrate board treatment of the tenth technical solution, any technical solution in the first to the 7th technical solution In substrate board treatment, other described components include the medial surface opposite with the end face of the substrate, the medial surface Cross sectional shape in the plane comprising the rotary shaft is bent along the end face of the substrate.
It is the substrate processing method using same of substrate board treatment according to the substrate processing method using same of the 11st technical solution, wherein should Substrate board treatment includes holding member, is arranged to from below remain substrate approximate horizontal, and the substrate can be made to advise Fixed rotary shaft pivots about；Rotating mechanism pivots about the holding member with the rotary shaft；Its His component, is configured as leaving from the substrate；And nozzle, treatment fluid can be sprayed.The substrate processing method using same include: with The end face of the substrate at spaced intervals by other described components along the substrate radial arrangement in the outside of the substrate Step；And make the nozzle from top ejection place for spraying target area in a manner of it can fall in and spray target area The step of managing liquid, described at least part for spraying target area are contained in the upper surface of other components.It is described other The interval between component and the end face of the substrate is configured to: falling in the processing liquid stream for spraying target area It crosses the upper surface of other components and is discharged from the inner end of the rotation shaft side of the upper surface, and fall in from top described The upper surface peripheral part of substrate.
Invention effect
According to the invention of any technical solution of first and the 11st in technical solution, ejection target area can be fallen in The mode in domain sprays treatment fluid from nozzle to other components, and described at least part for spraying target area is contained in other structures The upper surface of part.The end face of other components and substrate is at spaced intervals along the radial arrangement of substrate in the outside of substrate, the interval Be set to: fall in spray target area treatment fluid flow through the upper surface of other components and from the rotation shaft side of the upper surface Inner end is discharged, and the upper surface peripheral part of substrate is fallen in from top.Therefore, not only make the substrate handled by treatment fluid The processing width of upper surface peripheral part attenuates, but also can be improved the uniformity of processing width.
According to the invention of the second technical solution, the upper surface that target area is all contained in other components is sprayed.Therefore, Fall in the upper surface peripheral part of substrate treatment fluid be all from spray target area flow through other components upper surface and from this The treatment fluid of the inner end discharge of the rotation shaft side of upper surface.Therefore, the upper surface periphery that treatment fluid falls in substrate can be shortened The position in portion between the inner end of other components substrate radially at a distance from.Thereby, it is possible to further make by handling The processing width of the upper surface peripheral part for the substrate that liquid is handled attenuates.
According to the invention of third technical solution, since nozzle and the holding of other components are integrated by nozzle retaining feature, because This, treatment fluid can fall in fixed ejection target area.Thereby, it is possible to make the discharge shape for the treatment fluid being discharged from inner end State is stablized.Thus, it is possible to stablize the processing width of the upper surface peripheral part of substrate.
According to the invention of the 4th technical solution, other components are to circumferentially surround substrate along the substrate centered on rotary shaft Periphery annular component, other components and substrate are rotated with identical rotation speed.Therefore, even if making other components and base In the case that plate rotates together, the uniformity of the processing width of the upper surface peripheral part of substrate also can be improved.
According to the invention of the 5th technical solution, two arc-shaped components are set as one end toward each other and along the circumferential directions of substrate Adjacent, two arc-shaped components can be rotated by rotation center of the respective other end, so that respective one end obtains away from each other It is bigger than the diameter of substrate.Therefore, it by the rotation of two arc-shaped components, can be moved in relative to substrate board treatment Substrate out.
According to the invention of the 6th technical solution, nozzle more leans on the radial outside of substrate initially towards being configured at than processing position Outer fix other components ejection target area spray treatment fluid, and nozzle spray treatment fluid during, other components Processing position is moved to from outer fix.Therefore, it is able to suppress the chaotic influence because of the liquid stream for starting treatment fluid when spraying And cause the processing width of the upper surface peripheral part of substrate uneven.
According to the invention of the 7th technical solution, the radial direction of the inner end of the rotation shaft side of the upper surface of other components in substrate It is upper to be located at the position that rotation shaft side is more leaned on than the periphery of substrate.Therefore, the processing width of the upper surface peripheral part of substrate can be made It broadens.
According to the invention of the 8th technical solution, the medial surfaces of other components from lower end initially towards upper end with rotating The mode of axis is tilted relative to rotary shaft.Therefore, in the case where other components can be gone up and down, also can by from processing position Top make other components decline, thus by other components be configured at processing position.
According to the invention of the 9th technical solution, the medial surface of other components not only approaches rotation with from lower end towards upper end Shaft, also, it is convexly curved relative to axial rotary oblique upper.Therefore, can further homogenize substrate end face and other The interval radially in substrate between component.Thereby, it is possible to improve the treatment effeciency of the end face of substrate.
According to the invention of the tenth technical solution, other components include the medial surface opposite with the end face of substrate, the inside The cross sectional shape in the plane comprising rotary shaft in face is to be bent along the end face of substrate.Therefore, base can further be homogenized The interval radially in substrate between the end face of plate and other components.Thereby, it is possible to improve the processing of the end face of substrate effect Rate.
Detailed description of the invention
Fig. 1 is the side schematic view for illustrating the structure of the substrate board treatment according to embodiment.
Fig. 2 is the upper surface schematic diagram for the structure of the substrate board treatment of explanatory diagram 1.
Fig. 3 is the approximate stereogram for the structure of the substrate board treatment of explanatory diagram 1.
Fig. 4 is other components of the A1-A1 section line along Fig. 2 and the schematic cross-sectional view of substrate outer edge.
Fig. 5 is the schematic cross-sectional view of the other positions relationship of other components and substrate for explanatory diagram 4.
Fig. 6 is the schematic cross-sectional view for illustrating the other embodiments of other components.
Fig. 7 is the schematic cross-sectional view for illustrating the other embodiments of other components.
Fig. 8 is the schematic cross-sectional view for illustrating the other embodiments of other components.
Fig. 9 is the schematic cross-sectional view for illustrating the other embodiments of other components.
Figure 10 is the upper surface schematic diagram for indicating the ejection target area of other components of Fig. 4.
Figure 11 is the upper surface schematic diagram for indicating the other configurations example of ejection target area of other components.
Figure 12 is the upper surface schematic diagram of the other structures example for other components of explanatory diagram 1.
Figure 13 is the schematic cross-sectional view indicated near the peripheral part of the substrate of Fig. 1.
Figure 14 is the flow chart for indicating an example of movement of the substrate board treatment according to embodiment.
Figure 15 is the figure of the movement shown in the flowchart for explanatory diagram 14.
Figure 16 is the side schematic view for illustrating the structure of the substrate board treatment according to other embodiments.
Figure 17 is the upper surface schematic diagram for the mechanism of the substrate board treatment of explanatory diagram 16.
