CN108901190A - A kind of electronic radiation pipe - Google Patents

A kind of electronic radiation pipe Download PDF

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Publication number
CN108901190A
CN108901190A CN201811087796.3A CN201811087796A CN108901190A CN 108901190 A CN108901190 A CN 108901190A CN 201811087796 A CN201811087796 A CN 201811087796A CN 108901190 A CN108901190 A CN 108901190A
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CN
China
Prior art keywords
plate
top plate
bottom plate
side plate
item
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811087796.3A
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Chinese (zh)
Inventor
梅洹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Gold Huanke Technology Co Ltd
Original Assignee
Chengdu Gold Huanke Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Gold Huanke Technology Co Ltd filed Critical Chengdu Gold Huanke Technology Co Ltd
Priority to CN201811087796.3A priority Critical patent/CN108901190A/en
Publication of CN108901190A publication Critical patent/CN108901190A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of electronic radiation pipes, it is related to electronic heat sink field, including tube body, the tube body is surrounded by top plate, side plate, bottom plate, the top plate includes inverted draw cut item, the first top plate, the second top plate, and inverted draw cut notch is seamlessly connected with the first top plate and the second top plate respectively;The side plate includes the first side plate, the second side plate, and the first side plate is vertical with the first top plate to be connect, and the second side plate is vertical with the second top plate to be connect;The bottom plate includes kerve item, the first bottom plate, the second bottom plate, and the first bottom plate and the first side plate are seamlessly connected, and the second bottom plate and the second side plate are seamlessly connected, and kerve notch is seamlessly connected with the first bottom plate and the second bottom plate respectively;The outside of the top plate, the outside of side plate are provided with several parallel radiation tooths on the outside of bottom plate.Beneficial effects of the present invention have:It is bigger than traditional heat-dissipating plate heat dissipation area using tubular structure, improve unit time radiating efficiency.

