CN108959158A - A kind of processor plate based on Whitley platform - Google Patents
A kind of processor plate based on Whitley platform Download PDFInfo
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Abstract
本申请公开了一种基于Whitley平台的处理器板,该处理器板主要包括CPU0和CPU1两个CPU,两个CPU之间通过UPI信号互联,且两个CPU分别通过UPI信号与系统背板连接;CPU0通过X4的DMI信号以及X8的UPLINK PCIE信号经由系统背板与PCH互联;两个CPU分别通过X16的PCIE信号经由系统背板与IO板连接;两个CPU还分别通过X16的PCIE信号与硬盘背板互联;CPU0通过X16的PCIE信号连接管理板的OCP3.0连接器,管理板用于带外管理和带内管理;CPU0还通过X8的PCIE信号与RAID卡连接。通过本申请中的处理器板能够实现处理器设计的模块化,有利于适应灵活的项目需求,降低研发成本,节省产品开发时间。
The application discloses a processor board based on the Whitley platform. The processor board mainly includes two CPUs, CPU0 and CPU1. The two CPUs are interconnected through UPI signals, and the two CPUs are respectively connected to the system backplane through UPI signals. ; CPU0 is connected to the PCH through the system backplane through the DMI signal of X4 and the UPLINK PCIE signal of X8; the two CPUs are respectively connected to the IO board through the PCIE signal of X16 through the system backplane; the two CPUs are also connected to the IO board through the PCIE signal of X16 Hard disk backplane interconnection; CPU0 is connected to the OCP3.0 connector of the management board through the PCIE signal of X16, and the management board is used for out-of-band management and in-band management; CPU0 is also connected to the RAID card through the PCIE signal of X8. The processor board in this application can realize the modularization of processor design, which is conducive to adapting to flexible project requirements, reducing research and development costs, and saving product development time.
Description
技术领域technical field
本申请涉及服务器系统设计技术领域,特别是涉及一种基于Whitley平台的处理器板。The present application relates to the technical field of server system design, in particular to a processor board based on Whitley platform.
背景技术Background technique
随着计算机技术的发展,Intel推出了新的服务器平台Whitley,Whitley平台需要CPU架构的升级,CPU架构的升级通常包括内存方面和IO方面的升级。随着Whitley平台中CPU架构的升级,如何在服务器系统中合理设计处理器主板的结构,从而提升服务器的内存能力和IO传输能力,是个重要问题。With the development of computer technology, Intel has launched a new server platform, Whitley. The Whitley platform requires an upgrade of the CPU architecture. The upgrade of the CPU architecture usually includes the upgrade of memory and IO. With the upgrade of the CPU architecture in the Whitley platform, how to reasonably design the structure of the processor motherboard in the server system to improve the memory capacity and IO transmission capacity of the server is an important issue.
目前的处理器主板结构中,一个处理器主板内通常包括计算模块、PCH(PlatformController Hub,平台控制)、CPLD(Complex Programmable Logic Device,复杂可编程逻辑器件)、BMC(Baseboard Management Controller,基本管理控制器)以及网络等多个模块。根据特定的项目需求,通过对整个处理器主板的结构设计,使各个模块之间协调运作,从而实现信号的稳定传输、数据运算、各部件的监控等多种功能。In the current processor motherboard structure, a processor motherboard usually includes a computing module, PCH (PlatformController Hub, platform control), CPLD (Complex Programmable Logic Device, complex programmable logic device), BMC (Baseboard Management Controller, basic management control device) and network and other modules. According to the specific project requirements, through the structural design of the entire processor motherboard, the various modules can be coordinated to operate, so as to realize the stable transmission of signals, data calculation, monitoring of various components and other functions.
