CN108778722A - Protective film formation composite sheet - Google Patents

Protective film formation composite sheet Download PDF

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Publication number
CN108778722A
CN108778722A CN201780014253.6A CN201780014253A CN108778722A CN 108778722 A CN108778722 A CN 108778722A CN 201780014253 A CN201780014253 A CN 201780014253A CN 108778722 A CN108778722 A CN 108778722A
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CN
China
Prior art keywords
protective film
film formation
mentioned
methyl
composite sheet
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Pending
Application number
CN201780014253.6A
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Chinese (zh)
Inventor
佐伯尚哉
佐佐木辽
米山裕之
山本大辅
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Lintec Corp
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Lintec Corp
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to CN202311427176.0A priority Critical patent/CN117656639A/en
Publication of CN108778722A publication Critical patent/CN108778722A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/406—Bright, glossy, shiny surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)

Abstract

The present invention provides a kind of protective film formation composite sheet; it, which has protective film formation film on a surface of support chip and has overlay on the surface with the side opposite side for having the protective film formation film of the support chip, forms; wherein, the gloss value on the surface for the side opposite side of the overlay being in contact with the support chip is 32~95.

Description

Protective film formation composite sheet
Technical field
The present invention relates to the protective film formation composite sheets for forming protective film at the back side of semiconductor chip.
The application is required preferential based on the Japanese Patent Application 2016-042690 that on March 4th, 2016 files an application in Japan Power, and its content is incorporated herein.
Background technology
In recent years, semiconductor device is carried out using the Method for Installation for being referred to as so-called upside-down mounting (face down) mode Manufacture.In upside-down mounting mode, it may be used at the semiconductor chip with the electrodes such as convex block in circuit face, and the electrode and substrate Engagement.Therefore, chip exposes with the back side of circuit face opposite side sometimes.
At the back side of the chip of the exposing, the resin film made of organic material is formed sometimes as protective film, and with band The form installation of the semiconductor chip of protective film is in semiconductor devices.Protective film be in order to prevent in cutting action, encapsulate it It cracks and utilizes on chip afterwards.
As formation when protective film, formed using having protective film formation protective film made of film on support chip Use composite sheet.It is above-mentioned as above-mentioned support chip, such as using the laminate structure of resin base material, base material and adhesive phase etc. The lamination surface of the protective film formation film of base material or adhesive phase etc. is surface-treated sometimes.Said protection film is formed and is used For composite sheet, protective film formation has protective film Forming ability with film, in addition, support chip can be used as cutting sheet to play work( Can, protective film formation film can be formed as one with cutting sheet.
In the above-mentioned base material before being used for the processing of support chip, usually there is concaveconvex shape in its one or two sides.This It is due to if not having such concaveconvex shape, base material being batched when forming volume, base material connecing to each other can be caused Contacting surface is pasted and is sticked together, to become using difficulty.If at least one of the contact surface of base material to each other has bumps Shape, then the area of contact surface reduces, therefore can inhibit adhesion.
It is representative for such previous protective film formation composite sheet for having used the base material with male and fomale(M&F) There is structure as shown in Figure 4.Fig. 4 is the section of an example for schematically showing previous protective film formation composite sheet Figure.It should be noted that in attached drawing used in illustrating later, such as in order to be easier to understand protective film formation composite sheet Feature, for convenience's sake, sometimes for as mian part part amplification show, however it is not limited to the size ratio of each integral part The situation identical as reality such as rate.
Previous protective film formation composite sheet 9 depicted herein is that have protective film formation film 13 on support chip 90 Made of, support chip 90 is made of the laminate structure of base material 91 and adhesive phase 12, and has guarantor on adhesive phase 12 Cuticula, which is formed, uses film 13.Protective film formation becomes protective film with film 13 by solidification.Protective film forms further with composite sheet 9 Has stripping film 15 on protective film formation film 13, when using protective film formation composite sheet 9, stripping film 15 is removed. In protective film formation in composite sheet 9, support chip 90 with face (surface) 90a opposite sides for having protective film formation film 13 Face (back side) 90b, namely base material 91 with face (back side) 91b of face (surface) the 91a opposite sides for having adhesive phase 12 at For male and fomale(M&F).For protective film formation composite sheet 9, male and fomale(M&F) is become by the back side 91b of base material 91 in this wise, Batch and as volume when, can inhibit the stickup of the back side 91b of base material 91 and exposed surface (surface) 15a of stripping film 15, that is, can Inhibit adhesion.
On the other hand, protective film formation with composite sheet sometimes in the support of the protective film formed by protective film formation film Lettering is carried out on the face of piece side by irradiating laser (hereinafter, sometimes referred to as " laser lettering ").When laser lettering, from support chip Be irradiated with the opposite side for foring protective film side.At this point, for example, in the case of protective film formation composite sheet 9, Laser is irradiated to protective film from the back side sides 91b of base material 91 through support chip 90, but since the back side 91b of base material 91 is bumps Face, herein light diffusing reflection can occur, there are the unintelligible this problems of laser lettering.
As the irreflexive protective film formation composite sheet that can prevent such light, it is known to have shown in Fig. 5 that The protective film of spline structure, which is formed, uses composite sheet 8 (referring for example to patent document 1).
Fig. 5 is another sectional view for schematically showing previous protective film formation composite sheet.
It is to prop up in the same manner as previous protective film formation composite sheet 8 and protective film formation composite sheet 9 depicted herein Made of having protective film formation film 13 in blade 80, support chip 80 is by base material 81 and the laminate structure structure of adhesive phase 12 At, and have protective film formation film 13 on adhesive phase 12.But in support chip 80, the male and fomale(M&F) of base material 81 Configuration is opposite with the base material 91 in support chip 90.That is, in protective film formation in composite sheet 8, base material 81 has adhesive phase 12 face (surface) 81a becomes male and fomale(M&F), and base material 81 becomes even surface with face (back side) 81b of surface 81a opposite sides. Base material 81, protective film formation in support chip 80 with film 13 and stripping film 15 respectively with base material 91, the protective film in support chip 90 It is formed identical with film 13 and stripping film 15.
But in the case of protective film formation composite sheet 8, the back side 81b of base material 81, namely support chip 80 with Face (back side) 80b for having face (surface) 80a opposite sides of adhesive phase 12 becomes even surface, is formed with multiple by protective film Close piece 8 batch and as volume when, can not inhibit the back side 81b of base material 81 and exposed surface (surface) 15a of stripping film 15 stickup, Adhesion can not be inhibited.When sticking together, protective film formation is used with generation fold in composite sheet 8 or forming protective film When composite sheet 8 is continuously extracted out from volume is upper, stripping film 15 is caused to be removed from protective film formation on film 13.In addition, in base material 81 On the 81a of surface, in order to eliminate concave-convex shape, need adhesive phase 12 that there is enough thickness.The thickness of adhesive phase 12 is not When sufficient, the concaveconvex shape of base material 81 is reflected and is made face (back side) 13b of 80 side of support chip of protective film formation film 13 It is provided with concaveconvex shape, it is real to the face of the support chip side of the protective film formed by such protective film formation film 13 to exist The laser lettering applied becomes unintelligible this problem.
Existing technical literature
Patent document
Patent document 1：No. 5432853 bulletins of Japanese Patent No.
Invention content
The subject that the invention solves
Therefore, actual conditions are so far, can not have both still and can inhibit adhesion and clearly swash to protective film The protective film formation composite sheet of light lettering.
The present invention is exactly to carry out in view of the foregoing, and project is to provide a kind of protective film formation composite sheet, It is used to form protective film at the back side of semiconductor chip, which can inhibit adhesion, and can be with Laser lettering is clearly carried out to protective film.
Solution to the problem
One embodiment of the present invention is as described below.
(1) it is used as an embodiment of the invention, a kind of protective film formation composite sheet is provided, the one of support chip Has protective film formation film and opposite with having the side of protective film formation film in the support chip on a surface Have overlay on the surface of side to form, wherein the table for the side opposite side of the overlay being in contact with the support chip The gloss value in face is 32~95.
(2) in the protective film formation composite sheet of above-mentioned (1), using further having on the protective film formation film The protective film formation composite sheet of standby stripping film, the peeling force of the stripping film measured by the following method can be 10mN/50mm hereinafter,
(assay method of the peeling force of stripping film)
By the protective film formation composite sheet of the protective film formation with stripping film and width 50mm, long 100mm on film Multi-disc is overlapped in such a way that the overlay is 10~60 μm towards the overall thickness of the same direction and the overlay, by It is overlay, the laminated body that the second outermost layer is stripping film that this, which forms the first outermost layer, by the laminated body in the protective film The stacking direction of formation composite sheet is applied with the power of 980.665mN and stands 3 days at 40 DEG C, then in the stacking direction With peeling rate 300mm/ points, the condition of 180 ° of peel angle by near the stripping film of the described first outermost overlay from It is removed on adjacent overlay, measures peeling force at this time.
(3) can be above-mentioned support chip by base material and bonding in the protective film formation composite sheet of above-mentioned (1) or (2) Oxidant layer is laminated, and said protection film formation is to stack gradually above-mentioned overlay, base material, adhesive phase and protective film with composite sheet Made of formation film.
(4) in the protective film formation composite sheet of above-mentioned (3), above-mentioned adhesive phase can be energy ray-curable or non- The adhesive phase of energy ray-curable.
In protective film formation composite sheet described in any one of above-mentioned (1)~(4), said protection film formation film can To be the film of thermosetting property or energy ray-curable.
The effect of invention
According to the present invention, it is possible to provide a kind of protective film formation composite sheet is used to be formed at the back side of semiconductor chip Protective film, which can inhibit adhesion, and can clearly carry out laser lettering to protective film.
Description of the drawings
Fig. 1 is an embodiment party of the protective film formation composite sheet for schematically showing an embodiment of the invention The sectional view of formula.
Fig. 2 is another embodiment party for the protective film formation composite sheet for schematically showing an embodiment of the invention The sectional view of formula.
Fig. 3 is the vertical view for the protective film formation composite sheet for showing to manufacture in embodiment.
Fig. 4 is the sectional view of an example for schematically showing previous protective film formation composite sheet.
Fig. 5 is another sectional view for schematically showing previous protective film formation composite sheet.
Symbol description
1,2 ... protective film formation composite sheets
10 ... support chips
The surface of 10a ... support chips
The back side of 10b ... support chips
11 ... base materials
The surface of 11a ... base materials
The back side of 11b ... base materials
12 ... adhesive phases
The surface of 12a ... adhesive phases
13,23 ... protective film formation films
The surface of 13a, 23a ... protective film formation film
14 ... overlays
The surface of 14a ... overlays
The back side of 14b ... overlays
15 ... stripping films
The surface of 15a ... stripping films
16 ... fixture adhesive layers
The surface of 16a ... fixture adhesive layers
Specific implementation mode
◎ protective film formation composite sheets
The protective film formation composite sheet of present embodiment have on a surface of support chip protective film formation film, And have overlay on the surface with the side opposite side for having said protection film formation film of above-mentioned support chip and form, In, the gloss value on the surface for the side opposite side of above-mentioned overlay being in contact with above-mentioned support chip is 32~95.
Said protection film formation is with composite sheet by keeping the side of above-mentioned overlay being in contact with above-mentioned support chip opposite The gloss value on the surface of side is to be protected obtained from for after making protective film formation be cured with film in particular range as described above It, can be clear to protective film since laser can effectively and stably reach protective film when cuticula irradiates laser from overlay side Laser lettering is carried out clearly.
In addition, said protection film formation composite sheet is by having the above-mentioned overlay with easy slip and static electricity resistance, Batch and as volume when, can inhibit adhesion.
It should be noted that in the present specification, in said protection film formation composite sheet, by heating or irradiating energy After amount line makes protective film formation be solidified to form protective film with film, as long as the stepped construction of above-mentioned support chip and protective film is able to It keeps, then also referred to as protective film formation composite sheet.In addition, in said protection film formation composite sheet, above-mentioned support chip is In the case of the laminate structure of base material and adhesive phase, after so that adhesive phase is cured, as long as above-mentioned base material, adhesive phase are consolidated Compound and the stepped construction of protective film formation film or protective film are maintained, then also referred to as protective film formation composite sheet.
Fig. 1 is an embodiment party of the protective film formation composite sheet for schematically showing an embodiment of the invention The sectional view of formula.
Protective film formation composite sheet 1 depicted herein is that have protective film shape on a surface 10a of support chip 10 Have made of overlay 14 at film 13 and on another surface (back side) 10b of support chip 10.In addition, support chip 10 It is that base material 11 and adhesive phase 12 are laminated, has adhesive phase 12 on a surface 11a of base material 11, in base material 11 Another surface (back side) 11b on have overlay 14, have protective film formation film 13 on adhesive phase 12.In addition, Protective film formation composite sheet 1 further has stripping film 15 on protective film formation film 13, and stripping film 15 is in protective film shape It is removed at when being used with composite sheet 1.Protective film formation becomes protective film with film 13 by solidification.
In protective film formation in composite sheet 1, adhesive phase 12 is laminated on the above-mentioned surface 11a of base material 11, protective film Formation film 13 is laminated in a part of surface 12a for adhesive phase 12.Moreover, in the surface 12a of adhesive phase 12 not The protective film formation exposed surface of film 13 and protective film formation is laminated with to be laminated on the surface 13a (upper surface and side) of film 13 There is stripping film 15.
It should be noted that in stripping film 15 and the surface 12a of adhesive phase 12 or the surface of protective film formation film 13 May exist space part between 13a.For example, protective film is formed in the side of film 13, the surface 12a of adhesive phase 12, protect Region easy tos produce above-mentioned space part near film formation film 13.
In protective film formation in composite sheet 1, the face (surface) of overlay 14 being in contact with support chip 10 (base material 11) The gloss value of face (back side) 14b of 14a opposite sides is 32~95.Thus, it is possible to clearly carry out laser lettering to protective film.
It should be noted that in the present embodiment, unless otherwise specified, " gloss value of coating layer surface " refers to 20 ° of bright lusters of coating layer surface are measured based on 7105 standards of JIS K, from the side opposite with support chip side of overlay It is worth obtained from degree.
In addition, protective film formation composite sheet 1 is by having overlay 14, though batch and in the case of as volume, Also the stickup of the above-mentioned back side 11b of base material 11 and exposed surface (surface) 15a of stripping film 15 be can inhibit, that is, can inhibit adhesion.
In protective film formation in composite sheet 1, support chip 10 with face (surface) 10a for having protective film formation film 13 Face (the back of the body with face (surface) the 11a opposite sides for having adhesive phase 12 of face (back side) 10b of opposite side, namely base material 11 Face) 11b becomes the low male and fomale(M&F) of smoothness, but may be even surface herein.To being formed by protective film formation film 13 Protective film (illustration omitted) carry out laser lettering in the case of, the face of 10 side of support chip of protective film is shone from 14 side of overlay Penetrate laser.At this point, no matter the above-mentioned back side 10b (the above-mentioned back side 11b of base material 11) of support chip 10 is in male and fomale(M&F) and even surface Which kind of face, since overlay 14 has coated the face, the face (surface) of overlay 14 being in contact with support chip 10 (base material 11) The smoothness of face (back side) 14b of 14a opposite sides is high, its surface roughness Ra is small, the diffusing reflection quilt of the laser in overlay 14 Inhibit, so as to clearly carry out laser lettering to protective film.
It should be noted that in the present specification, unless otherwise specified, " surface roughness Ra " refers to JIS B0601:So-called arithmetic average roughness specified in 2001.
In protective film formation in composite sheet 1, the surface 11a of base material 11 is formed as even surface but it is also possible to be flat herein The low male and fomale(M&F) of slippery.But as it is explained in detail hereinafter, from the space part between the surface 11a and adhesive phase for inhibiting base material 11 It generates, be easier to set out in terms of making protective film formation composite sheet 1 become the composite sheet with ideal characterisitics, preferred substrates 11 Surface 11a is even surface.
For protective film formation shown in FIG. 1 composite sheet 1, with the state that stripping film 15 is removed, semiconductor die The back side of piece (illustration omitted) is pasted in the surface 13a of protective film formation film 13 and the surface 12a of adhesive phase 12 not Stacking protective film formation is pasted on the fixtures such as ring frame with the exposed surface of film 13 and is used.
Fig. 2 is another embodiment party for the protective film formation composite sheet for schematically showing an embodiment of the invention The sectional view of formula.It should be noted that in fig. 2, for element same as shown in Figure 1, symbol identical with Fig. 1 is marked, And omit detail explanation.This is also the same in the figure after Fig. 2.
Protective film formation composite sheet 2 depicted herein is laminated in the table of adhesive phase 12 in addition to protective film formation film 23 In the entire surface of face 12a, in the part for the surface 23a that fixture adhesive layer 16 is laminated in protective film formation film 23, The exposed surface and fixture adhesive layer 16 of fixture adhesive layer 16 is not laminated in the surface 23a of protective film formation film 23 It is laminated on surface 16a (upper surface and side) other than stripping film 15 this several points, with protective film formation composite sheet shown in FIG. 1 1 is identical.
It should be noted that in the surface 23a or fixture adhesive layer 16 of stripping film 15 and protective film formation film 23 Surface 16a between may exist space part.For example, the table of the side of fixture adhesive layer 16, protective film formation film 23 In the 23a of face, region easy tos produce above-mentioned space part near fixture adhesive layer 16.
In protective film formation in composite sheet 2, with protective film formation composite sheet 1 the case where in the same manner as, overlay 14 The gloss value of face (back side) 14b of face (surface) the 14a opposite sides being in contact with support chip 10 (base material 11) is 32~95.By This, can be to clearly carrying out laser lettering by protective film formation with the protective film that film 23 is formed.
In addition, protective film formation composite sheet 2 is by having overlay 14, though batch and in the case of as volume, Also it can inhibit adhesion.
For protective film formation shown in Fig. 2 composite sheet 2, with the state that stripping film 15 is removed, semiconductor die The back side of piece (illustration omitted) is pasted on the surface 23a of protective film formation film 23 and the surface of fixture adhesive layer 16 Upper surface in 16a is pasted on the fixtures such as ring frame and is used.
The present invention protective film formation with composite sheet be not limited to Fig. 1~2 shown in example, do not damaging effect of the present invention Can also be structure made of the part composition of composite sheet shown in Fig. 1~2 is changed or deleted in the range of fruit, It can also be and further add structure made of other compositions in example described above.
Hereinafter, being said in more detail to each composition of the protective film formation composite sheet of an embodiment of the invention It is bright.
Zero support chip
As long as said protection film formation film can be arranged in above-mentioned support chip, it is not particularly limited, such as can enumerates Stripping film for preventing from using in surface adhesive dust of protective film formation film etc. and cutting action etc. for pair The sheet material for the effect that the surface of protective film formation film is protected and plays cutting sheet etc..
As preferred above-mentioned support chip, can enumerate processing in semiconductor wafer in piece field it is usually used only The support chip etc. that the support chip and base material and adhesive phase being made of base material are laminated.
Support chip can be made of 1 layer (single layer), can also be made of 2 layers or more of multilayer.Support chip is made up of multiple layers In the case of, multilayer can be the same or different each other.Can also be all layers i.e., it is possible to be all layers of all same It is different, it can also be that only part layer is identical.Moreover, in the case that multilayer is different, the combination of these multilayers is not special It limits.Here, it refers to that at least one of the material of each layer and thickness are different that multilayer is different.
As long as the thickness of support chip according to purpose suitable for selection, but from can be to said protection film formation composite sheet From the perspective of assigning enough flexibility, becoming good to the stickup of semiconductor wafer, preferably 10~500 μm, more preferably It is 20~350 μm, particularly preferably 30~200 μm.
Here, " thickness of support chip " refers to the overall thickness for each layer for constituting support chip, for example, in base material and adhesive phase In the case of the support chip being laminated, refer to base material thickness and adhesive phase thickness aggregate value.
It should be noted that at least one side of support chip can become male and fomale(M&F), the thickness of support chip can be in support chip The position comprising the protrusion in the male and fomale(M&F), calculated as a starting point using the top of the protrusion.
Base material
The material of above-mentioned base material is preferably various resins, sub as its concrete example, can be enumerated：(low-density is poly- for polyethylene Ethylene (LDPE), straight-chain low density polyethylene (LLDPE), high density polyethylene (HDPE) (HDPE etc.)), polypropylene, ethylene-propylene copolymer Object, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, poly- naphthalene Naphthalate, polybutylene terephthalate (PBT), polyurethane, urethane acrylate, polyimides, ethylene-acetate Vinyl ester copolymers, ethylene-(methyl) acrylic copolymer, ethylene-(methyl) acrylate copolymer, gather ionomer resin Hydrogenation products, modifier, cross-linking agent or the copolymer etc. of styrene, makrolon, fluororesin, above-mentioned arbitrary resin.
It should be noted that in the present specification, the concept of " (methyl) acrylic acid " includes " acrylic acid " and " methyl Both acrylic acid ".
In the case of support chip is made of other component stackings such as base material and adhesive phase, the thickness of base material can be according to mesh Suitable selection, but preferably 15~300 μm, more preferably 20~200 μm.By making the thickness of base material be such range, The flexibility of said protection film formation composite sheet and the stickup of semiconductor wafer or semiconductor chip is further increased.
