JP2006261014A - Connecting terminal jointing ceramic heater and its manufacturing method - Google Patents

Connecting terminal jointing ceramic heater and its manufacturing method Download PDF

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JP2006261014A
JP2006261014A JP2005078986A JP2005078986A JP2006261014A JP 2006261014 A JP2006261014 A JP 2006261014A JP 2005078986 A JP2005078986 A JP 2005078986A JP 2005078986 A JP2005078986 A JP 2005078986A JP 2006261014 A JP2006261014 A JP 2006261014A
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connection terminal
plate
ceramic heater
metal layer
electrode
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Tomohiro Kuwayama
友広 桑山
Yoshinori Kawaguchi
義則 川口
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting terminal jointing ceramic heater superior in exothermic performance and temperature control performance, capable of demonstrating a stable performance for a long period, and its manufacturing method. <P>SOLUTION: This is a connecting terminal jointing ceramic heater in which a jointing part jointing an electrode part which is provided on the surface of a ceramic substrate and connected electrically to a heater exothermic portion heated by current flow and a plate-shape part provided at the end part of a connector connected electrically to the outside is coated by a metallic layer. The metallic layer is formed with a thickness of 4 μm or more at the outer circumference edge of a face on the opposite side to the jointing face of the electrode part in the plate-shape part, and its manufacturing method is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は接続端子接合セラミックヒータおよびその製造方法に関し、詳しくは、セラミックヒータの電極部と接続端子の板状部とを接合した接合部の腐食を防ぎ、発熱性能が安定しており寿命の長い接続端子接合セラミックヒータおよびその製造方法に関する。   The present invention relates to a connection terminal bonded ceramic heater and a method for manufacturing the same, and more particularly, to prevent corrosion of a bonded portion obtained by bonding an electrode portion of a ceramic heater and a plate-like portion of a connection terminal, to stably generate heat, and to have a long life. The present invention relates to a connection terminal bonded ceramic heater and a method for manufacturing the same.

従来からセラミックヒータ等のセラミック−金属の焼結接合体として用いられる金属は、タングステンやモリブデン等の耐熱性の金属が多い。その中でもタングステンを主成分とする金属は、アルミナとのなじみがよく耐熱性も優れているため、アルミナ製のセラミック基体の内部に設けたヒータと電気的に接続し、セラミック基体の表面に設けられる電極部として利用されることが多い。この場合、この電極部に対しロウ付け等により外部と電気的に接続するリード線の接続端子等が取付けられ、接合部を形成する。なお、この接続端子としては、ニッケル等の加工性が良く、良導性の金属を用いる。このとき、セラミック基体に設けたタングステン製の電極部に対してニッケル等よりなる接続端子を接合するには、タングステン等の電極部表面にニッケルメッキを施し、形成されたニッケルメッキ膜に銀−銅、銅−金や銅−銀などの合金よりなるロウ材を用いて接続端子をロウ付けする方法が採られている。なお、ニッケルメッキ膜を予め電極部に施すのは、タングステン系の電極部と銅、銀等を含んだロウ材との濡れ性を向上させるためである。その後、銅、銀等を含むロウ材は腐食しやすいので、ロウ付けした後の接合部に再度ニッケルメッキ等を施して、ロウ材やロウ付けした接合部の腐食を防ぐ金属層が形成されている。   Conventionally, a metal used as a ceramic-metal sintered joined body such as a ceramic heater is often a heat-resistant metal such as tungsten or molybdenum. Among these metals, tungsten-based metals are familiar with alumina and have excellent heat resistance, so they are electrically connected to a heater provided inside an alumina ceramic substrate and provided on the surface of the ceramic substrate. Often used as an electrode section. In this case, a lead wire connection terminal or the like that is electrically connected to the outside by brazing or the like is attached to the electrode portion to form a joint portion. As the connection terminal, a highly conductive metal such as nickel is used. At this time, in order to join the connection terminal made of nickel or the like to the tungsten electrode portion provided on the ceramic substrate, the surface of the electrode portion such as tungsten is plated with nickel, and the formed nickel plating film is silver-copper. A method of brazing connection terminals using a brazing material made of an alloy such as copper-gold or copper-silver has been adopted. The reason why the nickel plating film is applied to the electrode portion in advance is to improve the wettability between the tungsten-based electrode portion and the brazing material containing copper, silver and the like. After that, since the brazing material containing copper, silver, etc. is easily corroded, a nickel layer is applied again to the joint after brazing, and a metal layer is formed to prevent corrosion of the brazing material and brazed joint. Yes.

そして、従来からセラミックヒータの電極部と接続端子との接合部には不具合が生じ易く、色々な改良が試みられている。特許文献1には電極部に形成されるニッケルメッキ膜中の硫黄分を制限することにより、電極部と接続端子との接合面の剥離による導通不良を防止したセラミックヒータが開示されている。また、特許文献2には接合部の接合強度と経済性を考慮して、特定組成の銅−金−ニッケル系のロウ材用いたセラミックヒータに好適に利用できるセラミック−金属接合体が報告されている。   Conventionally, problems are likely to occur at the joint between the electrode portion of the ceramic heater and the connection terminal, and various improvements have been attempted. Patent Document 1 discloses a ceramic heater in which a sulfur content in a nickel plating film formed on an electrode portion is limited to prevent conduction failure due to peeling of a joint surface between the electrode portion and a connection terminal. Patent Document 2 reports a ceramic-metal bonded body that can be suitably used for a ceramic heater using a copper-gold-nickel brazing material having a specific composition in consideration of the bonding strength and economic efficiency of the bonded portion. Yes.

特開平8−185956号公報Japanese Unexamined Patent Publication No. Hei 8-185956 特開平11−292649号公報JP 11-292649 A

しかし、このようなセラミックヒータの中には、接合部が非常に腐食し易かったり、電極部が導電性不良を起こし発熱制御の信頼性にかけるものが多く見られた。最近のセンサー用セラミックヒータなどでは厳しい発熱管理を要求され、電極部の導電性不良または不安定はヒータ発熱性能不良、延いては温度制御不良を招き、すぐに使用不能なってしまう。本発明では、このようなトラブルのない長期間安定した性能を発揮できる接続端子接合セラミックヒータとその製造方法の提供を目的とするものである。   However, among such ceramic heaters, many joints are very easily corroded, and many electrode heaters have poor conductivity and are subject to reliability of heat generation control. In recent ceramic heaters for sensors and the like, strict heat generation management is required, and poor conductivity or instability of the electrode part leads to poor heater heat generation performance, and consequently poor temperature control, and can be disabled immediately. An object of the present invention is to provide a connection terminal bonded ceramic heater capable of exhibiting stable performance for a long time without such trouble and a method for manufacturing the same.

上述の接続端子接合セラミックヒータは、セラミックヒータの電極部と接合する接続端子の端部が断面略四角形の板型形状を有する板状部である。本発明者らの検討によると、この板状部をセラミックヒータの電極部に接合した接合部に対してメッキ等の金属層を被覆する際、板状部の電極部との接合面と反対側の面(以下、反対側面ともいう)の角部となっている外周縁には、反対側面の平面部分など他の部分と比較して十分な厚みの金属層が形成し難いことが分かった。そして、セラミックヒータの長期間の使用により、被覆した金属層が十分でない反対側面の外周縁付近のロウ材や接続端子が剥き出しとなり、この部分から接合部全体の腐食や接続端子と電極部との導電不良が起こることが分かった。 The connection terminal bonded ceramic heater described above is a plate-shaped portion having a plate shape in which the end portion of the connection terminal bonded to the electrode portion of the ceramic heater has a substantially square cross section. According to the study by the present inventors, when the metal part such as plating is coated on the joint part obtained by joining the plate part to the electrode part of the ceramic heater, the side opposite to the joint surface with the electrode part of the plate part It has been found that it is difficult to form a metal layer having a sufficient thickness on the outer peripheral edge, which is a corner portion of this surface (hereinafter also referred to as the opposite side surface), compared to other portions such as a flat portion on the opposite side surface. Due to the long-term use of the ceramic heater, the brazing material and the connection terminal near the outer peripheral edge of the opposite side surface where the coated metal layer is not sufficient are exposed. It was found that poor conductivity occurred.

