CN109047610A - A kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly - Google Patents
A kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly Download PDFInfo
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- CN109047610A CN109047610A CN201810821752.2A CN201810821752A CN109047610A CN 109047610 A CN109047610 A CN 109047610A CN 201810821752 A CN201810821752 A CN 201810821752A CN 109047610 A CN109047610 A CN 109047610A
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- punch
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J13/00—Details of machines for forging, pressing, or hammering
- B21J13/02—Dies or mountings therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/06—Heating or cooling methods or arrangements specially adapted for performing forging or pressing operations
Abstract
A kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly, it is related to a kind of microsecond delay floating die assembly, and in particular to a kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly.The present invention is in order to solve the miniature blank heating low efficiency of existing titanium alloy micro-cell electron capture detector die forging, and corner is difficult to be full of minisize mould stress greatly, under miniature gears, the short problem of die life.Formed punch of the invention is mounted on the lower surface of the upper die component, punch-pin is mounted on the upper surface of the lower mold assemblies, die case is on punch-pin, the type chamber is located at the underface of formed punch, the setting of titanium alloy forging stock is intracavitary in the type, one end of first conducting wire is connect by a terminal with the upper die component, the other end of first conducting wire is connect with the pulse power, one end of second conducting wire is connect by another terminal with the lower mold assemblies, and the other end of the second conducting wire is connect with the pulse power.The invention belongs to machine-building and Plastic Microforming Technology fields.
Description
Technical field
The present invention relates to a kind of microsecond delay floating die assemblies, and in particular to a kind of Ti alloy miniature gear pulse current auxiliary is micro-
Floating die assembly is shaped, machine-building and Plastic Microforming Technology field are belonged to.
Background technique
Titanium alloy material thermal coefficient is low, and machining deformation springback capacity is big, and cutting ability is poor, and machining accuracy is difficult to ensure, and
And temperature-room type plasticity is poor, titanium alloy parts with microstructure is needed using hot forming.This to Plastic microforming process, mold design with
And lubricating method etc. proposes rigors, so that being difficult to realize by the microsecond delay technology that mold applies load merely.
It is that electric field is directly acted on blank that electric current, which assists microsecond delay technology, is made by energy transmission, conversion and field excitation
With so that blank internal microstructure, mechanical property and thermo parameters method change, and the field of force applied with outside couples
Carry out auxiliary microsecond delay.The technology is substantially reduced titanium alloy material resistance of deformation using pulsed current excitation effect, and plasticity is aobvious
It writes and improves, or even there is superplastic ability, the microforming behavior of the difficult-to-deformation materials such as titanium alloy can be significantly improved.
However, micro-cell electron capture detector shaped structure size is small, generally in micron dimension, miniature gears cavity filling is very difficult.It adopts
Gear profile is only shaped with the manufacturing process of conventional fixed cavity plate, filling quality is very poor, and main cause is: first is that type chamber
Surface to volume ratio is larger, and mold forming more macroscopical to the frictional resistance of blank dramatically increases；Second is that mould size
Smaller, the load being able to bear is limited, and the load of application needs to effectively act on blank.In order to solve this problem, at present
The process being widely used has floating cavity die, and the patent of publication number CN1554499 is " for the miniature of miniature parts precision form
Floating die assembly device " solves the problems, such as minisize mould and blank positioning accuracy is low, minisize mould stress is big, but use
Heating method is difficult to realize the forming of the difficult-to-deformation materials miniature gears such as titanium alloy.
Summary of the invention
The present invention is to solve the existing miniature blank heating low efficiency of titanium alloy micro-cell electron capture detector die forging, and minisize mould stress is big, micro-
Corner is difficult to be full of under type gear, the short problem of die life, and then proposes a kind of Ti alloy miniature gear pulse current
Assist microsecond delay floating die assembly.
The technical solution adopted by the present invention to solve the above problem is as follows: the present invention includes upper die component, lower mold assemblies, punching
Head, punch-pin, cavity plate, the pulse power, the first conducting wire, the second conducting wire and two terminals, the upper die component and the lower die
Component is from top to bottom set gradually, and formed punch is mounted on the lower surface of the upper die component, and punch-pin is mounted on the lower mold assemblies
Upper surface, die case is on punch-pin, and the upper surface composing type chamber of the inner wall of cavity plate and punch-pin, the type chamber are located at formed punch
Underface, the setting of titanium alloy forging stock is intracavitary in the type, and one end of the first conducting wire passes through a terminal and the upper mold group
Part connection, the other end of the first conducting wire connect with the pulse power, one end of the second conducting wire pass through another terminal with it is described
Lower mold assemblies connection, the other end of the second conducting wire are connect with the pulse power.