Base material can be made of 1 layer (single layer), can also be made of 2 layers or more of multilayer.The feelings that base material is made up of multiple layers Under condition, multilayer can be the same or different each other.Here, " multilayer can be the same or different each other " refer to The case where above-mentioned support chip, is identical.
In the case that base material is made up of multiple layers, as long as the overall thickness of each layer is set as above-mentioned preferred base material thickness.
The surface roughness Ra in the face (surface) for having adhesive phase of base material is preferably 0.001~0.1 μm, is more preferably 0.005~0.08 μm, particularly preferably 0.01~0.04 μm.By making the above-mentioned surface roughness Ra of substrate surface be on above-mentioned Limit value is hereinafter, laser lettering can more clearly be carried out to protective film.
The above-mentioned surface roughness Ra of substrate surface such as can by the condition of molding of base material, surface treatment condition come into Row is adjusted.
It should be noted that as the method that monolithic turns to semiconductor chip by the cutting semiconductor chip by, such as can To enumerate：Using cutter cut semiconductor wafer cutter cutting, by laser irradiation cut semiconductor wafer laser cutting, Or cut the method using Water Cutting etc. of semiconductor wafer by being blown the water comprising grinding agent.
On the other hand, as the method that semiconductor wafer monolithic is turned to semiconductor chip, in addition to above-mentioned utilization cutting Other than method, following methods can also be enumerated：The focus that is set in inside semiconductor wafer is focused on to irradiate infrared region Laser, after the inside of semiconductor wafer forms modified layer, to the semiconductor wafer applied force, thus in above-mentioned modified layer Forming part is divided and singualtion by semiconductor wafer.
In the case that the above-mentioned surface roughness Ra of substrate surface is, for example, 0.01~0.2 μm, with such base material Inside of the protective film formation with composite sheet preferably above-mentioned in semiconductor wafer form modified layer and by semiconductor wafer monolithic It is used when change.
On the other hand, the surface roughness with the face (back side) of face (surface) opposite side for having adhesive phase of base material Ra, in other words namely support chip it is thick with the surface in the face (back side) of face (surface) opposite side for having protective film formation film Rugosity Ra is preferably 0.001~4 μm, more preferably 0.005~3.7 μm, is more preferably 0.01~3.4 μm, particularly preferably It is 0.02~3.1 μm.By making the above-mentioned surface roughness Ra of substrate backside for above-mentioned upper limit value hereinafter, can be easier to reduce The surface roughness Ra on the surface for the side opposite side of overlay being in contact with support chip is clear to protective film to be easier Ground carries out laser lettering.
The above-mentioned surface roughness Ra of substrate backside can be come for example, by condition of molding, surface treatment condition of base material etc. It is adjusted.
The resin of material as base material, which can also use, passes through crosslinked resin.
In addition, the resin of the material as base material, can be the sheet material formed by the extrusion molding of thermoplastic resin, Can also be that can also be the piece for keeping curable resin thin layer by well known method and being solidified to form obtained from stretching Material.
In addition, base material can be by made of coloring, can also be made of implementing printing.
It is from excellent heat resistance and also good with expansion adaptability, pickup adaptability by the flexibility with appropriateness Aspect set out, preferably comprise polyacrylic base material.
It for example can be the base material for the single-layer or multi-layer being only made of polypropylene containing polyacrylic base material, can also be poly- The base material for the multilayer that propylene layer is laminated with the resin layer other than polypropylene.
In the case of protective film formation film is heat cured, by making base material that there is heat resistance, the heat because of base material can inhibit Caused by deteriorate, the generation of the unfavorable condition in manufacturing process so as to effectively inhibit semiconductor device.
For base material, in order to make it be carried with the cementability between film with the adhesive phase or protective film formation being arranged on Height, can also be to further provided for contouring processing of its surface implementation based on blasting treatment, solvent processing etc., Corona discharge Treatment, electron beam At the oxidations such as treatment with irradiation, corona treatment, ozone/ultraviolet treatment with irradiation, flame treatment, chromic acid processing, hot wind processing Reason etc..It is carried out the material that primary coat is handled in addition, base material can also be surface.
Adhesive phase
Above-mentioned adhesive phase suitable can use well known adhesive phase.
Adhesive phase can use for constitute its, adhesive composition containing various compositions such as adhesives and shape At.The ratio for the mutual content of ingredient not gasified under room temperature in adhesive composition usually in adhesive phase it is above-mentioned at Divide the ratio of mutual content identical.It should be noted that in the present specification, " room temperature " refers to especially cold or not hot temperature Degree, i.e. usual temperature, it can be mentioned, for example 15~25 DEG C temperature etc..
The thickness of adhesive phase can be according to purpose suitable for selection, preferably 1~100 μm, more preferably 2~80 μm, spy It You Xuanwei not be 3~50 μm.
Adhesive phase can be made of 1 layer (single layer), can also be made of 2 layers or more of multilayer.Adhesive phase is by multilayer In the case of composition, multilayer can be the same or different each other.Here, " multilayer each other can it is identical can not also The case where referring to above-mentioned support chip, is same together ".
In the case that adhesive phase is made up of multiple layers, as long as the overall thickness of each layer is set as the thickness of above-mentioned preferred adhesive phase Degree.
As above-mentioned adhesive, it can be cited for example that acrylic resin, urethane based resin, rubber resin, The resin of binding property such as organic silicon resin, vinyl ethers resinoid can be enumerated in the case where being conceived to the function of its resin Such as energy ray-curable resin etc..
It should be noted that in the present specification, " energy line " refers to having energy in electromagnetic wave or beam of charged ions The ray of quantum can enumerate ultraviolet light, electron beam etc. as its example.Ultraviolet light for example can be by using as ultraviolet The high-pressure sodium lamp of line source melts H lamps or xenon lamp etc. to be irradiated.Electron beam can be radiated to be produced by electron-beam accelerator etc. Raw ray.
As above-mentioned energy ray-curable resin, it can be cited for example that with polymerizations such as (methyl) acryloyl group, vinyl The resin of property group.
Above-mentioned adherence resin is preferably acrylic resin, more preferably includes the knot for coming from (methyl) acrylate (methyl) acrylate copolymer of structure unit.
In the case that above-mentioned adhesive phase contains the ingredient that energy ray-curable resin etc. polymerize by energy line irradiates, As energy ray-curable, irradiation energy line and make its adhesiveness reduction, the semiconductor core with protective film described below as a result, The pickup of piece becomes easy.Such adhesive phase can be used for example containing each of the ingredient polymerizeing by irradiation by energy line Adhesive composition is planted to be formed.
< < adhesive composition > >
As preferred above-mentioned adhesive composition, can enumerate containing the viscous of the ingredient polymerizeing by irradiation by energy line Mixture composite, as such adhesive composition, for example,：Contain acrylic resin and energy line polymerism The composition of compound (hereinafter, sometimes referred to simply as " adhesive composition (i) ")；Containing with hydroxyl and side chain is with polymerism The above-mentioned acrylic resin of group is (for example, with hydroxyl and side chain is via urethane bond and with polymerizable group Acrylic resin) and isocyanates crosslinking agent composition (hereinafter, sometimes referred to simply as " adhesive composition (ii) ") Deng.
< adhesive compositions (i) >
Adhesive composition (i) contains above-mentioned acrylic resin and energy line polymerizable compound as essential component.
Hereinafter, being illustrated to each ingredient.
[acrylic resin]
In above-mentioned acrylic resin in adhesive composition (i), as preferred acrylic resin, such as can be with Enumerate as the monomer polymerization other than (methyl) acrylate of monomer and (methyl) acrylate used as needed and Obtained (methyl) acrylate copolymer.
As above-mentioned (methyl) acrylate, it can be cited for example that：(methyl) methyl acrylate, (methyl) acrylic acid second Ester, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) amyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) Heptylacrylate, (methyl) n-octyl, (methyl) Isooctyl acrylate monomer, (methyl) 2-EHA, (first Base) the positive nonyl ester of acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) acrylic acid hendecane base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) tridecyl acrylate, (methyl) propylene Sour tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl) acrylic acid hexadecane Base ester ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) octadecyl acrylate ((methyl) Stearyl acrylate), (methyl) acrylic acid isooctadecane base ester ((methyl) isostearyl acrylate) etc. constitute the alkane of Arrcostab (methyl) alkyl acrylate for the chain structure that the carbon atom number of base is 1~18；
(methyl) the acrylate base esters such as (methyl) isobornyl acrylate, (methyl) dicyclopentanyl acrylate；
(methyl) benzyl acrylate etc. (methyl) acrylic acid aralkyl ester；
(methyl) acrylic acid cyclenes base ester such as (methyl) acrylic acid dicyclopentenyl ester；
(methyl) acrylic acid cyclenes oxygroup Arrcostab such as (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester；
(methyl) acrylimide；
(methyl) acrylate containing glycidyl such as (methyl) glycidyl acrylate；
(methyl) dihydroxypropyl methyl esters, (methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) acrylic acid 2- hydroxybutyls, (methyl) acrylic acid 3- hydroxybutyls, (methyl) third (methyl) acrylate of the hydroxyls such as olefin(e) acid 4- hydroxybutyls etc..
As the monomer other than above-mentioned (methyl) acrylate, it can be cited for example that：(methyl) acrylic acid, itaconic acid, second Vinyl acetate, acrylonitrile, styrene, N hydroxymethyl acrylamide etc..
It is each to constitute monomer other than above-mentioned (methyl) acrylate of acrylic resin, above-mentioned (methyl) acrylate etc. Kind monomer can be only one kind, or two or more.
Acrylic resin contained by adhesive composition (i) can be only one kind, or two or more.
Relative to all total amounts containing ingredient other than solvent in adhesive composition (i), adhesive composition (i) The content of acrylic resin is preferably 40~99 mass %, more preferably 50~91 mass %.
[energy line polymerizable compound]
Above-mentioned energy line polymerizable compound is irradiated by the compound of polymerizing curable by energy line, as its example, Intramolecular, which can be enumerated, has the compound of energy ray-curable double bond Isoenergetical line polymerizable group.
As above-mentioned energy line polymerizable compound, it can be cited for example that the low molecular weight with energy line polymerizable group Compound (simple function or polyfunctional monomer and oligomer), more specifically, it can be cited for example that：Trimethylolpropane tris propylene Acid esters, tetramethylol methane tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacryande, two The acrylate such as six acrylate of pentaerythrite, 1,4 butanediol diacrylate, 1,6 hexanediol diacrylate；
The acrylate of the skeletons containing annular aliphatic such as bicyclopentadiene dimethoxy diacrylate；
Polyethyleneglycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified third Acrylic ester compounds such as olefin(e) acid ester, polyether acrylate, itaconic acid oligomer etc..
The molecular weight of above-mentioned energy line polymerizable compound is preferably 100~30000, more preferably 300~10000.
Energy line polymerizable compound contained by adhesive composition (i) can be only one kind, or two or more.
Relative to 100 mass parts of content of above-mentioned acrylic resin, the energy line polymerism of adhesive composition (i) The content for closing object is preferably 1~125 mass parts, more preferably 10~125 mass parts.
[Photoepolymerizationinitiater initiater]
It, can be with other than above-mentioned acrylic resin and energy line polymerizable compound in adhesive composition (i) Contain Photoepolymerizationinitiater initiater.
Above-mentioned Photoepolymerizationinitiater initiater can be well known Photoepolymerizationinitiater initiater, it is specific it can be cited for example that：4- (2- hydroxyl second Oxygroup) phenyl (2- hydroxyl -2- propyl) ketone, Alpha-hydroxy-α, α '-dimethyl acetophenone, 2- methyl -2- hydroxypropiophenonepreparations, 1- hydroxyls Butylcyclohexyl phenyl ketone, 2- hydroxyls -1- { 4- [4- (2- hydroxy-2-methyls propiono) benzyl] phenyl } -2- methylpropane -1- ketone Equal α -one alcohol compounds；
Methoxyacetophenone, 2,2- dimethoxy -2- phenyl acetophenones, 2,2- diethoxy acetophenones, 2- methyl-1s - The acetophenone compounds such as [4- (methyl mercapto) phenyl] -2- morpholino propane -1- ketone；
The benzoin ethers compound such as benzoin ethyl ether, benzoin iso-propylether, anisoin methyl ether；
The ketal compounds such as benzoin dimethylether；
The aromatic sulfonyls class compound such as 2- naphthalene sulfonyl chlorides；
The photolytic activities oxime compounds such as 1- benzophenone -1,1- propanedione -2- (O- ethoxy carbonyls) oxime；
The benzophenone compounds such as benzophenone, benzoylbenzoic acid, 3,3 '-dimethyl -4- methoxy benzophenones；
Thioxanthones, 2-chlorothioxanthone, 2- methyl thioxanthones, 2,4- dimethyl thioxanthones, isopropyl thioxanthone, 2,4- dichloros The thioxanthene ketone class compounds such as thioxanthones, 2,4- diethyl thioxanthones, 2,4- diisopropylthioxanthones；
Camphorone；Halogenated ketone；Acylphosphine oxide；Acyl phosphonate etc..
Photoepolymerizationinitiater initiater contained by adhesive composition (i) can be only one kind, or two or more.
In the case of using Photoepolymerizationinitiater initiater, relative to 100 mass parts of content of above-mentioned energy line polymerizable compound, The content of the Photoepolymerizationinitiater initiater of adhesive composition (i) is preferably 0.1~10 mass parts, more preferably 1~5 mass parts.It is logical Crossing makes the above-mentioned content of Photoepolymerizationinitiater initiater be above-mentioned lower limiting value or more, can fully obtain using caused by Photoepolymerizationinitiater initiater Effect.In addition, by making the above-mentioned content of Photoepolymerizationinitiater initiater be that above-mentioned upper limit value is drawn hereinafter, can inhibit by excessive photopolymerization The byproduct compounds that agent generates are sent out, to carry out the solidification of adhesive phase better.
[crosslinking agent]
It, can be with other than above-mentioned acrylic resin and energy line polymerizable compound in adhesive composition (i) Contain crosslinking agent.
As above-mentioned crosslinking agent, it can be cited for example that organic polyisocyanate compound, organic more group with imine moiety etc..
As above-mentioned organic polyisocyanate compound, it can be cited for example that：Aromatic polyisocyanate compound, fat Race's polyisocyanate compound, the tripolymer of alicyclic polyisocyanates compound and these compounds, isocyanuric acid ester body And addition body, above-mentioned aromatic polyisocyanate compound, aliphatic polyisocyanate compound or alicyclic polyisocyanates Terminal isocyanate carbamate prepolymer etc. obtained from compound is reacted with polyol compound.Above-mentioned addition body refers to Above-mentioned aromatic polyisocyanate compound, aliphatic polyisocyanate compound or alicyclic polyisocyanates compound and second The reactant of the low molecules active hydrogen compounds such as glycol, propylene glycol, neopentyl glycol, trimethylolpropane or castor oil.
As above-mentioned organic polyisocyanate compound, more specifically, it can be cited for example that：2,4- toluene diisocynates Ester；2,6- toluene di-isocyanate(TDI)s；1,3- benzene dimethylene diisocyanate；1,4- benzene dimethylene diisocyanate；Hexichol Methylmethane -4,4 '-diisocyanate；Diphenyl methane -2,4 '-diisocyanate；3- Dimethyl diphenylmethane diisocyanate； Hexamethylene diisocyanate；Isophorone diisocyanate；Dicyclohexyl methyl hydride -4,4 '-diisocyanate；Dicyclohexyl first Alkane -2,4 '-diisocyanate；The addition toluene di-isocyanate(TDI) on all or part of hydroxyl of the polyalcohols such as trimethylolpropane And compound made of any one of hexamethylene diisocyanate or both；Lysine diisocyanate etc..
As above-mentioned organic more group with imine moiety, it can be mentioned, for example：Bis- (the 1- aziridine of N, N '-diphenyl methane -4,4 ' - Carboxylic acid amides) ,-three-β of trimethylolpropane-'-aziridino propionic ester ,-three-β of tetramethylol methane-'-aziridino propionic ester, N, N '-Toluene-2,4-diisocyanates, bis- (1- aziridine carboxylic acid amides) triethylenemelanins of 4- etc..
In the case of using isocyanate compound as crosslinking agent, as acrylic resin, it is preferable to use hydroxyl Polymer.Crosslinking agent with isocyanate group, acrylic resin with hydroxyl in the case of, pass through above-mentioned isocyanate group With the reaction of hydroxyl, cross-linked structure can be easily imported within the adhesive layer.
Crosslinking agent contained by adhesive composition (i) can be only one kind, or two or more.
In the case of using crosslinking agent, relative to 100 mass parts of content of above-mentioned acrylic resin, adhesive composition (i) content of crosslinking agent is preferably 0.01~20 mass parts, more preferably 0.1~16 mass parts.
[solvent]
In adhesive composition (i), preferably other than above-mentioned acrylic resin and energy line polymerizable compound, into One step contains solvent.
Above-mentioned solvent is not particularly limited, as preferred above-mentioned solvent, it can be cited for example that：The hydrocarbon such as toluene, dimethylbenzene； The alcohol such as methanol, ethyl alcohol, 2- propyl alcohol, isobutanol (2- methylpropane -1- alcohol), n-butyl alcohol；The esters such as ethyl acetate；Acetone, methyl ethyl ketone Equal ketone；The ethers such as tetrahydrofuran；Amides such as dimethylformamide, N-Methyl pyrrolidone (compound with amido bond) etc..
Solvent contained by adhesive composition (i) can be only one kind, or two or more.
When adhesive composition (i) contains solvent, the content of solvent is preferably 40~90 mass %, more preferably 50~80 Quality %.
[other ingredients]
In adhesive composition (i), other than above-mentioned acrylic resin and energy line polymerizable compound, do not damaging In the range of evil effect of the present invention, the other ingredients for being not belonging to above-mentioned Photoepolymerizationinitiater initiater, crosslinking agent and solvent can also be contained.
Above-mentioned other ingredients can be those of known, can arbitrarily be selected, be not particularly limited according to purpose.As excellent Above-mentioned other ingredients of choosing, it can be cited for example that：Dyestuff, pigment, deterioration preventing agent, antistatic agent, fire retardant, organosilicon compound The various additives such as object, chain-transferring agent.
Above-mentioned other ingredients contained by adhesive composition (i) can be only one kind, or two or more.
< adhesive compositions (ii) >
Adhesive composition (ii) contain with hydroxyl and side chain with polymerizable group acrylic resin (such as With hydroxyl and side chain via urethane bond the acrylic resin with polymerizable group) and isocyanates hand over Join agent as essential component.
In the case of using adhesive composition (ii), acrylic resin in side chain by having polymerizable group, such as The case where adhesive composition (i), is such, and uses energy line polymerizable compound and is polymerize by irradiation energy line The case where reaction, is compared, the adhesiveness of the adhesive phase after polymerisation (solidification) reduce and generate from the stripping on the object that is stuck It is improved from property, the pick of the semiconductor chip with protective film improves.
It should be noted that in the present specification, the note about " acrylic resin " in adhesive composition (ii) It carries, refers to " there is the acrylic resin of polymerizable group in side chain " unless otherwise specified.
[acrylic resin]
There is the acrylic resin of polymerizable group as above-mentioned side chain, it can be cited for example that：Make as monomer (methyl) acrylate of not hydroxyl without hydroxyl contains hydroxyl with (methyl) acrylate of hydroxyl etc. with hydroxyl The copolymer compound of base, and make that there is the isocyanate group of isocyanate group and the compound of polymerizable group to contain with obtained The hydroxyl reaction of the copolymer of hydroxyl, to form resin obtained from urethane bond.
As (methyl) acrylate of above-mentioned not hydroxyl, it can be cited for example that (methyl) of adhesive composition (i) (methyl) acrylate in acrylate other than (methyl) acrylate of hydroxyl.
In addition, the compound as above-mentioned hydroxyl, can enumerate (methyl) with hydroxyl in adhesive composition (i) The identical compound of acrylate.
The compound of (methyl) acrylate and hydroxyl that constitute the not hydroxyl of above-mentioned acrylic resin respectively can To be only one kind, or two or more.
As the above-mentioned compound with isocyanate group and polymerizable group, it can be cited for example that 2- methacryloxypropyls (methyl) acrylate etc. containing isocyanate group such as base ethyl isocyanate.
Constituting the above-mentioned compound with isocyanate group and polymerizable group of above-mentioned acrylic resin can be only It is a kind of, or two or more.
Acrylic resin contained by adhesive composition (ii) can be only one kind, or two or more.
Relative to all total amounts containing ingredient other than the solvent in adhesive composition (ii), adhesive composition (ii) content of acrylic resin is preferably 80~99 mass %, more preferably 90~97 mass %.
[isocyanates crosslinking agent]
As above-mentioned isocyanates crosslinking agent, it can be cited for example that middle as crosslinking agent with adhesive composition (i) The identical substance of above-mentioned organic polyisocyanate compound.
Isocyanates crosslinking agent contained by adhesive composition (ii) can be only one kind, or two or more.
It is preferred that the molal quantity phase of isocyanate group possessed by isocyanates crosslinking agent in adhesive composition (ii) Molal quantity for hydroxyl possessed by the acrylic resin in adhesive composition (ii) is 0.2~3 times.By making isocyanide The above-mentioned molal quantity of perester radical is above-mentioned lower limiting value or more, the adhesiveness of the adhesive phase after solidification reduce caused by from being glued The fissility pasted on object improves, and the pick of the semiconductor chip with protective film improves.In addition, by making the upper of isocyanate group Molal quantity is stated as above-mentioned upper limit value hereinafter, the pair that the reaction of isocyanates crosslinking agent to each other generates can be further suppressed Product.
