CN108962802A - The guiding device of flip machine and wafer tablet - Google Patents
The guiding device of flip machine and wafer tablet Download PDFInfo
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- CN108962802A CN108962802A CN201810844127.XA CN201810844127A CN108962802A CN 108962802 A CN108962802 A CN 108962802A CN 201810844127 A CN201810844127 A CN 201810844127A CN 108962802 A CN108962802 A CN 108962802A
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- wafer tablet
- wafer
- tablet
- lifting column
- platform
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The invention discloses a kind of flip machine and the guiding devices of wafer tablet, comprising: pedestal；Material platform, material platform and pedestal are arranged along the pick-and-place direction relative spacing of wafer tablet, material platform is equipped with first through hole guidance set, guidance set includes the guide post of at least two relative spacings setting, at least two guide posts, which are enclosed, to be set to form blowing region, and at least two guide post protrusion material platforms are arranged and cooperatively form the introduction part for making wafer tablet fall into blowing region；And lifting column, lifting column are set in blowing region, one end of lifting column is set on pedestal, and the other end of lifting column is equipped with the supporting part for support wafer tablet, and supporting part can pass through first through hole, for moving back and forth wafer tablet along direction is picked and placed.The guiding device of flip machine and wafer tablet of the invention enables to wafer tablet to realize accurately positioning in the horizontal plane and keep stablizing, is accurately placed in preset discharge position, facilitates the progress of subsequent handling.
Description
Technical field
The present invention relates to wafer positioning device technical fields, and in particular to a kind of guiding of flip machine and wafer tablet dress
It sets.
Background technique
As the process of economic globalization is constantly accelerated, semicon industry and integrated circuit become promotion economic development
One big power-assisted, flip chip technology have been increasingly becoming one of key technology of semiconductor packaging industry, and wafer guiding device conduct
A highly important component part in upside-down mounting equipment, wafer guiding device with manipulator by cooperating, so that wafer tablet exists
Positioning is realized on material platform, and then smoothly completes the disengaging task of wafer tablet.
Traditional wafer guiding device, when the size of wafer tablet is larger and when heavier-weight, wafer tablet is in itself weight
It easily deforms under the action of power, causes wafer tablet that can all be affected in the positioning accuracy and stationarity of horizontal plane, so that
Wafer tablet can not accurately be placed in preset blowing region, cause difficulty for subsequent handling.
Summary of the invention
Based on this, it is necessary to provide the guiding device of a kind of flip machine and wafer tablet, guiding device enables to wafer
Tablet is accurately placed in preset blowing region, and flip machine includes the guiding device, so as to guarantee so that each process
It can accurately carry out.
Its technical solution is as follows:
A kind of guiding device of wafer tablet, comprising: pedestal；Material platform, the material platform and the pedestal are along the crystalline substance
The pick-and-place direction relative spacing setting of circle tablet, the material platform are equipped with first through hole；Guidance set, the guidance set packet
The guide post of at least two relative spacings setting is included, at least two guide posts, which are enclosed, to be set to form blowing region, at least two institutes
Guide post is stated to protrude the material platform setting and cooperatively form the importing for making the wafer tablet fall into the blowing region
Portion；And lifting column, the lifting column are set in the blowing region, one end of the lifting column is set on the pedestal,
The other end of the lifting column is equipped with the supporting part for wafer tablet described in support, and the supporting part can pass through described first
Through-hole, for moving back and forth the wafer tablet along the pick-and-place direction.
The guiding device of above-mentioned wafer tablet, in use, wafer tablet is transported to the surface of pedestal and incited somebody to action by manipulator
The blanking of wafer tablet is to preset lower discharge position, and lifting column rises until supporting part and the lower surface of wafer tablet abut against, or
The supporting part of lifting column stays in lower discharge position in advance, carries out support to wafer tablet using supporting part, improves wafer tablet
Stationarity in the horizontal plane, so that wafer tablet is realized after preliminary positioning, manipulator are removed in horizontal plane by lifting column
Support wafer tablet drives wafer tablet to move downward when lifting column declines, i.e., wafer tablet is mobile towards material platform, brilliant
In the process of moving, adjustment wafer tablet is in water under the guiding role for the introduction part that at least two guide posts are formed for circle tablet
Position in plane enables wafer tablet steadily, to be accurately moved on material platform and is placed in preset blowing region,
Facilitate the progress of subsequent handling.