Description

A kind of electronic radiation pipe
Technical field
The present invention relates to electronic heat sink field, in particular to a kind of electronic radiation pipe.
Background technique
With the rapid development of modern science and technology, the electronic product speed of service is continuously improved, and product characteristic is increasing, at this Under the premise of a little development, so that the design work of Electronic Design worker becomes increasingly complex, in the design of cooling electronic component device In, the heat dissipation problem of electronic component, chip must be resolved.The overall development trend of electronic device is lightweight, minimizes, However an important factor for restrict electronic device is overall efficiency and heat dissipation effect, in order to improve heat dissipation effect, need to use more has The heat dissipation technology of effect reduces volume under identical heat dissipation effect or improves heat dissipation effect under identical volume.High-power Main heat sink mode in electronic device has high wind refrigeration and installation radiator.Radiator is made of the good conductor material of heat, dissipates Hot device makes chip by the close contact with chip device surface, and the heat of device is transmitted to radiator, its surface makes heat Radiation is increased, and the air of circulation takes away a large amount of heat.Existing radiator is mostly single plate structure, and single area radiates, Heat dissipation region area is small, and heat dissipation is uneven, and heat dissipation effect is bad.
Summary of the invention
It is an object of the invention to:Provide a kind of electronic radiation pipe, solve heat dissipation region area is small, heat dissipation effect not Good problem.
The technical solution adopted by the present invention is as follows:
A kind of electronic radiation pipe, including tube body, the tube body are surrounded by top plate, side plate, bottom plate, and the top plate includes inverted draw cut Item, the first top plate, the second top plate, inverted draw cut notch are seamlessly connected with the first top plate and the second top plate respectively, the first top plate and the Two top plates are parallel with the slot bottom of inverted draw cut item, and the first top plate is symmetric with the second top plate with the center line of inverted draw cut item;The side Plate includes the first side plate, the second side plate, and the first side plate is vertical with the first top plate to be connect, and the second side plate is vertical with the second top plate to be connected It connects;The bottom plate includes kerve item, the first bottom plate, the second bottom plate, and the first bottom plate and the first side plate are seamlessly connected, the second bottom plate with The seamless connection of second side plate, kerve notch are seamlessly connected with the first bottom plate and the second bottom plate respectively, the first bottom plate and the second bottom Plate is symmetric with the center line of kerve item;A heat dissipation platform, institute are each provided on the inside of first bottom plate and the second bottom plate It states heat dissipation platform to be seamlessly connected with corresponding bottom plate, the center line of two heat dissipation platform kerves is symmetric;Outside, the side of the top plate Several parallel radiation tooths are provided on the outside of the outside of plate, bottom plate.
Existing radiator is mostly single plate structure, and single area heat dissipation, heat dissipation region area is small, and heat dissipation is uneven, heat dissipation It is ineffective.Radiator is made of the good conductor material of heat, and radiator makes chip by the close contact with chip device surface, The heat of device is transmitted to radiator, its surface increases radiation of heat, and the air of circulation takes away a large amount of heat.This A kind of electronic radiation pipe is invented, using tubular structure, is provided with radiation tooth on the outside of tube body, more than traditional heat-dissipating plate heat dissipation area Greatly, unit time radiating efficiency is improved;Furthermore ventilation opening is formed among tubular structure, air velocity increases in unit length, into One step increases heat dissipation effect.Two pieces of symmetrical heat dissipation platforms are main radiating area, are designed using symmetrical expression, and actual test dissipates Single 2-3 times of bottom heat radiation improved efficiency of thermal efficiency ratio.
First side plate is being provided with mounting groove with the first top plate junction, and first top plate connects with the first side plate The place of connecing is vertically installed with to be welded to connect with the matched several springs of mounting groove, spring and mounting groove slot bottom;Second side plate exists Second top plate junction is provided with mounting groove, second top plate is being vertically installed with and mounting groove with the second side plate junction Matched several springs, spring and mounting groove slot bottom are welded to connect.By increase spring structure, allow top plate movable, In the case where not influencing heat dissipation effect, to adapt to the component of more sizes.
The tooth height of radiation tooth on the outside of the top plate gradually successively decreases from the center line of inverted draw cut item to both sides.Start in component When work, heat is generated, since radiation tooth volume is different, the air pressure near each radiation tooth is different, the high radiation tooth of the tooth that successively decreases The tooth height for making top board surface form small air-flow, and successively decreasing facilitates air circulation and takes away heat, further increases heat dissipation effect.
First bottom plate and the second bottom plate are in 8 degree to 15 degree of angle with the slot bottom of kerve item respectively., inclined bottom plate In similarly land occupation projected area, more spaces are prevented take up, further increase heat dissipation area, improves in the unit time and dissipates The thermal efficiency.
Outside is provided with metallic channel in the tube body.Metallic channel facilitates electronic component cabling when radiator is installed, Route is avoided to wind, it is convenient to overhaul.
The side plate and back plate connections are provided with support bar, and support bar and side plate, bottom plate are seamlessly connected.Work as radiator water When placing flat, support bar can make radiator more stable, guarantee the normal work of electronic component.
It is provided with mounting plate and hinge on second side plate, through hole is provided on the mounting plate, the hinge is logical It crosses screw to fix with mounting plate, the hinge number at least two.By increasing mounting plate and hinge, can adapt to more Installation environment, it is such as wall-mounted, and hinge structure can make radiator moving in rotation in a certain range, more adapt to complicated wiring Component environment.
In conclusion by adopting the above-described technical solution, the beneficial effects of the invention are as follows:
1. a kind of electronic radiation pipe of the present invention, bigger than traditional heat-dissipating plate heat dissipation area by the way that radiation tooth is arranged, improve single Position time radiating efficiency.