It is preferred that being carried out to the content of the isocyanates crosslinking agent of adhesive composition (ii) suitable for adjusting so that isocyanic acid The molal quantity of ester group is above-mentioned range, as satisfaction on the basis of condition, the content 100 relative to acrylic resin Mass parts, preferably 0.01~20 mass parts, more preferably 0.1~15 mass parts, particularly preferably 0.3~12 mass parts.
[Photoepolymerizationinitiater initiater]
It, can be with other than above-mentioned acrylic resin and isocyanates crosslinking agent in adhesive composition (ii) Contain Photoepolymerizationinitiater initiater.
As above-mentioned Photoepolymerizationinitiater initiater, it can be cited for example that the same photopolymerization of with adhesive composition (i) the case where Initiator.
Photoepolymerizationinitiater initiater contained by adhesive composition (ii) can be only one kind, or two or more.
In the case of using Photoepolymerizationinitiater initiater, relative to 100 mass parts of content of acrylic resin, adhesive combination The content of the Photoepolymerizationinitiater initiater of object (ii) is preferably 0.05~20 mass parts.
Above-mentioned content by making Photoepolymerizationinitiater initiater is above-mentioned lower limiting value or more, can fully obtain and be caused using photopolymerization Effect caused by agent.In addition, by make Photoepolymerizationinitiater initiater above-mentioned content be above-mentioned upper limit value hereinafter, can inhibit by excess Photoepolymerizationinitiater initiater generate byproduct compounds, to better carry out adhesive phase solidification.
[solvent]
In adhesive composition (ii), other than above-mentioned acrylic resin and isocyanates crosslinking agent, preferably into One step contains solvent.
As above-mentioned solvent, it can be cited for example that with adhesive composition (i) the case where same solvent.
Solvent contained by adhesive composition (ii) can be only one kind, or two or more.
In the case that adhesive composition (ii) contains solvent, the content of solvent is preferably 40~90 mass %, more preferably For 50~80 mass %.
[other ingredients]
In adhesive composition (ii), other than above-mentioned acrylic resin and isocyanates crosslinking agent, do not damaging In the range of evil effect of the present invention, the other ingredients for being not belonging to above-mentioned Photoepolymerizationinitiater initiater and solvent can also be contained.
As above-mentioned other ingredients, it can be cited for example that with same other ingredients the case where adhesive composition (i).
Above-mentioned other ingredients contained by adhesive composition (ii) can be only one kind, or two or more.
More than, for containing irradiated by energy line by the adhesive composition of ingredient that polymerize is illustrated, but When the formation of adhesive phase, the adhesive composition without the ingredient polymerizeing by irradiation by energy line can also be used.That is, viscous Mixture layer can also be the adhesive phase of the non-energy line curability without energy ray-curable.
As preferred above-mentioned non-energy line curing adhesive composition, it can be cited for example that containing acrylic resin And the adhesive composition (hereinafter, sometimes referred to simply as " adhesive composition (iii) ") etc. of crosslinking agent, solvent, no can be contained Belong to any ingredients such as other ingredients of solvent.
< adhesive compositions (iii) >
Above-mentioned acrylic resin, crosslinking agent, solvent and other ingredients contained by adhesive composition (iii) respectively with it is viscous Acrylic resin, crosslinking agent, solvent and other ingredients in mixture composite (i) is identical.
Relative to all total amounts containing ingredient other than the solvent in adhesive composition (iii), adhesive composition (iii) content of acrylic resin is preferably 40~99 mass %, more preferably 50~93 mass %.
Relative to 100 mass parts of content of acrylic resin, the content of the crosslinking agent of adhesive composition (iii) is preferred For 3~30 mass parts, more preferably 5~25 mass parts.
Adhesive composition (iii) is identical as adhesive composition (i) other than this above-mentioned point.
The manufacturing method > > of < < adhesive compositions
The above-mentioned adhesive compositions such as adhesive composition (i)~(iii) can be by coordinating above-mentioned adhesive, as needed Ingredient other than the above-mentioned adhesive used etc. is used to constitute the ingredient of each adhesive composition and obtains.
Coordinate order of addition when each ingredient to be not particularly limited, two or more ingredients can also be added simultaneously.
The method mixed to each ingredient when cooperation is not particularly limited, can be from making the rotations such as stirrer or agitating paddle Come mixed method, using method that mixer is mixed, apply the method that ultrasonic wave is mixed etc. well known to side Suitable for selection in method.
For temperature and time when the addition of each ingredient and mixing, as long as deteriorating each gradation composition, It is not particularly limited, suitable for adjusting, but temperature is preferably 15~30 DEG C.
Zero protective film formation film
Said protection film formation film can be any one in thermosetting property and energy ray-curable.Protective film, which is formed, to be used Film eventually becomes the high protective film of impact resistance by solidification.The semiconductor that the protective film for example can prevent cutting action later The generation of crackle in chip.
Protective film formation film can use thermosetting protective film formation composition described later or energy line curing Property protective film formation composition (hereinafter, sometimes will be including being known as " protective film formation composition " including them) and formed.
Protective film formation film can be only 1 layer (single layer), or 2 layers or more of multilayer, in the case of being multilayer, Its multilayer can be the same or different each other, and the combination of multilayer is not particularly limited.
The thickness of protective film formation film is not particularly limited, preferably 1~100 μm, more preferably 5~75 μm, especially Preferably 5~50 μm.By making the thickness of protective film formation film be above-mentioned lower limiting value or more, for half as the object that is stuck The adhesion of conductor chip and semiconductor chip further increases.In addition, by making the thickness of protective film formation film be above-mentioned Upper limit value will more easily can be cut hereinafter, in the pickup of semiconductor chip using shearing force as the protective film of solidfied material It is disconnected.
Thermosetting protective film formation film
As preferred thermosetting protective film formation film, it can be cited for example that containing component of polymer (A) and thermosetting property The thermosetting protective film formation film of ingredient (B).Component of polymer (A) be can regard as polymerizable compound carry out polymerisation and The ingredient of formation.In addition, thermosetting component (B) is that heat can be cured (polymerization) and be reacted as the releaser of reaction Ingredient.It should be noted that in present embodiment, polymerisation also includes polycondensation reaction.
< < thermosetting protective films, which are formed, uses composition > >
Thermosetting protective film formation film can use the thermosetting protective film formation composition containing its constituent material To be formed.For example, thermosetting protective film formation composition is applied in the formation object surface of thermosetting protective film formation film, It makes it dry as needed, so as to form thermosetting protective film formation film in target site.Thermosetting protective film is formed With the content ratio of the ingredient not gasified under room temperature in composition to each other usually with thermosetting protective film formation film The content ratio of mentioned component to each other is identical.Here, " room temperature " as previously described.
The coating of thermosetting protective film formation composition can carry out according to known methods, it can be cited for example that making With Kohler coater, scraper plate coating machine, bar coater, gravure coater, roll coater, roller knife coating machine, curtain stream coating machine, die coating The method of the various coating machines such as machine, knife type coater, silk screen coating machine, Meyer bar coater, kiss coater.
The drying condition of thermosetting protective film formation composition is not particularly limited, thermosetting protective film formation combination In the case that object contains solvent described later, preferably make its heat drying, in this case, for example preferably with 70~130 DEG C, 10 Second~5 minutes conditions are dried.
< protective films, which are formed, uses composition (III-1) >
As thermosetting protective film formation composition, it can be cited for example that containing component of polymer (A) and thermosetting property at The thermosetting protective film of point (B) is formed with composition (III-1) (in the present specification, sometimes referred to simply as " protective film formation group Close object (III-1) ") etc..
[component of polymer (A)]
Component of polymer (A) is the polymerization for assigning film forming, flexibility etc. to thermosetting protective film formation film Close object.
Component of polymer (A) contained by protective film formation composition (III-1) and thermosetting protective film formation film can To be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
As component of polymer (A), it can be cited for example that：Acrylic resin (the tree with (methyl) acryloyl group Fat), polyester, urethane based resin (with urethane bond resin), propenoic methyl carbamate resin, organosilicon Resinoid (resin with siloxanes key), rubber resin (resin with rubber structure), phenoxy resin, thermosetting property are poly- Acid imide etc., preferably acrylic resin.
As the above-mentioned acrylic resin in component of polymer (A), well known acrylic polymer can be enumerated.
The weight average molecular weight (Mw) of acrylic resin is preferably 10000~2000000, more preferably 100000~ 1500000.By making the weight average molecular weight of acrylic resin be above-mentioned lower limiting value or more, thermosetting protective film formation film Shape stability (ageing stability when keeping) improves.In addition, by making the weight average molecular weight of acrylic resin be above-mentioned Upper limit value can be further suppressed and glued hereinafter, thermosetting protective film formation is easy to follow the male and fomale(M&F) for the object that is stuck with film It pastes and generates gap etc. between object and thermosetting protective film formation film.
The glass transition temperature (Tg) of acrylic resin is preferably -60~70 DEG C, more preferably -30~50 DEG C.It is logical Crossing makes the Tg of acrylic resin be above-mentioned lower limiting value or more, can inhibit the bonding force between protective film and support chip, support chip Fissility improves.In addition, by make acrylic resin Tg be above-mentioned upper limit value hereinafter, thermosetting protective film formation film and Bonding force between protective film and the object that is stuck improves.
As acrylic resin, it can be cited for example that the polymer of one or more kinds of (methyl) acrylate；Choosing From two kinds in (methyl) acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and N hydroxymethyl acrylamide etc. with The copolymer etc. of upper monomer.
As above-mentioned (methyl) acrylate for constituting acrylic resin, it can be cited for example that：(methyl) acrylic acid first Ester, (methyl) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (first Base) Hexyl 2-propenoate, (methyl) heptylacrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (first Base) n-octyl, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) Acrylic acid hendecane base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) acrylic acid 13 Arrcostab, (methyl) acrylic acid tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl) aliphatic acrylate ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) propylene The chain structure that the carbon atom number that sour stearyl ((methyl) stearyl acrylate) etc. constitutes the alkyl of Arrcostab is 1~18 (methyl) alkyl acrylate；
(methyl) the acrylate base esters such as (methyl) isobornyl acrylate, (methyl) dicyclopentanyl acrylate；
(methyl) benzyl acrylate etc. (methyl) acrylic acid aralkyl ester；
(methyl) acrylic acid cyclenes base ester such as (methyl) acrylic acid dicyclopentenyl ester；
(methyl) acrylic acid cyclenes oxygroup Arrcostab such as (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester；
(methyl) acrylimide；
(methyl) acrylate containing glycidyl such as (methyl) glycidyl acrylate；
(methyl) dihydroxypropyl methyl esters, (methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) acrylic acid 2- hydroxybutyls, (methyl) acrylic acid 3- hydroxybutyls, (methyl) third (methyl) acrylate of the hydroxyls such as olefin(e) acid 4- hydroxybutyls；
(methyl) acrylate containing substituted-amino such as (methyl) acrylic acid N- methylamino ethyl esters etc..Wherein, " substitution Amino " refers to, group made of 1 of amino or 2 hydrogen atoms are replaced by the group other than hydrogen atom.
Acrylic resin for example can also be other than above-mentioned (methyl) acrylate, also copolymerization have be selected from (methyl) One or more of acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and N hydroxymethyl acrylamide etc. Acrylic resin made of monomer.
The monomer for constituting acrylic resin can be only one kind, or and it is two or more, it is two or more situations Under, combination thereof and ratio can be selected arbitrarily.
Acrylic resin can have vinyl, (methyl) acryloyl group, amino, hydroxyl, carboxyl, isocyanate group etc. The functional group that can be bonded with other compounds.The above-mentioned functional group of acrylic resin can pass through crosslinking agent described later (F) it is bonded, can not also be directly bonded with other compounds by crosslinking agent (F) with other compounds.Acrylic resin When above-mentioned functional group is bonded with other compounds, the reliability that is encapsulated obtained from composite sheet using protective film formation The tendency being improved.
It in the present embodiment, can also be by the thermoplastic resin other than acrylic resin as component of polymer (A) (hereinafter, sometimes referred to simply as " thermoplastic resin ") is applied in combination with acrylic resin.
By using above-mentioned thermoplastic resin, protective film is improved from the fissility on support chip or thermosetting protective film Formation is easy to follow the male and fomale(M&F) for the object that is stuck with film, is further suppressed the object that is stuck sometimes and is formed use with thermosetting protective film Gap etc. is generated between film.
The weight average molecular weight of above-mentioned thermoplastic resin is preferably 1000~100000, more preferably 3000~80000.
The glass transition temperature (Tg) of above-mentioned thermoplastic resin is preferably -30~150 DEG C, is more preferably -20~120 ℃。
As above-mentioned thermoplastic resin, it can be cited for example that：Polyester, polyurethane, phenoxy resin, polybutene, polybutadiene Alkene, polystyrene etc..
Above-mentioned thermoplastic resin contained by protective film formation composition (III-1) and thermosetting protective film formation film can To be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
Protective film is formed in composition (III-1), the content of component of polymer (A) relative to other than solvent all at The ratio (that is, content of the component of polymer (A) of thermosetting protective film formation film) of the total content divided is independent of polymer The type of ingredient (A), preferably 5~50 mass %, more preferably 10~40 mass %, particularly preferably 15~35 mass %.
Component of polymer (A) is also equivalent to the case where thermosetting component (B).In the present embodiment, protective film is formed The case where containing the ingredient for being equivalent to both such component of polymer (A) and thermosetting component (B) with composition (III-1) Under, protective film formation is considered as with composition (III-1) containing component of polymer (A) and thermosetting component (B).
[thermosetting component (B)]
Thermosetting component (B) be for make thermosetting protective film formation with film be solidified to form hard protective film at Point.
Thermosetting component (B) contained by protective film formation composition (III-1) and thermosetting protective film formation film can To be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
As thermosetting component (B), it can be cited for example that epoxy-based thermosetting resin, Thermocurable polyimide, polyurethane, Unsaturated polyester (UP), organic siliconresin etc., preferably epoxy-based thermosetting resin.
(epoxy-based thermosetting resin)
Epoxy-based thermosetting resin includes epoxy resin (B1) and thermal curing agents (B2).
Protective film is formed with the epoxy-based thermosetting resin contained by composition (III-1) and thermosetting protective film formation film Can be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily It selects.
Epoxy resin (B1)
As epoxy resin (B1), well known epoxy resin can be enumerated, it can be cited for example that：Multifunctional class asphalt mixtures modified by epoxy resin Fat, biphenol compound, bis-phenol A glycidyl ether and its hydride, o-cresol phenolic resin varnish, bicyclopentadiene type ring Oxygen resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenylene matrix type epoxy resin etc., Epoxides more than 2 functions.
As epoxy resin (B1), the epoxy resin with unsaturated alkyl can be used.With without unsaturated alkyl Epoxy resin compare, the compatibility of epoxy resin and acrylic resin with unsaturated alkyl is high.Therefore, by using Epoxy resin with unsaturated alkyl is improved using the reliability that protective film formation encapsulates obtained from composite sheet.
As the epoxy resin with unsaturated alkyl, it can be cited for example that the PART EPOXY base of multifunctional based epoxy resin Group is converted into compound made of the group with unsaturated alkyl.Such compound for example can be by making (methyl) third Olefin(e) acid or derivatives thereof carries out addition reaction with epoxy group and obtains.
In addition, as the epoxy resin with unsaturated alkyl, it can be cited for example that the group with unsaturated alkyl is straight Connect compound etc. made of aromatic rings for being bonded to and constituting epoxy resin etc..
Unsaturated alkyl is the unsaturated group for having polymerism, sub as its concrete example, can enumerate vinyl (vinyl group), 2- acrylic (allyl), (methyl) acryloyl group, (methyl) acrylamido etc., preferably acryloyl Base.
It should be noted that in the present specification, " derivative " refers to, 1 or more hydrogen atom of former compound is by hydrogen original Compound made of group (substituent group) substitution other than son.
The number average molecular weight of epoxy resin (B1) is not particularly limited, from the solidification of thermosetting protective film formation film Property and solidification after protection film strength and heat resistance in terms of set out, preferably 300~30000, more preferably 300~ 10000,300~3000 are particularly preferably.
The epoxide equivalent of epoxy resin (B1) is preferably 100~1100g/eq, more preferably 150~1000g/eq.
Epoxy resin (B1) can be used alone, and can also be used in combination of two or more, be used in combination of two or more In the case of, combination thereof and ratio can be selected arbitrarily.
Thermal curing agents (B2)
Thermal curing agents (B2) are functioned as the curing agent of epoxy resin (B1).
As thermal curing agents (B2), it can be mentioned, for example：It can be with the official of epoxy reaction with 2 or more in 1 molecule The compound that can be rolled into a ball.As above-mentioned functional group, it can be mentioned, for example：Phenolic hydroxyl group, alcoholic extract hydroxyl group, amino, carboxyl, acidic group through acid anhydrides and At group etc., preferably phenolic hydroxyl group, amino or acidic group are through group made of acid anhydrides, more preferably phenolic hydroxyl group or amino.
As the phenols curing agent with phenolic hydroxyl group in thermal curing agents (B2), it can be mentioned, for example：Multifunctional phenolic resin, Xenol, novolak phenolics, dicyclopentadiene class phenolic resin, aralkyl phenolic resin etc..
As the amine curing agent with amino in thermal curing agents (B2), it can be mentioned, for example：Dicyandiamide is (below also referred to as For " DICY ") etc..
Thermal curing agents (B2) can also be the thermal curing agents with unsaturated alkyl.
As the thermal curing agents (B2) with unsaturated alkyl, it can be mentioned, for example：A part of quilt of the hydroxyl of phenolic resin Compound, the group with unsaturated alkyl made of group substitution with unsaturated alkyl are bonded directly to phenolic resin Compound made of aromatic ring etc..
Above-mentioned unsaturated alkyl in thermal curing agents (B2) be in the above-mentioned epoxy resin with unsaturated alkyl not The identical group of saturated hydrocarbyl.
In the case of using phenols curing agent as thermal curing agents (B2), from protective film is improved from the fissility on support chip From the perspective of, thermal curing agents (B2) are preferably softening point or the high thermal curing agents of glass transition temperature.
Thermal curing agents (B2) are preferably solid-state and not show curing activity to epoxy resin (B1) at normal temperatures, but another Aspect is dissolved by heating and shows the thermal curing agents of curing activity (hereinafter, sometimes referred to simply as " heat epoxy resin (B1) Active latent epoxy resin curing agent ").
Above-mentioned thermal activities latent epoxy resin curing agent at normal temperatures in thermosetting protective film formation film steadily It is scattered in epoxy resin (B1), but compatible with epoxy resin (B1) by heating, is reacted with epoxy resin (B1).By making It is significantly improved with the storage stability of above-mentioned thermal activities latent epoxy resin curing agent, protective film formation composite sheet.For example, The curing agent is inhibited with film to the movement of adjacent support chip from protective film formation, can effectively inhibit thermosetting protective film The thermosetting property of formation film reduces.Moreover, because the heat cure degree based on heating of thermosetting protective film formation film is further Increase, the pick of the semiconductor chip described later with protective film further increases.
As above-mentioned thermal activities latent epoxy resin curing agent, it can be cited for example that：Salt, binary acid hydrazides, double cyanogen The amine additives etc. of amine, curing agent.
In thermal curing agents (B2), such as multifunctional phenolic resin, novolak phenolics, bicyclopentadiene class phenolic aldehyde The number average molecular weight of the resin components such as resin, aralkyl phenolic resin is preferably 300~30000, more preferably 400~ 10000,500~3000 are particularly preferably.
In thermal curing agents (B2), such as the molecular weight of the non-resins ingredient such as bis-phenol, dicyandiamide is not particularly limited, such as excellent It is selected as 60~500.
Thermal curing agents (B2) can be used alone, and can also be used in combination of two or more, be used in combination of two or more In the case of, combination thereof and ratio can be selected arbitrarily.
In protective film formation composition (III-1) and thermosetting protective film formation film, relative to epoxy resin (B1) content of 100 mass parts of content, thermal curing agents (B2) is preferably 0.1~500 mass parts, more preferably 1~200 mass Part.By making the above-mentioned content of thermal curing agents (B2) be above-mentioned lower limiting value or more, it is easier to carry out thermosetting protective film and form use The solidification of film.In addition, by making the above-mentioned content of thermal curing agents (B2) for above-mentioned upper limit value hereinafter, thermosetting protective film forms use The hydroscopicity of film reduces, and the reliability encapsulated obtained from composite sheet using protective film formation is further increased.
In protective film formation composition (III-1) and thermosetting protective film formation film, relative to component of polymer (A) 100 mass parts of content, the content of thermosetting component (B) is (for example, epoxy resin (B1) and thermal curing agents (B2's) always contains Amount) it is preferably 1~100 mass parts, more preferably 1.5~85 mass parts, particularly preferably 2~70 mass parts.By making thermosetting Property ingredient (B) above-mentioned content be such range, can inhibit the bonding force between protective film and support chip, the fissility of support chip It improves.
[curing accelerator (C)]
Protective film formation composition (III-1) and thermosetting protective film formation film can contain curing accelerator (C). Curing accelerator (C) is the ingredient of the curing rate for adjusting protective film formation composition (III-1).
