CN108882515A - The processing method and mobile terminal of a kind of signal transmission device part, signal transmission device part - Google Patents
The processing method and mobile terminal of a kind of signal transmission device part, signal transmission device part Download PDFInfo
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- CN108882515A CN108882515A CN201811110506.2A CN201811110506A CN108882515A CN 108882515 A CN108882515 A CN 108882515A CN 201811110506 A CN201811110506 A CN 201811110506A CN 108882515 A CN108882515 A CN 108882515A
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- dielectric layer
- conductive layer
- transmission device
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- device part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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Abstract
The embodiment of the invention provides a kind of processing method of signal transmission device part, signal transmission device part and mobile terminals.The signal transmission device part specifically includes：First conductive layer and dielectric layer；Wherein, the first surface of first conductive layer is connect with the dielectric layer；The material of the dielectric layer is the dielectric layer substrate containing hollow beads.In the embodiment of the present invention, in the case where the signal transmission device part is used for transmission high-frequency signal, so that it may which the transmission loss for reducing the high-frequency signal improves the integrality of the high-frequency signal.Moreover, the dielectric layer can realize reliable support to first conductive layer, the integral strength of the signal transmission device part is improved.
Description
Technical field
The present invention relates to fields of communication technology, more particularly to the processing of a kind of signal transmission device part, signal transmission device part
Method and mobile terminal.
Background technique
With the rapid development of communication technology, in the mobile terminals such as mobile phone, palm PC, more and more signals need
It is transmitted under high frequency environment.In existing technology, high-frequency signal is often transmitted using signal transmission device part.
In existing mobile terminal, often there is high frequency letter when carrying out the transmission of high-frequency signal in signal transmission device part
Number transmission loss it is larger, the temperature of signal transmission device part rises obvious problem.In practical applications, in order to reduce high frequency
The transmission loss of signal in existing signal transmission device part, for the dielectric layer connecting with conductive layer, often selects low dielectric
The material of constant and low-loss tangent angle is processed into above-mentioned dielectric layer.For example, using liquid crystal polymer (Liquid Crystal
Polymer, LCP) substrate is processed into film, using as the dielectric layer in signal transmission device part.
However, during being processed into film using LCP substrate, the difficulty that not only forms a film is big, cost costly, and
And since the mechanical performance of LCP film is poor, dielectric layer is often also resulted in for the conduction in signal transmission device part
The poor problem of the support of layer.
Summary of the invention
In view of this, in order to solve in existing mobile terminal, signal transmission device part is in order to reduce the transmission of high-frequency signal
Loss, dielectric layer have that mechanical performance is poor, poor, this hair of support for the conductive layer in signal transmission device part
Bright embodiment provides a kind of signal transmission device part, a kind of processing method of signal transmission device part and a kind of mobile terminal.
In a first aspect, the embodiment of the invention discloses a kind of signal transmission device parts, including：First conductive layer and medium
Layer；Wherein
The first surface of first conductive layer is connect with the dielectric layer；
The material of the dielectric layer is the dielectric layer substrate containing hollow beads.
Second aspect, the embodiment of the invention also discloses a kind of processing methods of signal transmission device part, including：
Hollow beads are dispersed in dielectric layer substrate, the dielectric layer substrate containing hollow beads is formed；
Dielectric layer is formed on the first surface of the first conductive layer, obtains signal transmission device part；Wherein, the dielectric layer by
The dielectric layer substrate containing hollow beads is made.
The third aspect, the embodiment of the invention also discloses a kind of mobile terminals, including：Above-mentioned signal transmission device part.
The embodiment of the present invention includes following advantages：
In the embodiment of the present invention, the dielectric layer of the signal transmission device part is by the dielectric layer substrate system containing hollow beads
At, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer, in this way,
In the case that the signal transmission device part is used for transmission high-frequency signal, so that it may which the transmission loss for reducing the high-frequency signal mentions
The integrality of the high high-frequency signal.
Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of signal transmission device part of the invention；
Fig. 2 is a kind of structural schematic diagram of hollow beads of the invention；
Fig. 3 is a kind of one of the step flow chart of processing method embodiment of signal transmission device part of the invention；
Fig. 4 is the two of the step flow chart of the processing method embodiment of a kind of signal transmission device part of the invention；
Fig. 5 is the three of the step flow chart of the processing method embodiment of a kind of signal transmission device part of the invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
The embodiment of the invention provides a kind of signal transmission device parts, can specifically include：First conductive layer and dielectric layer；
Wherein, the first surface of first conductive layer is connect with the dielectric layer；The material of the dielectric layer is to contain hollow beads
Dielectric layer substrate.In the embodiment of the present invention, the dielectric layer of the signal transmission device part is by the medium containing hollow beads
Layer substrate is made, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer,
In this way, in the case where the signal transmission device part is used for transmission high-frequency signal, so that it may reduce the transmission of the high-frequency signal
Loss, improves the integrality of the high-frequency signal.Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads,
The mechanical performance of the dielectric layer is improved, in this way, the dielectric layer can be made to realize reliable branch to first conductive layer
Support, improves the integral strength of the signal transmission device part.
Referring to Fig.1, a kind of structural schematic diagram of signal transmission device part of the invention is shown, can specifically include：First
Conductive layer 10 and dielectric layer 11；Wherein, the first surface of the first conductive layer 10 is connect with dielectric layer 11；The material of the dielectric layer
Matter is the dielectric layer substrate containing hollow beads.In the embodiment of the present invention, high frequency letter is used for transmission in the signal transmission device part
In the case where number, so that it may which the transmission loss for reducing the high-frequency signal improves the integrality of the high-frequency signal.Moreover, being situated between
Matter layer 11 can realize reliable support to the first conductive layer 10, improve the integral strength of the signal transmission device part.
In practical applications, the signal transmission device part can be signal transmssion line or circuit board etc., and the present invention is implemented
Example for the signal transmission device part concrete type without limitation.Similarly, the circuit board can for flexible circuit board or
Printed circuit board, the embodiment of the present invention for the circuit board concrete type without limitation.
In the embodiment of the present invention, signal wire 101 and reference ground 102 can be set on the first conductive layer 10, in reality
In, conductor layer No.1 10 can be process using copper foil, and specifically, processing forms signal wire on the copper foil
101 and reference ground 102.
A signal wire 101 and two ginsengs are provided on the first conductive layer 10 it is understood that illustrating only in Fig. 1
The case where examining ground wire 102, and in practical applications, the quantity of signal wire 101, reference ground 102 on the first conductive layer 10 is also
It can be other values.For example, the quantity of signal wire 101 can be 2, the quantity of reference ground 102 can be 3；Alternatively,
The quantity of signal wire 101 can be 3, and the quantity of reference ground 102 can be 4 etc..The embodiment of the present invention is led for first
The particular number of signal wire 101, reference ground 102 in electric layer 10 can be without limitation.
In the embodiment of the present invention, the first surface of the first conductive layer 10 is connect with dielectric layer 11, in practical applications, medium
Layer 11 can be used for supporting the first conductive layer 10, and realize the signal wire 101 on the first conductive layer 10 and between reference ground 102
Insulation connection, avoid interfering with each other between signal wire 101 and reference ground 102.
In the embodiment of the present invention, the material of dielectric layer 11 can be the dielectric layer substrate containing hollow beads.Specifically, institute
Stating the dielectric layer substrate containing hollow beads can be formed in such a way that hollow beads 110 are dispersed in dielectric layer substrate.
In specific application, the dielectric layer substrate may include dielectric layer substrate solution and dielectric layer substrate prepolymer.
In specific application, hollow beads 110 can be dispersed in dielectric layer substrate solution or dielectric layer substrate is pre-
In polymers, the dielectric layer substrate solution containing hollow beads or the dielectric layer substrate prepolymer containing hollow beads are formed, so
Afterwards, then by the dielectric layer substrate solution containing hollow beads or dielectric layer substrate prepolymer containing hollow beads it carries out
Solidification, can form dielectric layer 11.
In specifically applying, the dielectric layer substrate can be the dielectric layer substrate of the types such as polyimides, liquid crystal, this
Inventive embodiments for the dielectric layer substrate concrete type without limitation.
