CN108966656A - Protective film formation film and protective film formation composite sheet - Google Patents
Protective film formation film and protective film formation composite sheet Download PDFInfo
- Publication number
- CN108966656A CN108966656A CN201780017025.4A CN201780017025A CN108966656A CN 108966656 A CN108966656 A CN 108966656A CN 201780017025 A CN201780017025 A CN 201780017025A CN 108966656 A CN108966656 A CN 108966656A
- Authority
- CN
- China
- Prior art keywords
- protective film
- film
- film formation
- methyl
- energy ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 584
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 317
- 239000002131 composite material Substances 0.000 title claims abstract description 80
- -1 Amino, substituted-amino Chemical group 0.000 description 108
- 239000000203 mixture Substances 0.000 description 108
- 239000004065 semiconductor Substances 0.000 description 78
- 150000001875 compounds Chemical class 0.000 description 68
- 229920000642 polymer Polymers 0.000 description 58
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 57
- 239000004615 ingredient Substances 0.000 description 56
- 239000000758 substrate Substances 0.000 description 52
- 238000004519 manufacturing process Methods 0.000 description 49
- 239000000178 monomer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 46
- 239000000049 pigment Substances 0.000 description 45
- 229920000647 polyepoxide Polymers 0.000 description 42
- 239000013078 crystal Substances 0.000 description 41
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 40
- 239000000463 material Substances 0.000 description 38
- 239000003795 chemical substances by application Substances 0.000 description 37
- 239000003822 epoxy resin Substances 0.000 description 37
- 229920005989 resin Polymers 0.000 description 36
- 239000011347 resin Substances 0.000 description 36
- 125000000524 functional group Chemical group 0.000 description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 30
- 239000002585 base Substances 0.000 description 30
- 239000010410 layer Substances 0.000 description 26
- 238000001723 curing Methods 0.000 description 25
- 150000002148 esters Chemical class 0.000 description 25
- 229920000058 polyacrylate Polymers 0.000 description 25
- 239000003431 cross linking reagent Substances 0.000 description 24
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 23
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 21
- 238000012856 packing Methods 0.000 description 21
- 238000001029 thermal curing Methods 0.000 description 20
- 238000007711 solidification Methods 0.000 description 18
- 230000008023 solidification Effects 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- 239000003086 colorant Substances 0.000 description 17
- 239000005056 polyisocyanate Substances 0.000 description 15
- 229920001228 polyisocyanate Polymers 0.000 description 15
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 15
- 239000007822 coupling agent Substances 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 239000005011 phenolic resin Substances 0.000 description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 9
- 239000000470 constituent Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000000007 visual effect Effects 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 150000001336 alkenes Chemical class 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 238000013007 heat curing Methods 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- 238000009415 formwork Methods 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 150000002118 epoxides Chemical class 0.000 description 5
- 125000004494 ethyl ester group Chemical group 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 244000028419 Styrax benzoin Species 0.000 description 4
- 235000000126 Styrax benzoin Nutrition 0.000 description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000254 damaging effect Effects 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 235000019382 gum benzoic Nutrition 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- JYRKWXQBMIICBI-UHFFFAOYSA-N (pentan-3-ylideneamino) acetate Chemical compound CCC(CC)=NOC(C)=O JYRKWXQBMIICBI-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- YTPOBBOFVWMAQR-UHFFFAOYSA-N 2-methylprop-2-enoic acid pentadecane Chemical compound CCCCCCCCCCCCCCC.CC(C(=O)O)=C YTPOBBOFVWMAQR-UHFFFAOYSA-N 0.000 description 2
- SKFMNMKQJBQBNA-UHFFFAOYSA-N 2-methylprop-2-enoic acid tetradecane Chemical compound C(C(=C)C)(=O)O.CCCCCCCCCCCCCC SKFMNMKQJBQBNA-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- VIJLQNMHRAUFIP-UHFFFAOYSA-N CCCCCCCCCCCCCC(C(=O)O)=C.C(CCCCCCCCCCC)C(C(=O)OC)=C Chemical compound CCCCCCCCCCCCCC(C(=O)O)=C.C(CCCCCCCCCCC)C(C(=O)OC)=C VIJLQNMHRAUFIP-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical class C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ACIAHEMYLLBZOI-ZZXKWVIFSA-N Unsaturated alcohol Chemical compound CC\C(CO)=C/C ACIAHEMYLLBZOI-ZZXKWVIFSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- KPTLPIAOSCGETM-UHFFFAOYSA-N benzene 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O.c1ccccc1 KPTLPIAOSCGETM-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 125000006841 cyclic skeleton Chemical group 0.000 description 2
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- AGKOCZMLUIUKEW-UHFFFAOYSA-N heptadecane 2-methylprop-2-enoic acid Chemical compound CCCCCCCCCCCCCCCCC.C(C(=C)C)(=O)O AGKOCZMLUIUKEW-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000002466 imines Chemical group 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- HJYKVGWOAOLIKY-UHFFFAOYSA-N methyl 2-methylidenenonanoate Chemical compound CCCCCCCC(=C)C(=O)OC HJYKVGWOAOLIKY-UHFFFAOYSA-N 0.000 description 2
- GTCAXTIRRLKXRU-UHFFFAOYSA-N methyl carbamate Chemical compound COC(N)=O GTCAXTIRRLKXRU-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 241000894007 species Species 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- CTLDMRCJDQGAQJ-UHFFFAOYSA-N (1,1-dimethoxy-2-phenylethyl)benzene Chemical compound C=1C=CC=CC=1C(OC)(OC)CC1=CC=CC=C1 CTLDMRCJDQGAQJ-UHFFFAOYSA-N 0.000 description 1
- QBJOHXRRAKMFIH-UHFFFAOYSA-N (2,4,6-trimethylbenzoyl)phosphanyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)PC(=O)C1=C(C)C=C(C)C=C1C QBJOHXRRAKMFIH-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical class [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- GPYLCFQEKPUWLD-UHFFFAOYSA-N 1h-benzo[cd]indol-2-one Chemical class C1=CC(C(=O)N2)=C3C2=CC=CC3=C1 GPYLCFQEKPUWLD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LRJKOALZSYELNZ-UHFFFAOYSA-N 2-(2,4,6-trioxo-1,3,5-triazinan-1-yl)ethyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCCN1C(=O)NC(=O)NC1=O LRJKOALZSYELNZ-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- FKJNJZAGYPPJKZ-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylethanone;methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 FKJNJZAGYPPJKZ-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- JEHFRMABGJJCPF-UHFFFAOYSA-N 2-methylprop-2-enoyl isocyanate Chemical compound CC(=C)C(=O)N=C=O JEHFRMABGJJCPF-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- XURABDHWIADCPO-UHFFFAOYSA-N 4-prop-2-enylhepta-1,6-diene Chemical class C=CCC(CC=C)CC=C XURABDHWIADCPO-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GNBCKKSGQPLTRW-UHFFFAOYSA-N C(C=C)(=O)OC.C(N)(O)=O Chemical compound C(C=C)(=O)OC.C(N)(O)=O GNBCKKSGQPLTRW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- GPAMXHKPTYPJBN-UHFFFAOYSA-N NCCNC(CC[Si](OCC)(OCC)C)O Chemical compound NCCNC(CC[Si](OCC)(OCC)C)O GPAMXHKPTYPJBN-UHFFFAOYSA-N 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- AGJXDKGTTMVHOU-UHFFFAOYSA-N [4-(hydroxymethyl)-1h-imidazol-5-yl]methanol Chemical compound OCC=1N=CNC=1CO AGJXDKGTTMVHOU-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical class [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- LTIBQZLAXJMKEF-UHFFFAOYSA-N azane;isocyanic acid Chemical group N.N=C=O LTIBQZLAXJMKEF-UHFFFAOYSA-N 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- CSNNWDJQKGMZPO-UHFFFAOYSA-N benzoic acid;2-hydroxy-1,2-diphenylethanone Chemical compound OC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 CSNNWDJQKGMZPO-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- LKMCJXXOBRCATQ-UHFFFAOYSA-N benzylsulfanylbenzene Chemical compound C=1C=CC=CC=1CSC1=CC=CC=C1 LKMCJXXOBRCATQ-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- RNOOHTVUSNIPCJ-UHFFFAOYSA-N butan-2-yl prop-2-enoate Chemical compound CCC(C)OC(=O)C=C RNOOHTVUSNIPCJ-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- NYVPYOCCTPDTKV-UHFFFAOYSA-N carbamic acid;isocyanic acid Chemical group N=C=O.NC(O)=O NYVPYOCCTPDTKV-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- RBSLJAJQOVYTRQ-UHFFFAOYSA-N croconic acid Chemical compound OC1=C(O)C(=O)C(=O)C1=O RBSLJAJQOVYTRQ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000003997 cyclic ketones Chemical class 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- YVUBWJOBCFNMES-UHFFFAOYSA-N formamide;pyridine Chemical compound NC=O.C1=CC=NC=C1 YVUBWJOBCFNMES-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- QDYTUZCWBJRHKK-UHFFFAOYSA-N imidazole-4-methanol Chemical compound OCC1=CNC=N1 QDYTUZCWBJRHKK-UHFFFAOYSA-N 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical class [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical class C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229940044652 phenolsulfonate Drugs 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- JHYGKRLFANBDIF-UHFFFAOYSA-N phosphane;triphenylphosphane Chemical compound P.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 JHYGKRLFANBDIF-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000019612 pigmentation Effects 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- LLBIOIRWAYBCKK-UHFFFAOYSA-N pyranthrene-8,16-dione Chemical compound C12=CC=CC=C2C(=O)C2=CC=C3C=C4C5=CC=CC=C5C(=O)C5=C4C4=C3C2=C1C=C4C=C5 LLBIOIRWAYBCKK-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical class C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003303 ruthenium Chemical class 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007776 silk screen coating Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920005792 styrene-acrylic resin Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical class S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical compound CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 150000003681 vanadium Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention provides protective film formation film and protective film formation composite sheet.The protective film formation is energy ray-curable with film, and when irradiation energy ray is to be made protective film, the maximum section height (Rt) on the surface (β ') of at least side of protective film is less than 10 μm.The protective film formation composite sheet has support chip; has the protective film formation film on support chip; when to protective film formation film irradiation energy ray to which protective film be made, surface (β) that become the surface (β ') of protective film, protective film formation film is towards support chip.
Description
Technical field
The present invention relates to protective film formation film and protective film formation composite sheets.
The Japanese Patent Application 2016-092008 claims priority that the application is filed an application based on April 28th, 2016 in Japan
Power, and its content is applied at this.
Background technique
In recent years, it is carrying out applying partly leading for the so-called Method for Installation referred to as upside-down mounting (face down) mode
The manufacture of body device.In upside-down mounting mode, using the semiconductor chip with the electrodes such as convex block in circuit face, the electrode with
Substrate engagement.Therefore, semiconductor chip exposes with the back side of circuit face opposite side sometimes.
It is formed with the resin film containing organic material as protective film at the back side of the semiconductor chip of the exposing, sometimes
Semiconductor device is packed into as the semiconductor chip with protective film.It is partly being led after cutting action or encapsulation in order to prevent
It cracks to utilize protective film on body chip.
In order to form such protective film, such as used using a kind of can be formed by being solidified to form the protective film of protective film
Film.As protective film formation film, such as it is may be used at the protective film formation film that its two sides has stripping film, or can be used
It is set on support chip and has in exposed surface the protective film formation film of stripping film.Protective film is provided on support chip
Formation uses the substance of film other than being used for the formation of protective film as protective film formation composite sheet, is also used as cutting
Piece.
As such protective film formation film, mainly used so far no matter whether there is or not support chip, all pass through heating
Solidify being formed the protective film formation film of protective film.At this point, for example, at the back side of semiconductor crystal wafer (with electrode shape
At the face of face opposite side) on attach the protective film formation film of Thermocurable or will be provided with the protective film of Thermocurable and formed
It (is formed with electrode by its protective film formation with the back side that film is attached at semiconductor crystal wafer with the protective film formation of film with composite sheet
The face of face opposite side) after, make the solidification of protective film formation film to which protective film be made by heating, by cutting semiconductor die
Circle divides that semiconductor chip is made together with protective film.Then, it keeps this to be pasted with the state of protective film, directly picks up half
Conductor chip.In addition, the solidification and cutting of protective film formation film are also carried out with sequence contrary to the above sometimes.
On the other hand, for protective film, usually using the irradiation of laser to the attaching face with protective film and semiconductor crystal wafer
Implement lettering (in this explanation in the face (being the face towards support chip of protective film in protective film formation composite sheet) of opposite side
In book, sometimes referred to as " laser lettering ").Moreover, for protective film, it is desirable that lettering visual excellence.
However, if stage of the laser lettering face of protective film before laser lettering become coarse, due to can not be clear
Laser lettering is carried out clearly, therefore lettering visuality is deteriorated.So, thus it is speculated that the laser lettering face of protective film becomes coarse reason
It is, the surface for being equivalent to laser lettering face has become coarse or Thermocurable in the stage of protective film formation film
Protective film formation film become soft in for cured heating and be easily deformed or packing material etc. containing ingredient to table
Face direction is mobile.It is therefore preferable that at least using without heating, the cured protection using the irradiation of the energy-rays such as ultraviolet light
Film, which is formed, uses film, and will not become coarse mode with laser lettering face makes its solidification.
As the protective film formation film of such energy ray-curable, stripping film is formed in for example, having been disclosed
On energy ray-curable protective film (referring to patent document 1) and be capable of forming high rigidity and the adherence to semiconductor chip
Property excellent protective film the protection of energy ray-curable chip with film (referring to patent document 2).
However, energy ray-curable protective film disclosed in Patent Document 1, energy-ray disclosed in Patent Document 2
The purpose for solidifying cake core protection film, which is not lain in, clearly carries out laser lettering to protective film.
Existing technical literature
Patent document
Patent document 1: No. 5144433 bulletins of Japanese Patent No.
Patent document 2: Japanese Unexamined Patent Publication 2010-031183 bulletin
Summary of the invention
The technical problem to be solved in the present invention
The purpose of the present invention is to provide one kind to form protective film at the back side of semiconductor crystal wafer or semiconductor chip, makes
The protective film formation film for the energy ray-curable that clearly laser lettering in protective film is possibly realized and has the film
Protective film formation use composite sheet.
Solve the technological means of technical problem
In order to solve the above technical problem, the present invention provides a kind of protective film formation films, are energy ray-curable
Protective film formed use film, to the protective film formation film irradiation energy ray to protective film is made when, in the protection
In film, at least the maximum section height (Rt) on the surface (β ') of side is less than 10 μm.
In protective film formation film of the invention, the gloss value of the preferably described surface (β ') is 45 or more.
In protective film formation film of the invention, when preferably irradiation energy ray is to be made protective film, become described
The maximum section height (Rt) on the surface (β ') of protective film, at least side surface (β) is less than 10 μm.
