CN108901089B - Thick film heating element and working temperature increasing method thereof - Google Patents
Thick film heating element and working temperature increasing method thereof Download PDFInfo
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- CN108901089B CN108901089B CN201810957420.7A CN201810957420A CN108901089B CN 108901089 B CN108901089 B CN 108901089B CN 201810957420 A CN201810957420 A CN 201810957420A CN 108901089 B CN108901089 B CN 108901089B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
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Abstract
The invention discloses a thick film heating element and a working temperature increasing method thereof. The element comprises: the substrate is cylindrical, has openings at two ends and is made of heat conduction materials; the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner; the resistor layer comprises a plurality of strip-shaped resistor strips, and the resistor strips cover the insulating layer at intervals; the conductor layer is made of silver and comprises a plurality of linear conductor wires, and the conductor wires are distributed on the insulating layer at intervals; one end of each conductor line is connected with one resistance strip, and the other end of each conductor line is connected with one conductive wire; a cover layer covering the resistance layer, the conductor layer and the insulating layer; and the conductors are made of copper or silver, and each conductor is connected with one conductor wire through a silver welding point. The scheme well solves the problem that the working temperature of the existing thick film heating element is lower, and the working temperature of the heating element is obviously improved.
Description
Technical Field
The invention relates to the technical field of thick film heating, in particular to a thick film heating element and a working temperature increasing method thereof.
Background
The working temperature of the heating circuit of the existing thick film heating element can generally reach more than 450 degrees, but the working temperature depends on the temperature resistance of a lead welding point. The existing lead welding point generally adopts a lead-free solder soldering method, the maximum heat-resisting temperature of the welding point is usually not more than 260 ℃, so that the working temperature of the thick film heating element is greatly limited, and the welding point also becomes a bottleneck for limiting the increase of the working temperature of the thick film heating element.
In order to improve the heat-resistant temperature of the welding point between the conductor and the lead, metal with high melting point is generally adopted, but if solder with high melting point is adopted, the silver conductor layer is easy to migrate in the welding process, and then the structure of the thick film conductor layer is damaged, so that the service life of the thick film heating element is greatly shortened.
Disclosure of Invention
The invention provides a thick film heating element and a working temperature increasing method thereof, which are used for overcoming the defects of low working temperature and the like in the prior art, and increasing the working temperature of the thick film heating element to more than 450 ℃ on the premise of not influencing the normal service life of the thick film element so as to improve the heating efficiency of the thick film element and widen the application field of the thick film element.
To achieve the above object, the present invention provides a thick film heating element comprising:
the substrate is cylindrical, has openings at two ends and is made of heat conduction materials;
the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner;
the resistor layer comprises a plurality of strip-shaped resistor strips, and the resistor strips are distributed on the insulating layer at intervals;
the conductor layer is made of silver and comprises a plurality of linear conductor wires, and the conductor wires are distributed on the insulating layer at intervals; one end of each conductor line is connected with one resistance strip, and the other end of each conductor line is connected with one conductive wire;
a cover layer covering the resistance layer, the conductor layer and the insulating layer;
the conductive wires are made of copper or silver, and each conductive wire is connected with one conductor wire through a silver soldering point.
In order to achieve the above object, the present invention further provides a method for increasing the operating temperature of a thick film heating element, comprising the following steps:
step 1: printing insulating medium slurry, heating resistance slurry, conductor slurry and covering coating slurry on a heat-conducting substrate layer by adopting a screen printing process, and drying and firing the heat-conducting substrate; forming a semi-finished product of the conductive wire to be welded;
bending and deforming the substrate into a cylindrical shape in the firing process, wherein the insulating medium slurry, the heating resistance slurry, the conductor slurry and the covering slurry form an insulating layer, a resistance layer, a conductor layer and a covering layer on the outer side surface of the substrate in sequence; wherein:
the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner;
the resistance layers are distributed on the insulating layer at intervals in a strip shape;
the conductor layers are made of silver, are linear and are distributed on the insulating layer at intervals, one end of each conductor wire is connected with the resistance layer, and the other end of each conductor wire is exposed outside the covering layer and is used for being welded with a conductive wire;
the covering layer covers the resistance layer, the conductor layer and the insulating layer;
the conductive wire is made of copper or silver;
step 2: placing a connection end of the conductive wire on a connection end of the conductor wire;
and step 3: covering the conductive wire connecting end and the conductor wire connecting end with nano-silver soldering paste;
and 4, step 4: and heating the nano silver soldering paste through quick heating equipment to complete the welding of the conductive wire and the conductor wire. The quick heating device comprises one of laser heating device, microwave heating device, light wave heating device, plasma activation heating device and activation area heating device.