本発明者らは、上述の知見を基に以下のような課題を解決するため手段を見出した。
(1)セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられた板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータにおいて、該金属層は、前記板状部のうち前記電極部の接合面とは反対側の面の外周縁に4μm以上の厚さで形成されることを特徴とする接続端子接合セラミックヒータである。
(2)前記板状部の前記外周縁に、長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起を形成していない(1)に記載の接続端子接合セラミックヒータである。
(3)前記接合部は、前記電極部と前記接続端子の前記板状部とをロウ材により接合された(1)または(2)に記載の接続端子接合セラミックヒータである。
(4)前記金属層は、少なくともニッケル、金、銀、白金のいずれか一種を含む金属メッキ層である(1)〜(3)のいずれかに記載の接続端子接合セラミックヒータである。
(5)セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられる板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータの製造方法において、
前記接続端子の前記板状部を板材の打ち抜きにより作成し、前記接続端子の前記板状部の打ち抜き方向の面を前記電極部との接合面として接合して前記接合部を形成し、該接合部の表面を厚さが4μm以上の前記金属層で被覆する接続端子接合セラミックヒータの製造方法である。
(6)セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられる板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータの製造方法において、
前記電極部と接合する前記板状部のうち前記電極部との接合面とは反対側の面の外周縁を長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起のない状態とした後、前記電極部と前記接続端子の前記接合面を接合して前記接合部を形成し、該接合部の表面を厚さが4μm以上の金属層で被覆する接続端子接合セラミックヒータの製造方法である。
The present inventors have found a means for solving the following problems based on the above knowledge.
(1) Joining the electrode part provided on the surface of the ceramic substrate and electrically connected to the heater heating part that generates heat when energized and the plate-like part provided at the end of the connection terminal electrically connected to the outside In the connection terminal bonding ceramic heater in which the bonded portion is covered with a metal layer, the metal layer has a thickness of 4 μm or more on the outer peripheral edge of the surface of the plate-like portion opposite to the bonded surface of the electrode portion. It is a connection terminal joining ceramic heater characterized by being formed.
(2) The connection terminal bonding according to (1), wherein a protrusion having a length of 10 μm or more and a thickness of 300 μm or less and a length / thickness ratio of ½ or more is not formed on the outer peripheral edge of the plate-like portion. Ceramic heater.
(3) The connecting portion is the connecting terminal bonded ceramic heater according to (1) or (2), in which the electrode portion and the plate-like portion of the connecting terminal are bonded with a brazing material.
(4) The connection terminal bonded ceramic heater according to any one of (1) to (3), wherein the metal layer is a metal plating layer containing at least one of nickel, gold, silver, and platinum.
(5) The electrode portion provided on the surface of the ceramic base and electrically connected to the heater heat generating portion that generates heat when energized is joined to the plate-like portion provided at the end of the connection terminal electrically connected to the outside. In the manufacturing method of the connecting terminal bonded ceramic heater in which the bonded portion is coated with a metal layer,
The plate-like portion of the connection terminal is created by punching a plate material, and the surface of the plate-like portion of the connection terminal in the punching direction is joined as a joint surface with the electrode portion to form the joint portion. This is a method of manufacturing a connection terminal bonded ceramic heater in which the surface of the part is covered with the metal layer having a thickness of 4 μm or more.
(6) The electrode portion provided on the surface of the ceramic base and electrically connected to the heater heat generating portion that generates heat when energized is joined to the plate-like portion provided at the end of the connection terminal electrically connected to the outside. In the manufacturing method of the connecting terminal bonded ceramic heater in which the bonded portion is coated with a metal layer,
The outer peripheral edge of the surface of the plate-like part to be joined to the electrode part opposite to the joining surface with the electrode part has a length of 10 μm or more and a thickness of 300 μm or less and a length / thickness ratio of 1/2 or more. After connecting the electrode part and the connection surface of the connection terminal, the connection part is formed, and the surface of the connection part is covered with a metal layer having a thickness of 4 μm or more. It is a manufacturing method of a joining ceramic heater.

本発明の接続端子接合セラミックヒータは、金属層が板状部の反対側面の外周縁に4μm以上の厚さで形成される。このように角部である板状部の反対側面の外周縁に厚みが4μm以上の金属層を設けることにより、セラミックヒータを長期間使用しても、接合部が剥き出しとなることを抑制し、接合部の腐食や電極部の導電不良を抑制することができる。よって、長期間安定した性能を発揮できるセラミックヒータとすることができる。なお、金属層の厚さが4μm未満のときは、上記効果を得ることができない。   In the connection terminal bonded ceramic heater of the present invention, the metal layer is formed at a thickness of 4 μm or more on the outer peripheral edge of the opposite side surface of the plate-like portion. In this way, by providing a metal layer with a thickness of 4 μm or more on the outer peripheral edge of the opposite side surface of the plate-like portion that is a corner portion, even if the ceramic heater is used for a long period of time, it is suppressed that the joint portion is exposed, It is possible to suppress the corrosion of the joint and the conductive failure of the electrode part. Therefore, it can be set as the ceramic heater which can exhibit the performance stabilized for a long period of time. In addition, when the thickness of a metal layer is less than 4 micrometers, the said effect cannot be acquired.

なお、本発明において「金属層は、板状部のうち電極部の接合面とは反対側の面の外周縁に4μm以上の厚さで形成される。」とは、板状部の厚さ方向の断面を取り、板状部の上記外周縁に対応する角部を通る仮想線を引いたときに、金属層に対応する仮想線の距離が4μm以上であることを意味するものである。   In the present invention, “the metal layer is formed at a thickness of 4 μm or more on the outer peripheral edge of the surface of the plate-like portion opposite to the bonding surface of the electrode portion” means the thickness of the plate-like portion. This means that when a cross section in the direction is taken and a virtual line passing through the corner corresponding to the outer peripheral edge of the plate-like part is drawn, the distance of the virtual line corresponding to the metal layer is 4 μm or more.