In addition, the present invention provides a kind of protective film formation composite sheet, by having support chip and in the support chip
On have the protective film formation and formed with film, protective film is made to the protective film formation film irradiation energy ray
When, become the surface (β ') of the protective film, the protective film form the surface (β) with film towards the support chip.
Invention effect
By using protective film formation film of the invention and protective film formation composite sheet, can in semiconductor crystal wafer or
The back side of semiconductor chip forms protective film, can clearly carry out laser lettering to protective film.
Detailed description of the invention
Fig. 1 is the sectional view for schematically showing an embodiment of protective film formation film of the invention.
Fig. 2 is the sectional view for schematically showing an embodiment of protective film formation composite sheet of the invention.
Fig. 3 is the sectional view for schematically showing the another embodiment of protective film formation composite sheet of the invention.
Specific embodiment
Film is used in the formation of ◇ protective film
The protective film formation of the invention protective film formation film that film is energy ray-curable, to the protective film shape
When at film irradiation energy ray to which protective film be made, in the protective film, the maximum on at least surface (β ') of side is cutd open
Face height (Rt) is less than 10 μm.
As described later, by the way that the protective film formation is set to support chip with film, protective film can be constituted and form use
Composite sheet.
The protective film formation film is solidified by the irradiation of energy-ray, becomes protective film.The protective film is for protecting
Protect the back side (face with electrode forming surface opposite side) of semiconductor crystal wafer or semiconductor chip.Protective film formed with film be it is soft,
It can be simply attached to attach object.
By making the protective film formation film energy ray-curable, can be formed in the protective film than Thermocurable
With carrying out being solidified to form protective film in the film shorter time.
In addition, in the present specification, " protective film forms film " refers to film before curing, and " protective film " is to instigate protective film
Film made of formation is solidified with film.
As the protective film formation film, such as can enumerate containing aftermentioned energy ray-curable ingredient (a)
Film is used in protective film formation.
Preferred energy ray-curable ingredient (a) is uncured, preferably its with adherence, more preferably its is uncured and has
Adherence.
In the present invention, " energy-ray " refers to the ray in electromagnetic wave or charged particle beam with the quantum of energy, as it
Example can enumerate ultraviolet light, radioactive ray, electron beam etc..
Ultraviolet light for example can be by using high-pressure sodium lamp, fusion H lamp (fusion H lamp), xenon lamp, black light lamp or LED
Lamp etc. is irradiated as ultraviolet source.Electron beam can irradiate the electron beam using generations such as electron-beam accelerators.
In the present invention, " energy ray-curable ", which refers to, carries out cured property by irradiation energy ray, " non-energy
Amount ray-curable " refers to irradiation energy ray without cured property.
To the protective film formation of the invention protective film obtained from film irradiation energy ray, any one or both sides
Surface is the maximum surface (β ') of section height (Rt) less than 10 μm.Surface (β ') be protective film be attached at semiconductor crystal wafer
Or the face of the face opposite side of semiconductor chip, it can be as the face for carrying out aftermentioned laser lettering.
In protective film, by making the maximum section height (Rt) on surface (β ') be less than the upper limit value, the laser in the face
Lettering is apparent from, lettering visual excellence.The reason of obtaining such effect is, is irradiated to the protective film formation with film
Energy-ray makes its solidification, so as to form protective film.
In addition, in the present specification, unless otherwise indicated, then " maximum section height (Rt) " refers to according to JIS B
Maximum section height (Rt) that 0601:2013 (ISO 4287:1997, Amd.1:2009) is acquired, roughness curve, it is sometimes simple
It writes " Rt ".
The maximum section height (Rt) on the surface (β ') of protective film is preferably 9 μm hereinafter, more preferably 8 μm or less.
The lower limit value of the maximum section height (Rt) on surface (β ') is not particularly limited.For example, the maximum of surface (β ') is cutd open
Face height (Rt) can be 0.5 μm or more.
The gloss value on the surface (β ') of protective film is preferably 45 or more, more preferably 50 or more, such as can for 60 with
Above, 70 with first-class.
The upper limit value of the gloss value on surface (β ') is not particularly limited.For example, the gloss value of surface (β ') can be
95 or less.
In addition, in the present specification, unless otherwise indicated, then " gloss value " refer to it is being acquired according to JISK 7105, from
Thereon under direction the surface of Observe and measure object side, measure value obtained from 60 ° of mirror surface lusters on the surface.
Protective film formed film surface (β) be to protective film formation film irradiation energy ray so that protective film be made
The face on the surface (β ') of Shi Chengwei protective film.In addition, the surface (β) that protective film forms film is and is attached at semiconductor crystal wafer
The face (being the face towards support chip of protective film formation film in protective film formation composite sheet) of face opposite side, final energy
Enough as the laser lettering face of protective film.
In the surface (β) of any one or both sides of protective film formation film, maximum section height (Rt) is preferably smaller than
10 μm, more preferably 9 μm hereinafter, further preferably 8.5 μm hereinafter, particularly preferably 8 μm or less.
The lower limit value of the maximum section height (Rt) on surface (β) is not particularly limited.For example, the maximum section of surface (β)
Highly (Rt) can be 0.5 μm or more.
It, can be more aobvious by making the maximum section height (Rt) on the surface (β) of protective film formation film be less than the upper limit value
It lands and obtains effect of the invention.That is, the face (comes from surface (β) when surface (β) being made to become the laser lettering face of protective film
Surface) laser lettering it is clear, lettering visual excellence.The reason of can get such effect is that film is used in protective film formation
For energy ray-curable, when solidification, is not required to heat, and terminates to solidify with the short time.It is used due to being formed with the protective film of Thermocurable
Film is different, and when solidification is not required to heat, thus can inhibit protective film formation film become soft in solidification and be easily deformed or
It can inhibit the ingredient that contains of packing material etc. in protective film formation film to move to surface direction.Further, since with the short time
Terminate solidification, therefore even if the maximum section height (Rt) of surface (β) is variable, also terminates solidification before excessive variation.Due to solid
The increase of the maximum section height (Rt) on the surface (β) in change is suppressed by this method, and the maximum of surface before curing (β)
Section height (Rt) is smaller as described above, therefore in the surface (β ') by the protective film being solidified to form, maximum section is high
Degree (Rt) becomes smaller.In addition, for the constituent of protective film formation film and protective film, may also suppress to lettering in solidification
Visuality generates dysgenic rotten.
The gloss value on surface (β) that protective film forms film is preferably 45 or more, and more preferably 50 or more, such as can be with
For 60 or more, 70 with first-class.
The upper limit value of the gloss value on surface (β) is not particularly limited.For example, the gloss value of surface (β) can be 95
Below.
Protective film formation of the invention is energy ray-curable with film, forms protective film by the irradiation of energy-ray
When, as long as the maximum section height (Rt) of surface (β ') plays effect of the invention less than 10 μm.
And the protective film formation film of Thermocurable by heating form protective film when, it is as described above, of the invention
The protective film formation of energy ray-curable is not suppressed with unfavorable condition repressed in film, related with surface shape.This
Outside, in heat cure, not only surface shape is easily deformed as described above, but also as heating time is elongated, protective film is formed
It is easy to produce with the constituent of film and protective film and dysgenic go bad is generated to lettering visuality.For example, even if protective film
Surface maximum section height (Rt) less than 10 μm, the lettering visuality of protective film is sometimes also bad.As described above, using heat
When the protective film of curability is formed with film, a variety of causes in heat cure causes the lettering visuality of protective film to be deteriorated.
It can be by the way that aftermentioned protective film formation to be coated on to the formation object surface, simultaneously of protective film formation film with composition
It makes it dry as needed and manufactures protective film formation film.Moreover, for example can be by protective film formation composition
The maximum section height (Rt) of coated face (the formation object surface of protective film formation film) is adjusted suitably to adjust and protect
Cuticula forms the maximum on the surface (β ') of the maximum section height (Rt) and gloss value and protective film with the surface (β) of film
Section height (Rt) and gloss value.
As described later, such as protective film formation film is when its two sides has stripping film, and composition is used in protective film formation
Coated face can be set to these stripping films any side surface (preferably lift-off processing face).And protective film formation is set with film
When being placed on aftermentioned support chip, the coated face of protective film formation composition can be set to the surface of the support chip.
As described above, when the surface of stripping film is set as the coated face of protective film formation composition, preferably by stripping film
In the protective film coated face that forms composition maximum section height (Rt) be set as, for example only the target of specific surface (β) is most
The value of the value small 0.5 of heavy gauge height (Rt) is in the range of only than its big 0.5 value.By adjusting in stripping film by this method
Protective film form the maximum section height (Rt) with the coated face of composition, more easily the maximum of surface (β) can be cutd open
Face height (Rt) is adjusted to target value.
On the other hand, in stripping film, non-protected film formed the coated face with composition surface maximum section height
(Rt) it is not particularly limited, such as can be identical as the coated face of protective film formation composition.
When the surface of stripping film not being set as the coated face of protective film formation composition, the surface of stripping film is (towards guarantor
Cuticula formation film face) maximum section height (Rt) be not particularly limited.
The maximum section height (Rt) on the surface of stripping film can be adjusted using well known method.
For example, high as maximum section is reduced and carrying out smoothing techniques by the surface to the male and fomale(M&F) as stripping film
The method for spending (Rt) can be enumerated in the surface of the stripping film as raw material pressing even surface to which smooth-shaped to be transferred to
The so-called pressing on the surface.It in the pressing, is adjusted by the smoothness to even surface, stripping film can be adjusted
Surface maximum section height (Rt).The mold of transfer for smooth-shaped can be roll (even surface is roll surface), plate
The arbitrary shape such as shape (even surface is plane), blocky (even surface is plane).
On the other hand, it cuts open as increasing maximum and carrying out further provided for contouring processing by surface to the even surface as stripping film
The method of face height (Rt) can be enumerated in the surface of the stripping film as raw material pressing male and fomale(M&F) to turn concaveconvex shape
It prints to the pressing on the surface.It in the pressing, is adjusted by the camber to male and fomale(M&F), stripping film can be adjusted
The maximum section height (Rt) on surface.The mold of transfer for concaveconvex shape can be roll (male and fomale(M&F) is roll surface), plate
The arbitrary shapes such as (male and fomale(M&F) is plane), blocky (male and fomale(M&F) is plane).
In addition, the method for the maximum section height (Rt) as the even surface for increasing stripping film, in addition to above-mentioned pressing
In addition, such as also blasting process, solvent treatment method etc. can be enumerated.
Protective film formation film can be only one layer (single layer), or two layers or more of multiple layers, when being multiple layers,
These multiple layers mutually the same can also be different, these multiple layers combinations are not particularly limited.
In addition, in the present specification, the case where being not limited only to protective film formation film, " multiple layers can be mutually the same
Can be different " refer to " all layers can be all the same, and all layers can also be different, can also only some layer it is identical ", separately
Outside, " multiple layers are different from each other " refers to " at least one of the constituent material of each layer and thickness are different from each other ".
The thickness of protective film formation film is preferably 1~100 μm, more preferably 5~75 μm, particularly preferably 5~50 μm.
By make protective film formation film with a thickness of the lower limit value more than, be capable of forming the higher protective film of protective capability.In addition,
By make protective film formation film with a thickness of the upper limit value hereinafter, can inhibit thickness as excessive thickness.
Herein, " thickness of protective film formation film " refers to the thickness of protective film formation film entirety, such as by multiple layers
The thickness of the protective film formation film of composition refers to the thickness for constituting the total of all layers of protective film formation film.
As long as protective film become fully play its function degree curing degree, make protective film formation film solidification from
And condition of cure when forming protective film is not particularly limited, and suitably select i.e. according to the type of protective film formation film
It can.
For example, the illumination of energy-ray when solidifying protective film formation film is preferably 4~280mW/cm2.Moreover, described
The light quantity of energy-ray when solidification is preferably 3~1000mJ/cm2。
As not limited especially using the semiconductor crystal wafer of object or the thickness of semiconductor chip for protective film formation film
It is fixed, since effect of the invention can be obtained more significantly, so preferably 30~1000 μm, more preferably 100~300 μm.
Fig. 1 is the sectional view for schematically showing an embodiment of protective film formation film of the invention.In addition, being
It should be readily appreciated that feature of the invention, for convenient, the pith of figure used in following explanation expanded into display sometimes, respectively
The dimensional ratios of constituent element etc. are not necessarily identical as reality.
Protective film formation film 13 shown here has the first stripping film 151 on the surface 13a of one side, with institute
It states and has the second stripping film 152 on the surface 13b of the other side of surface 13a opposite side.
Such protective film formation is for example suitble to be taken care of with roll with film 13.
Protective film formation film 13 is able to use aftermentioned protective film formation composition and is formed.
In protective film formation in film 13, the surface 13a and surface 13b any one or both be surface (β).
First stripping film 151 and the second stripping film 152 all can be well known stripping film, as described above, or adjust
Stripping film after saving the maximum section height (Rt) on surface.
First stripping film 151 and the second stripping film 152 can be mutually the same, such as or form it from protective film
With the different mutually different stripping film waited of peeling force required when being removed on film 13.
For protective film formation film 13 shown in FIG. 1, by any one of the first stripping film 151 and the second stripping film 152
Person's removal, attaches the back side of semiconductor crystal wafer (illustration omitted) in the exposed surface of generation.Then, by the first stripping film 151 and
The remaining another one of second stripping film 152 removes, and the exposed surface of generation becomes the attaching face of support chip.
< < protective film, which is formed, uses composition > >
Protective film formation film can be used the protective film formation composition containing its constituent material and be formed.For example, logical
It crosses and protective film formation is coated in the formation object surface of protective film formation film with composition and is dried as needed, energy
It is enough to form protective film formation film in target site.Ingredient in protective film formation composition, not gasifying under room temperature is each other
Content than usually with the mutual content of the ingredient of protective film formation film than identical.In addition, in the present specification, " often
Temperature " refers to the temperature for especially not cooled down or being heated, i.e. usual temperature, such as can enumerate 15~25 DEG C of temperature
Deng.
The coating of protective film formation composition is carried out using well known method, such as can be enumerated and be applied using air knife
Cloth machine, scraping blade coating machine, bar coater, gravure coater, roll coater, roller knife coating machine, curtain coater, die coating machine, knife type coater,
The method of the various coating machines such as silk screen coating machine (screen coater), Meyer rod coater, kiss painting machine (kiss coater).
The drying condition of protective film formation composition is not particularly limited, but after protective film formation composition contains
When the solvent stated, preferably it is thermally dried.Protective film formation composition containing solvent, for example, preferably with 70~130 DEG C,
10 seconds~5 minutes conditions are dried.
< protective film, which is formed, uses composition (IV-1) >
As protective film formation composition, such as the guarantor containing the energy ray-curable ingredient (a) can be enumerated
Cuticula is formed with composition (IV-1) etc..