然而,目前的处理器主板结构中,由于将计算模块、PCH、CPLD、BMC以及网络等多个模块组合设计在一块处理器主板中,当项目需求发生改变时,需要更改整个处理器主板的设计,具体地,需要重新评估板内信号的SI(Signal Integrity,信号完整性)、电源以及硬件设计等方案,投入人力和物力重新进行原理图设计、PCB(Printed Circuit Board,印制电路板)设计、物料采购以及板卡打板验证测试等流程。因此,目前处理器主板的共用性比较差,不便于服务器系统的升级和产品的更新。However, in the current structure of the processor board, since multiple modules such as the computing module, PCH, CPLD, BMC, and network are combined and designed in one processor board, when the project requirements change, the design of the entire processor board needs to be changed , Specifically, it is necessary to re-evaluate the SI (Signal Integrity, signal integrity) of the signal on the board, power supply and hardware design, and invest manpower and material resources to re-design the schematic diagram and PCB (Printed Circuit Board, printed circuit board) design , material procurement and board card board verification test and other processes. Therefore, at present, the commonality of the mainboard of the processor is relatively poor, which is inconvenient for upgrading of the server system and updating of products.
发明内容Contents of the invention
本申请提供了一种基于Whitley平台的处理器板,以解决现有技术中的处理器主板共用性差的问题。The present application provides a processor board based on the Whitley platform to solve the problem of poor commonality of processor boards in the prior art.
为了解决上述技术问题,本申请实施例公开了如下技术方案:In order to solve the above technical problems, the embodiment of the present application discloses the following technical solutions:
一种基于Whitley平台的处理器板,应用于服务器中,所述处理器板包括:CPU0和CPU1两个CPU,两个CPU之间通过UPI信号互联,且两个CPU分别通过UPI信号与系统背板连接;A processor board based on the Whitley platform is used in servers. The processor board includes two CPUs, CPU0 and CPU1. The two CPUs are interconnected through UPI signals, and the two CPUs communicate with the system back through UPI signals respectively. board connection;
CPU0通过X4的DMI信号以及X8的UPLINK PCIE(peripheral componentinterconnect express,高速串行计算机扩展总线标准)信号经由系统背板与PCH互联;CPU0 is interconnected with PCH through the system backplane through the DMI signal of X4 and the UPLINK PCIE (peripheral component interconnect express, high-speed serial computer expansion bus standard) signal of X8;
两个CPU分别通过X16的PCIE信号经由系统背板与IO板连接;The two CPUs are respectively connected to the IO board through the system backplane through the PCIE signal of X16;
两个CPU还分别通过X16的PCIE信号与硬盘背板互联;The two CPUs are also interconnected with the hard disk backplane through the PCIE signal of X16;
所述CPU0通过X16的PCIE信号连接管理板的OCP(Open Compute Project,开放计算项目)3.0连接器,所述管理板用于带外管理和带内管理;The CPU0 is connected to the OCP (Open Compute Project, Open Compute Project) 3.0 connector of the management board through the PCIE signal of X16, and the management board is used for out-of-band management and in-band management;
所述CPU0还通过X8的PCIE信号与RAID卡连接。The CPU0 is also connected to the RAID card through the PCIE signal of X8.
可选地,所述PCIE信号与其连接的终端相匹配。Optionally, the PCIE signal matches the terminal it is connected to.
可选地,与所述IO板连接的PCIE信号符合PCIE 4.0标准。Optionally, the PCIE signal connected to the IO board conforms to the PCIE 4.0 standard.
可选地,所述服务器包括基于Whitley平台的两路服务器或四路服务器。Optionally, the server includes a two-way server or a four-way server based on the Whitley platform.
可选地,当所述服务器为基于Whitley平台的两路服务器时,所述服务器中包括有一个所述处理器板。Optionally, when the server is a two-socket server based on the Whitley platform, the server includes one processor board.
可选地,当所述服务器为基于Whitley平台的两路服务器时,CPU0和CPU1共有三组X16的PCIE信号与硬盘背板互联。Optionally, when the server is a two-way server based on the Whitley platform, CPU0 and CPU1 have three sets of X16 PCIE signals interconnected with the hard disk backplane.
