CN108889649A - A kind of mobile brush of semiconductor plastic package die - Google Patents

A kind of mobile brush of semiconductor plastic package die Download PDF

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Publication number
CN108889649A
CN108889649A CN201810755833.7A CN201810755833A CN108889649A CN 108889649 A CN108889649 A CN 108889649A CN 201810755833 A CN201810755833 A CN 201810755833A CN 108889649 A CN108889649 A CN 108889649A
Authority
CN
China
Prior art keywords
brush
mentioned
support frame
fixed
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810755833.7A
Other languages
Chinese (zh)
Inventor
王梓轩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rugao Huijin Electronic Technology Co Ltd
Original Assignee
Rugao Huijin Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rugao Huijin Electronic Technology Co Ltd filed Critical Rugao Huijin Electronic Technology Co Ltd
Priority to CN201810755833.7A priority Critical patent/CN108889649A/en
Publication of CN108889649A publication Critical patent/CN108889649A/en
Withdrawn legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04Cleaning by suction, with or without auxiliary action

Landscapes

  • Cleaning In General (AREA)

Abstract

The invention discloses a kind of mobile brushs of semiconductor plastic package die comprising bracket, electric motor, sprocket wheel, chain etc., it is characterised in that:Moving track is fixedly connected on the support frame, stabiliser bar is fixed on the centre of support frame, sprocket wheel is fixed on the top of support frame, electric motor is coaxially fixedly mounted on the top of support frame, chain is connected with sprocket wheel, wheel is fixedly mounted on the bottom on chassis by wheel shaft, one end of hose is connected with the air outlet of centrifugal blower, the other end of hose and the mounting hole of vacuum chamber are tightly connected, filter screen is mounted on the mounting hole of vacuum chamber, one end of rotary shaft is connected with the output shaft of brush motor, the other end of rotary shaft is connected with side brush, the two-sided brush being equipped with of the present invention upper and lower mould to mold while can clear up, after the completion of cleaning, brush moves in parallel outside mold, will not because of mold size and influence the work of brush, reduce the generation of interference, framework of the present invention is simple, it is easy to operate.