Figure 18 is the upper surface schematic diagram of the movement in substrate carrying-in/carrying-out of other components for explanatory diagram 17.
Specific embodiment
Hereinafter, being described with reference to embodiment.Following implementation is an example for embodying the present invention, not It is the example for limiting technical scope of the invention.In addition, exaggerating or briefly showing sometimes in each figure of following institute's reference The size and numerical value of various pieces, in order to understand.Up and down direction is vertical direction, and substrate-side is on rotary chuck.
<embodiment>
<overall structure of 1. substrate board treatments 1>
Referring to Fig.1~Fig. 3 illustrates the structure of substrate board treatment 1.FIG. 1 to FIG. 3 is for illustrating according to embodiment The figure of the structure of substrate board treatment 1.Fig. 1, Fig. 2 are the side schematic view and upper surface schematic diagram of substrate board treatment 1.Fig. 3 It is the approximate stereogram of the substrate board treatment 1 from oblique upper.
In FIG. 1 to FIG. 3, the state that substrate 9 is configured at respective processing position in nozzle 51, other components 52 is shown Under, it is rotated centered on rotary shaft a1 by defined direction of rotation (direction of arrow AR1) by rotary chuck 21 State.In addition, illustrating with dashed lines the nozzle 51 for being configured at retreating position, other components 52 etc. in Fig. 2.In Fig. 2, Fig. 3, The record for a part of constituent element such as preventing portion 3 of dispersing is omitted in the constituent element of substrate board treatment 1.
The surface shape of substrate 9 is roughly circular.In the state that nozzle 51 etc. is configured at retreating position, pass through manipulator Etc. carrying out the carrying-in/carrying-out to the substrate 9 of substrate board treatment 1.The substrate 9 to substrate board treatment 1 is moved in removably Mode is kept by rotary chuck 21.
It should be noted that in the following description, " treatment fluid " includes " medical fluid " and " flushing liquor (also referred to as " is cleaned Liquid ") ", " medical fluid " uses in medical fluid processing, and described " flushing liquor uses in the flushing processing that medicine liquid washing is clean.
Substrate board treatment 1 have rotation holding mechanism 2, preventing portion of dispersing 3, processing unit 5, nozzle moving mechanism 6 and Control unit 130.These each portions 2~3,5~6 are electrically connected with control unit 130, and according to the instruction progress from control unit 130 Movement.As control unit 130, equipment for example identical with general computer can be used.That is, for example, control unit 130 includes using In the CPU for carrying out various calculation process, as the ROM of the read-only memory for storing basic program, as each for storing The RAM of the random access memory of kind information, for storing the disk of control software, data etc..In control unit 130, root According to step described in program as main control unit CPU by carry out calculation process come each portion of control base board processing unit 1.
<2. substrate 9>
Then, 3 pairs of substrates 9 for becoming process object in substrate board treatment 1 are illustrated referring to Fig.1.Figure 13 is table Show the cross-sectional view in the plane comprising central axis near the peripheral part of substrate 9.The cross-sectional view of Figure 13 is comprising (the rotation of substrate 9 Turn chuck 21) rotary shaft a1 plane on cross-sectional view (also referred to as " longitudinal sectional view "), the rotary shaft a1 pass through substrate 9 Interarea center c1.
In substrate board treatment 1 become process object substrate 9 have for example be made of silicon (Si) central core 901, The three-layered node of the lower membrane 902 of film forming and the upper layer film 903 to form a film in the outside of lower membrane 902 in the outside of central core 901 Structure.The surface shape of substrate 9 is roughly circular.The radius of substrate 9 is such as 150mm.Lower membrane 902 is, for example, heat oxide film (Th-SiO2) or insulating film (for example, Hf (hafnium) film or hafnium oxide film etc.).In addition, upper layer film 903 is, for example, barrier metal film (for example, TiN film, TaN film etc.) or metal film (for example, Al film, W film, NiSi film, Cu film etc.).But in substrate board treatment The substrate 9 for becoming process object in 1 can be the two-layer structure with such as central core 901 and lower membrane 902, it is possible to have Four layers or more of structure.
Hereinafter, the face of device pattern formed in two interareas of substrate 9 is referred to as " upper surface 91 ".In addition, by position It is referred to as " lower surface 92 " in the face of the opposite side of upper surface 91.In addition, the region for being formed with device pattern in upper surface 91 is claimed Make " device area 90 ".In addition, peripheral edge margin more more outward than device area 90 in upper surface 91 is referred to as " upper surface periphery Portion 911 ".Specifically, upper surface peripheral part 911 is, for example, to have minute widths D1 since the end (" periphery ") 94 of substrate 9 The cricoid region of (for example, D1=0.3mm~1.0mm).The end 94 of substrate 9 is in the surface of substrate 9 along the diameter of substrate 9 To outermost part.The shape at end 94 is rounded when overlooking substrate 9.In addition, by having since the end 94 of lower surface 92 There is the annular section of minute widths D1 to be referred to as " lower surface peripheral part 921 ".By upper surface peripheral part 911 and lower surface peripheral part 921 combined regions are referred to as " peripheral part ".
The end face 93 of substrate 9 is the respective flat part removed in upper surface 91 and lower surface 92 in the surface of substrate 9 Annulus afterwards.Specifically, end face 93 is that for example have minute widths D2 (for example, D2=0.3mm journey since end 94 Degree) annular section.In the longitudinal cross-section of substrate 9, end face 93 is protruded and is bent to the outside of substrate 9 along the radial of substrate 9. The annulus for being located at 94 upside of end in end face 93 is upside end face 93a, and the annulus positioned at 94 downside of end is lower side Face 93b.Upside end face 93a is contained in upper surface peripheral part 911, and downside end face 93b is contained in lower surface peripheral part 921.
Substrate board treatment 1 can be carried out by substrate 9 as dealing with objects to surface periphery portion 911 thereon and downside end face The processing (for example, removing the processing for being formed in upper surface peripheral part 911 and the film of downside end face 93b) of 93b.
<structure in each portion of 3. substrate board treatments 1>
<rotation holding mechanism 2>
Rotation holding mechanism 2 be make the interarea of side of substrate 9 upward in the state of remain substrate 9 substantially Flat-hand position and the mechanism for being able to carry out rotation.Rotation holding mechanism 2 makes substrate 9 by the rotation of the vertical of the center c1 of interarea Shaft a1 is pivoted about.