可选地,当所述服务器为基于Whitley平台的四路服务器时,所述服务器中包括有两个所述处理器板,两个所述处理器板之间通过系统背板连接。Optionally, when the server is a four-socket server based on the Whitley platform, the server includes two processor boards, and the two processor boards are connected through a system backplane.
可选地,当所述服务器为基于Whitley平台的四路服务器时,四个CPU共有六组X16的PCIE信号与硬盘背板互联。Optionally, when the server is a four-way server based on the Whitley platform, the four CPUs have a total of six groups of X16 PCIE signals interconnected with the hard disk backplane.
可选地,所述处理器板中每个CPU最大支持8个通道的16根DIMM(Dual-Inline-Memory-Modules,双列直插式存储模块,一种内存条)。Optionally, each CPU in the processor board supports a maximum of 16 DIMMs (Dual-Inline-Memory-Modules, Dual-Inline-Memory-Modules, a memory module) with 8 channels.
可选地,每个CPU中的内存槽为SMT内存槽。Optionally, the memory slots in each CPU are SMT memory slots.
本申请的实施例提供的技术方案可以包括以下有益效果:The technical solutions provided by the embodiments of the present application may include the following beneficial effects:
本申请提供一种基于Whitley平台的处理器板,该处理器板可用于两路服务器和四路服务器中。该处理器板主要包括两个CPU,两个CPU之间通过UPI信号互联,且两个CPU分别通过UPI信号与系统背板连接。该处理器板分别通过PCIE信号和DMI信号与外部板卡互联,还通过PCIE信号连接管理板的OCP3.0连接器,因此能够插入不同的OCP卡,从而实现系统网络的灵活配置。该处理器中的CPU0还通过X8的PCIE信号与RAID卡连接,通过RAID卡连接硬盘从而实现存储功能。本申请将计算模块从原有的综合多个模块功能的处理器主板中分离出来,设置专门的基于Whitley平台的处理器板,实现处理器设计的模块化,并在该处理器板上设置与其他板卡的信号连接装置,使得该处理器板主要负责计算功能,当项目需求发生改变时,能够及时对处理器板进行相应升级,且能够将该处理器板与其他板卡灵活组合,因此,目前的处理器板共用性较强,有利于服务器系统的升级和产品的更新。The present application provides a processor board based on the Whitley platform, which can be used in two-way servers and four-way servers. The processor board mainly includes two CPUs, the two CPUs are interconnected through UPI signals, and the two CPUs are respectively connected to the system backplane through UPI signals. The processor board is connected to external boards through PCIE signals and DMI signals, and is also connected to the OCP3.0 connector of the management board through PCIE signals, so different OCP cards can be inserted to realize flexible configuration of the system network. The CPU0 in the processor is also connected to the RAID card through the PCIE signal of the X8, and is connected to the hard disk through the RAID card to realize the storage function. In this application, the computing module is separated from the original processor main board that integrates multiple module functions, and a special processor board based on the Whitley platform is set to realize the modularization of the processor design. The signal connection device of other boards makes the processor board mainly responsible for computing functions. When the project requirements change, the processor board can be upgraded in time, and the processor board can be flexibly combined with other boards. Therefore, , the current processor board has a strong commonality, which is conducive to the upgrade of the server system and the update of the product.
应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本申请。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
附图说明Description of drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings on the premise of not paying creative work.
图1为本申请实施例所提供的一种基于Whitley平台的处理器板的结构示意图。FIG. 1 is a schematic structural diagram of a processor board based on a Whitley platform provided by an embodiment of the present application.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本申请中的技术方案,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本申请保护的范围。In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.
为了更好地理解本申请,下面结合附图来详细解释本申请的实施方式。In order to better understand the present application, the implementation manner of the present application will be explained in detail below in conjunction with the accompanying drawings.