Description

A kind of mobile brush of semiconductor plastic package die
Technical field
The present invention relates to semiconductor plastic package die fields, more particularly, to a kind of mobile brush of semiconductor plastic package die.
Background technique
Semiconductor packaging mold developing direction is realized and is closely filled to the encapsulating mould of higher precision, higher speed, tree Rouge utilization rate is high, and packaging technology is stablized, and product package quality is good, it be suitable for the multiple rows of, fine piths such as SSOP, TSSOP, LQFP, The micro semiconductors device products such as high density integrated circuit and SOT, SOD encapsulate, and multiple plastic packaging working cells are arranged in system, Diaphragm capsule formula MGP mould is installed, multiple units are packaged by establishment sequence, every to complete once in encapsulation process in each unit Encapsulating mould it is upper and lower between can all have the impurity such as remaining glue, if not in time clear up if can it is cumulative, next time Encapsulation is influenced when encapsulation.
Summary of the invention
It is an object of the invention to provide a kind of framework is simple, it is removable do not interfere cleaning and dust suction can be carried out to mold upper and lower mould The mobile brush of semiconductor plastic package die.
In order to solve the above technical problems, the technical scheme is that:A kind of mobile brush of semiconductor plastic package die, packet Include bracket, electric motor, sprocket wheel, chain, mobile device, hose, centrifugal blower, brush and controller, it is characterised in that:It is above-mentioned Bracket includes moving track, stabiliser bar, fixation hole, fixed feet and support frame, and above-mentioned moving track is fixedly connected on above-mentioned support On frame, the stabilizing rod is fixed on the centre of above-mentioned support frame, and above-mentioned fixed feet is fixed on the bottom of above-mentioned support frame, above-mentioned solid Foot is determined equipped with above-mentioned fixation hole, and above-mentioned sprocket wheel is fixed on the top of above-mentioned support frame, and above-mentioned electric motor is coaxially fixedly mounted At the top of above-mentioned support frame, above-mentioned chain is connected with above-mentioned sprocket wheel, and above-mentioned mobile device includes chassis, wheel shaft and wheel, Above-mentioned wheel is fixedly mounted on the bottom on above-mentioned chassis by above-mentioned wheel shaft, and above-mentioned wheel and above-mentioned moving track connect, One end of above-mentioned chain is fixed on the front end on above-mentioned chassis, and the other end of above-mentioned chain is fixed on behind above-mentioned chassis, above-mentioned Brush includes side brush, vacuum chamber, upper cover body, lower cover, filter screen, rotary shaft and brush motor, and above-mentioned vacuum chamber is equipped with peace Fill hole, be equipped with air inlet and through-hole in above-mentioned upper cover body and above-mentioned lower cover, above-mentioned hose by above-mentioned upper cover body and it is above-mentioned under The air inlet that lid is equipped with is connected with through-hole, and above-mentioned vacuum chamber is placed between above-mentioned upper cover body and above-mentioned lower cover, above-mentioned One end of hose is connected with the air outlet of above-mentioned centrifugal blower, and the other end of above-mentioned hose and the mounting hole of above-mentioned vacuum chamber are close Envelope connection, above-mentioned filter screen are mounted on the mounting hole of above-mentioned vacuum chamber, and above-mentioned upper cover body is equipped with above-mentioned with above-mentioned lower cover Side brush, one end of above-mentioned rotary shaft are connected with the output shaft of above-mentioned brush motor, the other end of above-mentioned rotary shaft and above-mentioned side Brush is connected.
In a kind of mobile brush of above-mentioned semiconductor plastic package die, the junction of above-mentioned upper cover body and above-mentioned vacuum chamber Removable, the junction of above-mentioned lower cover and above-mentioned vacuum chamber is also removable.
In a kind of mobile brush of above-mentioned semiconductor plastic package die, above-mentioned brush is the length that long 100cm wide is 40cm Rectangular, the corner of above-mentioned brush is equipped with rounding.
In a kind of mobile brush of above-mentioned semiconductor plastic package die, the stabilizing rod and above-mentioned support rod form one The angle of triangle, the stabilizing rod and above-mentioned support rod is 60 °.
In a kind of mobile brush of above-mentioned semiconductor plastic package die, above-mentioned brush motor, electric motor and centrifugation wind Machine is connect with above controller electric signal.
Beneficial effects of the present invention:The two-sided brush being equipped with of the present invention upper and lower mould to mold while can clear up, after the completion of cleaning, Brush moves in parallel outside mold, will not because of mold size and influence the work of brush, reduce the generation of interference, this hair Bright framework is simple, easy to operate, can clear up upper and lower mould after mold die sinking, reduce the labor intensity of worker, improve Working efficiency reduces the generation of personal injury, is moved to outside mold after the completion of cleaning, does not influence the normal work of mold.
