CN109065655A - 一种封装前板及其制备工艺 - Google Patents
一种封装前板及其制备工艺 Download PDFInfo
- Publication number
- CN109065655A CN109065655A CN201811118181.2A CN201811118181A CN109065655A CN 109065655 A CN109065655 A CN 109065655A CN 201811118181 A CN201811118181 A CN 201811118181A CN 109065655 A CN109065655 A CN 109065655A
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- Prior art keywords
- layer
- film
- coating
- foreboard
- silica gel
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 80
- 239000011248 coating agent Substances 0.000 claims abstract description 76
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000002131 composite material Substances 0.000 claims abstract description 53
- 239000012528 membrane Substances 0.000 claims abstract description 49
- 239000000741 silica gel Substances 0.000 claims abstract description 48
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000032683 aging Effects 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000002834 transmittance Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 10
- 230000003712 anti-aging effect Effects 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229920000620 organic polymer Polymers 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 238000010422 painting Methods 0.000 claims description 8
- 238000007761 roller coating Methods 0.000 claims description 7
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005137 deposition process Methods 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 13
- 238000012536 packaging technology Methods 0.000 abstract description 5
- 230000003666 anti-fingerprint Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 136
- 239000010408 film Substances 0.000 description 118
- 230000000694 effects Effects 0.000 description 11
- 238000004806 packaging method and process Methods 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 7
- 239000012766 organic filler Substances 0.000 description 6
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229910052593 corundum Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 5
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 229910001845 yogo sapphire Inorganic materials 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000003678 scratch resistant effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 3
- UGFMBZYKVQSQFX-UHFFFAOYSA-N para-methoxy-n-methylamphetamine Chemical group CNC(C)CC1=CC=C(OC)C=C1 UGFMBZYKVQSQFX-UHFFFAOYSA-N 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 2
- BHKKSKOHRFHHIN-MRVPVSSYSA-N 1-[[2-[(1R)-1-aminoethyl]-4-chlorophenyl]methyl]-2-sulfanylidene-5H-pyrrolo[3,2-d]pyrimidin-4-one Chemical compound N[C@H](C)C1=C(CN2C(NC(C3=C2C=CN3)=O)=S)C=CC(=C1)Cl BHKKSKOHRFHHIN-MRVPVSSYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010068 moulding (rubber) Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 208000007578 phototoxic dermatitis Diseases 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811118181.2A CN109065655A (zh) | 2018-09-25 | 2018-09-25 | 一种封装前板及其制备工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811118181.2A CN109065655A (zh) | 2018-09-25 | 2018-09-25 | 一种封装前板及其制备工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109065655A true CN109065655A (zh) | 2018-12-21 |
Family
ID=64765840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811118181.2A Pending CN109065655A (zh) | 2018-09-25 | 2018-09-25 | 一种封装前板及其制备工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109065655A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109830558A (zh) * | 2018-12-24 | 2019-05-31 | 汉能移动能源控股集团有限公司 | 太阳能电池封装板、制备方法及包含其的太阳能电池 |
CN110172307A (zh) * | 2019-05-28 | 2019-08-27 | 深圳华硕新材料应用科技有限公司 | 一种用于光感屏下指纹解锁的srf薄膜的制作方法 |
CN111430500A (zh) * | 2018-12-24 | 2020-07-17 | 汉能移动能源控股集团有限公司 | 一种太阳能复合封装板的制备工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004228141A (ja) * | 2003-01-20 | 2004-08-12 | Sharp Corp | 薄膜太陽電池およびその製造方法 |
US20060000506A1 (en) * | 2004-07-02 | 2006-01-05 | Christoph Brabec | Organic photovoltaic component with encapsulation |
CN106992255A (zh) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | 封装结构、其制作方法与其应用 |
CN106992253A (zh) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | 封装结构、薄膜太阳能电池及有机发光显示装置 |
CN107369734A (zh) * | 2017-05-19 | 2017-11-21 | 浙江帝恒实业有限公司 | 一种耐候性太阳能电池背板及其制备方法 |
CN107393986A (zh) * | 2016-05-11 | 2017-11-24 | 张家港康得新光电材料有限公司 | 封装材料及其制备方法以及光电器件 |
CN108016101A (zh) * | 2017-12-15 | 2018-05-11 | 东莞市达瑞电子股份有限公司 | 一种多层复合高透光率保护膜及其制作方法 |
-
2018
- 2018-09-25 CN CN201811118181.2A patent/CN109065655A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004228141A (ja) * | 2003-01-20 | 2004-08-12 | Sharp Corp | 薄膜太陽電池およびその製造方法 |
US20060000506A1 (en) * | 2004-07-02 | 2006-01-05 | Christoph Brabec | Organic photovoltaic component with encapsulation |
CN106992255A (zh) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | 封装结构、其制作方法与其应用 |
CN106992253A (zh) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | 封装结构、薄膜太阳能电池及有机发光显示装置 |
CN107393986A (zh) * | 2016-05-11 | 2017-11-24 | 张家港康得新光电材料有限公司 | 封装材料及其制备方法以及光电器件 |
CN107369734A (zh) * | 2017-05-19 | 2017-11-21 | 浙江帝恒实业有限公司 | 一种耐候性太阳能电池背板及其制备方法 |
CN108016101A (zh) * | 2017-12-15 | 2018-05-11 | 东莞市达瑞电子股份有限公司 | 一种多层复合高透光率保护膜及其制作方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109830558A (zh) * | 2018-12-24 | 2019-05-31 | 汉能移动能源控股集团有限公司 | 太阳能电池封装板、制备方法及包含其的太阳能电池 |
CN111430500A (zh) * | 2018-12-24 | 2020-07-17 | 汉能移动能源控股集团有限公司 | 一种太阳能复合封装板的制备工艺 |
CN110172307A (zh) * | 2019-05-28 | 2019-08-27 | 深圳华硕新材料应用科技有限公司 | 一种用于光感屏下指纹解锁的srf薄膜的制作方法 |
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Effective date of registration: 20201225 Address after: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Beijing Huihong Technology Co.,Ltd. Address before: Hanneng mobile Energy Holding Group Co., Ltd., room 107, building 2, Olympic Village street, Chaoyang District, Beijing Applicant before: HANERGY MOBILE ENERGY HOLDING GROUP Co.,Ltd. |
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Effective date of registration: 20211101 Address after: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Dongjun new energy Co.,Ltd. Address before: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant before: Beijing Huihong Technology Co.,Ltd. |
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