[energy ray-curable ingredient (a)]
Energy ray-curable ingredient (a) is the cured ingredient of irradiation by energy-ray, and for protection
Film formation film assigns the ingredient for making film property, pliability etc..
As energy ray-curable ingredient (a), for example, can enumerate it is with energy ray-curable group, divide equally again
Son amount be 80000~2000000 polymer (a1), and with energy ray-curable group, molecular weight be 100~
80000 compound (a2).The polymer (a1) can be its at least part made of the crosslinking of aftermentioned crosslinking agent (f)
Substance, or uncrosslinked substance.
In addition, in the present specification, unless otherwise indicated, then weight average molecular weight, which refers to, utilizes gel permeation chromatography (GPC)
The polystyrene scaled value of method measurement.
(polymer (a1) that with energy ray-curable group, weight average molecular weight is 80000~2000000)
The polymer (a1) for being 80000~2000000 as with energy ray-curable group, weight average molecular weight,
Such as can enumerate with the acrylic polymer (a11) of functional group that can react with group possessed by other compounds and
Energy-ray with group and the energy ray-curables group such as energy ray-curable double bond with the functional group reactions
The acrylic resin (a1-1) that curability compound (a12) is polymerized.
As the functional group that can be reacted with group possessed by other compounds, for example, can enumerate hydroxyl, carboxyl,
Amino, substituted-amino (group made of one or two hydrogen atom of amino is replaced by the group in addition to hydrogen atom), epoxy
Base etc..Wherein, from the point of the corrosion for the circuit for preventing semiconductor crystal wafer or semiconductor chip etc., the preferably described functional group is
Group in addition to carboxyl.
Wherein, the preferably described functional group is hydroxyl.
Acrylic polymer (a11) with functional group
As the acrylic polymer (a11) with functional group, such as can enumerate with the functional group
Acrylic monomer and polymer made of the acrylic monomer copolymerization for not having the functional group, or remove these lists
Further copolymerization has the polymer of the monomer (non-acrylic monomer) in addition to acrylic monomer other than body.
In addition, the acrylic polymer (a11) can be random copolymer, or block copolymer.
As the acrylic monomer with the functional group, such as hydroxyl monomer can be enumerated, carboxyl group-containing monomer, contained
Amino monomers, monomer containing substituted-amino, containing epoxy based monomers etc..
As the hydroxyl monomer, such as (methyl) acrylate, (methyl) acrylic acid 2- hydroxyl can be enumerated
Ethyl ester, (methyl) acrylic acid 2- hydroxy propyl ester, (methyl) acrylic acid 3- hydroxy propyl ester, (methyl) acrylic acid 2- hydroxybutyl, (first
Base) (methyl) hydroxyalkyl acrylates such as acrylic acid 3- hydroxybutyl, (methyl) acrylic acid 4- hydroxybutyl；Vinyl alcohol, alkene
Non- (methyl) acrylic compounds unsaturated alcohol such as propyl alcohol (unsaturated alcohol for not having (methyl) acryloyl group skeleton) etc..
As the carboxyl group-containing monomer, such as the olefinics unsaturation unitary carboxylic such as can enumerate (methyl) acrylic acid, crotonic acid
Acid (monocarboxylic acid with ethylenic unsaturated bond)；The ethylenically unsaturated dicarboxylics such as fumaric acid, itaconic acid, maleic acid, citraconic acid
(dicarboxylic acids with ethylenic unsaturated bond)；The acid anhydrides of the ethylenically unsaturated dicarboxylic；Methacrylic acid 2- carboxyethyl etc.
(methyl) acrylic acid carboxyalkyl ester etc..
It is preferred that the acrylic monomer with the functional group is hydroxyl monomer, carboxyl group-containing monomer, more preferably contain hydroxyl
Base monomer.
Constitute the acrylic polymer (a11), the acrylic monomer with the functional group can be only one
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
As the acrylic monomer for not having the functional group, such as (methyl) methyl acrylate, (first can be enumerated
Base) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl)
Isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) third
The own ester of olefin(e) acid, (methyl) heptylacrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (methyl) third
Olefin(e) acid n-octyl, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) propylene
Sour hendecane base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) acrylic acid tridecyl
Ester, (methyl) acrylic acid tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl)
Aliphatic acrylate ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) acrylic acid 18
Arrcostab ((methyl) stearyl acrylate acid esters) etc., composition Arrcostab alkyl is the chain structure that carbon atom number is 1~18
(methyl) alkyl acrylate etc..
In addition, as the acrylic monomer for not having the functional group, such as (methyl) acrylic acid first can also be enumerated
Oxygroup methyl esters, (methyl) methoxyethyl acrylate, (methyl) ethioxy methyl esters, (methyl) ethoxyethyl acrylate
Deng (methyl) acrylate containing alkoxyalkyl；Comprising (methyl) phenyl acrylate etc. (methyl) benzyl acrylate etc.,
(methyl) acrylate with aromatic group；(methyl) acrylamide and its derivative of non-crosslinked property；(methyl) propylene
Sour N, N- dimethylamino ethyl ester, (methyl) acrylic acid N, N- dimethylamino propyl ester etc. have the tertiary amino of non-crosslinked property
(methyl) acrylate etc..
Constitute the acrylic polymer (a11), the acrylic monomer without the functional group can be only
It is a kind of, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
As the non-acrylic monomer, such as the alkene such as ethylene, norbornene can be enumerated；Vinyl acetate；Benzene
Ethylene etc..
The non-acrylic monomer for constituting the acrylic polymer (a11) can be only one kind, or
Two or more, when being two or more, their combination and ratio can be selected arbitrarily.
In the acrylic polymer (a11), relative to the gross mass for the structural unit for constituting the polymer, by having
The ratio (content) for having the amount of structural unit derived from the acrylic monomer of the functional group is preferably 0.1~50 mass %,
More preferably 1~40 mass %, particularly preferably 3~30 mass %.By making the such range of the ratio, by described
The acrylic compounds obtained from the copolymerization of acrylic polymer (a11) and the energy ray-curable compound (a12)
The curing degree of protective film can be easily adjusted to preferably by the content of the energy ray-curable group in resin (a1-1)
Range.
The acrylic polymer (a11) for constituting the acrylic resin (a1-1) can be only one kind, can also
Think it is two or more, for it is two or more when, their combination and ratio can be selected arbitrarily.
In protective film formation in composition (IV-1), the content of acrylic resin (a1-1) is preferably 1~40 matter
Measure %, more preferably 2~30 mass %, particularly preferably 3~20 mass %.
Energy ray-curable compound (a12)
It is preferred that the energy ray-curable compound (a12), which has, selects free isocyanate group, epoxy group and carboxyl group
At one or more of group as can be with the base of functional group reactions possessed by the acrylic polymer (a11)
Group more preferably has isocyanate group as the group.For example, when the energy ray-curable compound (a12) has
When isocyanate group is as the group, which is easy and has acrylic polymer of the hydroxyl as the functional group
The hydroxyl for closing object (a11) is reacted.
It is preferred that the energy ray-curable compound (a12) is described energy ray curing with 1~5 in 1 molecule
Property group, more preferably have 1~3 energy ray-curable group.
As the energy ray-curable compound (a12), such as 2- methylacryoyloxyethyl isocyanide can be enumerated
Acid esters, isopropenyl-bis (alpha, alpha-dimethylbenzyl) based isocyanate, methacryloyl isocyanate, allyl iso cyanurate, 1,
1- (double acryloyloxymethyls) ethyl isocyanate；
Pass through reacting for diisocyanate cpd or polyisocyanate compounds and (methyl) Hydroxyethyl Acrylate
Obtained acryloyl group monoisocyanate compound；
Pass through diisocyanate cpd or polyisocyanate compounds, polyol compound and (methyl) dihydroxypropyl
Acryloyl group monoisocyanate compound etc. obtained from the reaction of ethyl ester.
Wherein, the preferably described energy ray-curable compound (a12) is 2- methylacryoyloxyethyl isocyanates.
The energy ray-curable compound (a12) for constituting the acrylic resin (a1-1) can be only one
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
In the acrylic resin (a1-1), the energy from the energy ray-curable compound (a12) is penetrated
The content of line curative group is excellent relative to the ratio of the content of the functional group from the acrylic polymer (a11)
It is selected as 20~120 moles of %, more preferably 35~100 moles of %, particularly preferably 50~100 moles of %.By making described contain
The ratio of amount is such range, is become much larger by the bonding force for the protective film being solidified to form.In addition, when the energy is penetrated
When line curability compound (a12) is simple function (having 1 group in 1 molecule) compound, the ratio of the content
Upper limit value be 100 moles of %, and when the energy ray-curable compound (a12) be it is multifunctional (in 1 molecule have 2
A above group) compound when, the upper limit value of the ratio of the content is sometimes more than 100 moles of %.
The weight average molecular weight (Mw) of the polymer (a1) is preferably 100000~2000000, more preferably 300000~
1500000。
When the polymer (a1) is that its at least part is crosslinked substance made of agent (f) crosslinking, the polymer
(a1) can be not belonging to as the monomer for constituting the acrylic polymer (a11) and any in the above-mentioned monomer illustrated
Person and there is the monomer of group react with crosslinking agent (f) to be copolymerized, and the progress at the group reacted with crosslinking agent (f)
Polymer made of crosslinking, can also be for from the energy ray-curable compound (a12), anti-with the functional group
Polymer made of being crosslinked at the group answered.
Protective film, which forms to be formed with composition (IV-1) and protective film, uses the polymer (a1) contained by film can be only
For one kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
(compound (a2) that with energy ray-curable group, molecular weight is 100~80000)
Energy possessed by the compound (a2) for being 100~80000 as with energy ray-curable group, molecular weight
Ray-curable group is measured, the group comprising energy ray-curable double bond can be enumerated, as preferred group, can be enumerated
(methyl) acryloyl group, vinyl etc..
The compound (a2) is not particularly limited as long as meeting above-mentioned condition, can enumerate with energy ray curing
Property the low molecular weight compound of group, the epoxy resin with energy ray-curable group, there is energy ray-curable base
The phenol resin etc. of group.
As the low molecular weight compound with energy ray-curable group in the compound (a2), such as can arrange
Polyfunctional monomer or oligomer etc. are enumerated, preferably with the acrylic ester compound of (methyl) acryloyl group.
As the acrylic ester compound, such as 2- hydroxyl -3- (methyl) acryloxypropyl first can be enumerated
Base acrylate, polyethylene glycol two (methyl) acrylate, propoxylation Ethoxylated bisphenol A bis- (methyl) acrylate, 2,
2- bis- [4- ((methyl) acryloxy polyethoxy) phenyl] propane, Ethoxylated bisphenol A bis- (methyl) acrylate, 2,2-
Bis- [4- ((methyl) acryloxy diethoxy) phenyl] propane, the bis- [4- (2- (methyl) acryloyloxyethoxy) of 9,9-
Phenyl] fluorenes, 2,2- bis- [4- (the poly- propoxyl group of (methyl) acryloxy) phenyl] propane, Tricyclodecane Dimethanol two (methyl) third
Olefin(e) acid ester (tristane dihydroxymethyl two (methyl) acrylate), 1,10- decanediol two (methyl) acrylate, 1,6- oneself two
Alcohol two (methyl) acrylate, 1,9- nonanediol two (methyl) acrylate, dipropylene glycol two (methyl) acrylate, 3 the third two
Alcohol two (methyl) acrylate, polypropylene glycol two (methyl) acrylate, polytetramethylene glycol two (methyl) acrylate, ethylene glycol two
(methyl) acrylate, diethylene glycol two (methyl) acrylate, triethylene glycol two (methyl) acrylate, the bis- [4- of 2,2-
((methyl) acryloyloxyethoxy) phenyl] propane, neopentyl glycol two (methyl) acrylate, ethoxylated polypropylene glycol two
Difunctionalities (methyl) acrylate such as (methyl) acrylate, 2- hydroxyl -1,3- two (methyl) acryloxy propane；
Modified three (2- (methyl) the acryloyl-oxy second of three (2- (methyl) acrylyl oxy-ethyl) isocyanuric acid esters, 6-caprolactone
Base) isocyanuric acid ester, ethoxylated glycerol three (methyl) acrylate, pentaerythrite three (methyl) acrylate, trihydroxy methyl
Propane three (methyl) acrylate, two trimethylolpropane four (methyl) acrylate, ethoxylation pentaerythrite four (methyl)
Poly- (methyl) acrylate of acrylate, pentaerythrite four (methyl) acrylate, dipentaerythritol, six (first of dipentaerythritol
Base) multifunctional (methyl) acrylates such as acrylate；
Multifunctional (methyl) acrylates oligomer such as carbamate (methyl) acrylate oligomer etc..
As the epoxy resin with energy ray-curable group, solid with energy-ray in the compound (a2)
It is recorded in phenol resin, such as [0043] section for being able to use " Japanese Unexamined Patent Publication 2013-194102 bulletin " of the property changed group etc.
Resin.Such resin also corresponds to constitute the resin of aftermentioned thermosetting component (h), but is regarded as in the present invention described
Compound (a2).
The weight average molecular weight of the compound (a2) is preferably 100~30000, and more preferably 300~10000.
Protective film, which forms to be formed with composition (IV-1) and protective film, uses the compound (a2) contained by film can be only
For one kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
[polymer (b) without energy ray-curable group]
When protective film formation composition (IV-1) and protective film formation use film to contain the compound (a2) described in
When energy ray-curable ingredient (a), preferably further also contain the polymer (b) without energy ray-curable group.
The polymer (b) can be crosslinked substance made of agent (f) crosslinking for its at least part, or not hand over
The substance of connection.
As the polymer (b) for not having energy ray-curable group, such as acrylic polymer, benzene can be enumerated
Oxygroup resin, carbamate resins, polyester, rubber resin, propenoic methyl carbamate resin, polyvinyl alcohol (PVA), fourth
Urea formaldehyde, polyester urethane resin etc..
Wherein, the preferably described polymer (b) is acrylic polymer (hereinafter, writing a Chinese character in simplified form work " acrylic polymer sometimes
(b-1)”)。
Acrylic polymer (b-1) can be well known acrylic polymer, such as can be a kind of acrylic compounds
The homopolymer of monomer, or the copolymer of two or more acrylic monomers can also be one or more kinds of
The copolymerization of acrylic monomer and one or more kinds of monomers (non-acrylic monomer) in addition to acrylic monomer
Object.
As the acrylic monomer of composition acrylic polymer (b-1), such as (methyl) propylene can be enumerated
Acid alkyl ester, (methyl) acrylate with cyclic skeleton, (methyl) acrylate containing glycidyl, hydroxyl
(methyl) acrylate, (methyl) acrylate containing substituted-amino etc..Herein, " substituted-amino " and the phase being illustrated above
Together.