Technical solution is illustrated further below:
Guiding device further includes the first hoistable platform and the first driving mechanism in one of the embodiments, and described first
Hoistable platform is equipped with the lifting column, and first driving mechanism is for driving first hoistable platform along the pick-and-place side
To reciprocating movement；When first hoistable platform is in first position, the supporting part is set to the blowing of the material platform
The top in face；When first hoistable platform is in the second position, the supporting part is set to the blowing face of the material platform
Lower section.The up and down motion of the first hoistable platform is driven using the first driving mechanism, is set to the first hoistable platform to drive
On lifting column move up and down so that supporting part support wafer tablet along wafer tablet pick-and-place direction move back and forth.
It is logical to be equipped with the first air-breathing for adsorbing the wafer tablet for the supporting part in one of the embodiments,
Road.It can use the mode vacuumized to adsorb wafer tablet, so that wafer tablet will not during being moved by support
It shakes, ensure that the stability of support.
The lifting column is configured to the first telescopic component of linear expansion in one of the embodiments, and described
The telescopic end of one telescopic component can be moved back and forth along the pick-and-place direction.Using the Telescopic of the first telescopic component itself,
To drive wafer tablet to move back and forth along the pick-and-place direction of wafer tablet.
The lifting column is at least three in one of the embodiments, the support of at least three lifting columns
Portion is arranged in plane.At least three supporting parts carry out support to wafer tablet, using at least 3 points at face principle, improve to wafer
The stability of tablet support.
The material platform is equipped with the second through-hole for passing through for the guide post in one of the embodiments, leads
It further include the second hoistable platform and the second driving mechanism to device, second hoistable platform is equipped with the guide post, described
Second driving mechanism is for driving second hoistable platform to move back and forth along the pick-and-place direction；When second hoistable platform
When in the third place, the guide post protrudes the material platform setting；When second hoistable platform is in four positions,
The guide post is set to the lower section in the blowing face of the material platform.The synchronization of guide post may be implemented using the second hoistable platform
Decline and rising avoid individually down or up draw so that introduction part is always in the horizontal plane oriented to wafer tablet
The machine error risen.
One end of at least two guide posts is equipped with guide part, and the guide part in one of the embodiments,
Big end be arranged close to the pedestal, at least two guide parts cooperatively form the introduction part.The guide part being oppositely arranged
Guide surface enable to wafer tablet to move along preset track.
The guide post is set as five in one of the embodiments, wherein three guide posts are respectively arranged at
On three sides of one rectangle, two guide post relative spacings are set on the Article 4 side of the rectangle and cooperate
Form the inlet and outlet for passing in and out for manipulator.Five guide posts are integrally in distributed rectangular, so that guiding device is suitable for square
Shape wafer tablet carries out guide-localization.
The second air-breathing being additionally provided on the material platform in one of the embodiments, for adsorbing the wafer tablet is logical
Road.The wafer tablet being placed on material platform is adsorbed using the second air intake passage, die bond operation is carried out to wafer tablet
Shi Jingyuan tablet will not occur to slide or shake, and ensure that the accuracy and accuracy of die bond.
A kind of flip machine, the guiding device including above-mentioned wafer tablet.
Above-mentioned flip machine, in use, wafer tablet is transported to the surface of pedestal and by wafer tablet blanking by manipulator
To preset lower discharge position, lifting column rises up to the lower surface of supporting part and wafer tablet abuts against or the support of lifting column
Portion stays in lower discharge position in advance, carries out support to wafer tablet using supporting part, improves wafer tablet in the horizontal plane
Stationarity, so that wafer tablet is realized after preliminary positioning, manipulator are removed in horizontal plane by lifting column support wafer tablet,
Wafer tablet is driven to move downward when lifting column declines, i.e., wafer tablet is mobile towards material platform, and wafer tablet is in movement
During, the position of adjustment wafer tablet in the horizontal plane under the guiding role for the introduction part that at least two guide posts are formed
It sets, wafer tablet steadily, is accurately moved on material platform and is placed in preset blowing region, facilitate subsequent work
The progress of sequence.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the guiding device of the wafer tablet of one embodiment；
Fig. 2 is the structural schematic diagram under a state of the guiding device of the wafer tablet of Fig. 1；
Fig. 3 is the structural schematic diagram under another state of the guiding device of the wafer tablet of Fig. 1；
Fig. 4 is the structural schematic diagram of the base part of the guiding device of the wafer tablet of Fig. 1.