Rotating holding mechanism 2 has rotary chuck (" holding member ", " board holder ") 21, and the rotary chuck 21 compares The small disk-shaped component of substrate 9.It is approximate horizontal, central shaft and rotary shaft a1 mono- that rotary chuck 21, which is arranged to its upper surface, It causes.The lower surface of rotary chuck 21 is connected with cylindric rotation axle portion 22.Axle portion 22 is rotated with its axis along vertical direction Posture configuration.The axis for rotating axle portion 22 is consistent with rotary shaft a1.In addition, rotation axle portion 22 is with rotary driving part (for example, watching Take motor) 23 it is connected.23 pairs of rotation axle portions 22 of rotary driving part, which carry out rotation driving, makes to rotate axle portion 22 around the axis.Cause This, rotary chuck 21 can be pivoted about together with rotary shaft a1 with rotation axle portion 22.Rotary driving part 23 and rotation Axle portion 22 is the rotating mechanism 231 for pivoting about rotary chuck 21 with rotary shaft a1.It rotates axle portion 22 and rotation is driven Dynamic portion 23 is housed inside in the shell 24 of tubular.
The central portion of rotary chuck 21 is provided with through hole (not shown), is connected with the inner space of rotation axle portion 22 It is logical.Inner space is connected through not shown piping, open and close valve with pump (not shown).130 electricity of the pump, open and close valve and control unit Connection.Control unit 130 controls the movement of the pump, open and close valve.The pump can be according to the control of control unit 130 come selectively Supply negative pressure and positive pressure.If substrate 9 with approximate horizontal posture configuration in the upper surface of rotary chuck 21 in the state of pump supply Negative pressure, then rotary chuck 21 adsorbs from below keeps substrate 9.If pump supply positive pressure, can take from the upper surface of rotary chuck 21 Lower substrate 9.
In this configuration, in the state that rotary chuck 21 adsorbs holding substrate 9, if rotary driving part 23 makes to rotate axle portion 22 rotations, then rotary chuck 21 along the axis of vertical direction to pivot about.It is maintained on rotary chuck 21 as a result, Substrate 9 rotated centered on the rotary shaft a1 of the vertical by the center c1 in the face of substrate 9 by the direction arrow AR1.
<preventing portion of dispersing 3>
Preventing portion of dispersing 3 accepts the treatment fluid etc. to disperse from the substrate 9 rotated together with rotary chuck 21.
Preventing portion of dispersing 3 has splash guard 31.Splash guard 31 is the component of the open barrel shape in upper end, is arranged to surround rotation Turn holding mechanism 2.It should be noted that the plate for surrounding rotation holding mechanism 2 can also be arranged in the outside of splash guard 31.
The cylindric inner sidewall that splash guard 31 has circular bottom, extends upwards from the inner side edge edge of bottom Portion and the cylindric external side wall extended upwards from the side edge section of bottom.Quilt near at least top of inside wall portion It is contained in the inner space of the flange shape component 241 of the setting of shell 24 of rotation holding mechanism 2.The top of external side wall (" upper end side section ", " upper part ") top extends inwardly.That is, the top extends obliquely upward towards rotary shaft a1.
It is formed with sump pit (not shown) in the bottom of splash guard 31, between the sump pit and inside wall portion and external side wall Space be connected.The sump pit is connected with the drainage thread of factory.In addition, the sump pit is connected with exhaust liquid mechanism, it should Exhaust liquid mechanism makes the space between inside wall portion and external side wall become negative pressure state by being forcibly vented in slot.It is interior Space between sidewall portion and external side wall is the space for collecting and being discharged the treatment fluid used in the processing of substrate 9, The treatment fluid for being collected into the space is discharged from sump pit.
Configured with the plate driving mechanism 32 for making 31 lifting moving of splash guard on splash guard 31.Plate driving mechanism 32 is for example It is made of stepper motor.Splash guard 31 by the driving of receiver sheet driving mechanism 32, and each top position and lower position it Between moved.The top position of splash guard 31 is that the upper edge of splash guard 31 is configured in and is held in rotary chuck 21 The position of the upper side of substrate 9.On the other hand, the lower position of splash guard 31 is that the upper edge of splash guard 31 is configured in Lower than the position of the upper surface of rotary chuck 21.When substrate 9 is moved to substrate board treatment 1, splash guard 31 is configured in down It sets in orientation.Plate driving mechanism 32 is electrically connected with control unit 130, and is acted under the control of control unit 130.That is, passing through control Portion 130 processed controls the position of splash guard 31.
Even if the preventing portion 3 it should be noted that substrate board treatment 1 does not disperse, will not destroy of the invention practical Property.
<processing unit 5>
Processing unit 5 carries out upper surface peripheral part 911 and downside end face 93b to the substrate 9 being maintained on rotary chuck 21 Processing.Specifically, processing unit 5 is handled to 911 supply of upper surface peripheral part for the substrate 9 being maintained on rotary chuck 21 Liquid.Processing unit 5 includes nozzle retaining feature 50, nozzle 51, other components 52 and treatment fluid supply unit 83.
Nozzle retaining feature 50 is the component for keeping being integrated by nozzle 51 and other components 52.Nozzle retaining feature 50 is pacified Assembly is placed in the top of the arm 63 for the length that aftermentioned nozzle moving mechanism 6 has.63 horizontal plane of arm extends.
Nozzle retaining feature 50 for example by the tabular component that will extend along vertical guide with from the upper distal process of the tabular component Protruding member out is engaged and is formed.The upper end of the tabular component is set to the top of arm 63.The protruding member is relative to the plate Shape component is prominent along the extending direction of arm 63 to the opposite side of arm 63.Nozzle 51 is set to the top of the protruding member.In nozzle The lower end of the tabular component of holding member 50 is provided with other components 52.
Nozzle 51 is maintained at the upper surface peripheral part 911 of the substrate 9 on rotary chuck 21 and rotated can fall in The mode of a part spray the liquid stream L1 for the treatment of fluid.Liquid stream L1 is sprayed with shape of liquid column from the ejiction opening of nozzle 51.Nozzle 51 Top end part (lower end) protrude downwards, and top be arranged ejiction opening.The upper surface phase of the ejiction opening and other components 52 To.Nozzle 51 is connected with treatment fluid supply unit 83, which is the piping to the nozzle 51 supply treatment fluid System.Specifically, the upper end of nozzle 51 is connected with one end of the piping 832 for the treatment of fluid supply unit 83.Nozzle 51 is from processing Liquid supply unit 83 is supplied to treatment fluid, and the liquid stream L1 for the treatment fluid being supplied to is sprayed with shape of liquid column from the ejiction opening on top.Spray Mouth 51 sprays treatment fluid from the top for spraying target area 521 in a manner of it can fall in and spray target area 521, sprays target At least part in region 521 is contained in the upper surface of other components 52.
