CN108966482A - A kind of power device radiator structure - Google Patents
A kind of power device radiator structure Download PDFInfo
- Publication number
- CN108966482A CN108966482A CN201810777858.7A CN201810777858A CN108966482A CN 108966482 A CN108966482 A CN 108966482A CN 201810777858 A CN201810777858 A CN 201810777858A CN 108966482 A CN108966482 A CN 108966482A
- Authority
- CN
- China
- Prior art keywords
- power device
- radiator body
- heat radiator
- heat
- radiating piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The present invention provides a kind of power device radiator structure, including radiator and power device；Radiator includes heat radiator body and radiating piece；Radiating piece is respectively arranged at the two sides of heat radiator body；Power device is fixedly installed in heat radiator body；Radiating piece is located in power device circumferential direction；Scheme provided by the invention increases the heat dissipation area of radiator near power device by increasing radiator around power device, to reduce the temperature rise of product high-temperature region, improve product reliability and extend product service life.
Description
Technical field
The invention belongs to power device technical field of heat dissipation, and in particular to a kind of power device radiator structure.
Background technique
Existing power device radiator usually on one side for the plane that is bonded of power device, another side is radiating fin
Radiator is fitted on power device radiating surface by piece, when application, and power device welds on circuit boards；As shown in Figure 1, existing
Power device radiator structure due to heat at a distance from heat source distribution gradient, dissipating away from heat source near and far in this type radiator
Heat area is almost suitable, leads to extreme temperatures at contact surface, and flight tip temperature is lower, and heat is unevenly distributed, radiator benefit
It is not high with rate.
Based on technical problem present in above-mentioned power device radiator, there has been no relevant solutions；Therefore urgent
Need to seek effective scheme to solve the above problems.
Summary of the invention
The purpose of the present invention is shortcomings present in view of the above technology, propose a kind of power device radiator structure, purport
Solve the problems, such as existing power device radiator structure high temperature area be unable to fully heat dissipation.
The present invention provides a kind of power device radiator structure, including radiator and power device；Radiator includes to radiate this
Body and radiating piece；Radiating piece is respectively arranged at the two sides of heat radiator body；Power device is fixedly installed in heat radiator body, and is located at
In radiating piece.
Further, radiating piece is fin；Fin, which is respectively separated, is set to heat radiator body two sides；Power device fixed setting
In in heat radiator body, and between fin.
Further, heat radiator body and fin are aluminium flake；Heat radiator body and fin are integrally formed.
Further, radiating piece is thermal column；Thermal column, which is respectively separated, is set to heat radiator body two sides；Power device is fixed
It is set in heat radiator body, and between thermal column.
Further, radiating piece includes fin and thermal column；Fin is arranged at intervals at heat radiator body side, and radiate intercolumniation
Every being set to the heat radiator body other side；Power device is fixedly installed in heat radiator body, and between thermal column or positioned at wing
Between piece.
Further, thermal column is aluminium column；Heat radiator body is aluminium flake；Thermal column and heat radiator body are integrally formed, or heat dissipation
Column is welded in heat radiator body.
Further, the length for stretching out in heat radiator body in heat radiator body outside the radiating piece of power device side is lower than
The length of heat radiator body is stretched out in outside the radiating piece of the heat radiator body other side.
Further, the length that heat radiator body is stretched out in outside the radiating piece in power device circumferential direction is overhanging lower than power device
For the length of heat radiator body.
It further, further include having circuit board；The power device is fixedly connected by pin with the circuit board.
Using the above scheme, increased around power device is that the thermal column being uniformly or non-uniformly distributed radiates to increase
Area, when product carries out forced heat radiation without using fan, can also be used radial radiating piece centered on power device or
Carry out increasing heat radiation area in conjunction with the installation situation design other shapes of PCB；When needing to carry out forced heat radiation using fan, then may be used
Suitable shape is designed according to air duct to increase the heat dissipation area near power device；The present invention utilizes farther away apart from heat source
Heat dissipation area is compensated away from the closer heat dissipation area of heat source, solves the problems, such as that hot source temperature is excessively high；Improve radiator benefit
With rate, bulk temperature is reduced；In the case where guaranteeing the identical situation of heat dissipation area, power device is partly embedded into radiator, reduces whole
The volume of body product improves product reliability and extends product service life.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Below with reference to attached drawing, the invention will be further described:
Fig. 1 is a kind of power device radiator structure schematic diagram of the prior art；
Fig. 2 is a kind of one cross-sectional view of power device radiator structure embodiment of the present invention；
Fig. 3 is a kind of one perspective view of power device radiator structure embodiment of the present invention；
Fig. 4 is a kind of two perspective view of power device radiator structure embodiment of the present invention；
Fig. 5 is a kind of two cross-sectional view of power device radiator structure embodiment of the present invention.