Description of symbols:
10, guiding device, 110, pedestal, 120, material platform, 121, first through hole, the 122, second through-hole, 123, blowing face,
124, the second air intake passage, 130, guidance set, 131, guide post, the 132, second hoistable platform, the 133, second driving mechanism,
134, it imports and exports, 140, lifting column, 141, supporting part, the 142, first hoistable platform, the 143, first driving mechanism, 200, wafer material
Piece, 300, manipulator, 1311, guide part.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only to solve
The present invention is released, and the scope of protection of the present invention is not limited.
It should be noted that it can be directly another when element is referred to as " being set to ", " being fixedly arranged on " another element
On a element or there may also be elements placed in the middle.When element is referred to as " being fixedly arranged on " another element, or with another yuan
Part " is fixedly connected ", and can be the mode of being detachably fixed between them is also possible to non-removable fixed form.When a member
Part is considered as " connection ", " sealed connection " another element, it can be directly to another element or may be same
When there are centering elements.Term as used herein "vertical", "horizontal", "left" and "right", "upper", "lower" and similar
Statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the constraint present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
The similar term such as heretofore described " first ", " second ", " third " does not represent specific quantity and sequence, only
It is the differentiation for title.
As shown in Figures 1 to 4, one embodiment of the present of invention discloses a kind of guiding device 10 of wafer tablet, comprising:
Pedestal 110；Material platform 120, material platform 120 and pedestal 110 are arranged along the pick-and-place direction relative spacing of wafer tablet 200, blowing
Platform 120 is equipped with first through hole 121；Guidance set 130, guidance set 130 include the guiding of at least two relative spacings setting
Column 131, at least two guide posts 131, which enclose, to be set to form blowing region, at least two guide posts 131 protrude the setting of material platforms 120 and
Cooperatively form the introduction part for making wafer tablet 200 fall into blowing region；And lifting column 140, lifting column 140 are set to blowing
In region, one end of lifting column 140 is set on pedestal 110, and the other end of lifting column 140, which is equipped with, is used for support wafer tablet
200 supporting part 141, supporting part 141 can pass through first through hole 121, for moving wafer tablet 200 back and forth along direction is picked and placed
It is dynamic.
The guiding device 10 of the wafer tablet 200 of above-described embodiment, in use, manipulator 300 transports wafer tablet 200
To pedestal 110 surface and by 200 blanking of wafer tablet to preset lower discharge position, lifting column 140 rises until supporting part
141 abut against or the supporting part 141 of lifting column 140 stays in lower discharge position in advance with the lower surface of wafer tablet 200, utilize
Supporting part 141 carries out support to wafer tablet 200, the stationarity of wafer tablet 200 in the horizontal plane is improved, so that wafer material
Piece 200 is realized after preliminary positioning, manipulator 300 are removed in horizontal plane by 140 support wafer tablet 200 of lifting column, lifting
Wafer tablet 200 is driven to move downward when column 140 declines, i.e., wafer tablet 200 is mobile towards material platform 120, wafer material
Piece 200 in the process of moving, adjusts wafer tablet under the guiding role for the introduction part that at least two guide posts 131 are formed
200 position in the horizontal plane enables wafer tablet 200 steadily, to be accurately moved on material platform 120 and is placed in pre-
If blowing region, facilitate the progress of subsequent handling.