例えば、図3、図4には本発明の接続端子接合セラミックヒータの構造例を示している。図3は円筒形の接続端子接合セラミックヒータ1の例であり、例えばセンサー等の小型の精密機器で温度条件や雰囲気ガスなどが劣悪な環境にも使用できる。この接続端子接合セラミックヒータ1は、主にセラミックヒータ100と接続端子7からなる。セラミックヒータ100は、アルミナ等を主体とする円筒形のセラミック基体2中に、通電により発熱するヒータ発熱部6及びヒータ発熱部6と接続するヒータリード部3(図1参照)が先端側から順に埋設されている(点線部分)。また、セラミック基体2の後端側の表面には、電極部4が設けられている。この電極部4は導通部5(図1参照)を介してヒータリード部3と連結している。そして、電極部4には、接続端子7が接合される。この接続端子7は、図5に示すようにその先端部に形成された電極部4と接続する板状部8と、後端部に形成されたリード線(図示せず)を接続するためのかしめ部15と、板状部8とかしめ部15とを接続する連結部16とからなる。他方、図4は平板状の接続端子接合セラミックヒータ20の例であり、例えば半導体製造装置のような比較的大型で厳しい温度制御の必要なヒータとして利用できる。なお、図4の接続端子接合セラミックヒータ20は、セラミック基体22の形状が平板状である以外は、図3の接続端子接合セラミックヒータ1と同様の構成を持っている。   For example, FIG. 3 and FIG. 4 show structural examples of the connection terminal bonded ceramic heater of the present invention. FIG. 3 shows an example of a cylindrical connection terminal bonded ceramic heater 1, which can be used in an environment where the temperature condition and the atmospheric gas are poor in a small precision instrument such as a sensor. The connection terminal bonded ceramic heater 1 mainly includes a ceramic heater 100 and a connection terminal 7. The ceramic heater 100 includes a cylindrical ceramic base 2 mainly composed of alumina or the like, and a heater heating portion 6 that generates heat by energization and a heater lead portion 3 (see FIG. 1) connected to the heater heating portion 6 in order from the tip side. It is buried (dotted line part). An electrode portion 4 is provided on the surface on the rear end side of the ceramic substrate 2. The electrode part 4 is connected to the heater lead part 3 through a conduction part 5 (see FIG. 1). The connection terminal 7 is joined to the electrode portion 4. As shown in FIG. 5, the connection terminal 7 is connected to a plate-like portion 8 connected to the electrode portion 4 formed at the front end portion and a lead wire (not shown) formed at the rear end portion. It consists of a caulking portion 15 and a connecting portion 16 that connects the plate-like portion 8 and the caulking portion 15. On the other hand, FIG. 4 shows an example of a flat connection terminal bonded ceramic heater 20 that can be used as a relatively large heater requiring severe temperature control, such as a semiconductor manufacturing apparatus. 4 has the same configuration as the connection terminal bonded ceramic heater 1 of FIG. 3 except that the shape of the ceramic substrate 22 is a flat plate.

そして、本発明の接続端子接合セラミックヒータ1は電極部4と接続端子7の板状部8とが接合された接合部の腐食等による劣化を防ぐものであり、この接合部につき詳しく説明する。図1、図2には図3の接続端子接合セラミックヒータの接合部を示している。電極部4はセラミック基体2の表面に露出しており、導通部5を介してヒータリード部3と連結している。電極部4の表面にはロウ材部9を介して接続端子7の板状接合部8の接合面12が接合されている。このロウ材部9は、金ロウ、銀ロウ、銅ロウなどのロウ材を用いている。なお、接合のためには、理論的には電極部4と接続端子7の接合面12との間にだけロウ材が存在すれば接合は可能であるが、実際にロウ付けをする場合は図1、図2に示すように電極部4上や接続端子7の板状接合部8のほぼ全体を覆うようにロウ材部9が形成される。そして、ロウ材部9は、銅などの腐食し易い金属を含むので、電極部4と接続端子7の板状部8とともにニッケル等の金属層10により被覆されている。この金属層10によりロウ材部9の腐食を防いでいる。   The connecting terminal bonded ceramic heater 1 of the present invention prevents deterioration due to corrosion or the like of the bonded portion where the electrode portion 4 and the plate-like portion 8 of the connecting terminal 7 are bonded, and this bonded portion will be described in detail. FIGS. 1 and 2 show a joint portion of the connection terminal joint ceramic heater of FIG. The electrode part 4 is exposed on the surface of the ceramic substrate 2 and is connected to the heater lead part 3 through the conduction part 5. A bonding surface 12 of the plate-like bonding portion 8 of the connection terminal 7 is bonded to the surface of the electrode portion 4 via a brazing material portion 9. The brazing material portion 9 uses a brazing material such as gold brazing, silver brazing, or copper brazing. For bonding, theoretically, bonding is possible if a brazing material exists only between the electrode portion 4 and the bonding surface 12 of the connection terminal 7. However, in the case of actual brazing, FIG. 1. As shown in FIG. 2, a brazing material portion 9 is formed so as to cover almost the entire plate-like joint portion 8 on the electrode portion 4 and the connection terminal 7. Since the brazing material portion 9 includes a metal that easily corrodes such as copper, the brazing material portion 9 is covered with a metal layer 10 such as nickel together with the electrode portion 4 and the plate-like portion 8 of the connection terminal 7. The metal layer 10 prevents the brazing material portion 9 from being corroded.

接続端子接合セラミックヒータ1は電極部4と接続端子7(板状部8)とロウ材部9により構成される接合部の全面を金属層10で被覆してロウ材部9を外部から隔離されている構造である。そして、この金属層10は、反対側面14の外周縁13での厚さt1が4μm以上である。この厚さt1は好ましくは6μm以上、さらに好ましくは8μm以上とすることがよい。このように板状部8の反対側面14の外周縁13に厚みが4μm以上の金属層10を設けることにより、セラミックヒータ1を長期間使用しても、接合部が剥き出しとなることを抑制し、接合部の腐食や電極部4の導電不良を抑制することができる。よって、期間安定した性能を発揮できるセラミックヒータとすることができる。   The connecting terminal bonding ceramic heater 1 has a metal layer 10 covering the entire surface of the bonding portion constituted by the electrode portion 4, the connection terminal 7 (plate-like portion 8) and the brazing material portion 9, and the brazing material portion 9 is isolated from the outside. It is a structure. And this metal layer 10 is 4 micrometers or more in thickness t1 in the outer periphery 13 of the opposite side surface 14. FIG. The thickness t1 is preferably 6 μm or more, more preferably 8 μm or more. Thus, by providing the metal layer 10 having a thickness of 4 μm or more on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8, even if the ceramic heater 1 is used for a long time, it is possible to prevent the joint portion from being exposed. In addition, corrosion of the joint portion and poor conductivity of the electrode portion 4 can be suppressed. Therefore, it can be set as the ceramic heater which can exhibit the performance stabilized for the period.

ところで、接続端子の板状部を簡単に効率的に製造するため、例えば板材の打ち抜きで作ることがある。この打ち抜きの際、板材を乗せる台に接している面(以下、この面を打ち抜き方向の面と称する。)の外周縁には、切断残、すなわちバリ(以下、突起とも言う)や傷が生ずることがある。このバリや傷は打ち抜き方法や打ち抜き装置によりさまざまであるが、全くなくすることは難しい。特に、数μmから数十μmの大きさのバリや傷が発生し易く、通常はこの程度の大きさであれば肉眼では発見し難い。そして、このような接続端子をそのままセラミックヒータの電極部と接合して接合部を形成すると、突起または傷が接続端子の板上部の反対側面の外周縁13に形成される虞があり、接合用のロウ材によっても修正されないことがある。このまま金属層により接合部を被覆しても、4μm以上の厚みの金属層を突起や傷に形成することが難しい場合がある。   By the way, in order to easily and efficiently manufacture the plate-like portion of the connection terminal, for example, it may be made by punching a plate material. At the time of punching, cutting residue, that is, burrs (hereinafter also referred to as protrusions) and scratches occur on the outer peripheral edge of the surface (hereinafter referred to as the surface in the punching direction) in contact with the table on which the plate material is placed. Sometimes. These burrs and scratches vary depending on the punching method and punching device, but it is difficult to eliminate them at all. In particular, burrs and scratches with a size of several μm to several tens of μm are likely to occur. Usually, such a size is difficult to detect with the naked eye. And if such a connection terminal is joined as it is to the electrode part of the ceramic heater to form a joint, a projection or a scratch may be formed on the outer peripheral edge 13 on the opposite side surface of the upper part of the connection terminal. Some brazing materials may not be corrected. Even if the bonding portion is covered with the metal layer as it is, it may be difficult to form a metal layer having a thickness of 4 μm or more on the protrusions and scratches.