Referring to Fig. 2, a kind of structural schematic diagram of hollow beads of the invention, as shown in Figure 2, hollow beads 110 are shown
It may include shell 111 and the hollow structure 112 formed coated by shell 111.In practical applications, hollow micro- in order to improve
The intensity of pearl 110, so that the dielectric layer base can be enhanced in the case where being blended in the dielectric layer substrate for hollow beads 110
The material of the intensity of material, shell 111 can be glass, ceramics or high molecular material etc..
It in the embodiment of the present invention, can be filled by dry gas in hollow structure 112, optionally, the gas can be with
For air or nitrogen etc..In practical applications, due to being filled in hollow structure 112 by dry gas, and gas is with low
The characteristics of dielectric constant and low-loss tangent angle, therefore, hollow beads 110, accordingly have low-k and low-loss tangent angle
The characteristics of.
Optionally, in order to enable hollow beads 110 can be mixed preferably with the dielectric layer substrate, it is shown in Fig. 2 in
The outer diameter of empty microballon 110 can be preferably 0.5-30um.Just for the dielectric constant for further decreasing hollow beads 110 and loss
Corner cut, in hollow beads 110 shown in Fig. 2, the thickness of shell 111 can be the 5-30% of its radius.
In practical applications, since hollow beads 110 have the characteristics that low-k and low-loss tangent angle,
Hollow beads 110 are being dispersed in the case where forming the dielectric layer substrate containing hollow beads in the dielectric layer substrate
Under, the dielectric layer substrate containing hollow beads accordingly has the characteristics that low-k and low-loss tangent angle.The present invention
In embodiment, in the case where the material of dielectric layer 11 is the dielectric layer substrate containing hollow beads, dielectric layer 11 is corresponding
Have the characteristics that low-k and low-loss tangent angle.
In the embodiment of the present invention, since dielectric layer 11 has the characteristics that low-k and low-loss tangent angle,
During signal wire 101 on first conductive layer 10 carries out impedance matching, signal wire 101 is readily available wider line width,
In this manner it is possible to reduce the conductor losses of signal wire 101, the signal transmission capabilities of signal wire 101 are improved.
Moreover, because dielectric layer 11 has the characteristics that low-k and low-loss tangent angle, in the signal transmission device
In the case that part is used for transmission high-frequency signal, so that it may which the transmission loss for reducing the high-frequency signal improves the high-frequency signal
Integrality.
Further, since the intensity of dielectric layer 11 can be enhanced in hollow beads 110, the mechanical performance of dielectric layer 11 is improved, this
Sample can make dielectric layer 11 realize reliable support to the first conductive layer 10, improve the whole strong of the signal transmission device part
Degree.
In an alternative embodiment of the invention, dielectric layer 11 can be thin film dielectric layer, the thin film dielectric layer and
The first surface of first conductive layer 10 presses connection.In practical applications, hollow beads 110 first can be blended in the medium
In layer substrate, the dielectric layer substrate containing hollow beads is formed；Then, the dielectric layer substrate by described containing hollow beads
The thin film dielectric layer is made；Finally, being by the pressing connection of the first surface of the thin film dielectric layer and the first conductive layer 10 again
It can.
In practical applications, in the process that the dielectric layer substrate containing hollow beads is made to the thin film dielectric layer
In, the thin film dielectric layer can be made to obtain preferable intensity using techniques such as stretching, orientations.Moreover, being situated between in the film
In the process of matter layer, the thickness and shape of the thin film dielectric layer, therefore, the thin film dielectrics can be controlled using mold
The machining accuracy of layer is higher.In this way, dielectric layer 11 be thin film dielectric layer in the case where, dielectric layer 11 accordingly have intensity compared with
High, the higher advantage of machining accuracy.
In another alternative embodiment of the invention, dielectric layer 11 can be coated media layer, the coated media layer
It can be by the way that the dielectric layer coated substrate of the hollow beads be formed on the first surface of the first conductive layer 10.Actually answering
In, first hollow beads 110 can be blended in the dielectric layer substrate, form the dielectric layer base containing hollow beads
Material；It then, can shape then by the dielectric layer coated substrate containing hollow beads on the first surface of the first conductive layer 10
At the coated media layer.