As shown in figure 4, optionally, guiding device 10 further includes the first hoistable platform 142 and the first driving mechanism 143,
One hoistable platform 142 is equipped with lifting column 140, and the first driving mechanism 143 is for driving the first hoistable platform 142 along pick-and-place direction
It moves back and forth；When the first hoistable platform 142 is in first position, supporting part 141 is set to the blowing face 123 of material platform 120
Top；When the first hoistable platform 142 is in the second position, supporting part 141 is set to the blowing face 123 of material platform 120
Lower section.The up and down motion of the first hoistable platform 142 is driven using the first driving mechanism 143, is set to the first lifting to drive
Lifting column 140 on platform 142 moves up and down so that 141 support of supporting part wafer tablet 200 along wafer tablet 200
Pick-and-place direction move back and forth, by the first hoistable platform 142 drive lifting column 140 realize rise and fall, when lifting column 140 is
It at more, can guarantee moving synchronously for lifting column 140, guarantee stability and accuracy that lifting column 140 moves, so that
The Primary Location of wafer tablet 200 is more accurate.When the first hoistable platform 142 is towards close to the movement of 120 direction of material platform, rise
Column 140 drops close to the movement of material platform 120, and supporting part 141 passes through first through hole 121 and is moved to the blowing face 123 of material platform 120
Top, until the first hoistable platform 142, when being moved to first position, supporting part 141 rises to top, so as to accept
Wafer tablet 200；When the first hoistable platform 142 is directed away from the movement of 120 direction of material platform, supporting part 141 is moved to blowing
The lower section in the blowing face 123 of platform 120 or across first through hole 121 until the lower section of material platform 120 is moved to, until the first lifting
When platform 142 is moved to the second position, supporting part 141 drops to lowermost end, so as to which wafer tablet 200 is placed in blowing
On platform 120.First driving mechanism 143 of the embodiment of the present invention can be cylinder, hydraulic cylinder or other can be realized reciprocating linear
The device of movement can also be the device that can be realized rotary motion, be converted rotary motion by adding intermediate conversion mechanism
To be transferred to the first hoistable platform 142 after linear motion, only the first hoistable platform 142 need to be enabled to along wafer tablet 200
Direction is picked and placed to move back and forth.In one embodiment, the first driving mechanism 143 is set as double-acting cylinder, and operation is flat
Surely, be not in impact phenomenon, lifting column 140 is enabled to realize stable support to wafer tablet 200.
Further, supporting part 141 is equipped with the first air intake passage (not shown) for adsorbing wafer tablet 200.?
Air intake passage is set on supporting part 141, can use the mode vacuumized and wafer tablet 200 is adsorbed, so that wafer material
Piece 200 will not shake during being moved by support, ensure that the stability of support, meanwhile, adsorption capacity makes wafer material
The bottom surface of piece 200 is tightly attached on supporting part 141, stable absorption can be carried out to the wafer tablet 200 of deformation, so that wafer material
The bottom surface of piece 200 is in same level, further improves the accuracy of 200 Primary Location of wafer tablet.The present invention is real
The bottom surface for applying the wafer tablet 200 of example, which is tightly attached on supporting part 141, refers to that supporting part 141 is tightly attached in the bottom surface of wafer tablet 200
End face on.
Optionally, lifting column 140 is configured to the first telescopic component (not shown) of linear expansion, the first telescopic component
Telescopic end can be moved back and forth along the pick-and-place direction of wafer tablet 200.Using the Telescopic of the first telescopic component itself, from
And wafer tablet 200 is driven to move back and forth along the pick-and-place direction of wafer tablet 200.First telescopic component of the embodiment of the present invention can
Be hydraulic cylinder, feed screw nut's assembly or other can be realized linear expansion movement component.
As shown in Figures 2 and 4, in one embodiment, lifting column 140 is at least three, at least three lifting columns 140
Supporting part 141 is arranged in plane.The supporting part 141 of at least three lifting columns 140 is arranged in plane, refers to 141 direction of supporting part
The end face of wafer tablet 200 is in same plane, and at least three supporting parts 141 carry out support to wafer tablet 200, using extremely
Few 3 points, at face principle, are improved the stability supported to wafer tablet 200, and it is preliminary to wafer tablet 200 to improve lifting column 140
The accuracy of positioning, so that wafer tablet 200 and horizontal plane keeping parallelism, enable wafer tablet 200 smoothly along feeding
Blowing direction moves back and forth.
In one embodiment, lifting column 140 is set as four, and four lifting columns 140 are in distributed rectangular in pedestal 110
On.When four lifting columns 140 are in distributed rectangular, wafer tablet 200 can be supported with four supporting points, to wafer tablet
More preferably, Primary Location effect further increases 200 support effect, so that wafer tablet 200 is more preferable in the stationarity of horizontal plane.
In one embodiment, lifting column 140 is set as the six roots of sensation, and six roots of sensation lifting column 140 is distributed in pedestal in regular hexagon
On 110.When six roots of sensation lifting column 140 is distributed in regular hexagon, wafer tablet 200 can be supported with six supporting points, it is right
More preferably, Primary Location effect further increases the support effect of wafer tablet 200, so that wafer tablet 200 is in the flat of horizontal plane
Stability is more preferable.
