CN112765067A - Hard disk backboard and mainboard assembling structure - Google Patents
Hard disk backboard and mainboard assembling structure Download PDFInfo
- Publication number
- CN112765067A CN112765067A CN202011627859.7A CN202011627859A CN112765067A CN 112765067 A CN112765067 A CN 112765067A CN 202011627859 A CN202011627859 A CN 202011627859A CN 112765067 A CN112765067 A CN 112765067A
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- connector
- hard disk
- ocp
- circuit board
- connectors
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0026—PCI express
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0028—Serial attached SCSI [SAS]
Abstract
The invention relates to the technical field of electronics, and discloses a hard disk backboard and a mainboard assembling structure. In the present invention, the hard disk backplane comprises: the circuit board comprises a hard disk connector arranged on the circuit board and an OCP connector arranged on the circuit board and used for being connected with a mainboard; the circuit board comprises a hard disk setting area for setting the hard disk connector, and the OCP connector is arranged in the hard disk setting area. Compared with the prior art, the hard disk backboard and the mainboard assembling structure provided by the embodiment of the invention have the advantages that the number of OCP connectors in the mainboard assembling structure is increased while the mainboard is not required to be modified.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a hard disk backboard and mainboard assembling structure.
Background
With the development of computer technology, OCP is widely used in the field of servers, and the standard of an OCP card is a sandwich card standard established by the organization of OCP (open computer project), and OCP is also widely used not only in high-density servers but also in general-purpose servers. With the popularization of the OCP standard, more and more servers are reserved with OCP connectors to realize flexible selection of expansion cards.
However, the inventor of the present invention finds that, in the assembly process of the server in the prior art, due to the limitation of the IO function and the space, only one OCP connector is usually designed on the motherboard, even some server motherboards are not provided with an OCP connector, in this case, if the number of OCP connectors is increased by modifying the motherboard design, the modification cost is huge, the development cycle of the product is also increased, and the configuration flexibility of the IO is insufficient.
Disclosure of Invention
The embodiment of the invention aims to provide a hard disk backboard and a mainboard assembling structure, which can improve the setting number of OCP connectors without modifying a mainboard.
In order to solve the above technical problem, an embodiment of the present invention provides a hard disk backplane, including: the circuit board comprises a hard disk connector arranged on the circuit board and an OCP connector arranged on the circuit board and used for being connected with a mainboard; the circuit board comprises a hard disk setting area for setting the hard disk connector, and the OCP connector is arranged in the hard disk setting area.
An embodiment of the present invention further provides a motherboard assembly structure, including: the hard disk drive comprises a main board and the hard disk back board connected with the main board.
Compared with the prior art, the OCP connector used for being connected with the mainboard is arranged on the hard disk backboard, when the mainboard needs to be connected with a plurality of OCP devices, the OCP connector on the hard disk backboard can be connected with the OCP devices, and the OCP connector on the hard disk backboard can be equivalent to the OCP connector of the mainboard because the OCP connector on the hard disk backboard is connected with the mainboard, so that the number of the OCP connectors of the mainboard is increased while the mainboard does not need to be modified. In addition, because the number of the hard disk connectors arranged on the hard disk back plate is large, the OCP connectors are arranged in the hard disk arrangement area, and the influence of the arrangement area of part of the hard disk connectors on the function of the hard disk back plate is small.
In addition, still include: and the NCSI connector is arranged in the hard disk setting area and is connected with the OCP connector through an NCSI bus. The NCSI connector is connected with the OCP connector through the NCSI bus, so that the OCP connector can provide complete OCP functions, and the flexibility of IO configuration of the system is enhanced.
In addition, still include: the Slimline connector is arranged on the circuit board and connected with the OCP connector.
In addition, the hard disk connector is an SFF8639 connector arranged on the circuit board; the number of the Slimline connectors is multiple, a part of the Slimline connectors are connected with the SFF8639 connector, and a part of the Slimline connectors are connected with the OCP connector.
In addition, the Slimline connector is connected with the OCP connector or the SFF8639 connector via a PCIE bus.
In addition, the SFF8639 connector comprises a plurality of channels, and the plurality of channels comprise NVME channels for connecting NVME hard disks and/or SAS channels for connecting SAS hard disks and/or SATA channels for connecting SATA hard disks.
In addition, the motherboard includes a slimSAS connector that connects with the OCP connector via a PCIE bus. The slim SAS connector is connected with the OCP connector through a PCIE bus, so that an OCP interface on a hard disk backplane can support an OCP card of X16.
In addition, the number of the slim sas connectors is multiple, and the slim sas connectors are connected to the OCP connector through the PCIE buses which are independent of each other. The plurality of slimSAS connectors are respectively connected with the OCP connector through a plurality of PCIE buses which are mutually independent, so that an OCP interface on the hard disk backplane can support an X8 OCP card.