As (methyl) alkyl acrylate, such as (methyl) methyl acrylate, (methyl) acrylic acid can be enumerated
Ethyl ester, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) acrylic acid are different
Butyl ester, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) Hexyl 2-propenoate,
(methyl) heptylacrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid are just pungent
Ester, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) acrylic acid hendecane
Base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) tridecyl acrylate, (methyl)
Acrylic acid tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl) acrylic acid ten
Six Arrcostabs ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) octadecyl acrylate
((methyl) stearyl acrylate acid esters) etc., constitute Arrcostab alkyl be the chain structure that carbon atom number is 1~18 (first
Base) alkyl acrylate etc..
As described (methyl) acrylate with cyclic skeleton, such as (methyl) isobomyl acrylate can be enumerated
(methyl) the acrylate base esters such as ester, (methyl) dicyclopentyl acrylate；
(methyl) benzyl acrylate etc. (methyl) acrylic acid aralkyl ester；
(methyl) acrylic acid cyclenes base ester such as (methyl) acrylic acid dicyclopentenyl base ester；
(methyl) acrylic acid cycloalkenyl oxy Arrcostab such as (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester etc..
As described (methyl) acrylate containing glycidyl, such as (methyl) glycidyl can be enumerated
Ester etc..
As (methyl) acrylate of the hydroxyl, such as (methyl) acrylate, (methyl) can be enumerated
Acrylic acid 2- hydroxy methacrylate, (methyl) acrylic acid 2- hydroxy propyl ester, (methyl) acrylic acid 3- hydroxy propyl ester, (methyl) acrylic acid 2-
Hydroxybutyl, (methyl) acrylic acid 3- hydroxybutyl, (methyl) acrylic acid 4- hydroxybutyl etc..
As described (methyl) acrylate containing substituted-amino, such as (methyl) acrylic acid N- methylamino can be enumerated
Ethyl ester etc..
As the non-acrylic monomer of composition acrylic polymer (b-1), such as ethylene, drop ice can be enumerated
The alkene such as piece alkene；Vinyl acetate；Styrene etc..
As being crosslinked agent (f) crosslinking, the polymer without energy ray-curable group at least partially
(b), for example, the reactive functional groups that can enumerate in the polymer (b) reacted with crosslinking agent (f) obtained from polymer.
The reactive functional groups are suitably selected according to progress such as the types of crosslinking agent (f), are not particularly limited.Example
Such as, when crosslinking agent (f) is polyisocyanate compounds, as the reactive functional groups, hydroxyl, carboxyl, ammonia can be enumerated
Base etc., wherein preferably with the hydroxyl with high reactivity of isocyanate group.In addition, when crosslinking agent (f) is epoxy compounds,
As the reactive functional groups, carboxyl, amino, amide groups etc. can be enumerated, wherein preferably with high reactivity with epoxy group
Carboxyl.However, from the point of the corrosion for the circuit for preventing semiconductor crystal wafer or semiconductor chip, the preferably described reactive functional
Group is the group in addition to carboxyl.
It, such as can as with the reactive functional groups and not having the polymer (b) of energy ray-curable group
Enumerate polymer obtained from at least monomer polymerization with the reactive functional groups of sening as an envoy to.For acrylic polymer
(b-1) when, the monomer with the reactive functional groups is used to arrange as the monomer for constituting the acrylic polymer (b-1)
It is lifting, in the acrylic monomer and non-acrylic monomer any one or both.For example, as with hydroxyl
As the polymer (b) of reactive functional groups, such as (methyl) acrylic ester polymerization by hydroxyl can be enumerated and obtained
The polymer arrived can enumerate the acrylic monomer or non-acrylic monomer that will hereinbefore enumerate in addition to this
One or two of more than hydrogen atom be substituted by polymer obtained from monomer polymerization made of the reactive functional groups.
In the polymer (b) with reactive functional groups, by the knot of the monomer derived with reactive functional groups
The amount of structure unit is preferably 1~25 matter relative to the ratio (content) of the gross mass for the structural unit for constituting the polymer (b)
Measure %, more preferably 2~20 mass %.By making the such range of the ratio, in the polymer (b), crosslinking
Degree becomes preferred range.
The more good point of film property is made from protective film formation composition (IV-1), is not had energy ray curing
The weight average molecular weight (Mw) of the polymer (b) of property group is preferably 10000~2000000, more preferably 100000~
1500000。
Protective film formed with composition (IV-1) and protective film formed with it is contained by film, do not have energy ray-curable
The polymer (b) of group can be only one kind, or two or more, when being two or more, their combination and ratio can
Arbitrarily to select.
As protective film formation with composition (IV-1), can enumerate containing the polymer (a1) and the compound
(a2) in any one or both protective film formation use composition.Moreover, preferably being protected when containing the compound (a2)
Cuticula, which is formed, further contains the polymer (b) without energy ray-curable group with composition (IV-1), at this point, also excellent
Choosing is further containing (a1).In addition, protective film, which is formed, can also not contain the compound (a2) with composition (IV-1)
And simultaneously containing the polymer (a1) and without the polymer (b) of energy ray-curable group.
When protective film formation containing the polymer (a1), the compound (a2) and does not have energy with composition (IV-1)
When measuring the polymer (b) of ray-curable group, in protective film formation in composition (IV-1), relative to the polymer
(a1) and 100 mass parts of total content of the polymer (b) without energy ray-curable group, compound (a2's) contains
Amount is preferably 10~400 mass parts, more preferably 30~350 mass parts.
In protective film formation in composition (IV-1), the energy ray-curable ingredient (a) and penetrated without energy
Total content of the polymer (b) of line curative group is (that is, protective film forms the energy ray-curable ingredient for using film
(a) and total content of the polymer (b) without energy ray-curable group) relative to the total of the ingredient in addition to solvent
The ratio of content is preferably 5~90 mass %, more preferably 10~80 mass %, particularly preferably 15~70 mass %, for example,
Or any one in 20~60 mass % and 25~50 mass %.By making the ratio of total content in this way
Range, the energy ray-curable of protective film formation film becomes more good.
When protective film formation contains the energy ray-curable ingredient (a) with composition (IV-1) and penetrates without energy
When the polymer (b) of line curative group, is formed and used in film in protective film formation composition (IV-1) and protective film, relative to
100 mass parts of content of energy ray-curable ingredient (a), the content of the polymer (b) are preferably 3~160 mass parts, more
Preferably 6~130 mass parts, such as or 15~130 mass parts, 40~130 mass parts, 65~130 mass parts and 90
Any one in~130 mass parts.By making the such range of the content of the polymer (b), protective film is formed
Become more good with the energy ray-curable of film.
In addition to containing energy ray-curable ingredient (a) and polymer (b) without energy ray-curable group with
Outside, protective film is formed can also be contained selected from by Photoepolymerizationinitiater initiater (c), packing material with composition (IV-1) according to purpose
(d), coupling agent (e), crosslinking agent (f), colorant (g), Thermocurable ingredient (h), curing accelerator (i) and universal additive
(z) one or more of the group formed.
For example, by using the protective film shape containing the energy ray-curable ingredient (a) and Thermocurable ingredient (h)
At with composition (IV-1), it is formed by protective film formation film and the bonding force of adherend is improved because of heating, by the protection
The protection film strength that film formation is formed with film is also improved.
[Photoepolymerizationinitiater initiater (c)]
As Photoepolymerizationinitiater initiater (c), such as can to enumerate benzoin, benzoin methylether, benzoin ethyl ether, benzoin different
The benzoins chemical combination such as propyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal
Object；The benzene such as acetophenone, 2- hydroxy-2-methyl -1- phenyl-propan -1- ketone, 2,2- dimethoxy -1,2- diphenylethane -1- ketone
Ethanone compounds；Bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl, the oxidation of 2,4,6- trimethyl benzoyl diphenyl base
The acylphosphine oxides compound such as phosphine；The sulphur compounds such as benzyl phenyl thioether, tetramethylthiuram monosulfide；1- hydroxy-cyclohexyl
The α -one alcoholic compound such as phenyl ketone；The azo-compounds such as azodiisobutyronitrile；The titanocenes compound such as titanocenes；The thiophenes such as thioxanthones
Ton ketone compound；Benzophenone, 2- (dimethylamino) -1- (4- morpholinyl phenyl) -2- benzyl -1- butanone, 1- [9- ethyl -6-
(2- methyl benzoyl) -9H- carbazole -3- base] benzophenone cpds such as ethyl ketone 1- (O- acetyl oxime)；Peroxide chemical combination
Object；The dione compounds such as biacetyl；Benzyl；Dibenzyl；2,4- diethyl thioxanthone；1,2- diphenyl methane；2- hydroxyl -2- first
Base -1- [4- (1- methyl ethylene) phenyl] acetone；2- chloroanthraquinone etc..
In addition, as Photoepolymerizationinitiater initiater (c), such as the naphtoquinone compounds such as 1- chloroanthraquinone also can be used；Photosensitizers such as amine etc..
It can be only one kind that protective film, which is formed with the Photoepolymerizationinitiater initiater (c) contained by composition (IV-1), or
Two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using Photoepolymerizationinitiater initiater (c), in protective film formation in composition (IV-1), relative to energy ray curing
100 mass parts of content of property ingredient (a), the content of Photoepolymerizationinitiater initiater (c) is preferably 0.01~20 mass parts, more preferably
0.03~10 mass parts, particularly preferably 0.05~5 mass parts.
[packing material (d)]
By making protective film formation film contain packing material (d), protective film formation is solidified with film and is protected obtained from
The adjustment of the thermal expansion coefficient of cuticula becomes easy.Moreover, by making formation object of the thermal expansion coefficient relative to protective film
Object optimization is further enhanced using the reliability of protective film formation encapsulation obtained from composite sheet.In addition, by making
Protective film formation film contains packing material (d), can reduce the hydroscopicity of protective film, or can be improved thermal diffusivity.
As packing material (d), such as the packing material being made of Heat Conduction Material can be enumerated.
Packing material (d) can be any one in organic filler material and inorganic filling material, preferably inorganic to fill out
Fill material.
As preferred inorganic filling material, for example, can enumerate silica, aluminium oxide, talcum, calcium carbonate, titanium white,
The powder such as colcother, silicon carbide, boron nitride；By pearl made of these inorganic filling material spheroidizations；These inorganic filling materials
The modified product in surface；The mono-crystlling fibre of these inorganic filling materials；Glass fibre etc..
Wherein, preferably inorganic filling material is silica or aluminium oxide.
The average grain diameter of packing material (d) is not particularly limited, preferably 0.01~20 μm, more preferably 0.1~15 μm,
Particularly preferably 0.3~10 μm.By making the such range of average grain diameter of packing material (d), it is able to maintain that protective film
Formation object adhesiveness, and simultaneously inhibit protective film light transmitance reduction.
In addition, in the present specification, unless otherwise indicated, then " average grain diameter " refers to is acquired using laser diffraction scattering method
Size distribution curve in accumulated value be 50% at partial size (D50) value.
It can be only one that protective film, which forms composition (IV-1) and protective film formation with the packing material (d) contained by film,
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using packing material (d), in protective film formation in composition (IV-1), the content of packing material (d) (is protected
Cuticula forms the content with the packing material (d) of film) relative to the total content of all the components in addition to solvent ratio it is preferred
For 5~83 mass %, more preferably 7~78 mass %, for example, can for 10~73 mass %, 25~68 mass % and 40~
Any one in 63 mass %.By making the such range of content of packing material (d), the tune of above-mentioned thermal expansion coefficient
It is whole to become easier to.
[coupling agent (e)]
It can be with the substance of the functional group of inorganic compound or organic compound reaction as coupling agent by using having
(e), it can be improved protective film formation film to the adhesiveness and adherence of adherend.In addition, by using coupling agent (e), it will
Protective film obtained from protective film formation is solidified with film improves water resistance in the state of not damaging heat resistance.
Coupling agent (e) preferably have can with energy ray-curable ingredient (a), do not have energy ray-curable group
Polymer (b) etc. possessed by functional group reactions functional group compound, more preferably silane coupling agent.
As the preferred silane coupling agent, such as 3- glycydoxy trimethoxy silicon can be enumerated
Alkane, 3- glycydoxy methyldiethoxysilane, 3- glycidyl ether oxypropyltriethoxysilane, 3- contracting
Water glycerin ether oxygroup methyldiethoxysilane, 2- (3,4- epoxycyclohexyl) ethyl trimethoxy silane, 3- methacryl
Oxygroup propyl trimethoxy silicane, 3- TSL 8330,3- (2- aminoethylamino) propyl trimethoxy silicon
Alkane, 3- (2- aminoethylamino) hydroxypropyl methyl diethoxy silane, 3- (phenyl amino) propyl trimethoxy silicane, 3- aniline
Base propyl trimethoxy silicane, 3- urea propyl-triethoxysilicane, 3- mercaptopropyl trimethoxysilane, 3- mercapto hydroxypropyl methyl diformazan
Oxysilane, bis- (3- triethoxy silicon substrate propyl) tetrasulfides, methyltrimethoxysilane, methyltriethoxysilane, second
Alkenyl trimethoxy silane, vinyltriacetoxy silane, imidizole silane etc..
It can be only one that protective film, which forms composition (IV-1) and protective film formation with the coupling agent (e) contained by film,
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using coupling agent (e), is formed and used in film in protective film formation composition (IV-1) and protective film, relative to energy
100 mass parts of total content of ray-curable ingredient (a) and the polymer (b) without energy ray-curable group are measured, it is even
The content for joining agent (e) is preferably 0.03~20 mass parts, more preferably 0.05~10 mass parts, particularly preferably 0.1~5 mass
Part.More than the content lower limit value by making coupling agent (e), packing material (d) can be obtained more significantly in resin
In raising, protective film formation film and the raising of adhesiveness of adherend etc. of dispersibility produced by using coupling agent (e)
Raw effect.In addition, by making the content upper limit value of coupling agent (e) hereinafter, the production of degassing can be further suppressed
It is raw.
[crosslinking agent (f)]
Above-mentioned energy ray-curable ingredient (a) is crosslinked by using crosslinking agent (f) or is not had energy ray curing
The polymer (b) of property group, can adjust the initial bond power and cohesiveness of protective film formation film.
As crosslinking agent (f), such as organic polyisocyanate compound, organic multicomponent group with imine moiety, gold can be enumerated
Belong to chelates crosslinking agent (crosslinking agent with metallo-chelate structure), (friendship with '-aziridino of aziridines crosslinking agent
Join agent) etc..
As the organic polyisocyanate compound, such as aromatic polyisocyanate compound, fat can be enumerated
Race's polyisocyanate compound and alicyclic polyisocyanates compound are (hereinafter, uniformly write a Chinese character in simplified form work " virtue for these compounds sometimes
Fragrant race's polyisocyanate compound etc. ")；The tripolymer of the aromatic polyisocyanate compound etc., isocyanuric acid ester body and
Addition product；Terminal isocyanate ammonia obtained from reacting described aromatic polyisocyanate compound etc. with polyol compound
Carbamate prepolymer etc.." addition product " refers to the aromatic polyisocyanate compound, aliphatic polyisocyante
Compound or alicyclic polyisocyanates compound and ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane or castor oil etc.