As shown in Figure 1, Figure 2 and shown in Fig. 4, based on any of the above embodiments, material platform 120 is equipped with for for guiding
The second through-hole 122 that column 131 passes through, guiding device 10 further include the second hoistable platform 132 and the second driving mechanism 133, and second
Hoistable platform 132 is equipped with guide post 131, and the second driving mechanism 133 is for driving the second hoistable platform 132 past along direction is picked and placed
It is multiple mobile；When the second hoistable platform 132 is in the third place, guide post 131 is protruded material platform 120 and is arranged；When the second lifting
When platform 132 is in four positions, guide post 131 is set to the lower section in the blowing face 123 of material platform 120.In the second driving machine
The second hoistable platform 132 is driven to move under the action of structure 133, to drive feeding blowing of the guide post 131 along wafer tablet 200
Direction movement may be implemented the synchronous decline of guide post 131 using the second hoistable platform 132 and rise, so that introduction part is always
Wafer tablet 200 is oriented in the horizontal plane, avoids individually down or up caused machine error.When the second lifting
When platform 132 is towards close to the movement of 120 direction of material platform, guide post 131 is mobile close to material platform 120, one end of guide post 131
Across the second through-hole 122 and be moved to material platform 120 blowing face 123 top, until the second hoistable platform 132 is moved to the
When three positions, guide post 131 protrudes material platform 120 and is arranged and cooperatively forms introduction part, so as to the wafer tablet to decline
200 are oriented to；When the second hoistable platform 132 is directed away from the movement of 120 direction of material platform, one end of guide post 131 is mobile
The lower section of material platform 120 is moved to the lower section in the blowing face 123 of material platform 120 or across the second through-hole 122, until second liter
When drop platform 132 is moved to four positions, one end of guide post 131 drops to lowermost end, so as to receive guide post 131
It rises, subsequent handling will not be interfered.Second driving mechanism 133 of the embodiment of the present invention can be cylinder, hydraulic cylinder or its
He can be realized the device of linear reciprocating motion, can with when can be realized the device of rotary motion, by adding intermediate conversion
Mechanism is transferred to the second hoistable platform 132 after converting linear motion for rotary motion, need to only enable to the second hoistable platform
132 move back and forth along the pick-and-place direction of wafer tablet 200.In one embodiment, the second driving mechanism 133 is set as film
Formula cylinder, it is compact-sized it is simple, manufacture is easy, at low cost, the service life is long, leakage is small, high-efficient.
Optionally, guide post 131 is configured to the second telescopic component (not shown) of linear expansion, the second telescopic component
Telescopic end cooperatively form introduction part.Using the Telescopic of the second telescopic component itself, to realize guide post 131 along wafer
The feeding blowing direction of tablet 200 moves back and forth.Second telescopic component of the embodiment of the present invention can be hydraulic cylinder, feed screw nut
Component or other can be realized linear expansion movement component.
As shown in Figures 3 and 4, based on any of the above embodiments, one end of at least two guide posts 131 is equipped with
Guide part 1311, and the big end of guide part 1311 is arranged close to pedestal 110, at least two guide parts 1311 cooperatively form importing
Portion.The guide surface for the guide part 1311 being oppositely arranged enables to wafer tablet 200 to move along preset track, when wafer tablet
200 side shift in the process of movement trend when, the guide surface of opposite guide part 1311 can be with wafer material
The other side of piece 200 contradicts, to prevent wafer tablet 200 from shifting, so that wafer tablet 200 is always in default rail
It is moved in mark, so as to accurately be moved to preset discharge position.The guide part 1311 of the embodiment of the present invention, which can be, leads
To cone, guiding Luntai, guiding voussoir or other elements with guiding role.In one embodiment, guide part 1311 is arranged
To be oriented to voussoir, guiding voussoir enables to the contact area of wafer tablet 200 and guide part 1311 to increase, enhances introduction part
Guide effect, enable wafer tablet 200 more steadily be accurately moved to default blowing region.It needs to be illustrated
, guide part 1311 can be integrally formed with guide post 131, can also be separately separately fabricated.