As preferred curing accelerator (C), it can be mentioned, for example：Triethylenediamine, benzyldimethylamine, 2,4, three ethyl alcohol The tertiary amines such as amine, dimethylaminoethanol, three (dimethylaminomethyl) phenol；2-methylimidazole, 2- phenylimidazoles, 2- phenyl- The imidazoles (1 such as 4-methylimidazole, 2- phenyl -4,5- bishydroxymethyls imidazoles, 2- phenyl -4- methyl -5- hydroxymethylimidazoles Imidazoles made of the above hydrogen atom is replaced by the group other than hydrogen atom)；Tributylphosphine, diphenylphosphine, triphenylphosphine etc. are organic Phosphine (phosphine made of 1 or more hydrogen atom is replaced by organic group)；TetraphenylTetraphenyl borate salts, triphenylphosphine tetraphenyl Tetraphenyl borate salts such as borate etc..
Curing accelerator (C) contained by protective film formation composition (III-1) and thermosetting protective film formation film can To be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In the case of using curing accelerator (C), in protective film formation composition (III-1) and thermosetting protective film shape At in film, relative to 100 mass parts of content of thermosetting component (B), the content of curing accelerator (C) is preferably 0.01~10 Mass parts, more preferably 0.1~5 mass parts.It, can be more by making the content of curing accelerator (C) more than above-mentioned lower limiting value It significantly obtains using effect caused by curing accelerator (C).In addition, by making the content of curing accelerator (C) above-mentioned Upper limit value hereinafter, for example being formed in thermosetting protective film under high temperature/super-humid conditions for highly polar curing accelerator (C) It is improved with inhibition mobile to the bonding interface side with the object that is stuck and being segregated in film, uses thermosetting protective film shape It is further increased at the reliability encapsulated obtained from film.
[packing material (D)]
Protective film formation composition (III-1) and thermosetting protective film formation film can contain packing material (D).It is logical Crossing makes thermosetting protective film formation film contain packing material (D), for making the solidification of thermosetting protective film formation film obtain Protective film, be easily adjusted coefficient of thermal expansion, optimize the coefficient of thermal expansion by formation object for protective film, use The reliability that thermosetting protective film formation encapsulates obtained from film further increases.In addition, by making thermosetting protective film shape Contain packing material (D) at film, the hydroscopicity of protective film can also be reduced, improve exothermicity.
Packing material (D) can be any materials in organic filler material and inorganic filling material, but preferably inorganic Packing material.
As preferred inorganic filling material, it can be mentioned, for example：Silica, aluminium oxide, talcum, calcium carbonate, titanium white, iron The powder such as red, silicon carbide, boron nitride；Bead made of spherical shape is made in these inorganic filling materials；These inorganic filling materials Surface be modified product；The mono-crystlling fibre of these inorganic filling materials；Glass fibre etc..
In these materials, preferably inorganic filling material is silica or aluminium oxide.
Packing material (D) contained by protective film formation composition (III-1) and thermosetting protective film formation film can be with It is only a kind of, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In the case of using packing material (D), in protective film formation in composition (III-1), other than solvent Whole components total content, the ratio of the content of packing material (D) is (that is, the packing material of thermosetting protective film formation film (D) content) it is preferably 5~80 mass %, more preferably 7~60 mass %.By making the content of packing material (D) in this way Range, the adjustment of above-mentioned coefficient of thermal expansion becomes more to be easy.
[coupling agent (E)]
Protective film formation composition (III-1) and thermosetting protective film formation film can contain coupling agent (E).Pass through Using with heat can be made with the compound of the functional group of inorganic compound or organic compound reaction as coupling agent (E) Solidity protective film formation film is improved relative to the cementability and adaptation of the object that is stuck.In addition, by using coupling agent (E), The heat resistance of protective film obtained from making thermosetting protective film formation film cure will not be caused impaired, and can be improved water-fast Property.
Coupling agent (E) preferably has can be with functional group possessed by component of polymer (A), thermosetting component (B) etc. The compound of the functional group of reaction, more preferably silane coupling agent.
As preferred above-mentioned silane coupling agent, it can be mentioned, for example：3- glycidoxypropyltrime,hoxysilanes, 3- rings Oxygen propoxypropyl methyldiethoxysilane, 3- glycidoxypropyl groups triethoxysilane, 3- glycidyl oxy methyls two Ethoxysilane, 2- (3,4- epoxycyclohexyls) ethyl trimethoxy silane, 3- methacryloxypropyl trimethoxy silicon Alkane, 3- TSL 8330s, 3- (2- aminoethylaminos) propyl trimethoxy silicane, 3- (2- amino-ethyl ammonia Base) hydroxypropyl methyl diethoxy silane, 3- (phenyl amino) propyl trimethoxy silicane, 3- anilino- propyl trimethoxy silicon It is alkane, 3- ureas propyl-triethoxysilicane, 3-mercaptopropyi trimethoxy silane, 3- mercapto propyl methyl dimethoxy silanes, double (3- triethoxysilylpropyltetrasulfides) tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyl front three Oxysilane, vinyltriacetoxy silane and imidizole silane etc..
Coupling agent (E) contained by protective film formation composition (III-1) and thermosetting protective film formation film can be only For one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In the case of using coupling agent (E), is formed and used in protective film formation composition (III-1) and thermosetting protective film In film, relative to 100 mass parts of total content of component of polymer (A) and thermosetting component (B), the content of coupling agent (E) is preferred For 0.03~20 mass parts, more preferably 0.05~10 mass parts, particularly preferably 0.1~5 mass parts.By making coupling agent (E) content more than above-mentioned lower limiting value, can significantly more obtain packing material (D) in resin dispersibility raising, Raising of cementability of thermosetting protective film formation film and the object that is stuck etc. uses effect caused by coupling agent (E).In addition, By making the content of coupling agent (E) in above-mentioned upper limit value hereinafter, the generation of degassing (outgas) can be further suppressed.
[crosslinking agent (F)]
As component of polymer (A), acrylic resin stated in use etc. has and can be bonded with other compounds The ingredient of functional groups such as vinyl, (methyl) acryloyl group, amino, hydroxyl, carboxyl, isocyanate group in the case of, protection Film formation composition (III-1) and thermosetting protective film formation film, which can contain, makes above-mentioned functional group and other compound keys It closes and crosslinked crosslinking agent (F).It is crosslinked by using crosslinking agent (F), thermosetting protective film formation film can be adjusted Initial bonding force and cohesiveness.
As crosslinking agent (F), it can be mentioned, for example：Organic polyisocyanate compound, organic more group with imine moiety, metal chelating Close species crosslinking agent (crosslinking agent with metallo-chelate structure), aziridines crosslinking agent (crosslinking agent with '-aziridino) Deng.
As above-mentioned organic polyisocyanate compound, it can be mentioned, for example：Aromatic polyisocyanate compound, aliphatic These compounds (are also together simply referred to as " aromatic series by polyisocyanate compound and alicyclic polyisocyanates compound below Polyisocyanate compound etc. ")；The trimers such as above-mentioned aromatic polyisocyanate compound, isocyanuric acid ester body and adduct； Terminal isocyanate carbamic acid obtained from making above-mentioned aromatic polyisocyanate compound etc. and polyol compound react Ester prepolymer etc..Above-mentioned " adduct " indicates above-mentioned aromatic polyisocyanate compound, aliphatic polyisocyanate compound Or the low molecules such as alicyclic polyisocyanates compound and ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane or castor oil The reactant of active hydrogen compounds can enumerate the phenylenedimethylidyne of trimethylolpropane as described later as its example Diisocyanate addition product etc..In addition, " the terminal isocyanate carbamate prepolymer " is as mentioned before.
As above-mentioned organic polyisocyanate compound, more specifically, it can be mentioned, for example：2,4 toluene diisocyanate； 2,6- toluene di-isocyanate(TDI)s；1,3- benzene dimethylene diisocyanate；1,4- xylene diisocyanate；Diphenyl methane- 4,4 '-diisocyanate；Diphenyl methane -2,4 '-diisocyanate；3- Dimethyl diphenylmethane diisocyanate；Six methylenes Group diisocyanate；Isophorone diisocyanate；Dicyclohexyl methyl hydride -4,4 '-diisocyanate；Dicyclohexyl methyl hydride -2, 4 '-diisocyanate；Addition has toluene di-isocyanate(TDI), six Asias on all or part of hydroxyl of the polyalcohols such as trimethylolpropane In methyl diisocyanate and benzene dimethylene diisocyanate any one or it is two or more made of compound；Lysine Diisocyanate etc..
As above-mentioned organic more group with imine moiety, it can be mentioned, for example：Bis- (the 1- aziridine of N, N '-diphenyl methane -4,4 ' - Formamide) ,-three-β of trimethylolpropane-'-aziridino propionic ester ,-three-β of tetramethylol methane-'-aziridino propionic ester, N, N '-Toluene-2,4-diisocyanates, bis- (1- aziridine formamide) triethylenemelanins of 4- etc..
It is excellent as component of polymer (A) in the case where using organic polyisocyanate compound as crosslinking agent (F) Choosing uses the polymer of hydroxyl.Crosslinking agent (F) with isocyanate group, component of polymer (A) with hydroxyl in the case of, By crosslinking agent (F) is with reacting for component of polymer (A) easily crosslinking knot can be imported to thermosetting protective film formation film Structure.
Crosslinking agent (F) contained by protective film formation composition (III-1) and thermosetting protective film formation film can be only For one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In the case of using crosslinking agent (F), in protective film formation in composition (III-1), relative to component of polymer (A) 100 mass parts of content, the content of crosslinking agent (F) be preferably 0.01~20 mass parts, more preferably 0.1~10 mass parts, Particularly preferably 0.5~5 mass parts.By making the above-mentioned content of crosslinking agent (F) more than above-mentioned lower limiting value, can significantly more obtain Obtain the effect for using crosslinking agent (F) and bringing.In addition, by making the above-mentioned content of crosslinking agent (F) in above-mentioned upper limit value hereinafter, can Inhibit bonding force, thermosetting protective film formation film and semiconductor wafer between thermosetting protective film formation film and support chip or Bonding force between semiconductor chip excessively reduces.
In the present invention, the effect of the present invention can be fully obtained without using crosslinking agent (F).
[energy ray-curable resin (G)]
Protective film formation composition (III-1) can contain energy ray-curable resin (G).Thermosetting protective film is formed With film by containing energy ray-curable resin (G), characteristic can be changed based on the irradiation of energy line.
Energy ray-curable resin (G) is that energy line curability compound is made to polymerize resin obtained from (solidification).
As above-mentioned energy ray-curable compound, it can be mentioned, for example：The intramolecular at least change with 1 polymeric double bond Close object, it is however preferred to have the acrylic ester compound of (methyl) acryloyl group.
As above-mentioned acrylic ester compound, it can be mentioned, for example：Trimethylolpropane tris (methyl) acrylate, four hydroxyls Methylmethane four (methyl) acrylate, pentaerythrite three (methyl) acrylate, pentaerythrite four (methyl) acrylate, two Pentaerythrite monohydroxy five (methyl) acrylate, dipentaerythritol six (methyl) acrylate, 1,4- butanediols two (methyl) (methyl) acrylate of the races containing chain fatty such as acrylate, 1,6-hexylene glycols two (methyl) acrylate skeleton；Two (first Base) skeleton containing annular aliphatic such as dicyclopentanyl acrylate (methyl) acrylate；Polyethylene glycol two (methyl) acrylate Etc. polyalkylene glycol (methyl) acrylate；Oligoester (methyl) acrylate；Carbamate (methyl) acrylate is low Polymers；Epoxy-modified (methyl) acrylate；Polyethers (methyl) third other than above-mentioned polyalkylene glycol (methyl) acrylate Olefin(e) acid ester；Itaconic acid oligomer etc..
The weight average molecular weight of above-mentioned energy ray-curable compound is preferably 100~30000, more preferably 300~ 10000。
Above-mentioned energy ray-curable compound for polymerization can be only one kind, or and it is two or more, it is two kinds In the case of above, combination thereof and ratio can be selected arbitrarily.
Energy ray-curable resin (G) contained by protective film formation composition (III-1) can be only one kind, can also It is two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
Protective film is formed in composition (III-1), and the content of energy ray-curable resin (G) is preferably 1~95 matter Measure %, more preferably 2~90 mass %, further preferably 3~85 mass %.
[Photoepolymerizationinitiater initiater (H)]
In the case that protective film formation contains energy ray-curable resin (G) with composition (III-1), in order to make energy line The polymerisation of curable resin (G) is effectively performed, and can also contain Photoepolymerizationinitiater initiater (H).
As Photoepolymerizationinitiater initiater (H) of the protective film formation in composition (III-1), it can enumerate and be combined with adhesive The identical Photoepolymerizationinitiater initiater of Photoepolymerizationinitiater initiater in object (ii).
Photoepolymerizationinitiater initiater (H) contained by protective film formation composition (III-1) can be only one kind, or two Kind or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In protective film formation in composition (III-1), 100 mass of content relative to energy ray-curable resin (G) Part, the content of Photoepolymerizationinitiater initiater (H) be preferably 0.1~20 mass parts, more preferably 1~10 mass parts, particularly preferably 2~ 5 mass parts.
[colorant (I)]
Protective film formation composition (III-1) and thermosetting protective film formation film can contain colorant (I).
As colorant (I), it can be cited for example that well known to inorganic system's pigment, organic system pigment, organic based dye etc. Toner.
As above-mentioned organic system pigment and organic based dye, it can be cited for example that：Ammonium system pigment, cyanine system pigment, portion are spent Blueness is pigment, crocic acid system pigment, side's acidBe pigment, azulene (azulenium) it is pigment, polymethine system pigment, naphthoquinones It is pigment, pyransIt is pigment, phthalocyanine system pigment, naphthalene phthalocyanine system pigment, naphthalene lactim system pigment, azo system pigmen, condensation Azo system pigmen, purple cyclic ketones system pigment, is pigment, two at indigo system's pigmentPiperazine system pigment, quinacridone pigment, different Yin (metallic complex salt contaminates for diindyl quinoline ketone system pigment, quinophthalone system pigment, azole series pigment, thioindigo system pigment, metal complex system pigment Material), dithiol metal complex system pigment, indoles phenol system pigment, triallyl methane system pigment, anthraquinone system pigment, twoPiperazine It is pigment, naphthols system pigment, azomethine system pigment, benzimidazolone system pigment, pyranthrone system pigment and intellectual circle system pigment etc..
As above-mentioned inorganic system's pigment, it can be cited for example that：Carbon black, cobalt system pigment, iron system pigment, chromium system pigment, titanium system Pigment, vanadium system pigment, zirconium system pigment, molybdenum system pigment, ruthenium system pigment, platinum group pigment, ITO (tin indium oxide) are pigment, ATO (oxygen Change antimony tin) it is pigment etc..
Colorant (I) contained by protective film formation composition (III-1) and thermosetting protective film formation film can be only For one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In the case of using colorant (I), the colorant (I) of thermosetting protective film formation film if content according to mesh Suitable adjusting.E.g., including protective film passes through and adjusts thermosetting property protection by the way that laser irradiation implements lettering the case where The content of the colorant (I) of film formation film and the translucency for adjusting protective film, can adjust lettering visibility.In addition, By adjusting the content of the colorant (I) of thermosetting protective film formation film, the design of protective film can also be improved and made The grinding trace for obtaining back surface of semiconductor wafer is not readily apparent.If it is considered that this point, then in protective film formation composition (III- 1) in, the content of colorant (I) relative to the total content of the whole components in addition to solvent ratio (that is, thermosetting protective film Form the content of the colorant (I) of film) it is preferably 0.1~10 mass %, more preferably 0.1~7.5 mass %, particularly preferred For 0.1~5 mass %.Above-mentioned content by making colorant (I) is above-mentioned lower limiting value or more, can significantly more obtain and use Effect caused by toner (I).In addition, by make colorant (I) above-mentioned content be above-mentioned upper limit value hereinafter, can inhibit thermosetting The translucency of property protective film formation film excessively reduces.
[universal additive (J)]
Protective film forms composition (III-1) and thermosetting protective film formation can not damage effect of the present invention with film In the range of contain universal additive (J).
Universal additive (J) can be well known additive, can select, be not particularly limited according to purpose and arbitrarily, make For preferred universal additive, it can be mentioned, for example：Plasticizer, antistatic agent, antioxidant, getter etc..
Universal additive (I) contained by protective film formation composition (III-1) and thermosetting protective film formation film can To be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
Protective film forms the content of the universal additive (I) with composition (III-1) and thermosetting protective film formation film It is not particularly limited, it can be according to purpose suitable for selection.
[solvent]
Protective film formation composition (III-1) preferably further contains solvent.Protective film formation group containing solvent The operability for closing object (III-1) is good.
Above-mentioned solvent is not particularly limited, as preferred above-mentioned solvent, it can be cited for example that：The hydrocarbon such as toluene, dimethylbenzene； The alcohol such as methanol, ethyl alcohol, 2- propyl alcohol, isobutanol (2- methylpropane -1- alcohol), n-butyl alcohol；The esters such as ethyl acetate, butyl acetate；Third The ketone such as ketone, methyl ethyl ketone；The ethers such as tetrahydrofuran；The amides such as the dimethylformamide, N-Methyl pyrrolidone (chemical combination with amido bond Object) etc..
Solvent contained by protective film formation composition (III-1) can be only one kind, or and it is two or more, it is two Kind or more in the case of, combination thereof and ratio can be selected arbitrarily.
From can more uniformly ingredient mixing aspect will be contained in protective film formation composition (III-1), protect It is preferably methyl ethyl ketone etc. that cuticula, which is formed with the solvent contained by composition (III-1),.
The manufacturing method > > of < < thermosetting protective film formation compositions
The thermosetting protective films formation such as protective film formation composition (III-1) composition can be by coordinating for constituting Its each ingredient and obtain.
Coordinate order of addition when each ingredient to be not particularly limited, two or more ingredients can also be added simultaneously.
It, can be by solvent be mixed with the arbitrary gradation composition other than solvent by the cooperation in the case of using solvent It uses, the arbitrary gradation composition other than solvent can not also be diluted in advance after ingredient beforehand dilution, but by will be molten Agent is mixed with these gradation compositions and is used.
For the method that each ingredient mixes is not particularly limited when cooperation, from so that stirrer or agitating paddle etc. is rotated and into In method well known to the mixed method of row, the method mixed using method that mixer is mixed, application ultrasonic wave etc. Appropriate selection.
The temperature and time when addition and mixing of each ingredient is not as long as in the case where causing each gradation composition to deteriorate It is not particularly limited, it is appropriate to adjust, but preferable temperature is 15~30 DEG C.
Energy ray-curable protective film formation film
Energy ray-curable protective film formation film contains energy ray-curable ingredient (a).
Energy ray-curable ingredient (a) is preferably uncured, preferably have adhesiveness, more preferably it is uncured and with bonding Property.Here, " energy line " and " energy ray-curable " as previously described.
< < energy ray-curable protective films, which are formed, uses composition > >
Energy ray-curable protective film formation film can use the energy ray-curable protective film containing its constituent material Formation composition and formed.For example, applying energy line in the formation object surface of energy ray-curable protective film formation film Curability protective film formation composition, makes it dry as needed, it is possible thereby to form energy ray-curable in target site Protective film formation film.The ingredient that does not gasify under room temperature in energy ray-curable protective film formation composition is to each other Content ratio is usually identical as the content ratio of the mentioned component of energy ray-curable protective film formation film to each other.Here, " room temperature " as previously described.
The coating of energy ray-curable protective film formation composition can carry out according to known methods, can enumerate Such as using Kohler coater, scraper plate coating machine, bar coater, gravure coater, roll coater, roller knife coating machine, curtain stream coating machine, The method of the various coating machines such as die coating machine, knife type coater, silk screen coating machine, Meyer bar coater, kiss coater.
The drying condition of energy ray-curable protective film formation composition is not particularly limited, energy ray-curable protection In the case that film formation composition contains solvent described later, preferably make its heat drying, in this case, it is preferred that for example It is dry under conditions of 70~130 DEG C, 10 seconds~5 minutes.
< protective films, which are formed, uses composition (IV-1) >
As energy ray-curable protective film formation composition, it can be cited for example that containing above-mentioned energy ray-curable at The energy ray-curable protective film of point (a) is formed with composition (IV-1) (in the present specification, sometimes referred to simply as " protective film shape At with composition (IV-1) ") etc..
[energy ray-curable ingredient (a)]
Energy ray-curable ingredient (a) is by energy line irradiates cured ingredient, and for energy line curing Property protective film formation film assign film forming, flexibility etc. ingredient.
As energy ray-curable ingredient (a), it can be cited for example that the weight average molecular weight with energy ray-curable group For 80000~2000000 polymer (a1) and chemical combination that the molecular weight with energy ray-curable group is 100~80000 Object (a2).Above-mentioned polymer (a1) can be that crosslinked polymer has occurred by crosslinking agent in its at least part, can also It is the polymer not crosslinked.
(polymer (a1) that the weight average molecular weight with energy ray-curable group is 80000~2000000)
The polymer (a1) for being 80000~2000000 as the weight average molecular weight with energy ray-curable group, can arrange Citing is such as：By with can with the acrylic polymer (a11) for the functional group that group reacts possessed by other compounds and Energy ray-curable with group and energy ray-curable double bond Isoenergetical line curative group with above-mentioned functional group reactions The acrylic resin (a1-1) that compound (a12) is polymerized.