The reactant of low molecule active hydrogen-contg compound.As the example of the addition product, trihydroxy methyl as described later can be enumerated
Benzene dimethylene diisocyanate addition product of propane etc..In addition, " terminal isocyanate carbamate prepolymer " refers to tool
There is urethane bond and there is the prepolymer of isocyanate group in the terminal part of molecule.
As the organic polyisocyanate compound, more specifically, such as 2,4- toluene diisocynate can be enumerated
Ester；2,6- toluene di-isocyanate(TDI)；1,3- benzene dimethylene diisocyanate；1,4- benzene dimethylene diisocyanate；Hexichol
Methylmethane -4,4 '-diisocyanate；Diphenyl methane -2,4 '-diisocyanate；3- Dimethyl diphenylmethane diisocyanate；
Hexamethylene diisocyanate；Isophorone diisocyanate；Dicyclohexyl methyl hydride -4,4 '-diisocyanate；Dicyclohexyl first
Alkane -2,4 '-diisocyanate；Addition has toluene diisocyanate on all or part of hydroxyl of the polyalcohols such as trimethylolpropane
In acid esters, hexamethylene diisocyanate and benzene dimethylene diisocyanate any one or it is two or more made of chemical combination
Object；Lysine diisocyanate etc..
As the organic multicomponent group with imine moiety, such as N can be enumerated, diphenyl methane -4 N ' -, 4 '-bis- (1- nitrogen third
Pyridine formamide) ,-three-β of trimethylolpropane-'-aziridino propionic ester ,-three-β of tetramethylol methane-'-aziridino propionic ester,
N, N '-Toluene-2,4-diisocyanate, bis- (1- aziridine formamide) triethylenemelanins of 4- etc..
When using organic polyisocyanate compound as crosslinking agent (f), as energy ray-curable ingredient (a) or not
Polymer (b) with energy ray-curable group, it is preferable to use hydroxyl polymer.When crosslinking agent (f) has isocyanide
When perester radical, energy ray-curable ingredient (a) or the polymer (b) without energy ray-curable group have hydroxyl,
By crosslinking agent (f) with energy ray-curable ingredient (a) or the polymer (b) without energy ray-curable group it is anti-
It answers, cross-linked structure simply can be imported into protective film formation film.
It can be only one that protective film, which forms composition (IV-1) and protective film formation with the crosslinking agent (f) contained by film,
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using crosslinking agent (f), in protective film formation in composition (IV-1), relative to energy ray-curable ingredient
(a) and 100 mass parts of total content of the polymer (b) without energy ray-curable group, the content of crosslinking agent (f) are preferred
For 0.01~20 mass parts, more preferably 0.1~10 mass parts, particularly preferably 0.5~5 mass parts.By making crosslinking agent (f)
The content be the lower limit value or more, can obtain more significantly by using crosslinking agent (f) and the effect that generates.In addition,
By making the content upper limit value of crosslinking agent (f) hereinafter, can inhibit being excessively used for crosslinking agent (f).
[colorant (g)]
As colorant (g), such as well known to inorganic pigment, organic pigment, organic dyestuff being enumerated etc.
Toner.
As the organic pigment and organic dyestuff, such as amine (aminium) class pigment, cyanine class color can be enumerated
Element, merocyanine class pigment, crocic acid (croconium) class pigment, sour cyanines (squarylium) the class pigment in side, azulene
(azulenium) class pigment, polymethine class pigment, naphthalene Quinone Pigments, pyransClass pigment, phthalocyanines pigment, naphthalene cyanines class pigment,
Naphthalene lactim (naphtholactam) class pigment, azo pigment, condensation azo pigment, indigoid type pigment, purple cyclic ketones
(perinone) class pigment, class pigment, dioxazine pigment, quinacridine ketone pigment, isoindoline ketone pigment, quinophthalone
Class pigment, pyroles pigment, thioindigo class pigment, metal complex species pigment (metal complex salt dyestuff), dithiol metal complexing
Species pigment, indoles phenol sulfonate, triallyl methane class pigment, anthraquinone pigments, aphthols pigment, azomethine class pigment,
Benzimidazole ketone pigment, pyranthrone pigment and intellectual circle (threne) class pigment etc..
As the inorganic pigment, such as carbon black, cobalt class pigment, iron class pigment, chromium class pigment, titanium class color can be enumerated
Element, vanadium class pigment, zirconium class pigment, molybdenum class pigment, ruthenium class pigment, platinum class pigment, ITO (tin indium oxide) class pigment, ATO (oxidation
Antimony tin) class pigment etc..
It can be only one that protective film, which forms composition (IV-1) and protective film formation with the colorant (g) contained by film,
Kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using colorant (g), the content that protective film forms the colorant (g) of film suitably adjust i.e. according to purpose
It can.For example, adjusting the translucency of protective film by the content for adjusting colorant (g), when thus adjusting lettering visuality, protecting
Cuticula, which is formed, to be used in composition (IV-1), content (i.e. protective film forms the content for using the colorant (g) of film) phase of colorant (g)
Ratio for the total content of all the components in addition to solvent is preferably 0.1~10 mass %, more preferably 0.4~7.5 matter
Measure %, particularly preferably 0.8~5 mass %.It more than the content lower limit value by making colorant (g), can be more aobvious
Land the effect for obtaining and being generated by using colorant (g).In addition, by make the content of colorant (g) it is described on
Limit value is hereinafter, can inhibit being excessively used for colorant (g).
[Thermocurable ingredient (h)]
Protective film, which forms to be formed with composition (IV-1) and protective film, uses the Thermocurable ingredient (h) contained by film can be only
For one kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
As Thermocurable ingredient (h), for example, can enumerate epoxies heat-curing resin, Thermocurable polyimides,
Polyurethane, unsaturated polyester (UP), organic siliconresin etc., preferably epoxies heat-curing resin.
(epoxies heat-curing resin)
Epoxies heat-curing resin is made of epoxy resin (h1) and thermal curing agents (h2).
Protective film is formed can with the epoxies heat-curing resin contained by composition (IV-1) and protective film formation film
To be only one kind, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
Epoxy resin (h1)
As epoxy resin (h1), well known epoxy resin can be enumerated, for example, can enumerate multifunctional based epoxy resin,
Biphenol compound, bisphenol A diglycidyl ether and its hydride, o-cresol phenolic resin varnish, dicyclopentadiene type ring
Oxygen resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenylene matrix type epoxy resin etc.
Epoxide more than difunctionality.
As epoxy resin (h1), it is possible to use the epoxy resin with unsaturated alkyl.With do not have unsaturated alkyl
Epoxy resin compare, the compatibility of epoxy resin and acrylic resin with unsaturated alkyl is high.Therefore, by using
Epoxy resin with unsaturated alkyl is improved using the reliability of protective film formation encapsulation obtained from composite sheet.
As the epoxy resin with unsaturated alkyl, for example, can enumerate multifunctional based epoxy resin epoxy group one
Partial Transformation is at compound made of the group with unsaturated alkyl.Such compound for example can be by making (methyl) propylene
Acid or derivatives thereof carries out addition reaction with epoxy group and obtains.
In addition, as the epoxy resin with unsaturated alkyl, such as can enumerate in the aromatic rings for constituting epoxy resin
There is the compound etc. of the group with unsaturated alkyl Deng upper Direct Bonding.
Unsaturated alkyl is that the unsaturated group with polymerism can enumerate ethylidine (ethylene as its concrete example
Base), 2- acrylic (allyl), (methyl) acryloyl group, (methyl) acrylamido etc., preferably acryloyl group.
Epoxy resin (h1) though number-average molecular weight be not particularly limited, from the curability of protective film formation film, with
And the point of film strength and heat resistance is protected to set out, preferably 300~30000, more preferably 400~10000, particularly preferably
500~3000.
The epoxide equivalent of epoxy resin (h1) is preferably 100~1000g/eq, more preferably 150~800g/eq.
Epoxy resin (h1) can be used alone, can also be simultaneously using two or more, while using two or more
When, their combination and ratio can be selected arbitrarily.
Thermal curing agents (h2)
Thermal curing agents (h2) play a role as the curing agent for epoxy resin (h1).
As thermal curing agents (h2), such as can enumerate has two or more can be with the official of epoxy reaction in 1 molecule
The compound that can be rolled into a ball.As the functional group, such as phenolic hydroxyl group, alcohol hydroxyl group, amino, carboxyl, acidic group acid anhydrides can be enumerated
Group made of group made of change etc., preferably phenolic hydroxyl group, amino or acidic group acid anhydrides, more preferably phenolic hydroxyl group or
Amino.
As the phenols curing agent with phenolic hydroxyl group in thermal curing agents (h2), such as multifunctional phenol tree can be enumerated
Rouge, '-biphenyl diphenol, novolak type phenol resin, bicyclopentadiene class phenol resin, aralkyl-phenol resin etc..
As the amine curing agent with amino in thermal curing agents (h2), such as dicyandiamide can be enumerated (hereinafter, sometimes
Write a Chinese character in simplified form work " DICY ") etc..
Thermal curing agents (h2) can have unsaturated alkyl.
As the thermal curing agents (h2) with unsaturated alkyl, for example, can enumerate phenol resin hydroxyl a part through having
Compound made of having the group of unsaturated alkyl to replace, Direct Bonding has unsaturated alkyl on the aromatic rings of phenol resin
Compound obtained from group etc..
In the unsaturated alkyl and the above-mentioned epoxy resin with unsaturated alkyl in thermal curing agents (h2) not
Saturated hydrocarbyl is identical.
When using phenols curing agent as thermal curing agents (h2), from improving protective film pointing out from the fissility of support chip
Hair, preferably thermal curing agents (h2) are softening point or the high thermal curing agents of glass transition temperature.
Phenol resin in thermal curing agents (h2), for example multifunctional, novolak type phenol resin, bicyclopentadiene class phenol tree
The number-average molecular weight of the resin components such as rouge, aralkyl-phenol resin is preferably 300~30000, and more preferably 400~10000, especially
Preferably 500~3000.
In thermal curing agents (h2), the molecular weight of non-resin ingredient such as '-biphenyl diphenol, dicyandiamide is not particularly limited,
Such as preferably 60~500.
Thermal curing agents (h2) can be used alone, can also be simultaneously using two or more, while using two or more
When, their combination and ratio can be selected arbitrarily.
When using Thermocurable ingredient (h), is formed and used in film in protective film formation composition (IV-1) and protective film, phase
For 100 mass parts of content of epoxy resin (h1), the content of thermal curing agents (h2) is preferably 0.01~20 mass parts.
When using Thermocurable ingredient (h), is formed and used in film in protective film formation composition (IV-1) and protective film, phase
For not having 100 mass parts of content of the polymer (b) of energy ray-curable group, the content of Thermocurable ingredient (h)
(for example, total content of epoxy resin (h1) and thermal curing agents (h2)) is preferably 1~500 mass parts.
[curing accelerator (i)]
Curing accelerator (i) is the ingredient for adjusting the curing rate of protective film formation film.
As preferred curing accelerator (i), such as triethylene diamine, benzyl dimethylamine, triethanolamine, two can be enumerated
The tertiary amines such as methyl amino ethanol, three (dimethylaminomethyl) phenol；2-methylimidazole, 2- phenylimidazole, 2- phenyl -4- first
The imidazoles such as base imidazoles, 2 pheny1 4,5 dihydroxymethyl imidazole, 2 phenyl 4 methyl 5 hydroxy methylimidazole (1 or more hydrogen
Imidazoles made of atom is replaced by the group other than hydrogen atom)；Organic phosphine (1 such as tributylphosphine, diphenylphosphine, triphenylphosphine
Phosphine made of a above hydrogen atom is replaced by organic group)；TetraphenylphosphoniumTetraphenyl borate, triphenylphosphine tetraphenyl borate
Equal tetraphenyl borates etc..
Curing accelerator (i) can be used alone, can also be simultaneously using two or more, while using two or more
When, their combination and ratio can be selected arbitrarily.
When using curing accelerator (i), protective film forms to be formed with composition (IV-1) and protective film and be promoted with the solidification of film
Content into agent (i) is not particularly limited, and suitably select according to the ingredient used simultaneously.
[universal additive (z)]
Universal additive (z) can be well known additive, can arbitrarily be selected, be not particularly limited according to purpose, as
Preferred additive, such as plasticizer, antistatic agent, antioxidant, capturing agent (gettering agent) can be enumerated etc..
Protective film forms composition (IV-1) and protective film formation with the universal additive (z) contained by film
It is a kind of, or two or more, when being two or more, their combination and ratio can be selected arbitrarily.
When using universal additive (z), protective film forms general the adding with composition (IV-1) and protective film formation film
Add the content of agent (z) to be not particularly limited, suitably select according to purpose.
[solvent]
It is preferred that protective film, which is formed, further contains solvent with composition (IV-1).Protective film containing solvent is formed with combination
The operability of object (IV-1) is good.
The solvent is not particularly limited, and as preferred solvent, such as can enumerate the hydrocarbon such as toluene, dimethylbenzene；Methanol,
The alcohol such as ethyl alcohol, 2- propyl alcohol, isobutanol (2- methylpropane -1- alcohol), n-butyl alcohol；The esters such as ethyl acetate；Acetone, methyl ethyl ketone etc.
Ketone；The ethers such as tetrahydrofuran；Amides such as dimethylformamide, N-Methyl pyrrolidone (compound with amido bond) etc..
It can be only one kind that protective film, which is formed with the solvent contained by composition (IV-1), or and it is two or more, be
When two or more, their combination and ratio can be selected arbitrarily.
From can be by the point that containing ingredient more uniformly mixes of the protective film formation in composition (IV-1), preferably
It is methyl ethyl ketone, toluene or ethyl acetate etc. that protective film, which is formed with the solvent contained by composition (IV-1),.
< < protective film forms the preparation method > > for using composition
Protective film is formed can be by blending for constituting its with the protective films formation such as composition (IV-1) composition
Each ingredient and obtain.
Order of addition when blending each ingredient is not particularly limited, and can also add two or more ingredients simultaneously.
It, can be pre- by the blending ingredient and mixing solvent with any blending ingredient in addition to solvent when using solvent
Dilution is to carry out using can not also be by any blending ingredient pre-dilution in addition to solvent and by by solvent and these
Blend ingredient mixing to carry out using.
The method that each ingredient is mixed when blending is not particularly limited, and suitably selects: making from following well known methods
Blender or stirring blade etc. rotate and mixed method；The method mixed using blender；Apply ultrasonic wave and
Mixed method etc..
As long as respectively blending ingredient not deteriorate, the temperature and time when adding and mix each ingredient are not particularly limited,
Suitably adjust, but preferable temperature is 15~30 DEG C.