The invention provides a thick film heating element and a working temperature increasing method thereof, wherein the thick film heating element comprises the following steps: the nano silver paste is used as the solder, and the low melting point of the nano silver and the good wettability between copper and silver are utilized, so that the silver substrate of the conductor layer can not be damaged in the welding process, the structure of the conductor layer can not be damaged, and the service life of the thick film heating element can not be influenced. In addition, the advantages of high temperature rise and high sintering speed when the nano silver paste is heated by the quick heating equipment are utilized, the sintering time is obviously shortened, the nano silver particles do not have enough time to generate surface diffusion, and the non-densification diffusion of the nano silver paste is greatly limited. When the nano silver paste enters a high-temperature region, densification diffusion (such as grain boundary/lattice diffusion) is dominant, so that densification diffusion occurs among nano silver particles, high sintering density is obtained, the formed welding spot is small in volume, rapid welding of the nano silver paste and a copper wire or a silver wire is realized, and a high-quality silver welding spot is obtained. The working temperature of the silver soldering point can reach the melting point of silver (about 950 ℃), and the working temperature of the thick film heating element is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is to be understood that the drawings in the following description are merely exemplary of the invention and that other drawings may be derived from the structure shown in these drawings without the exercise of inventive faculty, as will be apparent to those skilled in the art.
FIG. 1 is a front view of a thick film heating element provided by an embodiment of the invention;
FIG. 2 is an expanded view of FIG. 1;
FIG. 3 is a schematic longitudinal cross-sectional view of FIG. 1;
fig. 4 is a flowchart of a method for increasing the operating temperature of a thick film heating element according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should be considered to be absent and not within the protection scope of the present invention.
The invention provides a thick film heating element and a working temperature increasing method thereof.
Example one
Referring to fig. 1 to 3, the present invention provides a thick film heating element, including a substrate 1, an insulating layer 2, a resistive layer 3, a conductive layer 4, a covering layer 5 and a conductive wire 6, wherein:
the substrate 1 is cylindrical, has openings at two ends and is made of heat conducting materials;
the insulating layer 2 covers the outer wall of the substrate 1 in a semi-surrounding manner;
the resistance layer 3 comprises a plurality of strip-shaped resistance strips 31, and the resistance strips 31 are distributed on the insulating layer 2 at intervals;
the conductor layer 4 is made of silver and comprises a plurality of linear conductor wires 41, and the conductor wires 41 are distributed on the insulating layer 2 at intervals; one end of each conductor wire 41 (in the form of a long and thin wire) is connected to one of the resistor strips 31, and the other end of each conductor wire 41 has a welding end 42 (in the present embodiment, the welding end is in the form of a sheet, and may be in the form of a circle, an ellipse, a triangle, a trapezoid, a rhombus, or the like, and may be specifically determined according to the specific shape of the welding end of the conductive wire 6 welded thereto or the stability of the formed welding point), and the welding end 42 is connected to one conductive wire 6 through a silver welding point 61; the plurality of resistor strips 31 can be connected in series, in parallel or in a series-parallel combination mode through the conductor lines 41, so that the purpose of changing the resistance value of the resistor can be achieved according to specific requirements. The resistor strips 31 shown in fig. 2 are connected in series with each other.
The covering layer 5 covers the resistance layer 3, the conductor layer 4 and the insulating layer 2; the welding end 42 is exposed out of the covering layer 5;
the conductive wires 6 are made of copper or silver, and each conductive wire 6 is connected with one conductor wire 41 through a silver soldering point.