そこで、本発明の接続端子接合セラミックヒータは、接続端子の板状部の反対側面の外周縁13に、長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起、がないことが好ましい。つまり、板状部の反対側面の外周縁に特定範囲の大きさの突起や傷がなくなるので、その外周縁に4μm以上の厚みの金属層を容易に形成することができる。なお、上述の条件に該当しないほどの小さな突起であれば、厚さ4μm以上の金属層にて覆うことが容易にできる。また、上記条件を超える平坦に近い突起であっても、厚さ4μm以上の金属層を覆うことが容易に出来る。なお、長さ5μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起がないことが好ましい。   Therefore, the connection terminal bonded ceramic heater of the present invention is a protrusion having a length / thickness ratio of 1/2 or more on the outer peripheral edge 13 on the opposite side surface of the plate-like portion of the connection terminal, having a length of 10 μm or more and a thickness of 300 μm or less. It is preferable that there is no. In other words, since there are no protrusions or scratches having a specific range of size on the outer peripheral edge of the opposite side surface of the plate-like portion, a metal layer having a thickness of 4 μm or more can be easily formed on the outer peripheral edge. If the protrusion is small enough not to meet the above-mentioned conditions, it can be easily covered with a metal layer having a thickness of 4 μm or more. Further, even a flat protrusion exceeding the above condition can easily cover a metal layer having a thickness of 4 μm or more. It is preferable that there are no protrusions having a length of 5 μm or more and a thickness of 300 μm or less and a length / thickness ratio of 1/2 or more.

例えば、図1、図2を参照にしながら説明すると、接続端子接合セラミックヒータ1は、板状部8の反対側面14の外周縁13、例えば図1のコーナー部11や図2の境界部17に、長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起がない接続端子接合セラミックヒータ1である。このような板状部8の反対側面14の外周縁13に特定範囲の大きさの突起がなく、平滑な外周縁13を有する接続端子接合セラミックヒータ1は、厚さが4μm以上の金属層10を板状部8の反対側面14の外周縁13に形成し易く、また接続端子接合セラミックヒータ1の取り扱い中や使用中に突起部上の金属層が摩耗したり、突起部ごと破損したりしてロウ材が露出することがない。外周縁13に、長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起、すなわち細くて比較的長い突起が存在すると、これが損傷し易く損傷してロウ材が剥き出しになれば、この部分から腐食が始まる。しかし、上述の条件に該当しないほど小さな突起であれば、一般に平滑であるとみなされ、耐食性金属層で覆われておればほとんど損傷しない。逆に、上記条件を超える大きな、あるいは平坦に近い突起は通常の操作では損傷し難く問題にならない。   For example, referring to FIGS. 1 and 2, the connecting terminal bonded ceramic heater 1 is disposed on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8, such as the corner portion 11 of FIG. 1 or the boundary portion 17 of FIG. 2. This is a connecting terminal-bonded ceramic heater 1 having a length of 10 μm or more and a thickness of 300 μm or less and no protrusion having a length / thickness ratio of 1/2 or more. The connecting terminal bonded ceramic heater 1 having a smooth outer peripheral edge 13 without a protrusion having a specific size on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8 has a thickness of 4 μm or more. Can be easily formed on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8, and the metal layer on the protruding portion is worn or damaged during the handling or use of the connection terminal bonding ceramic heater 1. The brazing material will not be exposed. If the outer peripheral edge 13 has a protrusion having a length of 10 μm or more and a thickness of 300 μm or less and a length / thickness ratio of 1/2 or more, that is, a thin and relatively long protrusion, this is easily damaged and the brazing material is damaged. If it is exposed, corrosion starts from this part. However, if the protrusion is small enough not to meet the above-mentioned conditions, it is generally regarded as smooth, and if it is covered with a corrosion-resistant metal layer, it is hardly damaged. On the other hand, a large or nearly flat protrusion exceeding the above conditions is not easily damaged and does not cause a problem.

本発明の接続端子接合セラミックヒータに使用する部材の材質について説明する。それぞれの部材は、原則はセラミックヒータの使用目的に合わせて選べばどのような材料でも良い。一般的に好ましい部材につき説明する。セラミックヒータ用のセラミック基体は通常アルミナ、シリカ、カルシア、マグネシア、シリカアルミナ、ムライトなどが用いられる。その他に窒化珪素、炭化珪素、ジルコニア、サイアロン、窒化ホウ素あるいは珪酸カルシウムなどでも良い。通常はアルミナが使用しやすいのでアルミナを用いることが多い。ヒータ発熱体、電極用のパッド、これらを結ぶ導通部などはタングステンやモリブデンやその合金が利用される。一部にニッケルや白金、金の合金などを用いることもある。これらの部品は適当な電気伝導度を有し、セラミック基体と一体で焼成されるので耐熱性も必要である。また、薄い金属パッドなどとして焼成前のセラミック基体上に印刷などにより形成し易い金属が良い。タングステンはロウ材の成分である銅との接着性が良くないので接着端子を接合する電極部には焼成後にニッケルメッキ、金メッキなどの処理を施し、ロウ材による接着端子との接着性を高めてやることが好ましい。電極部と接続端子の接着はロウ付けや溶接によればよい。通常は操作が簡単で接着性が十分なロウ材によるロウ付けが用いられる。溶接によっても良いが、この場合は上記で説明したロウ材の替わりに溶接により溶解し、溶接棒材などの溶接剤と固溶した部分をロウ材と考えればよい。接続端子も通常の接続端子用の材質でよい。銅、金、銀、白金、ニッケル、アルミニウムなど良電導性で耐熱性、耐食性やロウ材との接着性の良い金属を選べばよい。経済性、耐食性等からはニッケルが好ましい場合が多い。金属層はメッキ層とする場合が多い。特に、ニッケルメッキ、金メッキなどが好適である。この層は主に内部のロウ材あるいは電極部や接続端子の接合部を腐食から保護する機能を有するものであれば良い。   The material of the member used for the connection terminal bonded ceramic heater of the present invention will be described. In principle, each member may be made of any material as long as it is selected according to the purpose of use of the ceramic heater. Generally preferable members will be described. As the ceramic substrate for the ceramic heater, alumina, silica, calcia, magnesia, silica alumina, mullite and the like are usually used. In addition, silicon nitride, silicon carbide, zirconia, sialon, boron nitride, calcium silicate, or the like may be used. Since alumina is usually easy to use, alumina is often used. Tungsten, molybdenum, or alloys thereof are used for the heater heating element, the electrode pads, and the conductive portions connecting them. In some cases, an alloy of nickel, platinum, or gold may be used. These parts have appropriate electrical conductivity and are fired integrally with the ceramic substrate, so that heat resistance is also required. Also, a metal that can be easily formed by printing or the like on a ceramic substrate before firing as a thin metal pad or the like is preferable. Tungsten does not have good adhesion to copper, which is a component of the brazing material, so the electrode part that joins the adhesive terminal is treated with nickel plating, gold plating, etc. after firing to improve the adhesion of the brazing material to the adhesive terminal. It is preferable to do. The electrode part and the connection terminal may be bonded by brazing or welding. Usually, brazing with a brazing material that is easy to operate and has sufficient adhesiveness is used. Although welding may be used, in this case, a portion that is melted by welding instead of the brazing material described above and is solid-solved with a welding agent such as a welding rod may be considered as a brazing material. The connection terminal may also be a normal connection terminal material. A metal such as copper, gold, silver, platinum, nickel, and aluminum having good electrical conductivity, heat resistance, corrosion resistance, and adhesiveness to the brazing material may be selected. Nickel is often preferred from the viewpoint of economy and corrosion resistance. The metal layer is often a plated layer. In particular, nickel plating, gold plating and the like are suitable. This layer may have any function as long as it mainly has a function of protecting the internal brazing material or the electrode portion and the connection portion of the connection terminal from corrosion.

