CN108901089A - A kind of thick film heating element and its operating temperature method for improving - Google Patents
A kind of thick film heating element and its operating temperature method for improving Download PDFInfo
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- CN108901089A CN108901089A CN201810957420.7A CN201810957420A CN108901089A CN 108901089 A CN108901089 A CN 108901089A CN 201810957420 A CN201810957420 A CN 201810957420A CN 108901089 A CN108901089 A CN 108901089A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
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Abstract
The present invention discloses a kind of thick film heating element and its operating temperature method for improving.The element includes：Substrate is cylindrical in shape, and both ends open is made from a material that be thermally conductive；Insulating layer is covered in the outer wall of the substrate in half-surrounded；Resistive layer, including multiple resistor stripes in a strip shape, the resistor stripe interval is covered on the insulating layer；Conductor layer is made from silver, and including more linear conductor lines, conductor lines are spaced apart on the insulating layer；One end of every conductor lines is connect with a resistor stripe, and the other end is connect with a conductor wire；Coating covers the resistive layer, conductor layer and insulating layer；Conductor wire, conductor are made of copper or silver, and are connected between every conductor wire and a conductor lines by silver soldering point.The program has well solved the relatively low problem of existing thick film heating element manipulation temperature, significantly improves the operating temperature of heater element.
Description
Technical field
The present invention relates to thick film heating technique field, especially a kind of thick film heating element and its operating temperature promotion side
Method.
Background technique
Existing thick film heating element, the operating temperature for the route that generates heat generally can reach 450 ° or more, but its operating temperature
Temperature resistant capability depending on conducting wire pad.Existing conducting wire pad generally uses lead-free solder soldering method, and solder joint highest is resistance to
Hot temperature is typically not greater than 260 DEG C, this just greatly limits the operating temperature of thick film heating element, therefore the solder joint system of also becoming
The about bottleneck of thick film heating element manipulation temperature promotion.
In order to improve the heat resisting temperature of solder joint between conductor and conducting wire, it will usually using the high metal of fusing point, but if adopt
With dystectic solder, silver conductor layer is easy to cause to migrate in the welding process, and then destroys the structure of thick film conductor layer, thus
Leading to the service life of thick film heating element will greatly shorten.
Summary of the invention
The present invention provides a kind of thick film heating element and its operating temperature method for improving, of the existing technology for overcoming
The defects of operating temperature is relatively low, under the premise of not influencing thick film element ordinary life, by the operating temperature of thick film heating element
450 DEG C or more are increased to, to improve the heating efficiency of thick film element, widens its suitable application area.
To achieve the above object, the present invention proposes a kind of thick film heating element, including：
Substrate is cylindrical in shape, and both ends open is made from a material that be thermally conductive；
Insulating layer is covered in the outer wall of the substrate in half-surrounded；
Resistive layer, including multiple resistor stripes in a strip shape, the resistor stripe is spaced apart on the insulating layer；
Conductor layer is made from silver, and including more linear conductor lines, the conductor lines are spaced apart in the insulating layer
On；One end of every conductor lines is connect with a resistor stripe, and the other end is connect with a conductor wire；
Coating covers the resistive layer, conductor layer and insulating layer；
The conductor wire, is made of copper or silver, and passes through silver soldering point between the every conductor wire and the conductor lines
Connection.
To achieve the above object, the present invention also provides a kind of thick film heating element manipulation temperature method for improving, including it is following
Step：
Step 1：Dielectric slurry, heating resistor slurry, conductor slurry and seal coat slurry are used into silk-screen printing
Technique is successively printed on thermally conductive substrate, and drying, firing；Form the semi-finished product of conductor wire to be welded；
By the substrate, bending deformation is cylindrical in shape in sintering procedure, and the dielectric slurry, is led at heating resistor slurry
Body slurry and covering slurry in the substrate lateral surface are sequentially formed insulating layer, resistive layer, conductor layer and coating；Wherein：
The insulating layer is covered in the outer wall of the substrate in half-surrounded；
The resistive layer is in a strip shape to be spaced apart on the insulating layer；
The conductor layer is made from silver, linear and be spaced apart on the insulating layer, the one of every conductor lines
End is connect with the resistive layer, and the other end is exposed to outside the coating, is used for and a conductive wire bonding；
The coating covers the resistive layer, conductor layer and insulating layer；
The conductor wire is made of copper or silver；
Step 2：The connecting pin of the conductor wire is placed on the connecting pin of the conductor lines；
Step 3：The conductor wire connecting pin and the conductor lines connecting pin are covered using nano mattisolda；
Step 4：The nano mattisolda is heated by speed heat equipment, completes the welding of the conductor wire and conductor lines.Institute
Stating speed heat equipment includes laser heating device, microwave heating equipment, optical wave heating equipment, plasma-activated heating equipment, activation
One of area's heating equipment.