As the above-mentioned functional group that can be reacted with group possessed by other compounds, it can be mentioned, for example：Hydroxyl, carboxylic Base, amino, substituted-amino (group made of 1 of amino or 2 hydrogen atoms are replaced by the group other than hydrogen atom), epoxy group Deng.Wherein, from the viewpoint of the circuit etch for preventing semiconductor wafer, semiconductor chip etc., preferably above-mentioned functional group is carboxylic Group other than base.
In these, above-mentioned functional group is preferably hydroxyl.
Acrylic polymer (a11) with functional group
As the acrylic polymer (a11) with above-mentioned functional group, it can be mentioned, for example：By with above-mentioned functional group Acrylic monomer and without above-mentioned functional group acrylic monomer copolymerization made of polymer, can also be in addition to these Copolymer obtained from monomer (non-acrylic monomer) other than monomer other than further co-polypropylene acrylic monomer.
In addition, above-mentioned acrylic polymer (a11) can be random copolymer, can also be block copolymer.
As the acrylic monomer with above-mentioned functional group, it can be mentioned, for example：Hydroxyl monomer, contains carboxyl group-containing monomer Amino monomers, monomer containing substituted-amino, containing epoxy based monomers etc..
As above-mentioned hydroxyl monomer, it can be mentioned, for example：(methyl) dihydroxypropyl methyl esters, (methyl) acrylic acid 2- hydroxyls Ethyl ester, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) acrylic acid 2- hydroxybutyls, (first Base) (methyl) hydroxyalkyl acrylates such as acrylic acid 3- hydroxybutyls, (methyl) acrylic acid 4- hydroxybutyls；Vinyl alcohol, alkene Non- (methyl) acrylic compounds unsaturated alcohol such as propyl alcohol (unsaturated alcohol for not having (methyl) acryloyl group skeleton) etc..
As above-mentioned carboxyl group-containing monomer, it can be mentioned, for example：The olefinics unsaturated monocarboxylic acids such as (methyl) acrylic acid, crotonic acid (monocarboxylic acid with ethylenic unsaturated bond)；The olefinics unsaturated dicarboxylic acid such as fumaric acid, itaconic acid, maleic acid, citraconic acid (dicarboxylic acids with ethylenic unsaturated bond)；The acid anhydrides of above-mentioned olefinic unsaturated dicarboxylic acid；Methacrylic acid 2- carboxyl second Ester etc. (methyl) acrylic acid carboxyalkyl ester etc..
The preferred hydroxyl monomer of acrylic monomer, carboxyl group-containing monomer with above-mentioned functional group, more preferable hydroxyl list Body.
The acrylic monomer with above-mentioned functional group for constituting above-mentioned acrylic polymer (a11) can be only one Kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
As the acrylic monomer without above-mentioned functional group, it can be cited for example that：(methyl) methyl acrylate, (first Base) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) Isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) third The own ester of olefin(e) acid, (methyl) heptylacrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (methyl) third Olefin(e) acid n-octyl, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) propylene Sour hendecane base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) acrylic acid tridecyl Ester, (methyl) acrylic acid tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl) Aliphatic acrylate ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) acrylic acid 18 (the first for the chain structure that the carbon atom number that Arrcostab ((methyl) stearyl acrylate) etc. constitutes the alkyl of Arrcostab is 1~18 Base) alkyl acrylate etc..
In addition, as the acrylic monomer without above-mentioned functional group, also it can be mentioned, for example：(methyl) acrylic acid methoxy Base methyl esters, (methyl) methoxyethyl acrylate, (methyl) ethioxy methyl esters, (methyl) ethoxyethyl acrylate etc. (methyl) acrylate containing alkoxyalkyl；Including having for (methyl) phenyl acrylate etc. (methyl) benzyl acrylate etc. (methyl) acrylate of aromatic group；(methyl) acrylamide and its derivative of non-crosslinked property；(methyl) acrylic acid N, (methyl) with tertiary amino of the non-crosslinked property such as N- dimethylamino ethyl esters, (methyl) acrylic acid N, N- dimethylamino propyl ester Acrylate etc..
The acrylic monomer without above-mentioned functional group for constituting above-mentioned acrylic polymer (a11) can be only one Kind, or two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
As above-mentioned non-acrylic monomer, it can be cited for example that：The alkene such as ethylene, norbornene；Vinyl acetate；Benzene Ethylene etc..
The above-mentioned non-acrylic monomer for constituting above-mentioned acrylic polymer (a11) can be only one kind, or Two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In above-mentioned acrylic polymer (a11), relative to the total amount for the structural unit for constituting the polymer, by having The ratio (content) of the amount of structural unit derived from the acrylic monomer of above-mentioned functional group is preferably 0.1~50 mass %, more Preferably 1~40 mass %, particularly preferably 3~30 mass %.By making aforementioned proportion be such range, by above-mentioned third Alkene acids polymers (a11) and above-mentioned energy ray-curable compound (a12) are through above-mentioned acrylic resin obtained from copolymerization (a1-1) in, the curing degree of protective film easily can be adjusted to preferred range by the content of energy ray-curable group.
The above-mentioned acrylic polymer (a11) for constituting above-mentioned acrylic resin (a1-1) can be only one kind, also may be used Think it is two or more, in the case of two or more, combination thereof and ratio can be selected arbitrarily.
In protective film formation in composition (IV-1), the content of acrylic resin (a1-1) is preferably 1~40 matter Measure %, more preferably 2~30 mass %, particularly preferably 3~20 mass %.
Energy ray-curable compound (a12)
Above-mentioned energy ray-curable compound (a12) preferably has one in isocyanate group, epoxy group and carboxyl Kind or it is two or more as can with the group of functional group reactions possessed by above-mentioned acrylic polymer (a11), more preferably With isocyanate group as above-mentioned group.Above-mentioned energy ray-curable compound (a12) is for example made with isocyanate group In the case of above-mentioned group, which is easy have acrylic polymer of the hydroxyl as functional group with above-mentioned (a11) the hydroxyl reacts.
Above-mentioned energy ray-curable compound (a12) has 1~5 above-mentioned energy ray-curable base preferably in 1 molecule Group more preferably has 1~2.
As above-mentioned energy ray-curable compound (a12), it can be mentioned, for example：2- methacryloxyethyl isocyanic acids Ester, isopropenyl-bis (alpha, alpha-dimethylbenzyl) based isocyanate, methacryl isocyanates, allyl isocyanate, 1,1- are (double Acryloyloxymethyl) ethyl isocyanate；
By diisocyanate cpd or polyisocyanate compound and (methyl), Hydroxyethyl Acrylate is reacted and obtains The acryloyl group monoisocyanate compound arrived；
By diisocyanate cpd or polyisocyanate compound, polyol compound and (methyl) dihydroxypropyl second Acryloyl group monoisocyanate compound etc. obtained from ester is reacted.
In these compounds, above-mentioned energy ray-curable compound (a12) is preferably that 2- methacryloxyethyls are different Cyanate.
The above-mentioned energy ray-curable compound (a12) for constituting above-mentioned acrylic resin (a1-1) can be only one kind, Or it is two or more, in the case of being two or more, combination thereof and ratio can be selected arbitrarily.
In above-mentioned acrylic resin (a1-1), relative to the above-mentioned official from above-mentioned acrylic polymer (a11) The content that can be rolled into a ball, the ratio of the content of the energy ray-curable group from above-mentioned energy ray-curable compound (a12) are preferred For 20~120 moles of %, more preferably 35~100 moles of %, particularly preferably 50~100 moles of %.By making above-mentioned content Ratio be such range, the bonding force of the protective film after solidification further increases.It should be noted that in above-mentioned energy line In the case that curability compound (a12) is simple function (with 1 above-mentioned group in 1 molecule) compound, above-mentioned content The upper limit value of ratio is 100 moles of %, but (has 2 in 1 molecule in above-mentioned energy ray-curable compound (a12) to be multifunctional A above above-mentioned group) in the case of compound, the upper limit value of the ratio of above-mentioned content is sometimes more than 100 moles of %.
The weight average molecular weight (Mw) of above-mentioned polymer (a1) is preferably 100000~2000000, more preferably 300000~ 1500000。
Here, described " weight average molecular weight " is as mentioned before.
Above-mentioned polymer (a1) is its at least part in the case that crosslinked polymer has occurred in crosslinking agent, on It can be by being not belonging to be illustrated as the monomer for constituting above-mentioned acrylic polymer (a11) to state polymer (a1) Any one of above-mentioned monomer and it is with the monomer of group reacted with crosslinking agent aggregated and to be reacted with above-mentioned crosslinking agent Compound made of group crosslinking can also be with coming from above-mentioned energy ray-curable compound (a12) with above-mentioned functional group Compound made of the group crosslinking of reaction.
Protective film is formed with the above-mentioned polymer contained by composition (IV-1) and energy ray-curable protective film formation film (a1) it can be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be arbitrary Selection.
(compound (a2) that the molecular weight with energy ray-curable group is 100~80000)
Energy possessed by the compound (a2) for being 100~80000 as the molecular weight with energy ray-curable group Line curative group can enumerate the group for including energy ray-curable double bond, preferably enumerate (methyl) acryloyl group, vinyl Deng.
Above compound (a2) can be enumerated as long as the compound for meeting above-mentioned condition is then not particularly limited：With energy Measure the low molecular weight compound of line curative group, the epoxy resin with energy ray-curable group, with energy line curing The phenolic resin etc. of property group.
As the low molecular weight compound with energy ray-curable group in above compound (a2), it can be mentioned, for example Polyfunctional monomer or oligomer etc., the preferably acrylic ester compound with (methyl) acryloyl group.
As above-mentioned acrylic ester compound, it can be mentioned, for example：2- hydroxyls -3- (methyl) acryloxypropyl Acrylate, polyethylene glycol two (methyl) acrylate, propoxylation Ethoxylated bisphenol A bis- (methyl) acrylate, 2,2- Bis- [4- ((methyl) acryloyl-oxy Quito ethyoxyl) phenyl] propane, Ethoxylated bisphenol A bis- (methyl) acrylate, 2,2- are bis- Bis- [4- (2- (methyl) acryloyloxyethoxy) benzene of [4- ((methyl) acryloxy diethoxy) phenyl] propane, 9,9- Base] fluorenes, bis- [4- ((methyl) the acryloyl-oxy Quito propoxyl group) phenyl] propane of 2,2-, Tricyclodecane Dimethanol two (methyl) propylene Acid esters, 1,10- decanediols two (methyl) acrylate, 1,6-hexylene glycols two (methyl) acrylate, two (first of 1,9- nonanediols Base) acrylate, dipropylene glycol two (methyl) acrylate, tripropylene glycol two (methyl) acrylate, two (first of polypropylene glycol Base) acrylate, polytetramethylene glycol two (methyl) acrylate, ethylene glycol two (methyl) acrylate, diethylene glycol two Bis- [4- ((methyl) acryloyloxyethoxy) benzene of (methyl) acrylate, triethylene glycol two (methyl) acrylate, 2,2- Base] propane, neopentyl glycol two (methyl) acrylate, ethoxylated polypropylene glycol two (methyl) acrylate, 2- hydroxyls -1,3- Two (methyl) acryloxy propane etc. difunctionalities (methyl) acrylate；
Three (2- (methyl) acryloyl-oxyethyl) isocyanuric acid esters, 6-caprolactone are modified three (2- (methyl) acryloyl-oxies Base ethyl) isocyanuric acid ester, ethoxylated glycerol three (methyl) acrylate, pentaerythrite three (methyl) acrylate, three hydroxyls Methylpropane three (methyl) acrylate, double trimethylolpropane four (methyl) acrylate, four (first of ethoxylation pentaerythrite Base) acrylate, pentaerythrite four (methyl) acrylate, more (methyl) acrylate of dipentaerythritol, dipentaerythritol six The multifunctional (methyl) acrylates such as (methyl) acrylate；
Multifunctional (methyl) acrylates oligomer such as carbamate (methyl) acrylate oligomer etc..
As in above compound (a2) the epoxy resin with energy ray-curable group, with energy ray-curable The tree described in such as in the 0043rd section of " Japanese Unexamined Patent Publication 2013-194102 bulletins " can be used in the phenolic resin of group Fat.Such resin also corresponds to constitute the resin of the thermosetting component described below, but in the present invention, as above-mentioned chemical combination Object (a2) processing.
The weight average molecular weight of above compound (a2) is preferably 100~30000, more preferably 300~10000.
Protective film is formed with the above compound contained by composition (IV-1) and energy ray-curable protective film formation film (a2) it can be only one kind, or two or more, in the case of being two or more, combination thereof and ratio can be arbitrary Selection.
[polymer (b) for not having energy ray-curable group]
Protective film formation composition (IV-1) and energy ray-curable protective film formation film are containing above compound (a2) as in the case of above-mentioned energy ray-curable ingredient (a), preferably also further contain and do not have energy ray-curable base The polymer (b) of group.
Above-mentioned polymer (b) can be that crosslinked polymer has occurred by crosslinking agent in its at least part, can also It is the polymer not crosslinked.
As the polymer (b) without energy ray-curable group, it can be mentioned, for example：Acrylic polymer, benzene oxygen Resin, polyurethane resin, polyester, rubber resin, propenoic methyl carbamate resin etc..
In these polymer, above-mentioned polymer (b) is preferably acrylic polymer (hereinafter, sometimes referred to simply as " acrylic acid Type of Collective object (b-1) ").
Acrylic polymer (b-1) can be those of known, such as can be a kind of homopolymerization of acrylic monomer Object can also be the copolymer of two or more acrylic monomers, can also be one or more kinds of acrylic monomers and The copolymer of monomer (non-acrylic monomer) other than one or more kinds of acrylic monomers.
As constitute acrylic polymer (b-1) above-mentioned acrylic monomer, it can be mentioned, for example：(methyl) acrylic acid (the first of Arrcostab, (methyl) acrylate with cyclic skeleton, (methyl) acrylate containing glycidyl, hydroxyl Base) acrylate, (methyl) acrylate etc. containing substituted-amino.Here, described " substituted-amino " is as mentioned before.
As above-mentioned (methyl) alkyl acrylate, it can be cited for example that：(methyl) methyl acrylate, (methyl) acrylic acid Ethyl ester, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) acrylic acid are different Butyl ester, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) heptylacrylate, (methyl) 2-EHA, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid are just pungent Ester, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (methyl) decyl acrylate, (methyl) acrylic acid hendecane Base ester, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) tridecyl acrylate, (methyl) Acrylic acid tetradecane base ester ((methyl) myristyl ester), (methyl) acrylic acid pentadecane base ester, (methyl) acrylic acid ten Six Arrcostabs ((methyl) acrylic acid palm ester), (methyl) acrylic acid heptadecane base ester, (methyl) octadecyl acrylate (methyl) propylene for the chain structure that the carbon atom number that ((methyl) stearyl acrylate) etc. constitutes the alkyl of Arrcostab is 1~18 Acid alkyl ester etc..
As above-mentioned (methyl) acrylate with cyclic skeleton, it can be cited for example that：(methyl) isobomyl acrylate (methyl) the acrylate base esters such as ester, (methyl) dicyclopentanyl acrylate；
(methyl) benzyl acrylate etc. (methyl) acrylic acid aralkyl ester；
(methyl) acrylic acid cyclenes base ester such as (methyl) acrylic acid dicyclopentenyl ester；
(methyl) acrylic acid cyclenes oxygroup Arrcostab such as (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester etc..
As above-mentioned (methyl) acrylate containing glycidyl, it can be cited for example that (methyl) glycidyl Ester etc..
As (methyl) acrylate of above-mentioned hydroxyl, it can be cited for example that：(methyl) dihydroxypropyl methyl esters, (first Base) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) propylene Sour 2- hydroxybutyls, (methyl) acrylic acid 3- hydroxybutyls, (methyl) acrylic acid 4- hydroxybutyls etc..
As above-mentioned (methyl) acrylate containing substituted-amino, it can be mentioned, for example：(methyl) acrylic acid N- methylaminos Ethyl ester etc..
As constitute acrylic polymer (b-1) above-mentioned non-acrylic monomer, it can be mentioned, for example：Ethylene, drop ice The alkene such as piece alkene；Vinyl acetate；Styrene etc..
Crosslinked above-mentioned gathering without energy ray-curable group is had occurred by crosslinking agent as at least part Object (b) is closed, it can be mentioned, for example：Polymer made of reactive functional groups in above-mentioned polymer (b) are reacted with crosslinking agent.
Above-mentioned reactive functional groups are suitably selected according to type of crosslinking agent etc., are not particularly limited.For example, crosslinking In the case that agent is polyisocyanate compound, as above-mentioned reactive functional groups, hydroxyl, carboxyl, amino etc. can be enumerated, at this In a little functional groups, preferably with the hydroxyl with high reactivity of isocyanate group.In addition, the case where crosslinking agent is epoxy compounds Under, as above-mentioned reactive functional groups, carboxyl, amino, amide groups etc. can be enumerated, in these functional groups, preferably and epoxy The carboxyl with high reactivity of base.Wherein, from the viewpoint of the circuit etch for preventing semiconductor wafer, semiconductor chip etc., on It is preferably the group other than carboxyl to state reactive functional groups.
As the polymer (b) without energy ray-curable group with above-mentioned reactive functional groups, example can be enumerated Such as：At least make polymer obtained from the monomer polymerization with above-mentioned reactive functional groups.If it is acrylic polymer (b- 1) the case where, is then enumerated above-mentioned using the monomer with above-mentioned reactive functional groups as to constitute the monomer of the polymer In acrylic monomer and non-acrylic monomer any one or both.For example, being reacted as being used as with hydroxyl The above-mentioned polymer (b) of property functional group, it can be mentioned, for example polymer obtained from (methyl) acrylic ester polymerization by hydroxyl, In addition to this, it can also enumerate by 1 or 2 or more in the above-mentioned acrylic monomer of aforementioned list or non-acrylic monomer Polymer obtained from monomer polymerization made of hydrogen atom is replaced by above-mentioned reactive functional groups.
In the above-mentioned polymer (b) with reactive functional groups, relative to the total of the structural unit for constituting the polymer Amount is preferably 1~20 mass %, more by the ratio (content) of the amount of the structural unit of the monomer derived with reactive functional groups Preferably 2~10 mass %.By making aforementioned proportion be such range, the crosslinked degree in above-mentioned polymer (b) can reach To preferred range.
From the viewpoint of the film forming of protective film formation composition (IV-1) becomes more good, do not have energy line The weight average molecular weight (Mw) of the polymer (b) of curative group is preferably 10000~2000000, more preferably 100000~ 1500000.Here, described " weight average molecular weight " is as mentioned before.
Protective film is formed does not have energy with contained by composition (IV-1) and energy ray-curable protective film formation film The polymer (b) of line curative group can be only one kind, or and it is two or more, in the case of being two or more, they Combination and ratio can arbitrarily select.
As protective film formation with composition (IV-1), can enumerate containing above-mentioned polymer (a1) and above compound (a2) in any one or both composition.Also, contain above compound in protective film formation composition (IV-1) (a2) in the case of, preferably also further contain without energy ray-curable group polymer (b), at this point, further preferably into One step contains above-mentioned (a1).In addition, protective film formation composition (IV-1) can not also be same containing above compound (a2) The above-mentioned polymer of Shi Hanyou (a1) and the polymer (b) without energy ray-curable group.
Protective film is formed with composition (IV-1) containing above-mentioned polymer (a1), above compound (a2) and without energy In the case of the polymer (b) of line curative group, in protective film formation in composition (IV-1), relative to above-mentioned polymer (a1) and 100 mass parts of the total content of the polymer (b) without energy ray-curable group, the content of above compound (a2) Preferably 10~400 mass parts, more preferably 30~350 mass parts.
In protective film formation in composition (IV-1), above-mentioned energy ray-curable ingredient (a) and solid without energy line Change property group polymer (b) total content relative to the ingredient other than solvent total content ratio (that is, energy line curing The above-mentioned energy ray-curable ingredient (a) of property protective film formation film and the polymer (b) without energy ray-curable group Total content) be preferably 5~90 mass %, more preferably 10~80 mass %, particularly preferably 20~70 mass %.Pass through It is such range, the energy of energy ray-curable protective film formation film to make the aforementioned proportion of the content of energy line curability composition Amount line curability can become more good.
Protective film, which is formed, to be used in composition (IV-1) other than above-mentioned energy ray-curable ingredient, can also be according to purpose And containing in thermosetting component, Photoepolymerizationinitiater initiater, packing material, coupling agent, crosslinking agent, colorant and universal additive One or more.For example, by using the protective film shape containing above-mentioned energy ray-curable ingredient and thermosetting component At with composition (IV-1), the bonding force relative to the object that is stuck for being formed by energy ray-curable protective film formation film is logical It crosses heating and improves, the protection film strength formed with film by the energy ray-curable protective film formation also improves.
As protective film formation in composition (IV-1) above-mentioned thermosetting component, Photoepolymerizationinitiater initiater, packing material, Coupling agent, crosslinking agent, colorant and universal additive, can enumerate respectively with energy line curing resin composition (III-1) in Thermosetting component (B), Photoepolymerizationinitiater initiater (H), packing material (D), coupling agent (E), crosslinking agent (F), colorant (I) and logical It is those of identical with additive (J).