参见图1,图1为本申请实施例所提供的一种基于Whitley平台的处理器板的结构示意图。由图1可知,本实施例所提供的处理器板主要包括两个CPU:CPU0和CPU1,其中CPU0为主CPU,两个CPU之间通过UPI信号互联,且两个CPU分别通过UPI信号与系统背板连接。本实施例中系统背板即图1中的SYS BP,系统背板上不设置任何芯片,用于实现服务器系统内各个板卡之间的信号连接。Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of a processor board based on a Whitley platform provided by an embodiment of the present application. It can be seen from Fig. 1 that the processor board provided in this embodiment mainly includes two CPUs: CPU0 and CPU1, wherein CPU0 is the main CPU, and the two CPUs are interconnected through UPI signals, and the two CPUs communicate with the system through UPI signals respectively. backplane connection. In this embodiment, the system backplane is the SYS BP in FIG. 1 , and no chip is arranged on the system backplane, which is used to realize the signal connection between various boards in the server system.
继续参见图1可知,CPU0通过X4的DMI信号以及X8的UPLINK PCIE信号经由系统背板与PCH互联。两个CPU分别通过X16的PCIE信号经由系统背板与IO板连接;两个CPU还分别通过X16的PCIE信号与硬盘背板互联,图1中的HDD(Hard Disk Drive,硬盘驱动器)BP为硬盘背板,硬盘背板上设置有硬盘连接器、硬盘的电源调节器VR、逻辑控制芯片等,用于连接硬盘。Continuing to refer to FIG. 1, it can be seen that CPU0 is interconnected with the PCH through the system backplane through the DMI signal of X4 and the UPLINK PCIE signal of X8. The two CPUs are respectively connected to the IO board through the system backplane through the PCIE signal of X16; the two CPUs are also connected to the hard disk backplane through the PCIE signal of X16, and the HDD (Hard Disk Drive, hard disk drive) BP in Figure 1 is the hard disk The backplane, the hard disk backplane is provided with a hard disk connector, a power regulator VR of the hard disk, a logic control chip, etc., for connecting the hard disk.
CPU0通过X16的PCIE信号连接管理板的OCP3.0连接器,管理板用于带外管理和带内管理,本实施例中的管理板用于对整个服务器系统中所有IO的管理,包括BMC、CPLD等。本实施例中CUP0通过X16的PCIE信号连接管理板的OCP3.0连接器,通过在OCP3.0连接器插入不同的OCP卡能够实现系统网络的灵活配置,也就是通过CPU0的这种连接关系设置,能够使处理器板连接到网卡,从而通过网络与外部实现信息交互。CPU0 is connected to the OCP3.0 connector of the management board through the PCIE signal of X16. The management board is used for out-of-band management and in-band management. The management board in this embodiment is used for the management of all IOs in the entire server system, including BMC, CPLD, etc. In this embodiment, CPU0 is connected to the OCP3.0 connector of the management board through the PCIE signal of X16, and the flexible configuration of the system network can be realized by inserting different OCP cards into the OCP3.0 connector, that is, through the connection relationship setting of CPU0 , enabling the processor board to be connected to the network card, thereby realizing information exchange with the outside through the network.
本实施例中CPU0还通过X8的PCIE信号与RAID卡连接,通过RAID连接硬盘能够实现处理器板的存储功能。而且,通过CPU0与RAID卡的连接,利用RAID卡连线到硬盘背板,能够实现NVME硬盘和SAS硬盘兼容,有利于提高处理器板的共用性和配置的灵活性。In this embodiment, CPU0 is also connected to the RAID card through the PCIE signal of X8, and the storage function of the processor board can be realized by connecting the hard disk through the RAID. Moreover, through the connection between CPU0 and the RAID card, the RAID card is used to connect to the hard disk backplane, so that the NVME hard disk and the SAS hard disk can be compatible, which is conducive to improving the commonality of the processor board and the flexibility of configuration.
综上所述,该处理器板能够通过PCIE信号和DMI信号实现与外部板卡的互联。其中,为确保处理器板与外部的高速通信互联,PCIE信号与其连接的终端相匹配,也就是PCIE信号的标准级别由其所连接的终端来决定。In summary, the processor board can be interconnected with external boards through PCIE signals and DMI signals. Among them, in order to ensure the high-speed communication interconnection between the processor board and the outside, the PCIE signal matches the terminal to which it is connected, that is, the standard level of the PCIE signal is determined by the terminal to which it is connected.