Further, the upper die component includes cope plate, upper insulation plate, upper padding plate and punch fixing plate, cope plate, on
Insulation board, upper padding plate and punch fixing plate are from top to bottom sequentially overlapped setting, and cope plate is detachable by screw and upper insulation plate
Connection, upper insulation plate are connect by screw with impulsion fixed plate, and one end of the first conducting wire is solid by a terminal and formed punch
Fixed board connection, the upper end of formed punch is inlaid in the middle part of punch fixing plate lower surface.
Further, the lower mold assemblies include blank holder, cavity plate fixed block, cushion block, the first lower insulation plate, lower bolster,
Second lower insulation plate, lower template, collets, pin, sliding shoe and two springs, the first lower insulation plate, lower bolster, second descend absolutely
Listrium, lower template are from top to bottom sequentially overlapped setting, and lower template is detachably connected by screw and the second lower insulation plate, under second
Insulation board is detachably connected by screw and lower bolster, and one end of the second conducting wire is connected by another terminal and lower bolster
It connects, the lower end of punch-pin is inlaid in the middle part of the first lower insulation plate upper surface, and cavity plate fixed block passes through screw and the first lower insulation plate
Upper surface be detachably connected, punch-pin is located in cavity plate fixed block, and blank holder is connected by the upper surface of screw and cavity plate fixed block
It connects, cavity plate is inlaid on sliding shoe, and sliding shoe is located in cavity plate fixed block, and sliding shoe can be along the inner wall straight line of cavity plate fixed block
It moves up and down, collets, cushion block are successively set on punch-pin two sides from the inside to the outside, and the inner wall of collets passes through pin and punch-pin
Outer wall is located by connecting, and two springs are symmetricly set on the two sides of punch-pin, and the following table face contact of the upper end of spring and sliding shoe, bullet
The lower end of spring is contacted with the upper surface of cushion block.
Further, the invention also includes four guide sleeves and four guide posts, four guide sleeves are symmetricly set on the two sides of formed punch,
And the upper end of each guide sleeve is fixedly connected with the lower surface of cope plate, the upper end of each guide post is inserted into a guide sleeve respectively
In lower end, the lower end of each guide post is fixedly connected with the upper surface of lower template.
Further, the reference diameter of cavity plate is less than 10mm, the fit clearance between the internal tooth and punch-pin external tooth of cavity plate
Less than 10 μm.
The beneficial effects of the present invention are: the present invention is directed to difficult-to-deformation material miniature gears design feature, propose based on floating
The Ti alloy miniature gear pulse current of dynamic cavity plate assists microsecond delay mold, is realized using pulse current to titanium alloy forging stock
It rapidly and efficiently heats, reduces resistance of deformation, improve forming accuracy.Meanwhile floating die assembly technique being cooperated to make cavity plate with respect to work
Part moves downward, and using relative friction forces, material is promoted to flow downward, and is conducive to the filling of corner under gear.
The present invention also has the effect that compared with prior art
1, it is realized using pulse current ancillary technique and titanium alloy forging stock is quickly heated, the time is short, temperature rise is big, efficiency
Height, heating speed have been shortened within several seconds to a few minutes from several minutes of even a few hours of common Muffle furnace, have been greatly improved
Production efficiency, reduces production cost.
2, using the micro-forming method based on floating cavity die, by changing mold in forming to the direction of blank,
The frictional resistance for hindering blank filling is become to effectively increase the filling energy of corner under gear conducive to the active friction power of forming
Power simultaneously reduces shaping load, shapes the miniature gears part that filling quality is good, dimensional accuracy is high.
3, the present invention guarantees that miniature gears part forming accuracy, die device can be small by the cooperation between die assembly
It uses, can also be used in Material Testing Machine on type press machine, hydraulic press, there is good applicability.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is cavity plate three dimensional structure diagram of the invention；
Fig. 3 is punch-pin three dimensional structure diagram of the invention.