次に、本発明の接続端子接合セラミックヒータの製造方法について説明する。本発明のセラミックヒータの製造方法は、接続端子の板状部を板材の打ち抜きにより作成し、この接続端子の板状部の打ち抜き方向の面をセラミックヒータの電極部との接合面として、接続端子とセラミックヒータの電極部との接合部を形成し、接合部の表面を厚さが4μm以上の金属層で被覆する製造方法である。接続端子の板状部の打ち抜き方向の面とは、打ち抜きの際、板材を乗せる台に接している側の面であり、接続端子の切断部に切断残すなわちバリの生じやすい面のことを指す。このように、接続端子を板材の打ち抜きで作ると、打ち抜き方向の面の外周縁には、突起や傷が生ずることがある。一方、打ち抜き方向の面と反対側の面には、突起や傷が生ずることが少ない。そこで、打ち抜き方向の面を電極部との接合面とすることで、板状部の反対側面の外周縁に上述のような特定範囲の大きさの突起や傷がなくなるので、4μm以上の厚みの金属層を容易にその外周縁に形成することができる。   Next, the manufacturing method of the connection terminal joining ceramic heater of this invention is demonstrated. The manufacturing method of the ceramic heater according to the present invention is such that the plate-like portion of the connection terminal is created by punching a plate material, and the surface in the punching direction of the plate-like portion of the connection terminal is used as a joint surface with the electrode portion of the ceramic heater. And a ceramic heater electrode part are formed, and the surface of the joint part is coated with a metal layer having a thickness of 4 μm or more. The surface in the punching direction of the plate-like portion of the connection terminal is the surface in contact with the base on which the plate material is placed during punching, and refers to the surface where cutting residue, that is, burrs are likely to occur at the cut portion of the connection terminal. . As described above, when the connection terminal is made by punching a plate material, a protrusion or a scratch may occur on the outer peripheral edge of the surface in the punching direction. On the other hand, there are few protrusions or scratches on the surface opposite to the surface in the punching direction. Therefore, by setting the surface in the punching direction as the joint surface with the electrode portion, the outer peripheral edge on the opposite side surface of the plate-like portion is free from protrusions and scratches having a specific range size as described above. A metal layer can be easily formed on the outer periphery thereof.

例えば、図4に示す構造のアルミナ基体にタングステン合金系のヒータ発熱部6、ヒータリード部3、電極部4、導通部5を有するセラミックヒータの製造方法は、まずアルミナスラリーからアルミナ板材を2枚成形する。一枚のアルミナ板の片面にタングステン合金製のヒータ発熱部6、ヒータリード部3を形成する。さらに、アルミナ板にヒータリード部3と繋がる導通用の小孔を開け、導通部5を作成する。そして、アルミナ板のヒータ発熱部6形成面と反対面に電極部4を形成する。なお、この電極部4と導通部5とは導通させている。ヒータ発熱部6、ヒータリード部3は所望の電気抵抗となるようなタングステン合金とし、導通部や電極部等は良導性のタングステン合金を用い印刷等により所望の形状に形成する。これに、別途作っておいたもう一枚のアルミナ板をヒータ発熱部6、ヒータリード部3を形成した面を挟むように積層し圧着して一枚のアルミナ板とする。この未焼成のアルミナ板を乾燥し、その後1200℃程度の温度で焼成すれば図4に示すようなセラミックヒータ20となる。また未焼成のアルミナ板をアルミナ円筒上に丸めて成形し、焼成すれば図3に示すようなセラミックヒータ100ができる。焼成後、電極部4の表面にはニッケルめっきを施してロウ付けを容易にしておくと良い。   For example, a method for manufacturing a ceramic heater having a tungsten alloy heater heating section 6, heater lead section 3, electrode section 4 and conduction section 5 on an alumina substrate having the structure shown in FIG. Mold. A heater heating part 6 and a heater lead part 3 made of tungsten alloy are formed on one side of one alumina plate. Further, a small hole for conduction connected to the heater lead portion 3 is formed in the alumina plate, and the conduction portion 5 is created. And the electrode part 4 is formed in the surface opposite to the heater heat generating part 6 formation surface of an alumina plate. The electrode part 4 and the conduction part 5 are electrically connected. The heater heat generating portion 6 and the heater lead portion 3 are made of a tungsten alloy that has a desired electric resistance, and the conductive portion and the electrode portion are formed in a desired shape by printing or the like using a highly conductive tungsten alloy. On this, another alumina plate prepared separately is laminated so as to sandwich the surface on which the heater heat generating portion 6 and the heater lead portion 3 are formed, and is pressed into one alumina plate. If this unfired alumina plate is dried and then fired at a temperature of about 1200 ° C., a ceramic heater 20 as shown in FIG. 4 is obtained. Further, a ceramic heater 100 as shown in FIG. 3 can be obtained by rolling an unfired alumina plate on an alumina cylinder, forming it, and firing it. After firing, the surface of the electrode part 4 is preferably plated with nickel to facilitate brazing.

一方、接続端子7は上述のような導電性の素材を使って作成すれば良いが、例えばニッケル製とすることが好適である。ニッケルの薄板から接続端子7の形状に合わせた型で打ち抜いて、図5のように成形加工すれば製造できる。一方の接続端子7の端部には、板状部8が形成されている。他方、リード線と接続する部分にはかしめ部15が形成されており、例えば図3、図4で示すようなコの字型断面としてリード線を圧着により接続し易い構造などとすればよい。この部分は円筒でも平板でも良く、使用目的に合わせて適宜成形すればよい。   On the other hand, the connection terminal 7 may be made using the conductive material as described above, but is preferably made of nickel, for example. It can be manufactured by punching out from a thin nickel plate with a mold matched to the shape of the connection terminal 7 and molding as shown in FIG. A plate-like portion 8 is formed at the end of one connection terminal 7. On the other hand, a caulking portion 15 is formed at a portion to be connected to the lead wire. For example, a U-shaped cross section as shown in FIGS. 3 and 4 may be used so that the lead wire can be easily connected by crimping. This portion may be a cylinder or a flat plate, and may be appropriately formed according to the purpose of use.

そして、この接続端子7の板状部8をセラミックヒータの電極部4に接合する。ここで注意することは、接続端子7の電極部4との接合面12を打ち抜き方向の面とすることである。これにより、打ち抜きの際に接続端子7の打ち抜き方向の面に発生したバリなどの突起はロウ材部9に埋もれてしまい、接合面12と反対側の面は打ち抜きのバリによる突起が出ることはない。接合は強度および導電性を有する方法で行えばよい。通常、ロウ付け、溶接が用いられるがロウ付けが簡単で確実なので好適である。ロウ材は上述のものを用いればよい。例えば、銀−銅系合金の銀ロウを用いればよい。通常、ロウ材は接合面だけでなく、図3、図4に示すように接合面12周辺の接合部全体にロウ材を溶着することにより完全に接合できる。   Then, the plate-like portion 8 of the connection terminal 7 is joined to the electrode portion 4 of the ceramic heater. It should be noted that the bonding surface 12 of the connection terminal 7 with the electrode portion 4 is a surface in the punching direction. As a result, protrusions such as burrs generated on the surface in the punching direction of the connection terminals 7 during punching are buried in the brazing material part 9, and protrusions due to punching burrs appear on the surface opposite to the joint surface 12. Absent. Bonding may be performed by a method having strength and conductivity. Usually, brazing or welding is used, but it is preferable because brazing is simple and reliable. The brazing material described above may be used. For example, a silver-copper alloy silver solder may be used. Usually, the brazing material can be completely joined by welding the brazing material not only to the joint surface but also to the entire joint around the joint surface 12 as shown in FIGS.