2. a kind of electronic radiation pipe of the present invention, by the way that tubular structure is arranged, centre forms ventilation opening, air in unit length Flow velocity increases, and further increases heat dissipation effect, and compatible more powerful product heat dissipation uses, and improves product service life.
3. a kind of electronic radiation pipe of the present invention is main radiating area by two pieces of symmetrical heat dissipation platforms of setting, adopts With symmetrical expression design, dispersion heat dissipation, radiate more balanced.
4. a kind of electronic radiation pipe of the present invention allows top plate movable, is not influencing to radiate by increasing spring structure In the case where effect, to adapt to the component of more sizes.
5. a kind of electronic radiation pipe of the present invention makes top board surface form small gas by the way that the high radiation tooth of tooth that successively decreases is arranged Stream, the air of circulation take away heat, further increase heat dissipation effect.
6. a kind of electronic radiation pipe of the present invention can adapt to more installation environments, such as by increasing mounting plate and hinge It is wall-mounted, and hinge structure can make radiator moving in rotation in a certain range, more adapt to the component environment of complicated wiring.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein:
Fig. 1 is overall structure diagram of the invention;
Fig. 2 is the part A enlarged diagram of Fig. 1;
Numbering in the drawing explanation:The first top plate of 101-, the second top plate of 102-, 103- inverted draw cut item, the first side plate of 201-, 202- Second side plate, 203- spring, 204- support bar, the first bottom plate of 301-, the second bottom plate of 302-, 303- kerve item, 304- heat dissipation platform, 4- radiation tooth, 5- hinge, 6- mounting plate.
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive Feature or step other than, can combine in any way.
It elaborates below with reference to Fig. 1, Fig. 2 to the present invention.
Embodiment 1
A kind of electronic radiation pipe, including tube body, it is characterised in that:The tube body is surrounded by top plate, side plate, bottom plate, described Top plate includes the first top plate 101, the second top plate 102, inverted draw cut item 103,103 notch of inverted draw cut article respectively with the first top plate 101 and the The seamless connection of two top plates 102, the first top plate 101 and the second top plate 102 are parallel with the slot bottom of inverted draw cut item 103, the first top plate 101 and Second top plate 102 is symmetric with the center line of inverted draw cut item 103;The side plate includes the first side plate 201, the second side plate 202, First side plate 201 is vertical with the first top plate 101 to be connect, and the second side plate 202 is vertical with the second top plate 102 to be connect;The bottom plate packet The first bottom plate 301, the second bottom plate 302, kerve item 303 are included, the first bottom plate 301 and the first side plate 201 are seamlessly connected, the second bottom plate 302 and second side plate 202 be seamlessly connected, 303 notch of kerve item is seamlessly connected with the first bottom plate 301 and the second bottom plate 302 respectively, First bottom plate 301 is symmetric with the second bottom plate 302 with the center line of kerve item 303;First bottom plate 301 and the second bottom A heat dissipation platform 304 is each provided on the inside of plate 302, the heat dissipation platform 304 is seamlessly connected with corresponding bottom plate, two heat dissipation platforms 304 It is symmetric with the center line of kerve item 303;If the outside of the top plate, the outside of side plate are provided on the outside of bottom plate Do parallel radiation tooth 4.
Existing radiator is mostly single plate structure, and single area heat dissipation, heat dissipation region area is small, and heat dissipation is uneven, heat dissipation It is ineffective.A kind of electronic radiation pipe of the present invention is provided with radiation tooth 4 on the outside of tube body, is compared traditional heat-dissipating using tubular structure Plate heat dissipation area is bigger, improves unit time radiating efficiency;Furthermore ventilation opening, air in unit length are formed among tubular structure Flow velocity increases, and further increases heat dissipation effect.Two pieces of symmetrical heat dissipation platforms 304 are main radiating area, using symmetrical expression Design, actual test radiating efficiency is than single 2-3 times of bottom heat radiation improved efficiency.
The tube body uses 6063 aluminum alloy materials.
The operation principle of the present invention is that:Tube body makes chip, the heat of device by the close contact with chip device surface It is transmitted to tube body, its surface increases radiation of heat, and the air of circulation takes away a large amount of heat.
Embodiment 2
The present embodiment is only that with the difference for implementing 1:First side plate 201 is arranged with 101 junction of the first top plate There is mounting groove, first top plate 101 is vertically installed with and the matched several springs of mounting groove with 201 junction of the first side plate 203, spring 203 and mounting groove slot bottom are welded to connect;Second side plate 202 is being provided with peace with 102 junction of the second top plate Tankage, second top plate 102 with 202 junction of the second side plate be vertically installed with the matched several springs 203 of mounting groove, Spring 203 is welded to connect with corresponding mounting groove slot bottom.
By increasing spring structure, allow top plate movable, in the case where not influencing heat dissipation effect, to adapt to more The component of size.
203 specification of spring is outer diameterInternal diameterFree height 5.0mm, material are spring Steel, steel wire diameter
The operation principle of the present invention is that:When tube body is installed on component, if component volume is bigger, spring 203 occur elastic deformation, and top plate is movable, and top plate can still be fitted closely with component, realize heat dissipation.
Embodiment 3
The present embodiment is only that with the difference for implementing 1:Mounting plate 6 and hinge 5, institute are provided on second side plate 202 It states and is provided with through hole on mounting plate 6, the hinge 5 is fixed by screw and mounting plate 6.
By increasing mounting plate 6 and hinge 5, it can adapt to more installation environments, such as wall, and hinge structure can make to dissipate Hot device moving in rotation in a certain range more adapts to the component environment of complicated wiring.
The hinge 5 uses 2 cun of stainless steel hinges.
The operation principle of the present invention is that:When tube body is installed on component, required installation position is fixed to by hinge 5 It sets, if meeting complicated cabling, can be realized by rotary hinge 5 does not influence heat dissipation effect, does not change tube body position.
The above, only the preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, it is any Those skilled in the art within the technical scope disclosed by the invention, can without the variation that creative work is expected or Replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be limited with claims Subject to fixed protection scope.