◇ protective film forms the manufacturing method for using film
It can be by the way that protective film formation be coated on stripping film (preferably its lift-off processing face) and according to need with composition
It is dried and manufactures protective film formation film of the invention.At this point, by forming the protective film in stripping film with combination
The maximum section height (Rt) of the coated face of object is adjusted, and is capable of forming the protective film formation with the surface (β) and uses film.
In addition, for example, as shown in Figure 1, protective film formation with film usually be fitted on its two sides the state of stripping film into
Row keeping.Therefore, as described above the exposed surface for the protective film formation film being formed on stripping film (with have stripping film
The face of side opposite side) on be further bonded stripping film (preferably its lift-off processing face).
◇ protective film forms the application method for using film
By the way that protective film formation of the invention is set to support chip with film as described above, protective film can be constituted and formed
Use composite sheet.Protective film formation composite sheet is attached at the back side of semiconductor crystal wafer (with electricity with film by its protective film formation
The face of pole forming face opposite side) to carry out using.Later, using with aftermentioned protective film formation composite sheet the case where, is identical
Method, carry out the formation of the cured protective film based on protective film formation film, cutting, semiconductor chip with protective film
Pick up etc., manufacturing objective semiconductor device.
On the other hand, protective film formation film of the invention can be pre-set at the back side of semiconductor crystal wafer, without setting
It is placed on support chip.That is, protective film formation to be attached to the back side of semiconductor crystal wafer with film.Then, to protective film formation film
Irradiation energy ray makes protective film formation film solidify and protective film is made.Then, by the protective film exposed surface (with
Be attached at the face of the side opposite side of semiconductor crystal wafer) on be bonded support chip, protective film formation film, which is made, becomes protective film
State protective film formation use composite sheet.Later, it is cut in the same manner as described above, the semiconductor core with protective film
The pickup etc. of piece, manufacturing objective semiconductor device.
In addition, herein to making the solidification of protective film formation film that the protective film be fitted in support again to being made after protective film
The case where piece, is illustrated, but when using protective film formation film of the invention, and the sequence for carrying out these processes can also be with
On the contrary.That is, passing through the dew in protective film formation film after on the back side that protective film formation is attached to semiconductor crystal wafer with film
It appears to be bonded support chip (with the face for the side opposite side for being attached at semiconductor crystal wafer), it is not that protective film formation film, which is thus made,
Composite sheet is used in the protective film formation of solid state.Then, it to protective film formation film irradiation energy ray, forms protective film and uses
Film solidification is to be made protective film.Later, it is cut in the same manner as described above, semiconductor chip with protective film picks up
It takes, manufacturing objective semiconductor device.
Composite sheet is used in the formation of ◇ protective film
Protective film formation composite sheet of the invention is by having support chip and having on the support chip protection
Film formation is formed with film, when to the protective film formation film irradiation energy ray to which protective film be made, becomes the guarantor
The surface (β ') of cuticula, the described protective film forms the surface (β) with film towards the support chip.
It is that imparting has the composite sheet as the function of cutting sheet in advance that composite sheet is used in protective film formation of the invention.
In the protective film formation composite sheet, protective film forms the surface (β) with film towards support chip, passes through energy
The irradiation of ray and become protective film surface (β ').
Since the protective film formation composite sheet has the protective film formation film, the surface (β ') of protective film
Laser lettering it is clear, lettering visual excellence.
In the present invention, even if after protective film formation film solidifies, as long as support chip and protective film formation is maintained to use film
Solidfied material (in other words, support chip and protective film) stepped construction, then the laminate structure thus referred to as " protective film is formed
With composite sheet ".
The semiconductor crystal wafer of object or the thickness of semiconductor chip are used as protective film formation composite sheet of the invention
Degree is not particularly limited, due to that can obtain effect of the invention, preferably 30~1000 μm more significantly, more preferably
100~300 μm.
Hereinafter, being described in detail to the composition of protective film formation composite sheet.
◎ support chip
The support chip can be made of a layer (single layer), can also be made of two layers or more of multiple layers.Support chip
When being made of multiple layers, these multiple layers mutually the same can be can also be different, as long as not damaging effect of the invention, these
Multiple layers of combination is not particularly limited.
As preferred support chip, such as the support chip being only made of substrate can be enumerated.
Hereinafter, side reference attached drawing, while being illustrated to the example of protective film formation composite sheet of the invention.
Fig. 2 is the sectional view for schematically showing an embodiment of protective film formation composite sheet of the invention.
In addition, in the figure after Fig. 2, for structure identical with the constituent element shown in figure being explained
At element, appended drawing reference identical with the figure that this is explained is marked, and description is omitted.
Protective film formation composite sheet 1C shown here has protective film formation film 13 on substrate 11.Support chip 10
It is only made of substrate 11, in other words, protective film formation has with composite sheet 1C on the surface upper layer 10a of the side of support chip 10
It is laminated with the composition of protective film formation film 13.In addition, protective film formation is with composite sheet 1C further in protective film formation film 13
On have stripping film 15.
In protective film formation in composite sheet 1C, on (the surface of the side of support chip 10 surface 11a of the side of substrate 11
Protective film formation film 13 is laminated on 10a), the protective film formation side of film 13 surface (in the present specification, sometimes
Referred to as " the first face ") a part of 13a, the region i.e. near peripheral part be laminated with fixture adhesive phase 16, in protective film shape
At in surface (the first face) 13a with film 13 the region that fixture adhesive phase 16 is not laminated and fixture adhesive phase 16
Surface 16a (upper surface and side) on be laminated with stripping film 15.
In protective film formation in composite sheet 1C, the surface of the other side of protective film formation film 13 is (in the present specification,
Sometimes referred to as " the second face "), i.e. the face 13b towards support chip 10 of protective film formation film 13 be the surface (β), can also be with
The the first face 13a for being protective film formation film 13 is the surface (β).
Protective film formation shown in Fig. 2 carried out in the following manner with composite sheet 1C using: in the shape for eliminating stripping film 15
Under state, the back side of semiconductor crystal wafer (illustration omitted) is attached on the first face 13a of protective film formation film 13, further makes to press from both sides
Upper surface in the surface 16a of tool adhesive phase 16 is attached on the fixtures such as annular frame.
Fig. 3 is the sectional view for schematically showing the another embodiment of protective film formation composite sheet of the invention.
Protective film formation composite sheet 1D shown here other than not having 16 this point of fixture adhesive phase, with
Protective film shown in Fig. 2 forms identical with composite sheet 1C.That is, in protective film formation in composite sheet 1D, in the side of substrate 11
Surface 11a on be laminated with protective film formation film 13, be laminated in the entire surface of the first face 13a of protective film formation film 13
There is stripping film 15.
Protective film formation shown in Fig. 3 carried out in the following manner with composite sheet 1D using: in the shape for eliminating stripping film 15
Under state, semiconductor crystal wafer is attached on a part of region of the center side in the first face 13a of protective film formation film 13 and (is omitted
Diagram) the back side, be attached to the region near peripheral part on the fixtures such as annular frame.
Protective film formation of the invention with composite sheet be not limited to Fig. 2~3 shown in composite sheet, it is of the invention not damaging
In the range of effect, what can be constituted to change or deleting a part of protective film formation composite sheet shown in Fig. 2~3 is answered
Close piece or may be added on the basis of above explained protective film formation composite sheet other composition it is compound
Piece.
As long as protective film formation composite sheet can also be in office shown in Fig. 2~3 for example, not damaging effect of the invention
The position of meaning is provided with the layer in addition to support chip, protective film formation film, fixture adhesive phase and stripping film.
In addition, in protective film formation composite sheet of the invention, can stripping film with and the stripping film directly contact
A part of gap is generated between layer.
In addition, in protective film formation composite sheet of the invention, can arbitrarily be adjusted according to purpose each layer size and
Shape.
Support chip can be transparent, can also be opaque, can also be coloured according to purpose.
Wherein, in the present invention that protective film formation has energy ray-curable with film, preferably support chip penetrates energy
Ray.
For example, the transmitance of the light of wavelength 375nm is preferably 30% or more in support chip, more preferably 50% or more,
Particularly preferably 70% or more.By making the such range of transmitance of the light, protective film is formed through support chip and is used
When film irradiation energy ray (ultraviolet light), the curing degree of protective film formation film is further enhanced.
On the other hand, in support chip, the upper limit value of the transmitance of the light of wavelength 375nm is not particularly limited.For example, institute
The transmitance for stating light may be 95% or less.
In addition, the transmitance of the light of wavelength 532nm is preferably 30% or more in support chip, more preferably 50% or more,
Particularly preferably 70% or more.By making the such range of transmitance of the light, protective film is formed through support chip and is used
It, being capable of more clearly lettering when film or protective film irradiation laser are to carry out lettering to it.
On the other hand, in support chip, the upper limit value of the transmitance of the light of wavelength 532nm is not particularly limited.For example, institute
The transmitance for stating light may be 95% or less.
In addition, the transmitance of the light of wavelength 1064nm is preferably 30% or more in support chip, more preferably 50% with
On, particularly preferably 70% or more.By making the such range of transmitance of the light, protective film is formed through support chip
It, being capable of more clearly lettering when with film or protective film irradiation laser to carry out lettering to it.
On the other hand, in support chip, the upper limit value of the transmitance of the light of wavelength 1064nm is not particularly limited.For example,
The transmitance of the light may be 95% or less.
Described in manufacturing method as be described hereinafter, by surface and root that protective film formation is coated on to support chip with composition
When according to needing to be dried and form protective film formation film, preferably by the coating of the protective film formation composition in support chip
The maximum section height (Rt) in face is set as, for example only the value of the value small 0.5 of the target maximum section height (Rt) of specific surface (β) is extremely
Only than its big 0.5 value in the range of.By the coated face for setting the protective film formation composition in support chip by this method
Maximum section height (Rt), the maximum section height (Rt) of surface (β) more easily can be adjusted to target value.
As the coated face of the protective film formation composition in support chip, such as the surface of the substrate can be enumerated.
Described in manufacturing method as be described hereinafter, in such a way that protective film formation not to be coated on to the surface of support chip with composition
When forming protective film formation film, the surface (face towards protective film formation film and the face with the face opposite side) of support chip
Maximum section height (Rt) though be not particularly limited, for example can be with the coated face of above-mentioned protective film formation composition
It is identical.
For example, the case where maximum section height (Rt) with the surface of above-mentioned stripping film can be utilized identical method tune
Save the maximum section height (Rt) on the surface of support chip.
Then, further the layer for constituting support chip is described in detail.
Zero substrate
The substrate is sheet or membranaceous, as its constituent material, such as can enumerate various resins.
As the resin, for example, can enumerate low density polyethylene (LDPE) (LDPE), straight-chain low density polyethylene (LLDPE),
The polyethylene such as high density polyethylene (HDPE) (HDPE)；Polypropylene, polybutene, polybutadiene, polymethylpentene, norbornene resin etc. remove
Polyolefin other than polyethylene；Vinyl-vinyl acetate copolymer, ethylene-(methyl) acrylic copolymer, ethylene-(methyl)
The ethene copolymers such as acrylate copolymer, ethylene-norbornene copolymer (use ethylene to be copolymerized as obtained from monomer
Object)；The vinyl chloride resins such as polyvinyl chloride, vinyl chloride copolymer (use vinyl chloride as resin obtained from monomer)；Polyphenyl
Ethylene；Polycyclic alkene；Polyethylene terephthalate, polybutylene terephthalate (PBT), gathers at polyethylene naphthalate
Ethylene isophthalate, poly- 2,6- (ethylene naphthalate), all structural units have the complete of aromatic series cyclic group
The polyester such as aromatic polyester；The copolymer of the two or more polyester；Poly- (methyl) acrylate；Polyurethane；Polyurethane third
Olefin(e) acid ester；Polyimides；Polyamide；Polycarbonate；Fluororesin；Polyacetals；Noryl；Polyphenylene sulfide；Polysulfones；Polyether-ketone
Deng.
In addition, as the resin, such as the polyester can also be enumerated and gathered with the mixture of resin etc. in addition to it
Close object alloy.It is preferred that the amount of the polyester and the resin in addition to polyester in the polymer alloy of resin in addition to it be compared with
On a small quantity.
In addition, as the resin, such as the one or more of the resin above illustrated can also be enumerated
Crosslinked resin made of crosslinking；The modified tree such as one or more kinds of ionomers of the resin above illustrated is used
Rouge.
In addition, in the present specification, " (methyl) acrylic acid " be comprising " acrylic acid " and " methacrylic acid " both
Concept.It is also identical as term as (methyl) acrylic compounds.
Constitute substrate resin can be only one kind, or it is two or more, for it is two or more when, their combination and
Ratio can be selected arbitrarily.
Substrate can be made of a layer (single layer), can also be made of two layers or more of multiple layers, be made of multiple layers
When, these multiple layers mutually the same can also be different, these multiple layers combinations are not particularly limited.
The thickness of substrate is preferably 50~300 μm, and more preferably 60~100 μm.By make substrate with a thickness of such
Range, the pliability of the protective film formation composite sheet and to the adhesion of semiconductor crystal wafer or semiconductor chip obtain into
One step improves.
Herein, " thickness of substrate " refers to the thickness of substrate entirety, such as the thickness for the substrate being made of multiple layers refers to
Constitute the thickness of the total of all layers of substrate.
Preferred substrates be the high substrate of thickness and precision, i.e. no matter what part thickness the base that is inhibited of deviation
Material.In above-mentioned constituent material, as the material that can be used for constituting the high substrate of the thickness and precision, such as it can enumerate poly-
Ethylene, the polyolefin in addition to polyethylene, polyethylene terephthalate, vinyl-vinyl acetate copolymer etc..
Substrate other than containing the main compositions material such as the resin, can also containing packing material, colorant, resist it is quiet
Various additives well known to electric agent, antioxidant, organic lubricant, catalyst, softening agent (plasticizer) etc..
As long as the optical characteristics of substrate meets the optical characteristics of support chip described above.That is, substrate can be saturating
It is bright, can also be opaque, it can also be coloured according to purpose, other layers can also be vapor-deposited with.
Moreover, preferred substrates are penetrated through energy in the present invention that protective film formation has energy ray-curable with film
Line.
Substrate can be manufactured using well known method.For example, the substrate containing resin can be by that will contain the resin
Resin combination molding and manufacture.
◇ protective film forms the manufacturing method for using composite sheet
It can stack gradually above-mentioned each layer in a manner of making above-mentioned each layer become corresponding positional relationship and make
Make protective film formation composite sheet of the invention.The forming method of each layer is identical as what is be illustrated above.
Manufacture is when being laminated with protective film formation composite sheet made of protective film formation film on support chip, for example, logical
It crosses and protective film formation is coated on support chip with composition and is dried as needed, the protective film can be obtained and formed
Use composite sheet.At this point, being cutd open by the maximum of the coated face as described above to the protective film formation composition in support chip
Face height (Rt) is adjusted, and is capable of forming the protective film formation with the surface (β) and uses film.