Treatment fluid supply unit 83 supplies treatment fluid to nozzle 51.Specifically, treatment fluid supply unit 83 passes through combined treatment Liquid supply source 831, piping 832 and open and close valve 833 and constitute.Treatment fluid includes medical fluid and flushing liquor.As medical fluid, such as can Use SC-1, DHF, SC-2 etc..As flushing liquor, such as pure water, warm water, Ozone Water, magnetized water, reductive water (hydrogen can be used Water), various organic solvents (ionized water, IPA (isopropanol), function water (CO2Water etc.) etc..
If supplying treatment fluid from treatment fluid supply unit 83 to nozzle 51, nozzle 51 sprays the liquid stream L1 of the treatment fluid.But It is that open and close valve 833 possessed by treatment fluid supply unit 83 passes through the valve opening and closing machine (not shown) that is electrically connected with control unit 130 Structure, and be opened and closed under the control of control unit 130.That is, controlling the spray for spraying treatment fluid from nozzle 51 by control unit 130 Do well (specifically, the ejection start time for the treatment fluid being ejected, ejection finish time, ejection flow etc.).That is, passing through The control of control unit 130, the nozzle 51 of processing unit 5 is can fall in the upper of the rotary shaft a1 substrate 9 pivoted about The mode in surface periphery portion 911 sprays the liquid stream L1 for the treatment of fluid.
Other components 52 are 93 intervals of end face with the substrate 9 being maintained on rotary chuck 21 and along the diameter of substrate 9 To the component in the outside for being configured at substrate 9.In more detail, the center of gravity of other components 52 is along the radial arrangement of substrate 9 in substrate 9 Outside.The upper surface of other components 52 includes at least part for spraying target area 521.Structure about other components 52 With other structures example, will be described hereinafter.
<nozzle moving mechanism 6>
Nozzle moving mechanism 6 is to move nozzle 51 and other components 52 between respective processing position and retreating position Mechanism.Nozzle moving mechanism 6 has horizontal-extending arm 63, nozzle base station 66, lifting driving portion 68 and rotary driving part 69.Nozzle retaining feature 50 is set to the tip portion of arm 63.
The base end part of arm 63 and the upper part of nozzle base station 66 are connected.Nozzle base station 66 is with its axis along vertical direction Posture configuration in the outside of shell 24.Nozzle base station 66 has rotary shaft, which extends along its axis in vertical direction, And it can be pivoted about with axis.The axis of nozzle base station 66 and the axis of rotary shaft are consistent.Nozzle base station 66 it is upper The upper end of rotary shaft is arranged in end part.By the rotation of rotary shaft, the upper part of nozzle base station 66 with the axis of rotary shaft, That is the axis of nozzle base station 66 pivots about.Nozzle base station 66 be provided with make the rotary shaft centered on the axis into The rotary driving part 69 of row rotation.Rotary driving part 69 has such as servo motor.
In addition, being provided with lifting driving portion 68 in nozzle base station 66.Going up and down driving portion 68 has such as servo motor.It rises Drop driving portion 68 goes up and down the rotary shaft of nozzle base station 66 along its axis by ball screw mechanism, which has The ball screw being connected with the output shaft of lifting driving portion 68.
Rotary driving part 69 passes through the rotary shaft of nozzle base station 66, rotates the upper part of nozzle base station 66.With this The rotation of upper part, nozzle retaining feature 50 are also pivoted about with the axis of nozzle base station 66.Rotation driving as a result, Portion 69 moves horizontally nozzle 51 and other components 52.That is, rotary driving part 69 is that other components 52 can be made in the diameter of substrate 9 To mobile " radial drive portion ".
Lifting driving portion 68 makes nozzle retaining feature 50, i.e. by going up and down the rotary shaft of nozzle base station 66 along its axis Nozzle 51 and other components 52 are gone up and down.Driving portion 68 and rotary driving part 69 are gone up and down by cooperation, nozzle retaining feature 50 is made to exist It is moved between processing position and retreating position, the processing position, which is located at, to be held near the substrate 9 of rotary chuck 21, described Retreating position is located at the radial outer upper side from processing position along substrate 9.If nozzle retaining feature 50 is configured in processing position It sets, then nozzle 51 and other components 52 are configured in respective processing position.
The respective retreating position of nozzle retaining feature 50, nozzle 51 and other components 52 not carrying channel with substrate 9 Each position that diameter is interfered and will not be interfered each other.Each retreating position is for example positioned at splash guard 31 Outer upper side.
Driving portion 68,69 is electrically connected with control unit 130, and is acted under the control of control unit 130.That is, passing through control Portion 130 processed controls the position of nozzle retaining feature 50.That is, controlling nozzle 51 and other components 52 by control unit 130 Position.
<structure of 4. other components 52 and the other structures example of other components>
Fig. 4 is the schematic cross-sectional view along other components 52 of A1-A1 section line (Fig. 2) and the peripheral part of substrate 9.Fig. 5 It is that the section view of other components 52 and substrate 9 for illustrating the different positional relationship of the positional relationship for being configured differently from Fig. 4 is shown It is intended to.Fig. 6~Fig. 9 is the schematic cross-sectional view for illustrating other components 52A~52D of other embodiments.Fig. 4~Fig. 9 is The figure shown by longitudinal sectional view.Figure 10 is the upper surface for indicating the example of ejection target area 521 of other components 52 Schematic diagram.It is the upper surface schematic diagram for indicating the other configurations example of ejection target area 521 of other components 52.Figure 12 is to be used for Illustrate using other components 52E as the upper surface schematic diagram of other configuration examples of other components 52.
As shown in figure 4, other components 52 are axis substantially along the columnar component of triangular prism of the circumferentially extending of substrate 9.Its The longitudinal cross-section of his component 52 is general triangular.Other components 52 have upper surface 53, lateral surface 54, medial surface (" opposite Face ") 55, side 57 and side 58.
Upper surface 53 is approximate horizontal rectangular surfaces.Lateral surface 54 is being radially disposed in most along substrate 9 in other components 52 The face in outside is arranged to relative to the diametrically substantially vertical of substrate 9.The end face 93 of medial surface 55 and substrate 9 is opposite, and with From lower end towards upper end and close to the mode of rotary shaft a1 relative to rotary shaft a1 tilt.Side 57,58 is and upper surface 53 The face for the general triangular being respectively perpendicular with lateral surface 54.Side 57,58 can be parallel to each other, can also be respectively along substrate 9 It radially extends.The inner end of the side rotary shaft a1 of upper surface 53 than substrate 9 end 94 be periphery substrate 9 radially closer to The position of the side rotary shaft a1.The inner end is located at the top of the upper surface peripheral part 911 of substrate 9.
The length D5 (Figure 10) of other components 52 radially of substrate 9 is for example, about 10mm.The tangent line at the end 94 of substrate 9 The length D6 (Figure 10) of other components 52 on direction is for example, about 20mm.Along the height D7 of other components 52 of rotary shaft a1 (Fig. 4) is for example, about 5mm.