具体地,与IO板连接的PCIE信号符合PCIE 4.0标准,两个CPU分别通过X16的PCIE信号经由系统背板连接到IO板,该走线遵循PCIE4.0的原则,能够使IO板的槽位最大速率支持PCIE4.0的信号,同时还能够向下兼容PCIE3.0/2.0/1.0等标准。与硬盘背板互联的PCIE信号为PCIE 3.0信号,与OCP3.0连接器连接的X16的PCIE信号为PCIE4.0信号,与RAID卡连接的X8的PCIE信号为PCIE 3.0信号。Specifically, the PCIE signal connected to the IO board conforms to the PCIE 4.0 standard, and the two CPUs are respectively connected to the IO board through the PCIE signal of X16 via the system backplane. The maximum rate supports PCIE4.0 signals, and it is also backward compatible with PCIE3.0/2.0/1.0 and other standards. The PCIE signal interconnected with the hard disk backplane is a PCIE 3.0 signal, the PCIE signal of the X16 connected to the OCP3.0 connector is a PCIE4.0 signal, and the PCIE signal of the X8 connected to the RAID card is a PCIE 3.0 signal.
本申请中的处理器板可用于基于Whitley平台的两路服务器或四路服务器。当处理器板应用于两路服务器时,两路服务器中包括一个处理器板,即:两路服务器的处理器器板上包括两个CPU:CPU0和CPU1,两个CPU之间通过UPI信号互联。当处理器板应用于四路服务器时,四路服务器中包括上下两个处理器板,两个处理器板之间通过系统背板连接。此时四路服务器中共4个CPU:CPU0、CPU1、CPU2和CPU3,每两个CPU构成一组且每两个CPU设置于一个处理器板上。两组CPU之间通过系统背板连接,每组内的两个CPU之间通过UPI信号互联。The processor board in this application can be used in a two-socket server or a four-socket server based on the Whitley platform. When the processor board is applied to a two-way server, one processor board is included in the two-way server, that is, the processor board of the two-way server includes two CPUs: CPU0 and CPU1, and the two CPUs are interconnected through UPI signals . When the processor board is applied to a four-way server, the four-way server includes two processor boards, one upper and the lower, and the two processor boards are connected through a system backplane. At this time, the four-way server has four CPUs in total: CPU0, CPU1, CPU2, and CPU3. Every two CPUs form a group and every two CPUs are arranged on a processor board. The two groups of CPUs are connected through the system backplane, and the two CPUs in each group are interconnected through UPI signals.
当处理器板应用于两路服务器中时,CPU0和CPU1共有三组X16的PCIE信号与硬盘背板互联,每个PCIe 3.0*16的信号可连接4个NVMe硬盘,因此,在两路服务器中,通过本申请中的处理器板,可连接12个NVMe硬盘,也就是在在2U高度内可支持12个NVMe硬盘。当处理器板应用于四路服务器中时,四个CPU共有六组X16的PCIE信号与硬盘背板互联,在四路服务器中,通过设置两个处理器板,可连接24个NVMe硬盘,也就是在4U高度内可支持24个NVMe硬盘。本实施例中处理器板的这种结构设计,能够充分利用CPU内部PCIE的分布特点,大大减少PCIE信号的走线长度,有利于提升信号的质量。When the processor board is used in a two-way server, CPU0 and CPU1 have three sets of X16 PCIE signals connected to the hard disk backplane, and each PCIe 3.0*16 signal can be connected to four NVMe hard disks. Therefore, in a two-way server , through the processor board in this application, 12 NVMe hard disks can be connected, that is, 12 NVMe hard disks can be supported within a 2U height. When the processor board is used in a four-way server, the four CPUs have a total of six sets of X16 PCIE signals connected to the hard disk backplane. In a four-way server, by setting two processor boards, 24 NVMe hard drives can be connected. That is, it can support 24 NVMe hard drives within 4U height. The structural design of the processor board in this embodiment can make full use of the distribution characteristics of PCIE inside the CPU, greatly reduce the routing length of PCIE signals, and help improve the quality of signals.