Detailed description of the invention
Fig. 1 is a kind of main view of the mobile brush of semiconductor plastic package die of the present invention.
Fig. 2 is a kind of left view of the mobile brush of semiconductor plastic package die of the present invention.
Figure label:1, bracket 2, electric motor 3, sprocket wheel 4, chain 5, mobile device 6, hose 7, centrifugal blower 8, brush 9, controller 10, moving track 11, stabiliser bar 12, fixation hole 13, fixed link 14, support frame 15, chassis 16, wheel shaft 17, wheel 18,19, vacuum chamber 20, upper cover body 21, lower cover 22, filter screen 23, rotary shaft 24, brush motor are brushed in side.
Specific embodiment
With reference to the accompanying drawings of the specification, the present invention is described in more detail.
A kind of mobile brush of semiconductor plastic package die as shown in Figure 1, including bracket 1, electric motor 2, sprocket wheel 3, chain Item 4, mobile device 5, hose 6, centrifugal blower 7, brush 8 and controller 9, it is characterised in that:Above-mentioned bracket 1 includes moving track 10, stabiliser bar 11, fixation hole 12, fixed feet 13 and support frame 14, above-mentioned moving track 10 are fixedly connected on above-mentioned support frame 14 On, the stabilizing rod 11 is fixed on the centre of above-mentioned support frame 14, and above-mentioned fixed feet 13 is fixed on the bottom of above-mentioned support frame 14, Above-mentioned fixed feet 13 is equipped with above-mentioned fixation hole 12, and above-mentioned sprocket wheel 3 is fixed on the top of above-mentioned support frame 14, above-mentioned electric motor 2 are coaxially fixedly mounted on the top of above-mentioned support frame 14, and above-mentioned chain 4 is connected with above-mentioned sprocket wheel 3, and above-mentioned mobile device 5 is wrapped Chassis 15, wheel shaft 16 and wheel 17 are included, above-mentioned wheel 17 is fixedly mounted on the bottom on above-mentioned chassis 15 by above-mentioned wheel shaft 16, on It states wheel 17 and above-mentioned moving track 10 connects, one end of above-mentioned chain 4 is fixed on the front end on above-mentioned chassis 15, above-mentioned chain The other end of item 4 is fixed on behind above-mentioned chassis 15, and above-mentioned brush 8 includes that 18, vacuum chamber 19, upper cover body 20, lower cover are brushed in side Body 21, filter screen 22, rotary shaft 23 and brush motor 24, above-mentioned vacuum chamber 19 are equipped with mounting hole, above-mentioned upper cover body 20 and upper It states and is equipped with air inlet and through-hole on lower cover 21, above-mentioned upper cover body 20 and above-mentioned lower cover 21 are equipped with by above-mentioned hose 6 Air inlet is connected with through-hole, and above-mentioned vacuum chamber 19 is placed between above-mentioned upper cover body 20 and above-mentioned lower cover 21, above-mentioned hose 6 One end is connected with the air outlet of above-mentioned centrifugal blower 7, and the mounting hole of the other end of above-mentioned hose 6 and above-mentioned vacuum chamber 19 seals Connection, above-mentioned filter screen 23 are mounted on the mounting hole of above-mentioned vacuum chamber 19, and above-mentioned upper cover body 20 is all provided with above-mentioned lower cover 21 There is above-mentioned side brush 18, one end of above-mentioned rotary shaft 23 is connected with the output shaft of above-mentioned brush motor 24, above-mentioned rotary shaft 23 The other end is connected with above-mentioned side brush 18.
In the present invention, after mold die sinking, controller starts electric motor, and brush is moved to by motor band movable sprocket rotation Designated position starts brush motor and centrifugal blower, and the impurity in mold is cleared mold by side brush, and centrifugal blower generates huge Wind-force drives impurity to enter vacuum chamber by hose, completes electric motor after cleaning and brush is parallel to mold movement again, directly To molds are all removed, waiting is opened next time, and the two-sided brush being equipped with of the present invention upper and lower mould to mold while can clear up, clearly After the completion of reason, brush is moved in parallel outside mold, will not because of mold size and influence the work of brush, reduce interference Occurring, framework of the present invention is simple, and it is easy to operate, upper and lower mould can be cleared up after mold die sinking, reduce the labour of worker Intensity improves work efficiency, and reduces the generation of personal injury, is moved to outside mold after the completion of cleaning, does not influence mold It works normally, It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, above-described embodiment and explanation It is merely illustrated the principles of the invention described in book, without departing from the spirit and scope of the present invention, the present invention also has Various changes and modifications, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention It is defined by the appending claims and its equivalent thereof.