It should be noted that other components 52 can be substituted by using other components 52E shown in such as Figure 12.Other Component 52E opposite medial surface with 93 interval of end face with substrate 9, periphery (end 94) of the medial surface along substrate 9 Extended in the circumferential direction of substrate 9 with arcuation.Thus come improve on upper surface peripheral part 911 processing width uniformity.
Other components 52 include generally circular ejection target area 521.Spraying target area 521 is imaginary region. The diameter of the liquid stream L1 of the treatment fluid sprayed from nozzle 51 is substantially identical as the diameter D3 of target area 521 is sprayed.Diameter D3's Length is roughly the same with the width D 2 of end face 93 of substrate 9.As shown in Fig. 4, Figure 10, it is entire spray target area 521 by comprising In the upper surface of other components 52 53.As shown in figure 11, when overlooking substrate 9, spray target area 521 in a part from other Expose to the side rotary shaft a1 the inner end of the upper surface 53 of component 52.
As shown in figure 4, as the treatment fluid that liquid stream L1 is sprayed in a manner of falling in and spraying target area 521 from nozzle 51, It is spread on upper surface 53 around from ejection target area 521.A part for the treatment of fluid flows through upper surface 53 and from upper surface 53 The side rotary shaft a1 external discharge of the inner end to other components 52.Between between other components 52 and the end face 93 of substrate 9 The upper surface peripheral part 911 that treatment fluid be discharged falls in from top substrate 9 is set to every 97 (Fig. 4).Therefore, the treatment fluid Upper surface peripheral part 911 can be fallen in from above towards upper surface peripheral part 911.The substantially phase of width D 2 of distance D4 and end face 93 Together, wherein distance D4 is the edge on the boundary and medial surface 55 between the flat part of upper surface peripheral part 911 and upside end face 93a The radial distance of substrate 9.
The treatment fluid of upper surface peripheral part 911 is fallen in via interval 97, flows to lower section along the end face of substrate 9 93.Exist as a result, More located by the part for holding 94 sides and downside end face 93b in the upper surface peripheral part 911 of substrate 9 than the part that treatment fluid is fallen in Manage liquid processing.
As shown in figure 5, other components 52 can be configured to the upper surface 53 of other components 52 and the upper surface 91 of substrate 9 Flat part is on the horizontal plane of roughly same height.In Fig. 5, identically as Fig. 4, the flat part of upper surface peripheral part 911 and Boundary and the substantially phase of width D 2 of the radial direction distance D4 and end face 93 along substrate 9 of medial surface 55 between the 93a of upside end face Together.Distance D4 is the distance from the boundary to the inner end of the upper surface of other components 52 53.
In addition, other components 52 can be substituted by using other components 52A as shown in FIG. 6.Other components 52A has The horizontal upper surface 53A and lateral surface 54A as vertical guide.Upper surface 53A and lateral surface 54A and other components 52 (Fig. 4) Upper surface 53 and lateral surface 54 be uniformly set.Other components 52A, which is used, has the medial surface opposite with the end face 93 of substrate 9 55A substitutes the medial surfaces 55 of other components 52.Medial surface 55A not only with from lower end towards upper end and close to rotary shaft a1, And it protrudes and is bent obliquely upward relative to rotary shaft a1.In addition, other components 52A has lower surface 56A, the lower surface The lower end of 56A connection medial surface 55A and lateral surface 54A are simultaneously parallel with upper surface 53A.
In addition, other components 52 can be substituted by using other components 52B as shown in Figure 7.Other components 52B has Be arranged to the upper surface 53B and lateral surface 54B roughly the same with the upper surface 53 of other components 52 and lateral surface 54, also have with Upper surface 53B parallel lower surface 56B.Lower surface 56B is formed with shapes and sizes identical with upper surface 53B.In addition, other Component 52B substitutes the medial surface 55 of other components 52 by having the medial surface 55B opposite with the end face 93 of substrate 9.Along packet The cross sectional shape of the medial surface 55B of the section on plane of the a1 containing rotary shaft is to be bent along the end face 93 of substrate 9.Upper surface 53B ratio The upper surface 91 of substrate 9 is more located above, and lower surface 56B is more located below than the lower surface 92 of substrate 9.
In addition, other components 52 can be substituted by using other components 52C as shown in Figure 8.Other components 52C has The shape that other components 52B is shunk along the direction rotary shaft a1.Other components 52C has upper surface 53C, lower surface 56C, lateral surface 54C and medial surface 55C.
Upper surface 53C is with the horizontal plane with the upper surface 53B same shape of other components 52B.Lower surface 56C is tool There is the horizontal plane with the lower surface 56B same shape of other components 52B.Upper surface 53C is comprised in the upper surface 91 with substrate 9 The identical horizontal plane in flat part in.Lower surface 56C is comprised in horizontal plane identical with the flat part of lower surface 92 of substrate 9 It is interior.Lateral surface 54C is vertical guide.Medial surface 55C is the respective inner end by connecting upper surface 53C and lower surface 56C It is formed.Cross sectional shape along the medial surface 55C of the section on plane comprising rotary shaft a1 is to be bent along the end face 93 of substrate 9.
In addition, other components 52 can be substituted by using other components 52D as shown in Figure 9.Other components 52D has Upper surface 53D, lower surface 56D, lateral surface 54D and medial surface 55D.Other components 52D, which passes through, to be had as the interior of vertical guide Side 55D substitutes the curved medial surface 55C of other components 52C.Medial surface 55D is relative to the radial vertical of substrate 9.Other Component 52D is rectangular shape.Upper surface 53D and lower surface 56D has upper surface 53C and lower surface with other components 52C The identical shape of 56C.Upper surface 53D is comprised in horizontal plane identical with the flat part of upper surface 91 of substrate 9, lower surface 56D is comprised in horizontal plane identical with the flat part of lower surface 92.Since medial surface 55D is plane, the end of substrate 9 Interval is equipped between the end 94 and medial surface 55D in face 93.Therefore, the flat part of upper surface peripheral part 911 and upside end face 93a it Between boundary at a distance from medial surface 55D (distance radially of substrate 9) D4 be longer than the width D 2 of end face 93.However, spraying A part of the treatment fluid of ejection target area 521 on to other components 52D falls in end face from the inner end of upper surface 53D 93.Thereby, it is possible to handle the narrow region in upper surface peripheral part 911 and downside end face 93b near the end 94 of substrate 9.It needs It is noted that substrate board treatment 1 by nozzle retaining feature 50 makes nozzle 51 and other components 52 to keep being integrated Mode is mobile, but substrate board treatment 1 can also not have nozzle retaining feature 50, and individually to each nozzle 51, its Elevating mechanism and the mobile mechanism moved radially in substrate 9 is arranged by component 5 in he.