Thick film heating element and its operating temperature method for improving provided by the invention：Using nano silver paste as solder, benefit
With the good characteristic of wellability between the low melting point and copper of nano silver, silver, the silver-based piece of conductor layer will not be injured in the welding process, no
The structure of conductor layer can be destroyed, thus will not influence the service life of thick film heating element.In addition, being received using the heating of speed heat equipment
Temperature rise when rice silver paste is fast, advantage that sintering velocity is fast, significantly shortening sintering time, when so that nano-Ag particles not having enough
Between diffusion into the surface occurs, to also just greatly limit the progress of the non-densifying diffusion of nano silver paste.When entering high-temperature region, cause
Densification diffusion (such as crystal boundary/lattice diffusion) will occupy leading position, so that densification diffusion occurs between nano-Ag particles, from
And very high sintered density is obtained, and the solder joint formed is small in size, realize nano silver paste and copper conductor or fast with silver wire
Speed welding, obtains the silver soldering point of high quality.The operating temperature of this silver soldering point can reach silver point (about 950 DEG C), substantially
Degree improves the operating temperature of thick film heating element.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described.It is clear that the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to the structure shown in these attached drawings.
Fig. 1 is the main view for the thick film heating element that inventive embodiments provide；
Fig. 2 is the expanded view of Fig. 1；
Fig. 3 is the Longitudinal cross section schematic of Fig. 1；
Fig. 4 is the flow chart for the thick film heating element manipulation temperature method for improving that inventive embodiments provide.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description.Obviously, described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art are obtained all without creative labor
Other embodiments shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and should not be understood as
Its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In the description of the present invention, " multiple " contain
Justice is at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. shall be understood in a broad sense,
For example, " fixation " may be a fixed connection, it may be a detachable connection, or integral；It can be mechanical connection, be also possible to
Electrical connection；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary
The interaction relationship of a element, unless otherwise restricted clearly.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
It in addition, the technical solution between each embodiment of the present invention can be combined with each other, but must be general with this field
Based on logical technical staff can be realized, when the combination of technical solution appearance is conflicting or cannot achieve, it will be understood that this
The combination of kind of technical solution is not present, also not the present invention claims protection scope within.
The invention proposes a kind of thick film heating element and its operating temperature method for improving.
Embodiment one
Please refer to Fig. 1 to Fig. 3, the present invention provides a kind of thick film heating element, including substrate 1, insulating layer 2, resistive layer 3,
Conductor layer 4, coating 5 and conductor wire 6, wherein：
Substrate 1 is cylindrical in shape, and both ends open is made from a material that be thermally conductive；
Insulating layer 2 is covered in the outer wall of the substrate 1 in half-surrounded；
Resistive layer 3 includes multiple resistor stripes 31 in a strip shape, and the resistor stripe 31 is spaced apart on the insulating layer 2；
Conductor layer 4 is made from silver, and including more linear conductor lines 41, the conductor lines 41 are spaced apart in described exhausted
In edge layer 2；One end of every conductor lines 41 (being in elongated threadiness) is connect with a resistor stripe 31, and the other end has weldering
End 42 is connect (to be in the form of sheets, rectangle in the present embodiment, can also be round, ellipse or triangle, trapezoidal, diamond shape etc., specifically may be used
Determined according to the stability of the concrete shape of the welding ends of the conductor wire 6 welded with it or solder joint after molding), welding ends
42 are connect with a conductor wire 6 by silver soldering point 61；Between multiple resistor stripes 31 series, parallel can be formed by conductor lines 41
Or the form combined in series and parallel, to achieve the purpose that change resistance according to specific needs.Between resistor stripe 31 described in Fig. 2
It is one another in series.
Coating 5 covers the resistive layer 3, conductor layer 4 and insulating layer 2；Welding ends 42 is exposed to outside coating 5；
The conductor wire 6 is made of copper or silver, and passes through silver soldering between the every conductor wire 6 and the conductor lines 41
Point connection.
Thick film heating element provided in this embodiment replaces existing tin welding spot by silver soldering point, substantially increases solder joint
Operating temperature, it is preferable that weld to form the silver soldering point by nano mattisolda between the conductor lines and the conductor wire.
It is welded using nano silver paste, and not will lead to the destruction of conductor layer in the welding process, ensuring making for thick film heating element
With the service life it is unaffected in the case where, the operating temperature of thick film heating element is increased to 450 DEG C~950 by original 260 DEG C
DEG C, heating efficiency is significantly improved, heating time is substantially reduced, can satisfy the need in the higher field of media operation temperature
It asks.