Claims (5)

1. a kind of mobile brush of semiconductor plastic package die, including bracket(1), electric motor(2), sprocket wheel(3), chain(4), move Dynamic device(5), hose(6), centrifugal blower(7), brush(8)And controller(9), it is characterised in that:The bracket(1)Including moving Dynamic rail road(10), stabiliser bar(11), fixation hole(12), fixed feet(13)And support frame(14), the moving track(10)It is fixed It is connected to support frame as described above(14)On, the stabiliser bar(11)It is fixed on support frame as described above(14)Centre, the fixed feet (13)It is fixed on support frame as described above(14)Bottom, the fixed feet(13)It is equipped with the fixation hole(12), the sprocket wheel(3) It is fixed on support frame as described above(14)Top, the electric motor(2)Coaxially it is fixedly mounted on support frame as described above(14)Top, The chain(4)With the sprocket wheel(3)It is connected, the mobile device(5)Including chassis(15), wheel shaft(16)And wheel (17), the wheel(17)Pass through the wheel shaft(16)It is fixedly mounted on the chassis(15)Bottom, the wheel(17)With The moving track(10)It connects, the chain(4)One end be fixed on the chassis(15)Front end, the chain (4)The other end be fixed on the chassis(15)Behind, the brush(8)It is brushed including side(18), vacuum chamber(19), upper cover body (20), lower cover(21), filter screen(22), rotary shaft(23)With brush motor(24), the vacuum chamber(19)It is equipped with installation Hole, the upper cover body(20)With the lower cover(21)On be equipped with air inlet and through-hole, the hose(6)By the upper cover body (20)With the lower cover(21)The air inlet being equipped with is connected with through-hole, the vacuum chamber(19)It is placed in the upper cover body (20)With the lower cover(21)Between, the hose(6)One end and the centrifugal blower(7)Air outlet be connected, institute State hose(6)The other end and the vacuum chamber(19)Mounting hole be tightly connected, the filter screen(23)It is mounted on the suction Dirt chamber(19)Mounting hole on, the upper cover body(20)With the lower cover(21)It is equipped with the side brush(18), the rotation Axis(23)One end and the brush motor(24)Output shaft be connected, the rotary shaft(23)The other end and the side brush (18)It is connected.
2. one kind according to claim 1, it is characterised in that:The upper cover body(20)With the vacuum chamber(19)Connection Place is removable connection, the lower cover(21)With the vacuum chamber(19)Junction be also removable connection.
3. one kind according to claim 1, it is characterised in that:The brush(8)It is the rectangular of 40cm for long 100cm wide Shape, the brush(8)Corner be equipped with rounding.
4. one kind according to claim 1, it is characterised in that:The stabiliser bar(11)With support frame as described above(14)Form one A triangle, the stabiliser bar(11)With support frame as described above(14)Angle be 60 °.
5. one kind according to claim 1, it is characterised in that:The brush motor(24), electric motor(2)With centrifugation wind Machine(7)With the controller(9)Electric signal connection.
CN201810755833.7A 2018-07-11 2018-07-11 A kind of mobile brush of semiconductor plastic package die Withdrawn CN108889649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810755833.7A CN108889649A (en) 2018-07-11 2018-07-11 A kind of mobile brush of semiconductor plastic package die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810755833.7A CN108889649A (en) 2018-07-11 2018-07-11 A kind of mobile brush of semiconductor plastic package die

Publications (1)

Publication Number Publication Date
CN108889649A true CN108889649A (en) 2018-11-27

Family

ID=64348564

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810755833.7A Withdrawn CN108889649A (en) 2018-07-11 2018-07-11 A kind of mobile brush of semiconductor plastic package die

Country Status (1)

Country Link
CN (1) CN108889649A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111055408A (en) * 2019-11-28 2020-04-24 铜陵富仕三佳机器有限公司 Plastic packaging press with automatic die brushing manipulator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111055408A (en) * 2019-11-28 2020-04-24 铜陵富仕三佳机器有限公司 Plastic packaging press with automatic die brushing manipulator

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Application publication date: 20181127