<5. movement about substrate board treatment>
Figure 14 is the flow chart for indicating an example of movement for substrate board treatment 1.Figure 15 is for explanatory diagram 14 The figure of movement shown in flow chart.
Hereinafter, 4~Figure 15 illustrates an example of the movement of substrate board treatment 1 referring to Fig.1.The action example is by nozzle 51 and other components 52 be configured at it is respective processing position and from 911 ejection of upper surface peripheral part from nozzle 51 to substrate 9 processing The movement of liquid.Before the motion flow for starting Figure 14, nozzle 51 and other components 52 are configured in such as retreating position, rotate Chuck 21 keeps substrate 9 but does not rotate.
The control unit 130 of substrate board treatment 1 controls rotating mechanism 231, starts to make rotary chuck 21 with rotary shaft a1 Center is rotated (the step S110 of Figure 14, Figure 15).The rotation is for example carried out with the rotation speed of 2000rpm.
Control unit 130 control lifting driving portion 68, rotary driving part 69, nozzle retaining feature 50 is configured from retreating position Outer fix in the side (radial direction of substrate 9) of the substrate 9 relative to processing position.Go up and down driving portion 68, rotary driving part Nozzle 51, other components 52 are configured to respective outer fix (the step of Figure 14, Figure 15 from respective retreating position by 69 S120).Nozzle 51, other components 52 respective outer fix be located at the side (diameter of substrate 9 relative to respective processing position To) outside.
Control unit 130 controls processing unit 5, and nozzle 51 is made to start to carry out the ejection target area 521 on other components 52 Treatment fluid ejection (the step S130 of Figure 14, Figure 15).The ejection target area 521 of other components 52 is ejected to from nozzle 51 Treatment fluid spread along the upper surface of other components 52 53, and from the inner end of other components 52 to the external row of other components 52 Out.But since nozzle 51, other components 52 are configured in respective outer fix, it is expelled to the outer of other components 52 The treatment fluid in portion can not fall in the upper surface peripheral part 911 of substrate 9.
Control unit 130 waits ejection in stable condition (Figure 14, Figure 15 of the liquid stream L1 of the treatment fluid up to being sprayed by nozzle 51 Step S140).Waiting time first passes through experiment etc. in advance for example to obtain and be stored in the ROM etc. of control unit 130.
Control unit 130 control rotary driving part 69, by nozzle retaining feature 50 along substrate 9 radial arrangement in substrate 9 The processing position of 93 side of end face.Nozzle 51, other components 52 are configured at the side of substrate 9 by rotary driving part 69 as a result, more in detail For thin, it is configured at respective processing position (referred to as " inner side ") (the step of Figure 14, Figure 15 of the side of end face 93 S150).During nozzle 51, other components 52 are mobile to respective processing position, nozzle 51 persistently sprays treatment fluid.Cause This, when nozzle 51, other components 52 are configured at respective processing position, to the treatment fluid for spraying the ejection of target area 521 The ejection state of liquid stream L1 is stable state.That is, from target area 521 is sprayed to the inner end of the upper surface of other components 52 53 The state of the liquid film of the treatment fluid of flowing is also stable.
Control unit 130 carries out base by making the nozzle 51 for being configured at processing position persistently spray treatment fluid with original state The processing (the step S160 of Figure 14, Figure 15) of the upper surface peripheral part 911 of plate 9.
If such as the processing of the upper surface peripheral part 911 of substrate 9 terminates after the specified time, control unit 130 Processing unit 5 is controlled to stop spraying treatment fluid (the step S170 of Figure 14, Figure 15) from nozzle 51.Control unit 130 can make to handle It before portion 5 stops spraying treatment fluid from nozzle 51, spray rotary driving part 69 will while spraying treatment fluid from nozzle 51 Mouth 51 and other components 52 are configured at respective outer fix, later, stop spraying treatment fluid from nozzle 51.
Control unit 130 controls rotating mechanism 231 come the rotation (the step S180 of Figure 14, Figure 15) for the chuck 21 that stops rotating, And terminate the movement of the flow chart of Figure 14.
<6. about other embodiments>
Figure 16 is the side schematic view for the structure for illustrating the substrate board treatment 1A of other embodiments.Figure 17 is to use In the upper surface schematic diagram for the structure for illustrating substrate board treatment 1A.Figure 18 is for illustrating relative to substrate board treatment 1A The upper surface schematic diagram of the movement of other components 73 of substrate board treatment 1A when the carrying-in/carrying-out of substrate 9.
Identically as substrate board treatment 1, substrate board treatment 1A is by pivoting about to rotary shaft a1 The upper surface peripheral part 911 of substrate 9 equal spray treatment fluid to carry out the device of the processing of upper surface peripheral part 911 etc..
As the structure different from substrate board treatment 1, substrate board treatment 1A substitutes substrate by configuring pedestal 25 The nozzle retaining feature 50 of processing unit 1 substitutes other components 52 by configuring other components 73.Nozzle 51 is fixed in arm The lower section on 63 top.
Pedestal 25 is circular component, the hole portion for being inserted into center by that will rotate axle portion 22, and pedestal 25 is fixed In rotation axle portion 22.The axle center of pedestal 25 is identical as the rotation axle center of axle portion 22, and is set as consistent with rotary shaft a1.As a result, Rotation axle portion 22 is rotated centered on rotary shaft a1 and with direction identical with substrate 9, identical speed.
Other components 73 are the circumferential direction along the substrate 9 centered on rotary shaft a1 and periphery (end 94, end for surrounding substrate 9 Face 93) plate annular component.
Other components 73 have multiple (being three in the example of diagram) arc-shaped component 73a~73c.Two arc-shaped components One end in the circumferential direction of each comfortable substrate 9 of 73a, 73b is toward each other.Arc-shaped component 73a, 73b are configured to respective The other end centered on rotated respectively in the horizontal plane.Four points of pact along the periphery of substrate 9 of arc-shaped component 73a, 73b One of length be extended, arc-shaped component 73c along the periphery of substrate 9 the length of about half be extended.Other components 73 upper surface is generally horizontal plane.The shape of longitudinal cross-section as other components 73 (arc-shaped component 73a~73c), example Such as, using other components 52, the cross sectional shape of 52A~52D.
Arc-shaped component 73c by two tabs 75 being provided projectingly upwards from the upper surface of pedestal 25, with pedestal The mode of 25 upper surface interval is fixed in pedestal 25.Arc-shaped component 73a, 73b is respective another by being installed on The tab 74 at end, is fixed in pedestal 25.In more detail, tab 74 passes through the rotary driving part that is made of stepper motor etc. (" rotating mechanism ") 79 can be rotated centered on its axle center.The axle center is vertical axis.