接続端子7の接合が終わったら、接合部全体を厚さが4μm以上の金属層10で被覆する。このとき、打ち抜き方向の面(接合面12)と反対側の面には、突起や傷が生ずることが少なくなっている。すると、接合面12とは反対側面14の外周縁13に上述の特定範囲の大きさの突起や傷がなくなるので、4μm以上の厚みの金属層10を容易にその外周縁13に形成することができる。なお、金属層10は上述したようにニッケルメッキなどが好適に適用できる。   When the connection of the connection terminal 7 is finished, the entire joint is covered with the metal layer 10 having a thickness of 4 μm or more. At this time, protrusions and scratches are less likely to occur on the surface opposite to the surface in the punching direction (joint surface 12). As a result, the outer peripheral edge 13 of the side surface 14 opposite to the joint surface 12 is free from protrusions and scratches having the above-mentioned specific range, so that the metal layer 10 having a thickness of 4 μm or more can be easily formed on the outer peripheral edge 13. it can. As described above, nickel plating or the like can be suitably applied to the metal layer 10.

他の態様の本発明の接続端子接合セラミックヒータの製造方法として、セラミックヒータの電極部と接合する板状部のうち、電極部との接合面とは反対側の面の外周縁を長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起がない状態とした後、セラミックヒータの電極部と接続端子の接合面を接合して接合部を形成し、接合部の表面を厚さが4μm以上の金属層で被覆する製造方法がある。このようにすれば、金属層で被覆する前に板状部の反対側面の外周縁に上述の突起はなく、メッキ層もむらなく形成されやすく、厚さが4μm以上の金属層で被覆ができる。板状部の反対側面14の外周縁13にできる突起を除去する方法は、どのような方法でも良いが接続端子をブラッシング、バレル研磨、研削などにより磨いてやれば容易に達成できる。勿論、鍛造等の最初から小突起のできない製造方法で接続端子を作っても良い。   As another method for manufacturing the connecting terminal bonded ceramic heater of the present invention, the outer peripheral edge of the surface opposite to the bonding surface with the electrode portion of the plate portion bonded to the electrode portion of the ceramic heater is 10 μm long. After the thickness is 300 μm or less and the protrusion having a length / thickness ratio of ½ or more is not present, the joined portion of the ceramic heater electrode portion and the connecting terminal is joined to form a joined portion. There is a manufacturing method in which the surface of the substrate is coated with a metal layer having a thickness of 4 μm or more. In this way, before the coating with the metal layer, the above-mentioned protrusions are not formed on the outer peripheral edge of the opposite side surface of the plate-like portion, the plating layer is easily formed uniformly, and the coating can be performed with the metal layer having a thickness of 4 μm or more. . Any method may be used to remove the protrusion formed on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion, but it can be easily achieved by polishing the connection terminal by brushing, barrel polishing, grinding or the like. Of course, the connection terminals may be made by a manufacturing method that does not allow small projections from the beginning, such as forging.

本発明のセラミックヒータは、接続端子の板状部のうち電極部との接合面とは反対側の
面の外周縁が4μm以上の金属層で被覆されており、また、破損し易い突起がないことから、電極部と接続端子との接合時に使用したロウ材などの接合材が表面に露出し腐食することがない。このため、接合部における導通不良がなく、安定した電流制御ができるので精度のよい長寿命のセラミックヒータである。また、接合部に突起がないことは製造時に他のセラミックヒータと重ねたり、使用時に他の部品と触れ合ったりしても突起が他のヒータや部品に傷をつけることもない。本発明の接続端子接合セラミックヒータの製造方法は、従来の製造方法より製造費を増加させることなく性能の安定した長寿命の接続端子接合セラミックヒータを製造する方法である。
In the ceramic heater of the present invention, the outer peripheral edge of the surface of the connection terminal opposite to the bonding surface with the electrode portion is coated with a metal layer of 4 μm or more, and there is no protrusion that is easily damaged. Therefore, the bonding material such as the brazing material used at the time of bonding the electrode portion and the connection terminal is not exposed and corroded on the surface. For this reason, there is no poor conduction at the joint, and stable current control can be performed, so that the ceramic heater has a high accuracy and a long life. Further, the fact that there is no protrusion at the joint does not cause the protrusion to damage other heaters or parts even if they are overlapped with other ceramic heaters at the time of manufacture or touch other parts at the time of use. The method for manufacturing a connection terminal bonded ceramic heater according to the present invention is a method for manufacturing a connection terminal bonded ceramic heater having a stable performance and a long life without increasing the manufacturing cost as compared with the conventional manufacturing method.

本発明を実施するための最良の形態を実施例および比較例によって示す。   The best mode for carrying out the present invention will be described with reference to examples and comparative examples.

(実施例1)
アルミナ93wt%、マグネシア、シリカ、カルシアからなる焼結助剤7wt%からなる原料粉末をエタノール溶媒中でスラリーとし、このスラリーからドクターブレード法により厚さ1.5mmの平板を作った。これから長さ60mm、幅10mmの板状に打ち抜いてグリーンシートを作成した。このグリーンシート小孔を二つ開けて、二つの小孔を基点として片面にタングステンを主成分とする金属ペーストによりヒータパターンを印刷した。また、小孔にも金属ペーストをつめてヒータパターンとの導電性を確保し、さらにグリーンシートの反対面の小孔部分に、金属ペーストで電極部を形成した。このヒータパターンを形成したグリーンシートのヒータパターン側にエタノールを塗布し、別途作っておいたアルミナ製の長さ60mm、外径10mm、内径2mmの円筒状焼結体にヒータパターン側を内側にして巻きつける。これを焼成炉で1200〜1300℃で焼成してセラミックヒータ100を作った。さらに、このセラミックヒータ100の電極部4にニッケルメッキを施した。
Example 1
A raw material powder composed of 93 wt% alumina, magnesia, silica and calcia and 7 wt% sintering aid was made into a slurry in an ethanol solvent, and a flat plate having a thickness of 1.5 mm was made from this slurry by the doctor blade method. From this, a green sheet was prepared by punching into a plate shape having a length of 60 mm and a width of 10 mm. Two small holes on the green sheet were formed, and a heater pattern was printed on one side with a metal paste mainly composed of tungsten with the two small holes as a starting point. In addition, the small holes were filled with a metal paste to ensure conductivity with the heater pattern, and an electrode portion was formed with the metal paste in the small hole portion on the opposite surface of the green sheet. Ethanol is applied to the heater pattern side of the green sheet on which the heater pattern is formed, and a separately prepared cylindrical sintered body having a length of 60 mm, an outer diameter of 10 mm, and an inner diameter of 2 mm with the heater pattern side inward. Wrap around. This was fired at 1200 to 1300 ° C. in a firing furnace to produce a ceramic heater 100. Further, the electrode portion 4 of the ceramic heater 100 was subjected to nickel plating.

一方、0.2mmのニッケル板から長さ15mm、幅1mmで先端が略T字型に膨らんだ形状の小片を打ち抜きにより作成した。この小片のT字型の両側部分を同方向に90℃折り曲げてリード線を圧着するコの字型の加締め部15をつくり、他端をセラミックヒータ1の電極部4と接合する板状部8となるようにして中間を略階段状に折り曲げた連結部16として、図5に示した形状の接続端子7を作成した。この際、接続端子7の板状部8の接合面12が打ち抜き方向の面となるようにする。そして、上記のセラミックヒータ1の電極部4に接続端子7の板状部8を銀ロウによりロウ付けして接合する。完全にロウ付けができたら、ニッケルメッキを施して金属層10を形成し、図3に示すような本発明の接続端子接合セラミックヒータ1が出来上がる。   On the other hand, a small piece having a length of 15 mm, a width of 1 mm, and a tip swelled into a substantially T shape was formed by punching from a 0.2 mm nickel plate. A U-shaped crimping portion 15 is formed by bending both side portions of the T-shape of this small piece in the same direction at 90 ° C. and crimping the lead wire, and the other end is joined to the electrode portion 4 of the ceramic heater 1. The connection terminal 7 having the shape shown in FIG. 5 was created as a connecting portion 16 whose middle portion was bent in a substantially staircase shape so as to be 8. At this time, the joint surface 12 of the plate-like portion 8 of the connection terminal 7 is made to be a surface in the punching direction. Then, the plate-like portion 8 of the connection terminal 7 is joined to the electrode portion 4 of the ceramic heater 1 by brazing with silver solder. When the brazing is complete, the metal layer 10 is formed by performing nickel plating, and the connection terminal bonded ceramic heater 1 of the present invention as shown in FIG. 3 is completed.