In practical applications, the coated media layer can be by by the dielectric layer coated substrate containing hollow beads
It is formed in the first surface of the first conductive layer 10, therefore, the processing technology of the coated media layer is relatively simple, moreover, described
Bond strength between coated media layer and the first surface of the first conductive layer 10 is higher.In this way, being that coating is situated between in dielectric layer 11
In the case where matter layer, the processing technology of dielectric layer 11 is relatively simple, and processing cost is lower, moreover, dielectric layer 11 and the first conduction
Bond strength between the first surface of layer 10 is higher.
Optionally, the signal transmission device part can also include：First cover film 12；Wherein, the first cover film 12 and
The second surface of one conductive layer 10 connects, and the first surface and second surface of the first conductive layer 10 are relative to each other.Specifically, first
The material of cover film 12 can be the materials such as polyimides, can between the first cover film 12 and the second surface of the first conductive layer 10
To realize bonding connection using the bond mediums such as glue, double faced adhesive tape.In practical applications, the first cover film 12 can be used for
The insulation of one conductive layer 10, dust-proof and waterproofing protection.
Optionally, the signal transmission device part can also include：Second conductive layer 13, wherein the of the second conductive layer 13
Three surfaces are connect with the surface on dielectric layer 11 far from the first conductive layer 10.It in practical applications, can be on the second conductive layer 12
It is provided with signal wire and/or reference ground, to improve the ability of the signal transmission device part transmission high-frequency signal.
In the embodiment of the present invention, since the second conductive layer 13 connects with the surface on dielectric layer 11 far from the first conductive layer 10
It connects, that is to say, that between the first conductive layer 10 and the second conductive layer 13, dielectric layer 11 can be not only used for propping up dielectric layer 11
The first conductive layer 10, the second conductive layer 13 are supportted, can also realize that the insulation between the first conductive layer 10 and the second conductive layer 13 connects
It connects, avoids interfering with each other between the first conductive layer 10 and the second conductive layer 13.
Optionally, the signal transmission device part can also include：Second cover film 14；Wherein, the second cover film 14 and
4th surface of two conductive layers 13 connects, and the third surface and the 4th surface of the second conductive layer 14 are relative to each other.Specifically, second
The material of cover film 14 can be the materials such as polyimides, can between the second cover film 14 and the 4th surface of the second conductive layer 13
To realize bonding connection using the bond mediums such as glue, double faced adhesive tape.In practical applications, the second cover film 14 can be used for
The insulation of two conductive layers 13, dust-proof and waterproofing protection.
To sum up, signal transmission device part described in the embodiment of the present invention includes at least following advantages：
In the embodiment of the present invention, since the dielectric layer of the signal transmission device part is by the dielectric layer substrate containing hollow beads
It is made, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer.In this way,
In the case where the signal transmission device part is used for transmission high-frequency signal, so that it may the transmission loss of the high-frequency signal is reduced,
Improve the integrality of the high-frequency signal.
Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
Embodiment two
Referring to Fig. 3, show a kind of processing method embodiment of signal transmission device part of the invention step flow chart it
One, it can specifically include following steps：
Step 301：Hollow beads are dispersed in dielectric layer substrate, the dielectric layer substrate containing hollow beads is formed.
In the embodiment of the present invention, the hollow beads can be dispersed in the dielectric layer substrate, be contained described in formation
The dielectric layer substrate of hollow beads.In specific application, the dielectric layer substrate may include dielectric layer substrate solution or
Dielectric layer substrate prepolymer.
In a particular application, the hollow beads can be dispersed in dielectric layer substrate solution or dielectric layer substrate pre-polymerization
In object, the dielectric layer substrate containing hollow beads is formed.
In practical applications, the dielectric layer substrate can be the dielectric layer substrate of the types such as polyimides, liquid crystal, this hair
Bright embodiment for the dielectric layer substrate concrete type without limitation.