The thick film heating element provided by the embodiment replaces the existing soldering point with the silver soldering point, so that the working temperature of the soldering point is greatly increased, and preferably, the conductor wire and the conductive wire are welded through the nano silver soldering paste to form the silver soldering point. The nano silver paste is adopted for welding, the conductor layer cannot be damaged in the welding process, the working temperature of the thick film heating element is increased to 450-950 ℃ from the original 260 ℃ under the condition that the service life of the thick film heating element is not affected, the heating efficiency is obviously improved, the heating time is greatly shortened, and the requirement of the field with higher medium working temperature can be met.
Preferably, in order to facilitate observation of the change of the operating temperature of the internal medium and the thick film heating element, or to perform temperature control, an NTC layer 7 (thermistor material) is coated on the cover layer, and the NTC layer is connected to the conductive wire through one of the conductor wires. Through the change of thermistor materials, the working temperature of the medium and the thick film heating element can be accurately measured by combining the conductor wire, the conductive wire connected with the conductor wire and the circuit connected with the conductive wire.
Preferably, the substrate 1 is made of one of stainless steel, aluminum, ceramic or alloy, has good heat conductivity, is convenient for high-temperature sintering processing, and has low cost and high corrosion resistance.
The heater made of the thick film heating element comprises an inner cylinder 11 made of one of stainless steel, aluminum, ceramic or alloy, wherein the inner cylinder 11 is positioned in a cylindrical substrate 1 (forming an outer cylinder), the upper end and the lower end of the inner cylinder are sealed, a medium cavity formed between the inner cylinder 11 and the outer cylinder is used for containing a heated medium (usually used for water or other liquid media), the lower end of the inner wall of the inner cylinder 11 is provided with an inlet 12 communicated with the medium cavity, and the upper end of the inner wall of the inner cylinder is provided with an outlet 13 communicated with the medium cavity. For example: in the heater for heating water instantly, a water inlet pipe is connected to an inlet 12, a water outlet of the heater is connected to an outlet 13 through a pipeline, when a user opens a hot water switch, the temperature of water in a medium cavity is detected through an NTC layer 7, when the temperature is lower than a set temperature of 99.9 ℃, a heating program is started, the outer end of a conducting wire 6 is electrified, current passes through a resistance layer 4 through a conductor wire 41, the resistance layer 4 generates heat to heat the water in the medium cavity, the power is cut off when the temperature reaches 99.9 ℃, and water is discharged from the water outlet.
Example two
The embodiment provides a thick film heating element, which is different from the first embodiment in that a substrate 1 is in a sheet shape and is made of a heat conducting material; an insulating layer 2 covers one side of the substrate 1, and such a thick film heating element in a sheet form is commonly used for heating solid devices or devices.
EXAMPLE III
Referring to fig. 4, on the basis of the first and second embodiments, the embodiment of the present invention provides a method for increasing the operating temperature of a thick film heating element, including the following steps:
step S1, printing the insulating medium slurry, the heating resistance slurry, the conductor slurry and the covering coating slurry on the heat conducting substrate layer by adopting a screen printing process, and drying and firing the heat conducting substrate; forming a semi-finished product of the conductive wire to be welded;
bending and deforming the substrate into a cylindrical shape in the firing process, wherein the insulating medium slurry, the heating resistance slurry, the conductor slurry and the covering slurry form an insulating layer, a resistance layer, a conductor layer and a covering layer on the outer side surface of the substrate in sequence; wherein:
the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner;
the resistance layers are distributed on the insulating layer at intervals in a strip shape;
the conductor layers are made of silver, are linear and are distributed on the insulating layer at intervals, one end of each conductor wire is connected with the resistance layer, and the other end of each conductor wire is exposed outside the covering layer and is used for being welded with a conductive wire;
the covering layer covers the resistance layer, the conductor layer and the insulating layer;
the conductive wire is made of copper or silver;
the step S1 includes:
step S11, printing the insulating medium slurry on a flat substrate with a preset size, drying and sintering the flat substrate, wherein the insulating medium slurry forms the insulating layer;
step S12, printing the heating resistor paste on the insulating layer, and drying and sintering the heating resistor paste to form the resistor layer;
step S13, printing the conductor paste on the insulating layer, and drying and sintering the conductor paste to form the conductor layer;
step S14, printing the cover paste on the insulating layer, the resistance layer, and the conductor layer, and drying and sintering the cover paste to form the cover layer;
the step S1 further includes:
step S15, in step 14, reserving connection ends exposed outside the covering layer at both ends of one of the conductor wires of the conductor layer, wherein one of the connection ends is used for connecting the conductive wire, printing thermistor paste on the other connection end, drying and sintering the thermistor paste, and the thermistor paste forms an NTC layer;
and step S16, printing encapsulation slurry on the covering layer and the NTC layer, drying and sintering, wherein the encapsulation slurry generates an encapsulation layer.