Preferably, for the ease of the variation of observation interior media and thick film heating element manipulation temperature, or implement temperature control,
NTC layer 7 (thermistor material) is coated on the coating, described NTC layers is led by the conductor lines with described
Electric wire connection.By the variation of thermistor material, in conjunction with by conductor lines, the conductor wire being connect with conductor lines and with conduction
The circuit of line connection, being capable of precise measurement medium and thick film heating element manipulation temperature.
Preferably, 1 material of substrate includes one of stainless steel, aluminium, ceramics or alloy, and heating conduction is good, and
Convenient for high temperature sintering processing, cost is relatively low, and corrosion resistance is high.
The heater formed, including inner cylinder 11 are made by above-mentioned thick film heating element, material be stainless steel, aluminium, ceramics or
One of alloy, inner cylinder 11 are located in the substrate 1 (forming outer cylinder) of tubular, upper and lower ends sealing, between inner cylinder 11 and outer cylinder
For accommodating heated medium (being usually used in water or other liquid mediums), 11 inner wall lower end of inner cylinder has and Jie the dielectric cavity of formation
The entrance 12 of matter chamber connection, upper end have the outlet 13 being connected to dielectric cavity.Such as：Add be used to instantaneously heat water
In hot device, water inlet pipe is connected on entrance 12, and the water outlet of heater is connected in outlet 13 by pipeline, is opened in user
When hot-water switch, the temperature of dielectric cavity internal water is detected by NTC layer 7, when being less than 99.9 DEG C of temperature of setting, starting heating
Program, 6 outer end of conductor wire are powered, and for electric current through conductor lines 41 by resistive layer 4, the fever of resistive layer 4 adds the water inside dielectric cavity
Heat, power-off when reaching 99.9 DEG C, water outlet water outlet.
Embodiment two
The present embodiment provides a kind of thick film heating elements, with embodiment one the difference is that, substrate 1 in the form of sheets, by
Heat Conduction Material is made；Insulating layer 2 is covered in the wherein one side of the substrate 1, and the thick film heating element of this sheet is commonly used to add
Hot solids equipment or device.
Embodiment three
Referring to figure 4., on the basis of embodiment one, two, the embodiment of the present invention provides a kind of thick film heating element manipulation
Temperature method for improving, includes the following steps：
Dielectric slurry, heating resistor slurry, conductor slurry and seal coat slurry are used silk-screen printing by step S1
Technique is successively printed on thermally conductive substrate, and drying is fired；Form the semi-finished product of conductor wire to be welded；
By the substrate, bending deformation is cylindrical in shape in sintering procedure, and the dielectric slurry, is led at heating resistor slurry
Body slurry and covering slurry in the substrate lateral surface are sequentially formed insulating layer, resistive layer, conductor layer and coating；Wherein：
The insulating layer is covered in the outer wall of the substrate in half-surrounded；
The resistive layer is in a strip shape to be spaced apart on the insulating layer；
The conductor layer is made from silver, linear and be spaced apart on the insulating layer, the one of every conductor lines
End is connect with the resistive layer, and the other end is exposed to outside the coating, is used for and a conductive wire bonding；
The coating covers the resistive layer, conductor layer and insulating layer；
The conductor wire is made of copper or silver；
The step S1 includes：
Step S11 prints the dielectric slurry on the tabular substrate of pre-set dimension, and dries, is sintered, described
Dielectric slurry forms the insulating layer；
Step S12 prints the heating resistor slurry on the insulating layer, and dries, is sintered, the heating electric resistance material
Slurry forms the resistive layer；
Step S13 prints the conductor slurry on the insulating layer, and dries, is sintered, and the conductor slurry forms institute
State conductor layer；
Step S14 prints the covering slurry in the insulating layer, resistive layer and conductor layer, and dries, is sintered, institute
It states covering slurry and forms the coating；
The step S1 further includes：
Step S15 in the step 14, is reserved with exposed at the both ends of a wherein conductor lines for the conductor layer
Connecting pin outside the coating, one of connecting pin print on another connecting pin for connecting the conductor wire
Brush Thermistor, and dry, be sintered, the Thermistor forms NTC layers；
Step S16 prints packaging slurry on the coating and NTC layers, and dries, is sintered, the hot packaging slurry
Generate encapsulated layer.