In addition, manufacture when being laminated with protective film formation composite sheet made of protective film formation film on support chip, is led to
Cross protective film formation is coated on stripping film (preferably its lift-off processing face) with composition and is dried as needed and
Protective film is formed on stripping film formed and use film, by by the surface of the exposed surface of the protective film formation film and the side of support chip
Fitting, also can be obtained the protective film formation composite sheet.Wherein, at this point, so that protective film formed film exposed surface (with set
Be equipped with the surface of the side opposite side of stripping film) maximum section height (Rt) become the surface (β) maximum section height
(Rt) mode is adjusted.
Any opportunity after forming protective film formation film removes stripping film.
In addition, protective film formation with composite sheet usually with the most surface layer of its support chip opposite side (such as protective film shape
At with film) surface be fitted with the state of stripping film and taken care of.Therefore, even if by protective film formation composition etc., use
Be coated on the stripping film (preferably its lift-off processing face) in forming the composition of layer for constituting most surface layer, and as needed into
Thus row drying forms the layer for constituting most surface layer on stripping film, and is opposite in the side contacted with same stripping film of this layer
Other each layers are laminated in the exposed surface of side also can be obtained protective film and is formed when holding does not remove and is bonded the state of stripping film
Use composite sheet.
◇ protective film forms the application method for using composite sheet
Protective film formation of the invention can for example be carried out using method as shown below with composite sheet using.
That is, by protective film formation with composite sheet by its protective film formation with film be attached at semiconductor crystal wafer the back side (with
The face of electrode forming surface opposite side).Then, to protective film formation film irradiation energy ray, solidify protective film formation with film
To which protective film be made.Then, by cutting, semiconductor crystal wafer is divided together with protective film, semiconductor chip is made.So
Afterwards, by semiconductor chip to be pasted with the state (that is, as semiconductor chip with protective film) of the protective film from support chip
It separates and picks up.
Later, using method identical with previous method, by the semiconductor of the obtained semiconductor chip with protective film
After flip-chip is connected to the circuit face of substrate, semiconductor packages is made.Then, it is partly led using semiconductor packages production target
Body device.
In addition, carry out to making protective film formation solidify to form after protective film the case where cutting again with film herein
Illustrate, but when using protective film formation composite sheet of the invention, the sequence for carrying out these processes be may be reversed.That is,
After protective film formation is attached on the back side of semiconductor crystal wafer with composite sheet, by cutting semiconductor crystal wafer and protective film shape
Divide together at film, semiconductor chip is made.Then, to the protective film formation film irradiation energy ray divided, make to protect
The solidification of cuticula formation film is to form protective film.It is same as described above later, by the semiconductor chip with protective film from support chip
Upper separation is simultaneously picked up, and makes the semiconductor device as target.
Embodiment
Hereinafter, the present invention will be described in more detail according to specific embodiment.Wherein, the present invention is not limited to
Embodiment described below.
Protective film described below forms ingredient used in the manufacture with composition.
Energy ray-curable ingredient
(a2) -1: tristane dihydroxymethyl diacrylate be (Nippon Kayaku Co., Ltd. manufacture
" KAYARAD R-684 ", the ultra-violet solidified compound of difunctionality, molecular weight 304)
Polymer without energy ray-curable group
(b) -1: by butyl acrylate (hereinafter, writing a Chinese character in simplified form work " BA ") (10 mass parts), methyl acrylate (hereinafter, writing a Chinese character in simplified form work
" MA ") (70 mass parts), glycidyl methacrylate (hereinafter, writing a Chinese character in simplified form work " GMA ") (5 mass parts) and acrylic acid 2- hydroxyl
Acrylic polymer (weight average molecular weight 300000, glass made of ethyl ester (hereinafter, writing a Chinese character in simplified form work " HEA ") (15 mass parts) copolymerization
- 1 DEG C of glass transition temperature)
(b) -2: by acrylic polymer (Weight-average molecular made of MA (85 mass parts) and HEA (15 mass parts) copolymerization
Amount 370000,6 DEG C of glass transition temperature)
Photoepolymerizationinitiater initiater
(c) (BASF AG manufactures -1:2- (dimethylamino) -1- (4- morpholinyl phenyl) -2- benzyl -1- butanone
" Irgacure (registered trademark) 369 ")
(c) -2:1- [9- ethyl -6- (2- methyl benzoyl) -9H- carbazole -3- base] ethyl ketone 1- (O- acetyl oxime) (BASF
" Irgacure (registered trademark) OXE02 " of company's manufacture)
Packing material
(d) -1: silica filler (vitreous silica filler, 8 μm of average grain diameter)
(d) -2: spherical silicon dioxide filler (" SC2050MA " of Admatechs. manufacture, 0.5 μm of average grain diameter)
Coupling agent
(e) -1:3- methacryloxypropyl trimethoxy silane (Shin-Etsu Chemical Co., Ltd. system
" KBM-503 " made, silane coupling agent)
(e) -2:3- TSL 8330 (NUC Corporation. manufacture " A-1110 ", it is silane coupled
Agent)
Colorant
(g) -1: by phthalocyanines blue pigment (Pigment Blue 15:3) 32 mass parts, isoindoline ketone yellow color
Plain (Pigment Yellow 139) 18 mass parts and the mixing of Anthraquinones red pigments (Pigment Red 177) 50 mass parts,
So that the total amount of three kinds of pigments/styrene acrylic resin amount=1/3 (mass ratio) mode carries out pigmentation and obtains
The pigment arrived
(g) -2: carbon black (" #MA650 " of Mitsubishi Chemical Corporation manufacture, average grain diameter
28nm)
Epoxy resin
(h1) -1: bisphenol A type epoxy resin (" jER828 " of Mitsubishi Chemical Corporation manufacture,
184~194g/eq of epoxide equivalent)
(h1) -2: bisphenol A type epoxy resin be (Mitsubishi Chemical Corporation manufacture
" jER1055 ", 800~900g/eq of epoxide equivalent)
(h1) -3: dicyclopentadiene type epoxy resin (" EPICLONHP-7200HH " of DIC Corporation manufacture,
255~260g/eq of epoxide equivalent)
Thermal curing agents
(h2) -1: dicyandiamide (thermal activities potentiality the curing agent, " Adeka of ADEKACORPORATION manufacture
Hardener EH-3636AS ", active hydrogen amount 21g/eq)
Curing accelerator
(i) (SHIKOKU CHEMICALSCORPORATION. is manufactured -1:2- phenyl -4,5- hydroxymethyl-imidazole
“CUREZOL 2PHZ-PW”)
Protective film described below forms substrate used in the manufacture with composite sheet.
Substrate (11) -1: being 0.9 μm, the other side by the maximum section height (Rt) on 80 μm of thickness, the surface of side
The substrate that the polypropylene film that the maximum section height (Rt) on surface is 1.5 μm is constituted
Substrate (11) -2: being 8.0 μm, the other side by the maximum section height (Rt) on 80 μm of thickness, the surface of side
The substrate that the polypropylene film that the maximum section height (Rt) on surface is 1.5 μm is constituted
Substrate (91) -1: being 12.0 μm, the other side by the maximum section height (Rt) on 80 μm of thickness, the surface of side
The substrate that the polypropylene film that the maximum section height (Rt) on surface is 1.5 μm is constituted
Substrate (91) -2: being 16.0 μm, the other side by the maximum section height (Rt) on 80 μm of thickness, the surface of side
The substrate that the polypropylene film that the maximum section height (Rt) on surface is 1.5 μm is constituted
Protective film described below, which is formed, forms stripping film used in the manufacture with composite sheet with film or protective film.
Stripping film (15) -1: the single side that polyethylene terephthalate is film-made is carried out at removing using silicone-treated
Stripping film made of reason (" SP-PET381031 " of Lintec Corporation. manufacture, 38 μm of thickness)
Stripping film (15) -3: used 80 μm of thickness, side surface maximum section height (Rt) be 0.9 μm, it is another
The stripping film for the polyethylene terephthalate that the maximum section height (Rt) on the surface of side is 1.5 μm
Stripping film (15) -4: used 80 μm of thickness, side surface maximum section height (Rt) be 8.0 μm, it is another
The stripping film for the polyethylene terephthalate that the maximum section height (Rt) on the surface of side is 1.5 μm
Stripping film (95) -1: used 80 μm of thickness, side surface maximum section height (Rt) be 12.0 μm, it is another
The stripping film for the polyethylene terephthalate that the maximum section height (Rt) on the surface of side is 1.5 μm
Stripping film (95) -2: used 80 μm of thickness, side surface maximum section height (Rt) be 16.0 μm, it is another
The stripping film for the polyethylene terephthalate that the maximum section height (Rt) on the surface of side is 1.5 μm
[embodiment 1]
< protective film forms the manufacture > for being formed with film and protective film and using composite sheet
(protective film forms the preparation for using composition (IV-1))
By energy ray-curable ingredient (a2) -1, polymer (b) -1, Photoepolymerizationinitiater initiater (c) -1, Photoepolymerizationinitiater initiater
(c) -2, packing material (d) -1, coupling agent (e) -1 and colorant (g) -1 with their content (solid content, mass parts) at
Mode for value shown in table 1 is dissolved or dispersed in methyl ethyl ketone, and is stirred in 23 DEG C, and solid component is thus prepared
The protective film that concentration is 50 mass %, which is formed, uses composition (IV-1).In addition, the record of the "-" on the column containing ingredient in table 1
Refer to protective film formation composition (IV-1) without the ingredient.
(protective film forms the manufacture for being formed with film and protective film and using composite sheet)
Using knife type coater, protective film formation obtained above is coated on substrate (11) -1 with composition (IV-1)
On the surface for the side that maximum section height (Rt) is 0.9 μm, and it is 2 minutes dry in 100 DEG C, thus make 25 μm of thickness of energy
The protective film for measuring ray-curable, which is formed, uses film (13) -1.
Then, protective film formation obtained above is fitted in the removing of stripping film (15) -1 with the exposed surface of film (13) -1
In process face, production substrate (11) -1, protective film formed with film (13) -1 and stripping film (15) -1 along they thickness direction according to
Composite sheet is used in the formation of protective film made of secondary stacking.The composition of obtained protective film formation composite sheet is shown in table 2.
The evaluation > of < protective film
(the maximum section height (Rt) with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film)
Using ultraviolet lamp (" RAD2000m/8 " of Lintec Corporation. manufacture), in illumination
195mW/cm2, light quantity 170mJ/cm2Under conditions of, protective film formation obtained above composite sheet is irradiated from support chip side purple
Thus outside line solidifies protective film formation film (13) -1, form protective film.
Then, support chip is removed from the protective film of formation, the exposing according to JIS B 0601:2013 to protective film
The maximum section with the surface (face towards substrate (11) -1) for the face opposite side for being attached at semiconductor crystal wafer of face, i.e. protective film
Highly (Rt) is measured.Show the result in table 2.In table 2, numerical value shown in the column of " Rt " is its measured value.
(gloss value with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film)
When measuring above-mentioned maximum section height (Rt), for protective film, gloss meter (NIPPON DENSHOKU is used
The gloss meter " VG2000 " of INDUSTRIES Co., LTD. manufacture), according to JIS K 7105, from attach semiconductor die
60 ° of mirror surface lusters on the surface with the face opposite side for being attached at semiconductor crystal wafer are surveyed in the opposite side in round side
It is fixed, using its measured value as the gloss value on the surface of protective film.Show the result in table 2.
(the laser lettering of protective film is visual)
In protective film formation composite sheet obtained above, identical side when using with measurement maximum section height (Rt)
Method solidifies protective film formation film (13) -1, forms protective film.
Then, using printing device " MD-S9910A " of manufacture (KEYENCE company), with export 1.2W, frequency 40kHz,
100mm/ seconds conditions of scanning speed, from the side opposite with the face for being attached at semiconductor crystal wafer of protective film to the table of protective film
The laser of face illumination wavelength 532nm carries out laser lettering.
Through substrate (11) -1, the lettering of protective film is visually observed, can clearly read all letterings
In the case of, laser lettering visuality is determined as " A ", in the case where can clearly reading at least part of lettering, by laser
Lettering visuality is determined as " B ".Show the result in table 2.
< protective film, which is formed, forms the manufacture with composite sheet and the evaluation > of protective film with film and protective film
[embodiment 2]
Other than using substrate (11) -2 to replace (11) -1 this point of substrate, method same as Example 1, system are utilized
Protective film formation film and protective film formation composite sheet are made, and evaluates protective film.By protective film formation with composition (IV-1)
The surface for the side that the maximum section height (Rt) for being coated on substrate (11) -2 is 8.0 μm.Show the result in table 2.
[embodiment 3]
< protective film forms the manufacture > for using film
(protective film forms the preparation for using composition (IV-1))
Using method same as Example 1, protective film formation composition (IV-1) is prepared.
< protective film forms the manufacture > for using film
Using knife type coater, protective film formation obtained above is coated on stripping film (15) -3 with composition (IV-1)
Maximum section height (Rt) be 0.9 μm side surface on, and it is 2 minutes dry in 100 DEG C, thus make 25 μm of thickness
The protective film of energy ray-curable, which is formed, uses film (13) -1.
Then, protective film formation obtained above is fitted in the removing of stripping film (15) -1 with the exposed surface of film (13) -1
In process face, production stripping film (15) -3, protective film form the thickness direction for using film (13) -1 and stripping film (15) -1 along them
Laminates made of stacking gradually.The composition of obtained laminates is shown in table 2.
< protective film forms the evaluation > with film and protective film
(the maximum section height with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film formation film
(Rt))
Stripping film (15) -3 is removed from laminates obtained above, for the protective film formation exposing of film (13) -1
Face, i.e. protective film form the surface with the face opposite side for being attached at semiconductor crystal wafer of film (13) -1, according to JIS B 0601:
2013 measure maximum section height (Rt).Show the result in table 2.In table 2, numerical value shown in the column of " Rt " is its measured value.
(gloss value with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film formation film)
Use gloss meter (the gloss meter of NIPPON DENSHOKU INDUSTRIES Co., LTD. manufacture
" VG2000 "), according to JIS K 7105, for protective film formation obtained above with film (13) -1, from be attached at semiconductor
The opposite side in the side of wafer carries out 60 ° of mirror surface lusters on the surface with the face opposite side for being attached at semiconductor crystal wafer
Measurement, using its measured value as the protective film formation gloss value on the surface of film (13) -1.Show the result in table 2.
(the maximum section height (Rt) with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film)
Using ultraviolet lamp (" RAD2000m/8 " of Lintec Corporation. manufacture), in illumination
195mW/cm2, light quantity 170mJ/cm2Under conditions of, ultraviolet light is irradiated to protective film formation obtained above film (13) -1, by
This solidifies protective film formation film (13) -1, forms protective film.
Then, opposite with the face for being attached at semiconductor crystal wafer according to JIS B 0601:2013 couple for the protective film of formation
The maximum section height (Rt) on the surface of side is measured.Show the result in table 2.