Specific embodiment
Specific embodiment 1: embodiment is described with reference to Fig. 1, a kind of Ti alloy miniature gear described in present embodiment
It includes upper die component, lower mold assemblies, formed punch 5, punch-pin 19, cavity plate 21, the pulse power that pulse current, which assists microsecond delay floating die assembly,
22, the first conducting wire 23, the second conducting wire 25 and two terminals 24, the upper die component and the lower mold assemblies from top to bottom according to
Secondary setting, formed punch 5 are mounted on the lower surface of the upper die component, and punch-pin 19 is mounted on the upper surface of the lower mold assemblies, cavity plate
21 are sleeved on punch-pin 19, and the upper surface composing type chamber of the inner wall of cavity plate 21 and punch-pin 19, the type chamber are being located at formed punch 5 just
Lower section, the setting of titanium alloy forging stock 6 is intracavitary in the type, and one end of the first conducting wire 23 passes through a terminal 24 and the upper mold
Component connection, the other end of the first conducting wire 23 are connect with the pulse power 22, and one end of the second conducting wire 25 is connect by another conducting wire
First 24 connect with the lower mold assemblies, and the other end of the second conducting wire 25 is connect with the pulse power 22.At the center of punch fixing plate 4
It is provided with up big and down small step through-hole, formed punch 5 is fixed in the step through-hole.6 height of titanium alloy forging stock is less than punch-pin 19
The depth of cavity that upper end and 21 internal model of cavity plate are formed.
Upper insulation plate 2, the first lower insulation plate 13, the second lower insulation plate 15 and 17 material of collets are mica or glass fibers
Dimension, so set, for insulation and heat-insulated needs, it is ensured that equipment safety reduces thermal losses, protects mold；Formed punch
5, punch-pin 19 and 21 material of cavity plate are Talide, so set, since Talide resistance is small, intensity
Height is suitable as the mold materials of electric current auxiliary die-forging forming.
High frequency pulse power supply of the pulse power 22 for laboratory independent development, 0~100V of output voltage, electric current 0~
5000A, frequency 100Hz~10KHz, duty ratio 0~100%, pulse current output waveform are square waveform.It should illustrate
It is to be able to achieve using the pulse power (as long as pulse parameter values needed for miniature gears shape can be provided) of same specification in the market same
Effect.
Specific embodiment 2: embodiment is described with reference to Fig. 1, a kind of Ti alloy miniature gear described in present embodiment
It includes cope plate 1, upper insulation plate 2, upper padding plate 3 and punch fixing plate that pulse current, which assists the upper die component of microsecond delay floating die assembly,
4, cope plate 1, upper insulation plate 2, upper padding plate 3 and punch fixing plate 4 are from top to bottom sequentially overlapped setting, and cope plate 1 passes through screw
It is detachably connected with upper insulation plate 2, upper insulation plate 2 is connect by screw with impulsion fixed plate 4, and one end of the first conducting wire 23 passes through
One terminal 24 is connect with punch fixing plate 4, and the upper end of formed punch 5 is inlaid in the middle part of 4 lower surface of punch fixing plate.Its
It is formed and connection relationship is same as the specific embodiment one.
Specific embodiment 3: embodiment is described with reference to Fig. 1, a kind of Ti alloy miniature gear described in present embodiment
The lower mold assemblies of pulse current auxiliary microsecond delay floating die assembly include exhausted under blank holder 7, cavity plate fixed block 11, cushion block 12, first
Listrium 13, lower bolster 14, the second lower insulation plate 15, lower template 16, collets 17, pin 18, sliding shoe 20 and two springs 10,
First lower insulation plate 13, lower bolster 14, the second lower insulation plate 15, lower template 16 are from top to bottom sequentially overlapped setting, lower template 16
It is detachably connected by screw and the second lower insulation plate 15, the second lower insulation plate 15 is detachably connected by screw with lower bolster 14
It connects, one end of the second conducting wire 25 is connect by another terminal 24 with lower bolster 14, and the lower end of punch-pin 19 is inlaid in first
The middle part of 13 upper surface of lower insulation plate, cavity plate fixed block 11 are detachably connected by the upper surface of screw and the first lower insulation plate 13
It connects, punch-pin 19 is located in cavity plate fixed block 11, and blank holder 7 is connect by screw with the upper surface of cavity plate fixed block 11, cavity plate 21
It is inlaid on sliding shoe 20, sliding shoe 20 is located in cavity plate fixed block 11, and sliding shoe 20 can be along the inner wall of cavity plate fixed block 11
Straight line moves up and down, and collets 17, cushion block 12 are successively set on 19 two sides of punch-pin from the inside to the outside and the inner wall of collets 17 passes through
Pin 18 and the outer wall of punch-pin 19 are located by connecting, and two springs 10 are symmetricly set on the two sides of punch-pin 19, and the upper end of spring 10
It is contacted with the lower end of the following table face contact of sliding shoe 20, spring 10 with the upper surface of cushion block 12.It is other composition and connection relationship with
Specific embodiment one is identical.