The connecting pin (welding ends) of the conductor wire is placed on the connecting pin (welding ends) of the conductor lines by step S2；
The step 2 includes：
Step S21, the semi-finished product are fixed on the table；
Step S22 passes through the fixed described one end of conductor wire far from connecting pin of tooling；
Step S23 adjusts the company that tooling makes the connecting pin of the conductor wire fall in the conductor lines on the semi-finished product
End is connect, the conductor wire connecting pin is made to cover a part of conductor lines connecting pin.
Step S3, coated with nano silver paste cover the conductor wire connecting pin and the conductor lines connecting pin；
Step S4 heats the nano mattisolda by speed heat equipment, completes the welding of the conductor wire and conductor lines.Institute
Stating speed heat equipment includes laser heating device, microwave heating equipment, optical wave heating equipment, plasma-activated heating equipment, activation
One of area's heating equipment, electric current assisted sintering equipment.
The step S4 includes：
Step S41, the speed heat equipment choosing laser heating device adjust laser heating device parameter, so that laser beam
Hot spot focus on the nano mattisolda on the conductor wire connecting pin and the conductor lines connecting pin；
Step S42, heating temperature are 270 DEG C~400 DEG C；Heating temperature is preferably 325 DEG C~400 DEG C, is higher than in temperature
In 325 DEG C of short time, in high-temperature region, generation intergranular is spread between Argent grain, layer of solder paste quick densifying, is occurred between particle bright
Aobvious neck links structure, and with the increase of temperature, the connector bonding strength of welding is higher.
Step S43, heating time are 0.6~3 second.Heating time is preferably 0.6~1.0 second, when heated between be 0.6 second
When, layer of solder paste temperature reaches 400 DEG C of peak value or so, and with the growth of heating time, temperature is no longer increased, and when heated between
When more than 1 second, with the extension of heating time, the shear strength of welding point is not further added by, or even is decreased.When heated
Between when being lower than 0.6 second, the organic matter in soldering paste decomposes not exclusively, and intergranular diffusion of the silver atoms in high temperature section is insufficient, welding
The compactness extent of connector is inadequate.
The silver soldering point obtained under above-mentioned boundary condition, sintered density is high, and solder joint is small in size, when substantially reducing welding
Between, improve welding efficiency.
It preferably, include solid-like nano-Ag particles and colloidal organic substance in the nano mattisolda in the step 4；
Wherein：
The content of the nano-Ag particles is between 70wt%~90wt%；
The partial size of the nano-Ag particles is between 30nm~60nm；
The organic substance includes fatty acid dispersant, the polymeric binder with long-chain and comprising short hydrocarbon chain
Polymeric diluents.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in scope of patent protection of the invention in other relevant technical fields.
Claims (10)
1. a kind of thick film heating element, which is characterized in that including：
Substrate is cylindrical in shape, and both ends open is made from a material that be thermally conductive；
Insulating layer is covered in the outer wall of the substrate in half-surrounded；
Resistive layer, including multiple resistor stripes in a strip shape, the resistor stripe interval is covered on the insulating layer；
Conductor layer is made from silver, and including more linear conductor lines, the conductor lines are spaced apart on the insulating layer；
One end of every conductor lines is connect with a resistor stripe, and the other end is connect with a conductor wire；
Coating covers the resistive layer, conductor layer and insulating layer；
The conductor wire, is made of copper or silver, and is connected between the every conductor wire and the conductor lines by silver soldering point.
2. a kind of thick film heating element, which is characterized in that including：
Substrate is made from a material that be thermally conductive in the form of sheets；
Insulating layer is covered in the wherein one side of the substrate；
Resistive layer, including multiple resistor stripes in a strip shape, the resistor stripe interval is covered on the insulating layer；
Conductor layer is made from silver, and including more linear conductor lines, the conductor lines are spaced apart on the insulating layer；
One end of every conductor lines is connect with a resistor stripe, and the other end is connect with a conductor wire；
Coating covers the resistive layer, conductor layer and insulating layer；
The conductor wire, is made of copper or silver, and is connected between the every conductor wire and the conductor lines by silver soldering point.
3. thick film heating element as claimed in claim 1 or 2, which is characterized in that between the conductor lines and the conductor wire
It is welded by nano mattisolda, the substrate material includes one of stainless steel, aluminium, ceramics or alloy.
4. thick film heating element according to claim 3, which is characterized in that described coated with NTC layers on the coating
NTC layers are connect by the conductor lines with the conductor wire.