In practical applications, the hollow beads may include shell and coat the hollow knot formed by the shell
Structure.In practical applications, in order to improve the intensity of the hollow beads, so that the hollow beads are being blended in the dielectric layer
The intensity of the dielectric layer substrate can be enhanced in the case where substrate, the material of the shell can be glass, ceramics or height
Molecular material etc..It can be filled by dry gas in the hollow structure, optionally, the gas can be air or nitrogen
Gas etc..In practical applications, due to there is dry gas filling in the hollow structure, and gas has low-k and low
The characteristics of loss tangent angle, therefore, the hollow beads, accordingly have the characteristics that low-k and low-loss tangent angle.
Optionally, described hollow micro- in order to enable the hollow beads can be mixed preferably with the dielectric layer substrate
The outer diameter of pearl can be preferably 0.5-30um.In order to further decrease dielectric constant and the loss tangent angle of the hollow beads,
In the hollow beads, the thickness of the shell can be the 5-30% of its radius.
In practical applications, since the hollow beads have the characteristics that low-k and low-loss tangent angle,
The hollow beads are being dispersed in the case where forming the dielectric layer substrate containing hollow beads in the dielectric layer substrate
Under, the dielectric layer substrate containing hollow beads accordingly has the characteristics that low-k and low-loss tangent angle.
Step 302：Dielectric layer is formed on the first surface of the first conductive layer, obtains signal transmission device part；Wherein, described
Dielectric layer is made of the dielectric layer substrate containing hollow beads.
In the embodiment of the present invention, dielectric layer can be formed on the first surface of the first conductive layer, obtain signal transmission device
Part；Wherein, the dielectric layer is made of the dielectric layer substrate containing hollow beads.Due to Jie containing hollow beads
Matter layer substrate has the characteristics that low-k and low-loss tangent angle, is described containing hollow micro- in the material of the dielectric layer
In the case where the dielectric layer substrate of pearl, the dielectric layer accordingly has the characteristics that low-k and low-loss tangent angle.
In the embodiment of the present invention, signal wire and reference ground can be set on first conductive layer.In practical application
In, the conductor layer No.1 can be process using copper foil, and specifically, processing forms the signal wire on the copper foil
With the reference ground.
In the embodiment of the present invention, since the dielectric layer has the characteristics that low-k and low-loss tangent angle,
During the signal wire on first conductive layer carries out impedance matching, the signal wire is readily available wider line
Width improves the signal transmission capabilities of the signal wire in this manner it is possible to reduce the conductor losses of the signal wire.
Moreover, because the dielectric layer has the characteristics that low-k and low-loss tangent angle, transmitted in the signal
In the case that device is used for transmission high-frequency signal, so that it may which the transmission loss for reducing the high-frequency signal improves the high frequency letter
Number integrality.
Further, since the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
To sum up, the processing method of signal transmission device part described in the embodiment of the present invention includes at least following advantages：
In the embodiment of the present invention, since the dielectric layer of the signal transmission device part is by the dielectric layer substrate containing hollow beads
It is made, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer.In this way,
In the case where the signal transmission device part is used for transmission high-frequency signal, so that it may the transmission loss of the high-frequency signal is reduced,
Improve the integrality of the high-frequency signal.
Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
Embodiment three
Referring to Fig. 4, show a kind of processing method embodiment of signal transmission device part of the invention step flow chart it
Two, it can specifically include following steps：
Step 401：Hollow beads are dispersed in dielectric layer substrate, the dielectric layer substrate containing hollow beads is formed.
Step 402：The first cover film is adhered on the second surface of the first conductive layer using bond medium, including
First conductive layer of cover film；Wherein, the first surface and second surface of first conductive layer are relative to each other.
In the embodiment of the present invention, the material of first cover film can be the materials such as polyimides, first covering
Between film and the second surface of first conductive layer bonding connection can be realized using bond mediums such as glue, double faced adhesive tapes.
In practical applications, first cover film can be used for the insulation of first conductive layer, dust-proof and waterproofing protection.
Step 403：Thin film dielectric layer is made in the dielectric layer substrate containing hollow beads.
In the embodiment of the present invention, the thin film dielectric layer can be made in the dielectric layer substrate containing hollow beads.
It in practical applications, can be with during the thin film dielectric layer is made in the dielectric layer substrate containing hollow beads
The thin film dielectric layer is made to obtain preferable intensity using techniques such as stretching, orientations.Moreover, adding in the thin film dielectric layer
During work, the thickness and shape of the thin film dielectric layer, therefore, the processing of the thin film dielectric layer can be controlled using mold
Precision is higher.In this way, the dielectric layer be thin film dielectric layer in the case where, the dielectric layer accordingly have intensity it is higher, plus
The higher advantage of work precision.
Step 404：The first surface of the dielectric layer and the first conductive layer is pressed, signal transmission device part is obtained.
In the embodiment of the present invention, can using film laminator by the first surface of the dielectric layer and first conductive layer into
Row pressing, obtains the signal transmission device part.
Step 405：The second cover film is adhered on the 4th surface of the second conductive layer using bond medium, including
Second conductive layer of cover film, wherein the third surface and the 4th surface of second conductive layer are relative to each other.
In the embodiment of the present invention, the material of second cover film can be the materials such as polyimides, second covering
Between film and the 4th surface of second conductive layer bonding connection can be realized using bond mediums such as glue, double faced adhesive tapes.
In practical applications, second cover film can be used for the insulation of second conductive layer, dust-proof and waterproofing protection.
Step 406：By surface and second separate with first conductive layer on the dielectric layer of the signal transmission device part
The third surface of conductive layer is pressed.
In the embodiment of the present invention, signal wire and/or reference ground can be set on second conductive layer, to improve
State the ability of signal transmission device part transmission high-frequency signal.
In the embodiment of the present invention, due to the table far from first conductive layer on second conductive layer and the dielectric layer
Face connection, that is to say, that the dielectric layer is between first conductive layer and second conductive layer, and the dielectric layer is not
It can be only used for supporting first conductive layer, second conductive layer, can also realize first conductive layer and described the
Insulation connection between two conductive layers, avoids interfering with each other between first conductive layer and second conductive layer.
To sum up, the processing method of signal transmission device part described in the embodiment of the present invention includes at least following advantages：
In the embodiment of the present invention, since the dielectric layer of the signal transmission device part is by the dielectric layer substrate containing hollow beads
It is made, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer.In this way,
In the case where the signal transmission device part is used for transmission high-frequency signal, so that it may the transmission loss of the high-frequency signal is reduced,
Improve the integrality of the high-frequency signal.
Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
In addition, the thin film dielectrics is being made in the dielectric layer substrate containing hollow beads in the embodiment of the present invention
During layer, the thin film dielectric layer can be made to obtain preferable intensity using techniques such as stretching, orientations.Moreover, institute
It states in the process of thin film dielectric layer, the thickness and shape of the thin film dielectric layer can be controlled using mold, it is therefore, described
The machining accuracy of thin film dielectric layer is higher.In this way, the dielectric layer is corresponding in the case where the dielectric layer is thin film dielectric layer
Have the advantages that intensity is higher, machining accuracy is higher.
Example IV
Referring to Fig. 5, show a kind of processing method embodiment of signal transmission device part of the invention step flow chart it
Three, it can specifically include following steps：
Step 501：Hollow beads are dispersed in dielectric layer substrate, the dielectric layer substrate containing hollow beads is formed.
Step 502：The first cover film is adhered on the second surface of the first conductive layer using bond medium, including
First conductive layer of cover film；Wherein, the first surface and second surface of first conductive layer are relative to each other.
Step 503：By the dielectric layer coated substrate containing hollow beads on the first surface of the first conductive layer, with
Dielectric layer is formed on the first surface, obtains signal transmission device part.
In the embodiment of the present invention, by the dielectric layer coated substrate containing hollow beads the of first conductive layer
On one surface, the coated media layer can be formed.
In practical applications, the coated media layer can be by by the dielectric layer coated substrate containing hollow beads
It is formed in the first surface of first conductive layer, therefore, the processing technology of the coated media layer is relatively simple；Moreover, institute
The bond strength stated between coated media layer and the first surface of first conductive layer is higher.In this way, being in the dielectric layer
In the case where coated media layer, the processing technology of the dielectric layer is relatively simple, and processing cost is lower, moreover, the dielectric layer
Bond strength between the first surface of first conductive layer is higher.