Specific embodiment 4: embodiment is described with reference to Fig. 1, a kind of Ti alloy miniature gear described in present embodiment
It further includes four guide sleeves 8 and four guide posts 9 that pulse current, which assists microsecond delay floating die assembly, and four guide sleeves 8 are symmetricly set on formed punch 5
Two sides, and the upper end of each guide sleeve 8 is fixedly connected with the lower surface of cope plate 1, and the upper end of each guide post 9 is inserted into respectively
In the lower end of one guide sleeve 8, the lower end of each guide post 9 is fixedly connected with the upper surface of lower template 16.Other compositions and connection
Relationship is identical as specific embodiment one, two or three.
Specific embodiment 4: illustrating present embodiment in conjunction with Fig. 1 to Fig. 3, a kind of titanium alloy described in present embodiment is micro-
Type gear pulse current assist microsecond delay floating die assembly cavity plate 21 reference diameter be less than 10mm, the internal tooth of cavity plate 21 with it is convex
Fit clearance between 19 external tooth of mould is less than 10 μm.Other compositions and connection relationship are same as the specific embodiment one.
Working principle
Cavity plate 21 is fixed on 20 center of sliding shoe by pretightning force first, then blank holder 7 is mounted on cavity plate fixed block
On 11, so that sliding shoe 20 is floated up and down along cavity plate fixed block 11 and limit upper limit position in blank holder 7, then fill mold
It sets and is installed on former.The both ends of the pulse power 22 formed punch is connected respectively to using conducting wire 23 after completion mold installation to consolidate
On fixed board 4 and lower bolster 14, since 19 lower end of punch-pin is provided with the first lower insulation plate 13, punch-pin 19 left and right settings collets
17, pulse current will circulate in the circuit formed between formed punch 5, titanium alloy forging stock 6, cavity plate 21, punch-pin 19.Complete die device
Titanium alloy forging stock 6 is put into the type chamber of 19 upper end of punch-pin and the formation of 21 internal model of cavity plate after installation, former downlink drives punching
Head fixed plate 4, formed punch 5 etc., which are moved downward, forms closing chamber with 21 upper end face contact of floating cavity die, and former, which continues traveling downwardly, to be made
Formed punch 5 compresses titanium alloy forging stock 6.Formed punch 5 and 6 pre-applied force of titanium alloy forging stock are in 5~10MPa, starting impulse power supply 22, to titanium
Alloy forging stock 6 is heated, and is reached after keeping the temperature 0.5~5min after forming temperature, former continues traveling downwardly drive floating cavity die
21 move down, while formed punch 5 applies active force to titanium alloy forging stock 6, are deformed it until filling full gear die
Chamber.The deflection of titanium alloy forging stock 6 is controlled by the thickness of blank holder 7, and the blank holder 7 of different-thickness is selected to carry out limiting punch head 5
Downlink height to protect punch-pin 19 and cavity plate 21.After the completion of extrusion molding, the pulse power 22 is closed, press machine uplink drives punching
First 5 backhaul, sliding shoe 20 float to its upper limit position, after cooling take out gear member from cavity plate 11.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above are modified or are modified
For the equivalent embodiment of equivalent variations, but without departing from the technical solutions of the present invention, according to the technical essence of the invention,
Within the spirit and principles in the present invention, any simple modifications, equivalent substitutions and improvements to the above embodiments etc., still
Belong within the protection scope of technical solution of the present invention.
Claims (5)
1. a kind of Ti alloy miniature gear pulse current assists microsecond delay floating die assembly, it is characterised in that: a kind of titanium alloy
It includes upper die component, lower mold assemblies, formed punch (5), punch-pin (19), cavity plate that miniature gears pulse current, which assists microsecond delay floating die assembly,
(21), the pulse power (22), the first conducting wire (23), the second conducting wire (25) and two terminals (24), the upper die component and
The lower mold assemblies are from top to bottom set gradually, and formed punch (5) is mounted on the lower surface of the upper die component, and punch-pin (19) is mounted on
The upper surface of the lower mold assemblies, cavity plate (21) are sleeved on punch-pin (19), and the inner wall of cavity plate (21) and punch-pin (19) is upper
End face composing type chamber, the type chamber are located at the underface of formed punch (5), and titanium alloy forging stock (6) setting is intracavitary in the type, and first leads
One end of line (23) is connect by a terminal (24) with the upper die component, the other end of the first conducting wire (23) and pulse
One end of power supply (22) connection, the second conducting wire (25) is connect by another terminal (24) with the lower mold assemblies, and second
The other end of conducting wire (25) is connect with the pulse power (22).