Protective film, which is formed, to be used in composition (IV-1), above-mentioned thermosetting component, Photoepolymerizationinitiater initiater, packing material, coupling Agent, crosslinking agent, colorant and universal additive can use individually one kind, can also be used in combination of two or more, combination In the case of two or more uses, combination thereof and ratio can be selected arbitrarily.
Protective film is formed with the above-mentioned thermosetting component in composition (IV-1), Photoepolymerizationinitiater initiater, packing material, coupling Agent, crosslinking agent, colorant and universal additive content suitably adjusted according to purpose, be not particularly limited.
For protective film formation composition (IV-1), from its operability aspect can be improved by dilution, Preferably further contain solvent.
As solvent of the protective film formation contained by composition (IV-1), it can be cited for example that being formed with protective film with combining The identical solvent of solvent in object (III-1).
Solvent contained by protective film formation composition (IV-1) can be only one kind, or two or more.
The manufacturing method > > of < < energy ray-curable protective film formation compositions
Protective film formation composition (IV-1) Isoenergetical line curability protective film formation composition can be by that will be used for It constitutes its each components matching and obtains.
Coordinate order of addition when each ingredient to be not particularly limited, two or more ingredients can also be added simultaneously.
It, can be by solvent be mixed with the arbitrary gradation composition other than solvent by the cooperation in the case of using solvent It uses, the arbitrary gradation composition other than solvent can not also be diluted in advance after ingredient beforehand dilution, but by will be molten Agent is mixed with these gradation compositions and is used.
For the method that each ingredient mixes is not particularly limited when cooperation, from so that stirrer or agitating paddle etc. is rotated and into In method well known to the mixed method of row, the method mixed using method that mixer is mixed, application ultrasonic wave etc. Appropriate selection.
The temperature and time when addition and mixing of each ingredient is not as long as in the case where causing each gradation composition to deteriorate It is not particularly limited, it is appropriate to adjust, but preferable temperature is 15~30 DEG C.
Zero overlay
For above-mentioned overlay, as long as the gloss value on the surface for the side opposite side being in contact with its support chip is 32 ~95, it is not particularly limited.
As preferred overlay, such as preferably comprise the coating of the solidfied material as obtained from energy line irradiation solidification Layer, preferably comprise by energy line irradiate polymerize, make containing energy line polymerizable compound coating composition solidification and Obtained overlay.
Moreover, above-mentioned energy line polymerizable compound is preferably (methyl) acrylic acid or derivatives thereof.
Said protection film formation not only has with composite sheet to be formed for the back side to semiconductor chip obtained from cutting Function as the protective film protected, the function of cutting sheet when can also have both for example as cutting semiconductor chip. Moreover, in the cutting of semiconductor wafer, spread sheet is carried out to the semiconductor wafer for being pasted with protective film formation composite sheet sometimes, In this case, claimed film formation has the flexibility of appropriateness with composite sheet.In order to be assigned with composite sheet to protective film formation The flexibility of appropriateness selects the resin of the softness such as polypropylene sometimes for example, as the material for constituting above-mentioned support chip.Another party Face, the resin etc. of such softness cause to deform or generate fold sometimes because of heating.Therefore, for overlay, It may be said that wish its be can by the composition as raw material by using the solidification that energy line irradiates rather than pass through heat cure To be formed.
The thickness of above-mentioned overlay is not particularly limited, preferably 0.1~20 μm, more preferably 0.4~15 μm, it is especially excellent It is selected as 0.8~10 μm.By making the thickness of overlay be above-mentioned lower limiting value or more, it is easier to reducing overlay with above-mentioned support The surface roughness Ra on the surface for the side opposite side that piece is in contact, and inhibit the adhesion of said protection film formation composite sheet Effect further increase.In addition, by make the thickness of overlay be above-mentioned upper limit value hereinafter, infrared passing through across sheet above When camera etc. is checked with the state of the semiconductor wafer after composite sheet having pasted said protection film formation, it can obtain more Clearly check image, and then can more easily carry out the cutting of the semiconductor wafer with spread sheet.
It should be noted that overlay by covering the male and fomale(M&F) of support chip, the contact surface with support chip as described above It can be formed as male and fomale(M&F), the thickness of overlay can be at the position, convex with this of the protrusion during overlay is comprising the male and fomale(M&F) The top in portion is calculated as a starting point.
The surface roughness Ra on the surface for the side opposite side of above-mentioned overlay being in contact with above-mentioned support chip is preferably 0.5 μm or less, more preferably 0.4 μm or less, further preferably 0.3 μm or less, particularly preferably 0.2 μm or less.By making The above-mentioned surface roughness Ra of overlay is above-mentioned upper limit value hereinafter, laser lettering can more clearly be carried out to protective film.
In addition, the surface roughness Ra on the surface for the side opposite side of above-mentioned overlay being in contact with above-mentioned support chip Lower limiting value is not particularly limited, such as can be set as 0.005 μm etc..
For the above-mentioned surface roughness Ra of overlay, such as can have overlay side by support chip The surface roughness Ra on surface, the thickness of overlay, be used to form overlay coating composition described later coating side Method etc. is adjusted.
[thickness (μm) of overlay] of above-mentioned overlay/[surface on the surface for having overlay side of support chip is thick Rugosity Ra (μm)] value be preferably 0.1~30, more preferably 0.3~20, particularly preferably 0.5~10.By making above-mentioned value be More than above-mentioned lower limiting value, the surface roughness Ra on the surface for the side opposite side of overlay being in contact with above-mentioned support chip is into one Step reduces, and can more clearly carry out laser lettering to protective film, in addition, inhibiting the adhesion of said protection film formation composite sheet Effect further increase.In addition, by making above-mentioned value for above-mentioned upper limit value hereinafter, the thickness that can avoid overlay is superfluous.
The gloss on the surface of side (the above-mentioned support chip side) opposite side of above-mentioned overlay being in contact with above-mentioned support chip Value is 32~95, is preferably 40~90, is more preferably 45~85.By making the above-mentioned gloss value of overlay be such range, Laser lettering can more clearly be carried out to protective film.In addition, by make overlay above-mentioned gloss value be above-mentioned lower limiting value with On, across sheet above by infrared camera etc. to the shape of the semiconductor wafer after having pasted said protection film formation composite sheet When state is checked, clearer check image can be obtained.Moreover, by making the above-mentioned gloss value of overlay be the above-mentioned upper limit Value can inhibit the luminous phenomenon of overlay hereinafter, when similarly checking the state of semiconductor wafer, to be easier The visuognosis of check image is carried out using infrared camera.
Protective film formation composite sheet from above-mentioned overlay side measure mist degree measured value be preferably 47% or less, it is more excellent It is selected as 1~47%, further preferably 2~40%, particularly preferably 3~30%.By making protective film formation composite sheet Above-mentioned mist degree is above-mentioned upper limit value hereinafter, the scattering of light is can inhibit, so as to more clearly carry out laser lettering to protective film. In addition, across sheet above by infrared camera etc. to the semiconductor wafer after having pasted said protection film formation composite sheet When state is checked, clearer check image can be obtained.Here, the above-mentioned mist degree of protective film formation composite sheet measures Value refers to, in protective film formation composite sheet, from the side opposite side being in contact with above-mentioned support chip of above-mentioned overlay The value for the mist degree that the direction on surface measures.
It should be noted that above-mentioned mist degree is the value measured based on 7136 standards of JIS K.
The various characteristics such as the gloss value of above-mentioned overlay for example can by the thickness of overlay, be used to form overlay after The coating composition of text narration is adjusted containing ingredient etc..
Protective film formation composite sheet from above-mentioned overlay side measure mist degree measured value for example can by overlay, The thickness of each layer of the composition protective film formation composite sheet of support chip etc. is used to form the composition of above layers (after for example, The coating composition of text narration) be adjusted containing ingredient etc..
< < coating composition > >
Above-mentioned coating composition is preferably comprised selected from silicon dioxide gel and is bonded with containing free-radical polymerised unsaturation Any one of silicon dioxide microparticle of organic compound of group or both (α) (hereinafter, sometimes referred to simply as " ingredient (α) "), And selected from one or more of polyfunctional acrylate's class monomer and esters of acrylic acid prepolymer (β) (hereinafter, sometimes referred to as For " ingredient (β) ").
[ingredient (α)]
Mentioned component (α) is while said protection film to be made to be formed with compound for making the refractive index of above-mentioned overlay reduce The cure shrinkage and the wet shrinkage of heat of piece reduce, to inhibit the protective film formation caused by these shrink to be produced with composite sheet The ingredient of raw curling.
As the silicon dioxide gel in ingredient (α), it can be cited for example that silicon dioxide microparticle in alcohol, derive from ethylene glycol The organic solvents such as ether (cellosolve) in suspended with colloidal state made of colloidal silicon dioxide.The above-mentioned silica that left floating The average grain diameter of particle is preferably 0.001~1 μm, more preferably 0.03~0.05 μm.
The silicon dioxide microparticle for being bonded with the organic compound containing free-radical polymerised unsaturated group in ingredient (α) It is crosslinked and cures by energy line irradiates.
It, can as the above-mentioned silicon dioxide microparticle for being bonded with the organic compound containing free-radical polymerised unsaturated group To enumerate for example：It is present in the silanol group on the surface of silicon dioxide microparticle in having containing free-radical polymerised unsaturated group The average grain diameter of silicon dioxide microparticle made of functional group reactions in machine compound, the silicon dioxide microparticle is preferably 0.005 ~1 μm.As long as the above-mentioned functional group in the organic compound containing free-radical polymerised unsaturated group can be micro- with silica Above-mentioned silanol group reaction in grain, is not particularly limited.
As the organic compound containing free-radical polymerised unsaturated group with above-mentioned functional group, example can be enumerated The compound that such as the following general formula (1) indicates.
[chemical formula 1]
(in formula, R1For hydrogen atom or methyl；R2Represented by the arbitrary general formula in halogen atom or following formula (2a)~(2f) Group.)
[chemical formula 2]
As R2In above-mentioned halogen atom, it can be cited for example that chlorine element, bromine atom, iodine atom etc..
As the preferred above-mentioned organic compound containing free-radical polymerised unsaturated group, it can be cited for example that：(first Base) acrylic acid, (methyl) acryloyl chloride, (methyl) acrylic acid 2- isocyanatoethyls, (methyl) glycidyl acrylate, (methyl) acrylic acid 2,3- imino groups propyl ester, (methyl) acrylic acid 2- hydroxy methacrylates, (3- (methyl) acryloxypropyl) three Methoxy silane etc..
In present embodiment, the above-mentioned organic compound containing free-radical polymerised unsaturated group can be used alone one Kind, it can also be used in combination of two or more.
In ingredient (α), silicon dioxide gel and it is bonded with the organic compound containing free-radical polymerised unsaturated group Silicon dioxide microparticle respectively can be only one kind, or it is two or more.
As ingredient (α), silicon dioxide gel can be used only, above-mentioned be bonded with containing radical polymerization can also be used only The silicon dioxide microparticle of the organic compound of conjunction property unsaturated group, can also contain silicon dioxide gel and above-mentioned be bonded with There is the silicon dioxide microparticle of the organic compound of free-radical polymerised unsaturated group to be applied in combination.
The content of the ingredient (α) of above-mentioned coating composition is preferably selected according to the refractive index of above-mentioned support chip, usually The content of the silica for coming from ingredient (α) of preferably above-mentioned overlay reaches the amount of 20~60 mass %.By making two The above-mentioned content of silica is above-mentioned lower limiting value or more, the effect for making the refractive index of overlay reduce and the above-mentioned protection of inhibition Film formation is further increased with the effect for generating curling in composite sheet.In addition, by making the above-mentioned content of silica be above-mentioned Upper limit value is hereinafter, the formation of overlay becomes easier to, and the effect for inhibiting the hardness of overlay to reduce further increases.
Volume from the refractive index, formation easiness and hardness and protective film formation composite sheet of above-mentioned overlay Bent generation inhibition becomes better aspect and sets out, and the content of the silica for coming from ingredient (α) of overlay is more preferable For 20~45 mass %.
[ingredient (β)]
Mentioned component (β) is the main photo-curable ingredient to form above-mentioned overlay.
Mentioned component (β) as long as in 1 molecule of polyfunctional acrylate's class monomer in have 2 or more (methyl) (methyl) acrylic acid derivative of acryloyl group, is not particularly limited.
As preferred above-mentioned polyfunctional acrylate's class monomer, it can be cited for example that：1,4- butanediols two (methyl) Acrylate, 1,6-hexylene glycols two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, polyethylene glycol two (methyl) Acrylate, hydroxyl trimethylace tonitric neopentyl glycol two (methyl) acrylate, two (methyl) dicyclopentanyl acrylates, caprolactone Modified two (methyl) acrylic acid dicyclopentenyl esters, ethylene-oxide-modified di(2-ethylhexyl)phosphate (methyl) acrylate, two (first of allylation Base) cyclohexyl acrylate, triisocyanate two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, two seasons Penta tetrol three (methyl) acrylate, propionic acid are modified dipentaerythritol three (methyl) acrylate, pentaerythrite three (methyl) third Olefin(e) acid ester, epoxy pronane modification trimethylolpropane tris (methyl) acrylate, three (acrylyl oxy-ethyl) triisocyanates, two Pentaerythrite five (methyl) acrylate, propionic acid are modified dipentaerythritol five (methyl) acrylate, six (first of dipentaerythritol Base) acrylate, caprolactone modification dipentaerythritol six (methyl) acrylate etc..
Mentioned component (β) as long as in esters of acrylic acid prepolymer have photo-curable (methyl) acrylic ester polymerization Object or oligomer, are not particularly limited.
As preferred above-mentioned esters of acrylic acid prepolymer, it can be cited for example that：Polyester acrylates prepolymer, epoxy Esters of acrylic acid prepolymer, urethane acrylate class prepolymer, polyalcohol acrylate class prepolymer etc..
As above-mentioned polyester acrylates prepolymer, it can be cited for example that：Condensation by polyacid and polyalcohol is anti- Obtained from answering, with (methyl) acrylic acid to two ends of molecule have hydroxyl polyester oligomer hydroxyl be esterified and Obtained polyester acrylates prepolymer；It is obtained with (methyl) acrylic acid to making oxyalkylene and polyacid carry out addition reaction To oligomer terminal hydroxyl be esterified obtained from polyester acrylates prepolymer etc..
As above-mentioned Epoxy Acrylates prepolymer, it can be cited for example that：By making (methyl) acrylic acid and relatively low point Propylene oxide obtained from the epoxide ring reaction of the bisphenol-type epoxy resin or phenolic resin varnish type epoxy resin of son amount is esterified Esters of gallic acid prepolymer.
As above-mentioned urethane acrylate class prepolymer, it can be cited for example that：By with (methyl) acrylic acid pair Urethane acrylate class prepolymer obtained from urethane oligomer is esterified, the urethane oligomer are to pass through Obtained from the reacting of polyether polyol or polyester polyol and polyisocyanates.
As above-mentioned polyalcohol acrylate class prepolymer, it can be cited for example that：With (methyl) acrylic acid to polyether polyols Polyalcohol acrylate class prepolymer obtained from the hydroxyl of alcohol is esterified.
In ingredient (β), above-mentioned polyfunctional acrylate's class monomer and esters of acrylic acid prepolymer can be only one respectively Kind, or it is two or more.
As ingredient (β), above-mentioned polyfunctional acrylate's class monomer can be used only, above-mentioned propylene can also be used only Above-mentioned polyfunctional acrylate's class monomer and esters of acrylic acid prepolymer can also be applied in combination for esters of gallic acid prepolymer.
[solvent]
Above-mentioned coating composition preferably further contains solvent other than ingredient (α) and ingredient (β).By making coating group It closes object and contains solvent, as described hereinafter, coating coating composition can be easier and made it dry, be used to form to be formed The film of overlay.
Above-mentioned solvent can be used alone, and can also be used in combination of two or more.
As above-mentioned solvent, it can be cited for example that：The aliphatic hydrocarbons such as hexane, heptane, hexamethylene；The fragrance such as toluene, dimethylbenzene Hydrocarbon；The halogenated hydrocarbons such as dichloromethane, vinyl chloride；The alcohol such as methanol, ethyl alcohol, propyl alcohol, butanol, 1- methoxy-2-propanols；Acetone, first and second The ketone such as ketone, 2 pentanone, isophorone, cyclohexanone；The esters such as ethyl acetate, butyl acetate；Cellosolvo (ethyl cellosolve) Equal cellosolves etc..
[any ingredient]
For above-mentioned coating composition, other than ingredient (α) and ingredient (β), effect of the present invention is not being damaged In range, mono-functional's acrylic ester monomer can also be contained, Photoepolymerizationinitiater initiater, photosensitizer, polymerization inhibitor, crosslinking agent, resisted The various any ingredients such as oxygen agent, ultra-violet absorber, light stabilizer, levelling agent, defoaming drug.
Above-mentioned any ingredient can be used alone, and can also be used in combination of two or more.
(mono-functional's acrylic ester monomer)
Above-mentioned mono-functional's acrylic ester monomer as any ingredient is photo-curable ingredient, as long as at 1 point (methyl) acrylic acid derivative only in son with 1 (methyl) acryloyl group, is not particularly limited.
As preferred above-mentioned mono-functional's acrylic ester monomer, it can be cited for example that：(methyl) cyclohexyl acrylate, (methyl) 2-EHA, (methyl) dodecylacrylate ((methyl) lauryl acrylate), (methyl) propylene Sour stearyl ((methyl) stearyl acrylate), (methyl) isobornyl acrylate etc..
(Photoepolymerizationinitiater initiater)
As the above-mentioned Photoepolymerizationinitiater initiater of any ingredient, can enumerate previous used known for free radical polymerization Photoepolymerizationinitiater initiater.
As preferred above-mentioned Photoepolymerizationinitiater initiater, it can be cited for example that：Acetophenone compounds, benzophenone chemical combination Object, alkyl amino benzophenone compound, benzil class based compound, benzoin class compound, benzoin ethers compound, The aryl ketones light such as benzyl dimethyl ketal class compound, benzoyl benzoate compounds, α-acyl group oxime ester compound are poly- Close initiator；The sulfur-bearings class Photoepolymerizationinitiater initiater such as thio-ether type compounds, thioxanthene ketone class compound；The acyls such as acyl group diaryl phosphine oxide Base phosphine oxide-type compound；Anthraquinone analog compound etc..
It should be noted that in the case of keeping above-mentioned coating composition cured by electron beam irradiation, photopolymerization is not needed Initiator.
In above-mentioned coating composition, relative to 100 mass parts of total content of photo-curable ingredient, Photoepolymerizationinitiater initiater contains Amount is preferably 0.2~10 mass parts, more preferably 0.5~7 mass parts.
(photosensitizer)
As above-mentioned photosensitizer, it can be cited for example that tertiary amines, ESCAROL 507 ester, mercaptan based sensitisers Deng.
In above-mentioned coating composition, relative to 100 mass parts of total content of photo-curable ingredient, the content of photosensitizer is preferred For 1~20 mass parts, more preferably 2~10 mass parts.
(antioxidant, ultra-violet absorber, light stabilizer)
Above-mentioned antioxidant, ultra-violet absorber and light stabilizer can be it is well known those, but preferably intramolecular has (first Base) acryloyl group etc. response type antioxidant, ultra-violet absorber and light stabilizer.These antioxidant, ultra-violet absorber And light stabilizer can inhibit due to being bonded on the polymer chain formed by energy line irradiates due to the process of time The loss from cured layer can play the function of these ingredients for a long time.
Above-mentioned coating composition preferably comprises silicon dioxide gel as ingredient (α), is further preferably hanged with colloidal state The silicon dioxide gel that the average grain diameter of the silicon dioxide microparticle floated is 0.03~0.05 μm.
By making above-mentioned overlay contain such silicon dioxide gel, inhibit the viscous of said protection film formation composite sheet Effect even further increases.Moreover, in above-mentioned overlay, compared to other regions, in the table with support chip side opposite side There are more such silicon dioxide gels in face and its near zone, unevenly exist due to such, inhibit above-mentioned guarantor The effect of the adhesion of cuticula formation composite sheet further increases.In above-mentioned overlay, in order to make silicon dioxide gel etc. contain Exist with there are uneven components, the coating condition of above-mentioned coating composition can be adjusted.
The manufacturing method > > of < < coating compositions
Coating composition can for example pass through gradation composition (α) and ingredient (β) Isoenergetical line polymerizable compound, Yi Jigen It is obtained according to ingredient other than the above to be used etc. is needed for constituting each ingredient of coating composition.For coating composition Speech, such as other than this different point of gradation composition, can be according to above-mentioned adhesive composition the case where same method and It obtains.
It, can be by solvent be mixed with the arbitrary gradation composition other than solvent by the cooperation in the case of using solvent It uses, the arbitrary gradation composition other than solvent can not also be diluted in advance after ingredient beforehand dilution, but by will be molten Agent is mixed with these gradation compositions and is used.
The ingredient other than solvent in coating composition is soluble in solvent, can not also be dissolved and is scattered in solvent In.Moreover, for the concentration of each ingredient of coating composition, viscosity, as long as coating composition can be applied, it is right It is not particularly limited.