本实施例中处理器板内每个CPU最大支持8个通道的16根DIMM,能够将内存速率从2933MT/s提升到3200MT/s,相比于上一代平台Purley平台能够提升30%的存储速率。In this embodiment, each CPU in the processor board supports a maximum of 16 DIMMs with 8 channels, which can increase the memory rate from 2933MT/s to 3200MT/s, which can increase the storage rate by 30% compared with the previous generation platform Purley platform .
为实现8个通道的16根DIMM的结构设计,本实施例在处理器板的板宽不变的情况下,将内存槽之间的间距以及内存槽到CPU的间距都进行缩小。内存槽的间距以及内存槽到CPU的距离设置,只要能够符合Intel内存的走线规范,并能够容纳8个通道的16根DIMM即可。例如:内存槽之间的间距从370mil缩减到310mil,内存槽到CPU的最小间距从880mil减小至580mil。In order to realize the structural design of 16 DIMMs with 8 channels, in this embodiment, the distance between the memory slots and the distance between the memory slot and the CPU are both reduced while the board width of the processor board remains unchanged. The distance between the memory slots and the distance from the memory slot to the CPU can be set as long as it meets the wiring specification of Intel memory and can accommodate 16 DIMMs with 8 channels. For example: the distance between the memory slots is reduced from 370mil to 310mil, and the minimum distance between the memory slot and the CPU is reduced from 880mil to 580mil.
进一步地,本实施例处理器板中的CPU,其内存槽为SMT内存槽,内存槽即内存连接器。也就是说,本实施例中CPU中的内存槽采用SMT工艺制作,能够大大提升信号传输的质量。Further, the memory slot of the CPU in the processor board of this embodiment is an SMT memory slot, and the memory slot is a memory connector. That is to say, in this embodiment, the memory slot in the CPU is made by SMT technology, which can greatly improve the quality of signal transmission.
综上所述,本申请中基于Whitley平台的处理器板,通过两个CPU构成单独的处理器模块,将计算模块从原有的综合多个模块功能的处理器主板中分离出来,实现处理器设计的模块化,使得该处理器板主要负责计算功能。并通过PCIE信号和DMI信号实现处理器板与外部板卡互联,还通过PCIE信号连接管理板的OCP3.0连接器实现处理器板与外部网络的连接。这种模块化的结构设计,当项目需求发生改变时,能够及时对处理器板进行相应升级,且能够将该处理器板与其他板卡灵活组合,因此,目前的处理器板共用性较强,有利于服务器系统的升级和产品的更新。而且这种模块化的结构设计,由于能够灵活适应不同的项目需求,有利于降低研发成本,节省产品开发时间。In summary, the processor board based on the Whitley platform in this application forms a separate processor module through two CPUs, and separates the computing module from the original processor board that integrates multiple module functions to realize the processor The modularity of the design makes this processor board mainly responsible for computing functions. The interconnection between the processor board and the external board is realized through the PCIE signal and the DMI signal, and the OCP3.0 connector of the management board is connected through the PCIE signal to realize the connection between the processor board and the external network. This modular structure design can upgrade the processor board in time when the project requirements change, and can flexibly combine the processor board with other boards. Therefore, the current processor board has strong commonality. , which is conducive to server system upgrades and product updates. Moreover, this modular structure design, because it can flexibly adapt to different project requirements, is conducive to reducing research and development costs and saving product development time.
以上所述仅是本申请的具体实施方式,使本领域技术人员能够理解或实现本申请。对这些实施例的多种修改对本领域的技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本申请的精神或范围的情况下,在其它实施例中实现。因此,本申请将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above descriptions are only specific implementation manners of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the present application will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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