2. a kind of Ti alloy miniature gear pulse current assists microsecond delay floating die assembly according to claim 1, feature exists
In: the upper die component include cope plate (1), upper insulation plate (2), upper padding plate (3) and punch fixing plate (4), cope plate (1),
Upper insulation plate (2), upper padding plate (3) and punch fixing plate (4) are from top to bottom sequentially overlapped setting, cope plate (1) by screw with
Upper insulation plate (2) is detachably connected, and upper insulation plate (2) is connect by screw with impulsion fixed plate (4), and the one of the first conducting wire (23)
End is connect by a terminal (24) with punch fixing plate (4), and the upper end of formed punch (5) is inlaid under punch fixing plate (4)
In the middle part on surface.
3. a kind of Ti alloy miniature gear pulse current assists microsecond delay floating die assembly according to claim 1, feature exists
In: the lower mold assemblies include blank holder (7), cavity plate fixed block (11), cushion block (12), the first lower insulation plate (13), lower bolster
(14), the second lower insulation plate (15), lower template (16), collets (17), pin (18), sliding shoe (20) and two springs
(10), the first lower insulation plate (13), lower bolster (14), the second lower insulation plate (15), lower template (16) are from top to bottom sequentially overlapped
Setting, lower template (16) are detachably connected by screw with the second lower insulation plate (15), and the second lower insulation plate (15) passes through screw
It is detachably connected with lower bolster (14), one end of the second conducting wire (25) is connected by another terminal (24) and lower bolster (14)
Connect, the lower end of punch-pin (19) is inlaid in the middle part of the first lower insulation plate (13) upper surface, cavity plate fixed block (11) by screw with
The upper surface of first lower insulation plate (13) is detachably connected, and punch-pin (19) is located in cavity plate fixed block (11), and blank holder (7) passes through
Screw is connect with the upper surface of cavity plate fixed block (11), and cavity plate (21) is inlaid on sliding shoe (20), and sliding shoe (20) is located at recessed
In mould fixed block (11), and sliding shoe (20) can be moved up and down along the inner wall straight line of cavity plate fixed block (11), collets (17), pad
Block (12) is successively set on punch-pin (19) two sides from the inside to the outside, and the inner wall of collets (17) passes through pin (18) and punch-pin (19)
Outer wall be located by connecting, two springs (10) are symmetricly set on the two sides of punch-pin (19), and the upper end of spring (10) and sliding shoe
(20) lower end of following table face contact, spring (10) is contacted with the upper surface of cushion block (12).
4. a kind of according to claim 1,2 or 3 Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly, special
Sign is: a kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly further includes four guide sleeves (8) and four
A guide post (9), four guide sleeves (8) are symmetricly set on the two sides of formed punch (5), and the upper end of each guide sleeve (8) with cope plate (1)
Lower surface be fixedly connected, the upper end of each guide post (9) is inserted into respectively in the lower end of a guide sleeve (8), each guide post (9)
Lower end is fixedly connected with the upper surface of lower template (16).
5. a kind of Ti alloy miniature gear pulse current assists microsecond delay floating die assembly according to claim 1, special
Sign is: the reference diameter of cavity plate (21) is less than 10mm, between the cooperation between the internal tooth and punch-pin (19) external tooth of cavity plate (21)
Gap is less than 10 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810821752.2A CN109047610A (en) | 2018-07-24 | 2018-07-24 | A kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810821752.2A CN109047610A (en) | 2018-07-24 | 2018-07-24 | A kind of Ti alloy miniature gear pulse current auxiliary microsecond delay floating die assembly |
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| CN110014112A (en) * | 2019-05-23 | 2019-07-16 | 哈尔滨工业大学 | A kind of pulse current auxiliary microsecond delay mold and method |
| CN110153217A (en) * | 2019-06-17 | 2019-08-23 | 四川大学 | The micro-plasticity forming method of titanium alloy micro-cell electron capture detector |
| CN114888156A (en) * | 2022-03-30 | 2022-08-12 | 武汉理工大学 | Electromagnetic impact composite forming device and method for high-rib thin-wall component |
| CN115026237A (en) * | 2022-07-21 | 2022-09-09 | 河北工程大学 | Cold heading die and cold heading process |
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| CN114888156A (en) * | 2022-03-30 | 2022-08-12 | 武汉理工大学 | Electromagnetic impact composite forming device and method for high-rib thin-wall component |
| CN115026237A (en) * | 2022-07-21 | 2022-09-09 | 河北工程大学 | Cold heading die and cold heading process |
| CN115026237B (en) * | 2022-07-21 | 2023-12-19 | 河北工程大学 | Cold heading die and cold heading process |
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