The manufacturing method of ◎ protective film formation composite sheets
The protective film formation of present embodiment can be manufactured as follows with composite sheet：Use said protection film formation composition Protective film formation film is formed, forms overlay using above-mentioned coating composition, then successively by overlay, support chip and protective film Formation is laminated with film.
In the case that support chip is made up of multiple layers, support chip is made as long as these are multilayer laminated.For example, support Piece is that in the case that base material and adhesive phase are laminated, can form adhesive phase using above-mentioned adhesive composition.
Constitute the formation sequence of each layer (overlay, support chip, protective film formation film) of protective film formation composite sheet It is not particularly limited.In addition, can be with the state of protective film formation composite sheet in phase by being formed for composition of above layers In addition the progress directly on a surface of adjacent layer, can also use stripping film (stripping film) and carry out on the surface thereof, and by the shape At layer fit in the state of protective film formation composite sheet the surface of adjacent layer.But support chip with have protect In the case that the face (back side) of face (surface) opposite side of cuticula formation film is male and fomale(M&F), in order to inhibit in overlay and support Space part is generated between the male and fomale(M&F) (back side) of piece, overlay is preferably directly coated with coating composition on the male and fomale(M&F) of support chip And it is formed.
Hereinafter, being illustrated for an example of the preferable production process of protective film formation composite sheet.
It is preferred that forming overlay by the following method, that is, support chip male and fomale(M&F) (in Fig. 1 and 2, be support chip 10 Back side 10b, i.e. base material 11 back side 11b) on coating coating composition and make it dry, make to be formed by film as needed Solidification.
Coating of the coating composition to object surface can carry out according to known methods, it can be cited for example that using air knife Coating machine, scraper plate coating machine, bar coater, gravure coater, roll coater, roller knife coating machine, curtain stream coating machine, die coating machine, scraper The method of the various coating machines such as coating machine, silk screen coating machine, Meyer bar coater, kiss coater.
In the case where being coated with coating composition on the male and fomale(M&F) of support chip, preferably inhibit in the recessed of overlay and support chip Space part is generated between convex surface.By inhibiting the generation of above-mentioned space part, can inhibit in the male and fomale(M&F) of overlay and support chip The diffusing reflection of borderline light, so as to more clearly carry out laser lettering on the surface of protective film.
In order to inhibit the generation of above-mentioned space part, such as it is preferable to use the small coating compositions of viscosity.In addition, containing energy The coating composition of line polymerizable compound is normally more suitable for inhibiting the generation of above-mentioned space part.
The drying condition of coating composition is not particularly limited, and coating composition is preferably thermally dried, in this case, Such as it is preferably made it dry under conditions of 70~130 DEG C, 0.5~5 minute.
The condition of cure of the film formed by coating composition is not particularly limited, and carries out according to known methods.
By energy line irradiation carry out it is cured in the case of, such as irradiation ultraviolet light when, can be used as ultraviolet source High-pressure sodium lamp, melting H lamps or xenon lamp etc., exposure is preferably set to 100~500mJ/cm2To be irradiated.On the other hand, The case where if it is irradiating electron beam, then preferably generates electron beam by electron-beam accelerator etc., exposure is preferably set to 150 ~350kV is irradiated.Wherein, the formation of overlay is preferably carried out by ultraviolet light irradiation.
It, can be in the table for the base material for having overlay in the case that support chip is, for example, base material and adhesive phase is laminated Face (being the surface 11a of base material 11 in Fig. 1 and 2) is directly coated with adhesive composition to form adhesive phase.But it is usually excellent Choosing for example on the lift-off processing face of stripping film using applying adhesive composition and making it dry and form adhesive phase, by institute The adhesive phase of formation is fitted in the surface of base material, removes above-mentioned stripping film etc., is additionally formed adhesive phase and is fitted in The method on the surface of base material.
Adhesive composition may be used the same method of the case where with coating composition and be applied to object surface.
Adhesive composition after coating can make its crosslinking by heating, this can also be simultaneous using the crosslinking that heating carries out Make drying to carry out.Heating condition can for example be set as 100~130 DEG C, 1~5 minute, and but not limited to this.
Support chip is that the case where being made of 1 layer (single layer) and for example, base material and adhesive phase are only made of etc. base material Be laminated etc. under the either case in the case of being made up of multiple layers, can the support chip for having overlay surface (Fig. 1 and It is the surface 10a of support chip 10 in 2, i.e. the surface 12a of adhesive phase 12) it is directly coated with protective film formation composition and is formed Protective film formation film.But with the above-mentioned adhesive phase the case where in the same manner as, it is usually preferred to using the lift-off processing in stripping film Protective film formation composition is applied on face and makes it dry and forms protective film formation film, then the protective film of formation is formed Fit in the surface of support chip with film, remove above-mentioned stripping film etc. as needed, be additionally formed protective film formation film and by its The method for fitting in the surface of support chip.
The same method of the case where protective film formation may be used with composition with coating composition is coated on object surface.
The case where drying condition of protective film formation composition is not particularly limited, may be used with coating composition is same The method of sample makes it dry.
Support chip is in the case of being laminated by base material and adhesive phase, and the protective film of present embodiment is formed with compound Piece can also be manufactured using the method other than the above method.For example, forming adhesive phase using above-mentioned adhesive composition, making Protective film formation film is formed with said protection film formation composition, then by above-mentioned adhesive phase and protective film formation film It overlaps and laminated body is made, the surface (the surface 11a of the base material 11 in Fig. 1 and 2) for the base material for having overlay is made to fit in The surface (face that protective film formation film is not set of adhesive phase) of the above-mentioned adhesive phase of the laminated body, it is possible thereby to manufacture Protective film formation composite sheet.
The case where formation condition of adhesive phase and protective film formation film in this case is with the above method is identical.
Support chip with the face (back side) of face (surface) opposite side for having protective film formation film be not male and fomale(M&F) but In the case of even surface, the protective film formation of present embodiment with composite sheet can also in aforementioned manners other than method make It makes.It is that the overlay fits in the even surface of support chip and stacking is made for example, forming overlay using above-mentioned coating composition On the other hand body forms protective film formation film with composition using said protection film formation, makes the protective film formation film The exposed surface (face that overlay is not set of support chip) for fitting in the support chip of above-mentioned laminated body, it is possible thereby to manufacture protective film Formation composite sheet.The overlay and protective film formation film being additionally formed can also be with above-mentioned phases to the coating squence of support chip Instead, then overlay can also be made to fit in support chip by making protective film formation fit in film a surface of support chip Another surface (face that protective film formation film is not set of support chip) manufacture protective film formation composite sheet.
Furthermore it is also possible to form protective film using said protection film formation composition on a surface of support chip On the other hand formation film forms overlay, and the overlay is made to fit in above-mentioned support chip using above-mentioned coating composition Exposed surface (face that protective film formation film is not set of support chip) manufacture protective film formation composite sheet.
The case where formation condition of overlay and protective film formation film in the case of these is with the above method is identical.
For example, manufacture it is as shown in Figure 1 when overlooked with composite sheet protective film formation down from above, protection In the case that the surface area of film formation film is less than the protective film formation composite sheet of the surface area of adhesive phase, in above-mentioned system It makes in method, as long as the protective film formation for being first cut into given size and shape in advance is set to film on adhesive phase.
The application method of ◎ protective film formation composite sheets
The application method of the protective film formation composite sheet of present embodiment is for example as shown below.
Firstly, for protective film formation film be it is heat cured in the case of protective film formation composite sheet application method It illustrates.
In this case, the protective film that the back side of semiconductor wafer is pasted on to protective film formation composite sheet first is formed and is used On film, while protective film formation is fixed on cutter device with composite sheet.
Then, so that protective film formation is cured with film by heating and obtain protective film.In the surface (electrode of semiconductor wafer Forming face) be pasted with back grinding tape (back grinding tape) in the case of, usually removing the back of the body from semiconductor wafer Protective film is formed after mill adhesive tape.
Then, cutting semiconductor chip and obtain semiconductor chip.Can also since forming protective film to being cut In a period of being segmented into only, laser is irradiated from the overlay side of protective film formation composite sheet to protective film, in protective film Surface carries out lettering.In this case, as previously described, by the side phase being in contact with support chip for making overlay The gloss value in the face (back side) tossed about is in particular range as described above, so as to clearly carry out laser print to protective film Word.
In addition, for before cutting semiconductor wafer, cut obtained from semiconductor chip, sometimes with Infrared camera etc. checks its state from carrying out from its back side (face for having pasted protective film formation composite sheet) side.For example, If it is semiconductor chip, then check that it there are the breakages such as N/D, fracture sometimes.
On the other hand, in the semiconductor chip with protective film of present embodiment, as described above, by making overlay The side opposite side being in contact with support chip face (back side) gloss value be particular range as described above in, in addition, Between overlay and the above-mentioned back side of support chip, the generation of space part is inhibited.Therefore, using infrared camera etc. from coating It is clear due to that can obtain when semiconductor wafer, semiconductor chip are observed with composite sheet across protective film formation in layer side Check image, therefore inspection can be accurately proceed.
Then, semiconductor chip is removed together from support chip with the protective film for being pasted on its back side, is picked up, by This obtains the semiconductor chip with protective film.For example, support chip is laminated by base material and adhesive phase and above-mentioned adhesive phase In the case of for energy ray-curable, adhesive phase is set to cure by energy line irradiation, it will from the adhesive phase after the solidification Semiconductor chip picks up together with the protective film for being pasted on its back side, thus can more easily obtain the semiconductor core with protective film Piece.
For example, using protective film formation shown in FIG. 1 composite sheet 1, by protective film formation composite sheet 1 Protective film formed and pasted with the back side of film 13 and semiconductor wafer, while the support chip of exposing 10 (adhesive phase 12) being pasted In cuttings such as ring frames with fixture (illustration omitted), to which protective film formation composite sheet 1 is fixed on cutter device.Then, After so that the solidification of protective film formation film 13 is obtained protective film, laser lettering is carried out to protective film, is then cut, and root It is regions curing other than the stickup position relative to above-mentioned fixture of adhesive phase 12 according to needing to make by irradiation energy line, so The semiconductor chip with protective film is picked up afterwards.In this way, using the guarantor that adhesive phase 12 is energy ray-curable It in the case that cuticula is formed with composite sheet 1, needs to be adjusted so that the composite sheet will not be removed from above-mentioned fixture, not make to glue The specific region of mixture layer 12 cures.On the other hand, using protective film formation composite sheet 1, without in addition setting Set the composition for the composite sheet to be pasted on to above-mentioned fixture.
In contrast, using protective film formation shown in Fig. 2 composite sheet 2, protective film is formed with multiple The protective film for closing piece 2 forms the back side stickup for using film 23 with semiconductor wafer, while fixture adhesive layer 16 is pasted on ring The cuttings such as shape frame are with fixture (illustration omitted), to which protective film formation composite sheet 2 is fixed on cutter device.Then, make guarantor After the solidification of cuticula formation film 23 obtains protective film, laser lettering is carried out to protective film, is then cut, and according to need The semiconductor chip with protective film is picked up after irradiation energy line makes adhesive phase 12 cure.In this way, Using protective film formation composite sheet 2 that adhesive phase 12 is energy ray-curable, formed with protective film is used With difference the case where composite sheet 1, need not be adjusted in order not to make the specific region of adhesive phase 12 be cured.It is another Aspect is different with composite sheet 1 from protective film formation as protective film formation composite sheet 2, it is necessary to be to have fixture bonding agent The composite sheet of layer 16.By having fixture adhesive layer 16, the layer of wide in range composition can be selected as adhesive according to purpose Layer 12.
Then, the use of the protective film formation composite sheet in the case of being energy ray-curable with film to protective film formation Method illustrates.
In this case, in the same manner as being heat cured situation with above-mentioned protective film formation film first, by semiconductor wafer The back side be pasted on the protective film formation film of protective film formation composite sheet, while protective film formation being fixed with composite sheet In cutter device.
Then, become protective film by energy line irradiation makes protective film formation film cure.In the table of semiconductor wafer In the case that face (electrode forming surface) is pasted with back grinding tape, usually formed after removing the back grinding tape from semiconductor wafer Protective film.
Then, cutting semiconductor chip and obtain semiconductor chip.Can also since forming protective film to being cut In a period of being segmented into only, laser is irradiated from the overlay side of protective film formation composite sheet to protective film, in protective film Surface carries out lettering.Can be that heat cured situation is same with above-mentioned protective film formation film until the lettering to cutting Ground carries out, with the situation likewise it is possible to clearly carry out laser lettering to protective film, so as to contour using infrared camera Checked to precision.
Then, semiconductor chip is removed together from support chip with the protective film for being pasted on its back side and is picked up, thus Obtain the semiconductor chip with protective film.
This method is specially suitable in the case of for example using following protective film formation composite sheets：As the guarantor Cuticula formation composite sheet, support chip are laminated by base material and adhesive phase, and above-mentioned adhesive phase cures for non-energy line Property.It should be noted that herein for making protective film formation film cure by energy line irradiation, then cutting semiconductor is brilliant Piece, then the case where semiconductor chip of pick-up tape protective film, are illustrated, but above-mentioned adhesive phase is non-energy line curability In the case of, the solidification of protective film formation film carried out by irradiation by energy line can also be before picking up semiconductor chip Any stage carry out.
For example, be laminated by base material and adhesive phase using support chip and above-mentioned adhesive phase be energy ray-curable Protective film formation composite sheet in the case of, method preferably described below.
That is, first, in the same manner as the above situation, the back side of semiconductor wafer is pasted on protective film formation composite sheet On protective film formation film, while protective film formation is fixed on cutter device with composite sheet.
Then, from the overlay side of protective film formation composite sheet to protective film irradiate laser, the surface of protective film into Row lettering, then cutting semiconductor chip and semiconductor chip is made.It, can be with above-mentioned protective film until the lettering to cutting Formation is that heat cured situation is carried out similarly with film, with the situation likewise it is possible to clearly carry out laser print to protective film Word, so as to be accurately proceed inspection using infrared camera etc..
Then, by by energy line irradiation the solidification of protective film formation film is made to become protective film, while adhesive phase is made to consolidate Change, semiconductor chip is picked up together with the protective film for being pasted on its back side from the adhesive phase after the solidification, is thus obtained Semiconductor chip with protective film.
On the other hand, it in the case of the protective film formation of strip being batched with composite sheet, is generally used in protective film and is formed With the protective film formation composite sheet for the state for being laminated with stripping film (being stripping film 15 in Fig. 1 and 2) in the exposed surface of film.And And the protective film formation composite sheet of present embodiment is to be formed arbitrarily (for example, protective film formation composite sheet shown in FIG. 1 1 and protective film formation composite sheet 2 shown in Fig. 2 in be formed arbitrarily) when, as protective film formation is coiled into composite sheet Web-like, the lamination unit for being sequentially laminated with overlay, support chip, protective film formation film and stripping film are folded successively in the radial direction of volume It closes.As a result, between the lamination unit that the radial direction of volume contacts with each other, the surface of the stripping film of a lamination unit (with It is provided with the face of the side opposite side of protective film formation film) (connect with base material with the back side of the overlay of another lamination unit The face of tactile side opposite side) contact, become the state of pressing, in the case where keeping the state, protective film is formed with compound The volume of piece is saved.But by being provided with overlay, between lamination unit, due to above-mentioned stripping film and overlay Stickup be suppressed, therefore, the protective film formation of present embodiment can inhibit adhesion with composite sheet.
Using the said protection film formation composite sheet for having stripping film on said protection film formation film, according to following The peeling force for the above-mentioned stripping film that method measures is preferably 10mN/50mm or less, is more preferably 7.5mN/50mm or less, is especially excellent It is selected as 5mN/50mm or less.
(assay method of the peeling force of stripping film)
By the protection of the present embodiment of the wide 50mm of the state with stripping film on protective film formation film, long 100mm Film formation with composite sheet by overlay towards the overall thickness of the same direction and overlay be 10~60 μm in the way of overlap it is more Piece, it is overlay, the laminated body that the second outermost layer is stripping film that the first outermost layer, which is consequently formed, by the laminated body in protective film shape 3 days are stood at the power (external force) for being applied with 980.665mN (i.e. 100gf) with the stacking direction of composite sheet and at 40 DEG C, then Above-mentioned stacking direction will be near the above-mentioned first outermost painting with the condition of peeling rate 300mm/ points, 180 ° of peel angle The stripping film of coating is from the adjacent overlay (coating nearest with the above-mentioned first outermost overlay on above-mentioned stacking direction Layer) on remove, measure peeling force at this time.It should be noted that the protective film formation of overlapping multi-disc is with composite sheet here It is same to constitute.In addition, the piece number of protective film formation composite sheet to be overlapped is preferably 1.By the stripping of such stripping film The height of adhesion inhibition (resistance to blocking) from the protective film formation composite sheet that present embodiment can be confirmed in power.
Embodiment
Hereinafter, the present invention is described in more detail by specific embodiment.But the present invention is not completely by following Shown in embodiment restriction.
The manufacture > of < protective film formation composite sheets
[embodiment 1]
The protective film formation composite sheet constituted shown in Fig. 1 is manufactured.By the vertical view of the protective film formation composite sheet It is shown in Fig. 3.More specifically, as described below.
[manufacture of the 1st laminated body]
(preparation of thermosetting protective film formation composition)
Coordinate following compositions with following amounts (solid constituent), then coordinate methyl ethyl ketone, it is 51 matter to have obtained solid component concentration The protective film for measuring % is formed with composition (III-1).
(component of polymer (A))
(A)-1：10 mass parts of n-butyl acrylate, 70 mass parts of methyl acrylate, 5 matter of glycidyl methacrylate Measure acrylic resin (weight average molecular weight 400000, vitrifying made of part and the copolymerization of 15 mass parts of acrylic acid 2- hydroxy methacrylates - 1 DEG C of transition temperature) 150 mass parts
(thermosetting component (B))
Epoxy resin (B1)
(B1)-1：Bisphenol A type epoxy resin (Mitsubishi chemical Co., Ltd's system " JER 828 ", 183~194g/ of epoxide equivalent Eq, molecular weight 370) 60 mass parts
(B1)-2：Bisphenol A type epoxy resin (Mitsubishi chemical Co., Ltd's system " JER 1055 ", epoxide equivalent 800~ 900g/eq, molecular weight 1600) 10 mass parts
(B1)-3：Dicyclopentadiene-type epoxy resin (DIC corporations " EPICLON HP-7200HH ", epoxide equivalent 274 ~286g/eq) 30 mass parts
Thermal curing agents (B2)
(B2)-1：Dicyandiamide (solid dispersing latent curing agent, ADEKA corporations " AdekaHardener EH- 3636AS ", active hydrogen amount 21g/eq) 2 mass parts
(curing accelerator (C))
(C)-1：2- phenyl -4,5- bishydroxymethyls imidazoles (Shikoku Chem's system " CUREZOL2PHZ ") 2 Mass parts
(packing material (D))
(D)-1：(Admatechs companies " SC2050MA " have carried out surface with epoxy compounds and have changed silica filler The silica filler of property, 0.5 μm of average grain diameter) 320 mass parts
(coupling agent (E))
(E)-1：γ-glycidoxypropyltrimethoxy silane (silane coupling agent, Shin-Etsu Chemial Co., Ltd's system " KBM403 ", methoxyl group equivalent 12.7mmol/g, molecular weight 236.3) 0.4 mass parts
(colorant (I))
(I)-1：Carbon black (pigment, Mitsubishi chemical Co., Ltd's system " MA600B ", average grain diameter 28nm) 1.2 mass parts
(formation of protective film formation film, the manufacture of the 1st laminated body)
On the lift-off processing face of the 1st stripping film (50 μm of Lindeke Co., Ltd's system " SP-P502010* ", thickness), make It is coated with protective film formation composition (III-1) obtained above with knife type coater, it is 2 minutes dry at 120 DEG C, it forms Protective film, which is formed, uses film (25 μm of thickness).
Then, make the lift-off processing of the 2nd stripping film (38 μm of Lindeke Co., Ltd's system " SP-PET381031C ", thickness) Face paste is sequentially laminated with together on the face with the face opposite side for being provided with the 1st stripping film of the protective film formation film The laminated body of the strip of 1st stripping film, protective film formation film and the 2nd stripping film.Then, the laminated body of the strip batched and After volume, by the laminated body, along its width direction, (protective film shown in Fig. 3 forms wide shown in the symbol w1 with composite sheet 1 Degree direction) cut into the size of 300mm.
Then, the laminated body for this after cutting is cut in its width direction central portion from the 2nd stripping film side The hemisection of cut mark so that the circle that the 2nd stripping film and protective film formation are diameter 220mm when depicting vertical view with film.It needs Illustrate, in the present specification, " vertical view " of laminated body refers to being seen downwards above its stacking direction to laminated body It sees.Then, the remaining mode of circular portion formed according to the only hemisection is by the 2nd stripping film and protective film formation film from upper It states and is removed on laminated body, obtained being circular protective film when being sequentially laminated with vertical view on the lift-off processing face of the 1st stripping film 1st laminated body made of formation film and the 2nd stripping film.Circular protective film formation in 1st laminated body is equivalent to film Protective film shown in Fig. 3 is formed with diameter d in composite sheet 11For the circular protective film formation film 13 of 220mm.