In figure: 1, radiator；11, heat radiator body；12, fin；13, fin；14, thermal column；2, power device；21, draw
Foot；3, circuit board.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figures 2 to 5, the present invention provides a kind of power device radiator structure, including radiator 1 and power device 2；It dissipates
Hot device 1 includes heat radiator body 11 and radiating piece；Radiating piece is respectively arranged at the two sides of heat radiator body 11, for power device
2 radiate；Heat radiator body 11, which primarily serves, leads wind action；Power device 2 is fixedly installed in heat radiator body 11, and is located at
In radiating piece；I.e. radiating piece is located in 2 circumferential direction of power device, to play the direct heat dissipation to power device 2；Power device 2 is logical
Pin 21 is crossed to be fixedly connected with circuit board 3；Specifically, in power device radiator structure, consider apart from power device (pyrotoxin)
Closer local temperature rise is higher；Therefore, as shown in Figure 1, space a of the present invention near power device and heat radiator body contact surface
Also increase the heat dissipation area of radiating piece, increased heat dissipation area is power all apart from the closer position of power device at this
The high-temperature region of device, therefore the temperature at product maximum temperature rise can be reduced, to achieve the purpose that heat dissipation；Using the above scheme,
Increase radiator near power device and radiator contact surface, around power device to increase power device radiator nearby
Heat dissipation area, reduce the heat dissipation area of farther away radiator, to reduce the temperature rise of product high-temperature region, reduce product size.
Preferably, in conjunction with above scheme, as shown in Figure 2 to Figure 3, in the present embodiment, radiating piece is fin 12,13；Fin
12,13 the two sides for being set to heat radiator body 11 are respectively separated；Power device 2 is fixedly installed in heat radiator body 11, and is located at wing
Between piece 12；Multiple fins 12 are arranged side by side in heat radiator body 11 and around power device 2, reach reduction power with this
Temperature around device 2；Further, heat radiator body and fin are aluminium flake；Heat radiator body and fin are integrally formed, to improve
Heat dissipation effect.
Preferably, in conjunction with above scheme, in the present embodiment, radiating piece is thermal column；Thermal column be respectively separated be set to it is scattered
Hot ontology two sides；Power device is fixedly installed in heat radiator body, and between thermal column, all to reduce power device with this
The temperature enclosed.
Preferably, in conjunction with above scheme, as shown in Fig. 4 to Fig. 5, in the present embodiment, radiating piece includes fin 13 and dissipates
Plume 14；Fin 13 is arranged at intervals at 11 side of heat radiator body, and thermal column 14 is arranged at intervals at 11 other side of heat radiator body；Power
Device 2 is fixedly installed in heat radiator body 11, and between thermal column 14 or between fin, reduces power device with this
Temperature around part 2.
Preferably, in conjunction with above scheme, in the present embodiment, thermal column is aluminium column；Heat radiator body is aluminium flake；Thermal column and dissipate
This hot body by integral forming or thermal column are welded in heat radiator body, to improve heat dissipation effect.
Preferably, in conjunction with above scheme, as shown in Figures 2 to 5, in the present embodiment, power device is located in heat radiator body 11
The length that heat radiator body 11 is stretched out in outside the radiating piece of 2 side of part stretches out in heat dissipation lower than 11 other side radiating piece of heat radiator body outside
The length of ontology 11；Further, the length of heat radiator body is stretched out in outside the radiating piece in power device circumferential direction lower than power device
The length of heat radiator body is stretched out in outside part；Specifically, due to the position apart from power device side farther out, temperature has been far below flat
Equal temperature in heat dissipation area identical with common radiating mode, can reduce fin or thermal column using the above scheme
Highly, to reduce small product size.
Using the above scheme, increased around power device is that the thermal column being uniformly or non-uniformly distributed radiates to increase
Area, when product carries out forced heat radiation without using fan, can also be used radial radiating piece centered on power device or
Carry out increasing heat radiation area in conjunction with the installation situation design other shapes of PCB；When needing to carry out forced heat radiation using fan, then may be used
Suitable shape is designed according to air duct to increase the heat dissipation area near power device；The present invention utilizes farther away apart from heat source
Heat dissipation area is compensated away from the closer heat dissipation area of heat source, solves the problems, such as that hot source temperature is excessively high；Improve radiator benefit
With rate, bulk temperature is reduced；In the case where guaranteeing the identical situation of heat dissipation area, power device is partly embedded into radiator, reduces whole
The volume of body product improves product reliability and extends product service life.
The above, only presently preferred embodiments of the present invention not do limitation in any form to the present invention.It is any ripe
Those skilled in the art is known, without departing from the scope of the technical proposal of the invention, all using technology contents described above
Many possible changes and modifications or equivalent example modified to equivalent change are made to technical solution of the present invention.Therefore, all
It is the content without departing from technical solution of the present invention, any change modification made to the above embodiment of technology according to the present invention,
Equivalent variations and modification belong to the protection scope of the technical program.
