CN109052307A - 晶圆结构及晶圆加工方法 - Google Patents
晶圆结构及晶圆加工方法 Download PDFInfo
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- CN109052307A CN109052307A CN201810746874.XA CN201810746874A CN109052307A CN 109052307 A CN109052307 A CN 109052307A CN 201810746874 A CN201810746874 A CN 201810746874A CN 109052307 A CN109052307 A CN 109052307A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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CN201810746874.XA CN109052307B (zh) | 2018-07-09 | 2018-07-09 | 晶圆结构及晶圆加工方法 |
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CN201810746874.XA CN109052307B (zh) | 2018-07-09 | 2018-07-09 | 晶圆结构及晶圆加工方法 |
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CN109052307A true CN109052307A (zh) | 2018-12-21 |
CN109052307B CN109052307B (zh) | 2020-11-17 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112010257A (zh) * | 2020-07-21 | 2020-12-01 | 无锡韦尔半导体有限公司 | 晶圆结构及晶圆加工方法 |
CN112621288A (zh) * | 2020-12-11 | 2021-04-09 | 信联智翊科技(苏州)有限公司 | 一种基于扇形衬套的高效批量加工治具及其作业方法 |
CN113460948A (zh) * | 2021-06-30 | 2021-10-01 | 西人马联合测控(泉州)科技有限公司 | 一种芯片封装结构和芯片封装方法 |
Citations (8)
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CN102947683A (zh) * | 2010-04-26 | 2013-02-27 | Hme有限公司 | 温度传感器及采用该温度传感器的辐射温度计、温度传感器的制造方法、采用光刻胶膜的多层薄膜热电堆及采用该热电堆的辐射温度计、以及多层薄膜热电堆的制造方法 |
DE102013213065A1 (de) * | 2013-07-04 | 2015-01-08 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
CN104936123A (zh) * | 2015-05-22 | 2015-09-23 | 北京卓锐微技术有限公司 | 一种硅电容麦克风的制造方法 |
CN106252388A (zh) * | 2016-04-08 | 2016-12-21 | 苏州能讯高能半导体有限公司 | 半导体晶圆及其制造方法 |
CN106467289A (zh) * | 2015-08-20 | 2017-03-01 | 北京卓锐微技术有限公司 | 晶圆结构及晶圆加工方法 |
US20170076937A1 (en) * | 2013-03-05 | 2017-03-16 | Infineon Technologies Americas Corp. | Method of Fabricating III-Nitride Semiconductor Dies |
CN107464777A (zh) * | 2016-06-02 | 2017-12-12 | 苏州能讯高能半导体有限公司 | 半导体晶圆及其制造方法 |
CN107686092A (zh) * | 2016-08-04 | 2018-02-13 | 北京卓锐微技术有限公司 | 晶圆结构及晶圆加工方法 |
-
2018
- 2018-07-09 CN CN201810746874.XA patent/CN109052307B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102947683A (zh) * | 2010-04-26 | 2013-02-27 | Hme有限公司 | 温度传感器及采用该温度传感器的辐射温度计、温度传感器的制造方法、采用光刻胶膜的多层薄膜热电堆及采用该热电堆的辐射温度计、以及多层薄膜热电堆的制造方法 |
US20170076937A1 (en) * | 2013-03-05 | 2017-03-16 | Infineon Technologies Americas Corp. | Method of Fabricating III-Nitride Semiconductor Dies |
DE102013213065A1 (de) * | 2013-07-04 | 2015-01-08 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
CN104936123A (zh) * | 2015-05-22 | 2015-09-23 | 北京卓锐微技术有限公司 | 一种硅电容麦克风的制造方法 |
CN106467289A (zh) * | 2015-08-20 | 2017-03-01 | 北京卓锐微技术有限公司 | 晶圆结构及晶圆加工方法 |
CN106252388A (zh) * | 2016-04-08 | 2016-12-21 | 苏州能讯高能半导体有限公司 | 半导体晶圆及其制造方法 |
CN107464777A (zh) * | 2016-06-02 | 2017-12-12 | 苏州能讯高能半导体有限公司 | 半导体晶圆及其制造方法 |
CN107686092A (zh) * | 2016-08-04 | 2018-02-13 | 北京卓锐微技术有限公司 | 晶圆结构及晶圆加工方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112010257A (zh) * | 2020-07-21 | 2020-12-01 | 无锡韦尔半导体有限公司 | 晶圆结构及晶圆加工方法 |
CN112010257B (zh) * | 2020-07-21 | 2023-12-08 | 无锡韦感半导体有限公司 | 晶圆结构及晶圆加工方法 |
CN112621288A (zh) * | 2020-12-11 | 2021-04-09 | 信联智翊科技(苏州)有限公司 | 一种基于扇形衬套的高效批量加工治具及其作业方法 |
CN113460948A (zh) * | 2021-06-30 | 2021-10-01 | 西人马联合测控(泉州)科技有限公司 | 一种芯片封装结构和芯片封装方法 |
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CN109052307B (zh) | 2020-11-17 |
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Effective date of registration: 20201119 Address after: 214000 5th floor, building C, swan tower, Wuxi Software Park, No.111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Weil Semiconductor Co.,Ltd. Address before: 430074 Three Floors of Henglong Building D Building in Huazhong Dawn Software Park, No. 1 Guanshan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: WUHAN NAIPUDENG TECHNOLOGY Co.,Ltd. |
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Address after: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weil Semiconductor Co.,Ltd. |
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Effective date of registration: 20220921 Address after: Room 501, 5th Floor, Building C, Cygnus Building, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Senxin Technology Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weigan Semiconductor Co.,Ltd. |