(preparation of coating composition)
(catalyst is melted into dispersion liquid obtained from being scattered in cellosolvo (ethyl cellosolve) in silicon dioxide gel Industrial Co., Ltd's system " OSCAL1632 ", 30~50nm of grain size of silicon dioxide gel, 30 mass % of solid component concentration) 150 In mass parts, (waste river is chemical for the hard paint that cooperation is formed by urethane acrylate and polyfunctional acrylate's monomer Industrial Co., Ltd's system " Beamset 575CB ", contains Photoepolymerizationinitiater initiater at 100 mass % of solid component concentration) 100 mass Part, obtain coating composition (30 mass % of solid component concentration).
(formation of overlay)
Then, the surface roughness Ra of male and fomale(M&F) is 0.4 μm, the surface roughness Ra in the face of the male and fomale(M&F) opposite side is On the above-mentioned male and fomale(M&F) of 0.02 μm of polypropylene base material (100 μm of thickness, 140~160 DEG C of fusing point), applied using Meyer bar coater Cloth coating composition obtained above, after 1 minute dry at 80 DEG C, with about 230mJ/cm2Light quantity irradiate ultraviolet light, make to do Curing of coating after dry forms overlay (3 μm of thickness).
(preparation of adhesive composition)
By 100 mass parts of (methyl) alkyl acrylate copolymer and the (crosslinking of aromatic polyisocyanate compound Agent, Mitsui Chemicals, Inc's system " Takenate D110N ") 10 mass parts (solid constituent) mixing, methyl ethyl ketone is being mixed, is being obtained The adhesive composition (iii) that solid component concentration is 30 mass % is arrived.
Above-mentioned (methyl) alkyl acrylate copolymer is 40 mass parts of n-butyl acrylate, 2-EHA 55 The acrylic resin of weight average molecular weight 600000 made of mass parts and the copolymerization of 5 mass parts of acrylic acid 2- hydroxy methacrylates.
(formation of adhesive phase (support chip), the manufacture of the 2nd laminated body)
In single side as forming organic silicon peeling agent layer come 38 μm of thickness obtained from carrying out lift-off processing by poly- pair Ethylene terephthalate is film-made the above-mentioned stripping of the 3rd stripping film to be formed (Lindeke Co., Ltd's system " SP-PET381031C ") From in process face, it is coated with adhesive composition obtained above (iii) using knife type coater and makes it dry, form bonding Oxidant layer (5 μm of thickness).
Then, to be formed with overlay above-mentioned base material carried out sided corona treatment with the face of male and fomale(M&F) opposite side after, make Above-mentioned adhesive phase is closed with the sided corona treatment face paste, has been stacked gradually overlay, base material, adhesive phase and the 3rd stripping Film and include support chip strip the 2nd laminated body.
Then, by the 2nd laminated body of the strip batch and as volume after, by the 2nd laminated body along its width direction (Fig. 3 Shown in protective film form the width direction shown in the symbol w1 of composite sheet 1) cut into the size of 300mm.
(manufacture of protective film formation composite sheet)
The 2nd stripping film is removed from the 1st laminated body obtained above, and circular protective film formation is made to be exposed with film.In addition, The 3rd stripping film is removed from the 2nd laminated body obtained above, and adhesive phase is made to expose.Then, make above-mentioned protective film be formed to use The exposed surface of film is bonded with the exposed surface of the adhesive phase, has obtained stacking gradually overlay, base material, adhesive phase, protective film The 3rd laminated body of protective film formation composite sheet is equivalent to made of formation film and the 1st stripping film.
For the 3rd laminated body obtained above, the hemisection of incision cut mark is carried out from overlay side so that overlay, base Material and adhesive phase are described when having vertical view as the circle of diameter 270mm.When the hemisection, to overlay, base material and adhesive phase The above-mentioned circle of diameter 270mm is formed by diameter 220mm's with protective film formation with film when having cut cut mark, and to overlook Circle becomes concentric circles.
Then, the position of the radial outside 20mm of the circle apart from above-mentioned diameter 270mm when looking down, from overlay side into It has gone overlay, base material and adhesive phase and has cut the hemisection for having cut mark, and made width direction (Fig. 3 institutes in the 3rd laminated body The protective film formation shown width direction shown in the symbol w1 of composite sheet 1) depict opposite a pair of of circular arc.
The cut mark for being equivalent to a pair of circular arc is formed in protective film formation composite sheet 1 shown in Fig. 3 shown in symbol 121 The curved peripheral portion of adhesive phase.Moreover, the distance between the circle of diameter 270mm and above-mentioned circular arc (20mm) are equivalent to figure Protective film shown in 3 is formed with the symbol w2 in composite sheet 1.
Such above-mentioned hemisection for describing 2 concentric circles and a pair of of circular arc the 3rd laminated body length direction (with Fig. 3 institutes The protective film formation shown orthogonal direction of width direction shown in the symbol w1 of composite sheet 1) in multiple positions carry out, from painting Coating side has carried out overlay, base material and adhesive phase and has cut the hemisection for having cut mark, and so that adjacent when depicting vertical view In above-mentioned length direction by circular arc 2 straight lines connected to each other between the position connect.It is equivalent to the cut mark formation figure of 2 straight lines Protective film shown in 3 forms the planar peripheral portion of the adhesive phase shown in the symbol 122 in composite sheet 1.
Then, it removes part when overlooking between the circle of above-mentioned diameter 270mm and a pair of of circular arc and is incited somebody to action by above-mentioned Overlay, base material and the adhesive phase in part clamped by circular arc 2 straight lines connected to each other, results in the institutes of Fig. 1 and 3 The protective film formation composite sheet shown.The protective film is formed is equivalent to figure with the circular adhesive phase (support chip) in composite sheet Diameter d in 32For the circular adhesive phase 12 (support chip 10) of 270mm.In addition, in the protective film formation composite sheet 1st stripping film is equivalent to the stripping film 15 in Fig. 3.
[embodiment 2]
As shown in table 1 like that, it is 1 μm rather than 0.4 μm of base material to have used the surface roughness Ra of male and fomale(M&F), in addition to this Other than point, protective film formation composite sheet has been obtained according to method similarly to Example 1.
[embodiment 3]
As shown in table 1 like that, the surface roughness Ra of male and fomale(M&F) has been used to be 1 μm rather than 0.4 μm of base material and make The thickness of overlay replaces 3 μm by 1 μm, and other than this point, protective film shape has been obtained according to method similarly to Example 1 At with composite sheet.
[embodiment 4]
As shown in table 1 like that, so that the thickness of overlay is replaced 3 μm by 1 μm, in addition to this point other than, according to embodiment 1 Same method has obtained protective film formation composite sheet.
[embodiment 5]
As shown in table 1 like that, the surface roughness Ra of male and fomale(M&F) has been used to be 1 μm rather than 0.4 μm of base material and make The thickness of overlay replaces 3 μm by 6 μm, and other than this point, protective film shape has been obtained according to method similarly to Example 1 At with composite sheet.
[embodiment 6]
As shown in table 1 like that, the surface roughness Ra of male and fomale(M&F) has been used to be 3 μm rather than 0.4 μm of base material and make The thickness of overlay replaces 3 μm by 6 μm, and other than this point, protective film shape has been obtained according to method similarly to Example 1 At with composite sheet.
[comparative example 1]
As shown in table 1 like that, it is 1 μm rather than 0.4 μm of base material and not to have used the surface roughness Ra of male and fomale(M&F) Overlay is formed, other than this point, protective film formation composite sheet has been obtained according to method similarly to Example 1.
[comparative example 2]
As shown in table 1 like that, base is configured in such a way that male and fomale(M&F) is towards opposite side, namely adhesive phase side (inside) Material and do not form overlay (that is, being formed as previous composition shown in fig. 5), other than this point, according to embodiment 1 Same method has obtained protective film formation composite sheet.
[comparative example 3]
As shown in table 1 like that, it is 1 μm rather than 0.4 μm of base material, according to recessed to have used the surface roughness Ra of male and fomale(M&F) Mode convex surface facing opposite side, namely adhesive phase side (inside) configures base material and does not form overlay (that is, being formed For previous composition shown in fig. 5), other than this point, obtains protective film according to method similarly to Example 1 and formed use Composite sheet.
[comparative example 4]
Dispersion liquid obtained from being scattered in cellosolvo instead of silicon dioxide gel, has used in terms of solid constituent It is (Admatechs corporations " SC2050MA ", average for the same amount of spherical silicon dioxide for having carried out surface modification with epoxy group 0.5 μm of grain size), other than this point, coating composition is prepared for according to method similarly to Example 1.
Also, it other than having used this point of the coating composition, is protected according to method similarly to Example 1 Film formation composite sheet.
In obtained protective film formation composite sheet, the surface roughness Ra of substrate side most surface as shown in table 1 that Sample is 0.8 μm.
The evaluation > of < protective film formation composite sheets
[laser lettering]
In the protective film formation composite sheet of each Examples and Comparative Examples obtained above, the 1st stripping film is removed, is used Adhesive phase is pasted on stainless steel ring frame by sticker (Lindeke Co., Ltd's system " RAD-2700F/12 "), simultaneously will Protective film formation is pasted on the back side for the silicon wafer (8 inches of outer diameter, 100 μm of thickness) for being heated to 70 DEG C with film.
Then, protective film formation at 130 DEG C heat within 2 hours with film, make protective film formation film thermosetting Change and forms protective film.
Then, using printing device (KEYENCE corporations " VK9700 "), in output power 0.6W, frequency 40kHz, sweep Laser of the speed from substrate side to protective film illumination wavelength 532nm under conditions of 100mm/ seconds is retouched, with following 2 patterns (figures Case 1, pattern 2) laser lettering has been carried out to protective film.
(pattern)
Pattern 1：Character size 0.4mm × 0.5mm, word interval 0.3mm, word number 20
Pattern 2：Character size 0.2mm × 0.5mm, word interval 0.3mm, word number 20
Then, for the word formed on protective film with above-mentioned laser lettering, according to following benchmark for from base material The visibility (laser lettering) of side is evaluated, and the results are shown in tables 1.
(evaluation criteria)
A：All words of pattern 1 and 2 are clear, can with there is no problem read the word of pattern 1 and 2.
B：Although at least part word in pattern 2 is unintelligible, all words in pattern 1 are clear, can not have The word of pattern 1 is read problematicly.
C：Any one pattern of pattern 1 and 2 is that at least part word is unintelligible.
[resistance to blocking (1)]
The protective film formation of each Examples and Comparative Examples obtained above of length 10m composite sheet is rolled up in 3 English of diameter On very little ABS resin coremaking material, 3 days have been stood at room temperature with the state.
Then, it for the protective film formation composite sheet of Examples 1 to 5, has attempted that overlay, base will have been stacked gradually 10 lamination units extraction of material, adhesive phase, protective film formation film and the 1st stripping film, the protection for comparative example 1~3 Film formation composite sheet, since there is no overlay, base material, adhesive phase, protective film will have been stacked gradually by, which having attempted, forms use 10 lamination units of film and the 1st stripping film are extracted out, at this point, the protective film formation composite sheet to contact with each other when for batching Contact site to each other whether there is or not paste, exist stickup in the case of its stickup degree, evaluated according to following benchmark, by result It is shown in table 1.
(evaluation criteria)
A：The stickup of above-mentioned contact site to each other is not confirmed completely.
B：Although confirming the slight stickup of above-mentioned contact site to each other, with there is no problem protective film can be formed It is extracted out with composite sheet.
C：Above-mentioned contact site is pasted a part of completely each other, when protective film formation is extracted out with composite sheet, the 1st stripping Film is removed from adhesive phase.
[resistance to blocking (2)]
The protective film formation of each Examples and Comparative Examples obtained above is cut into wide 50mm, long 100mm rulers with composite sheet Very little is band-like.It should be noted that when cutting out so that the length direction of the band and the coating direction one of adhesive composition It causes.
Prepare 10 ribbons obtained in this way, these ribbons are laminated and test film has been made.At this point, implementing It is that above-mentioned ribbon is laminated upward for overlay in the case of example 1~5.But the case where comparative example 1~3 Under, it is that above-mentioned ribbon is laminated upward for base material since there is no overlay.Then, (wide with 2 glass plates 75mm, long 15mm, thickness 5mm) test film is clamped, by the sandwich entirety of these glass plates and test film according to a glass plate It is positioned over given position as lowest level, counterweight is placed on the glass plate of another top layer, above-mentioned test film is carried out Pressurization.It is 980.665mN (i.e. 100gf) to the power that above-mentioned test film applies at this point, on the stacking direction of above-mentioned ribbon. It is in this state that the sandwich entirety of these glass plates and test film is interior at 40 DEG C in damp and hot promoters (ESPEC corporations) Keeping 3 days has carried out heating pressurization to above-mentioned test film and has promoted experiment.
Then, above-mentioned test film is taken out from damp and hot promoters, remove undermost 1st stripping film (with it is undermost The 1st stripping film that glass plate is in contact) and protective film formation film adjacent thereto, using double-faced adhesive tape by the bonding of exposing Oxidant layer fits in support plate, heating is pressurizeed remove only the undermost 1st from above-mentioned test film after promoting experiment as a result, Stripping film and protective film formation adjacent thereto are fixed on above-mentioned support plate with the sample after film.
Then, it in the case of Examples 1 to 5, removes in the sample after above-mentioned fixation farthest away from above-mentioned support plate most The sandwich being made of with film overlay, base material, adhesive phase and protective film formation on upper layer, using cupping machine, to shell Condition from speed 300mm/ points, 180 ° of peel angle removes the 1st stripping film of exposing from adjacent overlay, determines Peeling force at this time.In the case of comparative example 1~3, remove in the sample after above-mentioned fixation farthest away from above-mentioned support plate most The sandwich being made of with film base material, adhesive phase and protective film formation on upper layer, using cupping machine, with peeling rate 300mm/ divides, the condition of 180 ° of peel angle removes the 1st stripping film of exposing from adjacent base material, determines stripping at this time From power.Using the measured value of the peeling force of the 1st stripping film obtained in this way as the resistance to blocking of protective film formation composite sheet Index.
It should be noted that in the case where the peeling force for the 1st stripping film for wanting to measure is sufficiently small, from by damp and hot promotion It removes on the above-mentioned test film taken out in device and (connects as described above with undermost glass plate with undermost 1st stripping film The 1st tactile stripping film) adjacent protective film formation film when, sometimes as the 1st stripping film of the measure object of peeling force head It is removed on the layer (be in the case of Examples 1 to 5 overlay, comparative example 1~3 in the case of be base material) first abutted from it.It should In the case of, after removing undermost 1st stripping film on the above-mentioned test film that is taken out from by damp and hot promoters, the guarantor that is adjacent Cuticula formation is not removed with film, but protective film formation is fitted in support plate with film using double-faced adhesive tape, as a result, will be from The sample after undermost 1st stripping film is removed only on above-mentioned test film and is fixed on above-mentioned support plate, after the fixation Sample determines the peeling force of the 1st stripping film as described above.
The results are shown in tables 1.
[surface roughness Ra of substrate side most surface]
For the protective film formation composite sheet of each Examples and Comparative Examples obtained above, contact rough surface is used Degree instrument (Mitutoyo corporations " SURFTEST SV-3000 "), cutoff value λ c are set as 0.8mm, evaluation length Ln is set as 4mm, Based on JIS B0601:2001 standards are to substrate side most surface, the i.e. surface roughness with the face of substrate side opposite side of overlay Ra is determined, and the results are shown in table 1.In table 1, for the protective film formation composite sheet of comparative example 1~3, as The surface roughness Ra of substrate side most surface describes the surface roughness with the face of adhesive phase side opposite side of above-mentioned base material Ra。
[gloss value of coating layer surface]
For the protective film formation composite sheet of each Examples and Comparative Examples obtained above, vancometer (Japan is used Electricity Se Co., Ltd. manufacture vancometer " VG2000 "), be based on 7105 standards of JIS K, it is opposite with substrate side from overlay Side measure overlay surface 20 ° of mirror surface lusters, using its measured value as apply layer surface gloss value, tied Fruit is shown in table 1.
[the mist degree measured value measured from overlay side]
For the protective film formation composite sheet of each Examples and Comparative Examples obtained above, mist degree instrument (Japan's electricity is used Color Co. Ltd. system " NDH-2000 "), mist degree determined from overlay side based on 7136 standards of JIS K, the results are shown in table 1。
[table 1]
The protective film formation composite sheet of Examples 1 to 6 in the outermost layer of substrate side by having overlay and the coating The gloss value of layer surface is in particular range, and laser lettering and resistance to blocking are good.
The especially protective film formation composite sheet of embodiment 1,2,4 and 5 is formed with the protective film of embodiment 3 and 6 with multiple It closes piece to compare, laser lettering is excellent, thus it is speculated that this is because, the coating of the protective film formation composite sheet of embodiment 1,2,4 and 5 The gloss value of layer surface is slightly larger, has reached in more suitably range.
In addition, compared with the protective film formation composite sheet of embodiment 5 and 6, the protective film of Examples 1 to 4 is formed with multiple The resistance to blocking for closing piece is better, thus it is speculated that this is because, the thickness of the overlay of the protective film formation composite sheet of Examples 1 to 4 Degree is thinner.
It should be noted that the protective film formation composite sheet of Examples 1 to 6 is not true between base material and adhesive phase Recognize space part.
In contrast, the protective film formation composite sheet composite sheet as shown in fig. 4 of comparative example 1 is same, base material with tool The face (back side) of face (surface) opposite side of the side of standby adhesive phase is male and fomale(M&F), and does not have overlay, thus while Resistance to blocking is excellent, but laser lettering is poor.
The protective film formation composite sheet of comparative example 2 is same as composite sheet shown in fig. 5, base material with have adhesive phase The face (back side) of face (surface) opposite side of side be even surface, and do not have overlay, thus while laser lettering Well, but resistance to blocking is poor.The protective film formation composite sheet of comparative example 3 and the protective film formation composite sheet of comparative example 2 have There is same composition, not only resistance to blocking is poor, and laser lettering is also poor.Speculate this is because, base material has adhesive phase The face (surface) of side is male and fomale(M&F), and compared with the protective film formation composite sheet of comparative example 2, surface roughness Ra is big. For comparative example 3, since the surface roughness Ra of above-mentioned male and fomale(M&F) is big, the shape of male and fomale(M&F) also obtains on the surface of protective film The case where having arrived reflection, the concave-convex degree in the surface of protective film is caused to be more than comparative example 2, the diffusing reflection bigger of light, swashs as a result, Light lettering is further deteriorated.In addition it could be speculated that the protective film formation of comparative example 2 and 3 with composite sheet in the male and fomale(M&F) of base material There is space part between adhesive phase, but compared with comparative example 2, the surface roughness Ra bigger of the male and fomale(M&F) of comparative example 3 is empty Gap portion becomes larger, and therefore, compared with comparative example 2, the diffusing reflection bigger of the light of comparative example 3, laser lettering is further deteriorated.
The protective film formation composite sheet of comparative example 4 is same as the protective film formation composite sheet of embodiment 1, base material with The face (back side) for having face (surface) opposite side of the side of adhesive phase is male and fomale(M&F), and has overlay, although resist blocking and that Property is excellent, but laser lettering is poor.Speculate this is because, in the protective film formation composite sheet of comparative example 4, applies layer surface Gloss value is small, not in suitable range.
Industrial applicibility
The present invention can be used in the manufacture of semiconductor chip protected to the back side by protective film etc..

Claims (5)

1. a kind of protective film formation composite sheet, on a surface of support chip has protective film formation film and in institute It states and has overlay on the surface with the side opposite side for having the protective film formation film of support chip and form,
The gloss value on the surface for the side opposite side of the overlay being in contact with the support chip is 32~95.
2. protective film formation composite sheet according to claim 1, wherein used using further being formed in the protective film Has the protective film formation composite sheet of stripping film on film, the peeling force of the stripping film measured by the following method is 10mN/50mm hereinafter,
The assay method of the peeling force of stripping film：
By on protective film formation film with stripping film and width 50mm, long 100mm the protective film formation composite sheet according to The mode that the overlay is 10~60 μm towards the overall thickness of the same direction and the overlay overlaps multi-disc, thus shape It is overlay, the laminated body that the second outermost layer is stripping film at the first outermost layer, the laminated body is formed in the protective film It is applied with the power of 980.665mN with the stacking direction of composite sheet and stands 3 days at 40 DEG C, then in the stacking direction to shell From speed 300mm/ points, the condition of 180 ° of peel angle by near the stripping film of the described first outermost overlay from adjacent Overlay on remove, measure peeling force at this time.
3. protective film formation composite sheet according to claim 1 or 2, wherein the support chip is base material and adhesive Made of layer stackup,
The protective film formation with composite sheet stack gradually the overlay, base material, adhesive phase and protective film formation film and At.
4. protective film formation composite sheet according to claim 3, wherein described adhesive layer be energy ray-curable or The adhesive phase of non-energy line curability.
5. protective film formation composite sheet according to any one of claims 1 to 4, wherein the protective film, which is formed, to be used Film is the film of thermosetting property or energy ray-curable.
CN201780014253.6A 2016-03-04 2017-02-10 Protective film formation composite sheet Pending CN108778722A (en)

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SG11201807452UA (en) 2018-09-27
KR20180120173A (en) 2018-11-05
CN117656639A (en) 2024-03-08
WO2017150145A1 (en) 2017-09-08

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Application publication date: 20181109