Step 504：The second cover film is adhered on the 4th surface of the second conductive layer using bond medium, including
Second conductive layer of cover film, wherein the third surface and the 4th surface of second conductive layer are relative to each other.
Step 505：By surface and second separate with first conductive layer on the dielectric layer of the signal transmission device part
The third surface of conductive layer is pressed.
To sum up, the processing method of signal transmission device part described in the embodiment of the present invention includes at least following advantages：
In the embodiment of the present invention, since the dielectric layer of the signal transmission device part is by the dielectric layer substrate containing hollow beads
It is made, in practical applications, since hollow beads can reduce dielectric constant and the loss tangent angle of the dielectric layer.In this way,
In the case where the signal transmission device part is used for transmission high-frequency signal, so that it may the transmission loss of the high-frequency signal is reduced,
Improve the integrality of the high-frequency signal.
Moreover, because the intensity of the dielectric layer can be enhanced in the hollow beads, the mechanicalness of the dielectric layer is improved
Can, in this way, the dielectric layer can be made to realize reliable support to first conductive layer, improve the signal transmission device part
Integral strength.
In addition, in the embodiment of the present invention, the dielectric layer can be by by the dielectric layer substrate containing hollow beads
First surface coated in first conductive layer is formed, and therefore, the processing technology of the dielectric layer is relatively simple；Moreover, institute
The bond strength stated between dielectric layer and the first surface of first conductive layer is higher.
It should be noted that for simple description, therefore, it is stated as a series of action groups for embodiment of the method
It closes, but those skilled in the art should understand that, embodiment of that present invention are not limited by the describe sequence of actions, because according to
According to the embodiment of the present invention, some steps may be performed in other sequences or simultaneously.Secondly, those skilled in the art also should
Know, the embodiments described in the specification are all preferred embodiments, and the related movement not necessarily present invention is implemented
Necessary to example.
The embodiment of the invention also provides a kind of mobile terminal, the mobile terminal may include above-mentioned signal transmission device
Part.In the mobile terminal, the signal transmission device part can be realized the densification of electronic circuit, narrow space into
Row reliability and mobility with higher while largely wiring, moreover, when carrying out the transmission of high-frequency signal, signal transmission
Ability is higher, and the loss of the high-frequency signal is smaller, and the integrality of the high-frequency signal is preferable.The mobile terminal can be hand
The mobile terminals such as machine, tablet computer and wearable device, the present invention, which does not do the concrete type of the mobile terminal, to be had
Body limits.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
Although the preferred embodiment of the embodiment of the present invention has been described, once a person skilled in the art knows bases
This creative concept, then additional changes and modifications can be made to these embodiments.So the following claims are intended to be interpreted as
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or terminal device including a series of elements not only wrap
Those elements are included, but also including other elements that are not explicitly listed, or further includes for this process, method, article
Or the element that terminal device is intrinsic.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in process, method, article or the terminal device for including the element.
Above the processing method to a kind of signal transmission device part provided by the present invention, signal transmission device part and it is mobile eventually
End, is described in detail, and used herein a specific example illustrates the principle and implementation of the invention, above
The explanation of embodiment is merely used to help understand method and its core concept of the invention；Meanwhile for the general skill of this field
Art personnel, according to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion this
Description should not be construed as limiting the invention.
Claims (13)
1. a kind of signal transmission device part, which is characterized in that including：First conductive layer and dielectric layer；Wherein
The first surface of first conductive layer is connect with the dielectric layer；
The material of the dielectric layer is the dielectric layer substrate containing hollow beads.
2. signal transmission device part according to claim 1, which is characterized in that the dielectric layer is thin film dielectric layer, described
The pressing connection of the first surface of thin film dielectric layer and first conductive layer.
3. signal transmission device part according to claim 1, which is characterized in that the dielectric layer is coated media layer, described
Coated media layer by by the dielectric layer coated substrate containing hollow beads on the first surface of first conductive layer
It is formed.