Therefore, substrate board treatment 1A is by making 231 spin stand platform 25 of rotating mechanism make other structures via pedestal 25 etc. Part 73 is rotated with rotation speed identical with substrate 9.Rotary driving part 23, rotation axle portion 22, pedestal 25, rotary driving part 79, tab 74, tab 75 are the rotating mechanisms 251 for pivoting about other components 73 with rotary shaft a1.
Arc-shaped component 73a, 73b is rotated under the driving of rotary driving part 79 via tab 74, so that respective one End away from each other must be bigger than the diameter of substrate 9 using respective tab 74, i.e. using the respective other end as rotation center, thus The state shown in Figure 17 becomes state as shown in figure 18.One end of arc-shaped component 73a, 73b away from each other in the state of, Substrate is moved out from substrate board treatment 1 or substrate is moved in into substrate board treatment 1.
Substrate board treatment 1A has structure identical with substrate board treatment 1 other than above-mentioned difference, and carries out Processing to the upper surface peripheral part 911 of substrate 9.
That is, other components 73 are in a manner of 93 interval of end face with the substrate 9 for being held in rotary chuck 21 along substrate 9 Radial arrangement in the outside of substrate 9.Nozzle 51 is in a manner of it can fall in and spray target area 731 from ejection target area 731 top sprays treatment fluid, and described described at least part for spraying target area 731 is contained in the upper of other components 73 Surface.The treatment fluid that the interval of other components 73 and the end face 93 of substrate 9 is arranged to make to fall in ejection target area 731 flows through The upper surface of other components 73 and be discharged from the inner end of the side rotary shaft a1 of the upper surface, and fall in the upper of substrate 9 from top Surface periphery portion 911.Substrate board treatment 1A moves nozzle 51 and other components 73 respectively.Although nozzle 51 is driven by lifting Dynamic portion 68, rotary driving part 69 and radial direction and vertical direction along substrate 9 move, but other components 73 are in addition to part of it It is fixed relative to pedestal 25 except (arc-shaped component 73a, 73b), and together with pedestal 25, i.e., it is rotated together with substrate 9.It can be with It is that the whole of ejection target area 731 is contained in the upper surface of other components 73, is also possible to spray the one of target area 731 Expose from the inner end of the upper surface of other components 73 to the side rotary shaft a1 part.
It should be noted that can have in the lower section of rotary driving part 79 and each tab 75 in each processing position and It is located at the driving that arc-shaped component 73a~73c is driven between the outer fix in the radial outside of substrate 9 relative to processing position Mechanism.In the case, in substrate board treatment 1A, other components 73 (arc-shaped component 73a~73c) can also be configured In outer fix, treatment fluid is then sprayed from nozzle 51 to other components 73, and after the stabilization to be painted to do well, by other structures Part 73 (arc-shaped component 73a~73c) is configured at processing position.
According to any of the substrate board treatment of present embodiment as described above and substrate processing method using same, it will be able to By fall at least part be contained in other components 52 (73) upper surface ejection target area 521 (731) in a manner of from Nozzle 51 sprays treatment fluid.Other components 52 (73) are matched in a manner of 93 interval of end face with substrate 9 along the radial direction of substrate 9 It is placed in the outside of substrate 9, the treatment fluid which is set to make to fall in ejection target area 521 (731) flows through other components The upper surface of 52 (73) and be discharged from the inner end of the side rotary shaft a1 of the upper surface, and fall in from top the upper surface of substrate 9 Peripheral part 911.Therefore, the processing width that treatment fluid can not only be made to handle the upper surface peripheral part 911 of substrate 9 becomes It is narrow, additionally it is possible to improve the uniformity of processing width.
In addition, being sprayed target area 521 (731) according to the substrate board treatment of present embodiment formed as described above Whole be contained in the upper surfaces of other components 52 (73).Therefore, the treatment fluid of the upper surface peripheral part 911 of substrate 9 is fallen in Be all from spray target area 521 (731) flow through the upper surface of other components 52 (73) and from the rotary shaft a1 of the upper surface The treatment fluid of the inner end discharge of side.Therefore, can shorten treatment fluid fall in substrate 9 upper surface peripheral part 911 position and The radial distance along substrate 9 of the inner end of other components 52 (73).Thereby, it is possible to further make treatment fluid to substrate 9 The processing width that upper surface peripheral part 911 is handled attenuates.
In addition, according to the substrate board treatment of present embodiment formed as described above, since nozzle retaining feature 50 will Nozzle 51 and the holding of other components 52 are integrated, and therefore, treatment fluid can be sprayed in a manner of fixed ejection target area 521 by falling in Out.Thereby, it is possible to keep the discharge for the treatment fluid being discharged from inner end in stable condition.Thus, it is possible to make the upper surface periphery of substrate 9 The processing width in portion 911 is stablized.
In addition, other components 73 are along to rotate according to the substrate board treatment of present embodiment formed as described above The annular component of the periphery for circumferentially surrounding substrate 9 of substrate 9 centered on axis a1, other components 73 are with rotation identical with substrate 9 Rotary speed rotation.Therefore, even if also can be improved the upper of substrate 9 in the case where rotating other components 73 together with substrate 9 The uniformity of the processing width in surface periphery portion 911.
In addition, according to the substrate board treatment of present embodiment formed as described above, two arc-shaped components 73a, 73b It is arranged to one end toward each other and along the circumferentially-adjacent of substrate 9, and can makes respectively by rotation center of the respective other end One end away from each other and the mode of the distance the left diameter that is greater than substrate 9 is rotated.Therefore, pass through two arc-shaped structures The rotation of part 73a, 73b can carry out moving in and moving out for substrate 9 relative to substrate board treatment.
In addition, according to the substrate board treatment of present embodiment formed as described above, nozzle 51 is towards being configured in ratio Processing position more leans on the ejection target area 521 (731) of other components 52 (73) of the outer fix of the radial outside of substrate 9 to open Begin to spray treatment fluid, and during nozzle 51 sprays treatment fluid, other components 52 (73) are moved to processing position from outer fix. Therefore, it is able to suppress the upper surface periphery for leading to substrate 9 because of the chaotic influence for the liquid stream L1 for starting treatment fluid when spraying The processing width in portion 911 is uneven.
In addition, according to the substrate board treatment of present embodiment formed as described above, the upper table of other components 52 (73) The inner end of the side rotary shaft a1 in face more leans on the position of the side rotary shaft a1 than the periphery of substrate 9 along being radially disposed in for substrate 9.Cause This, can make the processing width of the upper surface peripheral part 911 of substrate 9 broaden.
