CN108987490B - 太阳能电池湿法刻蚀氧化后表层清洁的处理方法 - Google Patents
太阳能电池湿法刻蚀氧化后表层清洁的处理方法 Download PDFInfo
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- CN108987490B CN108987490B CN201810793139.4A CN201810793139A CN108987490B CN 108987490 B CN108987490 B CN 108987490B CN 201810793139 A CN201810793139 A CN 201810793139A CN 108987490 B CN108987490 B CN 108987490B
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- silicon nitride
- antireflection film
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- silane
- ammonia
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- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000001039 wet etching Methods 0.000 title claims abstract description 20
- 238000004140 cleaning Methods 0.000 title claims abstract description 17
- 230000003647 oxidation Effects 0.000 title claims abstract description 15
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 73
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 73
- 238000000151 deposition Methods 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 claims abstract description 47
- 230000008569 process Effects 0.000 claims abstract description 46
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910000077 silane Inorganic materials 0.000 claims abstract description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 36
- 239000010703 silicon Substances 0.000 claims abstract description 36
- 239000002344 surface layer Substances 0.000 claims abstract description 26
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 22
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract description 22
- 230000003667 anti-reflective effect Effects 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 238000005245 sintering Methods 0.000 abstract description 6
- 238000011109 contamination Methods 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000003010 ionic group Chemical group 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810793139.4A CN108987490B (zh) | 2018-07-18 | 2018-07-18 | 太阳能电池湿法刻蚀氧化后表层清洁的处理方法 |
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CN201810793139.4A CN108987490B (zh) | 2018-07-18 | 2018-07-18 | 太阳能电池湿法刻蚀氧化后表层清洁的处理方法 |
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CN108987490A CN108987490A (zh) | 2018-12-11 |
CN108987490B true CN108987490B (zh) | 2020-04-14 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011128134A2 (de) * | 2010-04-14 | 2011-10-20 | Robert Bosch Gmbh | Verfahren zur herstellung einer solarzelle sowie nach diesem verfahren hergestellte solarzelle |
CN102306680A (zh) * | 2011-08-23 | 2012-01-04 | 浙江嘉毅能源科技有限公司 | 晶体硅太阳能电池片减反射膜制备工艺 |
CN103606594A (zh) * | 2013-11-20 | 2014-02-26 | 英利能源(中国)有限公司 | 硅片的清理方法及减反射膜的制备方法 |
CN104319294A (zh) * | 2014-11-04 | 2015-01-28 | 苏州精创光学仪器有限公司 | 改进的镀氮化硅减反射膜方法 |
CN105633175A (zh) * | 2015-12-23 | 2016-06-01 | 泰州德通电气有限公司 | 一种可以降低抗pid电池外观不良率的工艺 |
-
2018
- 2018-07-18 CN CN201810793139.4A patent/CN108987490B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011128134A2 (de) * | 2010-04-14 | 2011-10-20 | Robert Bosch Gmbh | Verfahren zur herstellung einer solarzelle sowie nach diesem verfahren hergestellte solarzelle |
CN102306680A (zh) * | 2011-08-23 | 2012-01-04 | 浙江嘉毅能源科技有限公司 | 晶体硅太阳能电池片减反射膜制备工艺 |
CN103606594A (zh) * | 2013-11-20 | 2014-02-26 | 英利能源(中国)有限公司 | 硅片的清理方法及减反射膜的制备方法 |
CN104319294A (zh) * | 2014-11-04 | 2015-01-28 | 苏州精创光学仪器有限公司 | 改进的镀氮化硅减反射膜方法 |
CN105633175A (zh) * | 2015-12-23 | 2016-06-01 | 泰州德通电气有限公司 | 一种可以降低抗pid电池外观不良率的工艺 |
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Effective date of registration: 20191029 Address after: 710100 East Chang'an Avenue, Xi'an, Shaanxi Aerospace base, No. 589 Applicant after: Xi'an Electric Power Co., Ltd. Applicant after: Huanghe hydropower Xining Solar Power Co., Ltd Applicant after: State Electricity Investment Group the Yellow River Upstream Hydropower Development Co., Ltd. Applicant after: Qinghai Huanghe Hydropower Development Co. Ltd. Address before: 710100 East Chang'an Avenue, Xi'an, Shaanxi Aerospace base, No. 589 Applicant before: Xi'an Electric Power Co., Ltd. Applicant before: State power investment group Xi'an Solar Power Co., Ltd. Xining branch Applicant before: State Electricity Investment Group the Yellow River Upstream Hydropower Development Co., Ltd. Applicant before: Qinghai Huanghe Hydropower Development Co. Ltd. |
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Effective date of registration: 20220321 Address after: 810007 No. 4, Jinsi Road, Dongchuan Industrial Park, Xining City, Qinghai Province Patentee after: Xining solar power branch of Qinghai upper Yellow River Hydropower Development Co.,Ltd. Patentee after: Xi'an solar power branch of Qinghai upper Yellow River Hydropower Development Co.,Ltd. Patentee after: HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. Patentee after: QINGHAI HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. Address before: 710100 Shaanxi Xi'an space base east Chang'an Avenue 589 Patentee before: STATE POWER INVESTMENT CORPORATION XI'AN SOLAR POWER Co.,Ltd. Patentee before: Huanghe hydropower Xining Solar Power Co.,Ltd. Patentee before: HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. Patentee before: QINGHAI HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. |
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