(gloss value with the surface for the face opposite side for being attached at semiconductor crystal wafer of protective film)
When measuring above-mentioned maximum section height (Rt), for protective film, gloss meter (NIPPON DENSHOKU is used
The gloss meter " VG2000 " of INDUSTRIES Co., LTD. manufacture), according to JIS K 7105, from attach semiconductor die
60 ° of mirror surface lusters on the surface with the face opposite side for being attached at semiconductor crystal wafer are surveyed in the opposite side in round side
It is fixed, using its measured value as the gloss value on the surface of protective film.Show the result in table 2.
(the laser lettering of protective film is visual)
In laminates obtained above, make protective film formation film using the method being identical with the situation of embodiment 1
(13) -1 solidifications, form protective film.
Then, using printing device " MD-S9910A " of manufacture (KEYENCE company), with export 1.2W, frequency 40kHz,
100mm/ seconds conditions of scanning speed, from the side opposite with the face for being attached at semiconductor crystal wafer of protective film to the table of protective film
The laser of face illumination wavelength 532nm carries out laser lettering.
Through stripping film (15) -3, the lettering of protective film is visually observed, using being identical with the situation of embodiment 1
Method evaluation protective film laser lettering it is visual.Show the result in table 2.
< protective film forms the evaluation > formed with the manufacture of film and protective film with film and protective film
[embodiment 4]
Other than using stripping film (15) -4 to replace (15) -3 this point of stripping film, side same as Example 3 is utilized
Method, manufacture protective film, which is formed, uses film and laminates, and evaluates protective film formation film and protective film.Composition is used in protective film formation
(IV-1) surface for the side that the maximum section height (Rt) for being coated on stripping film (15) -4 is 8.0 μm.In addition, protective film is formed
It is fitted in the exposed surface of film (13) -1 on the lift-off processing face of stripping film (15) -1.Show the result in table 2.
< protective film, which forms to be formed to be formed with the manufacture of composite sheet and protective film with film and protective film, uses film and protective film
Evaluation >
[comparative example 1]
Other than using substrate (91) -1 to replace (11) -1 this point of substrate, method same as Example 1, system are utilized
Protective film formation film and protective film formation composite sheet are made, and evaluates protective film formation film and protective film.Protective film is formed
The surface for the side that the maximum section height (Rt) of substrate (91) -1 is 12.0 μm is coated on composition (IV-1).Result is shown
In table 3.
[comparative example 2]
Other than using substrate (91) -2 to replace (11) -1 this point of substrate, method same as Example 1, system are utilized
Protective film formation film and protective film formation composite sheet are made, and evaluates protective film formation film and protective film.Protective film is formed
The surface for the side that the maximum section height (Rt) of substrate (91) -2 is 16.0 μm is coated on composition (IV-1).Result is shown
In table 3.
< protective film forms the evaluation > formed with the manufacture of film and protective film with film and protective film
[comparative example 3]
Other than using stripping film (95) -1 to replace (15) -3 this point of stripping film, side same as Example 3 is utilized
Method, manufacture protective film, which is formed, uses film and laminates, and evaluates protective film formation film and protective film.Composition is used in protective film formation
(IV-1) surface for the side that the maximum section height (Rt) for being coated on stripping film (95) -1 is 12.0 μm.In addition, protective film shape
It is fitted on the lift-off processing face of stripping film (15) -1 at the exposed surface of film (13) -1.Show the result in table 3.
[comparative example 4]
Other than using stripping film (95) -2 to replace (15) -3 this point of stripping film, side same as Example 3 is utilized
Method, manufacture protective film, which is formed, uses film and laminates, and evaluates protective film formation film and protective film.Composition is used in protective film formation
(IV-1) surface for the side that the maximum section height (Rt) for being coated on stripping film (95) -2 is 16.0 μm.In addition, protective film shape
It is fitted on the lift-off processing face of stripping film (15) -1 at the exposed surface of film (13) -1.Show the result in table 3.
[reference example 1]
< protective film forms the manufacture > for using film
(protective film forms the preparation for using composition)
By polymer (b) -2, epoxy resin (h1) -1, epoxy resin (h1) -2, epoxy resin (h1) -3, thermal curing agents
(h2) -1, curing accelerator (i) -1, packing material (d) -2, coupling agent (e) -2 and colorant (g) -2 with their content (Gu
Body component amount, mass parts) become the mode of value shown in table 1 and is dissolved or dispersed in methyl ethyl ketone, and stirred in 23 DEG C
It mixes, thus prepares the protective film formation composition that solid component concentration is 50 mass %.Epoxy resin (h1) -1, epoxy resin
(h1) -2, epoxy resin (h1) -3 and thermal curing agents (h2) -1 are Thermocurable ingredient (h), and obtained composition is heat cure
Property protective film formation use composition.
Other than the protective film formation composition this point for using Thermocurable obtained above, utilization and embodiment
3 identical method manufacture protective films, which are formed, uses film (93) -1 and laminates.
< protective film forms the evaluation > with film and protective film
The case where using with embodiment 3 identical method, protective film formation film and protective film are partly led with being attached at
The maximum section height (Rt) and protective film formation film on the surface of the face opposite side of body wafer and protective film be attached at
The gloss value on the surface of the face opposite side of semiconductor crystal wafer is measured.Show the result in table 3.
In laminates obtained above, heating protective film formation film (93) -1 2 hours in 130 DEG C makes its solidification,
Form protective film.
Then, using with embodiment 3 the case where, identical method carried out laser lettering to protective film, and evaluation laser lettering can
Depending on property.Show the result in table 3.
[table 1]
[table 2]
[table 3]
When from the above results, using the protective film formation film of Examples 1 to 4, due to the surface (β ') of protective film
Maximum section height (Rt) be 7.5 μm hereinafter, the therefore visual excellence of the laser lettering of protective film.Confirm embodiment 3
It is 7.7 μm hereinafter, smaller that~4 protective film, which is formed with the maximum section height (Rt) on the surface (β) of film,.
In addition, using Examples 1 to 4 protective film formation film when, the maximum section height on the surface (β ') of protective film
(Rt) as low as 0.8~7.5 μm, and the gloss value on the surface (β ') of protective film is 50~90, it is sufficiently large.
When in contrast, using the protective film formation film of comparative example 1~4, due to the maximum on the surface (β ') of protective film
Section height (Rt) is 11.4 μm or more, therefore the visuality of the laser lettering of protective film is poor.Confirm the guarantor of comparative example 3~4
It is 11.5 μm or more that cuticula, which is formed with the maximum section height (Rt) on the surface (β) of film, larger.
In addition, using comparative example 1~4 protective film formation film when, the maximum section height on the surface (β ') of protective film
(Rt) greatly to 11.4~15.1 μm, and the gloss value on the surface (β ') of protective film is 23~30, smaller.
On the other hand, it is 0.8 μm that the protective film of reference example 1, which is formed with the maximum section height (Rt) on the surface (β) of film, compared with
It is small.Although however, making it be solidified to form protective film, and the surface (β ') of protective film with film by heating the protective film formation
Maximum section height (Rt) remain 5.5 μm, but gloss value is 40, smaller, therefore the laser lettering of protective film is visual
Property is poor.It (also includes the change of constituent that this, which is by explained hereinbefore, the protective film caused by being heating and curing unfavorable condition,
Matter etc.) generation caused by.
Industrial applicibility
The present invention can be used for the manufacture of semiconductor device.
Description of symbols
1C, 1D: composite sheet is used in protective film formation；10: support chip；10a: the surface of support chip；11: substrate；11a: substrate
Surface；13: film is used in protective film formation；13a: protective film forms the surface (surface of side) for using film；13b: protective film is formed
With the surface (surface of the other side) of film；15: stripping film；151: the first stripping films；152: the second stripping films；16: fixture is used viscous
Mixture layer；16a: the surface of fixture adhesive phase.
Claims (4)
- It is the protective film formation film of energy ray-curable 1. a kind of protective film, which is formed, uses film,When to the protective film formation film irradiation energy ray to which protective film be made, in the protective film, at least side Surface (β ') maximum section height (Rt) less than 10 μm.
- 2. protective film according to claim 1, which is formed, uses film, wherein the gloss value of the surface (β ') is 45 or more.
- 3. protective film according to claim 1 or 2, which is formed, uses film, in the protective film formation film, irradiation energy is penetrated When line is to be made protective film, the maximum section height on surface (β) that become the surface (β ') of the protective film, at least side (Rt) less than 10 μm.
- 4. a kind of protective film, which is formed, uses composite sheet, has support chip, and have in claims 1 to 3 on the support chip Described in any item protective films, which are formed, uses film,When to the protective film formation film irradiation energy ray to which protective film be made, become the surface (β ') of the protective film , the protective film form the surface (β) with film towards the support chip.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-092008 | 2016-04-28 | ||
| JP2016092008 | 2016-04-28 | ||
| PCT/JP2017/016258 WO2017188200A1 (en) | 2016-04-28 | 2017-04-25 | Film for forming protective film, and composite sheet for forming protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108966656A true CN108966656A (en) | 2018-12-07 |
Family
ID=60161568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780017025.4A Pending CN108966656A (en) | 2016-04-28 | 2017-04-25 | Protective film formation film and protective film formation composite sheet |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6938475B2 (en) |
| KR (1) | KR102316045B1 (en) |
| CN (1) | CN108966656A (en) |
| TW (1) | TWI721158B (en) |
| WO (1) | WO2017188200A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692352A (en) * | 2019-04-26 | 2021-11-23 | 琳得科株式会社 | Method for producing third laminate, method for producing fourth laminate, method for producing semiconductor device with back surface protective film, and third laminate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056328A (en) * | 2008-08-28 | 2010-03-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| CN104837942A (en) * | 2012-12-14 | 2015-08-12 | 琳得科株式会社 | Holding membrane forming film |
| WO2015146936A1 (en) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
| WO2015178346A1 (en) * | 2014-05-23 | 2015-11-26 | リンテック株式会社 | Composite sheet for forming protective film |
| CN105408105A (en) * | 2013-08-01 | 2016-03-16 | 琳得科株式会社 | Protective film formation-use composite sheet |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3113345B2 (en) | 1991-11-25 | 2000-11-27 | 三洋電機株式会社 | Hydrogen storage alloy electrode |
| JP2006048798A (en) * | 2004-08-02 | 2006-02-16 | Lintec Corp | Sheet for forming protective layer of optical recording medium, optical recording medium and manufacturing method of those |
| JP4851434B2 (en) * | 2007-12-18 | 2012-01-11 | 古河電気工業株式会社 | Chip protection film |
| JP2010031183A (en) | 2008-07-30 | 2010-02-12 | Furukawa Electric Co Ltd:The | Energy ray hardening type chip protecting film |
| US20150111032A1 (en) * | 2012-03-23 | 2015-04-23 | Lintec Corporation | Film, Sheet Substrate for Processing Workpiece, and Sheet for Processing Workpiece |
| WO2016027883A1 (en) * | 2014-08-22 | 2016-02-25 | リンテック株式会社 | Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
-
2017
- 2017-04-21 TW TW106113478A patent/TWI721158B/en active
- 2017-04-25 KR KR1020187026422A patent/KR102316045B1/en active IP Right Grant
- 2017-04-25 WO PCT/JP2017/016258 patent/WO2017188200A1/en active Application Filing
- 2017-04-25 CN CN201780017025.4A patent/CN108966656A/en active Pending
- 2017-04-25 JP JP2018514595A patent/JP6938475B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056328A (en) * | 2008-08-28 | 2010-03-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| CN104837942A (en) * | 2012-12-14 | 2015-08-12 | 琳得科株式会社 | Holding membrane forming film |
| CN105408105A (en) * | 2013-08-01 | 2016-03-16 | 琳得科株式会社 | Protective film formation-use composite sheet |
| WO2015146936A1 (en) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
| WO2015178346A1 (en) * | 2014-05-23 | 2015-11-26 | リンテック株式会社 | Composite sheet for forming protective film |
Non-Patent Citations (1)
| Title |
|---|
| 魏玉平 等: "纳米压印光刻技术综述", 《制造技术与机床》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692352A (en) * | 2019-04-26 | 2021-11-23 | 琳得科株式会社 | Method for producing third laminate, method for producing fourth laminate, method for producing semiconductor device with back surface protective film, and third laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI721158B (en) | 2021-03-11 |
| JPWO2017188200A1 (en) | 2019-03-07 |
| TW201802926A (en) | 2018-01-16 |
| WO2017188200A1 (en) | 2017-11-02 |
| KR20190003465A (en) | 2019-01-09 |
| KR102316045B1 (en) | 2021-10-21 |
| JP6938475B2 (en) | 2021-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108966671A (en) | Composite sheet is used in support chip and protective film formation | |
| JP6388752B1 (en) | Curable resin film and first protective film forming sheet | |
| CN109789666A (en) | Composite sheet is used in protective film formation | |
| CN108138012B (en) | Sheet for forming No. 1 protective film, method for forming No. 1 protective film, and method for manufacturing semiconductor chip | |
| CN108884244A (en) | Protective film formation film and protective film formation composite sheet | |
| CN108140567A (en) | Curable resin film and the 1st protective film formation piece | |
| CN108713248A (en) | Protective film forms the manufacturing method with film, protective film formation composite sheet and semiconductor chip | |
| CN109075047A (en) | The manufacturing method of the manufacturing method and semiconductor device of protective film formation composite sheet and the semiconductor chip with protective film | |
| CN109791887A (en) | Piece is used in the formation of first protective film | |
| CN109072009A (en) | Protective film formation film and protective film formation composite sheet | |
| CN108140585A (en) | 1st protective film formation piece | |
| CN108701640A (en) | Protective film formation film and protective film formation composite sheet | |
| CN109287125A (en) | The manufacturing method of semiconductor chip with protective film and the manufacturing method of semiconductor device | |
| WO2017078056A1 (en) | Curable resin film and first protective film forming sheet | |
| CN109071845A (en) | Protective film formation film and protective film formation composite sheet | |
| JP6273542B2 (en) | Curable resin film and first protective film forming sheet | |
| CN108701641A (en) | Protective film forms the manufacturing method with piece, the manufacturing method of protective film formation piece and semiconductor device | |
| CN111093987B (en) | Composite sheet for forming protective film and method for manufacturing semiconductor chip | |
| CN111279468B (en) | Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip | |
| CN108140622A (en) | Thermosetting resin film and the 2nd protective film form external member, the forming method of the 1st protective film of thermosetting resin film, the 1st protective film formation piece and semiconductor wafer of film | |
| CN108966656A (en) | Protective film formation film and protective film formation composite sheet | |
| CN108260356B (en) | Curable resin film and 1 st protective film-forming sheet | |
| CN108778722A (en) | Protective film formation composite sheet | |
| CN108778721A (en) | Protective film formation composite sheet | |
| CN108140586A (en) | The forming method of thermosetting resin film, the 1st protective film formation piece and the 1st protective film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |