CN108889665A - A kind of clearing apparatus of semiconductor plastic package die - Google Patents
A kind of clearing apparatus of semiconductor plastic package die Download PDFInfo
- Publication number
- CN108889665A CN108889665A CN201810756120.2A CN201810756120A CN108889665A CN 108889665 A CN108889665 A CN 108889665A CN 201810756120 A CN201810756120 A CN 201810756120A CN 108889665 A CN108889665 A CN 108889665A
- Authority
- CN
- China
- Prior art keywords
- shell
- gear
- mentioned
- brush
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 15
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 208000027418 Wounds and injury Diseases 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 3
- 208000014674 injury Diseases 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 244000309464 bull Species 0.000 description 1
- 239000007963 capsule composition Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Nozzles For Electric Vacuum Cleaners (AREA)
Abstract
The invention discloses a kind of clearing apparatus of semiconductor plastic package die comprising rotating mechanism, cleaning agency, electric motor, connecting rod, retarder and controller, it is characterised in that：Rotating shaft is connected with retarder, shell includes roll-shell and fixed shell, fixed shell is fixedly connected with fixed feet, pinion gear is fixedly connected with rotating shaft, gear wheel and pinion gear external toothing, inside engaged gear is engaged with gear wheel, inside engaged gear is connected with roll-shell, vacuum chamber is placed between upper cover body and lower cover, vacuum chamber is connected by hose with vacuum cleaner, one end of rotary shaft is connected with brush motor, the other end of rotary shaft is connected with disc brush, the output end of electric motor is connected with retarder, the present invention can be automatically simultaneously to upper after mold die sinking, lower die is cleared up, greatly reduce the labor intensity of worker, it improves work efficiency, reduce the generation of personal injury.
Description
Technical field
The present invention relates to semiconductor packaging mold technologies, more particularly, to a kind of clearing apparatus of semiconductor plastic package die.
Background technique
Semiconductor packaging mold developing direction is realized and is closely filled to the encapsulating mould of higher precision, higher speed, tree
Rouge utilization rate is high, and packaging technology is stablized, and product package quality is good, it be suitable for the multiple rows of, fine piths such as SSOP, TSSOP, LQFP,
The micro semiconductors device products such as high density integrated circuit and SOT, SOD encapsulate, and multiple plastic packaging working cells are arranged in system,
Diaphragm capsule formula MGP mould is installed, multiple units are packaged by establishment sequence, every to complete once in encapsulation process in each unit
Encapsulating mould it is upper and lower between can all have the impurity such as remaining glue, if not in time clear up if can it is cumulative, next time
Encapsulation is influenced when encapsulation.
Summary of the invention
It is an object of the invention to provide after a kind of die sinking of mold, the Semi-conductor plastic capsulation mould of cleaning and dust suction can be carried out to mold upper and lower mould
The clearing apparatus of tool.
In order to solve the above technical problems, the technical scheme is that：A kind of clearing apparatus of semiconductor plastic package die, packet
Include rotating mechanism, cleaning agency, electric motor, connecting rod, retarder and controller, it is characterised in that：Above-mentioned rotating mechanism packet
Rotating shaft, fixed frame, fixing piece, shell and gear set are included, above-mentioned rotating shaft is connected with above-mentioned retarder, and above-mentioned shell includes
Roll-shell and fixed shell, above-mentioned fixed shell are fixedly connected with above-mentioned fixed frame, and said gear group includes gear wheel, small tooth
Wheel and inside engaged gear, above-mentioned pinion gear are fixedly connected with above-mentioned rotating shaft, above-mentioned gear wheel and above-mentioned pinion gear external toothing, on
Inside engaged gear and above-mentioned gear wheel internal messing are stated, above-mentioned inside engaged gear is connected with above-mentioned roll-shell, above-mentioned fixed frame
It is equipped with mounting hole, above-mentioned cleaning agency includes brush, vacuum chamber, upper cover body, lower cover, upper driving device and lower driving dress
It sets, above-mentioned upper driving device is connected with above-mentioned upper cover body, and above-mentioned lower driving device is connected with above-mentioned lower cover, above-mentioned dust suction
Chamber is placed between above-mentioned upper cover body and above-mentioned lower cover, and above-mentioned vacuum chamber is connected by above-mentioned hose with above-mentioned vacuum cleaner, on
It states upper cover body and above-mentioned lower cover is equipped with above-mentioned brush, above-mentioned brush includes disc brush, rotary shaft and brush motor, above-mentioned rotation
One end of shaft is connected with above-mentioned brush motor, and the other end of above-mentioned rotary shaft is connected with above-mentioned disc brush, above-mentioned cleaning
Mechanism is fixedly connected by above-mentioned connecting rod with above-mentioned roll-shell, and the output end of above-mentioned electric motor is connected with above-mentioned retarder
It connects.
In a kind of clearing apparatus of above-mentioned semiconductor plastic package die, above-mentioned connecting rod is hollow square steel, and described
90 ° of shell vertical fixed.
In a kind of clearing apparatus of above-mentioned semiconductor plastic package die, the diameter of above-mentioned inside engaged gear is 10cm, on
The diameter for stating gear wheel is 8cm, and the diameter of above-mentioned pinion gear is 6cm.
In a kind of clearing apparatus of above-mentioned semiconductor plastic package die, above-mentioned upper cover body is equipped with and above-mentioned vacuum chamber
The upper through-hole communicated, above-mentioned lower cover are equipped with the lower through-hole communicated with above-mentioned vacuum chamber.
In a kind of clearing apparatus of above-mentioned semiconductor plastic package die, above-mentioned electric motor and above-mentioned brush motor with
The connection of controller electric signal.
Compared with the prior art, the advantages of the present invention are as follows：The configuration of the present invention is simple, easy to operate, cleaning ability is strong, the device
The glue for being scattered in corner and impurity can be scanned out and be sucked vacuum chamber by air suction opening by the disc brush being equipped with, the present invention
Upper and lower mould can be cleared up simultaneously automatically after mold die sinking, the labor intensity of worker is greatly reduced, improve work
Efficiency reduces the generation of personal injury.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the clearing apparatus of semiconductor plastic package die of the present invention.
Fig. 2 is a kind of gear set schematic diagram of the clearing apparatus of semiconductor plastic package die of the present invention.
Figure label：1, rotating mechanism 2, cleaning agency 3, electric motor 4, connecting rod 5, retarder 6, controller 7, revolution
Axis 8, fixed frame 9, fixing piece 10, shell 11, gear set 12, roll-shell 13, fixed shell 14, gear wheel 15, pinion gear 16,
Inside engaged gear 17, brush 18, vacuum chamber 19, upper cover body 20, lower cover 21, upper driving device 22, lower driving device 23, disk
Brush 24, rotary shaft 25, brush motor 26, hose 27, vacuum cleaner.
Specific embodiment
With reference to the accompanying drawings of the specification, the present invention is described in more detail.
A kind of clearing apparatus of semiconductor plastic package die as shown in Figure 1, 2, including rotating mechanism 1, cleaning agency 2, electricity
Dynamic motor 3, connecting rod 4, retarder 5 and controller 6, it is characterised in that：Above-mentioned rotating mechanism 1 include rotating shaft 7, fixed frame 8,
Fixing piece 9, shell 10 and gear set 11, above-mentioned rotating shaft 7 are connected with above-mentioned retarder 5, and above-mentioned shell 10 includes rotation shell
Body 12 and fixed shell 13, above-mentioned fixed shell 13 are fixedly connected with above-mentioned fixed feet 8, and said gear group 11 includes gear wheel
14, pinion gear 15 and inside engaged gear 16, above-mentioned pinion gear 15 are fixedly connected with above-mentioned rotating shaft 7, above-mentioned gear wheel 14 with it is upper
State 15 external toothing of pinion gear, above-mentioned inside engaged gear 16 and above-mentioned 14 internal messing of gear wheel, above-mentioned inside engaged gear 16 with it is above-mentioned
Roll-shell 12 is connected, above-mentioned fixed frame 8 be equipped with mounting hole, above-mentioned cleaning agency 2 include brush 17, vacuum chamber 18, on
Lid 19, lower cover 20, upper driving device 21 and lower driving device 22, above-mentioned upper driving device 21 are connected with above-mentioned upper cover body 19
Connect, above-mentioned lower driving device 22 is connected with above-mentioned lower cover 20, above-mentioned vacuum chamber 18 be placed in above-mentioned upper cover body 19 with it is above-mentioned under
Between lid 20, above-mentioned vacuum chamber 18 is connected by above-mentioned hose 26 with above-mentioned vacuum cleaner 27, above-mentioned upper cover body 19 with it is above-mentioned
Lower cover 20 is equipped with above-mentioned brush 17, and above-mentioned brush 17 includes disc brush 23, rotary shaft 24 and brush motor 25, above-mentioned rotation
One end of axis 24 is connected with above-mentioned brush motor 25, and the other end of above-mentioned rotary shaft 24 is connected with above-mentioned disc brush 23, on
State cleaning agency 2 and be fixedly connected by above-mentioned connecting rod 4 with above-mentioned roll-shell 12, the output end of above-mentioned electric motor 3 with it is upper
Retarder 5 is stated to be connected.
In the present invention, electric motor drives rotating shaft rotation, and pinion rotation, pinion gear are driven after retarder slows down
The bull gear drive being engaged with is driven, slows down improve the stability of rotation of device again, gear wheel drives internal messing therewith
Inside engaged gear rotation, inside engaged gear and roll-shell be keyed, and the rotation of inside engaged gear has driven roll-shell
Rotation, rotates to the angle vertical with plastic package die for the device and stops rotating, brush motor and vacuum cleaner starting, brush motor
Disc brush is driven to be cleaned, glue and impurity are drawn onto vacuum chamber by air suction opening by vacuum cleaner, are completed after cleaning, which turns again
Position originally parallel with mold is gone back to, the configuration of the present invention is simple is easy to operate, and cleaning ability is strong, the disk which is equipped with
Brush, which can scan out the glue for being scattered in corner and impurity, is sucked vacuum chamber by air suction opening, and the present invention is after mold die sinking
Automatically upper and lower mould can be cleared up simultaneously, greatly reduces the labor intensity of worker, improve work efficiency, reduces
The generation of personal injury.It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, above-described embodiment
It is merely illustrated the principles of the invention with described in specification, without departing from the spirit and scope of the present invention, the present invention
It will also have various changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The present invention claims guarantors
Shield range is defined by the appending claims and its equivalent thereof.
Claims (5)
1. a kind of clearing apparatus of semiconductor plastic package die, including rotating mechanism（1）, cleaning agency（2）, electric motor（3）, even
Extension bar（4）, retarder（5）And controller（6）, it is characterised in that：The rotating mechanism（1）Including rotating shaft（7）, fixed frame
（8）, fixing piece（9）, shell（10）And gear set（11）, the rotating shaft（7）With the retarder（5）It is connected, the shell
Body（10）Including roll-shell（12）With fixed shell（13）, the fixed shell（13）With the fixed frame（8）It is fixedly connected,
The gear set（11）Including gear wheel（14）, pinion gear（15）And inside engaged gear（16）, the pinion gear（15）With it is described
Rotating shaft（7）It is fixedly connected, the gear wheel（14）With the pinion gear（15）External toothing, the inside engaged gear（16）With institute
State gear wheel（14）Internal messing, the inside engaged gear（16）With the roll-shell（12）It is connected, the fixed frame（8）On
Equipped with mounting hole, the cleaning agency（2）Including brush（17）, vacuum chamber（18）, upper cover body（19）, lower cover（20）, hose
（26）, vacuum cleaner（27）, upper driving device（21）With lower driving device（22）, the upper driving device（21）With the upper cover body
（19）It is connected, the lower driving device（22）With the lower cover（20）It is connected, the vacuum chamber（18）It is placed on described
Lid（19）With the lower cover（20）Between, the vacuum chamber（18）Pass through the hose（26）With the vacuum cleaner（27）Phase
Connection, the upper cover body（19）With the lower cover（20）It is equipped with the brush（17）, the brush（17）Including disc brush
（23）, rotary shaft（24）With brush motor（25）, the rotary shaft（24）One end and the brush motor（25）It is connected, institute
State rotary shaft（24）The other end and the disc brush（23）It is connected, the cleaning agency（2）Pass through the connecting rod（4）With
The roll-shell（12）It is fixedly connected, the electric motor（3）Output end and the retarder（5）It is connected.
2. one kind according to claim 1, it is characterised in that：The connecting rod（4）For square steel, with the shell（10）
90 ° vertical fixed.
3. one kind according to claim 1, it is characterised in that：The inside engaged gear（16）Diameter be 10cm, it is described
Gear wheel（14）Diameter be 8cm, the pinion gear（15）Diameter be 6cm.
4. one kind according to claim 1, it is characterised in that：The upper cover body（19）It is equipped with and the vacuum chamber（18）
The upper air suction opening communicated, the lower cover（20）It is equipped with and the vacuum chamber（18）The lower air suction opening communicated.
5. one kind according to claim 1, it is characterised in that：The electric motor（3）With the brush motor（25）?
With controller（6）Electric signal connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810756120.2A CN108889665A (en) | 2018-07-11 | 2018-07-11 | A kind of clearing apparatus of semiconductor plastic package die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810756120.2A CN108889665A (en) | 2018-07-11 | 2018-07-11 | A kind of clearing apparatus of semiconductor plastic package die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108889665A true CN108889665A (en) | 2018-11-27 |
Family
ID=64348552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810756120.2A Withdrawn CN108889665A (en) | 2018-07-11 | 2018-07-11 | A kind of clearing apparatus of semiconductor plastic package die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108889665A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111055408A (en) * | 2019-11-28 | 2020-04-24 | 铜陵富仕三佳机器有限公司 | Plastic packaging press with automatic die brushing manipulator |
-
2018
- 2018-07-11 CN CN201810756120.2A patent/CN108889665A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111055408A (en) * | 2019-11-28 | 2020-04-24 | 铜陵富仕三佳机器有限公司 | Plastic packaging press with automatic die brushing manipulator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181127 |