Claims (8)

1. a kind of electronic radiation pipe, including tube body, it is characterised in that:The tube body is surrounded by top plate, side plate, bottom plate, the top Plate include the first top plate (101), the second top plate (102), inverted draw cut item (103), inverted draw cut item (103) notch respectively with the first top plate (101) it is seamlessly connected with the second top plate (102), the slot bottom of the first top plate (101) and the second top plate (102) and inverted draw cut item (103) In parallel, the first top plate (101) is symmetric with the second top plate (102) with the center line of inverted draw cut item (103);The side plate includes First side plate (201), the second side plate (202), the first side plate (201) is vertical with the first top plate (101) to be connect, the second side plate (202) vertical with the second top plate (102) to connect;The bottom plate includes the first bottom plate (301), the second bottom plate (302), kerve item (303), the first bottom plate (301) and the first side plate (201) are seamlessly connected, the second bottom plate (302) and the second side plate (202) seamless company Connect, kerve item (303) notch is seamlessly connected with the first bottom plate (301) and the second bottom plate (302) respectively, the first bottom plate (301) with Second bottom plate (302) is symmetric with the center line of kerve item (303);First bottom plate (301) and the second bottom plate (302) Inside is each provided with a heat dissipation platform (304), and the heat dissipation platform (304) is seamlessly connected with corresponding bottom plate, two heat dissipation platforms (304) It is symmetric with the center line of kerve item (303);The outside of the top plate, the outside of side plate are provided on the outside of bottom plate Several parallel radiation tooths (4).
2. a kind of electronic radiation pipe according to claim 1, it is characterised in that:First side plate (201) is with first Top plate (101) junction is provided with mounting groove, and first top plate (101) is vertically arranged with the first side plate (201) junction Have and is welded to connect with the matched several springs (203) of mounting groove, spring (203) and mounting groove slot bottom;Second side plate (202) Second top plate (102) junction is being provided with mounting groove, second top plate (102) with the second side plate (202) junction It is vertically installed with and is welded to connect with the matched several springs (203) of mounting groove, spring (203) with corresponding mounting groove slot bottom.
3. a kind of electronic radiation pipe according to claim 1, it is characterised in that:Radiation tooth (4) on the outside of the top plate Tooth height is gradually successively decreased from the center line of inverted draw cut item (103) to both sides.
4. a kind of electronic radiation pipe according to claim 1, it is characterised in that:First bottom plate (301) and the second bottom Plate (302) is in 8 degree to 15 degree of angle with the slot bottom of kerve item (303) respectively.
5. a kind of electronic radiation pipe according to claim 1, it is characterised in that:Outside is provided with conducting wire in the tube body Slot.
6. a kind of electronic radiation pipe according to claim 1, it is characterised in that:The side plate and back plate connections are provided with Support bar (204), support bar (204) and side plate, bottom plate are seamlessly connected.
7. a kind of electronic radiation pipe according to claim 1, it is characterised in that:It is provided on second side plate (202) Mounting plate (6) and hinge (5) are provided with through hole on the mounting plate (6), and the hinge (5) passes through screw and mounting plate (6) It is fixed.
8. a kind of electronic radiation pipe according to claim 7, it is characterised in that:Hinge (5) number at least two.
CN201811087796.3A 2018-09-18 2018-09-18 A kind of electronic radiation pipe Pending CN108901190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811087796.3A CN108901190A (en) 2018-09-18 2018-09-18 A kind of electronic radiation pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811087796.3A CN108901190A (en) 2018-09-18 2018-09-18 A kind of electronic radiation pipe