この接続端子接合セラミックヒータ1の接続端子7の板状部8を電子顕微鏡で観察した写真を図6に示す。上図は接続端子7の板状部8の端部がセラミックヒータ100の電極部4に接合している部分である。下図は上図の円形で示したコーナー部11付近の拡大図である。図から判るように板状部8の反対側面14の外周縁13には、高さ5μm、あるいは10μmを超えるような突起は見当たらない。   The photograph which observed the plate-shaped part 8 of the connection terminal 7 of this connection terminal joining ceramic heater 1 with the electron microscope is shown in FIG. The upper diagram is a portion where the end of the plate-like portion 8 of the connection terminal 7 is joined to the electrode portion 4 of the ceramic heater 100. The lower figure is an enlarged view of the vicinity of the corner portion 11 indicated by the circle in the upper figure. As can be seen from the drawing, no protrusions having a height exceeding 5 μm or 10 μm are found on the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8.

この接続端子7を厚さ方向に切断してさらに拡大し、エネルギー分散法による反射電子像処理した電子顕微鏡写真が図7の上図である。下図はこれを元素マッピングした図である。板状部8の反対側面14の外周縁13付近は接続端子7母材のニッケル、ロウ材部9の銅、銀、金属層10のニッケルがはっきりとこの順に層をなしている。図8はさらに拡大した元素マッピングした図であり外側の金属層10が5μm以上の厚さの層を作っていることがさらにわかりやすい。   An upper part of FIG. 7 is an electron micrograph obtained by cutting the connection terminal 7 in the thickness direction and further enlarging and processing the reflected electron image by the energy dispersion method. The figure below shows this element mapping. In the vicinity of the outer peripheral edge 13 of the opposite side surface 14 of the plate-like portion 8, nickel of the connection terminal 7 base material, copper of the brazing material portion 9, silver, and nickel of the metal layer 10 are clearly layered in this order. FIG. 8 is a further enlarged element mapping diagram, and it is easier to understand that the outer metal layer 10 forms a layer having a thickness of 5 μm or more.

(実施例2)
実施例1において接続端子7を作成する際、この接続端子7の板状部8をバレル研磨によって研磨し小突起を除去した。この研磨した接続端子7を用い、打ち抜き方向の面を接合面12と反対側面14にした以外は実施例1と同様にして本発明の接続端子接合セラミックヒータ1を作成した。実施例1と同じように電子顕微鏡写真で観察したところ、板状部8の反対側面14の外周縁には、長さ10μm以上太さ200μm以下で長さ/太さの比が1/2以上の突起がなかった。また、元素マッピングによって観察しても金属層10が4μm以上の厚さの層を作っていた。
(Example 2)
When the connection terminal 7 was prepared in Example 1, the plate-like portion 8 of the connection terminal 7 was polished by barrel polishing to remove small protrusions. Using this polished connection terminal 7, the connection terminal bonded ceramic heater 1 of the present invention was produced in the same manner as in Example 1 except that the surface in the punching direction was changed to the side surface 14 opposite to the bonded surface 12. When observed with an electron micrograph in the same manner as in Example 1, the outer peripheral edge of the opposite side surface 14 of the plate-like portion 8 had a length of 10 μm or more and a thickness of 200 μm or less and a length / thickness ratio of 1/2 or more. There was no protrusion. Further, even when observed by element mapping, the metal layer 10 formed a layer having a thickness of 4 μm or more.

(比較例)
実施例2においてバレル研磨した接続端子を用いた替わりに、バレル研磨する前の接続端子を用いた以外実施例2と同様にして接続端子接合セラミックヒータを作成した。
(Comparative example)
Instead of using the connection terminal subjected to barrel polishing in Example 2, a connection terminal bonded ceramic heater was prepared in the same manner as in Example 2 except that the connection terminal before barrel polishing was used.

(加速試験による評価)
上記で作成した実施例1、実施例2、比較例の接続端子接合セラミックヒータ1を下記の亜硫酸ガス曝気試験により評価した。およそ1リットルの容器中に測定用の接続端子接合セラミックヒータおよび約100mgの硫黄を離して入れ、硫黄に火を付けて容器を密閉して硫黄を燃焼させる。40秒後に容器から接続端子接合セラミックヒータ1を取り出して接合部分を観察する。ニッケルメッキがなくてロウ材が露出している部分は黒色に変色している。銀が硫化銀となって黒化したものと考えられる。なお、明らか白色であるべきニッケルメッキ層が硫化されて全体が激しく黒色になっているときは亜硫酸ガスへの曝露時間を短くする。
(Evaluation by accelerated test)
The connection terminal bonded ceramic heaters 1 of Example 1, Example 2 and Comparative Example created above were evaluated by the following sulfurous acid gas aeration test. In a container of approximately 1 liter, the connecting terminal bonding ceramic heater for measurement and about 100 mg of sulfur are put apart, and the sulfur is ignited to seal the container and burn the sulfur. After 40 seconds, the connecting terminal bonded ceramic heater 1 is taken out of the container and the bonded portion is observed. The part where there is no nickel plating and the brazing material is exposed turns black. It is thought that silver became silver sulfide and blackened. In addition, when the nickel plating layer which should be clear white is sulfided and the whole is intensely black, the exposure time to sulfurous acid gas is shortened.

亜硫酸ガス曝気試験の結果、実施例1および実施例2で作成した本発明の接続端子接合セラミックヒータは接続端子の板状接合部の稜および頂点部分を含めてほとんど黒化する部分はなかった。一方、比較例で作成した接続端子接合セラミックヒータは接続端子の板状接合部の稜および頂点部分はところどころに黒化した部分があり、ロウ材が露出していると考えられた。このロウ材は銅が含まれており、外部に露出しておればここから簡単に腐食が始まると考えられる。   As a result of the sulfurous acid gas aeration test, the connection terminal bonded ceramic heater of the present invention prepared in Example 1 and Example 2 had almost no blackened part including the edge and apex part of the plate-like bonded part of the connection terminal. On the other hand, it was considered that the connecting terminal bonded ceramic heater prepared in the comparative example had blackened portions at the ridges and apex portions of the plate-like bonded portions of the connecting terminals, and the brazing material was exposed. This brazing material contains copper, and if it is exposed to the outside, it is considered that corrosion starts easily from here.

本発明の接続端子接合セラミックヒータはセンサー用のヒータや半導体製造用のヒータなど高温や腐食性雰囲気など過酷な条件下で精度良く温度制御する長寿命の信頼性の高いヒータとして利用範囲が広い。   The connection terminal bonded ceramic heater of the present invention has a wide range of applications as a long-life and highly reliable heater that accurately controls temperature under severe conditions such as high temperatures and corrosive atmospheres, such as heaters for sensors and heaters for semiconductor manufacturing.