A step S2 of placing a connection end (soldering end) of the conductive wire on a connection end (soldering end) of the conductor wire;
the step 2 comprises the following steps:
step S21, fixing the semi-finished product on a workbench;
step S22, fixing one end of the conductive wire far away from the connecting end through a tool;
step S23, adjusting the tooling so that the connection end of the conductive wire falls on the connection end of the conductor wire on the semi-finished product, and the connection end of the conductive wire covers a part of the connection end of the conductor wire.
Step S3, coating nano silver solder paste to cover the conductive wire connection end and the conductor wire connection end;
and step S4, heating the nano silver soldering paste through a quick heating device to complete the welding of the conducting wire and the conductor wire. The quick heating equipment comprises one of laser heating equipment, microwave heating equipment, light wave heating equipment, plasma activation heating equipment, activation zone heating equipment and current-assisted sintering equipment.
The step S4 includes:
step S41, selecting laser heating equipment as the quick heating equipment, and adjusting parameters of the laser heating equipment to enable light spots of laser beams to be focused on the nano-silver soldering paste on the conductive wire connecting end and the conductor wire connecting end;
step S42, heating to 270-400 ℃; the heating temperature is preferably 325-400 ℃, and in a short time when the temperature is higher than 325 ℃, the silver particles are subjected to intercrystalline diffusion in a high-temperature region, the solder paste layer is rapidly densified, an obvious necking structure appears among the particles, and the connection strength of a welded joint is higher along with the increase of the temperature.
And step S43, heating for 0.6-3 seconds. The heating time is preferably 0.6-1.0 second, when the heating time is 0.6 second, the temperature of the soldering paste layer reaches about 400 ℃ of peak value, the temperature does not rise along with the increase of the heating time, and when the heating time exceeds 1 second, the shearing strength of the soldering joint does not increase or even decreases along with the increase of the heating time. When the heating time is less than 0.6 second, the decomposition of organic matters in the solder paste is incomplete, the intercrystalline diffusion of silver atoms in a high-temperature region is insufficient, and the compactness of a soldered joint is insufficient.
The silver solder joint obtained under the boundary conditions has high sintering density and small solder joint volume, greatly shortens the welding time and improves the welding efficiency.
Preferably, the nano silver solder paste in the step 4 comprises solid nano silver particles and a colloidal organic substance; wherein:
the content of the nano silver particles is between 70 and 90 weight percent;
the particle size of the nano silver particles is between 30nm and 60 nm;
the organic material includes a fatty acid dispersant, a polymeric binder with long chains, and a polymeric diluent containing short hydrocarbon chains.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A method for increasing the working temperature of a thick film heating element is characterized by comprising the following steps:
step 1: printing insulating medium slurry, heating resistance slurry, conductor slurry and covering slurry on a heat-conducting substrate layer by adopting a screen printing process, and drying and firing the heat-conducting substrate; forming a semi-finished product of the conductive wire to be welded;
bending and deforming the substrate into a cylindrical shape in the firing process, wherein the insulating medium slurry, the heating resistance slurry, the conductor slurry and the covering slurry form an insulating layer, a resistance layer, a conductor layer and a covering layer on the outer side surface of the substrate in sequence; wherein:
the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner;
the resistance layer is in a strip shape and covers the insulating layer at intervals;
the conductor layers are made of silver, are linear and are distributed on the insulating layer at intervals, one end of each conductor wire is connected with the resistance layer, and the other end of each conductor wire is exposed outside the covering layer and is used for being welded with a conductive wire;
the covering layer covers the resistance layer, the conductor layer and the insulating layer;
the conductor of the conductive wire is made of copper or silver;
step 2: placing a connection end of the conductive wire on a connection end of the conductor wire;
and step 3: coating nano silver soldering paste to cover the conductive wire connecting end and the conductor wire connecting end;
and 4, step 4: heating the nano silver soldering paste through quick heating equipment to complete the welding of the conductive wire and the conductor wire, wherein the quick heating equipment is laser heating equipment or microwave heating equipment;
the step 4 comprises the following steps:
step 41, selecting laser heating equipment as the rapid heating equipment, and adjusting parameters of the laser heating equipment to enable light spots of laser beams to be focused on the nano-silver solder paste on the conductive wire connecting end and the conductor wire connecting end;
42, heating to 325-400 ℃;
43, heating for 0.6-1.0 second;
the nano silver solder paste in the step 4 comprises solid nano silver particles and colloidal organic substances; wherein:
the content of the nano silver particles is 70-90 wt%;
the particle size of the nano silver particles is 30-60 nm;
the organic material includes a fatty acid dispersant, a polymeric binder with long chains, and a polymeric diluent containing short hydrocarbon chains.