In addition, the main board comprises a slimSAS connector and a MINISAS connector, the slimSAS connector is connected with the NVME channel of the SFF8639 connector via a PCIE bus, and the MINISAS connector is connected with the SAS channel and/or the SATA channel of the SFF8639 connector.
Drawings
Fig. 1 is a schematic structural diagram of a hard disk backplane according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a hard disk backplane according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a hard disk backplane according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of a motherboard assembly structure according to a fourth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a hard disk backplane, which has a specific structure shown in fig. 1, and includes: the circuit board 10, set up hard disk connector 20 on circuit board 10 and set up on circuit board 10, be used for with mainboard connection's OCP connector 30, circuit board 10 includes the hard disk setting region that is used for setting up hard disk connector 20, and OCP connector 30 sets up in the hard disk setting region.
Compared with the prior art, the OCP connector 30 used for being connected with the mainboard is arranged on the hard disk backboard, when the mainboard needs to be connected with a plurality of OCP devices, the OCP connector on the hard disk backboard can be connected with the OCP devices, and the OCP connector on the hard disk backboard can be equivalent to the OCP connector of the mainboard because the OCP connector on the hard disk backboard is connected with the mainboard, so that the number of the OCP connectors of the mainboard is increased while the mainboard does not need to be modified. In addition, because the number of the hard disk connectors 20 arranged on the hard disk backplane is large, the OCP connectors arranged in the hard disk arrangement area occupy part of the arrangement area of the hard disk connectors 20, and the function influence on the hard disk backplane is small.
Specifically, in the present embodiment, the OCP connector 30 is disposed in the hard disk installation area of the circuit board 10, and in practical applications, the OCP connector 30 may be replaced with the hard disk connector 20 originally disposed in the hard disk installation area. For example, the hard disk connectors 20 of two 2.5 inches hard disks arranged in a row below the 4NVME 2.5 inches hard disk backplane may be replaced by one OCP connector 30, or the hard disk connectors 20 of 3.5 inches at other positions may be replaced by one OCP connector 30, and so on. It should be understood that the foregoing is only a specific example of the present embodiment, and is not limited thereto, and that flexible arrangement, such as arranging a plurality of OCP connectors 30, may be specifically performed according to actual needs.
A second embodiment of the present invention relates to a hard disk backplane, as shown in fig. 2, the second embodiment is substantially the same as the first embodiment, and includes a circuit board 10, a hard disk connector 20, and an OCP connector 30, and the main differences are that: in the second embodiment of the present invention, the present invention further includes an NCSI connector 40 provided in the hard disk installation area, and the NCSI connector 40 is connected to the OCP connector 30 via an NCSI bus.
Compared with the prior art, the second embodiment of the present invention maintains all technical effects of the first embodiment, and at the same time, the NCSI connector 40 is connected to the OCP connector 30 via the NCSI bus, so as to ensure that the OCP connector 30 can provide a complete OCP function, and enhance flexibility of IO interface configuration of the system.
Specifically, in the present embodiment, the Slimline connector 50 is further included, and the Slimline connector 50 is connected to the OCP connector 30, which is disposed on the circuit board 10.
A third embodiment of the present invention relates to a hard disk backplane, as shown in fig. 3, the third embodiment is substantially the same as the first embodiment, and includes a circuit board 10, a hard disk connector 20, and an OCP connector 30, and the main differences are that: in the third embodiment of the present invention, the hard disk connector 20 is specifically an SFF8639 connector 60 provided on the circuit board 10; and a plurality of Slimline connectors 50 arranged on the circuit board 10, wherein part of the Slimline connectors 50 are connected with the SFF8639 connector 60, and the rest part of the Slimline connectors 50 are connected with the OCP connector 30.
SFF8639 connector 60 includes a plurality of channels, and the plurality of channels include an NVME channel for connecting NVME hard disks and/or an SAS channel for connecting SAS hard disks and/or an SATA channel for connecting SATA hard disks.
Compared with the prior art, the hard disk backplane provided by the third embodiment of the present invention retains the technical effects of the first embodiment, and at the same time, by setting SFF8639 connector 60 to include multiple channels, where the multiple channels include an NVME channel for connecting an NVME hard disk and/or an SAS channel for connecting an SAS hard disk and/or an SATA channel for connecting an SATA hard disk, the flexibility of the configuration of the IO port on the hard disk backplane can be effectively improved.
Specifically, in the present embodiment, the slim line connector 50 is connected to the OCP connector 30 via a PCIE bus, and the slim line connector 50 is connected to the SFF8639 connector 60 via a PCIE bus.
A fourth embodiment of the present invention relates to a motherboard assembly structure, as shown in fig. 4, including: mainboard 100 and hard disk backplate 200 connected with mainboard 100 and provided by the previous embodiment.