Further, guide part 1311 can be oppositely oriented column 131 around the center axis thereof of guide post 131.Guiding
Part 1311 can rotate, can be between guide part 1311 and wafer tablet 200 when being oriented to wafer tablet 200
Impact force is absorbed and is buffered, and can be prevented from scratching or damaging wafer tablet 200, be guaranteed the quality of product.
As shown in Figures 3 and 4, in one embodiment, guide post 131 is set as five, wherein three guide posts 131
It is respectively arranged on three sides of a rectangle, two 131 relative spacings of guide post are set on the Article 4 side of rectangle, simultaneously
Cooperatively form the inlet and outlet 134 for passing in and out for manipulator 300.Whole five guide posts 131 are in distributed rectangular, so that guiding dress
10 are set to be suitable for carrying out guide-localization to rectangle wafer tablet 200；The setting of inlet and outlet 134 facilitates manipulator 300 to wafer material
Piece 200 is picked up and the normal work that separates without influencing whether guiding device 10.
In another embodiment, guide post 131 is set as four, and four guide posts 131 are rounded to be distributed in pedestal 110
On.Four rounded distributions of guide post 131, so that guiding device 10 also can be suitably used for being oriented to circular wafers tablet 200
Positioning.
As shown in Figure 1 to Figure 3, based on any of the above embodiments, it is additionally provided on material platform 120 for adsorbing wafer
Second air intake passage 124 of tablet 200.Using the second air intake passage 124 to the wafer tablet 200 being placed on material platform 120
It is adsorbed, wafer tablet 200 will not occur to slide or shake when carrying out die bond operation to wafer tablet 200, ensure that die bond
Accuracy and accuracy.
One embodiment of the present of invention also discloses a kind of flip machine, the wafer tablet 200 including any of the above-described embodiment
Guiding device 10.
The flip machine of above-described embodiment, in use, wafer tablet 200 is transported to the surface of pedestal 110 by manipulator 300
And by 200 blanking of wafer tablet to preset lower discharge position, lifting column 140 rises until supporting part 141 and wafer tablet 200
Lower surface abuts against or the supporting part 141 of lifting column 140 stays in lower discharge position in advance, using supporting part 141 to wafer tablet
200 carry out support, improve the stationarity of wafer tablet 200 in the horizontal plane, so that wafer tablet 200 is realized just in horizontal plane
The positioning of step, manipulator 300 remove after by 140 support wafer tablet 200 of lifting column, lifting column 140 drives wafer when declining
Tablet 200 moves downward, i.e., wafer tablet 200 is mobile towards material platform 120, wafer tablet 200 in the process of moving,
The position of adjustment wafer tablet 200 in the horizontal plane, makes under the guiding role for the introduction part that at least two guide posts 131 are formed
Preset blowing region can steadily, be accurately moved on material platform 120 and be placed in by obtaining wafer tablet 200, be facilitated subsequent
The progress of process.
Specifically, wafer tablet 200 is carried to so that wafer tablet 200 is placed in holding for lifting column 140 by manipulator 300
In support portion 141, the first air intake passage on supporting part 141 adsorbs wafer tablet 200, to exist to wafer tablet 200
Preliminary positioning and stabilization are carried out on horizontal plane, lifting column 140 drives wafer tablet 200 towards material platform during declining
120 move, and in motion process, are oriented to using introduction part to wafer tablet 200, so that wafer tablet 200 is further adjusted
Whole blanking angles and positions enable wafer tablet 200 to be accurately placed in the preset blowing region of material platform 120 and by
Two air intake passages 124 adsorb wafer tablet 200, ensure that the accuracy of subsequent die bond operation, and wafer tablet 200 is placed
Behind the preset blowing region of material platform 120, guide post 131 drops under the blowing face 123 of material platform 120, can carry out
Subsequent handling；After the completion of the operation of subsequent die bond, the second air intake passage 124 cut-off, lifting column 140 rises thus by wafer material
The jacking of piece 200 carries out feeding by manipulator 300, at this point, guide post 131 also accordingly rises to predeterminated position, i.e., to feeding position
It can start the guide-localization operation of subsequent cycle.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
The constraint to patent of invention range therefore cannot be interpreted as.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of guiding device of wafer tablet characterized by comprising
Pedestal；
Material platform, the material platform and the pedestal are arranged along the pick-and-place direction relative spacing of the wafer tablet, the blowing
Platform is equipped with first through hole；
Guidance set, the guidance set include the guide post of at least two relative spacings setting, at least two guide posts
It encloses and sets to form blowing region, at least two guide posts are protruded the material platform setting and cooperatively formed for making the crystalline substance
Circle tablet falls into the introduction part in the blowing region；And
Lifting column, the lifting column are set in the blowing region, and one end of the lifting column is set on the pedestal, institute
The other end for stating lifting column is equipped with the supporting part for being used for wafer tablet described in support, and it is logical that the supporting part can pass through described first
Hole, for moving back and forth the wafer tablet along the pick-and-place direction.