5. a kind of thick film heating element manipulation temperature method for improving, which is characterized in that include the following steps：
Step 1：Dielectric slurry, heating resistor slurry, conductor slurry and seal coat slurry are used into silk-screen printing technique
It is successively printed on thermally conductive substrate, and drying is fired；Form the semi-finished product of conductor wire to be welded；
By the substrate, bending deformation is cylindrical in shape in sintering procedure, the dielectric slurry, heating resistor slurry, conductor material
It starches and covers slurry and be sequentially formed insulating layer, resistive layer, conductor layer and coating in the substrate lateral surface；Wherein：
The insulating layer is covered in the outer wall of the substrate in half-surrounded；
Resistive layer interval in a strip shape is every being covered on the insulating layer；
The conductor layer is made from silver, linear and be spaced apart on the insulating layer, one end of every conductor lines with
The resistive layer connection, the other end are exposed to outside the coating, are used for and a conductive wire bonding；
The coating covers the resistive layer, conductor layer and insulating layer；
The conductor of the conductor wire is made of copper or silver；
Step 2：The connecting pin of the conductor wire is placed on the connecting pin of the conductor lines；
Step 3：Coated with nano silver paste covers the conductor wire connecting pin and the conductor lines connecting pin；
Step 4：The nano mattisolda is heated by speed heat equipment, completes the welding of the conductor wire and conductor lines, the speed
Hot equipment includes that laser heating device, microwave heating equipment, optical wave heating equipment, plasma-activated heating equipment, region of activation add
One of hot equipment.
6. thick film heating element manipulation temperature method for improving according to claim 5, which is characterized in that step 2 packet
It includes：
Step 21, the semi-finished product are fixed on the table；
Step 22, pass through the fixed described one end of conductor wire far from connecting pin of tooling；
Step 23, the connecting pin that tooling makes the connecting pin of the conductor wire fall in the conductor lines on the semi-finished product is adjusted,
The conductor wire connecting pin is set to cover a part of conductor lines connecting pin.
7. thick film heating element manipulation temperature method for improving according to claim 5, which is characterized in that step 4 packet
It includes：
Step 41, the speed heat equipment choosing laser heating device adjusts laser heating device parameter, so that the hot spot of laser beam
Focus on the nano mattisolda on the conductor wire connecting pin and the conductor lines connecting pin；
Step 42, heating temperature is 260 DEG C~400 DEG C；
Step 43, heating time is 0.6~3 second.
8. thick film heating element manipulation temperature method for improving according to claim 7, which is characterized in that step 1 packet
It includes：
Step 11, the dielectric slurry is printed on the tabular substrate of pre-set dimension, and is dried, is sintered, the insulation
Medium slurry forms the insulating layer；
Step 12, the heating resistor slurry is printed on the insulating layer, and is dried, is sintered, the heating resistor slurry shape
At the resistive layer；
Step 13, the conductor slurry is printed on the insulating layer, and dries, be sintered, and the conductor slurry forms described lead
Body layer；
Step 14, the covering slurry is printed in the insulating layer, resistive layer and conductor layer, and is dried, is sintered, the covering
Slurry forms the coating.
9. thick film heating element manipulation temperature method for improving according to claim 8, which is characterized in that the step 1 is also
Including：
Step 15, in the step 14, institute is exposed to what the both ends of a wherein conductor lines for the conductor layer were reserved with
The connecting pin outside coating is stated, one of connecting pin is for connecting the conductor wire, the printing heat on another connecting pin
Quick resistance slurry, and dry, be sintered, the Thermistor forms NTC layers；
Step 16, packaging slurry is printed on the coating and NTC layers, and dries, is sintered, the hot packaging slurry generates packet
Sealing.
10. according to the described in any item thick film heating element manipulation temperature method for improving of claim 5~9, which is characterized in that institute
It states in the nano mattisolda in step 4 comprising solid-like nano-Ag particles and colloidal organic substance；Wherein：
The content of the nano-Ag particles is between 70wt%~90wt%；
The partial size of the nano-Ag particles is between 30nm~60nm；
The organic substance includes fatty acid dispersant, the polymeric binder with long-chain and the polymerization comprising short hydrocarbon chain
Object diluent.
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| CN201810957420.7A CN108901089B (en) | 2018-08-22 | 2018-08-22 | Thick film heating element and working temperature increasing method thereof |
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| CN201810957420.7A CN108901089B (en) | 2018-08-22 | 2018-08-22 | Thick film heating element and working temperature increasing method thereof |
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| CN108901089B CN108901089B (en) | 2021-05-25 |
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Cited By (1)
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| CN109853209A (en) * | 2019-01-24 | 2019-06-07 | 广西桂仪科技有限公司 | A kind of electric iron plate thick film heater and preparation process |
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| CN109853209A (en) * | 2019-01-24 | 2019-06-07 | 广西桂仪科技有限公司 | A kind of electric iron plate thick film heater and preparation process |
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| CN108901089B (en) | 2021-05-25 |
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