Claims (9)
1. a kind of power device radiator structure, which is characterized in that including radiator and power device；The radiator includes heat dissipation
Ontology and radiating piece；The radiating piece is respectively arranged at the two sides of the heat radiator body；The power device is fixedly installed on institute
It states in heat radiator body, and is located in the radiating piece.
2. power device radiator structure according to claim 1, which is characterized in that the radiating piece is fin；The fin
It is respectively separated and is set to the heat radiator body two sides；The power device is fixedly installed in the heat radiator body, and is located at institute
It states between fin.
3. power device radiator structure according to claim 2, which is characterized in that the heat radiator body and the fin are
Aluminium flake；The heat radiator body and the fin are integrally formed.
4. power device radiator structure according to claim 1, which is characterized in that the radiating piece is thermal column；It is described to dissipate
Plume, which is respectively separated, is set to the heat radiator body two sides；The power device is fixedly installed in the heat radiator body, and position
Between the thermal column.
5. power device radiator structure according to claim 1, which is characterized in that the radiating piece includes fin and heat dissipation
Column；The fin is arranged at intervals at the heat radiator body side, and the thermal column is arranged at intervals at the heat radiator body other side；
The power device is fixedly installed in the heat radiator body, and between the thermal column or between the fin.
6. power device radiator structure according to claim 4 or 5, which is characterized in that the thermal column is aluminium column；
The heat radiator body is aluminium flake；The thermal column and the heat radiator body are integrally formed or the thermal column is welded in institute
It states in heat radiator body.
7. power device radiator structure according to claim 1, which is characterized in that be located at the power in the heat radiator body
The length of the heat radiator body is stretched out in outside the radiating piece of device side lower than heat dissipation described in the heat radiator body other side
The length of the heat radiator body is stretched out in outside part.
8. power device radiator structure according to claim 1, which is characterized in that described scattered in the power device circumferential direction
The length of the heat radiator body is stretched out in outside warmware lower than the length for stretching out in the heat radiator body outside the power device.
9. power device radiator structure according to claim 1, which is characterized in that further include having circuit board；The power device
Part is fixedly connected by pin with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810777858.7A CN108966482A (en) | 2018-07-16 | 2018-07-16 | A kind of power device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810777858.7A CN108966482A (en) | 2018-07-16 | 2018-07-16 | A kind of power device radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108966482A true CN108966482A (en) | 2018-12-07 |
Family
ID=64481274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810777858.7A Pending CN108966482A (en) | 2018-07-16 | 2018-07-16 | A kind of power device radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966482A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526136A (en) * | 2018-12-25 | 2019-03-26 | 郑州师范学院 | A kind of power device radiator |
| EP4068923A1 (en) * | 2021-03-31 | 2022-10-05 | Siemens Aktiengesellschaft | Cooling device for cooling a semiconductor module and converter with the cooling device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213348Y (en) * | 2008-05-29 | 2009-03-25 | 珠海康威特电气有限公司 | Dustproof waterproof magnetic element and integrated apparatus for heat radiator |
| US20100243204A1 (en) * | 2009-03-24 | 2010-09-30 | Chiu-Mao Huang | Heat radiating unit for adapter |
| CN202535674U (en) * | 2012-03-28 | 2012-11-14 | 河北冠泰铝材有限公司 | Electric heat radiator with double-side teeth |
| CN202701643U (en) * | 2012-08-06 | 2013-01-30 | 浙江普尔尼机电有限公司 | Radiator set of electric welding machine |
| CN204925982U (en) * | 2015-09-16 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Radiating fin |
-
2018
- 2018-07-16 CN CN201810777858.7A patent/CN108966482A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213348Y (en) * | 2008-05-29 | 2009-03-25 | 珠海康威特电气有限公司 | Dustproof waterproof magnetic element and integrated apparatus for heat radiator |
| US20100243204A1 (en) * | 2009-03-24 | 2010-09-30 | Chiu-Mao Huang | Heat radiating unit for adapter |
| CN202535674U (en) * | 2012-03-28 | 2012-11-14 | 河北冠泰铝材有限公司 | Electric heat radiator with double-side teeth |
| CN202701643U (en) * | 2012-08-06 | 2013-01-30 | 浙江普尔尼机电有限公司 | Radiator set of electric welding machine |
| CN204925982U (en) * | 2015-09-16 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Radiating fin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526136A (en) * | 2018-12-25 | 2019-03-26 | 郑州师范学院 | A kind of power device radiator |
| CN109526136B (en) * | 2018-12-25 | 2021-04-13 | 郑州师范学院 | Power device heat abstractor |
| EP4068923A1 (en) * | 2021-03-31 | 2022-10-05 | Siemens Aktiengesellschaft | Cooling device for cooling a semiconductor module and converter with the cooling device |
| WO2022207179A1 (en) * | 2021-03-31 | 2022-10-06 | Siemens Aktiengesellschaft | Cooling device for cooling a semiconductor module and converter with the cooling device |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |
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| RJ01 | Rejection of invention patent application after publication |