In addition, according to the substrate board treatment of present embodiment formed as described above, the medial surface 55 of other components 52 It is tilted in a manner of with from lower end towards upper end and close to rotary shaft a1 relative to rotary shaft a1.Therefore, it can gone up and down In the case where his component 52, other components 52 can also be configured by going up and down other components 52 above processing position In processing position.
In addition, according to the substrate board treatment of present embodiment formed as described above, the medial surface of other components 52A 55A not only with from lower end towards upper end and close to rotary shaft a1, also, it is convexly curved obliquely upward relative to rotary shaft a1. Therefore, the radial interval homogenization of the end face 93 of substrate 9 and the substrate 9 of other components 52A can further be made.As a result, can Enough improve the treatment effeciency of the end face 93 of substrate 9.
In addition, according to the substrate board treatment of present embodiment formed as described above, other components 52B (52C) includes The medial surface 55B (55C) opposite with the end face 93 of substrate 9, and along the medial surface 55B of the section on plane comprising rotary shaft a1 The cross sectional shape of (55C) is bent along the end face of substrate 9 93.Therefore, end face 93 and other components of substrate 9 can further be made The radial interval along substrate 9 of 52B (52C) homogenizes.Thereby, it is possible to improve the treatment effeciency of the end face 93 of substrate 9.
Although being shown specifically and having illustrated the present invention, above explained all embodiments are merely illustrative. Therefore, the present invention suitably can be deformed and be omitted to embodiment within its invention scope.
Description of symbols
1,1A substrate board treatment
21 rotary chucks (holding member)
23 rotary driving parts
231 rotating mechanisms
251 rotating mechanisms
50 nozzle retaining features
51 nozzles
52, other components of 52A~52E
68 lifting driving portions
69 rotary driving parts
73 other components
73a~73c arc-shaped component
79 rotary driving parts (rotating mechanism)

Claims (11)

1. a kind of substrate board treatment, wherein include
Holding member, is set as from below remaining substrate approximate horizontal, and the substrate can be made with defined rotary shaft Center is rotated；
Rotating mechanism pivots about the holding member with the rotary shaft；
Other components, the radial direction with the end face of the substrate for being held in the holding member at spaced intervals along the substrate are matched It is placed in the outside of the substrate；And
Nozzle sprays treatment fluid from the top for spraying target area in a manner of it can fall in and spray target area, described At least part for spraying target area is contained in the upper surface of other components,
The interval between other described components and the end face of the substrate is configured to: falling in the ejection target area The treatment fluid flows through the upper surface of other components and can be discharged from the inner end of the rotation shaft side of the upper surface, And the upper surface peripheral part of the substrate is fallen in from top.
2. substrate board treatment documented by according to claim 1, wherein
The upper surface for spraying target area and being all contained in other components.
3. according to claim 1 or substrate board treatment documented by 2, wherein
Also have and the nozzle and other described components are kept into the nozzle retaining feature being integrated.
4. according to claim 1 or substrate board treatment documented by 2, wherein
Other described components are the rings along the periphery for circumferentially surrounding the substrate of the substrate centered on the rotary shaft Shape component,
The substrate board treatment further includes the rotating mechanism of the annular component, and the rotating mechanism of the annular component makes Other described components and the substrate are rotated with identical rotation speed.
5. the substrate board treatment according to documented by claim 4, wherein
The annular component has multiple arc-shaped components,
The multiple arc-shaped component has the circumferentially-adjacent two arc-shaped component along the substrate,
Described two respective one end in the circumferential direction of the substrate of arc-shaped component toward each other, described two arc-shaped structures Part is able to be rotated in the horizontal plane centered on the respective other end,
The substrate board treatment also has rotating mechanism, which can make described two arc-shaped components respectively with institute State two respective other ends of arc-shaped component for rotation center rotation so that described two respective one end of arc-shaped component that This leaves bigger than the diameter of the substrate.
6. according to claim 1 to substrate board treatment documented by any one of 5, wherein
The substrate board treatment includes
Radial drive portion can make other components moving radially along the substrate；And
Control unit, for controlling the radial drive portion and the nozzle,
Using fall in the treatment fluid for spraying target area flow through the upper surface of other components and from this table Other structures described in when the inner end of the rotation shaft side in face is discharged and falls in the upper surface peripheral part of the substrate from top When processing position of the position of part to define other components,
The control unit more leans on the base than the processing position being configured at the radial drive portion by other described components During the outer fix in the radial outside of plate, the nozzle is made to spray the processing initially towards the ejection target area Liquid, also, on one side make the nozzle make while spraying the treatment fluid radial drive portion will other described components from described Outer fix is moved to the processing position.
7. according to claim 1 to substrate board treatment documented by any one of 6, wherein
The inner end of the rotation shaft side of the upper surface of other components is radially located at than the base the substrate The periphery of plate more leans on the position of the rotation shaft side.
8. according to claim 1 to substrate board treatment documented by any one of 7, wherein
Other described components include the medial surface opposite with the end face of the substrate, and the medial surface is with from lower end court It is tilted to upper end close to the mode of the rotary shaft relative to the rotary shaft.
9. according to claim 1 to substrate board treatment documented by any one of 7, wherein
Other described components include the medial surface opposite with the end face of the substrate, and the medial surface is with from lower end direction Upper end and close to the rotary shaft, also, it is convexly curved relative to the axial rotary oblique upper.
10. according to claim 1 to substrate board treatment documented by any one of 7, wherein
Other described components include the medial surface opposite with the end face of the substrate, and the medial surface is including the rotation Cross sectional shape in the plane of shaft is bent along the end face of the substrate.
11. a kind of substrate processing method using same of substrate board treatment, wherein
The substrate board treatment includes
Holding member, is arranged to from below remain substrate approximate horizontal, and the substrate can be made with defined rotary shaft It pivots about；
Rotating mechanism pivots about the holding member with the rotary shaft；
Other components are configured as leaving from the substrate；And
Nozzle can spray treatment fluid,
The substrate processing method using same includes:
With the end face of the substrate at spaced intervals by other described components along the substrate radial arrangement in the substrate The step of outside；And
The nozzle is set to spray treatment fluid from the top for spraying target area in a manner of it can fall in and spray target area The step of, described at least part for spraying target area is contained in the upper surface of other components,
The interval between other described components and the end face of the substrate is configured to: falling in the ejection target area The treatment fluid flows through the upper surface of other components and can be discharged from the inner end of the rotation shaft side of the upper surface, And the upper surface peripheral part of the substrate is fallen in from top.
CN201780023526.3A 2016-04-13 2017-04-06 Substrate processing apparatus and substrate processing method Active CN109075051B (en)

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TW201741038A (en) 2017-12-01
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WO2017179481A1 (en) 2017-10-19
JP2017191849A (en) 2017-10-19

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