4. signal transmission device part according to claim 1, which is characterized in that further include：Second conductive layer, wherein
The third surface of second conductive layer is connect with the surface on the dielectric layer far from first conductive layer.
5. signal transmission device part according to claim 4, which is characterized in that further include：Second cover film, wherein
Second cover film is connect with the 4th surface of second conductive layer, the third surface of second conductive layer and
Four surfaces are relative to each other.
6. signal transmission device part according to claim 1, which is characterized in that further include：First cover film；Wherein
First cover film is connect with the second surface of first conductive layer, the first surface of first conductive layer and
Two surfaces are relative to each other.
7. a kind of processing method of signal transmission device part, which is characterized in that including：
Hollow beads are dispersed in dielectric layer substrate, the dielectric layer substrate containing hollow beads is formed；
Dielectric layer is formed on the first surface of the first conductive layer, obtains signal transmission device part；Wherein, the dielectric layer is by described
Dielectric layer substrate containing hollow beads is made.
8. the method according to the description of claim 7 is characterized in that described form medium on the first surface of the first conductive layer
Layer, obtains signal transmission device part；Wherein, the step of dielectric layer is made of the dielectric layer substrate containing hollow beads packet
It includes：
Thin film dielectric layer is made in the dielectric layer substrate containing hollow beads；
The first surface of the dielectric layer and the first conductive layer is pressed, signal transmission device part is obtained.
9. the method according to the description of claim 7 is characterized in that described form medium on the first surface of the first conductive layer
Layer, obtains signal transmission device part；Wherein, the step of dielectric layer is made of the dielectric layer substrate containing hollow beads packet
It includes：
By the dielectric layer coated substrate containing hollow beads on the first surface of the first conductive layer, in first table
Dielectric layer is formed on face, obtains signal transmission device part.
10. the method according to the description of claim 7 is characterized in that further including：
By the third on surface separate with first conductive layer on the dielectric layer of the signal transmission device part and the second conductive layer
Surface is pressed.
11. according to the method described in claim 10, it is characterized in that, further including：
The second cover film is adhered on the 4th surface of the second conductive layer using bond medium, obtains including the second of cover film
Conductive layer, wherein the third surface and the 4th surface of second conductive layer are relative to each other.
12. the method according to the description of claim 7 is characterized in that further including：
The first cover film is adhered on the second surface of the first conductive layer using bond medium, obtains including the first of cover film
Conductive layer；Wherein, the first surface and second surface of first conductive layer are relative to each other.
13. a kind of mobile terminal, which is characterized in that including：Signal transmission device part as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811110506.2A CN108882515A (en) | 2018-09-21 | 2018-09-21 | The processing method and mobile terminal of a kind of signal transmission device part, signal transmission device part |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811110506.2A CN108882515A (en) | 2018-09-21 | 2018-09-21 | The processing method and mobile terminal of a kind of signal transmission device part, signal transmission device part |
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| US20040124955A1 (en) * | 2002-12-31 | 2004-07-01 | Sung-Mao Wu | High frequency substrate |
| CN1671770A (en) * | 2002-07-25 | 2005-09-21 | 纳幕尔杜邦公司 | Liquid crystalline polymeric compositions |
| CN104206028A (en) * | 2012-03-26 | 2014-12-10 | 住友电工超效能高分子股份有限公司 | Fluorine resin substrate |
| CN107849284A (en) * | 2015-07-29 | 2018-03-27 | 日东电工株式会社 | Fluororesin porous body, the porous body and circuit board with metal level using it |
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|---|---|---|---|---|
| CN1671770A (en) * | 2002-07-25 | 2005-09-21 | 纳幕尔杜邦公司 | Liquid crystalline polymeric compositions |
| US20040124955A1 (en) * | 2002-12-31 | 2004-07-01 | Sung-Mao Wu | High frequency substrate |
| CN104206028A (en) * | 2012-03-26 | 2014-12-10 | 住友电工超效能高分子股份有限公司 | Fluorine resin substrate |
| CN107849284A (en) * | 2015-07-29 | 2018-03-27 | 日东电工株式会社 | Fluororesin porous body, the porous body and circuit board with metal level using it |
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Application publication date: 20181123 |