2. The method for increasing the operating temperature of a thick film heating element according to claim 1, wherein the step 2 comprises:
step 21, fixing the semi-finished product on a workbench;
step 22, fixing one end, far away from the connecting end, of the conducting wire through a tool;
and 23, adjusting the tool to enable the connecting end of the conductive wire to fall on the connecting end of the conductor wire on the semi-finished product, and enabling the connecting end of the conductive wire to cover a part of the connecting end of the conductor wire.
3. The method for increasing the operating temperature of a thick film heating element according to claim 1, wherein the step 1 comprises:
step 11, printing the insulating medium slurry on a flat substrate with a preset size, drying and sintering the flat substrate, wherein the insulating medium slurry forms the insulating layer;
step 12, printing the heating resistance slurry on the insulating layer, drying and sintering the heating resistance slurry, wherein the heating resistance slurry forms the resistance layer;
step 13, printing the conductor slurry on the insulating layer, drying and sintering the conductor slurry to form the conductor layer;
and step 14, printing the covering slurry on the insulating layer, the resistance layer and the conductor layer, drying and sintering the covering slurry, wherein the covering slurry forms the covering layer.
4. A thick film heating element made by the method of any one of claims 1 to 3, comprising:
the substrate is cylindrical, has openings at two ends and is made of heat conduction materials;
the insulating layer is covered on the outer wall of the substrate in a semi-surrounding manner;
the resistor layer comprises a plurality of strip-shaped resistor strips, and the resistor strips cover the insulating layer at intervals;
the conductor layer is made of silver and comprises a plurality of linear conductor wires, and the conductor wires are distributed on the insulating layer at intervals; one end of each conductor line is connected with one resistance strip, and the other end of each conductor line is connected with one conductive wire;
a cover layer covering the resistance layer, the conductor layer and the insulating layer;
the conductive wires are made of copper or silver, and each conductive wire is connected with one conductor wire through a silver soldering point.
5. The thick film heating element of claim 4 wherein said conductor lines and said conductive lines are soldered by a nano-silver solder paste, and said substrate material comprises one of aluminum, ceramic or an alloy.
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| CN109853209A (en) * | 2019-01-24 | 2019-06-07 | 广西桂仪科技有限公司 | A kind of electric iron plate thick film heater and preparation process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188065A (en) * | 1992-12-17 | 1994-07-08 | Ngk Spark Plug Co Ltd | Ceramic heater |
| CN1446146A (en) * | 2000-06-19 | 2003-10-01 | 赫斯基注射器成型系统有限公司 | Thick film heater apparatus |
| CN106851872A (en) * | 2016-12-09 | 2017-06-13 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of aluminium alloy base plate large power thick film circuit intermediate sintering temperature silver palladium resistance slurry and preparation method thereof |
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2018
- 2018-08-22 CN CN201810957420.7A patent/CN108901089B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06188065A (en) * | 1992-12-17 | 1994-07-08 | Ngk Spark Plug Co Ltd | Ceramic heater |
| CN1446146A (en) * | 2000-06-19 | 2003-10-01 | 赫斯基注射器成型系统有限公司 | Thick film heater apparatus |
| CN106851872A (en) * | 2016-12-09 | 2017-06-13 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of aluminium alloy base plate large power thick film circuit intermediate sintering temperature silver palladium resistance slurry and preparation method thereof |
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