Publications (1)

Publication Number Publication Date
CN108901190A true CN108901190A (en) 2018-11-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108770307A (en) * 2018-06-27 2018-11-06 江苏英杰电子器件有限公司 High-performance power supply radiator

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005006435A1 (en) * 2003-07-09 2005-01-20 C C K Innovations Sdn Bhd Heat sink
US20070097648A1 (en) * 2005-11-01 2007-05-03 Kevin Xu Method and apparatus for establishing optimal thermal contact between opposing surfaces
JP2008149929A (en) * 2006-12-19 2008-07-03 Kenwood Corp On-vehicle electronic equipment
CN201533462U (en) * 2009-11-18 2010-07-21 赵帆 Electric vehicle controller shell structure
CN203301408U (en) * 2013-04-08 2013-11-20 上海力信电气技术有限公司 Brushless motor controller and elasticity trim strip
CN105848455A (en) * 2016-05-27 2016-08-10 刘高志 Efficient heat dissipation type stacked intelligent controller
CN106686949A (en) * 2017-01-12 2017-05-17 徐州云意科技发展有限公司 Air-cooled electric vehicle controller
CN107278071A (en) * 2017-06-16 2017-10-20 珠海格力电器股份有限公司 Automatically controlled box and multi-online system
CN207720611U (en) * 2017-12-18 2018-08-10 深圳市崧盛电子股份有限公司 A kind of shell
CN209170803U (en) * 2018-09-18 2019-07-26 成都金洹科科技有限公司 A kind of electronic radiation pipe

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005006435A1 (en) * 2003-07-09 2005-01-20 C C K Innovations Sdn Bhd Heat sink
US20070097648A1 (en) * 2005-11-01 2007-05-03 Kevin Xu Method and apparatus for establishing optimal thermal contact between opposing surfaces
JP2008149929A (en) * 2006-12-19 2008-07-03 Kenwood Corp On-vehicle electronic equipment
CN201533462U (en) * 2009-11-18 2010-07-21 赵帆 Electric vehicle controller shell structure
CN203301408U (en) * 2013-04-08 2013-11-20 上海力信电气技术有限公司 Brushless motor controller and elasticity trim strip
CN105848455A (en) * 2016-05-27 2016-08-10 刘高志 Efficient heat dissipation type stacked intelligent controller
CN106686949A (en) * 2017-01-12 2017-05-17 徐州云意科技发展有限公司 Air-cooled electric vehicle controller
CN107278071A (en) * 2017-06-16 2017-10-20 珠海格力电器股份有限公司 Automatically controlled box and multi-online system
CN207720611U (en) * 2017-12-18 2018-08-10 深圳市崧盛电子股份有限公司 A kind of shell
CN209170803U (en) * 2018-09-18 2019-07-26 成都金洹科科技有限公司 A kind of electronic radiation pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108770307A (en) * 2018-06-27 2018-11-06 江苏英杰电子器件有限公司 High-performance power supply radiator

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