図1は本発明の接続端子接合セラミックヒータにおけるセラミックヒータと接続端子の接合部の構造図である。上部の円内はコーナー部の拡大図である。FIG. 1 is a structural diagram of a joint portion between a ceramic heater and a connection terminal in the connection terminal joint ceramic heater of the present invention. The upper circle is an enlarged view of the corner. 図2は円筒形をした本発明の接続端子接合セラミックヒータにおけるセラミックヒータと接続端子の接合部の円筒を輪切りにした状態の構造図である。FIG. 2 is a structural diagram of the cylindrical connecting terminal bonded ceramic heater of the present invention in a state where the cylinder of the connecting portion between the ceramic heater and the connecting terminal is cut into a ring. 図3は円筒形をした本発明の接続端子接合セラミックヒータの例示図である。FIG. 3 is a view showing an example of the connecting terminal bonding ceramic heater of the present invention having a cylindrical shape. 図4は板状の本発明の接続端子接合セラミックヒータの例示図である。FIG. 4 is an exemplary view of a plate-like connecting terminal bonding ceramic heater according to the present invention. 図5は本発明の接続端子接合セラミックヒータ用の接続端子の例示図である。FIG. 5 is an exemplary view of connection terminals for the connection terminal bonded ceramic heater of the present invention. 図6は本発明の接続端子接合セラミックヒータのセラミックヒータと接続端子との接合部の一部の電子顕微鏡写真である。下図は上図の丸印をした板状接合部の頂点部分の拡大写真である。FIG. 6 is an electron micrograph of a part of the joint between the ceramic heater and the connection terminal of the connection terminal bonding ceramic heater of the present invention. The lower figure is an enlarged photograph of the apex portion of the plate-like joint part circled in the upper figure. 図7は本発明の接続端子接合セラミックヒータの接続端子の接合面と反対側面の稜の部分における垂直切断面の電子顕微鏡写真である。図1における接続端子のコーナー部11に相当する。上図がエネルギー分散法による反射電子像処理した電子顕微鏡写真、下図がこれを元素マッピングした図である。FIG. 7 is an electron micrograph of a vertical cut surface at the ridge portion on the side surface opposite to the bonding surface of the connection terminal of the connection terminal bonding ceramic heater of the present invention. This corresponds to the corner portion 11 of the connection terminal in FIG. The upper figure is an electron micrograph obtained by processing a reflected electron image by the energy dispersion method, and the lower figure is a diagram obtained by element mapping. 図8は図6の元素マッピング図の拡大図である。FIG. 8 is an enlarged view of the element mapping diagram of FIG.

符号の説明Explanation of symbols

1、20:接続端子接合セラミックヒータ
t1:コーナー部に形成された金属層の厚さ
2、22:セラミック基体
3:ヒータリード部
4:電極部
5:導通部
6:ヒータ発熱部
7:接続端子
8:板状部
9:ロウ材部
10:金属層
11:コーナー部
12:接合面
13:反対側面の外周縁
14:反対側面
15:かしめ部
16:連結部
17:境界部
100:セラミックヒータ
DESCRIPTION OF SYMBOLS 1,20: Connection terminal joining ceramic heater t1: Thickness of the metal layer formed in the corner part 2, 22: Ceramic base | substrate 3: Heater lead part 4: Electrode part 5: Conduction part 6: Heater heat generating part 7: Connection terminal 8: Plate-shaped part 9: Brazing material part 10: Metal layer 11: Corner part 12: Joining surface 13: Outer peripheral edge 14 of opposite side surface 15: Reverse side surface 15: Caulking part 16: Connection part 17: Boundary part 100: Ceramic heater

Claims (6)

セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられた板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータにおいて、該金属層は、前記板状部のうち前記電極部の接合面とは反対側の面の外周縁に4μm以上の厚さで形成されることを特徴とする接続端子接合セラミックヒータ。   A joint provided on the surface of the ceramic base and joining the electrode part electrically connected to the heater heating part that generates heat when energized and the plate-like part provided at the end of the connection terminal electrically connected to the outside In the connecting terminal bonding ceramic heater coated with a metal layer, the metal layer is formed with a thickness of 4 μm or more on the outer peripheral edge of the surface of the plate-like portion opposite to the bonding surface of the electrode portion. A connecting terminal bonded ceramic heater. 前記板状部の前記外周縁に、長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起を形成していない請求項1に記載の接続端子接合セラミックヒータ。   2. The connection terminal bonded ceramic heater according to claim 1, wherein a protrusion having a length of 10 μm or more and a thickness of 300 μm or less and a length / thickness ratio of 1/2 or more is not formed on the outer peripheral edge of the plate-like portion. 前記接合部は、前記電極部と前記接続端子の前記板状部とをロウ材により接合された請求項1または2に記載の接続端子接合セラミックヒータ。   The connection terminal bonded ceramic heater according to claim 1, wherein the bonding portion is formed by bonding the electrode portion and the plate-shaped portion of the connection terminal with a brazing material. 前記金属層は、少なくともニッケル、金、銀、白金のいずれか一種を含む金属メッキ層である請求項1〜3のいずれか1項に記載の接続端子接合セラミックヒータ。   The connection terminal bonded ceramic heater according to claim 1, wherein the metal layer is a metal plating layer containing at least one of nickel, gold, silver, and platinum. セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられる板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータの製造方法において、
前記接続端子の前記板状部を板材の打ち抜きにより作成し、前記接続端子の前記板状部の打ち抜き方向の面を前記電極部との接合面として接合して前記接合部を形成し、該接合部の表面を厚さが4μm以上の前記金属層で被覆する接続端子接合セラミックヒータの製造方法。
There is a joined portion obtained by joining an electrode portion that is provided on the surface of the ceramic substrate and is electrically connected to a heater heat generating portion that generates heat when energized and a plate-like portion provided at an end portion of a connection terminal that is electrically connected to the outside. In the method of manufacturing a connection terminal bonded ceramic heater coated with a metal layer,
The plate-like portion of the connection terminal is created by punching a plate material, and the surface of the plate-like portion of the connection terminal in the punching direction is joined as a joint surface with the electrode portion to form the joint portion. A method of manufacturing a connection terminal bonded ceramic heater in which the surface of the portion is covered with the metal layer having a thickness of 4 μm or more.
セラミック基体の表面に設けられ、通電により発熱するヒータ発熱部に電気的に接続する電極部と、外部に電気的に接続する接続端子の端部に設けられる板状部とを接合した接合部が金属層で被覆された接続端子接合セラミックヒータの製造方法において、
前記電極部と接合する前記板状部のうち前記電極部との接合面とは反対側の面の外周縁を長さ10μm以上太さ300μm以下で長さ/太さの比が1/2以上の突起のない状態とした後、前記電極部と前記接続端子の前記接合面を接合して前記接合部を形成し、該接合部の表面を厚さが4μm以上の金属層で被覆する接続端子接合セラミックヒータの製造方法。

There is a joined portion obtained by joining an electrode portion that is provided on the surface of the ceramic substrate and is electrically connected to a heater heat generating portion that generates heat when energized and a plate-like portion provided at an end portion of a connection terminal that is electrically connected to the outside. In the method of manufacturing a connection terminal bonded ceramic heater coated with a metal layer,
The outer peripheral edge of the surface of the plate-like part to be joined to the electrode part opposite to the joining surface with the electrode part has a length of 10 μm or more and a thickness of 300 μm or less and a length / thickness ratio of 1/2 or more. After connecting the electrode part and the connection surface of the connection terminal, the connection part is formed, and the surface of the connection part is covered with a metal layer having a thickness of 4 μm or more. Manufacturing method of bonded ceramic heater.

JP2005078986A 2005-03-18 2005-03-18 Connecting terminal jointing ceramic heater and its manufacturing method Pending JP2006261014A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103968282A (en) * 2013-02-01 2014-08-06 东芝照明技术株式会社 Light-emitting device and lighting apparatus
KR20170001497A (en) * 2015-06-26 2017-01-04 주식회사 미코 Ceramic heater

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103968282A (en) * 2013-02-01 2014-08-06 东芝照明技术株式会社 Light-emitting device and lighting apparatus
KR20170001497A (en) * 2015-06-26 2017-01-04 주식회사 미코 Ceramic heater
KR102272522B1 (en) * 2015-06-26 2021-07-05 주식회사 미코세라믹스 Ceramic heater

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