2. the guiding device of wafer tablet according to claim 1, which is characterized in that further include the first hoistable platform and
One driving mechanism, first hoistable platform are equipped with the lifting column, and first driving mechanism is for driving described first
Hoistable platform is moved back and forth along the pick-and-place direction；
When first hoistable platform is in first position, the supporting part is set to the upper of the blowing face of the material platform
Side；
When first hoistable platform is in the second position, the supporting part is set under the blowing face of the material platform
Side.
3. the guiding device of wafer tablet according to claim 1, which is characterized in that the supporting part is equipped with for inhaling
First air intake passage of the attached wafer tablet.
4. the guiding device of wafer tablet according to claim 1, which is characterized in that the lifting column is configured to directly
The first flexible telescopic component of line, the telescopic end of first telescopic component can be moved back and forth along the pick-and-place direction.
5. the guiding device of wafer tablet according to claim 1, which is characterized in that the lifting column is at least three,
The supporting part of at least three lifting columns is arranged in plane.
6. the guiding device of wafer tablet according to any one of claims 1 to 5, which is characterized in that on the material platform
It further include the second hoistable platform and the second driving mechanism equipped with the second through-hole for passing through for the guide post, described second
Hoistable platform is equipped with the guide post, and second driving mechanism is for driving second hoistable platform along the pick-and-place side
To reciprocating movement；
When second hoistable platform is in the third place, the guide post protrudes the material platform setting；
When second hoistable platform is in four positions, the guide post is set under the blowing face of the material platform
Side.
7. the guiding device of wafer tablet according to any one of claims 1 to 5, which is characterized in that at least described in two
One end of guide post is equipped with guide part, and the big end of the guide part is arranged close to the pedestal, at least two guiding
Part cooperatively forms the introduction part.
8. the guiding device of wafer tablet according to any one of claims 1 to 5, which is characterized in that the guide post is set
It is set to five, wherein three guide posts are respectively arranged on three sides of a rectangle, between two guide posts are opposite
Every on the Article 4 side for be set to the rectangle and cooperatively forming inlet and outlet for passing in and out for manipulator.
9. the guiding device of wafer tablet according to any one of claims 1 to 5, which is characterized in that on the material platform
It is additionally provided with the second air intake passage for adsorbing the wafer tablet.
10. a kind of flip machine characterized by comprising the guiding of wafer tablet as described in any one of claim 1 to 9 fills
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810844127.XA CN108962802A (en) | 2018-07-27 | 2018-07-27 | The guiding device of flip machine and wafer tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810844127.XA CN108962802A (en) | 2018-07-27 | 2018-07-27 | The guiding device of flip machine and wafer tablet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962802A true CN108962802A (en) | 2018-12-07 |
Family
ID=64465749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810844127.XA Pending CN108962802A (en) | 2018-07-27 | 2018-07-27 | The guiding device of flip machine and wafer tablet |
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| Country | Link |
|---|---|
| CN (1) | CN108962802A (en) |
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| JP2009206315A (en) * | 2008-02-28 | 2009-09-10 | Chugai Ro Co Ltd | Substrate mounting device to table |
| JP2012033594A (en) * | 2010-07-29 | 2012-02-16 | Hitachi High-Technologies Corp | Substrate holder and substrate conveying system |
| JP2012109347A (en) * | 2010-11-16 | 2012-06-07 | Renesas Electronics Corp | Apparatus and method for thermal treatment |
| JP2013065658A (en) * | 2011-09-16 | 2013-04-11 | Renesas Electronics Corp | Stage with positioning mechanism, operation method of the same, and manufacturing method of semiconductor device |
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Application publication date: 20181207 |
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