Compared with the prior art, since the motherboard assembly structure provided by the fourth embodiment of the present invention includes the hard disk backplane provided by the foregoing embodiment, the motherboard assembly structure provided by the fourth embodiment of the present invention also has the technical effects of the foregoing embodiment, and further description thereof is omitted.
Specifically, in this embodiment, the motherboard includes a slimSAS connector 101, and the slimSAS connector 101 is connected to the OCP connector 30 via a PCIE bus. The slim sas connector 101 is connected with the OCP connector 30 via a PCIE bus, so that the OCP interface on the hard disk backplane can support an OCP card of X16.
Preferably, in another embodiment of the present invention, the motherboard may further include a plurality of slimSAS connectors 101, and each of the plurality of slimSAS connectors 101 may be connected to the OCP connector 30 via a plurality of PCIE buses independent of each other. The slim sas connectors 101 are connected to the OCP connector 30 via a plurality of PCIE buses independent of each other, so that the OCP interface on the hard disk backplane can support an OCP card of X8.
In addition, in other embodiments of the present invention, the motherboard may further include a slimSAS connector 101 and a MINISAS connector 102, where the slimSAS connector 101 is connected to the NVME channel of the SFF8639 connector 60 via a PCIE bus, and the MINISAS connector 102 is connected to the SAS channel and/or the SATA channel of the SFF8639 connector 60. The slim SAS connector 101 is connected with the NVME channel of the SFF8639 connector 60 through a PCIE bus, the MINISAS connector 102 is connected with the SAS channel and/or SATA channel of the SFF8639 connector 60, the slim SAS connector 101 and the MINISAS connector 102 are simultaneously connected into the SFF8639 connector 60, the SFF8639 connector 60 can selectively communicate according to the type of an actually inserted hard disk, and the flexibility of IO interface configuration in a mainboard assembly structure is further improved.
It is obvious that this embodiment is a motherboard assembly structure embodiment corresponding to the hard disk backplane embodiment, and this embodiment can be implemented in cooperation with the hard disk backplane embodiment. The related technical details mentioned in the foregoing hard disk backplane embodiment are still valid in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related technical details mentioned in the present embodiment can also be applied to the foregoing hard disk backplane embodiment.
It should be noted that each module referred to in this embodiment is a logical module, and in practical applications, one logical unit may be one physical unit, may be a part of one physical unit, and may be implemented by a combination of multiple physical units. In addition, in order to highlight the innovative part of the present invention, elements that are not so closely related to solving the technical problems proposed by the present invention are not introduced in the present embodiment, but this does not indicate that other elements are not present in the present embodiment.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A hard disk backplane, comprising:
the circuit board comprises a hard disk connector arranged on the circuit board and an OCP connector arranged on the circuit board and used for being connected with a mainboard;
the circuit board comprises a hard disk setting area for setting the hard disk connector, and the OCP connector is arranged in the hard disk setting area.
2. The hard disk backplane of claim 1, further comprising:
and the NCSI connector is arranged in the hard disk setting area and is connected with the OCP connector through an NCSI bus.
3. The hard disk backplane of claim 1, further comprising:
the Slimline connector is arranged on the circuit board and connected with the OCP connector.
4. The hard disk backplane of claim 3, wherein the hard disk connector is an SFF8639 connector disposed on the circuit board;
the number of the Slimline connectors is multiple, a part of the Slimline connectors are connected with the SFF8639 connector, and a part of the Slimline connectors are connected with the OCP connector.
5. The hard disk backplane according to claim 4, wherein the Slimline connector is connected to the OCP connector or the SFF8639 connector via a PCIE bus.
6. The hard disk backplane according to claim 4, wherein the SFF8639 connector comprises a plurality of channels, and the plurality of channels comprise NVME channels for connecting NVME hard disks and/or SAS channels for connecting SAS hard disks and/or SATA channels for connecting SATA hard disks.
7. A main board assembly structure, comprising: a motherboard and the hard disk backplane of any one of claims 1 to 6 connected to the motherboard.
8. A motherboard assembly structure as recited in claim 7, wherein the motherboard includes a slimSAS connector, the slimSAS connector being connected with the OCP connector via a PCIE bus.
9. A motherboard assembly structure as recited in claim 8, wherein the number of said slimSAS connectors is plural, and a plurality of said slimSAS connectors are connected to said OCP connector via a plurality of said PCIE buses independent of each other.
10. The motherboard assembly structure as recited in claim 7, when the hard disk backplane is the hard disk backplane of any one of claims 4 to 6, wherein the motherboard comprises a slimSAS connector connected to the NVME channel of the SFF8639 connector via a PCIE bus and a MINISAS connector for connecting to the SAS channel and/or SATA channel of the SFF8639 connector.
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Cited By (1)
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TWI826791B (en) * | 2021-05-28 | 2023-12-21 | 英業達股份有限公司 | Mother board |
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